A low power microencapsulated diode

Abstract

The application discloses a low-power-consumption micro-encapsulated diode, relates to the diode mounting technical field, and solves the problem of large bending error of a pin, comprising a PN junction and two pins, the two pins are respectively arranged at two ends of the PN junction, further comprising a butt joint sleeve sleeved outside the PN junction and a bending auxiliary assembly arranged outside the PN junction, rotating grooves are formed at two ends of the butt joint sleeve, and a moving groove is formed at the outside of the butt joint sleeve and is communicated with the two rotating grooves, and the bending auxiliary assembly is used for assisting the pin bending, the cam sleeve can be positioned at the pin jack position to assist the personnel in bending the pin at the accurate position, the phenomenon that the whole pin is too long or too short after bending is avoided, and the installation of the diode is more convenient.

Description

Technical Field

[0001] This invention relates to the field of diode mounting technology, specifically to a low-power miniature packaged diode. Background Technology

[0002] A diode is an electronic device made of semiconductor materials (silicon, selenium, germanium, etc.). It exhibits unidirectional conductivity; that is, when a forward voltage is applied to the anode and cathode, the diode conducts. When a reverse voltage is applied to the anode and cathode, the diode is cut off. Therefore, the conduction and cutoff of a diode are equivalent to the switching on and off of a switch.

[0003] Currently, common diodes on the market typically consist of a PN junction and two leads. When mounting them on a circuit board, personnel usually bend the two leads to insert them into the circuit board, then spot weld them on the back of the circuit board, and finally trim any excessively long leads. However, during the installation process, it is difficult for personnel to control the spacing when manually bending the leads, resulting in the leads being either too long or too short after bending, requiring them to be straightened and bent again. The installation process requires a high level of skill from the personnel. Therefore, we propose a low-power micro-packaged diode. Summary of the Invention

[0004] The purpose of this invention is to provide a low-power micro-packaged diode that can be bent precisely to avoid excessively long or short leads after bending, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a low-power micro-packaged diode, comprising a PN junction and two pins, the two pins being respectively mounted at both ends of the PN junction, and further comprising a mating sleeve fitted over the outside of the PN junction and a bending auxiliary component mounted over the outside of the PN junction, wherein both ends of the mating sleeve have rotating grooves, and the outside of the mating sleeve has a moving groove communicating with the two rotating grooves, and the bending auxiliary component is used to assist in bending the pins.

[0006] Preferably, the bending auxiliary component includes two cam sleeves, a connecting rod is fixed between the two cam sleeves, and a snap-fit ​​component that is slidably connected to the moving groove is installed inside the two cam sleeves. The bottom end of the two rotating grooves has a groove that matches the snap-fit ​​component. By moving the two cam sleeves, the position of the insertion hole can be predicted, and then the operator can easily perform the bending process.

[0007] Preferably, the mating sleeve has multiple through holes for heat dissipation, which helps to dissipate heat and prevent high temperatures from being difficult to dissipate.

[0008] Preferably, the cam sleeve has a notch at its protruding end, and the snap-fit ​​component passes through the notch. The cam sleeve has a chamfered opening on its outer side. The notch design facilitates the snap-fit ​​component, while the chamfered opening makes it easier to bend the pin.

[0009] Preferably, the snap-fit ​​component includes a snap-fit ​​post, which slides through the cam sleeve and is inserted into the recess. A limiting plate is fixed to the outer side of a section of the recess, and a receiving groove is formed in the recess corresponding to the position of the snap-fit ​​post. A compression spring is fitted on the outer side of the snap-fit ​​post, which abuts against the limiting plate and the inner wall of the receiving groove. The snap-fit ​​component achieves snap-fit ​​and limiting within the rotating groove, preventing accidental displacement.

[0010] Preferably, both ends of the snap-fit ​​post are spherical structures and both ends of the snap-fit ​​post are made of rubber material. By designing the spherical structure, it is easy to remove the mating sleeve, and at the same time, the rubber material can better protect the circuit board and avoid damage.

[0011] Preferably, the outer side of the cam sleeve has a pressing groove, and the pressing groove has a pushing groove. A pushing inclined plate is slidably inserted into the pushing groove, and the outer side of the locking post has an inclined groove that matches the pushing inclined plate. By matching the pushing inclined plate with the inclined groove, the locking post can be assisted to move outward, making it more convenient to move outward to assist the bending of the sleeve.

[0012] Preferably, the width of the moving groove and the width of the rotating groove are the same as the diameter of the locking post, so that the movement on the moving groove and the rotating groove is smoother.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] This invention, through the design of a bending auxiliary component, enables personnel to move the cam sleeve to the pin socket position for positioning when bending the pin, assisting personnel in performing accurate bending and avoiding the overall pin becoming too long or too short after bending, thus making the installation of diodes more convenient. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the diode structure of the present invention;

[0016] Figure 2 This is a schematic diagram of the overall structure of the present invention after it is installed on a diode;

[0017] Figure 3 This is a schematic diagram of the docking sleeve structure of the present invention;

[0018] Figure 4 This is a schematic diagram of the bending auxiliary component structure of the present invention;

[0019] Figure 5 This is a partial cross-sectional view of the cam sleeve structure of the present invention;

[0020] Figure 6 This is a schematic diagram of the snap-fit ​​structure of the present invention;

[0021] Figure 7 This is a schematic diagram showing the positional relationship between the push plate and the inclined groove of the present invention.

[0022] In the diagram: 1-PN junction; 2-pin; 3-connecting sleeve; 4-rotating groove; 5-moving groove; 6-bending auxiliary component; 7-cam sleeve; 8-connecting rod; 9-clamping component; 10-groove; 11-through hole; 12-notch; 13-clamping post; 14-limiting plate; 15-storage groove; 16-compression spring; 17-pressing groove; 18-pushing groove; 19-pushing ramp; 20-sloping groove. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Example 1

[0025] Please see Figures 1-3 The diagram shows a low-power micro-packaged diode, including a PN junction 1 and two pins 2, which are respectively mounted at both ends of the PN junction 1. It also includes a mating sleeve 3 that is sleeved on the outside of the PN junction 1 and a bending auxiliary component 6 that is mounted on the outside of the PN junction 1. Both ends of the mating sleeve 3 have rotating grooves 4, and the outside of the mating sleeve 3 has a moving groove 5 that communicates with the two rotating grooves 4. The bending auxiliary component 6 is used to assist in bending the pins 2.

[0026] It should be noted that in this solution, the outer sleeve 3 is located on the outside of the PN junction 1, which can provide protection for the PN junction 1. At the same time, multiple through holes 11 for heat dissipation are opened inside the sleeve 3 to avoid the problem of heat dissipation difficulties at high temperatures.

[0027] Please see Figures 4-6 The bending auxiliary component 6 shown in the figure includes two cam sleeves 7, a connecting rod 8 is fixed between the two cam sleeves 7, and a snap-fit ​​piece 9 is installed in the two cam sleeves 7 that is slidably connected to the moving groove 5. The bottom of the two rotating grooves 4 has a groove 10 that is adapted to the snap-fit ​​piece 9.

[0028] It should be noted that: by fixing the two cam sleeves 7 and the connecting rod 8 together, the cam sleeve 7 is moved so that one cam sleeve 7 moves to the position of the socket, so that the personnel can measure the bending position of the diode pin 2 by moving the cam sleeve 7, thereby assisting in bending.

[0029] Please see Figure 4 and Figure 5 The cam sleeve 7 shown in the figure has a notch 12 at its protruding end, and the snap-fit ​​part 9 passes through the notch 12. The cam sleeve 7 has a chamfered opening on its outer side.

[0030] It should be noted that the designed notch 12 can play an adjustment role, so that the cam sleeve 7 can undergo a certain indentation deformation when it is squeezed.

[0031] Please see Figures 5-7 The snap-fit ​​component 9 shown in the figure includes a snap-fit ​​post 13, which slides through the cam sleeve 7 and is inserted into the recess 12. A limiting plate 14 is fixed on the outer side of a section of the snap-fit ​​post 13, and a storage groove 15 is opened at the position of the snap-fit ​​post 13 in the recess 12. A compression spring 16 is sleeved on the outer side of the snap-fit ​​post 13, which abuts against the inner wall of the limiting plate 14 and the storage groove 15.

[0032] It should be noted that: under the action of the compression spring 16, the push locking post 13 moves outward, thereby enabling the locking post 13 to move stably within the rotating groove 4 and the moving groove 5.

[0033] The principle of bending auxiliary pin 2: First, the operator puts the mating sleeve 3 on the outside of the PN junction 1. Alternatively, the mating sleeve 3 can be directly installed on the PN junction 1 during diode production. Conventional existing equipment can handle this. When installing the diode, the operator locates the positive and negative terminals and the insertion position. Then, the operator puts on the cam sleeve 7, so that the two cam sleeves 7 are located in the two rotating slots 4 respectively. When the operator starts bending, one cam sleeve 7 is moved, causing the locking post 13 to be squeezed outward and then disengaged from the rotating slot 4. The other cam sleeve 7 moves along the moving slot 5. After moving to the designated position, the operator uses a tool to pinch one end of pin 2 and then bends it. During bending, the bent part is kept against the outside of the cam sleeve 7. The same method is used to bend the other pin 2, thereby achieving precise length bending of the diode pin 2. This also ensures that when pin 2 is inserted into the socket, the pin 2 wire on the circuit board will not be too long or too short, making installation more convenient.

[0034] It should be noted that after the pin 2 is bent, the operator inserts it into the circuit board and then solders the overly long end of pin 2. If pin 2 on the circuit board is too long and becomes loose, the operator can rotate the cam sleeve 7 so that the protruding end of the cam sleeve 7 is aligned with the circuit board, thereby lifting the diode and thus playing a certain role in winding up the wire. It also allows the diode to maintain a certain distance from the circuit board, resulting in better heat dissipation.

[0035] Example 2

[0036] Please see Figure 6 and Figure 7 This embodiment further illustrates Example 1. The cam sleeve 7 in the figure has a pressing groove 17 on its outer side, and a pushing groove 18 is opened in the pressing groove 17. A pushing inclined plate 19 is slidably inserted in the pushing groove 18, and a sloping groove 20 adapted to the pushing inclined plate 19 is opened on the outer side of the locking post 13.

[0037] It should be noted that: by the cooperation of the designed push plate 19 and the opened inclined groove 20, when the personnel need to move the cam sleeve 7 out and into the rotating groove 4, they can pinch the push plate 19 and squeeze the inclined groove 20, thereby assisting the rise of the locking column 13, making the movement out and into the rotating groove 4 smoother.

[0038] Example 3

[0039] Please see Figure 3 , Figure 6 and Figure 7 This embodiment further illustrates other embodiments. The width of the moving groove 5 and the width of the rotating groove 4 in the figure are the same as the diameter of the snap-fit ​​post 13. Both ends of the snap-fit ​​post 13 are designed to be spherical structures and are made of rubber material.

[0040] It should be noted that the spherical structure design allows for smoother movement within the rotating groove 4 and the moving groove 5. The diameter of the locking post 13 is consistent with the width of the moving groove 5 and the width of the rotating groove 4, making the movement more stable. The rubber material allows for slight contraction while avoiding damage to the circuit board.

[0041] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0042] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A low-power miniature packaged diode, comprising: A PN junction (1) and two pins (2), wherein the two pins (2) are respectively mounted at both ends of the PN junction (1); Its characteristic is that it further includes: A mating sleeve (3) is fitted on the outside of the PN junction (1). Both ends of the mating sleeve (3) have rotating grooves (4), and the outside of the mating sleeve (3) has a moving groove (5) that communicates with the two rotating grooves (4). A bending aid component (6) is installed on the outside of the PN junction (1), the bending aid component (6) is used to assist the bending of the pin (2); The bending auxiliary component (6) includes two cam sleeves (7), a connecting rod (8) is fixed between the two cam sleeves (7), and a snap-fit ​​piece (9) that is slidably connected to the moving groove (5) is installed in the two cam sleeves (7), and a groove (10) that is adapted to the snap-fit ​​piece (9) is opened at the bottom of the two rotating grooves (4). The mating sleeve (3) has multiple through holes (11) for heat dissipation.

2. The low-power micro-packaged diode according to claim 1, characterized in that: The cam sleeve (7) has a notch (12) at its protruding end, and the snap fastener (9) passes through the notch (12). The cam sleeve (7) has a chamfered opening on its outer side.

3. A low-power micro-packaged diode according to claim 2, characterized in that: The snap-fit ​​component (9) includes a snap-fit ​​post (13), which slides through the cam sleeve (7) and is inserted into the recess (12). A limiting plate (14) is fixed on the outer side of a section of the recess (12), and a storage groove (15) is opened at the position of the recess (12) corresponding to the snap-fit ​​post (13). A compression spring (16) is sleeved on the outer side of the snap-fit ​​post (13) and abuts against the inner wall of the limiting plate (14) and the storage groove (15).

4. A low-power micro-packaged diode according to claim 3, characterized in that: Both ends of the snap-fit ​​post (13) are spherical structures, and both ends of the snap-fit ​​post (13) are made of rubber material.

5. A low-power micro-packaged diode according to claim 4, characterized in that: The cam sleeve (7) has a pressing groove (17) on its outer side, and a pushing groove (18) is opened in the pressing groove (17). A pushing inclined plate (19) is slidably inserted in the pushing groove (18), and a sloping groove (20) adapted to the pushing inclined plate (19) is opened on the outer side of the snap-fit ​​post (13).

6. A low-power micro-packaged diode according to claim 5, characterized in that: The width of the moving groove (5) and the width of the rotating groove (4) are the same as the diameter of the snap-fit ​​post (13).

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