Multifunctional film pasting device and method

Abstract

The application discloses a multifunctional film pasting device and method, which comprises a feeding manipulator, a wafer ring stacking mechanism, a wafer ring film pasting mechanism and a vacuum film pasting mechanism. The feeding manipulator is used for sending a wafer into the wafer ring film pasting mechanism or the vacuum film pasting mechanism. The wafer ring stacking mechanism comprises a placing table for placing an iron ring and a first clamping assembly for moving the iron ring, and the first clamping assembly is liftable. The wafer ring film pasting mechanism comprises a movable film pasting table and a rolling film pasting assembly, and the film pasting table is movable to below the first clamping assembly. The vacuum film pasting mechanism comprises a vacuum cavity and a liftable sealing cover, and the vacuum cavity is provided with a wafer adsorption table. The application comprises two film pasting modes of rolling film pasting and vacuum film pasting, can arbitrarily switch the film pasting mode according to requirements, satisfies the film pasting requirements of different wafers, and has low equipment cost and small occupied space.

Description

Technical Field

[0001] This invention relates to the field of wafer lamination technology, and in particular to a multifunctional lamination device and method. Background Technology

[0002] Wafer dicing involves separating each individual die from a wafer. Before dicing, a protective film (dicing film or dicing protective film) needs to be applied to the non-circuit board side (back side) of the wafer. The wafer is then sent to a wafer dicing machine for cutting. After dicing, the individual dies are neatly arranged and adhered to adhesive tape. The frame structure prevents the dies from colliding due to tape wrinkles.

[0003] Currently, there are two common film application methods: vacuum lamination and roll lamination. Roll lamination involves placing the wafer with the circuit board side down, covering the wafer with a film (the back side), and then using rollers to press and adhere the film. Vacuum lamination involves placing the diced film and the wafer in a vacuum chamber, using vacuum extraction to bond the film and wafer together. Both methods have their own advantages and disadvantages. Therefore, many factories need to equip themselves with two sets of equipment for both vacuum lamination and roll lamination to perform film application on different types of wafers. However, having two sets of lamination equipment is not only costly but also occupies a large amount of space. Summary of the Invention

[0004] To address the aforementioned issues, this invention provides a multifunctional film-applying device and method that offers various film-applying options, meeting the film-applying needs of different wafers while reducing equipment costs, making it economical and practical.

[0005] Therefore, the technical solution of the present invention is: a multifunctional film-applying device, including a feeding robot, a film ring stacking mechanism, a film ring applying mechanism, a vacuum applying mechanism, and a film ring transfer mechanism;

[0006] A loading robot is used to feed wafers into a wafer ring lamination mechanism or a vacuum lamination mechanism.

[0007] The ring stacking mechanism includes a platform for placing iron rings, a first clamping component for moving iron rings, and the first clamping component is liftable;

[0008] The film-applying mechanism includes a movable film-applying table and a roller-applying assembly. The film-applying table can be moved to a position below the first clamping assembly.

[0009] The vacuum lamination mechanism includes a vacuum chamber and a liftable sealing cover, and the vacuum chamber is equipped with a wafer adsorption platform;

[0010] The sheet ring transfer mechanism includes a second gripping assembly and a moving track. The second gripping assembly has a suction nozzle and can be translated along the moving track.

[0011] After the loading robot of the present invention removes the wafer from the loading tray, it can be sent to the wafer lamination table of the wafer ring lamination mechanism or the wafer adsorption table of the vacuum lamination mechanism, depending on the requirements. Alternatively, the film on the wafer ring lamination mechanism can be replaced with a pre-cut film, which can also achieve the lamination operation.

[0012] When the wafer is placed on the lamination table, the iron ring is picked up by the first clamping component and placed on the lamination table. Then the lamination table moves to the rolling lamination component for lamination. The film is directly applied to the wafer and rolled to fix it. Subsequently, the wafer ring transfer mechanism removes the laminated wafer from the lamination table and sends it to other stations for the next process.

[0013] When the wafer is placed on the wafer adsorption platform of the vacuum laminating mechanism, the iron ring is picked up by the first gripping component and placed on the laminating platform. Then, the laminating platform moves to the rolling laminating component for lamination. The film is directly applied to the iron ring. Subsequently, the wafer ring transfer mechanism removes the film and iron ring from the laminating platform and sends them into the vacuum chamber. The sealing cover closes with the vacuum chamber, and a vacuum is drawn, allowing the wafer and film to automatically adhere. Finally, the wafer ring transfer mechanism removes the laminated wafer from the vacuum chamber and sends it to another station for the next process.

[0014] Preferably, the system also includes a positioning mechanism with a positioning platform and a camera assembly above it. Before wafer lamination, the wafers must be centered and V-groove positioned to ensure consistent position and orientation, thus ensuring uniformity in subsequent wafer processing steps. The loading robot removes the wafers from the loading tray and places them on the positioning mechanism for positioning, ensuring that all wafers fed into the lamination process remain in the same state.

[0015] Preferably, the film-applying mechanism includes a first driving component that drives the film-applying table to move, and the rolling film-applying component includes a feeding roller, a guide roller, a tension roller, a waste recycling roller, a film-pressing component, and a cutting component. One end of the film is wound on the feeding roller, and the other end passes through the guide roller and the tension roller and is fixed on the waste recycling roller. The film-pressing component is used to press the film onto the film-applying table, and the cutting component is provided with a rotatable cutting blade.

[0016] Preferably, the vacuum cavity of the vacuum film-applying mechanism is further provided with an annular platform, on which a wafer mounting groove is provided. The wafer adsorption platform is placed in the middle of the annular platform and can be raised and lowered. The sealing cover is provided with a first lifting component that drives the sealing cover to move. The sealing cover can be tightly fixed to the vacuum cavity. With the annular platform as the boundary, the side facing the sealing cover is the upper cavity, and the other side of the annular platform is the lower cavity. The upper cavity and the lower cavity are respectively connected to a vacuum device, and the pressure in the upper cavity is less than the pressure in the lower cavity.

[0017] Preferably, the device also includes a wafer ring flipping mechanism, which includes a flipping table and a rotary motor that drives the flipping table to rotate 180 degrees. The flipping table is equipped with pneumatic clamps and negative pressure suction holes. Wafers coming out of the lamination station are positioned with the wafer at the bottom and the film at the top. The laminated wafer is placed on the flipping station and flipped 180 degrees so that the wafer is on top and the film is on the bottom, facilitating subsequent marking work.

[0018] The second technical solution of the present invention is: a multifunctional film application method, comprising the following steps:

[0019] 1) The loading robot takes the wafer off the loading tray. If the wafer is placed on the film application table of the wafer ring film application mechanism, proceed to step 2). If the wafer is placed on the wafer adsorption table of the vacuum film application mechanism, proceed to step 3).

[0020] 2) The first gripping assembly places the iron ring onto the film application platform, located on the outside of the wafer; the film application platform moves to the roller film application assembly to complete the roller film application.

[0021] 3) The first clamping component places the iron ring onto the film application table, and the film application table moves to the rolling film application component to bond the cut film and the iron ring together; the film ring transfer mechanism removes the cut film and the iron ring from the film application table and sends them into the vacuum chamber to complete the vacuum film application.

[0022] 4) In step 2) or step 3), the wafer after film application is completed is sent to other stations by the wafer ring transfer mechanism for the next process.

[0023] Preferably, in step 1), after the loading robot takes the wafer off the loading tray, it clamps the wafer to the positioning mechanism for positioning; the camera on the positioning mechanism takes an image of the wafer, compares it with the pre-stored image, confirms the position difference of the V-shaped notch on the captured image and the pre-stored image, and adjusts the gripping position of the loading robot.

[0024] Preferably, the specific steps of rolling and applying the film in step 2) are as follows:

[0025] I) In the initial state, the film-mounting platform is located above the stage of the wafer stacking mechanism. The wafer is placed on the film-mounting platform by the loading robot, and the film-mounting platform moves away from the stage and translates to the side.

[0026] II) The first gripping component grips the iron ring from the platform and moves the iron ring upward;

[0027] III) The film application platform is reset and moved under the placement platform, that is, under the first clamping component. The first clamping component places the iron ring on the film application platform, located on the outside of the wafer.

[0028] IV) The film application table moves the wafer and iron ring to the bottom of the dicing assembly. The feeding rollers send out the dicing film. Through the action of the guide rollers and tension rollers, the dicing film is applied to the wafer. The dicing blades on the dicing assembly remove the excess dicing film. The film pressing assembly makes the dicing film fit closer and more closely to the wafer.

[0029] V) The wafer transfer mechanism removes the laminated wafer from the lamination table and sends it to the next station.

[0030] Preferably, the specific steps of vacuum film application in step 3) are as follows:

[0031] S1) In the initial state, the vacuum chamber and the sealing cover are separated. The loading robot places the wafer on the wafer adsorption platform and uses negative pressure to fix the wafer.

[0032] S2) The film application table moves to the side after leaving the shelf;

[0033] S3) The first gripping component grips the iron ring from the table and moves the iron ring upward;

[0034] S4) The film application table is reset and moved under the storage platform, that is, under the first clamping component. The first clamping component places the iron ring on the film application table.

[0035] S5) The film application table moves the iron ring to the bottom of the cutting assembly. The feeding roller feeds the cutting film out. Through the action of the guide roller and tension roller, the cutting film is applied to the iron ring. The cutting blade on the cutting assembly removes the excess cutting film.

[0036] S6) The sheet ring transfer mechanism removes the cutting film and iron ring from the film application table and sends them into the vacuum chamber, placing them in the sheet ring placement groove on the ring table.

[0037] S7) The sealing cap moves down and is tightly fixed to the vacuum chamber. At this time, the cutting membrane separates the upper chamber and the lower chamber.

[0038] S8) The vacuum devices connected to the upper and lower chambers start working, evacuating the gas in the chambers so that the pressure in the upper chamber is less than the pressure in the lower chamber; at this time, the gas pressure on both sides of the cutting membrane is different, and the cutting membrane presents a concave arc shape.

[0039] S9) The wafer adsorption platform moves upward, and the center of the wafer first contacts the dicing film. As the wafer rises, the contact surface with the dicing film slowly spreads outward until the wafer and the dicing film are completely bonded.

[0040] S10) Atmospheric pressure is released simultaneously in the upper and lower cavities to remove air bubbles between the wafer and the dicing film, making the dicing film at the edge of the wafer fit more closely.

[0041] S11) The sealing cover moves upward and separates from the vacuum chamber, allowing the wafer ring transfer mechanism to remove the wafer with the dicing film attached from the wafer adsorption platform and send it to the next station.

[0042] Preferably, in step 4), the wafer ring transfer mechanism sends the wafer after film application to the flipping station. After the wafer is flipped 180 degrees, it falls into the marking station. After the marking work is completed, the wafer is sent into the unloading box.

[0043] Compared with the prior art, the beneficial effects of the present invention are:

[0044] 1. The equipment includes two film application methods: roll film application and vacuum film application. The film application method can be switched at will according to the needs of different wafers. The equipment has low cost and small footprint.

[0045] 2. It integrates automatic wafer feeding, wafer positioning, wafer film application, wafer marking, and automatic wafer unloading, with a high degree of automation and high work efficiency. Attached Figure Description

[0046] The following detailed description, in conjunction with the accompanying drawings and embodiments of the present invention, will provide further information.

[0047] Figure 1 , Figure 2 This is a schematic diagram of the structure of the present invention;

[0048] Figure 3 This is a top view of the structure of the present invention;

[0049] Figure 4 This is a schematic diagram of the positioning mechanism of the present invention;

[0050] Figure 5 This is a schematic diagram of the sheet ring stacking mechanism of the present invention;

[0051] Figure 6 This is a schematic diagram of the sheet ring film application mechanism of the present invention;

[0052] Figure 7 This is a schematic diagram of the sheet ring transfer mechanism of the present invention;

[0053] Figure 8 This is a schematic diagram of the vacuum film application mechanism of the present invention;

[0054] Figure 9 This is a schematic diagram of the vacuum film application mechanism of the present invention in its open state;

[0055] Figure 10 This is a schematic diagram of the sheet ring flipping mechanism of the present invention.

[0056] The diagram is marked as follows:

[0057] Feeding mechanism 1; Feeding robot 2;

[0058] Positioning mechanism 3, positioning platform 31, camera component 32;

[0059] 4. Sheet ring stacking mechanism, 41. Placement platform, 42. Iron ring, 43. Mounting bracket, 44. Suction cup, 45. First linear module;

[0060] 5. Film-applying mechanism, 51. Film-applying table, 52. First drive assembly, 53. Feeding roller, 54. Guide roller, 55. Tension roller, 56. Waste recycling roller, 57. Film pressing assembly, 58. Cutting assembly;

[0061] The ring transfer mechanism 6, the second clamping assembly 61, the second moving track 62, and the second suction nozzle 63;

[0062] Vacuum film application mechanism 7, vacuum chamber 71, sealing cover 72, wafer adsorption platform 73, annular platform 74, first lifting component 75;

[0063] 8. Plate ring flipping mechanism, 81. Flipping table, 82. Rotating assembly, 83. Pneumatic clamp;

[0064] 9. Marking mechanism; 91. Marking table; 92. Marking machine;

[0065] Feeding mechanism 10. Detailed Implementation

[0066] In the description of this invention, it should be noted that the directional terms such as "center", "horizontal (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this invention.

[0067] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of "first" and "second" to define a feature may explicitly or implicitly include one or more of that feature. In the description of this invention, "several" or "a number" means two or more, unless otherwise explicitly specified.

[0068] See the attached drawings. The multifunctional film-applying device described in this embodiment includes a feeding mechanism 1, a feeding robot 2, a positioning mechanism 3, a film ring stacking mechanism 4, a film ring applying mechanism 5, a film ring transfer mechanism 6, a vacuum film-applying mechanism 7, a film ring flipping mechanism 8, a marking mechanism 9, and a feeding mechanism 10.

[0069] The feeding mechanism 1 is equipped with a feeding box, and uncoated wafers are placed in the feeding box.

[0070] The loading robot 2 can pick up wafers from the loading box and place them into the positioning mechanism 3, the wafer ring laminating mechanism 5, or the vacuum laminating mechanism 7.

[0071] The positioning mechanism 3 is equipped with a positioning platform 31, and a camera assembly 32 is mounted above the positioning platform 31. Before wafer lamination, the wafer must be centered and V-groove positioned to ensure that the wafer's position and orientation are consistent, thus ensuring uniformity in subsequent wafer processing steps. After the loading robot 2 removes the wafer from the loading tray, it places it on the positioning platform 3 of the positioning mechanism 3 for positioning, ensuring that all wafers fed into the lamination process remain in the same state.

[0072] The ring stacking mechanism 4 includes a platform 41 for placing iron rings and a first clamping component for moving iron rings, and the first clamping component is liftable; a number of iron rings 42 are placed on the platform 41, and the first clamping component includes a mounting frame 43, a suction cup 44 and a vertically arranged first linear module 45. The mounting frame 43 is fixed on the first linear module 45 and can be lifted and lowered with the linear module. The suction cup 44 is provided below the mounting frame 43, which can attract the iron rings 42 and remove the iron rings from the platform.

[0073] The film-applying mechanism 5 includes a movable film-applying table 51, a first drive assembly 52 that drives the film-applying table to move, and a roller-applying assembly. The first drive assembly includes a horizontally arranged second linear module, guide rails, etc., which can drive the film-applying table 51 to translate along the guide rails. The roller-applying assembly includes a feeding roller 53, a guide roller 54, a tension roller 55, a waste recycling roller 56, a film pressing assembly 57, and a cutting assembly 58. One end of the cut film is wound around the feeding roller, and the other end passes through the guide roller and tension roller and is fixed to the waste recycling roller. The film pressing assembly is used to press the film onto the film-applying table. The cutting assembly is equipped with a rotatable cutting blade. The film-applying mechanism is an existing roller-applying technology, which is a mature technology, and its specific structure will not be described in detail.

[0074] The wafer ring transfer mechanism 6 includes a second gripping assembly 61 and a second moving track 62. The second gripping assembly is equipped with a second suction nozzle 63, which can be used to adsorb wafers and iron rings, and drive them to move along the second moving track 62 to transfer wafers between the film application platform 51, the wafer adsorption platform 73 and the flipping platform.

[0075] The vacuum film application mechanism 7 includes a vacuum chamber 71 and a liftable sealing cover 72. The vacuum chamber 71 is provided with a wafer adsorption platform 73. The vacuum chamber is also provided with an annular platform 74, which has a wafer ring placement groove. The wafer adsorption platform 73 is placed in the middle of the annular platform and can be raised and lowered. The sealing cover is provided with a first lifting component 75 that drives the sealing cover 72 to move. The sealing cover can be tightly fixed to the vacuum chamber. The side facing the sealing cover is the upper chamber, and the other side of the annular platform is the lower chamber. The upper chamber and the lower chamber are respectively connected to a vacuum device. The pressure in the upper chamber is less than the pressure in the lower chamber.

[0076] The wafer flipping mechanism 8 includes a flipping table 81 and a rotating component 82 that drives the flipping table to rotate 180 degrees. The flipping table 81 is equipped with a pneumatic clamp 83 and a negative pressure suction hole. The wafers coming out of the lamination station are positioned with the wafer at the bottom and the film at the top. The laminated wafers are placed on the flipping station and flipped 180 degrees so that the wafers are on top and the film is on the bottom, which facilitates subsequent marking work.

[0077] The marking mechanism 9 includes a marking table 91, a third drive mechanism for moving the marking table, and a marking machine 92. The third drive mechanism consists of a third linear module and a third moving track. The marking table can move along the third moving track below the flipping table 81. After the pneumatic clamp 83 on the flipping table 81 is released, the wafer falls into the marking table 91. Then the marking table drives the wafer back to the marking machine 92 for marking.

[0078] The unloading mechanism 10 includes an unloading box, into which wafers with films applied and labels are fed for storage.

[0079] In this embodiment, after the loading robot removes the wafer from the loading tray, it can be sent to the wafer lamination table of the wafer ring lamination mechanism or the wafer adsorption table of the vacuum lamination mechanism, depending on the requirements. Alternatively, the film on the wafer ring lamination mechanism can be replaced with a pre-cut film, which can also achieve the lamination operation.

[0080] The rolling and applying of film includes the following steps:

[0081] 1) Uncoated wafers are placed in the loading box of loading mechanism 1. Loading robot 2 takes the wafers out of the loading box and sends them to positioning mechanism 3.

[0082] 2) The wafer is placed on the positioning platform 31, and the camera component 32 can capture an image of the wafer and compare it with the pre-stored image to confirm the position difference of the V-shaped notch on the captured image and the pre-stored image, so that the robot arm can grasp the wafer at the same position, that is, the wafers entering the film lamination process are all consistent.

[0083] 3) At this time, the film application table 51 is located above the placement table 41 of the wafer ring stacking mechanism 4, that is, between the placement table 41 and the first gripping component, which facilitates the loading robot 2 to place the wafer; after the wafer is placed on the film application table 51 by the loading robot 2, the film application table 51 moves along the guide rail and leaves the placement table.

[0084] 4) The first gripping component descends, and the suction cup 44 removes the iron ring 42 from the table 41, and moves the iron ring upward.

[0085] 5) The film application platform 51 is reset and moved back below the first clamping assembly. Then the first clamping assembly places the iron ring 42 on the film application platform, located on the outside of the wafer.

[0086] 6) The film application table 51 moves the wafer and the iron ring to the bottom of the cutting assembly 58. The feeding roller 53 feeds out the cutting film. Under the action of the guide roller 54 and the tension roller 55, the cutting film is applied to the wafer. The cutting blade on the cutting assembly 58 removes the excess cutting film. The film pressing assembly makes the cutting film fit closer to the wafer.

[0087] 7) The wafer ring transfer mechanism 6 removes the wafer after it has been coated from the coating table 51, and then moves the wafer to the flipping station. It passes through the vacuum coating mechanism 7 along the way. At this time, the vacuum chamber 71 and the sealing cover 72 are open, which makes it convenient for the wafer to pass between them.

[0088] 8) The wafer is placed on the flipping table 81 of the flipping station and fixed by the pneumatic clamp 83. Then the flipping table 81 drives the wafer to flip 180 degrees.

[0089] 9) After the wafer is flipped, the marking table of the marking mechanism moves below the flipping table, the flipping table moves down, and the wafer is placed on the marking table;

[0090] 10) The marking table 91 moves the wafer back to the marking machine 92 for marking operation;

[0091] 11) The marked wafers are sent into the unloading box for storage, thus completing the roll-on film application process.

[0092] Vacuum lamination includes the following steps:

[0093] S1) The uncoated wafers are placed in the loading box of the loading mechanism 1. The loading robot 2 takes the wafers out of the loading box and sends them to the positioning mechanism 3.

[0094] S2) The wafer is placed on the positioning platform 31. The camera component 32 can capture an image of the wafer and compare it with the pre-stored image to confirm the position difference of the V-shaped notch on the captured image and the pre-stored image, so that the robot arm can grasp the wafer at the same position, that is, the wafers entering the film lamination process are all consistent.

[0095] S3) In the initial state, the vacuum chamber 71 and the sealing cover 72 are separated. The loading robot 2 places the wafer on the wafer adsorption platform 73 and uses negative pressure to fix the wafer.

[0096] S4) At this time, the film application table 51 is located above the table of the film ring stacking mechanism 4, that is, between the table and the first clamping component. Then the film application table moves along the guide rail and leaves the table.

[0097] S5) The first gripping component descends, and the suction cup 44 removes the iron ring 42 from the table, causing the iron ring to move upward.

[0098] S6) The film application table 51 is reset and moved back below the first clamping component. Then the first clamping component places the iron ring on the film application table.

[0099] S7) The film application table 51 moves the iron ring to below the cutting assembly 58. The feeding roller 53 feeds out the cutting film. After the action of the guide roller 54 and tension roller 55, the cutting film is applied to the iron ring. The cutting blade on the cutting assembly removes the excess cutting film.

[0100] S8) The sheet ring transfer mechanism 6 removes the cutting film and iron ring from the film application platform 51 and sends them into the vacuum chamber 71, placing them in the sheet ring placement groove of the annular platform 74.

[0101] S9) The sealing cover 72 moves down and is tightly fixed to the vacuum chamber 71. At this time, the cutting membrane separates the upper chamber and the lower chamber.

[0102] S10) The vacuum devices connected to the upper and lower chambers start working, evacuating the gas in the chambers so that the pressure in the upper chamber is less than the pressure in the lower chamber; at this time, the gas pressure on both sides of the cutting membrane is different, and the cutting membrane presents a concave arc shape.

[0103] S11) The wafer adsorption platform 73 moves upward, and the center of the wafer first contacts the dicing film. As the wafer rises, the contact surface with the dicing film slowly spreads outward until the wafer and the dicing film are completely bonded.

[0104] S12) Atmospheric pressure is released simultaneously in the upper and lower cavities to remove air bubbles between the wafer and the dicing film, making the dicing film at the edge of the wafer fit more snugly.

[0105] S13) The sealing cover 72 moves upward and separates from the vacuum chamber 71, and the wafer ring transfer mechanism 6 can remove the wafer with the dicing film attached from the wafer adsorption platform 73 and send it to the flipping station.

[0106] S14) The wafer is placed on the flipping table 81 of the flipping station and fixed by the pneumatic clamp 83. Then the flipping table drives the wafer to flip 180 degrees.

[0107] S15) After the wafer is flipped, the marking table 91 of the marking mechanism moves below the flipping table 81, and the flipping table moves down to place the wafer on the marking table.

[0108] S16) The marking table 91 drives the wafer back to the marking machine 92 for marking operation;

[0109] S17) The marked wafers are sent into the unloading box for storage, thus completing the vacuum film application process.

[0110] The above description is merely a preferred embodiment of the present invention, and the scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A multifunctional film applicator, characterized in that: This includes a feeding robot, a sheet ring stacking mechanism, a sheet ring film application mechanism, a vacuum film application mechanism, and a sheet ring transfer mechanism; A loading robot is used to feed wafers into a wafer ring lamination mechanism or a vacuum lamination mechanism. The ring stacking mechanism includes a platform for placing iron rings, a first clamping component for moving iron rings, and the first clamping component is liftable; The film-applying mechanism includes a movable film-applying table and a roller-applying assembly. The film-applying table can be moved to a position below the first clamping assembly. The vacuum lamination mechanism includes a vacuum chamber and a liftable sealing cover, and the vacuum chamber is equipped with a wafer adsorption platform; The sheet ring transfer mechanism includes a second gripping assembly and a moving track. The second gripping assembly has a suction nozzle and can be translated along the moving track.

2. The multifunctional film applicator as described in claim 1, characterized in that: It also includes a positioning mechanism, which has a positioning platform and a camera component above the positioning platform.

3. The multifunctional film applicator as described in claim 1, characterized in that: The film-applying mechanism includes a first drive assembly that drives the film-applying table to move. The rolling film-applying assembly includes a feeding roller, a guide roller, a tension roller, a waste recycling roller, a film-pressing assembly, and a cutting assembly. One end of the film is wound on the feeding roller, and the other end passes through the guide roller and the tension roller and is fixed on the waste recycling roller. The film-pressing assembly is used to press the film onto the film-applying table. The cutting assembly is provided with a rotatable cutting blade.

4. The multifunctional film applicator as described in claim 1, characterized in that: The vacuum chamber of the vacuum film-applying mechanism is also provided with an annular platform, on which a wafer mounting groove is provided. The wafer adsorption platform is placed in the middle of the annular platform and can be raised and lowered. The sealing cover is provided with a first lifting component that drives the sealing cover to move. The sealing cover can be tightly fixed to the vacuum chamber. With the annular platform as the boundary, the side facing the sealing cover is the upper chamber, and the other side of the annular platform is the lower chamber. The upper chamber and the lower chamber are respectively connected to a vacuum device, and the pressure in the upper chamber is less than the pressure in the lower chamber.

5. The multifunctional film applicator as described in claim 1, characterized in that: It also includes a plate ring flipping mechanism, which includes a flipping table and a rotary motor that drives the flipping table to rotate 180 degrees. The flipping table is equipped with pneumatic clamps and negative pressure suction holes.

6. A multifunctional film application method, characterized in that: Includes the following steps: 1) The loading robot takes the wafer off the loading tray. If the wafer is placed on the film application table of the wafer ring film application mechanism, proceed to step 2). If the wafer is placed on the wafer adsorption table of the vacuum film application mechanism, proceed to step 3). 2) The first gripping assembly places the iron ring onto the film application platform, located on the outside of the wafer; the film application platform moves to the roller film application assembly to complete the roller film application. 3) The first clamping component places the iron ring onto the film application table, and the film application table moves to the rolling film application component to bond the cut film and the iron ring together; the film ring transfer mechanism removes the cut film and the iron ring from the film application table and sends them into the vacuum chamber to complete the vacuum film application. 4) In step 2) or step 3), the wafer after film application is completed is sent to other stations by the wafer ring transfer mechanism for the next process.

7. The multifunctional film application method as described in claim 6, characterized in that: In step 1), after the loading robot takes the wafer off the loading tray, it clamps the wafer to the positioning mechanism for positioning; the camera on the positioning mechanism takes an image of the wafer and compares it with the pre-stored image to confirm the position difference of the V-shaped notch on the captured image and the pre-stored image, and adjusts the gripping position of the loading robot.

8. The multifunctional film application method as described in claim 6, characterized in that: The specific steps for rolling and applying the film in step 2) are as follows: I) In the initial state, the film-mounting platform is located above the stage of the wafer stacking mechanism. The wafer is placed on the film-mounting platform by the loading robot, and the film-mounting platform moves away from the stage and moves to the side. II) The first gripping component grips the iron ring from the platform and moves the iron ring upward; III) The film application platform is reset and moved under the placement platform, that is, under the first clamping component. The first clamping component places the iron ring on the film application platform, located on the outside of the wafer. IV) The film application table moves the wafer and iron ring to the bottom of the dicing assembly. The feeding rollers send out the dicing film. Through the action of the guide rollers and tension rollers, the dicing film is applied to the wafer. The dicing blades on the dicing assembly remove the excess dicing film. The film pressing assembly makes the dicing film fit closer and more closely to the wafer. V) The wafer transfer mechanism removes the laminated wafer from the lamination table and sends it to the next station.

9. The multifunctional film application method as described in claim 6, characterized in that: The specific steps for vacuum film application in step 3) are as follows: S1) In the initial state, the vacuum chamber and the sealing cover are separated. The loading robot places the wafer on the wafer adsorption platform and uses negative pressure to fix the wafer. S2) The film application table moves to the side after leaving the shelf; S3) The first gripping component grips the iron ring from the table and moves the iron ring upward; S4) The film application table is reset and moved under the storage platform, that is, under the first clamping component. The first clamping component places the iron ring on the film application table. S5) The film application table moves the iron ring to the bottom of the cutting assembly. The feeding roller feeds the cutting film out. Through the action of the guide roller and tension roller, the cutting film is applied to the iron ring. The cutting blade on the cutting assembly removes the excess cutting film. S6) The sheet ring transfer mechanism removes the cutting film and iron ring from the film application table and sends them into the vacuum chamber, placing them in the sheet ring placement groove on the ring table. S7) The sealing cap moves down and is tightly fixed to the vacuum chamber. At this time, the cutting membrane separates the upper chamber and the lower chamber. S8) The vacuum devices connected to the upper and lower chambers start working, evacuating the gas in the chambers so that the pressure in the upper chamber is less than the pressure in the lower chamber; at this time, the gas pressure on both sides of the cutting membrane is different, and the cutting membrane presents a concave arc shape. S9) The wafer adsorption platform moves upward, and the center of the wafer first contacts the dicing film. As the wafer rises, the contact surface with the dicing film slowly spreads outward until the wafer and the dicing film are completely bonded. S10) Atmospheric pressure is released simultaneously in the upper and lower cavities to remove air bubbles between the wafer and the dicing film, making the dicing film at the edge of the wafer fit more closely. S11) The sealing cover moves upward and separates from the vacuum chamber, allowing the wafer ring transfer mechanism to remove the wafer with the dicing film attached from the wafer adsorption platform and send it to the next station.

10. The multifunctional film application method as described in claim 6, characterized in that: In step 4), the wafer ring transfer mechanism sends the coated wafer to the flipping station. After the wafer is flipped 180 degrees, it falls into the marking station. After the marking is completed, the wafer is sent into the unloading box.

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