Power module and power system

Abstract

The application provides a power module and a power system. The power system comprises at least one power module, a load and a system circuit board. The at least one power module supplies power to the load through the system circuit board. The at least one power module comprises a magnetic core, a power chip, a first conductive member and a second conductive member. The magnetic core comprises opposite first and second sides and opposite third and fourth sides, and a horizontal passage extending from the first side to the second side. The power chip comprises at least two switches connected into a half-bridge circuit. The first conductive member and the second conductive member are arranged in a stacked manner across the passage. Different layouts of positions between the first conductive member, the second conductive member, the magnetic core and the power chip form power modules with different arrangements. The formed power modules can meet the requirements of higher power, higher efficiency, higher power density and smaller size, higher dynamic performance, multi-path power supply and other high requirements.

Description

Technical Field

[0001] This application relates to the field of power electronic equipment technology, and in particular to a power module and power system. Background Technology

[0002] As the data processing capabilities of various data processing chips and other intelligent processors improve, the requirements for chip space utilization and power consumption also increase significantly, thus placing higher demands on power modules. For example, power modules need higher power, higher efficiency, higher power density, and smaller size, and higher requirements are also placed on dynamic performance.

[0003] Furthermore, these stringent requirements may vary depending on the specific chip being powered, and even for the same chip, multiple different power supply needs may be involved. For example, the power supply requirements of a high-power main chip may require multi-phase parallel connection and as many opposite couplings as possible to improve dynamic performance, while for other low-power auxiliary power supplies, the main requirement is appropriate efficiency, and when the power is low, a single-phase power module may be sufficient. However, if different solutions are adopted for different power supply needs, such as for the main chip power supply and the auxiliary power supply, for example, using modular power supply for the main chip and discrete components for the auxiliary power supply, such a power supply solution will inevitably increase the burden of system board development, and will also have to deal with multiple auxiliary power supplies, thus consuming a lot of human resources and time costs in the development and verification process.

[0004] It is evident that a comprehensive solution is urgently needed to meet the requirements of higher power, higher efficiency, higher power density, smaller size, higher dynamic performance, and multi-channel power supply for power modules. Summary of the Invention

[0005] This application provides a power module and power system designed to effectively meet the high requirements of power modules, such as higher power, higher efficiency, higher power density, smaller size, higher dynamic performance, and multi-channel power supply.

[0006] In a first aspect, this application provides a power module, comprising:

[0007] The magnetic core includes a first side, a second side, a third side, and a fourth side, wherein the first side and the second side are opposite to each other, and the third side and the fourth side are opposite to each other; the magnetic core also includes a horizontal channel extending from the first side to the second side;

[0008] A power chip, comprising at least two switches connected in a half-bridge circuit; and

[0009] A first conductive element and a second conductive element are stacked vertically in the channel and traverse the channel. The first end of the first conductive element is electrically connected to the midpoint of the bridge arm of the half-bridge circuit, and the second end of the first conductive element is electrically connected to the first connection terminal. The two ends of the second conductive element are electrically connected to the second connection terminal and the third connection terminal, respectively. The first connection terminal, the second connection terminal and the third connection terminal are located on the third side of the magnetic core.

[0010] In one possible design, a module circuit board is also included, with a portion of the module circuit board passing through the channel; the power chip is located on a first side of the magnetic core and disposed on a first surface of the module circuit board.

[0011] In one possible design, an electronic component is also included;

[0012] The electronic device is disposed on the second surface of the module circuit board, and the projection of the electronic device on the second plane is within the projection of the power chip.

[0013] In one possible design, the first conductive element includes a first transverse portion and a first lower longitudinal portion connected to each other; the second conductive element includes a second lower longitudinal portion, a second transverse portion, and a third lower longitudinal portion connected in sequence; wherein...

[0014] The first transverse portion and the second transverse portion pass through the channel, the first lower longitudinal portion and the third lower longitudinal portion are located on the second side of the magnetic core and are insulated from each other, and the second lower longitudinal portion is located on the first side of the magnetic core.

[0015] In one possible design, the magnetic core, the first conductive element, and the second conductive element are embedded in an insulating encapsulant, and the power chip is disposed on the upper surface of the insulating encapsulant.

[0016] In one possible design, the power chip, the magnetic core, the first conductive element, and the second conductive element are all embedded in an insulating encapsulant.

[0017] In one possible design, the first conductive element includes a first upper longitudinal portion, a first transverse portion, and a first lower longitudinal portion connected in sequence; the second conductive element includes a second lower longitudinal portion, a second transverse portion, and a third lower longitudinal portion connected in sequence; wherein...

[0018] The first transverse portion and the second transverse portion pass through the channel. The first lower longitudinal portion and the third lower longitudinal portion are located on the second side of the magnetic core and are insulated from each other. The first upper longitudinal portion extends upward on the first side of the magnetic core, and the second lower longitudinal portion extends downward on the first side of the magnetic core.

[0019] In one possible design, the magnetic core covers the first lower longitudinal portion and the third lower longitudinal portion on the second side.

[0020] Secondly, this application provides a power module, comprising:

[0021] The magnetic core includes a first side, a second side, a third side, and a fourth side, wherein the first side and the second side are opposite to each other, and the third side and the fourth side are opposite to each other; the magnetic core also includes a horizontal channel extending from the first side to the second side;

[0022] A power chip, stacked on the fourth side, and including at least a first half-bridge circuit and a second half-bridge circuit; and

[0023] A first conductive element and a second conductive element extend from the first side to the second side in the channel. The first end of the first conductive element is electrically connected to the midpoint of the bridge arm in the first half-bridge circuit, and the second end of the first conductive element is electrically connected to the first connecting terminal. The first end of the second conductive element is electrically connected to the midpoint of the bridge arm in the second half-bridge circuit, and the second end of the second conductive element is electrically connected to the second connecting terminal. The first connecting terminal and the second connecting terminal are located on the third side of the magnetic core.

[0024] The first conductive element and the second conductive element are stacked in the channel of the magnetic core.

[0025] In one possible design, the first conductive element includes a first upper longitudinal portion, a first transverse portion, and a first lower longitudinal portion connected in sequence; the second conductive element includes an upper portion, a connecting portion, a lower portion, a second lower longitudinal portion, and a third upper longitudinal portion, wherein the second lower longitudinal portion is located on a first side of the magnetic core and extends downward from the lower portion, and the third upper longitudinal portion is located on a second side of the magnetic core and extends upward from the upper portion; wherein the first transverse portion is located between the upper portion and the lower portion.

[0026] Thirdly, this application provides a power supply system, including at least one power module, a load, and a system circuit board as described in either the first or second aspect;

[0027] The at least one power module supplies power to the load via the system circuit board.

[0028] In one possible design, the at least one power module includes a second power module and a third power module; the first connection terminal, the second connection terminal, and the third connection terminal of the second power module overlap with the projections of the first connection terminal, the second connection terminal, and the third connection terminal of the third power module on the system circuit board.

[0029] The first connection terminal of the second power module is electrically connected to the second connection terminal of the third power module through a second connection line disposed in the system circuit board, and the third connection terminal of the third power module is electrically connected to the load; the second output current supplies power to the load through the first conductive element of the second power module, the second connection line, the second conductive element of the third power module, and the third connection terminal;

[0030] The first connection terminal of the third power module is electrically connected to the second connection terminal of the second power module through a third connection line disposed in the system circuit board. The third connection terminal of the second power module is electrically connected to the load. The third output current supplies power to the load through the first conductive element of the third power module, the third connection line, the second conductive element of the second power module, and the third connection terminal.

[0031] This application provides a power module and a power system. The power system includes at least one power module, a load, and a system circuit board. The at least one power module supplies power to the load through the system circuit board. The at least one power module includes a magnetic core, a power chip, a first conductive element, and a second conductive element. The magnetic core includes opposing first and second sides, as well as opposing third and fourth sides, and a horizontal channel extending from the first side to the second side. The power chip includes at least two switches connected to form a half-bridge circuit. The first and second conductive elements are stacked and traverse the channel. By varying the positions of the first conductive element, the second conductive element, the magnetic core, and the power chip, various power modules with different arrangements can be formed. This allows the resulting power modules to meet the high requirements of higher power, higher efficiency, higher power density, smaller size, higher dynamic performance, and multi-channel power supply. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 A cross-sectional view of a power module provided in an embodiment of this application;

[0034] Figure 2 A circuit diagram provided for an embodiment of this application;

[0035] Figure 3 A cross-sectional view of another power module provided in an embodiment of this application;

[0036] Figure 4 A cross-sectional view of a power module along the AA direction provided in an embodiment of this application;

[0037] Figure 5 A cross-sectional view of another power module provided in an embodiment of this application;

[0038] Figure 6 A cross-sectional view of yet another power module provided in an embodiment of this application;

[0039] Figure 7 A cross-sectional view along the AA direction provided for an embodiment of this application;

[0040] Figure 8 A right view of a power module provided in an embodiment of this application;

[0041] Figure 9 A cross-sectional view of yet another power module provided in an embodiment of this application;

[0042] Figure 10 A cross-sectional view along the AA direction provided in an embodiment of this application;

[0043] Figure 11 A right view of another power module provided in an embodiment of this application;

[0044] Figure 12 A cross-sectional view of a power supply system provided in an embodiment of this application;

[0045] Figure 13 A cross-sectional view of another power system provided in an embodiment of this application. Detailed Implementation

[0046] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of methods and apparatus consistent with some aspects of this application as detailed in the appended claims.

[0047] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0048] To address the aforementioned problems in the prior art, this application provides a power module and a power system. The power system includes at least one power module, a load, and a system circuit board. The at least one power module supplies power to the load through the system circuit board. The at least one power module includes a magnetic core, a power chip, a first conductive element, and a second conductive element. The magnetic core includes opposing first and second sides, as well as opposing third and fourth sides, and a horizontal channel extending from the first side to the second side. The power chip includes at least two switches connected to form a half-bridge circuit. The first and second conductive elements are stacked and traverse the channel. By varying the positions of the first conductive element, the second conductive element, the magnetic core, and the power chip, various power module arrangements are formed, enabling the resulting power modules to meet high requirements such as higher power, higher efficiency, higher power density, smaller size, higher dynamic performance, and multi-channel power supply needs in a balanced manner.

[0049] Figure 1 This is a cross-sectional view of a power module provided in an embodiment of this application. Figure 1 As shown, the power module provided in this embodiment includes: a magnetic core 1, a first conductive element 21, a second conductive element 22, and a power chip 3. (Refer to...) Figure 1 As shown, the magnetic core 1 has a first side, a second side, a third side, and a fourth side, with the first and second sides facing each other, and the third and fourth sides facing each other. Furthermore, the magnetic core 1 also includes a horizontal channel 11 extending from the first side to the second side.

[0050] Power chip 3 includes at least two switches connected in a half-bridge circuit. The half-bridge circuit is as follows: Figure 2 As shown, Figure 2 This is a circuit diagram provided for an embodiment of this application. Figure 2 In a half-bridge circuit, switching devices Q1 and Q2 are connected to form one half-bridge, and Q3 and Q4 are connected to form another half-bridge circuit. SW is the midpoint of the bridge arm of the half-bridge circuit. It should be noted that half-bridge circuits include, but are not limited to, those shown below. Figure 2The circuit shown can also be a Boost circuit, a Buck / Boost circuit, etc. Figure 2 In the half-bridge circuit shown, Vo represents the positive output, Vin represents the positive input, Co represents the output capacitor, Cin represents the input capacitor, and GND represents the negative output.

[0051] The extension direction of channel 11 is parallel to the main plane of power chip 3, that is, the axis of the extension direction of channel 11 (e.g., Figure 1 The horizontal line from the first side to the second side of the magnetic core 1 is parallel to the main plane of the power chip 3, allowing the magnetic core 1 and the power chip 3 to be laid flat, thereby reducing the height of the final power module. Furthermore, while maintaining a constant height, the inductance can be flexibly adjusted by changing the length of the magnetic core 1. The power chip 3 can be any power device in the power module, such as a metal-oxide-semiconductor field-effect transistor (MOSFET) or a gallium nitride (GaN) switching device.

[0052] The first conductive element 21 and the second conductive element 22 can be stacked vertically in the channel 11 and traverse the channel 11. The first end of the first conductive element 21 is electrically connected to the midpoint SW of the bridge arm of the half-bridge circuit, and the second end of the first conductive element 21 is electrically connected to the first connecting terminal 61. The two ends of the second conductive element 22 are electrically connected to the second connecting terminal 62 and the third connecting terminal 63, respectively. The first connecting terminal 61, the second connecting terminal 62, and the third connecting terminal 63 are located on the third side of the magnetic core 1.

[0053] Optionally, the power module may further include a module circuit board 41. A portion of the module circuit board 41 may be disposed within the channel 11, such as... Figure 1 As shown, the power chip 3 can be located on the first side of the magnetic core 1 and disposed on the first surface of the module circuit board 41, which can be as follows: Figure 1 The upper surface of the module circuit board 41 allows the midpoint SW of the bridge arm to be electrically connected to the first connection terminal 61 via the module circuit board 41. It should be noted that... Figure 1 In one embodiment, the power chip 3 is located on the first surface of the module circuit board 41. In other embodiments, the power chip 3 may also be embedded in the module circuit board 41.

[0054] Furthermore, other components, such as capacitors, resistors, and other electronic devices 39, can be disposed on the second surface of the module circuit board 41. Figure 1As shown, the power module may also include an electronic device 39, which may be disposed on the second surface of the module circuit board 41. The projection of the electronic device 39 on the second plane is within the projection of the power chip 3, that is, the projection of the power chip 3 on the second plane can cover the projection of the electronic device 39 on the second plane, so as to reduce the space occupancy rate.

[0055] Optionally, other peripheral terminals 69 may be provided on the module circuit board 41 by means of copper blocks, etc., so as to facilitate the connection of circuits such as input circuits, grounding circuits and signal circuits through the peripheral terminals 69.

[0056] As can be seen from the above description, setting up a module circuit board in the power module can facilitate the integration of power chips, magnetic cores, first and second conductive components, and related connection circuits. For example, a planar inductor can be formed in a manner similar to a planar transformer, which facilitates automated production and consistent parameter control, thus benefiting the fabrication of the power module.

[0057] The specific shapes of the first conductive element 21 and the second conductive element 22 can be set according to the specific structure of the channel 11 and the magnetic core 1 in actual working conditions to meet high requirements such as smaller size and multiple power supply needs. Optionally, Figure 1 The diagram shows one possible shape for the first conductive element 21 and the second conductive element 22. (Refer to...) Figure 1 As shown, the first conductive element 21 may include a first transverse portion 21b and a first lower longitudinal portion 21c connected to each other. The second conductive element 22 includes a second lower longitudinal portion 22a, a second transverse portion 22b, and a third lower longitudinal portion 22c connected in sequence. Figure 1 The first conductive element 21 shown is L-shaped. The first conductive element 21 can be made by stamping and bending a copper strip, or by connecting and splicing two conductive segments together. The second conductive element 22 is U-shaped. The second conductive element 22 can be made by stamping and bending a copper strip, or by connecting and splicing three conductive segments together.

[0058] In this embodiment, the first transverse portion 21b and the second transverse portion 22b pass through the channel 11, the second lower longitudinal portion 22a is located on the first side of the magnetic core 1, and the first lower longitudinal portion 21c and the third lower longitudinal portion 22c are located on the second side of the magnetic core 1. Furthermore, the first lower longitudinal portion 21c and the third lower longitudinal portion 22c are insulated from each other. This application does not limit the insulating material used to achieve insulation. Figure 1 The insulating layer formed by this insulating material is not shown in the diagram.

[0059] In some embodiments, such as Figure 1As shown, the first lateral portion 21b and the second lateral portion 22b are disposed in the module circuit board 41, that is, the module circuit board 41 is partially inserted into the channel 11 of the magnetic core. In other embodiments, the first lateral portion 21b and the second lateral portion 22b are disposed insulated from each other in the magnetic core channel 11, and the module circuit board 41 is disposed adjacent to the magnetic core.

[0060] Furthermore, to facilitate the integration of various components in the power module, the magnetic core 1, the first conductive element 21, and the second conductive element 22 can be embedded in an insulating encapsulant, or the power chip 3, the magnetic core 1, the first conductive element 21, and the second conductive element 22 can all be embedded in an insulating encapsulant, such as a prepreg or other adhesive, so that the components embedded in the insulating encapsulant are combined in an insulating manner to form a whole, which facilitates assembly during the power module manufacturing process.

[0061] In one possible design, for example, when the magnetic core 1, the first conductive element 21 and the second conductive element 22 are embedded in the insulating encapsulant, the power chip 3 can be disposed on the upper surface of the insulating encapsulant 51. Figure 3 This is a cross-sectional view of another power module provided in an embodiment of this application. Figure 4 A cross-sectional view of a power module along the AA direction provided in an embodiment of this application, wherein the cross-sectional plane is... Figure 3 AA side as shown. Figure 3 As shown, the power module provided in this embodiment includes: a magnetic core 1, a first conductive element 21, a second conductive element 22, and a power chip 3.

[0062] The magnetic core 1 has a first side, a second side, a third side, and a fourth side, with the first and second sides facing each other, and the third and fourth sides facing each other. Furthermore, the magnetic core 1 also includes a horizontal channel 11 extending from the first side to the second side.

[0063] The power chip 3 includes at least two switches connected in a half-bridge circuit and is disposed on the upper surface of the insulating encapsulation material 51 in which the magnetic core 1, the first conductive element 21, and the second conductive element 22 are embedded. Figure 3 and Figure 4 The diagram shows that the first conductive element 21 and the second conductive element 22 are separated by an insulating layer 55.

[0064] The half-bridge circuit in power chip 3, such as Figure 2 As shown, it will not be described again here. The extension direction of channel 11 is parallel to the main plane of power chip 3, as can be seen in the reference. Figure 1The embodiments are described in detail. The power chip 3 can be any power device in the power module, such as a metal-oxide-semiconductor field-effect transistor (MOSFET) or a gallium nitride (GaN) switching device.

[0065] The first conductive element 21 and the second conductive element 22 can be stacked vertically in the channel 11 and traverse the channel 11. The first end of the first conductive element 21 is electrically connected to the midpoint SW of the bridge arm of the half-bridge circuit, and the second end of the first conductive element 21 is electrically connected to the first connecting terminal 61. The two ends of the second conductive element 22 are electrically connected to the second connecting terminal 62 and the third connecting terminal 63, respectively. The first connecting terminal 61, the second connecting terminal 62, and the third connecting terminal 63 are located on the third side of the magnetic core 1.

[0066] Continue to refer to Figure 3 As shown, the first conductive element 21 may include a first upper vertical portion 21a, a first horizontal portion 21b, and a first lower vertical portion 21c connected in sequence. The second conductive element 22 includes a second lower vertical portion 22a, a second horizontal portion 22b, and a third lower vertical portion 22c connected in sequence.

[0067] The first transverse portion 21b and the second transverse portion 22b pass through the channel 11 and are insulated from each other. The first lower longitudinal portion 21c and the third lower longitudinal portion 22c are located on the second side of the magnetic core 1 and are insulated from each other (e.g., Figure 4 (As shown in the middle insulating layer 55), the first upper longitudinal portion 21a extends upward on the first side of the magnetic core 1, and the second lower longitudinal portion 22a extends downward on the first side of the magnetic core 1.

[0068] Optionally, in Figure 3 On this basis, Figure 5 A cross-sectional view of another power module provided in an embodiment of this application, wherein, Figure 5 and Figure 3 The arrangement of components and the shapes of conductive parts in the power modules shown are similar, while Figure 3 and Figure 5 The difference is that, Figure 3 The middle magnetic core 1 does not cover the first lower longitudinal portion 21c and the third lower longitudinal portion 22c on the second side, while Figure 5 The middle magnetic core 1 covers the first lower longitudinal portion 21c and the third lower longitudinal portion 22c on the second side, so that... Figure 5 The power supply module shown is more advantageous for increasing inductor charge or reducing the size of the power supply module. Figure 5The magnetic core 1 structure makes the axis of channel 11 L-shaped, which increases the length of channel 11. This allows for an increase in the inductance charge or, without changing the inductance charge, a reduction in the size of the magnetic core 1 to reduce the size of the power module.

[0069] Optionally, Figure 3 and Figure 5 The module may also include an insulating encapsulant 51, which is arranged parallel to the channel 11 and covers the magnetic core 1, so as to facilitate the electrical connection of the corresponding devices and reduce the size of the power module.

[0070] In the above embodiments, the first and second conductive components of the power module are stacked in the channel, meaning that the projections of the first and second conductive components on the third side of the magnetic core 1 overlap. This significantly reduces the overall envelope area of ​​the cross-sections of the first and second conductive components, thereby reducing the cross-sectional area of ​​the channel and consequently the cross-sectional area of ​​the magnetic core, achieving the effect of reducing the size of the magnetic core, inductor, and power module. Furthermore, a smaller channel cross-sectional area indicates a shorter magnetic circuit length, which can further reduce magnetic core losses.

[0071] This application provides a power module including a magnetic core, a power chip, a first conductive element, and a second conductive element. The magnetic core includes opposing first and second sides, as well as opposing third and fourth sides, and a horizontal channel extending from the first side to the second side. The power chip includes at least two switches connected to form a half-bridge circuit. The first and second conductive elements are stacked and traverse the channel. By varying the positions of the first and second conductive elements, the magnetic core, and the power chip, and by using different shapes for the first and second conductive elements, various power modules with different arrangements can be formed. This allows the resulting power modules to meet the high demands of higher power, higher efficiency, higher power density, smaller size, higher dynamic performance, and multi-channel power supply requirements in a balanced manner.

[0072] Figure 6 This is a cross-sectional view of yet another power module provided in an embodiment of this application. (See attached image.) Figure 6 As shown, the power module provided in this embodiment includes: a magnetic core 1, a first conductive element 21, a second conductive element 22, and a power chip 3. The magnetic core 1 has a first side, a second side, a third side, and a fourth side, with the first and second sides facing each other, and the third and fourth sides facing each other. The magnetic core 1 also includes a horizontal channel 11 extending from the first side to the second side. The power chip 3 is stacked on the fourth side of the magnetic core 1 and includes at least a first half-bridge circuit and a second half-bridge circuit. The first and second half-bridge circuits can be formed by multiple power chips 3 or by a single power chip 3. Figure 6 The diagram shows two power chips 3 forming a first half-bridge circuit and a second half-bridge circuit, respectively.

[0073] A first conductive element 21 and a second conductive element 22 extend from a first side to a second side of the magnetic core 1 in the channel 11. The first end of the first conductive element 21 is electrically connected to the midpoint SW-1 of the bridge arm in the first half-bridge circuit, and the second end of the first conductive element 21 is electrically connected to the first connecting terminal 61. The first end of the second conductive element 22 is electrically connected to the midpoint SW-2 of the bridge arm in the second half-bridge circuit, and the second end of the second conductive element 22 is electrically connected to the second connecting terminal 62. The first connecting terminal 61 and the second connecting terminal 62 are located on the third side of the magnetic core 1.

[0074] The first conductive element 21 and the second conductive element 22 can be stacked in the channel 11 of the magnetic core 1, that is, the projections of the first conductive element and the second conductive element on the third side of the magnetic core 1 overlap each other. This can significantly reduce the overall envelope area of ​​the cross-sections of the first conductive element and the second conductive element, thereby helping to reduce the cross-sectional area of ​​the channel. For example, refer to... Figure 7 and Figure 8 As shown, Figure 7 Another power module cross-sectional view along the AA direction provided in this application embodiment, wherein the cross-sectional plane is... Figure 6 The AA surface shown in the figure Figure 8 This is a right view of a power module provided in an embodiment of this application. Figure 8 for Figure 6 The right-side view. Figure 7 and Figure 8 The stacking state of the first conductive element 21 and the second conductive element 11 in the channel 11 can be seen. Combined with... Figure 6 and Figure 8 As can be seen, the first conductive element 21 and the second conductive element 22 are staggered and intersected on the right side of the magnetic core 1. The first conductive element 21 extends downward from above the second conductive element 22 on the right side of the magnetic core 1 and is electrically connected to the first connecting terminal 61. The second conductive element 22 extends upward from below the first conductive element 21 on the right side of the magnetic core 1 and is electrically connected to the SW point of the power chip 3.

[0075] It should be noted that the first half-bridge circuit and the second half-bridge circuit are similar to the half-bridge circuit in the aforementioned embodiments; for details, please refer to the foregoing. Figure 2 The description will not be repeated here.

[0076] The specific shapes of the first conductive element 21 and the second conductive element 22 can be set according to the specific structure of the channel 11 and the magnetic core 1 in actual working conditions to meet high requirements such as smaller size and multiple power supply needs. Optionally, Figure 6 The diagram shows one possible shape for the first conductive element 21 and the second conductive element 22. (Refer to...) Figure 6As shown, optionally, the first conductive member 21 includes a first upper vertical portion 21a, a first horizontal portion 21b, and a first lower vertical portion 21c connected in sequence. The second conductive member 22 includes a second lower vertical portion 22a, a second horizontal portion 22b, and a second upper vertical portion 22e connected in sequence.

[0077] The first transverse portion 21b and the second transverse portion 22b pass through the channel 11. The first upper longitudinal portion 21a extends upward on the first side of the magnetic core 1, and the second lower longitudinal portion 22a extends downward on the first side of the magnetic core 1. The first lower longitudinal portion 21c extends downward on the second side of the magnetic core 1, and the second upper longitudinal portion 22e extends upward on the second side of the magnetic core 1. The first conductive element 21 and the second conductive element 22 are insulated from each other, and the insulating layer between them is as follows: Figure 7 The insulating layer 55 is shown in the figure.

[0078] To facilitate the integration of various components in the power module, the first conductive element 21 and the second conductive element 22 can be combined in an insulating manner to form a single unit for easy assembly during the power module manufacturing process.

[0079] Optionally, Figure 6 The power module shown may also include a module circuit board 41, which is disposed between the magnetic core 1 and the power chip 3 to facilitate the integration of electrical connections between the various devices.

[0080] The power module provided in this application embodiment has a first conductive element and a second conductive element stacked in a direction parallel to the channel direction and perpendicular to the third side of the magnetic core. This significantly reduces the envelope area of ​​their cross-sections, which is beneficial for reducing the cross-sectional area of ​​the channel, and thus reducing the cross-sectional area of ​​the magnetic core. This achieves the effect of reducing the volume of the magnetic core, inductor, and power module. Furthermore, a smaller channel cross-sectional area indicates a shorter magnetic circuit length, which can further reduce magnetic core losses.

[0081] exist Figure 6 Based on this, the shapes of the first conductive element 21 and the second conductive element 22 can also be as follows: Figure 9 As shown. Figure 9 This is a cross-sectional view of yet another power module provided in an embodiment of this application. Figure 10 A cross-sectional view along the AA direction provided in another embodiment of this application, wherein... Figure 10 Sectional view is Figure 9 The diagram shows surface AA, omitting module circuit boards, etc. Figure 11 A right view of another power module provided in an embodiment of this application. Figure 11 for Figure 9 The right-side view. (Refer to...) Figures 10 to 11As shown, the first conductive element 21 includes a first upper vertical portion 21a, a first transverse portion 21b, and a first lower vertical portion 21c connected in sequence. The second conductive element 22 includes an upper layer portion 22f, a connecting portion 22g, a lower layer portion 22h, a second lower vertical portion 22a, and a third upper vertical portion 22k. The second lower vertical portion 22a is located on the first side of the magnetic core 1 and extends downward from the lower layer portion 22h. The third upper vertical portion 22k is located on the second side of the magnetic core 1 and extends upward from the upper layer portion 22f. The first transverse portion 21b is located between the upper layer portion 22f and the lower layer portion 22h. The connecting portion 22g is used to connect the upper layer portions 22f and 22h. The first conductive element 21 and the second conductive element 21 are stacked in the channel 11 and connected by a channel. Figure 10 The insulating layers 55 are insulated from each other.

[0082] To facilitate the integration of various components in the power module, the first conductive element 21 and the second conductive element 22 can be combined in an insulating manner to form a single unit for easy assembly during the power module manufacturing process.

[0083] Optionally, Figure 9 The power module shown may also include a module circuit board 41, which is arranged parallel to the channel 11 and located between the magnetic core 1 and the power chip 3, so as to facilitate the electrical connection of the corresponding devices and reduce the size of the power module.

[0084] It should be noted that, Figure 9 The power module shown contains magnetic core 1, power device 3, and first connection terminal 61 and second connection terminal 62. Figure 6 Similar to those in the text, I will not elaborate further here.

[0085] The power module provided in this application embodiment has a first conductive element that wraps around a second conductive element and is arranged parallel to the channel. This reduces the path of leakage flux between the two elements, which is beneficial for improving the coupling coefficient of the two oppositely coupled inductors. Furthermore, in cross-section, the second conductive element can surround the first conductive element in a C-shape above, below, and to one side. The first and second conductive elements do not need to cross on the first and second sides of the magnetic core, which facilitates the arrangement of corresponding circuits and is beneficial for the fabrication of the power module.

[0086] The power modules provided in the above embodiments include a magnetic core, a power chip, a first conductive element, and a second conductive element. The magnetic core includes opposing first and second sides, as well as opposing third and fourth sides, and a horizontal channel extending from the first side to the second side. The power chip includes at least a first half-bridge circuit and a second half-bridge circuit. The first and second conductive elements traverse the channel and are stacked within the channel. By varying the positions of the first conductive element, the second conductive element, the magnetic core, and the power chip, and by using different shapes for the first and second conductive elements, various power modules with different arrangements can be formed. This allows the resulting power modules to meet the high requirements of higher power, higher efficiency, higher power density, smaller size, higher dynamic performance, and multi-channel power supply.

[0087] Based on the power modules provided in the above embodiments, this application also provides a power system, which may include at least one power module, a load, and a system circuit board provided in the above embodiments. The at least one power module can supply power to the load via the system circuit board. The load can be any component that needs power, such as intelligent processors like CPUs (Central Processing Units), GPUs (Graphics Processing Units), and TPUs (Tensor Processing Units). For example, an OAM-packaged smart accelerator card, where OAM refers to the smart accelerator card module OAM (OCP Accelerator Module, defined by the Open Computer Project) industry standard, namely the OCP Accelerator Module Design Specification.

[0088] Figure 12 This is a cross-sectional view of a power supply system provided in an embodiment of this application. Figure 12 As shown, the power system provided in this application embodiment includes at least one power module, a load 9, and a system circuit board 46. The at least one power module may include a first power module 81, and the first power module 81 and the load 9 may be disposed on the same side above the system circuit board 46.

[0089] The first connection terminal 611 of the first power module 81 is electrically connected to the third connection terminal 631 of the first power module 81 via the first connection line 291 disposed on the system circuit board 46. The second connection terminal 621 of the first power module 81 is electrically connected to the load 9. The output current of the first power module 81, i.e., the first output current, can supply power to the load 9 via the first conductive element 211, the first connection line 291, the second conductive element 221, and the second connection terminal 621 of the first power module 81. The direction of the first output current is as follows: Figure 12 As indicated by the middle arrow. Figure 12 In this context, Vo represents the positive output terminal of the power supply system, meaning that the first output current can supply power to the load 9 via the positive output terminal Vo. The positive output terminal Vo is electrically connected to the positive power terminal of the load 9.

[0090] It should also be noted that Figure 12 The first power module 81 in Figure 1 The power module shown is an example. The first power module 81 may also be other power modules in the aforementioned embodiments, which will not be described in detail here. Figure 12 The electronic components 39 can be set in the corresponding positions according to the specific structural layout of the first power module 81 in the actual working conditions, and the number of electronic components 39 is also determined by the actual working conditions.

[0091] In this embodiment, a single-phase multi-turn inductor power supply is formed through the first connection line in the system circuit board, increasing the inductance and improving the efficiency of the power module. Furthermore, the power system provided in this embodiment allows the power module to independently power a low-power circuit of the load, enhancing the flexibility of the power module's application.

[0092] Figure 13 A cross-sectional view of another power system provided in an embodiment of this application, such as Figure 13 As shown, the power system provided in this embodiment includes at least one power module, a load 9, and a system circuit board 46. The at least one power module may include a second power module 82 and a third power module 83. The projections of the first connection terminal 612, the second connection terminal 622, and the third connection terminal 632 of the second power module 82 and the first connection terminal 613, the second connection terminal 623, and the third connection terminal 633 of the third power module 83 on the system circuit board 46 overlap. In other words... Figure 13 The second power module 82 and the third power module 83 in the system can have the same structure and can be stacked symmetrically on the upper and lower surfaces of the system circuit board 46.

[0093] Specifically, the first connection terminal 612 of the second power module 82 is electrically connected to the second connection terminal 623 of the third power module 83 via the second connection line 292 disposed in the system circuit board 46, and the third connection terminal 633 of the third power module 83 is electrically connected to the load 9. The output current of the second power module 82, i.e., the second output current, supplies power to the load 9 via the first conductive element 212 of the second power module 82, the second connection line 292, the second conductive element 223 of the third power module 83, and the third connection terminal 633.

[0094] The first connection terminal 613 of the third power module 83 is electrically connected to the second connection terminal 622 of the second power module 82 via the third connection line 293 disposed in the system circuit board 46. The third connection terminal 632 of the second power module 82 is electrically connected to the load 9. The output current of the third power module, i.e., the third output current, supplies power to the load 9 via the first conductive element 213 of the third power module 83, the third connection line 293, the second conductive element 222 of the second power module 82, and the third connection terminal 632.

[0095] The flow directions of the second and third output currents are as follows: Figure 13 As indicated by the middle arrow. Figure 13 In this context, Vo represents the positive output of the half-bridge circuit, meaning that the second and third output currents can power the load 9 via the positive output Vo. Optionally, the second and third output currents can be combined through shorted conductive lines in the system circuit board 46 and then power the load 9 via the positive output Vo.

[0096] Figure 13 The equal distances between the second power module 82 and the third power module 83 and the load 9 ensure that the output impedances of the second power module 82 and the third power module 83 are consistent and balanced, which helps to improve the output stability of the power modules and increase the output power.

[0097] It should also be noted that Figure 13 The second power module 82 and the third power module 83 in Figure 3 The power module shown is an example; the second power module 82 and the third power module 83 can also be... Figure 5 The power module shown will not be described in detail here. Figure 13 The electronic components are not shown, but in actual operation, they can be placed in the corresponding positions according to the specific layout of the power supply module in the actual operation.

[0098] In this embodiment of the application, the second and third connection lines in the system circuit board enable the second power module and the third power module to form an anti-coupled parallel connection, thereby providing two anti-coupled power supply methods for the load, so that the power system can meet the power supply requirements of different phases.

[0099] The power supply system provided in the above embodiments may include at least one power module that can comprise different numbers or different internal structures of power modules. These power modules are then arranged on the system circuit board in different ways to form single-phase or two-phase power supply methods, enabling the power system to meet diverse power supply requirements. Flexible integration via the system circuit board simplifies the structural complexity of the power modules, thereby facilitating their fabrication and application.

[0100] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the claims.

[0101] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A power module, characterized in that, include: The magnetic core includes a first side, a second side, a third side, and a fourth side, wherein the first side and the second side are opposite to each other, and the third side and the fourth side are opposite to each other; the magnetic core also includes a horizontal channel extending from the first side to the second side; A power chip, comprising at least two switches connected in a half-bridge circuit; as well as A first conductive element and a second conductive element are stacked vertically in the channel and traverse the channel. The first end of the first conductive element is electrically connected to the midpoint of the bridge arm of the half-bridge circuit, and the second end of the first conductive element is electrically connected to the first connection terminal. The two ends of the second conductive element are electrically connected to the second connection terminal and the third connection terminal, respectively. The first connection terminal, the second connection terminal and the third connection terminal are located on the third side of the magnetic core.

2. The power module according to claim 1, characterized in that, It also includes a module circuit board, part of which is disposed in the channel; the power chip is located on the first side of the magnetic core and disposed on the first surface of the module circuit board.

3. The power module according to claim 2, characterized in that, It also includes an electronic device; The electronic device is disposed on the second surface of the module circuit board, and the projection of the electronic device on the second surface is within the projection of the power chip.

4. The power module according to claim 2, characterized in that, The first conductive element includes a first transverse portion and a first lower longitudinal portion connected to each other; the second conductive element includes a second lower longitudinal portion, a second transverse portion, and a third lower longitudinal portion connected in sequence; wherein... The first transverse portion and the second transverse portion pass through the channel, the first lower longitudinal portion and the third lower longitudinal portion are located on the second side of the magnetic core and are insulated from each other, and the second lower longitudinal portion is located on the first side of the magnetic core.

5. The power module according to claim 1, characterized in that, The magnetic core, the first conductive element, and the second conductive element are embedded in an insulating encapsulation material, and the power chip is disposed on the upper surface of the insulating encapsulation material.

6. The power module according to claim 1, characterized in that, The power chip, the magnetic core, the first conductive element, and the second conductive element are all embedded in an insulating encapsulation material.

7. The power module according to claim 5, characterized in that, The first conductive element includes a first upper longitudinal portion, a first transverse portion, and a first lower longitudinal portion connected in sequence; the second conductive element includes a second lower longitudinal portion, a second transverse portion, and a third lower longitudinal portion connected in sequence; wherein... The first transverse portion and the second transverse portion pass through the channel. The first lower longitudinal portion and the third lower longitudinal portion are located on the second side of the magnetic core and are insulated from each other. The first upper longitudinal portion extends upward on the first side of the magnetic core, and the second lower longitudinal portion extends downward on the first side of the magnetic core.

8. The power module according to claim 7, characterized in that, The magnetic core covers the first lower longitudinal portion and the third lower longitudinal portion on the second side.

9. A power supply module, characterized in that, include: The magnetic core includes a first side, a second side, a third side, and a fourth side, wherein the first side and the second side are opposite to each other, and the third side and the fourth side are opposite to each other; the magnetic core also includes a horizontal channel extending from the first side to the second side; A power chip, stacked on the fourth side, and including at least a first half-bridge circuit and a second half-bridge circuit; as well as A first conductive element and a second conductive element extend from the first side to the second side in the channel. The first end of the first conductive element is electrically connected to the midpoint of the bridge arm in the first half-bridge circuit, and the second end of the first conductive element is electrically connected to the first connecting terminal. The first end of the second conductive element is electrically connected to the midpoint of the bridge arm in the second half-bridge circuit, and the second end of the second conductive element is electrically connected to the second connecting terminal. The first connecting terminal and the second connecting terminal are located on the third side of the magnetic core. The first conductive element and the second conductive element are stacked in the channel of the magnetic core.

10. The power module according to claim 9, characterized in that, The first conductive element includes a first upper longitudinal portion, a first transverse portion, and a first lower longitudinal portion connected in sequence; the second conductive element includes an upper layer portion, a connecting portion, a lower layer portion, a second lower longitudinal portion, and a third upper longitudinal portion, wherein the second lower longitudinal portion is located on a first side of the magnetic core and extends downward from the lower layer portion, and the third upper longitudinal portion is located on a second side of the magnetic core and extends upward from the upper layer portion; wherein the first transverse portion is located between the upper layer portion and the lower layer portion.

11. A power supply system, characterized in that, Includes at least one power module, load, and system circuit board as described in any one of claims 1-10; The at least one power module supplies power to the load via the system circuit board.

12. The power supply system according to claim 11, characterized in that, The at least one power module includes a first power module, and the first power module and the load are disposed on the same side above the system circuit board. The first connection terminal of the first power module is electrically connected to the third connection terminal of the first power module through a first connection line disposed in the system circuit board, and the second connection terminal of the first power module is electrically connected to the load; the first output current supplies power to the load through the first conductive element, the first connection line, the second conductive element and the second connection terminal of the first power module.

13. The power supply system according to claim 11, characterized in that, The at least one power module includes a second power module and a third power module; the first connection terminal, the second connection terminal, and the third connection terminal of the second power module overlap with the projections of the first connection terminal, the second connection terminal, and the third connection terminal of the third power module on the system circuit board; The first connection terminal of the second power module is electrically connected to the second connection terminal of the third power module through a second connection line disposed in the system circuit board, and the third connection terminal of the third power module is electrically connected to the load; the second output current supplies power to the load through the first conductive element of the second power module, the second connection line, the second conductive element of the third power module, and the third connection terminal; The first connection terminal of the third power module is electrically connected to the second connection terminal of the second power module through a third connection line disposed in the system circuit board. The third connection terminal of the second power module is electrically connected to the load. The third output current supplies power to the load through the first conductive element of the third power module, the third connection line, the second conductive element of the second power module, and the third connection terminal.

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