An automatic PCB packaging device

Abstract

This invention discloses an automatic PCB packaging device, comprising a frame, a receiving assembly, a flipping assembly, and a transfer robot. The frame has a material hopper station and an installation platform located on one side of the material hopper station. The receiving assembly is located on the installation platform and includes a first linear motion module and a receiving platform located above the first linear motion module. The first linear motion module can drive the receiving platform to move to the receiving position or the flipping position. The flipping assembly is located on the installation platform and includes a flipping platform that can be flipped up and down. The flipping platform can be flipped to be above the receiving platform located at the flipping position to pick up the PCB board on the receiving platform. The transfer robot is located on the frame and is used to transfer the PCB board from the flipping platform to the material hopper station. The automatic PCB packaging device of this invention has the advantages of high automation, simple operation, high working efficiency, and wide applicability.

Description

Technical Field

[0001] This invention relates to the field of packaging equipment technology, and in particular to an automatic packaging device for PCB boards. Background Technology

[0002] Currently, PCB products are mainly packaged manually, with finished products placed into different silos for packaging based on actual needs. Manual packaging offers high flexibility and can handle diverse requirements, but it suffers from high error rates and low efficiency. Furthermore, with rising labor costs, this method is becoming increasingly unsuitable for production demands. Automated packaging production has become an inevitable trend.

[0003] The above content is only used to help understand the technical solution of the invention and does not represent an admission that the above content is prior art. Summary of the Invention

[0004] The main objective of this invention is to provide an automatic PCB packaging device, which aims to improve the packaging efficiency of PCBs.

[0005] To achieve the above objectives, the present invention provides an automatic PCB packaging device, comprising:

[0006] The frame includes a hopper station and an installation platform located on one side of the hopper station;

[0007] A receiving component is provided on the mounting platform. The receiving component includes a first linear motion module and a receiving platform provided above the first linear motion module. The first linear motion module can drive the receiving platform to move to the receiving position or the position to be flipped.

[0008] A flipping component is provided on the mounting platform. The flipping component includes a flipping platform that can be flipped up and down. The flipping platform can be flipped to be above the receiving platform located at the position to be flipped in order to pick up the PCB board on the receiving platform.

[0009] A transfer robot, mounted on the frame, is used to transfer PCB boards from the flipping platform to the hopper station.

[0010] In one embodiment, the silo station is provided with a packaging pallet silo and a packaging silo, and the transfer robot is also used to transfer empty packaging pallets from the packaging pallet silo to the packaging silo.

[0011] In one embodiment, the packaging pallet hopper and / or the packaging hopper is provided with a second linear motion module and a pallet connected to the second linear motion module, the second linear motion module being used to drive the pallet to move up and down.

[0012] In one embodiment, the packing pallet hopper and / or the packing hopper are provided with guide plates extending in a vertical direction, the guide plates being located on opposite sides of the pallet.

[0013] In one embodiment, the second linear module and the guide plate surround to form a receiving cavity, and a discharge port is formed on one side of the receiving cavity. The packaging pallet hopper and / or the packaging hopper is provided with a limiting plate extending in a vertical direction, and the limiting plate can be moved to or out of the discharge port.

[0014] In one embodiment, the transplanting robot includes an X-axis linear motion module and a first suction component connected together. The X-axis linear motion module is laid on the frame and its guide rail extends from the hopper station to the mounting platform. The X-axis motion module can drive the first suction component to move along its guide rail.

[0015] In one embodiment, the transplanting robot further includes a Y-axis linear motion module and a Z-axis linear motion module connected together. The Y-axis linear motion module is mounted above the X-axis linear motion module, and the first suction member is rotatably and slidably connected to the Z-axis linear motion module.

[0016] In one embodiment, the flipping platform includes a flip plate, a second suction member and a limiting post disposed on one side of the flip plate, the second suction member being used to suction the PCB board on the receiving platform, and the limiting post being used to limit the PCB board suctioned by the first suction member.

[0017] In one embodiment, the receiving platform includes a first platform and a second platform disposed opposite to each other, and the distance between the first platform and the second platform is adjustable.

[0018] In one embodiment, the installation platform is further equipped with a barcode scanner, which is used to identify whether the packaged PCB board is qualified.

[0019] This invention automates the PCB packaging process by employing a receiving component, a flipping component, and a transfer robot in tandem. In this invention, the receiving component transfers the PCB from the previous station to the flipping position, and then the flipping component and the transfer robot further transfer the PCB to the packaging position at the material storage station. This process is repeated until the number of PCBs at the material storage station reaches the predetermined packaging quantity. The entire packaging process is automated, requiring no manual intervention, significantly improving packaging efficiency and saving labor costs. The automatic PCB packaging device of this invention has the advantages of high automation, simple operation, high efficiency, and wide applicability. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the PCB board automatic packaging device of the present invention in one embodiment;

[0022] Figure 2 yes Figure 1 A schematic diagram of the structure of the flipping component in the diagram;

[0023] Figure 3 yes Figure 1 A schematic diagram of the material receiving component in the middle;

[0024] Figure 4 yes Figure 1 A schematic diagram of the structure of the first suction component;

[0025] Figure 5 yes Figure 1 A schematic diagram of the structure of the packaging hopper when it is full;

[0026] Figure 6 yes Figure 1 A schematic diagram of the structure of the packaging hopper when it is empty.

[0027] Explanation of icon numbers:

[0028]

[0029]

[0030] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0032] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0033] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, if the word "and / or" appears throughout the text, it means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0034] This invention proposes an automatic PCB packaging device 100.

[0035] Please see Figure 1 and Figure 2 In this embodiment of the invention, the automatic PCB packaging device 100 includes a frame 10, a receiving component 20, a flipping component 30, and a transfer robot 40. The frame 10 is provided with a material storage station 11 and an installation platform 13 located on one side of the material storage station 11. The receiving component 20 is disposed on the installation platform 13 and includes a first linear motion module 21 and a receiving platform 23 disposed above the first linear motion module 21. The first linear motion module 21 can drive the receiving platform 23 to move to the receiving position or the position to be flipped. The flipping component 30 is disposed on the installation platform 13 and includes a flipping platform 31 that can be flipped up and down. The flipping platform 31 can be flipped to be above the receiving platform 23 located at the position to be flipped to pick up the PCB board on the receiving platform 23. The transfer robot 40 is disposed on the frame 10 and is used to transfer the PCB board from the flipping platform 31 to the material storage station 11.

[0036] Specifically, the frame 10 is rectangular, and a rectangular cover is provided on top of the frame 10. The cover covers the flipping component 30, the transplanting robot 40, and part of the receiving component 20 to ensure that the PCB board is not disturbed by the external environment when the PCB board is packaged by the automatic PCB board packaging device 100. The mounting platform 13 is located in front of the material storage station 11. The receiving component 20 and the flipping component 30 are arranged from right to left along the length of the mounting platform 13. The guide rail of the first linear motion module 21 extends from front to back along the width of the mounting platform 13, that is, from the end near the material storage station 11 to the end away from the material storage station 11 until it extends out of the cover. When the receiving platform 23 moves to the receiving position, the receiving platform 23 is outside the cover. When the receiving platform 23 moves to the flipping position, the receiving platform 23 is inside the cover.

[0037] When using the PCB automatic packaging device 100 to package the PCB board, the following steps are included:

[0038] S1: The transplanting robot 40 picks up the empty packaging pallet and moves it to the packaging position of the silo station 11;

[0039] S2: Move the receiving platform 23 to the receiving position to receive the PCB board from the previous station, and then move it to the position to be flipped;

[0040] S3: Flip the flipping platform 31 toward the receiving platform 23 to the position to be flipped and pick up the PCB board on the receiving platform 23. Then the flipping platform 31 carries the PCB board and flips back to its original position.

[0041] S4: When the PCB board is a qualified product, the transfer robot 40 transfers the PCB board on the flipping platform 31 to the packaging pallet at the packaging position. When the PCB board is a non-qualified product, the transfer robot 40 transfers the PCB board on the flipping platform 31 to the NG pallet at the NG position of the material storage station 11.

[0042] S5: Repeat S2-S4 in sequence until the packaging tray at the packaging position is full of PCB boards;

[0043] S6: Repeat S1-S5 sequentially until the number of PCBs at the packaging location reaches the predetermined amount.

[0044] The technical solution of this invention automates the PCB board packaging process by employing a receiving component 20, a flipping component 30, and a transfer robot 40 working together. In this invention, the receiving component 20 transfers the PCB board from the previous station to the flipping position, and then the flipping component 30 and the transfer robot 40 further transfer the PCB board to the packaging position at the material storage station 11. This process is repeated until the number of PCB boards at the packaging position at the material storage station 11 reaches the predetermined packaging quantity. The entire packaging process is automated, requiring no manual intervention, greatly improving packaging efficiency and saving labor costs. The automatic PCB board packaging device 100 of this invention has the advantages of high automation, simple operation, high efficiency, and wide applicability.

[0045] Understandably, according to the technical solution of the present invention, the silo station 11 is provided with a packaging pallet silo, a packaging silo, an NG pallet silo, and an NG packaging silo. Those skilled in the art can plan the number and arrangement of the packaging pallet silo, the packaging silo, the NG pallet silo, and the NG packaging silo according to the actual situation, and no special limitation is made here; the transfer robot 40 is also used to transfer empty packaging pallets from the packaging pallet silo to the packaging silo, and to transfer empty NG pallets from the NG pallet silo to the NG packaging silo, and to transfer unqualified PCB boards from the flipping platform 31 to the NG packaging silo. When the PCB board automatic packaging device 100 is used to package the PCB board, the specific steps of S1 are as follows: the transfer robot 40 takes out an empty packaging pallet from the packaging pallet hopper and transfers the packaging pallet to the packaging hopper; at the same time, before performing step S2, step S0 is also required: the transfer robot 40 takes out an empty NG pallet from the NG pallet hopper and transfers the NG pallet to the NG packaging hopper; in S4, when the PCB board is a defective product, the transfer robot 40 transfers the PCB board on the flipping platform 31 to the NG pallet in the NG packaging hopper. The specific steps of S6 are as follows: when the packaging pallet at the packaging position is full of qualified PCBs and the NG pallet at the NG position is not full of unqualified PCBs, repeat steps S1-S5 in sequence until the packaging pallet at the packaging position is full of PCBs; when the packaging pallet at the packaging position is full of qualified PCBs and the NG pallet at the NG position is full of unqualified PCBs, repeat steps S0-S5 in sequence until the packaging pallet at the packaging position is full of PCBs.

[0046] Please see Figure 5In one embodiment, the packaging pallet hopper, the packaging material hopper, the NG pallet hopper, and the NG packaging hopper are each equipped with a second linear motion module 1131 and a pallet 1132 connected to the second linear motion module 1131. The second linear motion module 1131 is used to drive the pallet 1132 to move up and down. During the packaging process, the second linear motion module 1131 drives the pallet 1132 to move to a specific height to receive the corresponding pallet or PCB board.

[0047] The packaging pallet hopper, the packaging material hopper, the NG pallet hopper, and the NG packaging hopper are provided with guide plates 1133 extending vertically. The guide plates 1133 are located on the left and right sides of the pallet 1132, and the width between the guide plates 1133 on the left and right sides of the pallet 1132 is the same as the width of the packaging pallet or NG pallet. The second linear module and the guide plates 1133 surround to form a receiving cavity, and a discharge port 113a is formed on the front side of the receiving cavity. The packaging material hopper, the NG pallet hopper, and the NG packaging hopper are also provided with limiting plates 1134 extending vertically. The limiting plates 1134 can be moved to or out of the discharge port 113a. When it is necessary to unload materials, the limiting plates 1134 can be moved out of the discharge port 113a and materials can be unloaded from the discharge port 113a. The guide plate 1133 and the limiting plate 1134 prevent the packaging pallet or the NG pallet from shifting or slipping during the up-and-down movement of the pallet 1132.

[0048] Please continue reading. Figure 6 In one embodiment, within the packing hopper, a first sensor 1135 and a second sensor 1136 are arranged sequentially on the inner side of the guide plate 1133. The first sensor 1135 is located at the upper end of the guide plate 1133 and is used to identify whether the packing hopper is full (i.e., the quantity of PCB boards being packed has reached the predetermined packing quantity). Generally, before the transfer robot 40 transfers the PCB boards to the packing hopper, the pallet 1132 in the packing hopper needs to rise to a specific height to catch the PCB boards. The second sensor 1136 can be used to identify whether the rising height of the pallet 1132 is sufficient. The specific height settings of the first sensor 1135 and the second sensor 1136 can be adjusted according to the actual packing situation and are not specifically limited here.

[0049] Please see Figure 1In one embodiment, the transplanting robot 40 includes an X-axis linear motion module 41, a Y-axis linear motion module 43, a Z-axis linear motion module 45, and a first suction member 47 connected together. The X-axis linear motion module 41 has two parallel guide rails extending from front to back. The X-axis linear motion module 41 is laid on the frame 10, and its guide rails extend from the hopper station 11 to the mounting platform 13. The Y-axis linear motion module 43 is mounted above the X-axis linear motion module 41, and the guide rails of the Y-axis linear motion module 43 extend from left to right. The guide rails of the Z-axis linear motion module 45 extend vertically. The guide rails of the X-axis linear motion module, the Y-axis linear motion module 43, and the Z-axis linear motion module 45 are perpendicular to each other to form a three-dimensional rectangular coordinate system. The first suction member 47 is slidably connected to the Z-axis linear motion module 45. Driven by the X-axis linear motion module 41, the Y-axis linear motion module 43, together with the Z-axis linear motion module 45 and the first suction member 47, moves back and forth; driven by the Y-axis linear motion module 43, the Z-axis linear motion module 45, together with the first suction member 47, moves left and right; driven by the Z-axis linear motion module 45, the first suction member 47 moves up and down.

[0050] Please see Figure 2In one embodiment, the flipping platform 31 includes a flip plate 311 and a second suction member 313 and a limiting post 315 disposed on one side of the flip plate 311. The second suction member 313 is used to suction the PCB board on the receiving platform 23, and the limiting post 315 is used to limit the PCB board suctioned by the first suction member 47. The flipping assembly 30 further includes a mounting frame 33, a first drive motor 35, and a pre-push cylinder 37. The mounting frame 33 is disposed on the mounting platform 13 and includes a fixing plate and a fixing column. The fixing plate is horizontally disposed on the mounting platform 13, and the fixing column extends vertically from the upper surface of the fixing plate. There are two fixing columns, which are respectively disposed at the front end and rear end of the base plate. The front end and rear end of the flipping platform 31 are rotatably connected to the upper end of one of the fixing columns. The first drive motor 35 is mounted on the upper surface of the fixing plate and is disposed below the flipping platform 31 and connected to the flipping platform 31 through a transmission gear. The first drive motor 35 is used to drive the flipping platform 31 to rotate. The pre-push cylinder 37 is disposed below the fixing plate and can drive the fixing plate to move up and down. The fixed plate has vertically extending positioning posts on both its left and right sides. The height of the positioning posts is the same as the height of the fixed posts. When the flipping platform 31 flips to the right to a horizontal position, the top of the positioning post on the right side of the base plate holds the flipping platform 31 to prevent it from flipping further. Then, the flipping platform 31 is flipped 180° to the left (i.e., to a horizontal position), and the top of the positioning post on the left side of the base plate holds the flipping platform 31 to prevent it from flipping further. The specific steps of S3 are as follows: the flipping platform 31 is flipped to the right to a horizontal position and moved to an appropriate height under the drive of the pre-push cylinder 37 to pick up the PCB board on the receiving platform 23. Then, the flipping platform 31, carrying the PCB board, is flipped 180° to the left again and moved up and down to an appropriate height under the drive of the pre-push cylinder 37 so that the transfer robot 40 can pick up the PCB board on it.

[0051] Please see Figure 3Based on the above embodiments, in one embodiment, the receiving platform 23 includes a first platform 231 and a second platform 233 arranged opposite to each other, and the distance between the first platform 231 and the second platform 233 is adjustable. The first platform 231 and the second platform 233 can each be used to transport one PCB board. The first platform 231 and the second platform 233 are centrally symmetrically arranged. A lead screw 25 is provided below the second platform 233. The lead screw 25 is used to drive the second platform 233 to move relative to the first platform 231, thereby achieving the purpose of adjusting the distance between the first platform 231 and the second platform 233. This avoids the situation where two PCB boards at one station on the production line cannot be received simultaneously due to improper distance between the first platform 231 and the second platform 233, or where the flipping component 30 cannot simultaneously transfer the PCB boards on the first platform 231 and the second platform 233. Correspondingly, the first suction member 47 includes a first flip suction cup and a second flip suction cup, and the limiting post 315 includes a first limiting post 315 and a second limiting post 315. The first flip suction cup and the second flip suction cup are used to pick up PCB boards on the first platform 231 and the second platform 233, respectively. The first limiting post 315 and the second limiting post 315 are used to position the PCB boards picked up by the first flip suction cup and the second flip suction cup, respectively.

[0052] Please see Figure 1 Furthermore, the installation platform 13 is also equipped with a barcode scanner 60. During the packaging process of the PCB board, before performing the above-mentioned step S4, the barcode scanner 60 is required to scan the packaged PCB board to identify whether the PCB board is a qualified product. Specifically, the barcode scanner can be arbitrarily selected during the packaging process of the above-mentioned steps S1, S2, and S3. In one embodiment, the barcode scanner 60 is located between the receiving position and the flipping position. The barcode scanner 60 is used to identify whether the PCB board on the receiving platform 23 is qualified. During the process of the receiving platform 23 moving the packaged PCB board from the receiving position to the flipping position, the barcode scanner 60 will scan and identify the packaged PCB board. Correspondingly, the barcode scanner 60 includes a first barcode scanner 60 and a second barcode scanner 60, which are respectively used to scan and identify the PCB boards on the first platform 231 and the second platform 233.

[0053] In one embodiment, the mounting platform 13 is also equipped with a labeling machine 70. During the packaging process of the PCB board, after performing the above step S6, the first suction cup 472 also needs to pick up the label printed by the labeling machine 70 and stick the label onto the packaged product in the packaging hopper.

[0054] Please see Figure 4 Based on the above embodiments, in one embodiment, the first suction member 47 is rotatably connected to the Z-axis linear motion module 45. The first suction member 47 and the Z-axis linear motion module 45 are connected by a connector 50. The connector 50 includes a mounting base 51 and a second drive motor 53. The mounting base 51 has an accommodating cavity inside. The second drive motor 53 is installed in the accommodating cavity. The rotating shaft at the lower end of the second drive motor 53 passes through the bottom of the mounting base 51 and is connected to the first suction member 47.

[0055] The first suction component 47 includes a mounting plate 471, a first suction cup 472, a second suction cup 473, and a third suction cup 474. The mounting plate 471 is located below the mounting base 51 and connected to the second drive motor 53. The first suction cup 472, the second suction cup 473, and the third suction cup 474 are all mounted on the lower surface of the mounting plate 471. The first suction cup 472 is used to pick up packing trays and NG trays, and the first suction cup 472 is used to pick up PCB boards. The third suction cup 474 is used to pick up labels printed by the label printer 70.

[0056] In one embodiment, the mounting plate 471 is further provided with a camera 475 and a third sensor 476. The camera 475 is used to assist the first suction cup 472, the second suction cup 473, and the third suction cup 474 in focusing on the object to be picked up. For example, before the first suction cup 472 picks up the packing tray, the camera 475 captures the position of the packing tray, so that the first suction cup 472 is accurately moved to the position corresponding to the packing tray. The third sensor 476 is used to identify whether the first suction cup 472, the second suction cup 473, and the third suction cup 474 have picked up the object to be picked up.

[0057] The foregoing examples are merely illustrative, used to explain some features of the method described in this invention. The appended claims are intended to claim the broadest possible scope, and the embodiments presented herein are merely illustrative of selected implementations based on combinations of all possible embodiments. Therefore, the applicant intends that the appended claims are not limited by the selection of examples illustrating the features of the invention. Some numerical ranges used in the claims also include sub-ranges within them, and variations within these ranges should also be interpreted as being covered by the appended claims where possible.

Claims

1. An automatic PCB packaging device, characterized in that, include: The frame includes a hopper station and an installation platform located on one side of the hopper station. The hopper station includes a packing pallet hopper, a packing hopper, an NG pallet hopper, and an NG packing hopper. A receiving component is provided on the mounting platform. The receiving component includes a first linear motion module and a receiving platform provided above the first linear motion module. The first linear motion module can drive the receiving platform to move to the receiving position or the position to be flipped. A flipping component is provided on the mounting platform. The flipping component includes a flipping platform that can be flipped up and down. The flipping platform can be flipped to be above the receiving platform located at the position to be flipped in order to pick up the PCB board on the receiving platform. A transfer robot is mounted on the frame. The transfer robot is used to transfer PCB boards from the flipping platform to the hopper station. The transfer robot is also used to transfer empty packing pallets from the packing pallet hopper to the packing hopper, and to transfer empty NG pallets from the NG pallet hopper to the NG packing hopper, and to transfer defective PCB boards from the flipping platform to the NG packing hopper. The packaging pallet hopper, the packaging hopper, the NG pallet hopper, and the NG packaging hopper are all equipped with a second linear motion module and a pallet connected to the second linear motion module. The second linear motion module is used to drive the pallet to move up and down. During the packaging process, the second linear motion module drives the pallet to move to a specific height to receive the corresponding pallet or PCB board. Each of the packing pallet hopper, the packing hopper, the NG pallet hopper, and the NG packing hopper is provided with a guide plate extending in a vertical direction, and the guide plate is located on opposite sides of the pallet; The receiving platform includes a first platform and a second platform arranged opposite to each other, and the distance between the first platform and the second platform is adjustable. The installation platform is also equipped with a barcode scanner, which is used to identify whether the packaged PCB board is qualified. The second linear motion module and the guide plate form a receiving cavity. A discharge port is formed on the front side of the receiving cavity. The packaging bin, the packaging pallet bin, the NG pallet bin, and the NG packaging bin are also provided with a limiting plate extending in the vertical direction. The limiting plate can be moved to or out of the discharge port. When it is necessary to unload, the limiting plate is moved out of the discharge port and the material is unloaded from the discharge port.

2. The PCB board automatic packaging device as described in claim 1, characterized in that, The transplanting robot includes an X-axis linear motion module and a first suction component connected together. The X-axis linear motion module is laid on the frame and its guide rail extends from the hopper station to the mounting platform. The X-axis linear motion module can drive the first suction component to move along its guide rail.

3. The automatic PCB packaging device as described in claim 2, characterized in that, The transplanting robot also includes a Y-axis linear motion module and a Z-axis linear motion module connected together. The Y-axis linear motion module is mounted above the X-axis linear motion module. The first suction member is rotatably and slidably connected to the Z-axis linear motion module.

4. The automatic PCB packaging device as described in claim 3, characterized in that, The flipping platform includes a flip plate, a second suction member and a limiting post disposed on one side of the flip plate. The second suction member is used to pick up the PCB board on the receiving platform, and the limiting post is used to limit the PCB board picked up by the second suction member.

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