A method of forming a multi-layer board segmented via

Abstract

The application provides a multilayer board segmented via hole method, comprising the following steps: S1: inner layer etching is adopted, and screen printing insulating anti-electroplating ink is performed; S2: then, a pressing machine is used for pressing work; S3: after pressing, drilling equipment is used for drilling work; S4: then, whole-board electroplating is adopted, and then, anti-electroplating ink stripping work is performed; and S5: then, pattern electroplating is performed. The pressing machine in the S2 needs to be used during pressing, and the pressing machine comprises a workbench, a limiting frame is fixedly installed on the top of the workbench, sliding grooves are formed in the two sides in the limiting frame, and sliding blocks are slidably connected in the sliding grooves. The multilayer board segmented via hole method can control the thickness of the screen printing anti-electroplating ink after inner layer etching, the stripping anti-electroplating ink medicine concentration, and the stripping anti-electroplating ink time, so that any layer can be turned on or off without Stub, the process is relatively simpler than N+N+N, and the production difficulty is lower.

Description

Technical Field

[0001] This invention relates to the field of etching, and more particularly to a method for segmented vias in multilayer boards. Background Technology

[0002] Etching is a technique that removes material using chemical reactions or physical impacts. Etching techniques can be divided into two categories: wet etching and dry etching.

[0003] After etching the inner layer pattern, anti-plating ink is screen-printed and cured at the PAD position where the back-drilling does not penetrate the layer hole. Then, the layers are pressed, drilled, and electroplated. The hole wall has anti-plating ink, so copper cannot be plated at this position, thus achieving the purpose. Currently, back-drilling is used to control the stub value to ensure signal integrity, or an N+N+N design is used to achieve stub-free operation. High-speed signals will still be reflected and lost when passing through the stub, affecting signal integrity. In addition, the product alignment requirements are high, and the multiple resin plugging and grinding processes are complex and costly.

[0004] Therefore, it is necessary to provide a method for segmented vias in multilayer boards to solve the above-mentioned technical problems. Summary of the Invention

[0005] This invention provides a method for segmented vias in multilayer boards, which solves the problems of using back drilling and controlling the stub value to ensure signal integrity, or using an N+N+N design to achieve stub-free operation, where high-speed signals still experience reflection and loss after passing through the stub, affecting signal integrity; and also the problems of high product alignment requirements, complex and costly multiple resin plugging and grinding processes.

[0006] To solve the above-mentioned technical problems, the present invention provides a method for segmented vias in a multilayer board, comprising the following steps:

[0007] S1: Inner layer etching is used, followed by screen printing of insulating anti-electroplating ink;

[0008] S2: Then a pressing machine is used for pressing;

[0009] S3: Drilling is performed using drilling equipment after pressing;

[0010] S4: Then, the entire plate is electroplated, followed by the removal of anti-reflective electroplating ink.

[0011] S5: Then proceed with pattern electroplating.

[0012] Preferably, a pressing machine is required during the pressing process in step S2. The pressing machine includes a worktable, and a limiting frame is fixedly installed on the top of the worktable. Sliding grooves are provided on both sides inside the limiting frame, and a slider is slidably connected inside the sliding groove.

[0013] Preferably, a pad is fixedly installed on the inner side of the slider, and a connecting hole is opened inside the worktable. A threaded post is provided inside the connecting hole, and the top of the threaded post is fixedly installed to the bottom of the pad.

[0014] Preferably, a threaded ring is fitted on the surface of the threaded post, and a connecting post is fixedly installed at the bottom of the threaded post.

[0015] Preferably, a second sliding groove is provided on both sides of the bottom of the workbench and on the outside of the connecting hole, and a second slider is slidably connected inside the second sliding groove.

[0016] Preferably, a spring is provided on the inner side of the second slider and inside the second groove, and a connecting rod is rotatably connected to the bottom of the second slider.

[0017] Preferably, the bottom of the connecting rod is rotatably connected to the outside of the connecting column, and a connecting frame is fixedly installed on the top of the workbench.

[0018] Preferably, a telescopic rod is fixedly installed on the top of the connecting frame, and an extrusion plate is fixedly installed at the output end of the telescopic rod and on the inner side of the connecting frame.

[0019] Preferably, the connecting frame has limit holes on both sides inside, and a moving rod is provided inside the limit holes.

[0020] Preferably, the surface of the movable rod is provided with a scale strip, and a hollow cover plate is fixedly installed at the bottom of the movable rod and at the top of the extrusion plate.

[0021] Compared with related technologies, the method for segmented vias in a multilayer board provided by the present invention has the following advantages:

[0022] This invention provides a method for segmented vias in multilayer boards. By using the above method, the thickness of the anti-plating ink after inner layer etching, the concentration of the anti-plating ink stripping solution, and the time for stripping the anti-plating ink can be controlled. It can achieve the connection and disconnection of any layer without stubs. The process is simpler and easier to produce than N+N+N. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of a first embodiment of a method for segmented vias in a multilayer board provided by the present invention;

[0024] Figure 2 for Figure 1 The diagram shows the external three-dimensional structure.

[0025] Figure 3 for Figure 1 The diagram shows the structure of the top of the connecting frame;

[0026] Figure 4 for Figure 1 The diagram shows the overall cross-sectional structure.

[0027] Figure 5 This is a schematic diagram of the structure of a second embodiment of a method for segmented vias in a multilayer board provided by the present invention;

[0028] Figure 6 for Figure 5 The diagram shows the structure of the top of the extrusion plate.

[0029] The following are the labeling elements in the diagram: 1. Workbench; 2. Limiting frame; 3. Slide groove; 4. Slider; 5. Pad; 6. Connecting hole; 7. Threaded post; 8. Threaded ring; 9. Connecting post; 10. Second slide groove; 11. Second slider; 12. Spring; 13. Connecting rod; 14. Connecting frame; 15. Telescopic rod; 16. Extrusion plate; 17. Limiting hole; 18. Moving rod; 19. Scale bar; 20. Hollow cover plate.

[0030] 21. Circular groove; 22. Arc-shaped slider; 23. Connecting plate; 24. Threaded sleeve; 25. Insertion hole; 26. Threaded rod; 27. Fixing bracket; 28. Insert rod. Detailed Implementation

[0031] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0032] First Embodiment

[0033] Please refer to the following: Figure 1 , Figure 2 , Figure 3 , Figure 4 ,in, Figure 1 This is a schematic diagram of the structure of a first embodiment of a method for segmented vias in a multilayer board provided by the present invention; Figure 2 for Figure 1 The diagram shows the external three-dimensional structure. Figure 3 for Figure 1 The diagram shows the structure of the top of the connecting frame; Figure 4 for Figure 1 The diagram shows a schematic cross-sectional view of the structure. A method for segmenting vias in a multilayer board includes the following steps:

[0034] S1: Inner layer etching is used, followed by screen printing of insulating anti-electroplating ink;

[0035] S2: Then a pressing machine is used for pressing;

[0036] S3: Drilling is performed using drilling equipment after pressing;

[0037] S4: Then, the entire plate is electroplated, followed by the removal of anti-reflective electroplating ink.

[0038] S5: Then proceed with pattern electroplating.

[0039] In the S2 process, a pressing machine is required. The pressing machine includes a worktable 1. A limiting frame 2 is fixedly installed on the top of the worktable 1. Slide grooves 3 are provided on both sides inside the limiting frame 2. A slider 4 is slidably connected inside the slide grooves 3.

[0040] The cooperation between slider 4 and groove 3 can improve the stability of the movement of pad 5 and prevent it from shifting or shaking.

[0041] A pad 5 is fixedly installed on the inner side of the slider 4. A connecting hole 6 is opened inside the worktable 1. A threaded post 7 is provided inside the connecting hole 6. The top of the threaded post 7 is fixedly installed to the bottom of the pad 5.

[0042] A threaded ring 8 is fitted on the surface of the threaded post 7, and a connecting post 9 is fixedly installed at the bottom of the threaded post 7.

[0043] The movement range of the threaded post 7 in the connecting hole 6 can be easily controlled by the mutual cooperation between the threaded post 7 and the threaded ring 8, thereby adjusting the distance that the pad 5 can push when pushing the product upward, thus improving the practicality of the overall structure.

[0044] A second slide groove 10 is provided on both sides of the bottom of the workbench 1 and outside the connecting hole 6. A second slider 11 is slidably connected inside the second slide groove 10.

[0045] A spring 12 is provided on the inner side of the second slider 11 and inside the second slide groove 10, and a connecting rod 13 is rotatably connected to the bottom of the second slider 11.

[0046] Through the cooperation between the second slide 12, the second slider 11, the spring 12, and the connecting rod 13, the pad 5 can move upward by the elastic deformation of the spring 12 when the pad 5 is not subjected to a downward force, thereby pushing the product on the pad 5 upward, thus facilitating the picking up of the product.

[0047] The bottom of the connecting rod 13 is rotatably connected to the outside of the connecting column 9, and the top of the workbench 1 is fixedly installed with a connecting frame 14.

[0048] A telescopic rod 15 is fixedly installed on the top of the connecting frame 14, and an extrusion plate 16 is fixedly installed at the output end of the telescopic rod 15 and on the inner side of the connecting frame 14.

[0049] Rubber pads are fixedly installed on the bottom of the extrusion plate 16 and the top of the pad 5. The rubber pads can prevent hard contact from occurring during the pressing of the product and thus avoid damage to the product, thereby improving the yield.

[0050] Limiting holes 17 are provided on both sides inside the connecting frame 14, and a moving rod 18 is provided inside the limiting hole 17.

[0051] The interplay between the limiting hole 17 and the moving rod 18 improves the stability of the hollow cover plate 20 during operation, preventing it from rotating during movement or operation.

[0052] The surface of the output end of the telescopic rod 18 is provided with a scale bar 19, and a hollow cover plate 20 is fixedly installed at the bottom of the moving rod 18 and at the top of the extrusion plate 16.

[0053] The hollow cover plate 20, the limiting hole 17, and the moving rod 18 work together to seal the top opening of the limiting frame 2 during operation, thus preventing external objects from entering the interior of the limiting frame 2, thereby improving the stability of operation and preventing damage to the equipment.

[0054] The working principle of the segmented via method for multilayer boards provided by this invention is as follows:

[0055] When product pressing is required, the object can be placed on the pad 5. Then, the telescopic rod 15 can be activated. The extension of the telescopic rod 15 pushes the pressing plate 16 downward, causing it to move downward. The downward movement of the pressing plate 16, combined with gravity, causes the hollow cover plate 20 to move downward simultaneously. This downward movement of the hollow cover plate 20 causes the moving rod 18 to move downward inside its limiting hole 17 until the bottom of the hollow cover plate 20 contacts the top of the limiting frame 2. Afterward, the hollow cover plate 20 stops moving downward, and the pressing plate 16 enters the limiting frame 2, thus contacting the product. When the product is pressed and squeezed, and the product is subjected to force, its pad 5 moves downward inside the limiting frame 2, which drives the threaded column 7 to move downward inside the connecting hole 6. Subsequently, it drives the threaded ring 8, connecting column 9 and connecting rod 13 to move downward. The angle change caused by the movement of the connecting rod 13 drives the second slider 11, causing the second slider 11 to move from the outside to the inside inside the second slide groove 0. At this time, the spring 12 is squeezed, causing the spring 12 to undergo elastic deformation until the bottom of the pad 5 contacts the top of the worktable 1. At this time, the pad 5 can no longer move downward. As the telescopic rod 15 continues to extend downward, the squeezing work can be performed.

[0056] As the telescopic rod 15 continues to extend downwards, its hollow cover plate 20 covers the top of the limiting frame 2. Therefore, the depth of the extrusion plate 16 entering the limiting frame 2 can be determined from the scale strip 19 set on the telescopic rod 15, and thus the extrusion force at this time can be judged.

[0057] After the extrusion process, the telescopic rod 15 and the extrusion plate 16 are reset, so the pad 5 is not subjected to downward force. The elastic deformation of the spring 12 pushes the second slider 11 outward, causing the second slider 11 to reset. The movement of the second slider 11 drives the connecting rod 13 to move. Subsequently, the angle change caused by the movement of the connecting rod 13 drives the connecting column 9 to move upward, which in turn drives the threaded column 7 to move upward. This causes the pad 5 to move upward in the limiting frame 2. The pad 5 is moved to a position at the top inside the limiting frame 2, which makes it convenient for workers to pick up the pressed product.

[0058] Compared with related technologies, the method for segmented vias in a multilayer board provided by the present invention has the following advantages:

[0059] By adopting the above method, the thickness of the anti-plating ink after inner layer etching, the concentration of the anti-plating ink stripping solution, and the time for stripping the anti-plating ink can be controlled. It can achieve arbitrary layer switching without stubs, and the process is simpler and easier to produce than N+N+N.

[0060] The product can be easily pressed by the cooperation of the following structures: workbench 1, limiting frame 2, slide groove 3, slider 4, pad 5, connecting hole 6, threaded column 7, threaded ring 8, connecting column 9, second slide groove 10, second slider 11, spring 12, connecting rod 13, connecting frame 14, telescopic rod 15, extrusion plate 16, limiting hole 17, moving rod 18, scale bar 19, hollow cover plate 20. After pressing, the product can be ejected for easy removal, thus improving work efficiency and reducing operation difficulty.

[0061] Second Embodiment

[0062] Please refer to the following: Figure 5 and Figure 6 Based on the method for segmented vias in a multilayer board provided in the first embodiment of this application, the second embodiment of this application proposes another method for segmented vias in a multilayer board. The second embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0063] Specifically, the second embodiment of this application provides a method for segmented vias in a multilayer board, which differs in that the extrusion plate 16 has a circular groove 21 on its top, and arc-shaped sliders 22 are slidably connected to both sides inside the circular groove 21. A connecting plate 23 is fixedly installed on the top of the arc-shaped sliders 22, and a threaded sleeve 24 is fixedly installed on the top of the connecting plate 23. Insertion holes 25 are provided on both sides of the top of the extrusion plate 16 and on the outer side of the circular groove 21. A threaded rod 26 is provided on the top of the threaded sleeve 24, and a fixing bracket 27 is fixedly installed on the outer side of the top of the threaded rod 26. Insert rods 28 are fixedly installed on the bottom of both sides of the fixing bracket 27.

[0064] The threaded sleeve 24 and the threaded rod 26 are compatible, and the insertion hole 25 and the insertion rod 28 are compatible.

[0065] Since the insertion rod 28 is inserted into the insertion hole 25, its pressing plate 16 will not rotate during operation, thus improving its working stability and not affecting the normal operation of the threaded sleeve 24.

[0066] The working principle of the segmented via method for multilayer boards provided by this invention is as follows:

[0067] When installing the extrusion plate 16, the threaded sleeve 24 and the threaded rod 26 are aligned, and then the threaded sleeve 24 is rotated, which drives the connecting plate 23 to rotate. The rotation of the connecting plate 23 drives the arc-shaped slider 22, causing it to slide inside the circular groove 21. With the threaded sleeve 24 rotating and the threaded rod 26 remaining stationary, the threaded sleeve 24 and the threaded rod 26 are connected by threads. At this time, the insertion hole 25 and the insertion rod 28 are aligned. As the threaded rod 26 enters the threaded sleeve 24, the extrusion plate 16 moves upward until the insertion rod 28 is inserted into the insertion hole 25, thus completing the installation.

[0068] Compared with related technologies, the method for segmented vias in a multilayer board provided by the present invention has the following advantages:

[0069] The replacement of the extrusion plate 16 is facilitated by the cooperation between the circular slide 21, arc-shaped slider 22, connecting plate 23, threaded sleeve 24, insertion hole 25, threaded rod 26, fixing frame 27, and insertion rod 28. The structure is simple and easy to operate, so it can be quickly replaced and put into working condition, thus improving work efficiency by working in the most suitable state.

[0070] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A method for segmented vias in a multilayer board, characterized in that, Includes the following steps: S1: Inner layer etching is used, followed by screen printing of insulating anti-electroplating ink; S2: Then, a pressing machine is used for pressing. S3: Drilling is performed using drilling equipment after pressing; S4: Then, the entire plate is electroplated, followed by the removal of anti-reflective electroplating ink. S5: Subsequently, pattern electroplating is performed. During the pressing process in S2, a pressing machine is required. The pressing machine includes a worktable. A limit frame is fixedly installed on the top of the worktable. Sliding grooves are formed on both sides inside the limit frame. A slider is slidably connected inside the sliding groove. A pad is fixedly installed on the inner side of the slider. A connecting hole is formed inside the worktable. A threaded post is provided inside the connecting hole. The top of the threaded post is fixedly installed to the bottom of the pad. A threaded ring is fitted onto the surface of the threaded post. A connecting post is fixedly installed at the bottom of the threaded post. Second sliding grooves are formed on both sides of the bottom of the worktable, outside the connecting hole. A second slider is slidably connected inside the slide groove. A spring is installed on the inner side of the second slider and inside the second slide groove. A connecting rod is rotatably connected to the bottom of the second slider. The bottom of the connecting rod is rotatably connected to the outer side of the connecting column. A connecting frame is fixedly installed on the top of the worktable. A telescopic rod is fixedly installed on the top of the connecting frame. An extrusion plate is fixedly installed on the output end of the telescopic rod and inside the connecting frame. Limiting holes are opened on both sides inside the connecting frame. A moving rod is installed inside the limiting holes. A scale strip is provided on the surface of the moving rod. A hollow cover plate is fixedly installed at the bottom of the moving rod and above the extrusion plate.

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