Multi-channel power supply box for spatial imaging spectrometer

Abstract

The application discloses a kind of space imaging spectrometer multi-channel power supply electric box, it includes: multiple power supply board frame, top frame, bottom frame and multiple middle frame, multiple power supply board frame is installed on heat dissipation substrate in parallel;The top frame is set to one side of multiple power supply board frame as a whole;The bottom frame is set to the other side of multiple power supply board frame as a whole;Each middle frame is set between two adjacent power supply board frames;The side of each power supply board frame is equipped with power supply board, multiple high-power components are installed on the power supply board, the pin of multiple high-power components is connected with via hole on power supply board, the heat dissipation reinforcing plate is installed on each high-power component, the both ends of heat dissipation reinforcing plate and power supply board are connected by screw, and the screw also passes through power supply board frame and is connected with nut.The application uses independent single machine structure, to improve the heat dissipation capacity of high-power component, solve the problem of occupying too many on-board resources.

Description

Technical Field

[0001] This invention relates to the field of space imaging spectrometer technology, and in particular to a multi-channel power supply box for a space imaging spectrometer. Background Technology

[0002] Space imaging spectrometers have garnered widespread attention due to their ability to image within specific spectral bands. In particular, multi-channel imaging spectrometers have become a hot topic in Earth observation research, capable of observing the same target in different spectral bands and providing crucial data for meteorology, disaster prevention, and other fields. Multi-channel imaging spectrometers require spectral dispersion using devices such as gratings and prisms, followed by the conversion of optical signals into electrical signals at the focal plane of each channel using detectors, thus completing the detection process. Traditional designs connect the power board and detector control board via board-to-board connectors, fixing them within the same housing and enclosed space. This necessitates comprehensive heat dissipation for high-power components such as detectors and DC / DC converters. When the detector power is high, especially when cooling is required, excessive power consumption for heat dissipation consumes significant onboard resources.

[0003] Therefore, those skilled in the art have provided a multi-channel power supply box for a space imaging spectrometer to solve the problems mentioned in the background art. Summary of the Invention

[0004] This invention provides a standalone, single-unit structure for a multi-channel power supply box for a space imaging spectrometer, designed to improve the heat dissipation of high-power components and solve the problem of excessive on-board resource consumption.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A multi-channel power supply box for a space imaging spectrometer includes:

[0007] Multiple power board frames are mounted in parallel on a heat dissipation substrate.

[0008] A top frame, wherein the top frame is disposed on one side of the plurality of power board frames as a whole;

[0009] A bottom frame is located on the other side of the overall power board frame;

[0010] Multiple middle frames, each of which is disposed between two adjacent power board frames;

[0011] A power board is mounted on one side of each power board frame. Multiple high-power components are mounted on the power board. The pins of the multiple high-power components are connected to vias on the power board. A heat dissipation reinforcement plate is mounted on each high-power component. The two ends of the heat dissipation reinforcement plate are connected to the power board by screws. The screws also pass through the power board frame and are connected to nuts.

[0012] Furthermore, the power board frame is fitted with the adjacent top frame, bottom frame and middle frame through a stop joint.

[0013] Furthermore, an indium sheet is deposited on the heat dissipation substrate.

[0014] Furthermore, the thickness of the indium sheet is 0.1 mm.

[0015] Furthermore, multiple high-power components are located on the same side of the power board.

[0016] Furthermore, an insulating thermal pad is provided between each of the high-power components and the power board.

[0017] Furthermore, the thickness of the insulating thermal pad is 0.2 mm.

[0018] Furthermore, an insulating sleeve is installed on the outside of the nut.

[0019] Furthermore, the insulating sleeve is made of polyimide.

[0020] In the above technical solution, the multi-channel power supply box for a space imaging spectrometer provided by the present invention has the following beneficial effects: The overall design of this application is more independent, facilitating assembly, adjustment, and testing. Each power board is separated by a top frame, bottom frame, and middle frame, forming an integrated structure. This provides sufficient heat dissipation for high-power components, avoids occupying excessive satellite heat resources, and allows more satellite heat resources to be allocated to the payload, thereby improving the overall satellite thermal efficiency. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0022] Figure 1 This is a schematic diagram of the structure of a multi-channel power supply box for a space imaging spectrometer provided in an embodiment of the present invention;

[0023] Figure 2 for Figure 1 A schematic diagram of the power supply board frame structure;

[0024] Figure 3 for Figure 1 A schematic diagram of the power supply board frame.

[0025] Explanation of reference numerals in the attached figures:

[0026] 10. Power supply board frame; 11. Power supply board; 12. High-power components; 13. Heat dissipation reinforcement plate;

[0027] 20. Heat dissipation substrate;

[0028] 30. Top frame;

[0029] 40. Base frame;

[0030] 50. Mid-frame;

[0031] 60. Insulating sleeve. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0033] See Figure 1-3 As shown;

[0034] The multi-channel power supply box for a space imaging spectrometer according to an embodiment of the present invention includes:

[0035] Multiple power board frames 10 are mounted in parallel on a heat dissipation substrate 20.

[0036] Top frame 30, the top frame 30 is disposed on one side of the plurality of power board frames 10 as a whole;

[0037] The bottom frame 40 is disposed on the other side of the plurality of power board frames 10 as a whole, and the bottom plate 40 and the top plate 30 close the two ends of the plurality of power board frames 10.

[0038] Multiple middle frames 50, each middle frame 50 is disposed between two adjacent power board frames 10, the middle frame 50 separates the two adjacent power board frames 10 to ensure that the signals between each power board frame 10 do not interfere;

[0039] A power board 11 is mounted on one side of each power board frame 10. Multiple high-power components 12 are soldered onto the power board 11, and the multiple high-power components 12 are located on the same side of the power board 11. The pins of the multiple high-power components 12 are connected to the vias on the power board 11. An insulating thermal pad with a thickness of 0.2 mm is provided between each high-power component 12 and the power board 11. A heat dissipation reinforcement plate 13 is mounted on each high-power component 12. The heat dissipation reinforcement plate 13 presses the corresponding high-power component 12 firmly onto the power board 11, ensuring that the high-power component is tightly attached to the mounting surface on the power board frame. The two ends of the heat dissipation reinforcement plate 3 are connected to the power board 11 by screws. The screws also pass through the power board frame 10 and are connected to nuts.

[0040] The power board frame 10 is fitted with the adjacent top frame 30, bottom frame 40 and middle frame 50 through a stop joint to ensure seamless installation; the power board frame 10, top frame 30, bottom frame 40 and middle frame 50 are connected by long screws to ensure the stability of the overall structure. The above-mentioned overall structure is mounted on the heat dissipation substrate 20, and the heat dissipation substrate 20 is mounted on the satellite flight board.

[0041] An indium sheet is laid on the side of the heat dissipation substrate 20 near the satellite deck. The thickness of the indium sheet is 0.1 mm.

[0042] An insulating sleeve 60 is installed on the outside of the nut. The insulating sleeve 60 insulates the nut and the corresponding screw, ensuring that the screw is not conductive. The insulating sleeve 60 is made of polyimide.

[0043] This application features a more independent overall design, facilitating assembly, debugging, and testing. Utilizing cable power supply aims to improve the heat dissipation capacity of high-power components and address the issue of excessive satellite resource consumption. A top frame 30, a bottom frame 40, and a middle frame 50 separate each power board frame 10, forming a unified structure. This provides ample heat dissipation for high-power components 12, minimizing the use of satellite thermal resources and freeing up more for the payload, thereby improving the overall satellite thermal efficiency.

[0044] Even under the most severe operating conditions, the high-power devices 12 on the power supply board frame 10, after being derated, still meet the aerospace requirements for temperature control.

[0045] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A multi-channel power supply box for a space imaging spectrometer, characterized in that, include: Multiple power supply frames (10) are mounted in parallel on a heat dissipation substrate (20); Top frame (30), the top frame (30) is disposed on one side of the entire power board frame (10); The bottom frame (40) is located on the other side of the entire power board frame (10); Multiple middle frames (50), each of the middle frames (50) being disposed between two adjacent power board frames (10); A power board (11) is mounted on one side of each power board frame (10). Multiple high-power components (12) are mounted on the power board (11). The pins of the multiple high-power components (12) are connected to the vias on the power board (11). A heat dissipation reinforcement plate (13) is mounted on each high-power component (12). The two ends of the heat dissipation reinforcement plate (13) are connected to the power board (11) by screws. The screws also pass through the power board frame (10) and are connected to the nut. An indium sheet is deposited on the heat dissipation substrate (20); An insulating thermal pad is provided between each of the high-power components (12) and the power board (11); An insulating sleeve (60) is installed on the outside of the nut.

2. The multi-channel power supply box for a space imaging spectrometer according to claim 1, characterized in that, The power board frame (10) is fitted with the adjacent top frame (30), bottom frame (40) and middle frame (50) by a stop joint.

3. The multi-channel power supply box for a space imaging spectrometer according to claim 1, characterized in that, The thickness of the indium sheet is 0.1 mm.

4. The multi-channel power supply box for a space imaging spectrometer according to claim 1, characterized in that, Multiple high-power components (12) are located on the same side of the power board (11).

5. The multi-channel power supply box for a space imaging spectrometer according to claim 1, characterized in that, The thickness of the insulating thermal pad is 0.2 mm.

6. The multi-channel power supply box for a space imaging spectrometer according to claim 1, characterized in that, The insulating sleeve (60) is made of polyimide.

Images