Power module and power system

Abstract

The application provides a power module and a power system. The power system comprises at least one power module, a load and a system circuit board. The at least one power module comprises a magnetic core, a power chip, a first conductive member and a second conductive member. The magnetic core comprises opposite first and second sides, third and fourth sides, and a vertical channel extending from the first side to the second side. The power chip comprises at least two switches connected into a half-bridge circuit, and can be stacked on the second side of the magnetic core, the extending direction of the channel being perpendicular to the main plane thereof, or can be arranged on the third or fourth side of the magnetic core. The first and second conductive members pass through the channel. The at least one power module provided by the application can supply power to the load through the system circuit board, can realize reverse coupling between multiple phases, and can simultaneously better meet multiple requirements such as high power density and smaller size, fast dynamic response and multi-path power supply requirement, low cost and the like by adopting integrated design.

Description

Technical Field

[0001] This application relates to the field of power electronic equipment technology, and in particular to a power module and power system. Background Technology

[0002] As the data processing capabilities of various data processing chips and other intelligent processors improve, the requirements for chip space utilization and power consumption also increase significantly, thus placing higher demands on power modules. For example, power modules need higher power, higher efficiency, higher power density, and smaller size, and higher requirements are also placed on dynamic performance.

[0003] Furthermore, these stringent requirements may vary depending on the specific chip being powered, and even for the same chip, multiple different power supply needs may be involved. For example, the power supply requirements of a high-power main chip may require multi-phase parallel connection and as many anti-couplings as possible to improve dynamic performance. For other low-power auxiliary power supplies, the main requirement is appropriate efficiency, and when the power is low, a single-phase power module may be sufficient. However, if different solutions are adopted for different power supply needs, such as for the main chip power supply and the auxiliary power supply, for example, using modular power supply for the main chip and discrete components for the auxiliary power supply, such a power supply solution will inevitably increase the burden of system board development, and will also have to deal with multiple auxiliary power supplies, thus consuming a lot of human resources, development and verification time.

[0004] It is evident that a comprehensive solution is urgently needed to meet the requirements of higher power, higher efficiency, higher power density, smaller size, higher dynamic performance, and multi-channel power supply for power modules. Summary of the Invention

[0005] This application provides a power module and power system designed to effectively meet the high requirements of power modules, such as higher power, higher efficiency, higher power density, smaller size, higher dynamic performance, and multi-channel power supply.

[0006] In a first aspect, this application provides a power module, comprising:

[0007] The magnetic core includes opposing first, second, third, and fourth sides, and a vertical channel extending from the first side to the second side.

[0008] A power chip, stacked on the second side, and including at least two switches connected to form a half-bridge circuit, wherein the channel extends perpendicularly to the main plane of the power chip; and

[0009] A first conductive element and a second conductive element are present. The first conductive element extends through the channel, and its first end is electrically connected to the midpoint of the bridge arm of the half-bridge circuit. The second end of the first conductive element is electrically connected to a first connecting terminal. The second conductive element extends through the channel, and its two ends are electrically connected to a second connecting terminal and a third connecting terminal, respectively. The first connecting terminal, the second connecting terminal, and the third connecting terminal are disposed on the first side.

[0010] In one possible design, the second conductive element includes a first conductive portion, a second conductive portion, and a third conductive portion;

[0011] The first conductive portion extends through the channel, the second conductive portion is disposed on the second side of the magnetic core, and the third conductive portion is disposed on the third or fourth side of the magnetic core, parallel to the channel with the first conductive portion.

[0012] In one possible design, the width of the first conductive portion is the width of the channel, the width of the third conductive portion is equal to the width of the magnetic core, and the thickness of the third conductive portion is less than the thickness of the first conductive portion; the shape of the second conductive portion is trapezoidal.

[0013] In one possible design, a module circuit board is also included; the module circuit board is disposed between the magnetic core and the power chip, and the first end of the first conductive element is electrically connected to the midpoint of the bridge arm of the half-bridge circuit through the module circuit board.

[0014] In one possible design, the second conductive portion is disposed within the module circuit board and is electrically connected to the first conductive portion and the third conductive portion, respectively.

[0015] In one possible design, the second conductive portion is disposed on the module circuit board and adjacent to the power chip; the second conductive portion is electrically connected to the first conductive portion and the third conductive portion respectively via a first conductive via and a second conductive via through the module circuit board; the projection of the first conductive element on the second plane is within the projection of the power chip.

[0016] In one possible design, an electronic component is also included;

[0017] The electronic device is adjacent to the magnetic core and is disposed below the module circuit board, and the projection of the electronic device on the second plane is within the projection of the power chip.

[0018] In one possible design, the power module further includes a third conductive element, which has the same structure as the second conductive element and is disposed on the other side of the first conductive element.

[0019] Secondly, this application provides a power module, comprising:

[0020] The magnetic core includes opposing first, second, third, and fourth sides, and a vertical channel extending from the first side to the second side;

[0021] A power chip, disposed on the third or fourth side of the magnetic core, and including at least two switches connected in a half-bridge circuit; and

[0022] A first conductive element and a second conductive element are present. The first conductive element passes through the channel, and its first end is electrically connected to the midpoint of the bridge arm of the half-bridge circuit via a transverse circuit. The second end of the first conductive element is electrically connected to a first connecting terminal. The second conductive element passes through the channel, and its two ends are electrically connected to a second connecting terminal and a third connecting terminal, respectively. The first connecting terminal, the second connecting terminal, and the third connecting terminal are disposed on the first side.

[0023] In one possible design, the second conductive element includes a first conductive portion, a second conductive portion, and a third conductive portion;

[0024] The first conductive portion extends through the channel, the second conductive portion is disposed on the second side of the magnetic core, and the third conductive portion is disposed on the side of the magnetic core opposite to the power chip.

[0025] In one possible design, an electronic component is also included, disposed below the power chip; and the magnetic core, the first conductive element, the second conductive element, the power chip, and the electronic component are embedded in an insulating encapsulant.

[0026] In one possible design, the width of the first conductive portion is the width of the channel, the width of the third conductive portion is equal to the width of the magnetic core, and the thickness of the third conductive portion is less than the thickness of the first conductive portion; the shape of the transverse circuit and the second conductive portion is trapezoidal.

[0027] Thirdly, this application provides a power supply system, including at least one power module, a load, and a system circuit board as described in either the first or second aspect;

[0028] The at least one power module supplies power to the load via the system circuit board.

[0029] In one possible design, the at least one power module includes a first power module, the first power module and the load being disposed on the same side above the system circuit board;

[0030] The first connection terminal of the first power module is electrically connected to the third connection terminal of the first power module through a first connection line disposed in the system circuit board, and the second connection terminal of the first power module is electrically connected to the load; the first output current supplies power to the load through the first conductive element, the first connection line, the second conductive element and the second connection terminal of the first power module.

[0031] In one possible design, the at least one power module includes a first power module and a second power module; wherein,

[0032] The first connection terminal of the first power module is electrically connected to the second connection terminal of the second power module via the system circuit board, and the first connection terminal of the second power module is electrically connected to the second connection terminal of the first power module via the system circuit board; or...

[0033] The first connection terminal of the first power module is electrically connected to the third connection terminal of the second power module through the system circuit board, and the first connection terminal of the second power module is electrically connected to the third connection terminal of the first power module through the system circuit board.

[0034] In one possible design, the first power module and the second power module are stacked on the upper and lower surfaces of the system circuit board, and the load is located on the same side of the system circuit board as the first power module or the second power module.

[0035] In one possible design, the first connection terminal, the second connection terminal, and the third connection terminal of the first power module overlap with the projections of the first connection terminal, the second connection terminal, and the third connection terminal of the second power module on the system circuit board.

[0036] The first connection terminal of the first power module is electrically connected to the second connection terminal of the second power module through a second connection line disposed in the system circuit board, and the third connection terminal of the second power module is electrically connected to the load; the second output current supplies power to the load through the first conductive element of the first power module, the second connection line, the second conductive element of the second power module, and the third connection terminal;

[0037] The first connection terminal of the second power module is electrically connected to the second connection terminal of the first power module through a third connection line disposed in the system circuit board, and the third connection terminal of the first power module is electrically connected to the load; the third output current supplies power to the load through the first conductive element of the second power module, the third connection line, the second conductive element of the first power module, and the third connection terminal.

[0038] In one possible design, the projections of the first connection terminal and the second connection terminal of the first power module and the second connection terminal and the first connection terminal of the second power module on the system circuit board overlap accordingly.

[0039] The first connection terminal of the first power module is electrically connected to the second connection terminal of the second power module through a fourth connection line disposed in the system circuit board, and the third connection terminal of the second power module is electrically connected to the load; the fourth output current supplies power to the load through the first conductive element of the first power module, the fourth connection line, the second conductive element of the second power module, and the third connection terminal;

[0040] The first connection terminal of the second power module is electrically connected to the second connection terminal of the first power module through a fifth connection line disposed in the system circuit board, and the third connection terminal of the first power module is electrically connected to the load; the fifth output current supplies power to the load through the first conductive element of the second power module, the fifth connection line, the second conductive element of the first power module, and the third connection terminal.

[0041] In one possible design, the first power module and the second power module are disposed on the same side above the system circuit board, and the third connection terminal of the first power module is adjacent to the third connection terminal of the second power module; the first power module and the second power module form a positively coupled connection relationship or an anti-coupled connection relationship; the load is disposed below the system circuit board.

[0042] In one possible design, the first power module and the second power module are arranged in parallel on the same side above the system circuit board, with the first power module and the second power module having the same orientation, and the load is adjacent to the third conductive portion of the first power module and the third conductive portion of the second power module.

[0043] In one possible design, the at least one power module includes a first power module, a second power module, and a third power module; the first power module, the second power module, and the third power module are laid flat on the first surface of the system circuit board; or the first power module and the second power module are disposed on the first surface of the system circuit board, and the third power module is disposed on the second surface of the system circuit board.

[0044] Each of the first power module, the second power module, and the third power module further includes a third conductive element. The third conductive element passes through the channel of its corresponding magnetic core. Both ends of each third conductive element are electrically connected to a fourth connection terminal and a fifth connection terminal, respectively. Each fourth connection terminal and each fifth connection terminal are disposed on the first side of the magnetic core.

[0045] The first power module, the second power module, and the third power module form a three-way anti-coupled connection; wherein, the first connection terminal of the first power module, the fourth connection terminal of the second power module, and the fourth connection terminal of the third power module are electrically connected through the system circuit board; the first connection terminal of the second power module, the fourth connection terminal of the first power module, and the second connection terminal of the third power module are electrically connected through the system circuit board; and the first connection terminal of the third power module, the second connection terminal of the first power module, and the second connection terminal of the second power module are electrically connected through the system circuit board.

[0046] This application provides a power module and a power system. The power system includes at least one power module, a load, and a system circuit board. The at least one power module includes a magnetic core, a power chip, a first conductive element, and a second conductive element. The magnetic core includes opposing first, second, third, and fourth sides, and a vertical channel extending from the first side to the second side. The power chip includes at least two switches connected to form a half-bridge circuit. It can be stacked on the second side of the magnetic core with the channel extending perpendicular to its main plane, or it can be disposed on the third or fourth side of the magnetic core. Both the first and second conductive elements extend through the channel. When the power chip is stacked on the second side of the magnetic core, the first and second ends of the first conductive element are electrically connected to the midpoint of the bridge arm of the half-bridge circuit and a first connection terminal, respectively. The two ends of the second conductive element are electrically connected to a second connection terminal and a third connection terminal, respectively. The first, second, and third connection terminals are disposed on the first side of the magnetic core. When the power chip is positioned on the third or fourth side of the magnetic core, the first end of the first conductive element is electrically connected to the midpoint of the bridge arm of the half-bridge circuit via a lateral circuit, and its second end is electrically connected to the first connection terminal. The two ends of the second conductive element are electrically connected to the second and third connection terminals, respectively. The first, second, and third connection terminals are positioned on the first side of the magnetic core. At least one power module provided in this application supplies power to the load via a system circuit board, enabling reverse coupling between multiple phases. Its integrated design effectively meets various requirements, including high power density, smaller size, fast dynamic response, multi-channel power supply, and low cost. Attached Figure Description

[0047] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0048] Figure 1 A cross-sectional view of a power module provided in an embodiment of this application;

[0049] Figure 2 A top view of a power module provided in an embodiment of this application;

[0050] Figure 3 A circuit diagram provided for an embodiment of this application;

[0051] Figure 4 A cross-sectional view of another power module provided in an embodiment of this application;

[0052] Figure 5 A cross-sectional view of another power module provided in an embodiment of this application;

[0053] Figure 6 A top view of another power module provided in an embodiment of this application;

[0054] Figure 7 A cross-sectional view of yet another power module provided in an embodiment of this application;

[0055] Figure 8 A top view of another power module provided in an embodiment of this application;

[0056] Figure 9 A cross-sectional view of a power supply system provided in an embodiment of this application;

[0057] Figure 10 A cross-sectional view of another power system provided in an embodiment of this application;

[0058] Figure 11 A top view of a power supply system provided in an embodiment of this application;

[0059] Figure 12 A cross-sectional view of another power supply system provided for implementation of this application;

[0060] Figure 13 A top view of another power system provided in an embodiment of this application;

[0061] Figure 14 A cross-sectional view of yet another power supply system provided in an embodiment of this application;

[0062] Figure 15 A cross-sectional view of yet another power supply system provided in an embodiment of this application;

[0063] Figure 16 A top view of another power supply system provided in an embodiment of this application;

[0064] Figure 17 A cross-sectional view of yet another power supply system provided in an embodiment of this application;

[0065] Figure 18 This is a cross-sectional view of another power supply system provided in an embodiment of this application. Detailed Implementation

[0066] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of methods and apparatus consistent with some aspects of this application as detailed in the appended claims.

[0067] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0068] To address the aforementioned problems in the prior art, this application provides a power module and a power system. The power system includes at least one power module, a system circuit board, and a load. The at least one power module includes a magnetic core, a power chip, a first conductive element, and a second conductive element. The magnetic core includes opposing first, second, third, and fourth sides, and a vertical channel extending from the first side to the second side. The power chip includes at least two switches connected to form a half-bridge circuit. The first and second conductive elements pass through the vertical channel. By placing the power chip on different sides of the magnetic core to form at least one power module with various layouts, the at least one power module can achieve reverse coupling between multiple phases. The integrated design can flexibly and uniformly accommodate various requirements such as high power density and smaller size, fast dynamic response and multi-channel power supply, and low cost, thereby supplying power to the load through the system circuit board.

[0069] Figure 1 This is a cross-sectional view of a power module provided in an embodiment of this application. Figure 2 This is a top view of a power module provided in an embodiment of this application. Figure 1 As shown, the power module provided in this embodiment includes: a magnetic core 1, a first conductive element 21, a second conductive element 22, and a power chip 3.

[0070] The magnetic core 1 includes opposing sides, such as opposing first and second sides, and opposing third and fourth sides. Additionally, the magnetic core 1 includes a vertical channel 11 extending from the first side to the second side.

[0071] The power chip 3 can be stacked on the second side of the magnetic core 1 and may include at least two switches connected in a half-bridge circuit. The half-bridge circuit is as follows: Figure 3 As shown, Figure 3 This is a circuit diagram provided for an embodiment of this application. Figure 3 In a half-bridge circuit, switching devices Q1 and Q2 are connected to form one half-bridge circuit, and Q3 and Q4 are connected to form another half-bridge circuit. SW represents the midpoint of the bridge arms of each half-bridge circuit. It should be noted that half-bridge circuits include, but are not limited to, those shown below. Figure 3 The circuit shown can also be a Boost circuit, a Buck / Boost circuit, etc. Figure 3 In the half-bridge circuit shown, Vo represents the positive output, Vin represents the positive input, Co represents the output capacitor, Cin represents the input capacitor, and GND represents the negative output.

[0072] The extension direction of channel 11 is perpendicular to the main plane of power chip 3, that is, the axis of the extension direction of channel 11 (e.g., Figure 1 The vertical lines in the middle or Figure 2The straight line perpendicular to the plane of the paper is perpendicular to the main plane of power chip 3. Power chip 3 can be any power device in the power module, such as a metal-oxide-semiconductor field-effect transistor (MOSFET) or a gallium nitride (GaN) switching device.

[0073] Both the first conductive element 21 and the second conductive element 22 pass through the channel 11. The first end of the first conductive element 21 is electrically connected to the midpoint SW of the bridge arm of the half-bridge circuit, and the second end of the first conductive element 21 is electrically connected to the first connecting terminal 61, making the length of the first conductive element 21 relatively short to improve efficiency. The first conductive element 21 can be configured as an I-shape or other shapes. The two ends of the second conductive element 22 are electrically connected to the second connecting terminal 62 and the third connecting terminal 63, respectively. The first connecting terminal 61, the second connecting terminal 62, and the third connecting terminal 63 are located on the first side of the magnetic core 1.

[0074] Optionally, refer to Figure 1 As shown, the second conductive element 22 includes a first conductive portion 22a, a second conductive portion 22b, and a third conductive portion 22c. The first conductive portion 22a, the second conductive portion 22b, and the third conductive portion 22c are electrically connected end-to-end to form a U-shaped second conductive element 22. Specifically, the first conductive portion 22a passes through the channel 11, the second conductive portion 22b is disposed on the second side of the magnetic core 1, and the third conductive portion 22c is disposed on the third and / or fourth side of the magnetic core 1. The third conductive portion 22c and the first conductive portion 22a can be parallel to the channel 11. The U-shaped second conductive element 22 can be made, for example, by stamping and bending a copper strip, or by connecting and splicing three conductive segments together. In actual operation, an insulating material can be provided between the first conductive element 21 and the second conductive element 22, or between the first conductive portion 22a of the second conductive element 22 and the first conductive portion 22a of the second conductive element 22.

[0075] Reference Figure 2 As shown, Figure 2 for Figure 1The attached figure shows a top view of the power module. For ease of display, the power chip 3 is shown as transparent. The width of the first conductive portion 22a is equal to or less than the width of the channel 11. The width of the third conductive portion 22c can be equal to or less than the width of the magnetic core 1. While maintaining comparable conductivity (i.e., approximately the same cross-sectional area), the thickness of the third conductive portion 22c is less than the thickness of the first conductive portion 22a, thus making the third conductive portion 22c thinner and reducing the footprint of the power module. Furthermore, the shape of the second conductive portion 22b can be trapezoidal, meaning the first conductive portion 22a can diffusely connect to the third conductive portion 22c. Alternatively, the shape of the second conductive portion 22b can be rectangular, electrically connecting the first conductive portion 22a and the third conductive portion 22c.

[0076] Optionally, continue to refer to Figure 1 As shown, the power module may further include a module circuit board 41. The module circuit board 41 can be disposed between the magnetic core 1 and the power chip 3, and the first end of the first conductive element 21 is electrically connected to the midpoint SW of the bridge arm of the half-bridge circuit through the module circuit board 41. The module circuit board 41 can be made of any material capable of supporting the power chip 3; for example, it can be a printed circuit board (PCB) or formed using insulating encapsulant.

[0077] Optionally, the second conductive portion 22b can be disposed on the module circuit board 41 and electrically connected to the first conductive portion 22a and the third conductive portion 22c respectively. For example, the first conductive portion 22a and the third conductive portion 22c can be electrically connected to the second conductive portion 22b respectively through conductive vias.

[0078] Figure 1 The power supply module shown can be used in practical applications to meet at least single-phase or two-phase coupled power supply requirements. However, to achieve coupling between more phase power supply modules to meet multi-phase power supply requirements, in... Figure 1 On this basis, Figure 4 A cross-sectional view of another power module provided in an embodiment of this application. (Refer to...) Figure 4 As shown, the power module may further include a third conductive element 23, which has the same structure as the second conductive element 22, for example, both being U-shaped structures, including a first conductive portion 23a, a second conductive portion 23b, and a third conductive portion 23c. The two ends of the third conductive element 23 are electrically connected to the fourth connecting terminal 64 and the fifth connecting terminal 65, respectively. The third conductive element 23 is located on the other side of the first conductive element 21, meaning the third conductive element 23 and the second conductive element 22 are located on opposite sides of the first conductive element 21. Similarly, the third conductive element 23 can be made by stamping and bending copper strips, or it can be formed by connecting and splicing three conductive segments together. It should be noted that... Figure 4 The other structures besides the third conductive element 23 are similar to Figure 1 The corresponding structure is similar to that in [the text], so it will not be described in detail here.

[0079] exist Figure 1 or Figure 4 In the power module shown, the power chip 3 and the magnetic core 1 can be stacked. That is, the power chip 3 and the magnetic core 1 are stacked on the upper and lower sides of the module circuit board 41. The projection of the first end of the first conductive element 21 on the module circuit board 41 overlaps with the projection of the output terminal of the power chip 3 on the module circuit board 41. This allows the SW point of the half-bridge circuit formed by the power chip 3 to be directly connected to the first conductive element 21. The first conductive element 21 passes vertically downward through the channel 11 of the magnetic core 1 and connects to the first connection terminal 61 below. The short length of the first conductive element helps reduce impedance and improve efficiency. Furthermore, the stacked arrangement of the device chip and inductor results in a simple structure, further reducing thermal resistance and facilitating heat dissipation from the power module using a surface-mount heat sink.

[0080] In some embodiments, the power chip 3 and the magnetic core 1 can also be stacked in a staggered manner. Optionally, in Figure 1 On this basis, Figure 5 This is a cross-sectional view of another power module provided in an embodiment of this application. Figure 6 This is a top view of another power module provided in an embodiment of this application. Figure 6 for Figure 5 The top view of the power module shown. Figure 5 The image only shows the corresponding view when the power module includes the first conductive element 21 and the second conductive element 22.

[0081] like Figure 5 As shown, the second conductive portion 22b of the second conductive element 22 is disposed on the module circuit board 41 and adjacent to the power magnetic core 3, that is, the second conductive portion 22b and the power magnetic core 3 are located on the same side of the module circuit board 41 or the magnetic core. The second conductive portion 22b is electrically connected to the first conductive portion 22a and the third conductive portion 22c respectively through the first conductive via 221 and the second conductive via 222 penetrating the module circuit board 41, thereby forming a complete U-shaped second conductive element 22. The projection of the first conductive element 21 on the second plane is within the projection of the power chip 3. The second plane can be understood as the plane in the horizontal direction of the module circuit board 41.

[0082] Figure 5 The structure of the power module shown can be more conducive to its manufacturing. For example, to make better use of space, other electronic components such as capacitors or resistors can be placed below the module circuit board 41; that is, the power module can also include an electronic component 39. Figure 5As shown, electronic device 39 is adjacent to magnetic core 1 and is disposed below module circuit board 41. Furthermore, the projection of electronic device 39 on the second plane is within the projection of power chip 3. In other words, the projection of power chip 3 on the second plane can cover the projection of electronic device 39 on the second plane, thereby achieving better space utilization.

[0083] Optionally, the above Figure 1 and Figure 5 The power module shown may also include a peripheral connection terminal 69. This peripheral connection terminal 69 can be located on the third, fourth, fifth, or sixth side of the magnetic core 1. For example, when the third conductive portion 22c of the second conductive element 22 is located on the third side of the magnetic core 1, the peripheral connection terminal 69 is located on the fourth side of the magnetic core 1. Conversely, when the third conductive portion 22c of the second conductive element 22 is located on the fourth side of the magnetic core 1, the peripheral connection terminal 69 is located on the third side of the magnetic core 1. Figure 1 and Figure 5 The third conductive portion 22c of the second conductive element 22 is disposed on the fourth side of the magnetic core 1, and the external connection terminal 69 is disposed on the third side of the magnetic core 1.

[0084] The power module provided in the above embodiments includes a magnetic core, a power chip, and a first conductive element and a second conductive element. The magnetic core includes a first side, a second side, a third side, and a fourth side, and a vertical channel extending from the first side to the second side. The power chip can be stacked on the second side of the magnetic core and includes at least two switches connected to form a half-bridge circuit. The extension direction of the channel is perpendicular to the main plane of the power chip. The first conductive element and the second conductive element pass through the channel. The first end and the second end of the first conductive element are electrically connected to the midpoint of the bridge arm of the half-bridge circuit and the first connection terminal, respectively. The two ends of the second conductive element are electrically connected to the second connection terminal and the third connection terminal, respectively. The first connection terminal, the second connection terminal, and the third connection terminal are disposed on the first side of the magnetic core. The integrated design of the various structures in the power module allows the manufactured power module to uniformly and flexibly meet multiple requirements such as high power density and smaller size, fast dynamic response and multi-channel power supply, and low cost.

[0085] Figure 7 This is a cross-sectional view of yet another power module provided in an embodiment of this application. Figure 8 A top view of another power module provided in an embodiment of this application, wherein, Figure 8 for Figure 7 A top view of the power module shown. Figure 7 As shown, the power module includes: a magnetic core 1, a first conductive element 21, a second conductive element 22, and a power chip 3.

[0086] The magnetic core 1 includes opposing sides, such as opposing first and second sides, and opposing third and fourth sides. Additionally, the magnetic core 1 includes a vertical channel 11 extending from the first side to the second side.

[0087] Power chip 3 is located on the third or fourth side of magnetic core 1. Figure 7 The medium-power chip 3 is located on the third side of the magnetic core 1, and also includes at least two switches connected to form a half-bridge circuit. The half-bridge circuit can be as follows: Figure 3 As shown, SW is the midpoint of the bridge arm of the half-bridge circuit. The half-bridge circuit includes, but is not limited to, the following: Figure 3 The circuit shown.

[0088] Both the first conductive element 21 and the second conductive element 22 pass through the channel 11. The first end of the first conductive element 21 is electrically connected to the midpoint SW of the bridge arm of the half-bridge circuit via the transverse circuit 5, and the second end of the first conductive element 21 is electrically connected to the first connection terminal 61. Figure 7 In the illustrated embodiment, the output terminal of the power chip 3 can be positioned facing upwards, unlike... Figure 1 The output terminal is positioned with one side facing downwards to facilitate easier connection of the first conductive element 21 to the midpoint SW of the bridge arm. It should be noted that the first conductive element 21 and the transverse circuit 5 can be considered as the first and second conductive portions of the first conductive element 21, i.e., the first conductive element 21 can be considered L-shaped. The first conductive element 21 and the transverse circuit 5 can be manufactured by stamping and bending copper strips, or by connecting and splicing two conductive segments together. The transverse circuit 5 can also be a conductive line in a circuit board. The shape of the transverse circuit 5 can be trapezoidal, i.e., it can be connected to the power chip 3 in a diffused manner; of course, the shape of the transverse circuit 5 can also be rectangular.

[0089] Furthermore, the two ends of the second conductive element 22 are electrically connected to the second connecting terminal 62 and the third connecting terminal 63, respectively. The first connecting terminal 61, the second connecting terminal 62, and the third connecting terminal 63 are disposed on the first side of the magnetic core 1. Optionally, referring to... Figure 7 As shown, the second conductive element 22 includes a first conductive portion 22a, a second conductive portion 22b, and a third conductive portion 22c. The first conductive portion 22a passes through the channel 11, the second conductive portion 22b is disposed on the second side of the magnetic core 1, and the third conductive portion 22c is disposed on the side of the magnetic core 1 opposite to the power chip 3.

[0090] Combination Figure 7 and Figure 8As shown, the width of the first conductive portion 22a is the width of the channel 11, the width of the third conductive portion 22c is equal to the width of the magnetic core 1, and the thickness of the third conductive portion 22c is less than the thickness of the first conductive portion 22a. The second conductive portion 22b is trapezoidal in shape, meaning that the first conductive portion 22a can be connected to the third conductive portion 22c in a diffused manner. Additionally, the power module may also include a peripheral connection terminal 69. This peripheral connection terminal 69 can be located on the other side of the power chip 3 opposite to the magnetic core 1.

[0091] Continue to refer to Figure 7 As shown, in order to make reasonable use of space, both the magnetic core 1 and the power chip 3 can be embedded within the insulating encapsulation material 51. In other words, the projection of the insulating encapsulation material 51 can cover both the magnetic core 1 and the power chip 3.

[0092] Optionally, to further optimize space utilization and improve power density, efficiency, and dynamic performance, the power module may also include other electronic components such as capacitors and resistors. (See reference...) Figure 7 As shown, the power module may also include electronic components 39. For example, the electronic components 39 can be positioned below the power chip 3. Furthermore, the magnetic core 1, the first conductive element 21, the second conductive element 22, the power chip 3, and the electronic components 39 can all be embedded in the insulating encapsulant 51, which not only improves the reliability of the power module but also provides advantages such as a neat appearance. Moreover, encapsulating the various structures of the power module within the insulating encapsulant facilitates the formation of conductive lines.

[0093] The power module provided in the above embodiments includes a magnetic core, a power chip, and a first conductive element and a second conductive element. The magnetic core includes opposing first, second, third, and fourth sides, and a vertical channel extending from the first side to the second side. The power chip is disposed on the third or fourth side of the magnetic core and includes at least two switches connected to form a half-bridge circuit. The first and second conductive elements pass through the channel. The first end of the first conductive element is electrically connected to the midpoint of the bridge arm of the half-bridge circuit via a transverse circuit, while the second end of the first conductive element is electrically connected to a first connection terminal. The two ends of the second conductive element are respectively electrically connected to a second connection terminal and a third connection terminal. The first, second, and third connection terminals are disposed on the first side of the magnetic core. The integrated design of the various structures in the power module allows the manufactured power module to uniformly and flexibly meet multiple requirements such as high power density and smaller size, fast dynamic response and multi-channel power supply, and low cost.

[0094] Based on the power modules provided in the above embodiments, this application also provides a power system, which may include at least one power module, a load, and a system circuit board provided in the above embodiments. The at least one power module can supply power to the load via the system circuit board. The load can be any component that needs power, such as intelligent processors like CPUs (Central Processing Units), GPUs (Graphics Processing Units), and TPUs (Tensor Processing Units), or intelligent accelerator cards. For example, an intelligent accelerator card using OAM packaging. OAM refers to the intelligent accelerator card module OAM (OCP Accelerator Module, defined by the Open Computer Project) industry standard, namely the OCP Accelerator Module Design Specification.

[0095] Figure 9 This is a cross-sectional view of a power supply system provided in an embodiment of this application. Figure 9 As shown, the power system provided in this application embodiment includes at least one power module, a load 9, and a system circuit board 46. The at least one power module may include a first power module 81. For example, the first power module 81 and the load 9 may be disposed on the same side above the system circuit board 46.

[0096] The first connection terminal 611 of the first power module 81 is electrically connected to the third connection terminal 631 of the first power module 81 via the first connection line 291 disposed in the system circuit board 46. The second connection terminal 621 of the first power module 81 is electrically connected to the load 9 via the system circuit board 46, for example, the second connection terminal 621 is electrically connected to the positive power input terminal of the load 9 via the system circuit board 46. This allows the current generated by the power module, i.e., the first output current, to flow through the first conductive element 211, the first connection line 291, the second conductive element 221, and the second connection terminal 621 of the first power module 81 to supply power to the load 9 (e.g., ...). Figure 9 (As shown by the arrow in the image). The first output current can be transmitted through the output positive terminal V. O Power is supplied to load 9. It is understood that the positive output V... O It is electrically connected to the positive terminal of the power output of load 9.

[0097] It should also be noted that Figure 9 The first power module 81 in Figure 1The power module shown is an example. The first power module 81 can also be any other power module in the foregoing embodiments, which will not be described in detail here. Figure 9 The electronic components 39 can be set in the corresponding positions according to the specific structural layout of the first power module 81 in the actual working conditions, and the number of electronic components 39 is also determined by the actual working conditions.

[0098] In this embodiment, the first conductive element and the second conductive element of the first power module are connected in series through the first connection line in the system circuit board. This increases the number of turns in the winding of the inductor formed by the magnetic core, the first conductive element, and the second conductive element, thereby increasing the inductance and improving the efficiency of the power module. Furthermore, the power system provided in this embodiment also allows the power module to independently power a small-power circuit of the load, enhancing the flexibility of the power module's application.

[0099] Figure 9 The power system shown includes at least one power module, namely a first power module 81. In some embodiments, the at least one power module may include a first power module 81 and a second power module 82. The first power module 81 and the second power module 82 can form different coupled power supply devices by different arrangements on the system circuit board 46. For example, the first power module 81 and the second power module 82, or more power modules, can be stacked vertically or laid flat on the system circuit board 46.

[0100] Figure 10 A cross-sectional view of another power system provided in an embodiment of this application. (See attached image.) Figure 10 As shown, the power system provided in this embodiment includes at least one power module, a load 9, and a system circuit board 46. The at least one power module may include a first power module 81 and a second power module 82. For example, the first power module 81 and the second power module 82 may be stacked on the upper and lower surfaces of the system circuit board 46, and the load 9 may be located on the same side of the system circuit board 46 as the first power module 81 or the second power module 82. Figure 10 The example shown is that the load 9 and the first power module 81 are located on the same side of the upper surface of the system circuit board 46.

[0101] The first connection terminal 611 of the first power module 81 is electrically connected to the second connection terminal 622 of the second power module 82 through the system circuit board 46, and the first connection terminal 612 of the second power module 82 is electrically connected to the second connection terminal 621 of the first power module 81 through the system circuit board 46.

[0102] Reference Figure 10As shown, the projections of the first connection terminals 611, 621, and 631 of the first power module 81 and the first connection terminals 612, 622, and 632 of the second power module 82 on the system circuit board 46 can overlap. In other words, Figure 10 The first power module 81 and the second power module 82 in the system can have the same structure and be stacked symmetrically on the upper and lower surfaces of the system circuit board 46.

[0103] Specifically, the first connection terminal 611 of the first power module 81 is electrically connected to the second connection terminal 622 of the second power module 82 via the second connection line 292 disposed in the system circuit board 46, and the third connection terminal 632 of the second power module 82 is electrically connected to the load 9. Therefore, the output current of the first power module 81, i.e., the second output current, can be output via the first conductive element 211 of the first power module 81, the second connection line 292, the second conductive element 222 of the second power module 82, and the third connection terminal 632 to power the load 9.

[0104] Correspondingly, the first connection terminal 612 of the second power module 82 is electrically connected to the second connection terminal 621 of the first power module 81 via the third connection line 293 disposed in the system circuit board 46, and the third connection terminal 631 of the first power module 81 is electrically connected to the load 9. This allows the output current of the second power module 82, i.e., the third output current, to be output via the first conductive element 212 of the second power module 82, the third connection line 293, the second conductive element 221 of the first power module 81, and the third connection terminal 631 to power the load 9. Optionally, the second and third output currents can be used as the positive output V of the power supply system via a short-circuited conductive line in the system circuit board 46. o To supply power to load 9.

[0105] As can be seen from the above description, Figure 10 The layout of the power supply system shown creates an anti-coupling relationship between the two phases of the first and second power supply modules, thereby improving the dynamic performance of the power supply system. Furthermore, referring to... Figure 10 and Figure 11 It can be seen that the first power module and the second power module are equidistant from the load, and this distance is based on... Figure 11 L in a express, Figure 11 This is a top view of a power supply system provided in an embodiment of this application. Figure 11 It shows Figure 10 The distance relationship between the first and second power modules and the load. Therefore, as... Figure 10The layout shown allows the output impedances of the first and second power modules to be consistent and balanced, which helps to improve the output stability of the power modules and further increase the output power.

[0106] exist Figure 10 On this basis, Figure 12 A cross-sectional view of another power supply system provided for implementation of this application. Figure 13 This is a top view of another power system provided in an embodiment of this application. Figure 13 It shows Figure 12 The distance relationship between the power module and the load in the power system shown is illustrated. (Refer to...) Figure 12 and Figure 13 As shown, the power system provided in this application embodiment includes at least one power module, a load 9, and a system circuit board 46. The at least one power module may include a first power module 81 and a second power module 82.

[0107] The first connection terminal 611 of the first power module 81 is electrically connected to the second connection terminal 622 of the second power module 82 through the system circuit board 46, and the first connection terminal 612 of the second power module 82 is electrically connected to the second connection terminal 621 of the first power module 81 through the system circuit board 46.

[0108] For example, the first power module 81 and the second power module 82 can be stacked on the upper and lower surfaces of the system circuit board 46, respectively, and the load 9 can be located on the same side of the system circuit board 46 as the first power module 81 or the second power module 82. Figure 12 Load 9 is not shown. (Refer to...) Figure 12 and Figure 13 As can be seen, for example, the first power module 81 and the second power module 82 can be arranged side by side with the load 9, so that the fourth output current and the fifth output current can respectively pass through the output positive terminal V o1 and V o2 It supplies power to load 9 and outputs positive V. o1 and V o2 Distance L a1 They can be equal to maintain the balance of the output impedances of the two power supply modules, ensuring output stability and current output capability.

[0109] Reference Figure 12 As shown, the projections of the first connection terminal 611 and the second connection terminal 621 of the first power module 81 onto the system circuit board 46 correspond and overlap with those of the second connection terminal 622 and the first connection terminal 612 of the second power module 82. In other words, Figure 12 The first power module 81 and the second power module 82 have the same structure, but are different. Figure 10The two power modules are stacked symmetrically on the upper and lower surfaces of the system circuit board 46, with the order reversed.

[0110] Specifically, the first connection terminal 611 of the first power module 81 is electrically connected to the second connection terminal 622 of the second power module 82 via the fourth connection line 294 disposed in the system circuit board 46, and the third connection terminal 632 of the second power module 82 is electrically connected to the load 9, thereby enabling the output current of the first power module 81, i.e., the fourth output current, to supply power to the load 9 via the first conductive element 211 of the first power module 81, the fourth connection line 294, the second conductive element 222 of the second power module 82, and the third connection terminal 632 (e.g., Figure 10 and Figure 12 (As indicated by the middle arrow), that is, the fourth output current can pass through the output positive terminal V. o1 Power is supplied to load 9.

[0111] Accordingly, the first connection terminal 612 of the second power module 82 is electrically connected to the second connection terminal 621 of the first power module 81 via the fifth connection line 295 disposed in the system circuit board 46, and the third connection terminal 631 of the first power module 81 is electrically connected to the load 9, thereby enabling the output current of the second power module 82, i.e., the fifth output current, to supply power to the load 9 via the first conductive element 212 of the second power module 82, the fifth connection line 295, the second conductive element 221 of the first power module 81, and the third connection terminal 631 (e.g., Figure 10 and Figure 12 (As indicated by the middle arrow), that is, the fifth output current can pass through the output positive terminal V. o2 Power is supplied to load 9.

[0112] It is understandable that the fourth connection line 294 and the fifth connection line 295 can be vertical lines. In actual operation, conductive vias can be used to pass through the system circuit board 46 vertically to form a connection circuit. The first power module 81 and the second power module 82 are located at... Figure 12 The layout method in and its Figure 10 Compared to the layout method in the middle, Figure 12 The fourth connection line 294 and the fifth connection line 295 can be vertically routed in the system circuit board 46, while Figure 10 The second connection line 292 and the third connection line 293 are cross-wired in the system circuit board 46. Therefore, Figure 12 The layout of the power module shown makes the connection lines shorter and the wiring easier to manufacture, which is beneficial for practical applications and improves power supply efficiency.

[0113] Figure 10 and Figure 12The description covers the stacking of the first power module 81 and the second power module 82 on the system circuit board 46. Optionally, the first power module 81 and the second power module 82 can also be tiled on the system circuit board 46. Figure 14 and Figure 15 These are cross-sectional views of yet another power supply system provided in the embodiments of this application. Figure 14 and Figure 15 As shown, the power system provided in this application embodiment includes at least one power module, a load 9, and a system circuit board 46. The at least one power module may include a first power module 81 and a second power module 82, and the first power module 81 and the second power module 82 are both disposed on the same side surface of the system circuit board 46.

[0114] Reference Figure 14 The first power module 81 and the second power module are laid flat on the system circuit board 46, which can be described as follows: the first connection terminal 611 of the first power module 81 is electrically connected to the third connection terminal 632 of the second power module 82 through the system circuit board 46, and the first connection terminal 612 of the second power module 82 is electrically connected to the third connection terminal 631 of the first power module 81 through the system circuit board 46.

[0115] Specific reference Figure 14 As shown, a multi-phase positive coupling connection can be formed between the first power module 81 and the second power module 82. For example, the first power module 81 and the second power module 82 are disposed on the same side above the system circuit board 46, and the third connection terminal 631 of the first power module 81 is adjacent to the third connection terminal 632 of the second power module 82, thereby forming a multi-phase positive coupling connection between the first power module 81 and the second power module 82. Figure 14 The positive coupling connection shown by the arrow on the system circuit board 46 enables the load 9 to be powered by a multi-phase positive coupling power supply. The load 9 can be positioned below the system circuit board 46 (the load 9 is located on...). Figure 14 (Not shown in the image) The second connection terminal 621 of the first power module 81 and the second connection terminal 622 of the second power module 82 are connected to the load 9 to supply power to the load 9.

[0116] Reference Figure 15 The first power module 81 and the second power module 82 are laid flat on the system circuit board 46, which can be described as follows: the first connection terminal 611 of the first power module 81 is electrically connected to the second connection terminal 622 of the second power module 82 through the system circuit board 46, and the first connection terminal 612 of the second power module 82 is electrically connected to the second connection terminal 621 of the first power module 81 through the system circuit board 46.

[0117] Specific reference Figure 15As shown, a multi-phase anti-coupling connection can be formed between the first power module 81 and the second power module 82. For example, the first power module 81 and the second power module 82 are disposed on the same side above the system circuit board 46, and the third connection terminal 631 of the first power module 81 is adjacent to the third connection terminal 632 of the second power module 82, thereby forming a multi-phase anti-coupling connection between the first power module 81 and the second power module 82. Figure 15 The anti-coupling connection shown by the arrow on the system circuit board 46 enables the load 9 to be powered by multiple anti-coupling power supplies. The load 9 can be positioned below the system circuit board 46, for example, with the projection of the load 9 onto the system circuit board 46 coinciding with that of the first power module 81 or the second power module 82. This allows for vertical power supply, resulting in shorter power supply lines and improved efficiency and dynamic performance.

[0118] The power system provided in the above embodiments can form positively coupled or anti-coupled connections by arranging the first and second power modules on the system circuit board in different ways to meet different power supply requirements, thus providing high flexibility. Furthermore, by arranging different conductive lines on the system circuit board, the structure of the power modules can be simplified, thereby reducing the height of the power modules and increasing power density. In actual operation, multiple small power modules can be flexibly combined on the system circuit board to form a multi-phase coupled power supply, facilitating flexible arrangement. The load is placed below the system circuit board to shorten its distance from the power modules, reducing current transmission paths, lowering transmission losses, and improving efficiency. In practical research and development, due to the simple structure, each power module can also be single-phase, which is more conducive to the refined development of each power module, thereby improving the development speed and competitiveness of the power modules.

[0119] Optionally, in Figure 14 and Figure 15 Based on this, the first power module 81 and the second power module 82 can also be arranged flatly on the system circuit board 46 as follows: Figure 16 As shown. Figure 16 This is a top view of another power supply system provided in an embodiment of this application. (See attached image.) Figure 16As shown, the first power module 81 and the second power module 82 can be arranged in parallel on the same side of the system circuit board 46, with the first power module 81 and the second power module 82 facing the same direction. The load 9 is adjacent to the third conductive portion of the first power module 81 and the third conductive portion of the second power module 82. This makes the interconnection lines between the first and second connection terminals of the first power module 81 and the second and first connection terminals of the second power module 82 via the conductive lines of the system circuit board 46 more balanced and shorter overall. The consistency of the distances between the first and second power modules 81 and the load 9 is also better, which is more conducive to reducing transmission loss.

[0120] Figures 10 to 16 The diagram illustrates the layout when at least one power module in a power system comprises two power modules. However, it should be noted that... Figures 10 to 16 The power module in the at least one power module is shown only schematically. Figure 1 The diagram shows the corresponding power module. At least one power module can be any of the power modules described in the foregoing embodiments.

[0121] Optionally, at least one power module in the power system may also include three power modules. Figure 17 and Figure 18 This is a cross-sectional view of yet another power supply system provided in an embodiment of this application. (See attached image.) Figure 17 and Figure 18 As shown, the power system provided in this application embodiment includes at least one power module, a load, and a system circuit board 46. The at least one power module may include a first power module 81, a second power module 82, and a third power module 83.

[0122] The first power module 81, the second power module 82, and the third power module 83 can be laid flat on the first surface of the system circuit board 46 (e.g., Figure 17 (as shown), or, the first power module 81 and the second power module 82 can be disposed on the first surface of the system circuit board 46, while the third power module 83 is disposed on the second surface of the system circuit board 46 (as shown). Figure 18 (As shown).

[0123] Based on the first power module and the second power module in the power systems provided in the foregoing embodiments, the embodiments of this application... Figure 17 and Figure 18Each of the first power module 81, the second power module 82, and the third power module 83 shown includes a third conductive element. Each third conductive element passes through a channel in its corresponding magnetic core, and both ends of each third conductive element are electrically connected to a fourth connection terminal and a fifth connection terminal, respectively. Each fourth connection terminal and each fifth connection terminal are located on the first side of the magnetic core. For example, refer to... Figure 17 and Figure 18 As shown, the first power module 81 includes a third conductive element 231, the two ends of which are electrically connected to its fourth connection terminal 641 and fifth connection electronic element 651, respectively; the second power module 82 includes a third conductive element 232, the two ends of which are electrically connected to its fourth connection terminal 642 and fifth connection electronic element 652, respectively; the third power module 83 includes a third conductive element 233, the two ends of which are electrically connected to its fourth connection terminal 643 and fifth connection electronic element 653, respectively. It should be noted that other corresponding structures in the first power module 81, second power module 82, and third power module 83 can be referred to the detailed description in the aforementioned power module embodiments, and will not be repeated here.

[0124] Reference Figure 17 and Figure 18 As shown, the first power module 81, the second power module 82, and the third power module 83 can form a three-way anti-coupled connection. The first connection terminal 611 of the first power module 81, the fourth connection terminal 642 of the second power module 82, and the fourth connection terminal 643 of the third power module 83 are electrically connected via the system circuit board 46, so that the output current of the first power module 81 supplies power to the load (if the load is not in operation) through the fifth connection terminal 652 of the second power module 82 and the fifth connection terminal 653 of the third power module 83. Figure 17 and Figure 18 (As shown in the diagram); the first connection terminal 612 of the second power module 82, the fourth connection terminal 641 of the first power module 81, and the second connection terminal 623 of the third power module 82 are electrically connected through the system circuit board 46, so that the output current of the second power module 82 supplies power to the load through the fifth connection terminal 651 of the first power module 81 and the third connection terminal 633 of the third power module 83 (the load is not in the circuit). Figure 17 and Figure 18 (as shown in the diagram); the first connection terminal 613 of the third power module 83, the second connection terminal 621 of the first power module 81, and the second connection terminal 622 of the second power module 82 are electrically connected through the system circuit board 46, so that the output current of the third power module 83 supplies power to the load through the third connection terminal 631 of the first power module 81 and the third connection terminal 632 of the second power module 83 (the load is not in the circuit). Figure 17 and Figure 18 (as shown in the image).

[0125] The power system provided in the above embodiments includes at least three power modules. By arranging these three power modules in a three-way anti-coupling connection, a three-way anti-coupling power supply method can be used to power the load. Increasing the number of anti-coupling connections is beneficial for reducing system losses and improving system dynamics. It also reduces the number of electronic components in the power modules, such as capacitors. Fewer capacitors reduce costs and the space occupied by the system circuit board. Furthermore, in the formed three-way anti-coupling connection, different layouts of the power modules can result in different paths for the output current to be input to the load, thus leading to different connection lines for the output current on the system circuit board. For example… Figure 18 The layout of the power modules in the power system shown allows the path for the output current to be input to the load to be significantly shorter than... Figure 17 The path of the output current in the power supply system shown can reduce line connection losses and thus improve power supply efficiency.

[0126] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the claims.

[0127] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A power module, characterized in that, include: The magnetic core includes opposing first, second, third, and fourth sides, and a vertical channel extending from the first side to the second side. A power chip, stacked on the second side, includes at least two switches connected to form a half-bridge circuit, the extension direction of the channel being perpendicular to the main plane of the power chip; as well as A first conductive element and a second conductive element are present. The first conductive element extends through the channel, and its first end is electrically connected to the midpoint of the bridge arm of the half-bridge circuit. The second end of the first conductive element is electrically connected to a first connecting terminal. The second conductive element extends through the channel, and its two ends are electrically connected to a second connecting terminal and a third connecting terminal, respectively. The first connecting terminal, the second connecting terminal, and the third connecting terminal are disposed on the first side.

2. The power module according to claim 1, characterized in that, The second conductive element includes a first conductive portion, a second conductive portion, and a third conductive portion; The first conductive portion extends through the channel, the second conductive portion is disposed on the second side of the magnetic core, and the third conductive portion is disposed on the third or fourth side of the magnetic core, parallel to the channel with the first conductive portion.

3. The power module according to claim 2, characterized in that, The width of the first conductive portion is the width of the channel, the width of the third conductive portion is equal to the width of the magnetic core, and the thickness of the third conductive portion is less than the thickness of the first conductive portion; the shape of the second conductive portion is trapezoidal.

4. The power module according to claim 2, characterized in that, It also includes a module circuit board; the module circuit board is disposed between the magnetic core and the power chip, and the first end of the first conductive element is electrically connected to the midpoint of the bridge arm of the half-bridge circuit through the module circuit board.

5. The power module according to claim 4, characterized in that, The second conductive portion is disposed in the module circuit board and is electrically connected to the first conductive portion and the third conductive portion respectively.

6. The power module according to claim 4, characterized in that, The second conductive portion is disposed on the module circuit board and adjacent to the power chip; the second conductive portion is electrically connected to the first conductive portion and the third conductive portion respectively via a first conductive via and a second conductive via penetrating the module circuit board; the projection of the first conductive element on the second plane is within the projection of the power chip.

7. The power module according to claim 6, characterized in that, It also includes an electronic device; the electronic device is adjacent to the magnetic core and is disposed below the module circuit board, and the projection of the electronic device on the second plane is within the projection of the power chip.

8. The power module according to claim 2, characterized in that, The power module further includes a third conductive element, which has the same structure as the second conductive element and is disposed on the other side of the first conductive element.

9. A power supply module, characterized in that, include: The magnetic core includes opposing first, second, third, and fourth sides, and a vertical channel extending from the first side to the second side; A power chip is disposed on the third or fourth side of the magnetic core and includes at least two switches connected in a half-bridge circuit. as well as A first conductive element and a second conductive element are present. The first conductive element passes through the channel, and its first end is electrically connected to the midpoint of the bridge arm of the half-bridge circuit via a transverse circuit. The second end of the first conductive element is electrically connected to a first connecting terminal. The second conductive element passes through the channel, and its two ends are electrically connected to a second connecting terminal and a third connecting terminal, respectively. The first connecting terminal, the second connecting terminal, and the third connecting terminal are disposed on the first side.

10. The power module according to claim 9, characterized in that, The second conductive element includes a first conductive portion, a second conductive portion, and a third conductive portion; The first conductive portion extends through the channel, the second conductive portion is disposed on the second side of the magnetic core, and the third conductive portion is disposed on the side of the magnetic core opposite to the power chip.

11. The power module according to claim 10, characterized in that, It also includes an electronic device disposed below the power chip; and the magnetic core, the first conductive element, the second conductive element, the power chip, and the electronic device are embedded in an insulating encapsulant.

12. The power module according to claim 10, characterized in that, The width of the first conductive portion is the width of the channel, the width of the third conductive portion is equal to the width of the magnetic core, and the thickness of the third conductive portion is less than the thickness of the first conductive portion; the shape of the transverse circuit and the second conductive portion is trapezoidal.

13. A power supply system, characterized in that, Includes at least one power module, load, and system circuit board as described in any one of claims 1-12; The at least one power module supplies power to the load via the system circuit board.

14. The power supply system according to claim 13, characterized in that, The at least one power module includes a first power module, and the first power module and the load are disposed on the same side above the system circuit board. The first connection terminal of the first power module is electrically connected to the third connection terminal of the first power module through a first connection line disposed in the system circuit board, and the second connection terminal of the first power module is electrically connected to the load; the first output current supplies power to the load through the first conductive element, the first connection line, the second conductive element and the second connection terminal of the first power module.

15. The power supply system according to claim 13, characterized in that, The at least one power module includes a first power module and a second power module; wherein... The first connection terminal of the first power module is electrically connected to the second connection terminal of the second power module via the system circuit board, and the first connection terminal of the second power module is electrically connected to the second connection terminal of the first power module via the system circuit board; or... The first connection terminal of the first power module is electrically connected to the third connection terminal of the second power module through the system circuit board, and the first connection terminal of the second power module is electrically connected to the third connection terminal of the first power module through the system circuit board.

16. The power supply system according to claim 15, characterized in that, The first power module and the second power module are stacked on the upper and lower surfaces of the system circuit board, and the load is located on the same side of the system circuit board as the first power module or the second power module.

17. The power supply system according to claim 16, characterized in that, The projections of the first connection terminal, the second connection terminal, and the third connection terminal of the first power module on the system circuit board overlap with the projections of the first connection terminal, the second connection terminal, and the third connection terminal of the second power module. The first connection terminal of the first power module is electrically connected to the second connection terminal of the second power module through a second connection line disposed in the system circuit board, and the third connection terminal of the second power module is electrically connected to the load; the second output current supplies power to the load through the first conductive element of the first power module, the second connection line, the second conductive element of the second power module, and the third connection terminal; The first connection terminal of the second power module is electrically connected to the second connection terminal of the first power module through a third connection line disposed in the system circuit board, and the third connection terminal of the first power module is electrically connected to the load; the third output current supplies power to the load through the first conductive element of the second power module, the third connection line, the second conductive element of the first power module, and the third connection terminal.

18. The power supply system according to claim 16, characterized in that, The projections of the first connection terminal and the second connection terminal of the first power module and the second connection terminal and the first connection terminal of the second power module on the system circuit board overlap accordingly. The first connection terminal of the first power module is electrically connected to the second connection terminal of the second power module through a fourth connection line disposed in the system circuit board, and the third connection terminal of the second power module is electrically connected to the load; the fourth output current supplies power to the load through the first conductive element of the first power module, the fourth connection line, the second conductive element of the second power module, and the third connection terminal; The first connection terminal of the second power module is electrically connected to the second connection terminal of the first power module through a fifth connection line disposed in the system circuit board, and the third connection terminal of the first power module is electrically connected to the load; the fifth output current supplies power to the load through the first conductive element of the second power module, the fifth connection line, the second conductive element of the first power module, and the third connection terminal.

19. The power supply system according to claim 15, characterized in that, The first power module and the second power module are disposed on the same side above the system circuit board, and the third connection terminal of the first power module is adjacent to the third connection terminal of the second power module; the first power module and the second power module form a positive coupling connection or an anti-coupling connection; the load is disposed below the system circuit board.

20. The power supply system according to claim 15, characterized in that, The first power module and the second power module are arranged in parallel on the same side above the system circuit board. The first power module and the second power module have the same orientation, and the load is adjacent to the third conductive part of the first power module and the third conductive part of the second power module.

21. The power supply system according to claim 13, characterized in that, The at least one power module includes a first power module, a second power module, and a third power module; the first power module, the second power module, and the third power module are laid flat on the first surface of the system circuit board; or the first power module and the second power module are disposed on the first surface of the system circuit board, and the third power module is disposed on the second surface of the system circuit board. Each of the first power module, the second power module, and the third power module further includes a third conductive element. The third conductive element passes through the channel of its corresponding magnetic core. Both ends of each third conductive element are electrically connected to a fourth connection terminal and a fifth connection terminal, respectively. Each fourth connection terminal and each fifth connection terminal are disposed on the first side of the magnetic core. The first power module, the second power module, and the third power module form a three-way anti-coupled connection; wherein, the first connection terminal of the first power module, the fourth connection terminal of the second power module, and the fourth connection terminal of the third power module are electrically connected through the system circuit board; the first connection terminal of the second power module, the fourth connection terminal of the first power module, and the second connection terminal of the third power module are electrically connected through the system circuit board; and the first connection terminal of the third power module, the second connection terminal of the first power module, and the second connection terminal of the second power module are electrically connected through the system circuit board.

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