Material cleaning system, method, server, and storage medium

Abstract

The application is suitable for the computer technical field, and provides a material cleaning system and method, a server and a storage medium, wherein the method comprises the following steps: obtaining the inlet pressure of a warehouse wall ring pipe and the ring pipe pressure corresponding to each nozzle assembly; determining the pressure drop degree corresponding to each nozzle assembly according to the inlet pressure and the ring pipe pressure corresponding to each nozzle assembly; determining the working sequence of each nozzle assembly according to the pressure drop degree corresponding to each nozzle assembly, and controlling each nozzle assembly to clean materials according to the corresponding working sequence. In the application, the working sequence of the nozzle assembly with a smaller pressure drop degree is set in the front position, so that the cleaning medium with a larger pressure can be accurately used to clean the more seriously blocked warehouse area, which helps to improve the utilization rate of the cleaning medium and the material cleaning efficiency.

Description

Technical Field

[0001] This application belongs to the field of computer technology, and in particular relates to material handling systems, methods, servers and storage media. Background Technology

[0002] In the production processes of industrial raw materials, chemical reagents, food, and other materials, silos are often used to transport materials. To prevent materials from hardening and bridging in the silos, which can lead to blockages, it is usually necessary to use nozzles to spray cleaning media, such as compressed air or water, to purge the materials in the silos under high pressure.

[0003] In related technologies, since the degree of blockage in different parts of the silo is usually different, if each nozzle sprays the cleaning medium at the same pressure to purge each area in the silo, it is easy to result in low utilization of the cleaning medium and low material cleaning efficiency. Summary of the Invention

[0004] This application provides a material cleaning method, server, and storage medium, which can solve the problems of low utilization rate of cleaning media and low material cleaning efficiency in related technologies.

[0005] The first aspect of this application provides a material cleaning system, including: a medium source, a silo, a silo wall ring pipe disposed inside the silo, and a plurality of nozzle assemblies; the medium source is connected to the silo wall ring pipe of the silo through a pipe; the input end of each nozzle assembly in the silo is connected to the silo wall ring pipe respectively; the first end and the last end of the silo wall ring pipe are not connected, and a pressure measuring device is provided at the last end of the silo wall ring pipe.

[0006] A second aspect of this application provides a material cleaning method, including: The system obtains the inlet pressure of the bin wall annular pipe and the annular pipe pressure corresponding to each nozzle assembly. The annular pipe pressure is the pressure of the bin wall annular pipe when the corresponding nozzle assembly is opened individually. Based on the inlet pressure and the annular pipe pressure corresponding to each nozzle assembly, the system determines the pressure drop of each nozzle assembly. Based on the pressure drop of each nozzle assembly, the system determines the working sequence of each nozzle assembly and controls each nozzle assembly to clean the material according to the corresponding working sequence. The smaller the pressure drop of the nozzle assembly, the earlier it is in the working sequence.

[0007] In some embodiments, when the material cleaning system includes multiple hoppers, the working sequence of each nozzle assembly is determined according to the pressure drop corresponding to each nozzle assembly, including: determining the working sequence of each nozzle assembly in the multiple hoppers in order of increasing pressure drop.

[0008] In some embodiments, after determining the pressure drop level corresponding to each nozzle assembly, the method further includes: acquiring characteristic information of the silo, wherein the characteristic information includes at least one of the following characteristics: the silo level, the silo slope, and the distance between the silo and the medium source; adjusting the pressure drop level according to the characteristic information; and switching the pressure drop level to the adjusted pressure drop level.

[0009] In some embodiments, adjusting the pressure drop level based on feature information includes: obtaining the material cleaning mode of the silo; selecting a target preset function from the preset function set corresponding to the silo that matches the material cleaning mode and feature item, wherein the preset function in the preset function set corresponds to the material cleaning mode and feature item; determining the pressure drop change corresponding to each feature item based on the target preset function corresponding to each feature item; and adjusting the pressure drop level based on the pressure drop change corresponding to each feature item.

[0010] In some embodiments, determining the operating sequence of each nozzle assembly based on the pressure drop corresponding to each nozzle assembly includes: selecting target nozzle assemblies from a plurality of nozzle assemblies whose corresponding pressure drop is greater than a preset pressure drop threshold; and determining the operating sequence of each target nozzle assembly based on the pressure drop corresponding to each target nozzle assembly.

[0011] In some embodiments, the method further includes: generating a visual representation of the pressure drop of each nozzle assembly based on a preset information presentation template and the pressure drop corresponding to each nozzle assembly, and presenting the visual representation.

[0012] In some embodiments, the method further includes: acquiring the opening pressure and closing pressure of the target component, wherein the opening pressure is the pressure of the target component when the target valve corresponding to the target component is open, and the closing pressure is the pressure of the target valve when it is closed, and the target component includes any one of the following: a pipeline between the medium source and the silo, a silo wall ring pipe, and a nozzle assembly; determining the pressure drop degree of the corresponding target component based on the opening pressure and closing pressure of each target component; for each target component, determining the self-test result of the corresponding target component based on the pressure drop degree of the corresponding target component and the fault pressure drop threshold of the corresponding target component; and generating alarm information to indicate that the corresponding target component has a fault when the self-test result indicates that the corresponding target component has a fault.

[0013] A third aspect of this application provides a material cleaning device, comprising: The pressure acquisition unit is used to acquire the inlet pressure of the bin wall annular pipe and the annular pipe pressure corresponding to each nozzle assembly. The annular pipe pressure is the pressure of the bin wall annular pipe when the corresponding nozzle assembly is opened individually. The pressure drop determination unit is used to determine the pressure drop degree of each nozzle assembly based on the intake pressure and the annular pipe pressure corresponding to each nozzle assembly. The material cleaning unit is used to determine the working sequence of each nozzle assembly based on the pressure drop of each nozzle assembly, and to control each nozzle assembly to clean the material according to the corresponding working sequence. The smaller the pressure drop of the nozzle assembly, the earlier it is in the working sequence.

[0014] In some embodiments, the material cleaning unit is specifically used to: when the material cleaning system includes multiple hoppers, determine the working sequence of each nozzle assembly in the multiple hoppers in order of increasing pressure drop.

[0015] In some embodiments, the device further includes an information acquisition unit and a voltage drop switching unit.

[0016] The information acquisition unit is used to acquire the characteristic information of the silo, wherein the characteristic information includes at least one of the following characteristic items: the silo level, the slope of the silo, and the distance between the silo and the medium source; The voltage drop switching unit is used to adjust the voltage drop level based on characteristic information and to switch the voltage drop level to the adjusted voltage drop level.

[0017] In some embodiments, the voltage drop switching unit further includes a mode acquisition module, a change determination module, and a voltage drop adjustment module.

[0018] The pattern acquisition module is used to acquire the material cleaning pattern of the silo and select a target preset function that matches the material cleaning pattern and feature items from the preset function set corresponding to the silo. The preset function in the preset function set corresponds to the material cleaning pattern and feature items. The change determination module is used to determine the pressure drop change corresponding to each characteristic item based on the target preset function corresponding to each characteristic item. The pressure drop adjustment module is used to adjust the degree of pressure drop based on the pressure drop change corresponding to each characteristic item.

[0019] In some embodiments, the material cleaning unit further includes a component screening module and a sequence determination module.

[0020] The component selection module is used to select target nozzle components from multiple nozzle components whose pressure drop is greater than a preset pressure drop threshold. The sequence determination module is used to determine the working sequence of each target nozzle assembly based on the pressure drop corresponding to each target nozzle assembly.

[0021] In some embodiments, the apparatus further includes a view presentation unit, configured to present a template and the pressure drop level corresponding to each nozzle assembly according to preset information, generate a view for presenting the pressure drop level of each nozzle assembly, and present the view.

[0022] In some embodiments, the apparatus further includes a target acquisition unit, a degree determination unit, and an alarm generation unit.

[0023] The target acquisition unit is used to acquire the opening pressure and closing pressure of the target component. The opening pressure is the pressure of the target component when the target valve corresponding to the target component is open, and the closing pressure is the pressure of the target valve when it is closed. The target component includes any one of the following: a pipeline between the medium source and the silo, a silo wall ring pipe, or a nozzle assembly. The degree determination unit is used to determine the pressure drop degree of the corresponding target component based on the opening and closing pressures of each target component; The alarm generation unit is used to determine the self-test result of each target component based on the voltage drop level and the fault voltage drop threshold of the target component, and to generate alarm information indicating that the target component is faulty when the self-test result indicates that the target component is faulty.

[0024] A fourth aspect of this application provides a server including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it implements the steps of the material cleaning method provided in the second aspect.

[0025] The fifth aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the material cleaning method provided in the second aspect.

[0026] The beneficial effects of this application embodiment compared with the prior art are as follows: When cleaning materials in the silo, the smaller the pressure drop corresponding to the nozzle assembly, the greater the blockage at the nozzle assembly. In addition, as the medium source is continuously consumed, the air inlet pressure of the silo wall ring pipe usually gradually decreases. By setting the working sequence of the nozzle assembly with the smaller pressure drop to earlier, it is possible to use the cleaning medium with higher pressure to accurately clean the more severely blocked silo area, which helps to improve the utilization rate of the cleaning medium and improve the material cleaning efficiency. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of a material cleaning system provided in an embodiment of this application; Figure 2 This is a schematic diagram of a material cleaning system provided in another embodiment of this application; Figure 3 This is a flowchart illustrating the implementation of a material cleaning method according to an embodiment of this application; Figure 4 This is a flowchart illustrating the implementation of adjusting the voltage drop level according to an embodiment of this application; Figure 5a This is a schematic diagram of various preset functions for the slope of a silo provided in an embodiment of this application; Figure 5b This is a schematic diagram of various preset functions for the distance to the gas source provided in an embodiment of this application; Figure 6 A flowchart illustrating the implementation of a material cleaning method according to another embodiment of this application; Figure 7 This is a structural block diagram of a material cleaning device provided in an embodiment of this application; Figure 8 This is a structural block diagram of a server provided in one embodiment of this application. Detailed Implementation

[0029] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0030] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0031] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0032] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0033] To illustrate the technical solution of this application, the following embodiments will be used for explanation.

[0034] Please see Figure 1 , Figure 1 This is a schematic diagram of a material cleaning system provided in an embodiment of this application. Figure 1 As shown, the material cleaning system includes: a media source 101, a hopper 102, a hopper wall annular pipe 103 disposed inside the hopper 102, and a first nozzle assembly 1041, a second nozzle assembly 1042, and a third nozzle assembly 1043. The media source 101 is connected to the hopper wall annular pipe 103 of the hopper 102 via a main pipe P1 and a branch pipe P2. The input ends of the first nozzle assembly 1041, the second nozzle assembly 1042, and the third nozzle assembly 1043 in the hopper 102 are respectively connected to the hopper wall annular pipe 103, and the cleaning media can flow through the first nozzle assembly 1041, the second nozzle assembly 1042, or the third nozzle assembly 1043 into the hopper 102. The first and second ends of the hopper wall annular pipe 103 are not connected, and a pressure measuring device 105 is provided at the end of the hopper wall annular pipe 103. It should be noted that this embodiment does not specifically limit the number of nozzle assemblies in the hopper 102.

[0035] In practice, the cleaning medium in the medium source 101 can flow through the main pipe P1 and the branch pipe P2 into the silo wall ring pipe 103 of the silo 102. The cleaning medium is then sprayed into the silo 102 through the first nozzle assembly 1041, the second nozzle assembly 1042, and the third nozzle assembly 1043 connected to the silo wall ring pipe 103, cleaning the material inside the silo 102. A pressure measuring device 105 is installed at the end of the silo wall ring pipe 103 to detect the pressure inside the silo wall ring pipe 103. Here, the medium source 101 and the silo wall ring pipe 103 can be connected by multiple pipes such as the main pipe P1 and the branch pipe P2, or by a single pipe.

[0036] In practical applications, a main valve can be installed at the output end of the medium source 101 to control the output of the cleaning medium in the medium source 101, and a main valve can be installed in the branch pipeline P2 to control the cleaning medium entering the silo 102. Each nozzle assembly can include a nozzle and a switch for controlling the operation of the spray group; this switch is typically a solenoid valve.

[0037] The material cleaning system provided in this embodiment includes a pressure measuring device 105 installed at the end of the bin wall ring pipe 103. This device can detect the air inlet pressure of the bin wall ring pipe 103 and the ring pipe pressure corresponding to each nozzle assembly. This helps to determine the pressure drop of each nozzle assembly and the working sequence of each nozzle assembly based on the pressure drop. Furthermore, it allows the nozzle assembly with the smaller pressure drop to be placed earlier in the working sequence. This enables the cleaning medium with higher pressure to be used precisely to clean the more severely blocked bin area, thereby improving the utilization rate of the cleaning medium and the material cleaning efficiency.

[0038] In some embodiments, the material cleaning system described above may include multiple silos. When the material cleaning system includes multiple silos, the piping connections between each silo and the media source are substantially the same.

[0039] Please see Figure 2 , Figure 2 This is a schematic diagram of a material cleaning system provided in another embodiment of this application. For example... Figure 2 As shown, the material cleaning system may include a first silo 1021 and a second silo 1022. A media source 101 is connected to the silo wall ring pipe 103 of the first silo 1021 via a main pipe P1 and a first branch pipe P21. A first nozzle assembly 1041, a second nozzle assembly 1042, and a third nozzle assembly 1043 in the first silo 1021 are respectively connected to the silo wall ring pipe 103. A pressure measuring device 105 is installed at the end of the silo wall ring pipe 103. The piping connection between the second silo 1022 and the media source 101 is similar. The media source 101 is connected to the silo wall ring pipe 103 of the second silo 1022 via a main pipe P1 and a second branch pipe P22. A fourth nozzle assembly 1044 and a fifth nozzle assembly 1045 in the second silo 1022 are respectively connected to the silo wall ring pipe 103. A pressure measuring device 105 is installed at the end of the silo wall ring pipe 103. A main valve 106 is provided at the output end of the medium source 101 to control the output of the cleaning medium in the medium source 101. A first silo main valve 1071 is provided on the first branch pipe P21 in the first silo 1021 to control the cleaning medium entering the silo 1021. A second silo main valve 1072 is provided on the second branch pipe P22 in the second silo 1022 to control the cleaning medium entering the second silo 1022.

[0040] Please see Figure 3 , Figure 3This is a flowchart illustrating the implementation of a material cleaning method according to an embodiment of this application, including: Step 301: Obtain the air inlet pressure of the bin wall annular pipe and the annular pipe pressure corresponding to each nozzle assembly.

[0041] The aforementioned nozzle assembly typically includes a nozzle valve, nozzle elements, and a nozzle head. The inlet pressure of the aforementioned silo wall annular pipe is the pressure when air enters the silo wall annular pipe and all nozzle assemblies are closed. In practice, the inlet pressure is the pressure in the silo wall annular pipe when the main valve of the media source is open, the silo valves in the branch pipelines are open, and the nozzle valves in the nozzle assemblies are closed. The annular pipe pressure is the pressure in the silo wall annular pipe 103 when each individual nozzle assembly is opened. (Combined with...) Figure 1 For example, the silo 102 includes a first nozzle assembly 1041, a second nozzle assembly 1042, and a third nozzle assembly 1043. The annular pressure of the first nozzle assembly 1041 is the pressure of the silo wall annular pipe 103 when the first nozzle assembly 1041 is opened alone, and the second nozzle assembly 1042 and the third nozzle assembly 1043 are both closed. The cleaning medium is sprayed into the silo 102 only from the nozzle in the first nozzle assembly 1041.

[0042] In this embodiment, the entity executing the above-described material cleaning method is typically a material cleaning system, specifically a server within the material cleaning system used to control its operation. It should be noted that the server can be hardware or software. When the server is hardware, it can be implemented as a distributed server cluster consisting of multiple servers, or as a single server. When the server is software, it can be implemented as multiple software programs or software modules, or as a single software program or software module; no specific limitations are imposed here.

[0043] In practice, the aforementioned executing entity can obtain the inlet pressure of the silo wall annular pipe 103 and the annular pipe pressure corresponding to each nozzle assembly through the pressure measuring device 105 installed at the end of the silo wall annular pipe 103. Specifically, when the material cleaning system is inlet, the server can control all nozzle assemblies to close, measure the inlet pressure of the silo wall annular pipe 103 through the pressure measuring device 105, and then the server can individually open each nozzle assembly, measuring the annular pipe pressure when each nozzle assembly is individually opened through the pressure measuring device 105. The server can store the measured inlet pressure and the annular pipe pressure corresponding to each nozzle assembly, and the aforementioned executing entity can obtain the inlet pressure of the silo wall annular pipe 103 and the annular pipe pressure corresponding to each nozzle assembly from the stored data.

[0044] Step 302: Determine the pressure drop of each nozzle assembly based on the intake pressure and the annular pressure corresponding to each nozzle assembly.

[0045] The pressure drop level mentioned above is typically used to describe the degree of pressure change. In practical applications, the pressure drop level can indicate the degree of blockage at the nozzle assembly. Specifically, a larger pressure drop level indicates that when the corresponding nozzle assembly is open, more cleaning medium in the bin wall annular pipe 103 is consumed through the corresponding nozzle assembly, and the degree of blockage at the corresponding nozzle assembly is smaller. Conversely, a smaller pressure drop level indicates that when the corresponding nozzle assembly is open, less cleaning medium in the bin wall annular pipe 103 is consumed through the corresponding nozzle assembly, and the degree of blockage at the corresponding nozzle assembly is larger. Here, the pressure drop level can be expressed as the pressure difference between the intake pressure and the annular pipe pressure, or as a pressure drop rate. The pressure difference is the difference between the intake pressure and the annular pipe pressure, and the pressure drop rate is the quotient of the pressure difference and the annular pipe pressure. In practical applications, when the pressure drop level is expressed as a pressure drop rate, the difference between the data can be amplified, thereby more clearly distinguishing the degree of blockage at each nozzle assembly, especially when the pressure difference values ​​are similar. In other words, when the pressure drop is expressed as a pressure drop rate, it helps to more accurately sort the nozzle assemblies. For example, if the inlet pressure of nozzle assembly 1 is 4.8 MPa and the ring pipe pressure is 4.2 MPa, and the inlet pressure of nozzle assembly 2 is 3.8 MPa and the ring pipe pressure is 3.2 MPa, when the pressure drop is expressed as a differential pressure value, the pressure drop of both nozzle assembly 1 and nozzle assembly 2 is 0.6 MPa, making it difficult to clearly determine the difference in the degree of blockage between them. However, when the pressure drop is expressed as a differential pressure rate, the pressure drop of nozzle assembly 1 is 0.143 and the pressure drop of nozzle assembly 2 is 0.188, making it more obvious that the blockage of nozzle assembly 1 is more severe than that of nozzle assembly 2.

[0046] In practice, for each nozzle assembly, the aforementioned actuator can use the difference between the intake pressure and the corresponding annular pressure to determine the pressure drop level of the nozzle assembly. Alternatively, the actuator can use the pressure drop rate between the intake pressure and the annular pressure as the pressure drop level. Here, when determining the pressure drop level for each nozzle assembly, typically either the pressure drop value or the pressure drop rate is used. Combined with... Figure 2 For example, when the main valve 106 of the medium source is open, the main valve 1071 of the first silo in the branch pipeline P21 is open, and the nozzle valve in the nozzle assembly is closed, the air inlet pressure in the silo wall ring pipe 103 is 4.8 MPa. When the first nozzle assembly 1041 is opened alone, the pressure in the silo wall ring pipe 103 is 4.2 MPa. When the above-mentioned actuator uses the pressure drop rate as the pressure drop degree, the pressure drop degree of the first nozzle assembly 1041 = (4.8-4.2) / 4.2 = 0.143.

[0047] Step 303: Determine the working sequence of each nozzle assembly based on the pressure drop corresponding to each nozzle assembly, and control each nozzle assembly to clean the material according to the corresponding working sequence.

[0048] The above-mentioned working sequence refers to the activation order of each nozzle assembly in the silo 102. In practical applications, the capacity of the media source 101 storing the cleaning medium is limited, and during material cleaning, material cleaning is usually interrupted and air replenishment is performed only when the remaining amount of cleaning medium in the media source 101 is less than a preset threshold. In the early stages of material cleaning, the pressure in the silo wall annular pipe 103 is relatively high, and the nozzle assemblies with earlier working sequences spray the cleaning medium with relatively high pressure. As the cleaning medium is consumed, the pressure in the silo wall annular pipe 103 gradually decreases, and the nozzle assemblies with later working sequences spray the cleaning medium with relatively low pressure. The smaller the pressure drop of the nozzle assembly, the earlier it is in the working sequence. Here, the smaller the pressure drop, the greater the blockage at the corresponding nozzle assembly. The aforementioned execution entity can set the working sequence of the nozzle assembly with the smaller pressure drop to be earlier, using the higher-pressure cleaning medium in the early stages to clean the silo area corresponding to the more severely blocked nozzle assembly. The greater the pressure drop, the less blocked the corresponding nozzle assembly. The aforementioned actuator can set the working sequence of the nozzle assembly with the greater pressure drop to be later, and use a cleaning medium with a lower pressure later to clean the hopper area of ​​the nozzle assembly with relatively less blockage.

[0049] In practice, the aforementioned executing entities can determine the working sequence of each nozzle assembly in the hopper 102 according to the order of increasing pressure drop. Combined with... Figure 1 For example, the pressure drop of the first nozzle assembly 1041 in the hopper 102 is 0.11, the pressure drop of the second nozzle assembly 1042 is 0.15, and the pressure drop of the third nozzle assembly 1043 is 0.13. The working order of the nozzle assemblies in the hopper 102 can be set as (① first nozzle assembly 104, ② third nozzle assembly 1043, ③ second nozzle assembly 1042) according to the order of the corresponding pressure drop from small to large.

[0050] In practice, the aforementioned executing entity can send an opening command to the corresponding nozzle assembly according to the working sequence of each nozzle assembly, thereby controlling the opening of each nozzle assembly to perform material cleaning.

[0051] In practice, the aforementioned executing entity typically uses a polling method to control each nozzle assembly in the silo 102 to clean the material. In practice, the working sequence of each nozzle assembly in the silo 102 is not fixed during each polling cycle. The executing entity can determine the working sequence of each nozzle assembly based on the increasing pressure drop of each nozzle assembly in the silo 102 during each polling cycle.

[0052] Combination Figure 1 For example, during the (N-1)th polling, the working sequence of the nozzle assemblies in the hopper 102 is (① first nozzle assembly 104, ② third nozzle assembly 1043, ③ second nozzle assembly 1042). During the polling, the pressure drop corresponding to each nozzle assembly is calculated. The calculated pressure drop corresponding to the first nozzle assembly 1041 is 0.13, the pressure drop corresponding to the second nozzle assembly 1042 is 0.12, and the pressure drop corresponding to the third nozzle assembly 1043 is 0.11 during the (N-1)th polling. In the Nth polling, based on the pressure drop of each nozzle assembly calculated in the previous polling, the working sequence of the nozzle assemblies in hopper 102 can be set as (① third nozzle assembly 1043, ② second nozzle assembly 1042, ③ first nozzle assembly 1041). Simultaneously, in the Nth polling, the pressure drop of each nozzle assembly is calculated, and the calculated pressure drop for the first nozzle assembly 1041 is 0.38, for the second nozzle assembly 1042 it is 0.27, and for the third nozzle assembly 1043 it is 0.32. In the N+1th polling, based on the pressure drop of each nozzle assembly calculated in the previous polling, the working sequence of the nozzle assemblies in hopper 102 can be set as (① second nozzle assembly 1042, ② third nozzle assembly 1043, ③ first nozzle assembly 1041). During each polling, the pressure drop of each nozzle assembly is calculated and used to sort the working order in the next polling. During the next polling according to the working order, the pressure drop of each nozzle assembly is dynamically updated. This process is repeated so that the pressure drop of each nozzle assembly can truly reflect the degree of blockage, and the working order of each nozzle assembly is adjusted according to the actual degree of blockage.

[0053] The material cleaning method provided in this embodiment determines the pressure drop of each nozzle assembly by detecting the pressure through the pressure measuring device 105 installed at the end of the silo wall ring pipe 103 when cleaning the material in the silo 102. Based on the pressure drop of each nozzle assembly in the silo 102, the working order of each nozzle assembly is sorted so that the nozzle assembly with the smaller pressure drop is placed earlier in the working order. This ensures that the nozzle assembly with more severe blockage is placed earlier in the working order, ensuring that the cleaning medium with higher pressure is accurately used for the nozzle assembly with more severe blockage, thereby improving the utilization rate of the cleaning medium and improving the material cleaning efficiency.

[0054] In some embodiments, when the material cleaning system includes multiple hoppers, the above-mentioned determination of the working sequence of each nozzle assembly based on the pressure drop degree corresponding to each nozzle assembly may include: determining the working sequence of each nozzle assembly in the multiple hoppers in order of increasing pressure drop degree.

[0055] In practice, when a material cleaning system includes multiple silos, the aforementioned execution entity can determine the working sequence of each nozzle assembly according to the order of pressure drop from smallest to largest.

[0056] Combination Figure 2 For example, the material cleaning system may include a first hopper 1021 and a second hopper 1022. The first hopper 1021 may include a first nozzle assembly 1041, a second nozzle assembly 1042, and a third nozzle assembly 1043. The second hopper 1022 may include a fourth nozzle assembly 1044 and a fifth nozzle assembly 1045. The pressure drop of the first nozzle assembly 1041 is 0.11, the pressure drop of the second nozzle assembly 1042 is 0.15, the pressure drop of the third nozzle assembly 1043 is 0.13, the pressure drop of the fourth nozzle assembly 1044 is 0.14, and the pressure drop of the fifth nozzle assembly 1045 is 0.10. The working sequence of each nozzle assembly may be set in order of increasing pressure drop (① fifth nozzle assembly 1045, ② first nozzle assembly 104, ③ third nozzle assembly 1043, ④ second nozzle assembly 1042, ⑤ fourth nozzle assembly 1044).

[0057] In practice, the working sequence of each nozzle component in the material cleaning system is not fixed during each polling process. The aforementioned execution entity can determine the working sequence of each nozzle component based on the order of pressure drop of each nozzle component in the material cleaning system from small to large during each polling.

[0058] Continue to combine Figure 2 For example, during the (N-1)th polling, the working sequence of each nozzle assembly in the material cleaning system is (① fifth nozzle assembly 1045, ② first nozzle assembly 104, ③ third nozzle assembly 1043, ④ second nozzle assembly 1042, ⑤ fourth nozzle assembly 1044). During the (N-1)th polling, the pressure drop of the first nozzle assembly 1041 is calculated to be 0.11, the pressure drop of the second nozzle assembly 1042 is 0.12, the pressure drop of the third nozzle assembly 1043 is 0.13, the pressure drop of the fourth nozzle assembly 1044 is 0.14, and the pressure drop of the fifth nozzle assembly 1045 is 0.15. During the Nth round of polling, the working order of each nozzle component in the material cleaning system can be set as (① first nozzle component 104, ② second nozzle component 1042, ③ third nozzle component 1043, ④ fourth nozzle component 1044, ⑤ fifth nozzle component 1045) based on the order of pressure drop corresponding to each nozzle component calculated in the previous round from small to large.

[0059] The material cleaning method provided in this embodiment can accurately apply a high-pressure cleaning medium to a severely clogged nozzle assembly, thereby improving the utilization rate of the cleaning medium and increasing the material cleaning efficiency.

[0060] In some embodiments, after determining the pressure drop corresponding to each nozzle assembly, the above material cleaning method may further include the following steps one to two.

[0061] Step 1: Obtain the characteristic information of the silo.

[0062] The feature information includes at least one of the following features: the silo level of silo 102, the slope of silo 102, and the distance between silo 102 and media source 101. For ease of description, the slope of silo 102 can be referred to as silo slope, and the distance between silo 102 and media source 101 can be referred to as air source distance. Here, silo level is the level of silo 102 in the material cleaning system set by the user according to the actual application scenario. The silo level is used to indicate the importance of the corresponding silo 102 in the material cleaning system. Silo slope is the angle between the nozzle in the nozzle assembly and the silo wall of the silo 102 and the horizontal plane. Air source distance is the pipe distance between silo 102 and media source 101.

[0063] In some implementations, the characteristic information of the silo 102 can be stored in a database, and the aforementioned execution entity can obtain the characteristic information of the silo 102 by accessing the database.

[0064] In some implementations, the user can input the characteristic information of the hopper 102 through the target device, and the aforementioned execution entity can obtain the characteristic information of the hopper 102 from the target device. The target device can be a user terminal or the execution entity itself.

[0065] Step two: Adjust the pressure drop level based on the characteristic information, and switch the pressure drop level to the adjusted pressure drop level.

[0066] In practice, the aforementioned executing entity can adjust the pressure drop by adding each feature item in the feature information to the pressure drop level. To facilitate intuitive data setting and calculation, the executing entity can first convert each feature item in the feature information to a preset range according to a preset conversion relationship, ensuring that each feature item is at the same order of magnitude during calculation. For example, the executing entity can convert the silo level of silo 102, the slope of silo 102, and the distance between silo 102 and the medium source 101 to a preset range [0.1, 90]. This allows the converted feature items to be added to the pressure drop level to obtain the adjusted pressure drop level. In practice, after adjusting the pressure drop level, the executing entity can switch the pressure drop level to the adjusted level and determine the working sequence of each nozzle assembly based on the adjusted pressure drop level.

[0067] The material cleaning method provided in this embodiment adjusts the pressure drop level by using the characteristic information of the silo 102. This reduces the impact of silo grade, silo slope, and air source distance on the pressure drop level, improves the accuracy of the pressure drop level, and further allows for the precise application of the higher-pressure cleaning medium to the more severely clogged nozzle assembly, thereby increasing the utilization rate of the cleaning medium and improving the material cleaning efficiency.

[0068] Please see Figure 4 , Figure 4 This is a flowchart illustrating the implementation of adjusting the voltage drop level according to an embodiment of this application, including: Step 401: Obtain the material cleaning mode of the silo, and select a target preset function that matches the material cleaning mode and feature from the preset function set corresponding to the silo.

[0069] The aforementioned material cleaning mode is typically a pre-defined operating mode for silo 102. In practice, users can set the material cleaning mode for silo 102. In practice, for each characteristic item, the same value of that characteristic item typically corresponds to different pressure drop changes in different material cleaning modes. The preset functions in the preset function set correspond to both the material cleaning mode and the characteristic item. For the same characteristic item, different material cleaning modes correspond to different objective functions. In practice, the aforementioned execution entity can use the value range corresponding to the characteristic item and a pre-defined mapping range to establish a preset function corresponding to each characteristic item under each material cleaning mode. Specifically, for each characteristic item, the aforementioned execution entity can use the upper limit and lower limit of the characteristic item's value and a pre-defined mapping range to perform curve fitting using various fitting methods, obtaining multiple curves corresponding to that characteristic item. The curve function corresponding to each curve is a preset function. The fitting method corresponds to the material cleaning mode and can include linear fitting, power function fitting, exponential function fitting, logarithmic function fitting, etc.

[0070] As an example, please see Figure 5a , Figure 5a This is a schematic diagram of various preset functions for silo slope provided in an embodiment of this application. For example... Figure 5a As shown, if the fitting method corresponding to material cleaning mode 1 is linear fitting, the fitting method corresponding to material cleaning mode 2 is power function fitting, the fitting method corresponding to material cleaning mode 3 is exponential function fitting, and the fitting method corresponding to material cleaning mode 4 is logarithmic function fitting, the X-axis represents the value of the feature term, and the Y-axis represents the mapped value of the feature term in the mapping interval. For the feature term silo slope, its corresponding value interval is 0.1-90 degrees, and the mapping interval is [0.1, 9]. Linear fitting, power function fitting, exponential function fitting, and logarithmic function fitting are used for curve fitting to obtain the linear curve, power function curve, exponential function curve, and logarithmic function curve corresponding to the feature term silo slope. The curve function corresponding to each curve is a preset function. Combined with... Figure 5a Preset functions 1, 2, 3, and 4 can be obtained. Preset function 1 corresponds to material cleaning mode 1 and silo slope feature item, preset function 2 corresponds to material cleaning mode 2 and silo slope feature item, preset function 3 corresponds to material cleaning mode 3 and silo slope feature item, and preset function 4 corresponds to material cleaning mode 4 and silo slope feature item.

[0071] As another example, see Figure 5b , Figure 5b This is a schematic diagram illustrating various preset functions for the distance to the gas source provided in an embodiment of this application. For example... Figure 5b As shown, for the feature term "gas source distance," if the fitting method corresponding to material cleaning mode 1 is linear fitting, the fitting method corresponding to material cleaning mode 2 is power function fitting, the fitting method corresponding to material cleaning mode 3 is exponential function fitting, and the fitting method corresponding to material cleaning mode 4 is logarithmic function fitting, the X-axis represents the reciprocal value of the feature term, and the Y-axis represents the mapping value of the reciprocal value of the feature term in the mapping interval. For the feature term "gas source distance," its corresponding value range is 10-280 meters, the reciprocal value range of the gas source distance is [0.357, 10], and the mapping interval is [0.1, 9]. Linear fitting, power function fitting, exponential function fitting, and logarithmic function fitting are used for curve fitting to obtain the linear curve, power function curve, exponential function curve, and logarithmic function curve corresponding to the feature term "gas source distance." The curve function corresponding to each curve is a preset function. Combined with... Figure 5bPreset functions 5, 6, 7, and 8 can be obtained. Among them, preset function 5 corresponds to material cleaning mode 1 and air source distance feature item, preset function 6 corresponds to material cleaning mode 2 and air source distance feature item, preset function 7 corresponds to material cleaning mode 3 and air source distance feature item, and preset function 8 corresponds to material cleaning mode 4 and air source distance feature item.

[0072] In practice, the material cleaning mode of silo 102 can be stored in a database, and the aforementioned execution entity can obtain the material cleaning mode of silo 102 by accessing the database. Here, the user can select the material cleaning mode of silo 102 through an interactive interface, and the aforementioned execution entity can obtain the material cleaning mode of silo 102 by receiving the material cleaning mode information input by the user in the interactive interface. In practice, after obtaining the material cleaning mode of silo 102, the aforementioned execution entity can use the material cleaning mode and select a target preset function from the preset function set corresponding to silo 102 that matches the material cleaning mode and feature item. For example, when the material cleaning mode of silo 102 is material cleaning mode 1, the aforementioned execution entity can use material cleaning mode 1 and select a target preset function from the preset function set corresponding to silo 102 that matches material cleaning mode 1 and the slope of feature item silo 102. Simultaneously, the aforementioned execution entity can also use material cleaning mode 1 and select a target preset function from the preset function set corresponding to silo 102 that matches material cleaning mode 1 and the distance between feature item silo 102 and medium source 101.

[0073] Step 402: Determine the pressure drop change corresponding to each feature item based on the target preset function corresponding to each feature item.

[0074] In practice, after obtaining the target preset function corresponding to each feature item, the aforementioned executing entity can use the feature value corresponding to the feature item to determine the pressure drop change corresponding to the feature value from the target preset function. For example, if the slope of feature item silo 102 is 60 degrees, and the material cleaning mode of silo 102 is material cleaning mode 1, please continue to refer to... Figure 5a The aforementioned executing entity can adopt material cleaning mode 1, and determine the corresponding pressure drop change as 3 from the target preset function corresponding to the slope of the silo 102 through the characteristic value of 60 degrees.

[0075] Step 403: Adjust the pressure drop level according to the pressure drop change corresponding to each characteristic item.

[0076] In practice, the aforementioned executing entity can add the pressure drop change corresponding to each characteristic item to the pressure drop level, and adjust the pressure drop level corresponding to the corresponding nozzle assembly to obtain the adjusted pressure drop level of the corresponding nozzle assembly. In practice, when the material cleaning system includes multiple silos, each silo can select a different material cleaning mode. Furthermore, the cleaning mode of the silo can be changed according to the user's actual needs.

[0077] The material cleaning method provided in this embodiment sets different target preset functions for each material cleaning mode of the feature items. By adjusting the pressure drop of the nozzle assembly through the target preset functions and the corresponding feature items, the cleaning medium with higher pressure is accurately used for the nozzle assembly with more severe blockage, thereby improving the utilization rate of the cleaning medium and improving the material cleaning efficiency. At the same time, users can select different material cleaning modes according to actual usage needs, thus expanding the application range of material cleaning modes.

[0078] In some embodiments, determining the operating sequence of each nozzle assembly based on the pressure drop corresponding to each nozzle assembly may include the following first and second steps.

[0079] The first step is to select the target nozzle assembly from multiple nozzle assemblies whose pressure drop is greater than a preset pressure drop threshold.

[0080] The aforementioned preset pressure drop threshold is a pre-defined threshold for the degree of pressure drop. In practice, when the pressure drop of the nozzle assembly exceeds the preset threshold, the blockage at the nozzle assembly is severe, requiring high-pressure cleaning with a cleaning medium; when the pressure drop of the nozzle assembly is less than or equal to the preset threshold, the blockage is less severe, and high-pressure cleaning is not necessary. The target nozzle assembly is the one with severe blockage requiring high-pressure cleaning with a cleaning medium. In practice, the executing entity can compare the pressure drop of each of multiple nozzle assemblies with the preset threshold, and select the nozzle assembly with a pressure drop exceeding the preset threshold as the target assembly.

[0081] The second step is to determine the working sequence of each target nozzle assembly based on the pressure drop corresponding to each target nozzle assembly.

[0082] In practice, the aforementioned executing entities can determine the working sequence of each target nozzle assembly according to the order of pressure drop from smallest to largest.

[0083] The material cleaning method provided in this embodiment can avoid including nozzle assemblies with low clogging levels in the work sequence, reduce the consumption of cleaning media by nozzle assemblies with low clogging levels, and allow the cleaning media to be used as much as possible in the hopper area corresponding to nozzle assemblies with high clogging levels, thereby further improving the utilization rate of the cleaning media and improving the material cleaning efficiency.

[0084] In some embodiments, the material cleaning method described above may further include: generating a visual representation of the pressure drop of each nozzle assembly based on a preset information presentation template and the pressure drop corresponding to each nozzle assembly, and presenting the visual representation. The preset information presentation template is typically a pre-defined template for presenting information. Here, the executing entity can write the pressure drop corresponding to each nozzle assembly into the preset information presentation template to obtain the visual representation. In practice, the executing entity can combine the pressure drop corresponding to each nozzle assembly with a material cleaning system diagram, presenting the visual representation of the pressure drop of each nozzle assembly in the material cleaning system diagram.

[0085] The material cleaning method provided in this embodiment visualizes the pressure drop of each nozzle assembly by presenting a visual diagram, making it easy for users to obtain the pressure drop of each nozzle assembly by viewing the diagram, thus facilitating user operation.

[0086] Please see Figure 6 , Figure 6 This is a flowchart illustrating the implementation of a material cleaning method according to another embodiment of this application, including: Step 601: Obtain the opening pressure and closing pressure of the target component.

[0087] Wherein, the aforementioned opening pressure is the pressure of the target component when the target valve corresponding to the target component is open. Wherein, the aforementioned closing pressure is the pressure of the target valve when it is closed, or the pressure after a preset time interval following the opening of the target valve. Wherein, the aforementioned target component includes any one of the following: the pipeline between the medium source 101 and the silo 102, the silo wall annular pipe 103, and the nozzle assembly.

[0088] In practice, the aforementioned executing entity can obtain the opening and closing pressures of the target component through the target valve corresponding to the target component. Specifically, when the target component is the pipeline between the medium source 101 and the silo 102, the corresponding target valve is the main valve 106 of the medium source. The aforementioned executing entity can use the pipeline pressure detected by the pressure measuring device 105 at the medium source 101 when the main valve 106 of the medium source is opened alone as the opening pressure of the pipeline between the medium source 101 and the silo 102. After a preset time interval, the aforementioned executing entity can use the pipeline pressure detected by the pressure measuring device 105 at the medium source 101 as the closing pressure.

[0089] When the target component is the silo wall ring pipe 103, the corresponding target valve is the main valve of the branch pipeline. The aforementioned actuator can open the main valve of the medium source 101. When the main valve of the branch pipeline is closed, the pipeline pressure detected by the pressure measuring device 105 at the medium source 101 is used as the opening pressure of the silo wall ring pipe 103. Then, the main valve of the branch pipeline is opened. After a preset time interval, the aforementioned actuator can use the pipeline pressure detected by the pressure measuring device 105 at the end of the silo wall ring pipe 103 as the closing pressure.

[0090] When the target component is a nozzle assembly, the target valve should be a nozzle valve. The aforementioned executing entity can open the main valve of the medium source 101, open the main valve of the branch pipeline, and close the nozzle valve. The pipeline pressure detected by the pressure measuring device 105 at the end of the silo wall ring pipe 103 is used as the opening pressure of the nozzle assembly. After the nozzle valve is opened and a preset time interval has elapsed, the pipeline pressure detected by the pressure measuring device 105 at the end of the silo wall ring pipe 103 is used as the closing pressure of the nozzle assembly.

[0091] Step 602: Determine the pressure drop of the corresponding target component based on the opening and closing pressures of each target component.

[0092] The aforementioned pressure drop can be expressed as the pressure difference between the opening and closing pressures, or as a pressure drop rate. The pressure difference is the difference between the opening and closing pressures, while the pressure drop rate is the quotient of the pressure difference and the closing pressure. In practical applications, when the pressure drop is expressed as a pressure drop rate, it can distinguish the degree of blockage at corresponding target components when the pressure difference values ​​are similar. In practice, for each target component, the actuator can use the difference between the opening and closing pressures of the target component as the pressure drop degree, or it can use the pressure drop rate of the opening and closing pressures as the pressure drop degree. Here, when determining the pressure drop degree of a target component, either the pressure difference value or the pressure drop rate is typically used.

[0093] Step 603: For each target component, determine the self-test result of the target component based on the voltage drop level and the fault voltage drop threshold of the target component, and generate alarm information to indicate that the target component has a fault when the self-test result indicates that the target component has a fault.

[0094] The aforementioned fault voltage drop threshold is typically a pre-set threshold indicating the degree of voltage drop that indicates a fault in the corresponding target component. In practice, the executing entity can set separate fault voltage drop thresholds for each target component. The executing entity can then compare the voltage drop degree of the target component with its corresponding fault voltage drop threshold to determine the self-test result of the target component. For example, if the executing entity uses the voltage drop rate as the voltage drop degree, and the voltage drop rate of the target component is 0.03, while the corresponding fault voltage drop threshold is 0.02, the voltage drop rate of the target component is greater than its fault voltage drop threshold, indicating a fault in the target component.

[0095] In practice, when the self-test result indicates a fault in the corresponding target component, the aforementioned execution entity generates alarm information indicating the fault and displays the alarm information in the user interface. For example, if the target component is the warehouse wall ring pipe 103, and the self-test result indicates a fault in the warehouse wall ring pipe 103, the aforementioned execution entity generates alarm information indicating the fault in the warehouse wall ring pipe 103 and displays the alarm information indicating the fault in the warehouse wall ring pipe 103 in the user interface.

[0096] In practice, for the same target component, the aforementioned execution entity can also set different fault pressure drop thresholds for different fault types, with each threshold corresponding to a different fault type. For example, for the pipeline between the medium source 101 and the silo 102, the fault types can include: minor leakage, fault leakage, and accident leakage. The execution entity can set corresponding fault pressure drop thresholds for each fault type, such as setting the fault pressure drop threshold for minor leakage to 0.02, the fault pressure drop threshold for fault leakage to 0.05, and the fault pressure drop threshold for accident leakage to 0.1. When the pressure drop of the pipeline between medium source 101 and silo 102 is greater than 0.02 and less than 0.05, the fault type of the pipeline between medium source 101 and silo 102 can be determined as a minor leak; when the pressure drop of the pipeline between medium source 101 and silo 102 is greater than 0.05 and less than 0.1, the fault type of the pipeline between medium source 101 and silo 102 can be determined as a fault leak; when the pressure drop of the pipeline between medium source 101 and silo 102 is greater than 0.1, the fault type of the pipeline between medium source 101 and silo 102 can be determined as an accident leak.

[0097] In practice, the aforementioned implementing entities can set different countermeasures for different fault types. As an example, for a minor leak in the pipeline between medium source 101 and silo 102, a minor leak alert can be set to remind the user of the minor leak. The user can then troubleshoot or disable the fault based on the received alert information. As another example, for an accidental leak in the pipeline between medium source 101 and silo 102, an accidental leak alert can be set, and simultaneously, a valve closing command can be used to close the main valve of medium source 101, and a motor closing command can be used to de-energize the motor of medium source 101.

[0098] In practice, when a target component malfunctions, the aforementioned executing entity can close the valve corresponding to the target component, thus isolating the malfunctioning target component from the material cleaning system. The isolated target component will not participate in the polling of the material cleaning system. That is, during the polling, the aforementioned executing entity can skip the target component that is in an isolated state in the material cleaning system.

[0099] Continue to combine Figure 2 For example, if there is an accidental leak in the wall ring pipe 103 of the first silo 1021, the wall ring pipe cannot meet the normal working requirements. The main valve 1071 of the first silo corresponding to the wall ring pipe 103 of the first silo 1021 can be closed to isolate the first silo 1021 from the material cleaning system. During the polling, the first silo 1021, which is in an isolated state in the material cleaning system, is skipped. The nozzle assemblies in the first silo 1021 do not participate in the polling, and the polling is performed directly on the nozzle assemblies in the second silo 1022.

[0100] The material cleaning method provided in this embodiment generates alarm information to indicate that the target component is faulty when the target component is faulty, so that the user can quickly understand the fault status of the target component and thus clear the fault in a timely manner.

[0101] Please see Figure 7 , Figure 7 This is a structural block diagram of a material cleaning device 700 provided in an embodiment of this application, comprising: The pressure acquisition unit 701 is used to acquire the inlet pressure of the bin wall annular pipe 103 and the annular pipe pressure corresponding to each nozzle assembly, wherein the annular pipe pressure is the pressure of the bin wall annular pipe 103 when the corresponding nozzle assembly is opened individually. The pressure drop determination unit 702 is used to determine the pressure drop degree of each nozzle assembly based on the intake pressure and the annular pipe pressure corresponding to each nozzle assembly. The material cleaning unit 703 is used to determine the working sequence of each nozzle assembly based on the pressure drop corresponding to each nozzle assembly, and to control each nozzle assembly to clean the material according to the corresponding working sequence. The smaller the pressure drop of the nozzle assembly, the earlier it is in the working sequence.

[0102] In some embodiments, the material cleaning unit 703 is specifically used to: when the material cleaning system includes multiple hoppers 102, determine the working sequence of each nozzle assembly in the multiple hoppers 102 according to the order of increasing pressure drop.

[0103] In some embodiments, the device further includes an information acquisition unit and a voltage drop switching unit (not shown in the figure).

[0104] The information acquisition unit is used to acquire the characteristic information of the silo 102, wherein the characteristic information includes at least one of the following characteristic items: the silo level of the silo 102, the slope of the silo 102, and the distance between the silo 102 and the medium source 101. The voltage drop switching unit is used to adjust the voltage drop level based on characteristic information and to switch the voltage drop level to the adjusted voltage drop level.

[0105] In some embodiments, the voltage drop switching unit 702 further includes a mode acquisition module, a change determination module, and a voltage drop adjustment module (not shown in the figure).

[0106] The pattern acquisition module is used to acquire the material cleaning mode of the silo 102 and select a target preset function that matches the material cleaning mode and feature items from the preset function set corresponding to the silo 102. The preset function in the preset function set corresponds to the material cleaning mode and feature items. The change determination module is used to determine the pressure drop change corresponding to each characteristic item based on the target preset function corresponding to each characteristic item. The pressure drop adjustment module is used to adjust the degree of pressure drop based on the pressure drop change corresponding to each characteristic item.

[0107] In some embodiments, the material cleaning unit 703 further includes a component screening module and a sequence determination module (not shown in the figure).

[0108] The component selection module is used to select target nozzle components from multiple nozzle components whose pressure drop is greater than a preset pressure drop threshold. The sequence determination module is used to determine the working sequence of each target nozzle assembly based on the pressure drop corresponding to each target nozzle assembly.

[0109] In some embodiments, the apparatus further includes a view presentation unit (not shown in the figure), configured to present a template and the pressure drop degree corresponding to each nozzle assembly according to preset information, generate a view for presenting the pressure drop degree of each nozzle assembly, and present the view.

[0110] In some embodiments, the apparatus further includes a target acquisition unit, a degree determination unit, and an alarm generation unit (not shown in the figure).

[0111] The target acquisition unit is used to acquire the opening pressure and closing pressure of the target component. The opening pressure is the pressure of the target component when the target valve corresponding to the target component is open, and the closing pressure is the pressure of the target valve when it is closed. The target component includes any one of the following: the pipeline between the medium source 101 and the silo 102, the silo wall ring pipe 103, and the nozzle assembly. The degree determination unit is used to determine the pressure drop degree of the corresponding target component based on the opening and closing pressures of each target component; The alarm generation unit is used to determine the self-test result of each target component based on the voltage drop level and the fault voltage drop threshold of the target component, and to generate alarm information indicating that the target component is faulty when the self-test result indicates that the target component is faulty.

[0112] The device provided in this embodiment, when cleaning materials in the silo 102, determines the pressure drop of each nozzle assembly by detecting the pressure through the pressure measuring device 105 installed at the end of the silo wall ring pipe 103. Based on the pressure drop of each nozzle assembly in the silo 102, the working order of each nozzle assembly is sorted so that the nozzle assembly with the smaller pressure drop is placed earlier in the working order, and the nozzle assembly with more severe blockage is placed earlier in the working order. This ensures that the cleaning medium with higher pressure is accurately used for the nozzle assembly with more severe blockage, improves the utilization rate of the cleaning medium, and improves the material cleaning efficiency.

[0113] It should be understood that, Figure 7 In the structural block diagram of the material cleaning device 700 shown, each unit is used to perform... Figure 3 , Figure 4 and Figure 6 The steps in the corresponding embodiments, and for Figure 3 , Figure 4 and Figure 6 The steps in the corresponding embodiments have been explained in detail in the above embodiments. Please refer to them for details. Figure 3 , Figure 4 and Figure 6 as well as Figure 3 , Figure 4 and Figure 6 The relevant descriptions in the corresponding embodiments will not be repeated here.

[0114] Please see Figure 8 , Figure 8 This is a structural block diagram of a server 800 provided in an embodiment of this application. The server 800 in this embodiment includes: at least one processor 801 ( Figure 8 Only one processor is shown, along with a memory 802 and a computer program 803 stored in the memory 802 and executable on at least one processor 801, such as a material cleaning program. When the processor 801 executes the computer program 803, it implements the steps in the embodiments of the various material cleaning methods described above. When the processor 801 executes the computer program 803, the functions of each module / unit in the embodiments of the various devices described above are, for example, Figure 7 The functions of the pressure acquisition unit 701 to the material cleaning unit 703 shown are illustrated.

[0115] For example, computer program 803 can be divided into one or more units, one or more of which are stored in memory 802 and executed by processor 801 to complete this application. One or more units can be a series of computer program instruction segments capable of performing specific functions, which describe the execution process of computer program 803 in server 800. For example, computer program 803 can be divided into a pressure acquisition unit, a pressure drop determination unit, and a material cleaning unit. The specific functions of each unit have been described in the above embodiments and will not be repeated here.

[0116] Server 800 can be a computing device such as a server, desktop computer, tablet computer, cloud server, and mobile terminal. Server 800 may include, but is not limited to, a processor 801 and a memory 802. Those skilled in the art will understand that... Figure 8 This is merely an example of server 800 and does not constitute a limitation on server 800. It may include more or fewer components than shown, or combine certain components, or different components. For example, a server may also include input / output devices, network access devices, buses, etc.

[0117] The processor 801 may be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.

[0118] The memory 802 can be an internal storage unit of the server 800, such as the server 800's hard drive or memory. The memory 802 can also be an external storage device of the server 800, such as a plug-in hard drive, Smart Media Card (SMC), Secure Digital (SD) card, or Flash Card. Optionally, the memory 802 can include both internal and external storage units of the server 800. The memory 802 is used to store computer programs and other programs and data required by the turntable device. The memory 802 can also be used to temporarily store data that has been output or will be output.

[0119] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0120] If an integrated module is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can also be implemented by a computer program instructing related hardware, and a computer program can be stored in a computer-readable storage medium. When executed by a processor, this computer program can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying computer program code, recording media, USB flash drives, portable hard drives, magnetic disks, optical disks, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc.

[0121] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0122] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A material handling system, characterized in that, The system includes: a medium source, a silo, a server, a silo wall ring pipe disposed inside the silo, and multiple nozzle assemblies; The medium source is connected to the silo wall ring pipe via a pipeline; The input ends of each nozzle assembly in the hopper are respectively connected to the hopper wall ring pipe; The first and last ends of the bin wall ring pipe are not connected, and a pressure measuring device is installed at the last end of the bin wall ring pipe. The server is used to acquire the inlet pressure of the silo wall annular pipe and the annular pipe pressure corresponding to each nozzle assembly. Based on the inlet pressure and the annular pipe pressure corresponding to each nozzle assembly, the server determines the pressure drop degree corresponding to each nozzle assembly. Based on the pressure drop degree corresponding to each nozzle assembly, the server determines the working sequence of each nozzle assembly and controls each nozzle assembly to clean the material according to the corresponding working sequence. The annular pipe pressure is the pressure of the silo wall annular pipe when the corresponding nozzle assembly is opened individually. The pressure drop degree can indicate the degree of blockage at the nozzle assembly and can be realized as the pressure drop difference between the inlet pressure and the annular pipe pressure, or as a pressure drop rate. The smaller the pressure drop degree of the nozzle assembly, the earlier it is in the working sequence. The pressure drop difference is the difference between the inlet pressure and the annular pipe pressure. The pressure drop rate is the quotient of the pressure drop difference and the annular pipe pressure. The working sequence is the opening sequence of each nozzle assembly in the silo.

2. A material cleaning method, characterized in that, Applied to the material handling system as described in claim 1, the method includes: Obtain the inlet pressure of the bin wall annular pipe and the annular pipe pressure corresponding to each nozzle assembly; Based on the intake pressure and the annular pressure corresponding to each nozzle assembly, determine the pressure drop degree corresponding to each nozzle assembly. Based on the pressure drop of each nozzle assembly, the working sequence of each nozzle assembly is determined, and each nozzle assembly is controlled to clean materials according to the corresponding working sequence. The smaller the pressure drop of the nozzle assembly, the earlier it is in the working sequence.

3. The material cleaning method according to claim 2, characterized in that, When the material cleaning system includes multiple hoppers, determining the operating sequence of each nozzle assembly based on the pressure drop corresponding to each nozzle assembly includes: The working sequence of each nozzle assembly in multiple hoppers is determined according to the order of pressure drop from smallest to largest.

4. The material cleaning method according to claim 2, characterized in that, After determining the pressure drop corresponding to each nozzle assembly, the method further includes: Obtain the characteristic information of the silo, wherein the characteristic information includes at least one of the following characteristic items: the silo level of the silo, the slope of the silo, and the distance between the silo and the medium source; The pressure drop level is adjusted based on the characteristic information, and the pressure drop level is switched to the adjusted pressure drop level.

5. The material cleaning method according to claim 4, characterized in that, The adjustment of the pressure drop level based on the feature information includes: Obtain the material cleaning mode of the silo, and select a target preset function that matches the material cleaning mode and feature items from the preset function set corresponding to the silo, wherein the preset function in the preset function set corresponds to the material cleaning mode and feature items; Based on the target preset function corresponding to each characteristic term, determine the pressure drop change corresponding to the corresponding characteristic term; The pressure drop level is adjusted based on the pressure drop change corresponding to each characteristic item.

6. The material cleaning method according to claim 2, characterized in that, The step of determining the operating sequence of each nozzle assembly based on the pressure drop corresponding to each nozzle assembly includes: From multiple nozzle assemblies, select the target nozzle assembly whose pressure drop is greater than a preset pressure drop threshold; The working sequence of each target nozzle assembly is determined based on the pressure drop corresponding to each target nozzle assembly.

7. The material cleaning method according to claim 2, characterized in that, The method further includes: Based on the preset information presentation template and the pressure drop degree corresponding to each nozzle assembly, a visual diagram for presenting the pressure drop degree of each nozzle assembly is generated, and the visual diagram is presented.

8. The material cleaning method according to any one of claims 2-7, characterized in that, The method further includes: The opening pressure and closing pressure of the target component are obtained, wherein the opening pressure is the pressure of the target component when the target valve corresponding to the target component is open, and the closing pressure is the pressure when the target valve is closed. The target component includes any one of the following: the pipeline between the medium source and the silo, the silo wall ring pipe, and the nozzle assembly. Determine the pressure drop of the corresponding target component based on the opening and closing pressures of each target component; For each target component, the self-test result of the target component is determined based on the voltage drop level and the fault voltage drop threshold of the target component. When the self-test result indicates that the target component is faulty, an alarm message is generated to indicate that the target component is faulty.

9. A server comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the material cleaning method as described in any one of claims 2 to 8.

10. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by the processor, it implements the material cleaning method as described in any one of claims 2 to 8.

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