A heat dissipation triode for TWS

Abstract

The application discloses a heat dissipation component for a triode of TWS, relates to the technical field of triode installation, and solves the problem of unstable installation of the triode and the heat dissipation fin, comprising a mounting plate and a triode body, support plates are fixed at both ends of the mounting plate, the triode body is inserted between the two support plates, further comprising a clamping assembly fixed on the mounting plate and a heat dissipation piece installed between the two support plates, the clamping assembly is used for clamping and limiting the triode body, the existing triode structure is optimized, the clamping assembly and the heat dissipation piece are designed, the triode can be accurately inserted into the jack on the circuit board when the triode is installed on the circuit board, the installation is more stable, the situation that the heat dissipation fin is loosened due to chip shaking is avoided, and the heat dissipation effect is better.

Description

Technical Field

[0001] This invention relates to the field of transistor mounting technology, specifically a heat dissipation transistor for TWS (True Wireless Stereo). Background Technology

[0002] TWS stands for True Wireless Stereo, meaning truly wireless stereo sound. TWS technology is based on Bluetooth chip technology. Its working principle involves the phone connecting to the main earphone, which then wirelessly connects to the secondary earphone, achieving true wireless separation of the left and right channels. Wireless earphones typically contain transistors (bipolar junction transistors, also known as transistors or crystal transistors), which are semiconductor devices that amplify weak signals into larger amplitude electrical signals; they are also used as contactless switches.

[0003] Currently, transistors are very important electronic components in large-scale integrated circuits. As semiconductor devices, transistors do not have a significant heat dissipation effect, so heat sinks are often added to their collectors. Traditional heat dissipation uses heat sinks to conduct heat, attaching the heat sinks to the outside of the transistor. However, the transistors in TWS wireless earphones are small, making it difficult for personnel to attach the heat sinks. After installation, the transistor is only limited by its pins. When the device is vibrated, the transistor will shake, causing the heat sinks to detach. To address this, we propose a heat dissipation transistor for TWS. Summary of the Invention

[0004] The purpose of this invention is to provide a heat dissipation transistor for TWS that can stably mount a transistor and a heat sink, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a heat dissipation transistor for TWS, comprising a mounting plate and a transistor body, wherein support plates are fixed at both ends of the mounting plate and the transistor body is inserted between the two support plates, and further comprising a clamping assembly fixed on the mounting plate and a heat dissipation component installed between the two support plates, wherein the clamping assembly is used to clamp and limit the transistor body.

[0006] Preferably, the clamping assembly includes two support rods distributed on the outer sides of the two support plates, and pull-down members are fixed to the outer sides of the two support rods. A connecting plate is sleeved on the outer side of each of the two support rods, and a connector is fixed to the outer end of the connecting plate. A clamping plate is fixed through the two connectors. A sliding opening is opened on each of the two support plates, and a sliding post adapted to the sliding opening is fixed to the outer side of the connecting plate. A connecting port that fits on the outer side of the support rod is opened on the connecting plate. The clamping assembly enables auxiliary installation of the transistor body.

[0007] Preferably, the connector includes a slide rod, the bottom of which is fixed to the connecting plate, and the outer side of which is slidably inserted into the clamping plate. A tension spring is sleeved on the outer side of the slide rod and fixed to the clamping plate and the connecting plate. A limit plate is fixed to the top of the slide rod. The designed connector enables the installation limit of the transistor.

[0008] Preferably, the pull-down component includes a fixing ring fixed to the outside of the support rod, a pull-down platform slidably sleeved on the outside of the support rod, and a tension spring is fixed between the pull-down platform and the fixing ring. The diameter of the pull-down platform is larger than the inner diameter of the connection port, and the inner diameter of the connection port is larger than the diameter of the fixing ring. The pull-down component provides a pull-down force to achieve stable limiting of the transistor.

[0009] Preferably, the heat sink includes a rectangular heat-conducting plate located between two support plates, and the rectangular heat-conducting plate has inclined openings on both sides. The outer end of the sliding column is slidably inserted into the inclined opening. Through the designed inclined opening, the sliding column can push the rectangular heat-conducting plate after it moves down, so that it fits more closely with the transistor.

[0010] Preferably, the clamping plate has an interface at each of the three pin positions at the bottom of the transistor body, and the clamping plate has a limiting block at both ends that is compatible with the two support plates. By connecting the interface with the socket on the circuit board, the installation of the mounting plate is more stable and the installation of the transistor is more convenient.

[0011] Preferably, both support plates have a limiting frame fixed at their bottom that fits against the outer side of the transistor body, and the limiting frame has heat dissipation holes to achieve stable installation of the transistor.

[0012] Preferably, both ends of the mounting plate have positioning holes for pin positioning, which facilitates limiting the position of the mounting plate.

[0013] Compared with the prior art, the beneficial effects of the present invention are: This invention optimizes the existing transistor structure and, through the design of a clamping component and heat sink, enables the transistor to be accurately inserted into the socket on the circuit board during installation. At the same time, the installation is more stable, avoiding chip vibration that could cause the heat sink to loosen, resulting in better heat dissipation. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the transistor mounted on the circuit board according to the present invention; Figure 2 This is a schematic diagram of the overall structure of the present invention; Figure 3 This is a schematic diagram of the structure of the present invention after removing the transistor body; Figure 4 for Figure 3 Enlarged view of point A in the middle; Figure 5 This is a partial cross-sectional view of the clamping component of the present invention; Figure 6 for Figure 5 Enlarged view of section B in the middle.

[0015] In the diagram: 1-Mounting plate; 2-Transistor body; 3-Support plate; 4-Clamping assembly; 5-Heat sink; 6-Support rod; 7-Pull-down piece; 8-Connecting plate; 9-Connector; 10-Clamping plate; 11-Sliding port; 12-Sliding column; 13-Connecting port; 14-Sliding rod; 15-Tension spring one; 16-Limiting plate; 17-Fixing ring; 18-Pull-down platform; 19-Tension spring two; 20-Rectangular heat-conducting plate; 21-Inclined opening; 22-Mating interface; 23-Limiting block; 24-Limiting frame; 25-Heat dissipation hole; 26-Positioning hole. Detailed Implementation

[0016] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] Example 1 Please see Figures 1-3 The diagram shows a heat dissipation transistor for TWS, including a mounting plate 1 and a transistor body 2. Both ends of the mounting plate 1 are fixed with support plates 3, and the transistor body 2 is inserted between the two support plates 3. It also includes a clamping assembly 4 fixed on the mounting plate 1 and a heat sink 5 installed between the two support plates 3. The clamping assembly 4 is used to clamp and limit the transistor body 2.

[0018] It should be noted that in this solution, the mounting plate 1 is pre-fixed to the circuit board, so that when installing the transistor, it can be stably inserted into the socket of the circuit board, making the installation of the transistor more convenient. It is worth noting that, in order to facilitate the installation of the mounting plate 1, positioning holes 26 for pin positioning are provided at both ends of the mounting plate 1.

[0019] Please see Figures 1-6 The clamping assembly 4 shown in the figure includes two support rods 6, which are distributed on the outside of two support plates 3. Pull-down pieces 7 are fixed on the outside of the two support rods 6. Connecting plates 8 are sleeved on the outside of the two support rods 6, and connecting pieces 9 are fixed on the outer ends of the connecting plates 8. Clamping plates 10 are fixed through the two connecting pieces 9. Sliding openings 11 are opened on the two support plates 3, and sliding columns 12 that are adapted to the sliding openings 11 are fixed on the outside of the connecting plates 8. Connecting ports 13 are opened on the outside of the support rods 6.

[0020] It should be noted that the downward pressure of the clamping plate 10 limits the position of the transistor body 2, thereby making its installation more stable.

[0021] Please see Figure 3 and Figure 4 The connector 9 shown in the figure includes a slide rod 14. The bottom of the slide rod 14 is fixed to the connecting plate 8, and the outer side of the slide rod 14 is slidably inserted into the clamping plate 10. A tension spring 15 is sleeved on the outer side of the slide rod 14 and fixed to the clamping plate 10 and the connecting plate 8. A limit plate 16 is fixed to the top of the slide rod 14. It should be noted that the sliding rod 14 and the tension spring 15 are designed to cooperate with each other to achieve the downward pressure on the clamping plate 10, thereby achieving stable positioning of the transistor body 2.

[0022] Please see Figures 3-6 The pull-down component 7 shown in the figure includes a fixing ring 17 fixed to the outside of the support rod 6, a pull-down platform 18 slidably sleeved on the outside of the support rod 6, and a tension spring 19 fixed between the pull-down platform 18 and the fixing ring 17. The diameter of the pull-down platform 18 is larger than the inner diameter of the connection port 13, and the inner diameter of the connection port 13 is larger than the diameter of the fixing ring 17. It should be noted that: under the action of tension spring 19, the pull-down table 18 is pressed down, thereby pressing down the connecting plate 8 and the sliding column 12.

[0023] Additionally, please see Figure 2 and Figure 6 The heat sink 5 shown in the figure includes a rectangular heat-conducting plate 20, which is located between two support plates 3. The rectangular heat-conducting plate 20 has inclined openings 21 on both sides, and the outer end of the sliding column 12 is slidably inserted into the inclined openings 21. It should be noted that the rectangular heat-conducting plate 20 is located between the two support plates 3 and is connected to the sliding column 12 through the inclined opening 21. This allows the rectangular heat-conducting plate 20 to be driven to adhere to the transistor body 2 when the sliding column 12 moves down, making the fit tighter and preventing the two from separating and affecting heat dissipation.

[0024] The principle of stable installation of transistors is as follows: First, the operator places the mounting plate 1 on the circuit board and then limits the mounting plate 1 with pins. Next, the operator moves the clamping plate 10 upward to the highest position and places the transistor body 2 between the two support plates 3. Then, the operator moves the transistor body 2 downward so that its pins are inserted into the circuit board. Then, the clamping plate 10 is pulled down by the tension spring 15 to press down on the transistor body 2, thus achieving a stable clamping effect. Similarly, under the action of the tension spring 19, the sliding column 12 will move within the inclined opening 21, thereby driving the rectangular heat-conducting plate 20 forward to fit more closely to the outside of the transistor body 2, making the heat dissipation effect of the transistor better. When the circuit board is subjected to vibration, the designed tension springs 15 and 19 enable the rectangular heat-conducting plate 20 to adhere to the transistor body 2, preventing them from separating and thus improving the heat dissipation effect.

[0025] Example 2 Please see Figure 3 and Figure 4 This embodiment further illustrates Example 1. The clamping plate 10 in the figure has a connection interface 22 at the three pin positions at the bottom of the transistor body 2, and the clamping plate 10 has a limiting block 23 at both ends that is adapted to the two support plates 3.

[0026] It should be noted that the design of the limiting block 23 makes the clamping plate 10 more stable when it moves downward, and also makes the downward pressure limiting of the transistor body 2 more stable. It is worth noting that the interface 22 on the clamping plate 10 can position the socket on the circuit board. During positioning, the operator first places the mounting plate 1 on the circuit board. Since the connecting plate 8 has a connection port 13 that can pass through the fixing ring 17, the connecting plate 8 can be moved down onto the mounting plate 1. Then, the clamping plate 10 is moved to the surface of the mounting plate 1. At this time, the operator can use the transistor body 2 to insert its pins into the interface 22 and then through the socket on the circuit board. After that, the operator can use bolts to limit the mounting plate 1, making the installation of the transistor more precise.

[0027] Example 3 Please see Figure 3This embodiment further illustrates other embodiments. The bottom of the two support plates 3 in the figure is fixed with a limiting frame 24 that fits against the outside of the transistor body 2, and the limiting frame 24 has a heat dissipation hole 25.

[0028] It should be noted that the added limiting frame 24 can wrap around the bottom of the transistor body 2, making the installation of the transistor body 2 more stable. At the same time, the designed heat dissipation hole 25 makes the heat dissipation of the transistor better.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0030] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation component for a transistor used in TWS (True Wireless Stereo), comprising: The mounting plate (1) and the transistor body (2) are provided. Both ends of the mounting plate (1) are fixed with support plates (3), and the transistor body (2) is inserted between the two support plates (3). Its characteristic is that it further includes: A clamping assembly (4) is fixed on the mounting plate (1), the clamping assembly (4) being used to clamp and limit the transistor body (2); Heat sink (5) installed between the two support plates (3); The clamping assembly (4) includes two support rods (6), which are distributed on the outside of the two support plates (3). Pull-down pieces (7) are fixed on the outside of the two support rods (6). A connecting plate (8) is sleeved on the outside of each of the two support rods (6). A connector (9) is fixed at the outer end of the connecting plate (8), and a clamping plate (10) is fixed through the two connectors (9). A sliding opening (11) is opened on each of the two support plates (3), and a sliding column (12) that matches the sliding opening (11) is fixed on the outside of the connecting plate (8). A connecting port (13) is opened on the connecting plate (8) and sleeved on the outside of the support rods (6). The connector (9) includes a slide rod (14), the bottom of which is fixed to the connecting plate (8), and the outer side of which is slidably inserted into the clamping plate (10). A tension spring (15) is sleeved on the outer side of the slide rod (14) and fixed to the clamping plate (10) and the connecting plate (8). A limit plate (16) is fixed at the top of the slide rod (14). The pull-down component (7) includes a fixing ring (17) fixed to the outside of the support rod (6), a pull-down platform (18) is slidably sleeved on the outside of the support rod (6), and a tension spring (19) is fixed between the pull-down platform (18) and the fixing ring (17). The diameter of the pull-down platform (18) is larger than the inner diameter of the connection port (13), and the inner diameter of the connection port (13) is larger than the diameter of the fixing ring (17). The heat dissipation component (5) includes a rectangular heat-conducting plate (20), which is located between two support plates (3), and the rectangular heat-conducting plate (20) has inclined openings (21) on both sides. The outer end of the sliding column (12) is slidably inserted into the inclined openings (21).

2. The heat dissipation component for a transistor used in TWS according to claim 1, characterized in that: The clamping plate (10) has a connection interface (22) at the three pin positions at the bottom of the transistor body (2), and the clamping plate (10) has a limiting block (23) at both ends that is compatible with the two support plates (3).

3. A heat dissipation component for a transistor used in TWS according to claim 1, characterized in that: Both of the support plates (3) have a limiting frame (24) fixed at the bottom that fits against the outside of the transistor body (2), and the limiting frame (24) has a heat dissipation hole (25).

4. A heat dissipation component for a transistor used in TWS according to claim 1, characterized in that: The mounting plate (1) has positioning holes (26) at both ends for pin positioning.

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