A semiconductor tilt-controllable chip mounting apparatus and chip mounting method

Abstract

This invention provides a semiconductor tilt-controllable surface mount technology (SMT) processing apparatus, including a base plate, and further comprising: a surface mount mechanism, a hydraulic mechanism, a measuring mechanism, and a fixing and adjusting mechanism. The surface mount mechanism is fixedly mounted on the base plate, and includes a lower plate and an upper plate fixed above the base plate. A double-crank mechanism is disposed between the lower and upper plates, and the upper plate is provided with a surface mount processing stage suitable for placement. The fixing and adjusting mechanism is disposed on the lower plate and connected to the double-crank mechanism. The hydraulic mechanism is disposed above the processing stage. This invention also provides a surface mount processing method. Through this invention, the surface mount processing apparatus has a simple and stable structure, high operability, and high maintainability.

Description

Technical Field

[0001] This invention relates to the field of chip mounting equipment technology, and more specifically, to a chip mounting equipment and method with controllable semiconductor tilt angle. Background Technology

[0002] The field of two-dimensional electronic materials and devices is currently experiencing rapid development. Organically combining novel two-dimensional materials with traditional three-dimensional semiconductors to construct hybrid multi-dimensional structures can achieve more complex device functions, providing a new path for the design of modern electronic devices. Taking molybdenum disulfide / gallium nitride (MoS2 / GaN) semiconductor heterojunctions as an example, MoS2 / GaN semiconductor heterojunctions have broad application prospects in photovoltaics, optoelectronics, and spintronics. High-quality, large-area, and orientation-controllable two-dimensional semiconductors on three-dimensional semiconductor substrates are key to high-performance devices. From a growth thermodynamics perspective, nucleation tends to preferentially occur on steps during growth. Atomic-level steps on the surface of single-crystal substrates are beneficial for promoting the growth of highly oriented, high-quality continuous thin films of two-dimensional semiconductor materials. According to crystal symmetry, the atomic steps on the surface of semiconductor substrates are caused by the tilt angle of their C-axis (0001).

[0003] In traditional semiconductor processing, the C-axis tilt angle of the substrate is mainly determined during the ingot cutting process, which is cumbersome, complex, and requires highly skilled personnel. Secondly, in terms of existing semiconductor tilt angle adjustment devices, in order to pursue the accuracy of tilt angle adjustment, most existing mechanisms use high-precision components such as gears as core adjustment components, such as a positioning fixture for semiconductor processing with patent number CN109676415A. However, its maintainability and operability are poor, and it is impossible to achieve a balanced and unified mechanism performance. Summary of the Invention

[0004] This invention discloses a semiconductor tilt-controllable chip mounting device, which has a simple structure and is easy to operate, aiming to improve the poor operability of existing chip mounting devices.

[0005] The present invention adopts the following solution:

[0006] This application provides a semiconductor tilt-controllable surface mount processing apparatus, including a base plate, and further including: a surface mount mechanism, a hydraulic mechanism, a measuring mechanism, and a fixing and adjusting mechanism, wherein...

[0007] A patching mechanism is fixedly installed on the base plate. The patching structure includes a lower plate and an upper plate fixed above the base plate. A double crank mechanism is provided between the lower plate and the upper plate, and the upper plate is provided with a suitable place for a patching processing table.

[0008] The fixing and adjusting mechanism is disposed on the lower plate and connected to the double crank mechanism, and is configured to adjust the swing of the double crank mechanism to control the tilt angle of the upper plate.

[0009] The measuring mechanism is configured to measure the height difference between the two sides of the upper plate, so as to cooperate with the fixing and adjusting mechanism to adjust the tilt angle of the upper plate;

[0010] The hydraulic mechanism is located above the processing table and is configured to move up and down above the processing table.

[0011] Furthermore, the double-crank mechanism includes a first link, a second link, a third link, and a fourth link hinged to the upper plate and the lower plate and arranged in a square array. The first link and the second link constitute a first double-crank mechanism, the third link and the fourth link constitute a second double-crank mechanism, and a fifth link is fixedly connected between the first link and the third link.

[0012] Furthermore, the rotation amplitude of the double crank mechanism is less than or equal to 14°.

[0013] Furthermore, the processing table is provided with a placement groove, the upper end surface of which is an inclined surface.

[0014] Furthermore, the fixing and adjusting mechanism includes a slide rail fixed to the lower plate, a slidable slider is provided on the slide rail, and a sixth rod is hinged to the slider, the sixth rod connecting the slider and the fifth rod.

[0015] Furthermore, the measuring mechanism includes two micrometers, which are fixed above the upper plate by fasteners, with their lower measuring points abutting against the lower plate. They are configured to measure the height difference between two opposite short sides of the upper plate.

[0016] Furthermore, the hydraulic mechanism includes an inverted L-shaped bracket and a hydraulic device, which is suspended above the processing table via the inverted L-shaped bracket.

[0017] Furthermore, the hydraulic device is equipped with a hydraulic plate, which is adapted to the placement groove of the processing table disposed on the upper plate.

[0018] The present invention also provides a chip mounting method, using the chip mounting apparatus with controllable semiconductor tilt angle described in any one of the above claims, the steps of which are:

[0019] S1: Place the semiconductor wafer or chip into the placement slot on the upper plate of the chip mounting mechanism and fix it in place;

[0020] S2: Adjust the angle of the semiconductor wafer according to the requirements, and calculate the required height difference of the upper plate through trigonometric functions; adjust the height difference of the two micrometers, and then adjust the angle of the upper plate through the fixing and adjusting structure so that the two ends of the upper plate are in close contact with the upper measuring points of the two micrometers;

[0021] S3: Inject molten resin into the placement tank and drive the hydraulic plate of the hydraulic device to slowly descend until it contacts the molten resin, so that the upper end of the resin remains horizontal. After the resin is completely solidified, a resin block with semiconductor wafers with the required tilt angle can be obtained, and the upper end of the resin block is a horizontal surface and the lower end is an inclined surface.

[0022] S4: Invert the resin block and place it into another processing mold. At this time, the resin block becomes horizontal at the bottom and tilted at the top, and the semiconductor wafer is exposed at the tilted end of the resin block. Then pour resin into the mold. Stop adding resin when the newly added molten resin completely covers the semiconductor wafer and make the top of the resin block horizontal.

[0023] S5: Remove the excess resin block to obtain a resin block of a semiconductor wafer with an inclined angle, and fix it on a polishing machine for polishing.

[0024] Beneficial effects:

[0025] In this invention, the semiconductor tilt-controllable chip mounting device uses a double crank mechanism as an adjustment mechanism. This mechanism has a quick-return characteristic and can be quickly adjusted to the required tilt angle. It has a simple and stable structure, high operability and maintainability, and can achieve extremely high precision under the action of a micrometer, thus achieving a unity of accuracy, operability and maintainability. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a semiconductor tilt-controllable chip mounting device according to an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the mounting device and fixing and adjusting device of a semiconductor tilt-controllable chip mounting processing apparatus according to an embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the processing flow of a semiconductor tilt-controllable chip mounting device according to an embodiment of the present invention;

[0029] Icons: Base plate 1, Lower plate 2, Upper plate 3, First rod 4, Second rod 5, Third rod 6, Fourth rod 7, Fifth rod 8, Sixth rod 9, Hydraulic plate 10, Inverted L-shaped bracket 11, Hydraulic device 12, First micrometer 13, Second micrometer 14, Slide rail 15, Slider 16, Placement slot 17. Detailed Implementation

[0030] Example

[0031] Combination Figures 1 to 2 As shown, this embodiment provides a semiconductor tilt-controllable chip mounting apparatus, including a base plate 1, and further including: a chip mounting mechanism, a hydraulic mechanism, a measuring mechanism, and a fixing and adjusting mechanism. The chip mounting mechanism is fixedly mounted on the base plate 1. The chip mounting structure includes a lower plate 2 and an upper plate 3 fixed above the base plate 1. A double-crank mechanism is provided between the lower plate 2 and the upper plate 3, and the upper plate 3 is provided with a mounting table suitable for placement. The fixing and adjusting mechanism is located on the lower plate 2 and connected to the double-crank mechanism, configured to adjust the swing of the double-crank mechanism to control the tilt angle of the upper plate 3. The measuring mechanism is configured to measure the height difference between the two sides of the upper plate 3 to cooperate with the fixing and adjusting mechanism to adjust the tilt angle of the upper plate 3. The hydraulic mechanism is located above the mounting table and configured to move up and down above the mounting table.

[0032] In this embodiment, the base plate 1 is used to place and fix it on a plane or processing platform. The base plate 1 and the patch mechanism are fixed by support columns, so that the patch mechanism is at a certain height from the base plate 1. The upper surface of the lower plate 2 is provided with four hinge ends arranged in a square. The lower surface of the upper plate 3 is also provided with hinge ends, which are also arranged in a square. Here, the distance between the hinge ends of the upper plate 3 can be set to be smaller than the distance between the hinge ends of the lower plate. The double crank mechanism includes a first rod 4, a second rod 5, a third rod 6, and a fourth rod 7, which are hinged to the upper plate 3 and the lower plate 2 and arranged in a square array. The first rod 4 and the second rod 5 constitute a first double crank mechanism, and the third rod 6 and the fourth rod 7 constitute a second double crank mechanism. A fifth rod 8 is fixedly connected between the first rod 4 and the third rod 6. Here, the first rod 4, the second rod 5, the third rod 6, and the fourth rod 7 are all hinged at both ends to the hinge ends of the upper plate 3 and the lower plate 2, thus forming two sets of double-crank mechanisms. The double-crank mechanism can swing around the hinge end, thereby changing the tilt angle of the upper plate 3. In other embodiments, the rotation amplitude of the double-crank mechanism can be set to be less than or equal to 14°. The rotation angle can be limited by setting a limiting device at the hinge end. The fixing and adjusting mechanism includes a slide rail 15 fixed on the lower plate 2. A slidable slider 16 is provided on the slide rail 15, and a sixth rod 9 is hinged to the slider 16. The sixth rod 9 connects the slider 16 and the fifth rod 8. The double-crank mechanism is driven to swing by sliding the slider 16 on the fixing and adjusting mechanism to change the tilt angle of the upper plate 3. The double-crank mechanism can achieve rapid rotation and has a quick-return characteristic, which can be quickly adjusted to the required tilt angle. The slide rail 15 and slider 16 mechanism can greatly shorten the working distance and is simple and reliable to operate. In this embodiment, the processing table is provided with a placement groove 17 for placing semiconductor wafers to be processed, and the upper surface of the placement groove 17 is further provided as an inclined surface.

[0033] In some embodiments, taking a first double-crank mechanism as an example, in the same double-crank mechanism, the distance between the two hinge ends of the upper plate 3 is defined as a1, and the distance between the two hinge ends of the lower plate 2 is defined as a2. Then a1, a2, the first link 4, and the second link 5 form a quadrilateral. This quadrilateral satisfies the following conditions: if the side length of the quadrilateral is satisfied, the side opposite the shortest side is a2; or if the side length is not satisfied, the sum of the shortest side and the longest side is greater than the sum of the other two sides. This setting makes the rotation of the double-crank mechanism more stable.

[0034] The measuring mechanism includes two micrometers, defined as a first micrometer 13 and a second micrometer 14, distributed on both sides of the upper plate 3 and the lower plate 2. Specifically, the other micrometer is fixed above the upper plate 3 by a fixing member, with its lower measuring point abutting against the lower plate 2. It is configured to measure the height difference between two opposite short sides of the upper plate 3. The fixing member can be fixedly mounted on the base plate 1, and the micrometer can be fixed to the fixing member, such that its lower measuring point abuts against the lower plane of the lower plate 2, and its upper measuring point is suspended above the upper plate 3. The upper plate 3 can be rectangular, having a long side and a short side. The upper measuring point is located directly above the upper plate 3, near the midpoint of the two short sides. The two micrometers can respectively measure the height difference between the two short sides of the upper plate 3, with an accuracy of up to one-thousandth of a millimeter, resulting in high measurement precision.

[0035] The hydraulic mechanism includes an inverted L-shaped bracket 11 and a hydraulic device 12, which is suspended above the processing table via the inverted L-shaped bracket 11. Here, the hydraulic device 12 is equipped with a hydraulic plate 10, which is adapted to the placement slot 17 of the processing table on the upper plate 3. When the hydraulic device 12 is working, the hydraulic plate 10 slowly descends and remains horizontal. The hydraulic plate 10 pauses when it approaches the resin on the patch, ensuring the resin has a horizontal upper surface until it completely solidifies. Using a hydraulic press provides stable operation and improves the overall accuracy of the patch application.

[0036] Combination Figure 3 As shown, another embodiment of the present invention also provides a chip mounting method, which uses the above-described semiconductor tilt-controllable chip mounting apparatus, and the steps are as follows:

[0037] S1: Place the semiconductor wafer or chip in the placement slot 17 of the upper plate 3 of the chip mounting mechanism and fix it slightly;

[0038] S2: Adjust the angle of the semiconductor wafer according to the requirements, and calculate the required height difference of the upper plate 3, i.e. the tilt angle, through trigonometric functions. Then, first adjust the height difference of the two micrometers, and then adjust the angle of the upper plate 3 through the fixing and adjusting structure so that the two ends of the upper plate 3 are in close contact with the upper measuring points of the two micrometers.

[0039] S3: Molten resin is injected into the placement groove 17 of the processing table of the upper plate 3, and the hydraulic plate 10 of the hydraulic device 12 is driven to slowly descend until it contacts the molten resin. The current position is kept unchanged so that the upper end of the resin remains horizontal. After the resin is completely solidified, a resin block with semiconductor wafers with the required tilt angle can be obtained. The upper end of the resin block is horizontal and the lower end is inclined.

[0040] S4: Invert the resin block and place it into another processing mold. At this time, the resin block becomes horizontal at the bottom and tilted at the top, and the semiconductor wafer is exposed at the tilted end of the resin block. Then pour resin into the mold. Stop adding resin when the newly added molten resin completely covers the semiconductor wafer and make the top of the resin block horizontal.

[0041] S5: Remove the excess resin block to obtain a semiconductor wafer with an inclined angle; fix the resin block with the semiconductor wafer on a polishing machine for polishing, and the entire process is completed.

[0042] The embodiments of the present invention have the following advantages:

[0043] Firstly, by setting up the interaction between the placement mechanism, hydraulic mechanism, measuring mechanism, and fixing and adjusting mechanism, the tilt angle of the semiconductor wafer can be precisely controlled, and the operation process is simplified, improving the quality and efficiency of placement.

[0044] Secondly, the hydraulic device 12 is suspended above the chip placement mechanism during chip placement and does not directly contact the semiconductor wafer. Therefore, the chip placement mechanism is not affected by the stress of the hydraulic mechanism, which greatly improves the overall stability of the device.

[0045] Third, the measurement mechanism provides high-precision data, up to one-thousandth of a millimeter, and the measured physical quantities are differential values, unaffected by errors in a single direction, resulting in small errors.

[0046] Fourth, the fixing and adjusting device can easily and efficiently adjust the tilt angle of the semiconductor wafer, and its structure is simple, easy to operate and maintain;

[0047] Fifth, the patch processing device is equipped with a double crank mechanism, which has a quick-return characteristic and can be quickly adjusted to the required tilt angle; the structure is simple and stable, with high operability and maintainability; and it achieves extremely high precision under the action of the micrometer, realizing the unity of accuracy, operability and maintainability.

[0048] It should be understood that the above are merely preferred embodiments of the present invention, and the scope of protection of the present invention is not limited to the above embodiments. All technical solutions that fall within the scope of the present invention are within the scope of protection of the present invention.

[0049] The accompanying drawings used in the above description of the embodiments only illustrate certain embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

Claims

1. A semiconductor tilt-controllable surface mount processing apparatus, comprising a base plate, characterized in that, Also includes: The components include a placement mechanism, a hydraulic mechanism, a measuring mechanism, and a fixing and adjusting mechanism. A patching mechanism is fixedly installed on the base plate. The patching mechanism includes a lower plate and an upper plate fixed above the base plate. A double crank mechanism is provided between the lower plate and the upper plate, and the upper plate is provided with a suitable place for a patching processing table. The fixing and adjusting mechanism is disposed on the lower plate and connected to the double crank mechanism, and is configured to adjust the swing of the double crank mechanism to control the tilt angle of the upper plate. The measuring mechanism is configured to measure the height difference between the two sides of the upper plate, so as to cooperate with the fixing and adjusting mechanism to adjust the tilt angle of the upper plate; The hydraulic mechanism is positioned above the processing table and is configured to move up and down above the processing table. The double-crank mechanism includes a first, second, third, and fourth rod, hinged to the upper and lower plates and arranged in a square array. The first and second rods form a first double-crank mechanism, and the third and fourth rods form a second double-crank mechanism. A fifth rod is fixedly connected between the first and third rods. The rotation amplitude of the double-crank mechanism is less than or equal to 14°. The processing table has a placement groove, the upper surface of which is inclined. The fixing and adjusting mechanism includes a slide rail fixed to the lower plate, a slidable slider mounted on the slide rail, and a sixth rod hinged to the slider, connecting the slider and the fifth rod.

2. The semiconductor tilt-controllable chip mounting apparatus according to claim 1, characterized in that, The measuring mechanism includes two micrometers, which are fixed above the upper plate by fasteners, with their lower measuring points pressed against the lower plate. The mechanism is configured to measure the height difference between two opposite short sides of the upper plate.

3. The semiconductor tilt-controllable chip mounting apparatus according to claim 1, characterized in that, The hydraulic mechanism includes an inverted L-shaped bracket and a hydraulic device, which is suspended above the processing table via the inverted L-shaped bracket.

4. The semiconductor tilt-controllable chip mounting apparatus according to claim 3, characterized in that, The hydraulic device is equipped with a hydraulic plate, which is adapted to the placement slot of the processing table on the upper plate.

5. A surface mount technology (SMT) processing method, characterized in that, Using the semiconductor tilt-controllable chip mounting apparatus according to any one of claims 1-4, The steps are as follows: S1: Place the semiconductor wafer or chip into the placement slot on the upper plate of the chip mounting mechanism and fix it in place; S2: Adjust the angle of the semiconductor wafer according to the requirements, and calculate the required height difference of the upper plate through trigonometric functions; adjust the height difference of the two micrometers, and then adjust the angle of the upper plate through the fixing and adjusting structure so that the two ends of the upper plate are in close contact with the upper measuring points of the two micrometers; S3: Inject molten resin into the placement tank and drive the hydraulic plate of the hydraulic device to slowly descend until it contacts the molten resin, so that the upper end of the resin remains horizontal. After the resin is completely solidified, a resin block with semiconductor wafers with the required tilt angle can be obtained, and the upper end of the resin block is a horizontal surface and the lower end is an inclined surface. S4: Invert the resin block and place it into another processing mold. At this time, the resin block becomes horizontal at the bottom and tilted at the top, and the semiconductor wafer is exposed at the tilted end of the resin block. Then pour resin into the mold. Stop adding resin when the newly added molten resin completely covers the semiconductor wafer and make the top of the resin block horizontal. S5: Remove the excess resin block to obtain a resin block of a semiconductor wafer with an inclined angle, and fix it on a polishing machine for polishing.

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