Five-in-one metal substrate backlight and conductive film combined keyboard backlight module

Abstract

This invention discloses a five-in-one metal substrate backlight and conductive film combined keyboard backlight module. The backlight module includes keycaps, an upper conductive component, a lower conductive component, LEDs, a light-shielding film, a light-guiding film, and a reflective film. The keycaps are positioned above the upper conductive component, and the lower conductive component is positioned below the upper conductive component. The lower conductive component has an opening corresponding to the keycap position. The LEDs are positioned below the lower conductive component. The light-shielding film is positioned below the lower conductive component, and a first through-hole is provided on the light-shielding film corresponding to the LEDs. The light-guiding film is positioned below the light-shielding film, and a second through-hole is provided on the light-guiding film corresponding to the LEDs. The LEDs are placed inside the first and second through-holes. Light-guiding dots are provided on the light-guiding film corresponding to the openings. The reflective film is positioned below the light-guiding film. By adopting a lower conductive component structure, the metal substrate is located below the keycaps, acting as a circuit board and directly supporting the keycaps, simplifying the structure between the metal substrate and the keycaps.

Description

Technical Field

[0001] This invention relates to a keyboard backlight module, and more particularly to a keyboard backlight module that combines a five-in-one metal substrate backlight with a conductive film, which is applied in the field of computer accessories. Background Technology

[0002] The keyboard is the most commonly used and primary input device. It allows users to input English letters, Chinese characters, numbers, punctuation marks, and other symbols into a computer, thereby issuing commands and inputting data. It can be said that since the invention of the computer, the keyboard has been an indispensable peripheral device.

[0003] With the continuous development of keyboards, backlit keyboards (or illuminated keyboards) have emerged to improve the user experience. These keyboards feature keycaps with a light-transmitting structure, illuminating them with light emitted from a backlight module. This makes them more suitable for nighttime typing, improving visibility of the keycaps, and also creates a more visually appealing effect. Current illuminated keyboards typically have a backlight module inside the keyboard, beneath which is a metal substrate. The backlight module emits light to illuminate the keycaps. It usually consists of a light-shielding film, a light guide film, a reflective film, and LEDs. These layers are stacked, and the LEDs are positioned on the side of the light guide film. The light emitted by the LEDs enters the light guide film, is guided through it to the individual keycaps, and then shines through to illuminate them.

[0004] Currently common backlit keyboards have inherent disadvantages due to their structural limitations: (1) Since LED lights are not used between the keycaps and the backlight module, it is not conducive to heat dissipation of the backlight module, which can easily cause heat concentration and localized overheating of the keyboard; (2) The metal substrate is located below the backlight module and plays a supporting role for the keycaps. The keycaps of existing backlit keyboards need to pass through the backlight module and connect to the metal substrate, which makes the structure of existing backlit keyboards more complicated and not conducive to heat dissipation of the backlit keyboard. Summary of the Invention

[0005] To address the issues of complex structure and poor heat dissipation in existing backlit keyboards, as mentioned above, this invention provides a five-in-one metal substrate backlight and conductive film combined keyboard backlight module. It adopts a bottom conductive component structure, so that the metal substrate is located below the keycaps, directly supporting the keycaps, simplifying the structure between the metal substrate and the keycaps. At the same time, the LEDs are positioned downwards, which can directly dissipate heat, thereby achieving a convenient heat dissipation effect. Furthermore, it can also help the laptop's own heat dissipation to further cool the keyboard.

[0006] The technical solution adopted by this invention to solve its technical problem is: a five-in-one metal substrate backlight and conductive film combined keyboard backlight module, the backlight module including keycaps, an upper conductive component, a lower conductive component, LEDs, a light-shielding film, a light-guiding film, and a reflective film. The keycaps are disposed above the upper conductive component, the lower conductive component is disposed below the upper conductive component, the lower conductive component has an opening corresponding to the keycap position, the LEDs are disposed below the lower conductive component, the light-shielding film is disposed below the lower conductive component, the light-shielding film has a first through hole corresponding to the LED, the light-guiding film is disposed below the light-shielding film, the light-guiding film has a second through hole corresponding to the LED, the LEDs are placed in the first through hole and the second through hole, the light-guiding film has light-guiding dots corresponding to the opening, and the reflective film is disposed below the light-guiding film.

[0007] Furthermore, the upper conductive component includes an elastic conductive element and an insulating layer. The insulating layer is provided with a first conductive contact. The elastic conductive element is disposed on the insulating layer corresponding to the first conductive contact. The conductive contact is a silver paste dot or a conductor.

[0008] Furthermore, the lower conductive component includes an upper circuit layer, a metal substrate, and a lower circuit layer. The upper circuit layer is disposed above the metal substrate, and the lower circuit layer is disposed below the metal substrate. The upper circuit layer has a second conductive contact corresponding to the elastic conductive element. The LED light is disposed below the lower circuit layer. The upper circuit layer has a first opening corresponding to the keycap position. The metal substrate has a second opening corresponding to the first opening, and the lower circuit layer has a third opening corresponding to the second opening.

[0009] Furthermore, the upper conductive component is fixedly installed together with the lower conductive component using a first adhesive layer, the thickness of which is 0.02mm to 0.025mm.

[0010] Furthermore, the upper circuit layer, the metal substrate, and the lower circuit layer are bonded together with each other.

[0011] Furthermore, the thickness of both the upper and lower circuit layers is 0.05–0.1 mm, the upper circuit layer is black or white, the lower circuit layer is a color that reflects light, and the metal substrate is a metal sheet with a thickness of 0.15–0.25 mm.

[0012] Furthermore, the lower conductive component is fixedly installed together with the light-shielding film using a second adhesive layer, the thickness of which is 0.02mm to 0.025mm; the light-shielding film is fixedly installed together with the light-guiding film using a third adhesive layer, the thickness of which is 0.02mm to 0.025mm; and the light-guiding film is fixedly installed together with the reflective film using a fourth adhesive layer, the thickness of which is 0.02mm to 0.025mm.

[0013] Furthermore, the reflective film has a black ink layer on the lower layer and a color that reflects light on the upper layer; the light guide dots are arranged above or below the light guide film, and the thickness of the light guide film is 0.010 to 0.25 mm.

[0014] Furthermore, a first connection terminal is provided on one side of the upper circuit layer, and a second connection terminal is provided on one side of the lower circuit layer.

[0015] Furthermore, a scissor-switch pin is installed between the keycap and the upper conductive assembly, and a hook for engaging the scissor-switch pin is provided above the metal substrate.

[0016] The beneficial effects of this invention are as follows: This invention provides a five-in-one metal substrate backlight and conductive film combined keyboard backlight module. It adopts a lower conductive component structure, so that the metal substrate is located below the keycaps, which acts as a circuit board and directly supports the keycaps. The conductive film (Membrane) is combined with the lower conductive component of the metal substrate, which simplifies the structure between the metal substrate and the keycaps. At the same time, the LEDs are set downward, which can directly dissipate heat through the metal substrate of the lower conductive component, thereby achieving a convenient heat dissipation effect. Furthermore, it can also help the laptop's own heat dissipation to further dissipate heat from the keyboard. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the exploded state structure of a partial cross-section of a single keycap provided by the present invention;

[0018] Figure 2 This is a schematic diagram of the disassembled structure of a single keycap and scissor-switch pins provided by the present invention;

[0019] Figure 3 This is a schematic diagram of the decomposed state structure of the lower conduction component provided by the present invention;

[0020] Figure 4 This is a partial top view of the keycap structure provided by the present invention;

[0021] Figure 5 This is a bottom view of the lower circuit layer structure provided by the present invention;

[0022] Figure 6 This is a top view of the upper circuit layer structure provided by the present invention;

[0023] Figure 7 This is a bottom view of the insulating layer provided by the present invention.

[0024] Reference numerals: 1 - Keycap; 2 - Scissor-switch pin; 3 - Upper conductive assembly; 31 - Flexible conductive element; 32 - Insulating layer; 321 - First conductive contact; 4 - First adhesive layer; 5 - Lower conductive assembly; 51 - Upper circuit layer; 511 - Second conductive contact;

[0025] 512 – First opening; 513 – First connecting terminal; 52 – Metal substrate; 521 – Second opening; 522 – Hook; 53 – Lower circuit layer; 531 – Third opening; 532 – Second connecting terminal; 6 LED light; 7 - Second adhesive layer; 8 - Light-shielding film; 81 - First through hole; 9 - Third adhesive layer; 10 - Light guide film; 101 - Second through hole; 102 - Light guide dots; 11 - Fourth adhesive layer; 12 - Reflective film. Detailed Implementation

[0026] To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0027] Please see Figures 1 to 7 This invention provides a five-in-one metal substrate backlight and conductive film combined keyboard backlight module. The attached drawings show the structure of a single keyboard keycap; in practice, the structure of each keycap is identical. The backlight module includes a keycap 1, an upper conductive component 3, a lower conductive component 5, an LED 6, a light-shielding film 8, a light-guiding film 10, and a reflective film 12. The keycap 1 is positioned above the upper conductive component 3, and the lower conductive component 5 is positioned below it. When the keycap 1 is pressed, the upper conductive component 3 and the lower conductive component 5 become conductive. The LED 6 is positioned below the lower conductive component 5 and is either top-emitting or side-emitting, illuminating the light. The lower conductive component 5 has an opening corresponding to the keycap 1 position for light to pass through. The light-shielding film 8 is... Located below the lower conductive component 5, the light-shielding film 8 has both reflective and light-shielding functions. The light-shielding film 8 has a first through hole 81 corresponding to the LED 6. The light guide film 10 is located below the light-shielding film 8 and has a second through hole 101 corresponding to the LED 6. The LED 6 is placed inside the first through hole 81 and the second through hole 101. The light guide film 10 has light guide dots 102 corresponding to the opening. The reflective film 12 is located below the light guide film 10, which allows the light emitted by the LED 6 to enter the light guide film 10 and then be emitted from the light guide dots 102, thereby illuminating the keycap 1. This allows the LED 6 to be positioned downwards, enabling direct heat dissipation and facilitating heat dissipation. Furthermore, it can also help the laptop itself dissipate heat from the keyboard.

[0028] In this embodiment, the upper conductive component 3 includes an elastic conductive element 31 and an insulating layer 32. The insulating layer 32 is made of PET (polyethylene terephthalate) material, while the elastic conductive element 31 is a spring sheet or rubber dome. A first conductive contact 321 is provided on the insulating layer 32, and the elastic conductive element 31 is disposed on the insulating layer 32 corresponding to the first conductive contact 321. The first conductive contact 321 is made of silver paste or other conductive materials. The insulating layer 32 and the first conductive contact 321 form a conductive membrane to facilitate conduction. The lower conductive component 5 includes an upper circuit layer 51, a metal substrate 52, and a lower circuit layer 53. The upper circuit layer 51 is disposed above the metal substrate 52, and the lower circuit layer 53 is disposed below the metal substrate 52. The upper circuit layer 51 and the lower circuit layer 53 are preferably copper foil circuits. The upper circuit layer 51 is provided with a second conductive contact 511 corresponding to the elastic conductive member 31. The second conductive contact 511 is a silver paste dot or a conductor, or other conductive materials. The LED light 6 is located below the lower circuit layer 53. The upper circuit layer 51 is provided with a first opening 512 corresponding to the keycap 1. The metal substrate 52 is provided with a second opening 521 corresponding to the first opening 512. The lower circuit layer 53 is provided with a third opening 531 corresponding to the second opening 521. This allows the metal substrate 52 to be directly located below the keycap 1, directly supporting the keycap 1. This simplifies the structure between the metal substrate 52 and the keycap 1 and helps to improve the feel during use.

[0029] In this embodiment, in order to transmit signals between the backlight module and the laptop, a first connection terminal 513 is provided on one side of the upper circuit layer 51. The signal is transmitted after pressing through the first connection terminal 513. A second connection terminal 532 is provided on one side of the lower circuit layer 53. The LED light signal is controlled through the first connection terminal 513. The first connection terminal 513 is connected to the upper circuit layer 51 by soldering, and the second connection terminal 532 can also be connected to the lower circuit layer 53 by soldering.

[0030] In this embodiment, the upper conductive component 3 is fixedly installed together with the lower conductive component 5 using a first adhesive layer 4. The thickness of the first adhesive layer 4 is 0.02mm to 0.025mm, which allows the upper conductive component 3 and the lower conductive component 5 to be regarded as a whole. The first adhesive layer 4 is a thermosetting adhesive, self-adhesive, etc., which facilitates the overall assembly, transportation and production of the whole unit. Alternatively, the first adhesive layer 4 can be omitted, which also optimizes the backlight module structure and increases the structural compactness.

[0031] In this embodiment, the upper circuit layer 51, the metal substrate 52, and the lower circuit layer 53 are bonded together, or they can be made into an integral structure, and can be bonded together using thermosetting adhesive or self-adhesive.

[0032] In this embodiment, the light-shielding film 8 is made of PET (polyethylene terephthalate) material. The light guide film 10 and reflective film 12 can also be made of PET (polyethylene terephthalate) material, with a thickness of 0.020-0.30 mm, preferably 0.025 mm. In specific implementations, other materials can also be used. The lower layer of the light-shielding film 8 is provided with white ink for reflection, which can reflect the upward light emitted by the LED lamp 6 back into the light guide film 10 to enhance its brightness. The upper layer of the light-shielding film 8 is provided with black ink for light blocking to prevent light transmission in areas other than the keycap 1, thus affecting the overall use of the keyboard. In this embodiment, the white ink and black ink are applied to the light-shielding film 8 by printing. In specific implementations, other methods can also be used, such as spraying, screen printing, etc.

[0033] In this embodiment, the thickness of both the upper circuit layer 51 and the lower circuit layer 53 is 0.05-0.1mm. The upper circuit layer 51 is black or white, and the lower circuit layer 53 is a color that can reflect light, such as white or transparent. The transparent color is used because the metal sheet itself reflects light. Both the upper circuit layer 51 and the lower circuit layer 53 are white, or the lower circuit layer 53 can be white to serve as a reflective element. In specific implementation, the component pads are positioned away from the white area, and pads can be provided on any one of the four sides of the lower circuit layer. The metal substrate 52 is a metal sheet, such as a steel sheet or aluminum alloy. The steel sheet is used with a thickness of 0.15-0.25mm to ensure the thickness of the backlight module.

[0034] In this embodiment, the lower conductive component 5 is fixedly installed together with the light-shielding film 8 using a second adhesive layer 7, the thickness of which is 0.02mm to 0.025mm. The light-shielding film 8 is fixedly installed together with the light-guiding film 10 using a third adhesive layer 9, the thickness of which is 0.02mm to 0.025mm. The light-guiding film 10 is fixedly installed together with the reflective film 12 using a fourth adhesive layer 11, the thickness of which is 0.02mm to 0.025mm. The second adhesive layer 7, the third adhesive layer 9, and the fourth adhesive layer 11 are thermosetting adhesives, which are convenient for processing. In specific implementations, self-adhesive materials can also be used, whose thickness is negligible, as long as the bonding requirements are met. Alternatively, during production and processing, the second adhesive layer 7, the third adhesive layer 9, and the fourth adhesive layer 11 can be omitted, and other fixing structures can be used to fix them together.

[0035] In this embodiment, the lower layer of the reflective film 12 is provided with black ink, which can play a good role in blocking light and improve the overall use of the keyboard. There will be no light exposure. The upper layer is coated with a color that can reflect light, such as white or fluorescent white.

[0036] In this embodiment, the light guide dots 102 can be generated by conventional methods such as coating, screen printing, halftone printing, UV adhesive, or embossing. The light guide dots 102 are disposed above or below the light guide film 10. Preferably, the light guide dots 102 correspond to the opening positions. The thickness of the light guide film 10 is 0.0125 to 0.25 mm.

[0037] In this embodiment, a scissor-switch leg 2 is installed between the keycap 1 and the upper conductive assembly 3. A hook 522 for engaging the scissor-switch leg 2 is provided on the upper metal substrate 52. The upper conductive assembly 3 has a through hole (not shown in the figure) through which the hook 522 passes. In specific implementation, by pressing the keycap 1, pressure is applied to the scissor-switch leg 2, thereby deforming the elastic conductive member 31 and causing the insulating layer 32 to be stressed. Thus, the first conductive contact 321 and the second conductive contact 511 are connected to achieve the key press effect. When the keycap 1 is released, the scissor-switch leg and the elastic conductive member 31 rebound, thereby disengaging the first conductive contact 321 from the second conductive contact 511 and disconnecting it.

[0038] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A keyboard backlight module combining a five-in-one metal substrate backlight and a conductive film, characterized in that, The backlight module includes a keycap (1), an upper conductive component (3), a lower conductive component (5), an LED (6), a light-shielding film (8), a light guide film (10), and a reflective film (12). The keycap (1) is positioned above the upper conductive component (3), and the lower conductive component (5) is positioned below the upper conductive component (3). The lower conductive component (5) has an opening corresponding to the keycap (1). The LED (6) is positioned below the lower conductive component (5), and the light-shielding film (8) is positioned below the lower conductive component (5). Below the light-shielding film (8), a first through hole (81) is provided on the light-shielding film (8) corresponding to the LED lamp (6). The light guide film (10) is disposed below the light-shielding film (8). A second through hole (101) is provided on the light guide film (10) corresponding to the LED lamp (6). The LED lamp (6) is placed in the first through hole (81) and the second through hole (101). Light guide dots (102) are provided on the light guide film (10) corresponding to the opening. The reflective film (12) is disposed below the light guide film (10). The lower conductive component (5) includes an upper circuit layer (51), a metal substrate (52), and a lower circuit layer (53). The upper circuit layer (51) is disposed above the metal substrate (52), and the lower circuit layer (53) is disposed below the metal substrate (52). The upper circuit layer (51) has a second conductive contact (511) corresponding to the elastic conductive member (31). The LED lamp (6) is disposed below the lower circuit layer (53). The upper circuit layer (51) has a first opening (512) corresponding to the keycap (1). The metal substrate (52) has a second opening (521) corresponding to the first opening (512), and the lower circuit layer (53) has a third opening (531) corresponding to the second opening (521). The upper conductive component (3) includes an elastic conductive element (31) and an insulating layer (32). The insulating layer (32) is provided with a first conductive contact (321). The elastic conductive element (31) is disposed on the insulating layer (32) corresponding to the first conductive contact (321). The conductive contact (321) is a silver paste dot or a conductor.

2. The keyboard backlight module combining a five-in-one metal substrate backlight and conductive film as described in claim 1, characterized in that, The upper conductive component (3) is fixedly installed together with the lower conductive component (5) using a first adhesive layer (4), the thickness of which is 0.02mm to 0.025mm.

3. The keyboard backlight module combining a five-in-one metal substrate backlight and conductive film as described in claim 1, characterized in that, The upper circuit layer (51), the metal substrate (52), and the lower circuit layer (53) are bonded together.

4. The keyboard backlight module combining a five-in-one metal substrate backlight and conductive film as described in claim 1, characterized in that, The thickness of the upper circuit layer (51) and the lower circuit layer (53) is 0.05-0.1 mm. The upper circuit layer (51) is black or white, and the lower circuit layer (53) is a color that can reflect light. The metal substrate (52) is a metal sheet with a thickness of 0.15-0.25 mm.

5. A keyboard backlight module combining a five-in-one metal substrate backlight and a conductive film as described in claim 1, characterized in that, The lower conductive component (5) is fixedly installed together with the light-shielding film (8) using a second adhesive layer (7), the thickness of which is 0.02mm to 0.025mm; The light-shielding film (8) is fixedly installed together with the light guide film (10) using a third adhesive layer (9), the thickness of which is 0.02mm to 0.025mm. The light guide film (10) is fixedly installed together with the reflective film (12) using a fourth adhesive layer (11), the thickness of which is 0.02mm to 0.025mm.

6. The keyboard backlight module combining a five-in-one metal substrate backlight and conductive film according to claim 1, characterized in that, The reflective film (12) has a black ink layer on the lower layer and a color that can reflect light on the upper layer; The light guide dots (102) are disposed above or below the light guide film (10), and the thickness of the light guide film (10) is 0.010 to 0.25 mm.

7. A keyboard backlight module combining a five-in-one metal substrate backlight and a conductive film as described in claim 1, characterized in that, The upper circuit layer (51) is provided with a first connection terminal (513) on one side, and the lower circuit layer (53) is provided with a second connection terminal (532) on one side.

8. A keyboard backlight module combining a five-in-one metal substrate backlight and a conductive film as described in claim 1, characterized in that, A scissor leg (2) is installed between the keycap (1) and the upper conductive assembly (3), and a hook (522) for engaging the scissor leg (2) is provided above the metal substrate (52).

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