A heat dissipation structure for circuit boards and its processing technology

Abstract

This invention belongs to the field of circuit board technology, and particularly to a circuit board heat dissipation structure. It includes a circuit board substrate, a heat-conducting groove, a heat-absorbing cotton layer, a copper heat-conducting plate, a heat-dissipating aluminum plate, heat dissipation fins, and a mounting plate. The heat-absorbing cotton layer is bonded and fixed to the bottom surface of the circuit board substrate, the copper heat-conducting plate is bonded and fixed to the bottom surface of the heat-absorbing cotton layer, and the heat-dissipating aluminum plate is bonded and fixed to the bottom end of the copper heat-conducting plate. Heat dissipation fins are evenly distributed on the bottom surface of the heat-dissipating aluminum plate. This circuit board heat dissipation structure, utilizing the combination of the heat-conducting groove, heat-absorbing cotton layer, copper heat-conducting plate, heat-dissipating aluminum plate, and heat dissipation fins, can quickly dissipate the heat generated by the circuit board substrate during operation, greatly improving the heat dissipation performance of the circuit board substrate. Furthermore, this heat dissipation structure has significant advantages such as convenient processing and low processing cost. It is also relatively stable during operation, will not damage the circuit board substrate, and will not exacerbate the intake of external dust.

Description

Technical Field

[0001] This invention belongs to the field of circuit board technology, specifically relating to a heat dissipation structure for circuit boards, and also to a processing technology for the heat dissipation structure for circuit boards. Background Technology

[0002] Circuit boards are also known as ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed circuit boards (copper etching technology), etc. Circuit boards contain a variety of electronic components and are a core component of electronic products and equipment such as computers.

[0003] Because it contains a variety of different electronic components, the circuit board will inevitably generate a lot of heat during operation due to the influence of current. Therefore, in order to ensure the safety of the circuit board operation, an auxiliary heat dissipation structure is usually added to the circuit board.

[0004] Some electronic products, such as computers, are equipped with cooling fans. However, these fans typically only cool the core components of the circuit board, such as the CPU. Therefore, existing technologies often incorporate structures that provide auxiliary cooling for the entire circuit board. For example, Chinese Utility Model Patent Application No. 202020543596.0 discloses a circuit board body with two support plates fixedly connected to its top. A heat sink is located above the circuit board body, and the heat sink is a hollow structure with an open bottom. A rotating shaft is located inside the heat sink, and fan blades are fitted onto the bottom of the rotating shaft. A motor is located above the heat sink, and the top of the rotating shaft penetrates the heat sink. A bearing is located at the penetration point between the rotating shaft and the heat sink. The top of the rotating shaft is connected to the output end of the motor via a fixing component. First connecting plates are fixedly connected to both sides of the heat sink. This design allows for cooling of the circuit board body and facilitates easy assembly and disassembly of the first connecting plates and support plates, making it convenient for practical use. It also facilitates the separation of the motor and rotating shaft, thus enabling later maintenance and replacement of the motor.

[0005] However, traditional heat dissipation structures have the problem of high processing costs, and they can also cause the circuit board to vibrate when the motor is working, which will inevitably have a very negative impact on the safety of the circuit board. In addition, using air cooling will draw in external dust, which will further reduce the performance of the circuit board. Summary of the Invention

[0006] To address the aforementioned problems in the prior art, this invention provides a circuit board heat dissipation structure and its processing technology, which features convenient use, good heat dissipation effect, easy processing, and low processing cost.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a heat dissipation structure for a circuit board, comprising a circuit board substrate, wherein the heat dissipation structure further comprises a heat-conducting groove, a heat-absorbing cotton layer, a copper heat-conducting plate, a heat-dissipating aluminum plate, heat dissipation fins, and a mounting plate;

[0008] Multiple heat-conducting grooves are evenly formed on the circuit board substrate. The heat-absorbing cotton layer is bonded and fixed to the bottom surface of the circuit board substrate. The copper heat-conducting plate is bonded and fixed to the bottom surface of the heat-absorbing cotton layer. The heat-dissipating aluminum plate is bonded and fixed to the bottom end of the copper heat-conducting plate. Heat dissipation fins are evenly distributed on the bottom surface of the heat-dissipating aluminum plate.

[0009] The mounting plate is connected to the bottom of the heat dissipation aluminum plate, and mounting feet are fixed on the mounting plate. There are two sets of mounting feet that are symmetrically distributed, and there are two mounting feet in each set.

[0010] In a preferred embodiment of the present invention, the length and width of the circuit board substrate, the heat-absorbing cotton layer, the copper heat-conducting plate, the heat-dissipating aluminum plate, and the mounting plate are all equal.

[0011] As a preferred embodiment of the present invention, it further includes a first telescopic spring, a limiting plate, and a second telescopic spring. A positioning post is fixed on the top surface of the mounting plate. A positioning slot for the positioning post to pass through is formed in the circuit board substrate, the heat-absorbing cotton layer, the copper heat-conducting plate, and the heat-dissipating aluminum plate. The first telescopic spring is sleeved on the positioning post and located between the heat-dissipating aluminum plate and the mounting plate. The limiting plate is an inverted "L"-shaped component. A guide post is fixed on the end face of the mounting plate, and a waist-shaped hole for the guide post to pass through is formed on the vertical part of the limiting plate. A limiting disc is fixed on the extended end of the guide post. The second telescopic spring is sleeved on the guide post and located between the limiting plate and the limiting disc.

[0012] As a preferred embodiment of the present invention, there are two symmetrically distributed limiting plates, and each limiting plate has two symmetrically distributed waist-shaped holes on its vertical part; there are four positioning posts distributed diagonally.

[0013] This invention also discloses a processing technology for a heat dissipation structure of a circuit board, the processing technology specifically including the following steps:

[0014] Step 1: Use a punching machine to punch out heat-conducting grooves on the circuit board substrate;

[0015] Step 2: Use a cutting device to cut out a heat-absorbing cotton layer that is the same size as the circuit board substrate, and then glue and fix the heat-absorbing cotton layer to the bottom surface of the circuit board substrate;

[0016] Step 3: Use cutting equipment to cut out a copper heat-conducting plate of the same size as the circuit board substrate, and glue and fix the copper heat-conducting plate to the bottom of the heat-absorbing cotton layer;

[0017] Step 4: Use cutting equipment to cut out a heat dissipation aluminum plate of the same size as the circuit board substrate, process heat dissipation fins on the surface of the heat dissipation aluminum plate, and then glue and fix the heat dissipation aluminum plate to the bottom surface of the copper heat-conducting plate.

[0018] Step 5: Punch out four diagonally distributed positioning slots on the assembly of the circuit board substrate, heat-absorbing cotton layer, copper heat-conducting plate and heat-dissipating aluminum plate.

[0019] Step 6: Use cutting equipment to cut out a mounting plate of the same size as the circuit board substrate. Weld mounting feet and guide posts to the outer side of the mounting plate and make the guide posts pass through the waist-shaped holes. After fitting a No. 2 telescopic spring on the guide post, weld a limiting plate to the end of the guide post away from the mounting plate. Finally, according to the position and number of positioning slots, weld the same number of positioning posts to the top surface of the mounting plate.

[0020] Step 7: In the SMT placement equipment, chip components are mounted on the top surface of the circuit board substrate using the SMT placement process;

[0021] Step 8: Install the No. 1 telescopic spring on the positioning post, and then install the combination of circuit board substrate, heat-absorbing cotton layer, copper heat-conducting plate and heat-dissipating aluminum plate on the mounting plate, so that the positioning post passes through the corresponding positioning slot, and at the same time, make the horizontal part of the limiting plate press down on the circuit board substrate.

[0022] As a preferred embodiment of the present invention, the heat-conducting groove is formed on the non-mounted portion of the circuit board substrate.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows: The heat dissipation structure of the circuit board of the present invention, by utilizing the combination of heat-conducting grooves, heat-absorbing cotton layer, copper heat-conducting plate, heat-dissipating aluminum plate and heat dissipation fins, can quickly dissipate the heat generated by the circuit board substrate during operation, greatly improving the heat dissipation performance of the circuit board substrate. In addition, the heat dissipation structure has the significant advantages of convenient processing and low processing cost. It is also relatively stable during operation, will not damage the circuit board substrate, and will not aggravate the intake of external dust. Attached Figure Description

[0024] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0025] Figure 1 This is a schematic diagram of the structure of the present invention;

[0026] Figure 2 For the present invention Figure 1 Enlarged structural diagram at point A in the diagram;

[0027] Figure 3 For the present invention Figure 1 Enlarged structural diagram at point B in the diagram;

[0028] In the diagram: 1. Circuit board substrate; 2. Heat-conducting groove; 3. Heat-absorbing cotton layer; 4. Copper heat-conducting plate; 5. Heat-dissipating aluminum plate; 6. Heat-dissipating fins; 7. Mounting plate; 8. Mounting foot; 9. Positioning post; 10. Positioning groove; 11. No. 1 telescopic spring; 12. Limiting plate; 13. Waist-shaped hole; 14. Guide post; 15. Limiting plate; 16. No. 2 telescopic spring. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figures 1-3 The present invention provides the following technical solution: a heat dissipation structure for a circuit board, including a circuit board substrate 1, and the heat dissipation structure for the circuit board further includes a heat-conducting groove 2, a heat-absorbing cotton layer 3, a copper heat-conducting plate 4, a heat dissipation aluminum plate 5, heat dissipation fins 6 and a mounting plate 7.

[0031] From the appendix Figure 1 and attached Figure 2 As shown, in this embodiment, multiple heat-conducting grooves 2 are evenly opened on the circuit board substrate 1, the heat-absorbing cotton layer 3 is bonded and fixed to the bottom surface of the circuit board substrate 1, the copper heat-conducting plate 4 is bonded and fixed to the bottom surface of the heat-absorbing cotton layer 3, and the heat-dissipating aluminum plate 5 is bonded and fixed to the bottom end of the copper heat-conducting plate 4. Heat dissipation fins 6 are evenly distributed on the bottom surface of the heat dissipation aluminum plate 5. Therefore, the opening of multiple heat-conducting grooves 2 can greatly increase the heat dissipation area of ​​the circuit board substrate 1. At the same time, multiple heat-conducting grooves 2 are also conducive to ventilation and heat dissipation of the circuit board substrate 1. The heat-absorbing cotton layer 3 can quickly absorb the heat generated by the circuit board substrate 1 and conduct it to the copper heat-conducting plate 4, which is then absorbed and dissipated by the lower heat dissipation aluminum plate 5. The heat dissipation fins 6 make the lower heat dissipation aluminum plate 5 have a large heat dissipation area, which greatly improves the heat dissipation efficiency of the circuit board substrate 1.

[0032] From the appendix Figure 1 and attached Figure 2As shown, in this embodiment, the mounting plate 7 is connected below the heat dissipation aluminum plate 5, and mounting feet 8 are fixed on the mounting plate 7. There are two sets of mounting feet 8 symmetrically distributed, and there are two mounting feet 8 in each set. The combination of the device circuit board substrate 1, the heat-absorbing cotton layer 3, the copper heat-conducting plate 4 and the heat dissipation aluminum plate 5 is mounted using the mounting plate 7, and is installed in the casing of the electronic product using the mounting feet 8 and conventional means.

[0033] From the appendix Figure 1 and attached Figure 2 As shown, in an optional embodiment, the circuit board substrate 1, the heat-absorbing cotton layer 3, the copper heat-conducting plate 4, the heat-dissipating aluminum plate 5, and the mounting plate 7 are all of equal length and width, which reduces processing costs and ensures better heat dissipation efficiency.

[0034] From the appendix Figure 1 Appendix Figure 2 and attached Figure 3 As shown, as an optional embodiment, this embodiment also includes a first telescopic spring 11, a limiting plate 12, and a second telescopic spring 16. A positioning post 9 is fixed on the top surface of the mounting plate 7. A positioning slot 10 for the positioning post 9 to pass through is opened in the circuit board substrate 1, the heat-absorbing cotton layer 3, the copper heat-conducting plate 4, and the heat-dissipating aluminum plate 5. The first telescopic spring 11 is sleeved on the positioning post 9 and is located between the heat-dissipating aluminum plate 5 and the mounting plate 7. The limiting plate 12 is an inverted "L" shaped component. A guide post 14 is fixed on the end face of the mounting plate 7, and a waist-shaped hole 13 for the guide post 14 to pass through is opened on the vertical part of the limiting plate 12. A limiting plate 15 is fixed on the protruding end of the guide post 14. The second telescopic spring... The circuit board substrate 1, heat-absorbing cotton layer 3, copper heat-conducting plate 4, and heat-dissipating aluminum plate 5 are assembled on the guide post 14 and positioned between the limiting plate 12 and the limiting plate 15. The first telescopic spring 11 pushes the circuit board substrate 1, heat-absorbing cotton layer 3, copper heat-conducting plate 4, and heat-dissipating aluminum plate 5 assembly on top. The horizontal part of the limiting plate 12 limits the circuit board substrate 1, ensuring the stability of the assembly and making installation convenient. When it is necessary to clean or repair the circuit board substrate 1, the limiting plate 12 is pulled outward to make the horizontal part of the limiting plate 12 deviate from the circuit board substrate 1. Then, the limiting plate 12 is moved down a certain position, and the circuit board substrate 1, heat-absorbing cotton layer 3, copper heat-conducting plate 4, and heat-dissipating aluminum plate 5 assembly can be removed, which is very convenient.

[0035] From the appendix Figure 1 Appendix Figure 2 and attached Figure 3 As shown, in an optional embodiment, there are two symmetrically distributed limiting plates 12 in this embodiment, and two symmetrically distributed waist-shaped holes 13 are opened on the vertical part of each limiting plate 12; four positioning posts 9 are distributed diagonally to ensure the stability of the assembly of the circuit board substrate 1, heat-absorbing cotton layer 3, copper heat-conducting plate 4 and heat-dissipating aluminum plate 5 with the mounting plate 7.

[0036] A fabrication process for a heat dissipation structure on a circuit board, the process specifically including the following steps:

[0037] Step 1: Use a punching machine to punch out heat-conducting grooves 2 on the circuit board substrate 1;

[0038] Step 2: Use a cutting device to cut out a heat-absorbing cotton layer 3 that is the same size as the circuit board substrate 1, and then glue and fix the heat-absorbing cotton layer 3 to the bottom surface of the circuit board substrate 1.

[0039] Step 3: Cut out a copper heat-conducting plate 4 of the same size as the circuit board substrate 1 using a cutting device, and glue and fix the copper heat-conducting plate 4 to the bottom surface of the heat-absorbing cotton layer 3.

[0040] Step 4: Cut out a heat dissipation aluminum plate 5 with the same size as the circuit board substrate 1 using a cutting device, and process heat dissipation fins 6 on the surface of the heat dissipation aluminum plate 5. Then, glue and fix the heat dissipation aluminum plate 5 to the bottom surface of the copper heat-conducting plate 4.

[0041] Step 5: Punch out four diagonally distributed positioning slots 10 on the assembly of circuit board substrate 1, heat-absorbing cotton layer 3, copper heat-conducting plate 4 and heat-dissipating aluminum plate 5.

[0042] Step 6: Cut out a mounting plate 7 of the same size as the circuit board substrate 1 using a cutting device. Weld mounting feet 8 and guide posts 14 to the outer side of the mounting plate 7 and make the guide posts 14 pass through the waist-shaped hole 13. After fitting a No. 2 telescopic spring 16 on the guide post 14, weld a limiting plate 15 to the end of the guide post 14 away from the mounting plate 7. Finally, according to the position and number of positioning slots 10, weld the same position and number of positioning posts 9 to the top surface of the mounting plate 7.

[0043] Step 7: In the SMT placement equipment, chip components are mounted on the top surface of the circuit board substrate 1 using the SMT placement process;

[0044] Step 8: Install the No. 1 telescopic spring 11 on the positioning post 9, and then install the assembly of the circuit board substrate 1, the heat-absorbing cotton layer 3, the copper heat-conducting plate 4 and the heat-dissipating aluminum plate 5 on the mounting plate 7, so that the positioning post 9 passes through the corresponding positioning slot 10, and at the same time, press down the horizontal part of the limiting plate 12 on the circuit board substrate 1.

[0045] From the appendix Figure 1 As shown, in an optional embodiment, the heat-conducting groove 2 is formed on the non-mounted part of the circuit board substrate 1 to prevent damage to the circuit board substrate 1 and avoid adverse effects on the performance of the circuit board substrate 1.

[0046] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limitations; therefore, other examples of exemplary embodiments may have different values.

[0047] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0048] Furthermore, in the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation", "connection", "linking", "setting", "equipped", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components. For those skilled in the art, the specific meaning of the above terms in the present invention can be understood according to the specific circumstances.

[0049] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A heat dissipation structure for a circuit board, comprising a circuit board substrate (1), characterized in that: The heat dissipation structure of the circuit board also includes a heat-conducting channel (2), a heat-absorbing cotton layer (3), a copper heat-conducting plate (4), a heat-dissipating aluminum plate (5), heat dissipation fins (6), and a mounting plate (7). Multiple heat-conducting grooves (2) are evenly opened on the non-mounted part of the circuit board substrate (1). The heat-absorbing cotton layer (3) is bonded and fixed to the bottom surface of the circuit board substrate (1). The copper heat-conducting plate (4) is bonded and fixed to the bottom surface of the heat-absorbing cotton layer (3). The heat-dissipating aluminum plate (5) is bonded and fixed to the bottom end of the copper heat-conducting plate (4). Heat dissipating fins (6) are evenly distributed on the bottom surface of the heat dissipating aluminum plate (5). The mounting plate (7) is connected to the bottom of the heat dissipation aluminum plate (5), and mounting feet (8) are fixed on the mounting plate (7). There are two sets of mounting feet (8) symmetrically distributed, and there are two mounting feet (8) in each set symmetrically distributed. The circuit board heat dissipation structure also includes a first telescopic spring (11), a limiting plate (12), and a second telescopic spring (16). A positioning post (9) is fixed on the top surface of the mounting plate (7). A positioning slot (10) for the positioning post (9) to pass through is provided in the circuit board substrate (1), the heat-absorbing cotton layer (3), the copper heat-conducting plate (4), and the heat dissipation aluminum plate (5). The first telescopic spring (11) is sleeved on the positioning post (9) and is located between the heat dissipation aluminum plate (5) and the positioning slot (9). Between the mounting plates (7); the limiting plate (12) is an inverted "L" shaped component, a guide post (14) is fixed on the end face of the mounting plate (7), and a waist-shaped hole (13) for the guide post (14) to pass through is opened on the vertical part of the limiting plate (12), a limiting plate (15) is fixed on the extended end of the guide post (14), and the second telescopic spring (16) is sleeved on the guide post (14) and located between the limiting plate (12) and the limiting plate (15); There are two symmetrically distributed limit plates (12), and two symmetrically distributed waist-shaped holes (13) are opened on the vertical part of each limit plate (12); there are four diagonally distributed positioning posts (9).

2. The heat dissipation structure for a circuit board according to claim 1, characterized in that: The length and width of the circuit board substrate (1), the heat-absorbing cotton layer (3), the copper heat-conducting plate (4), the heat-dissipating aluminum plate (5), and the mounting plate (7) are all equal.

3. The processing technology for fabricating a circuit board heat dissipation structure as described in any one of claims 1-2, characterized in that: The processing technology specifically includes the following steps: Step 1: Use a punching machine to punch out heat-conducting grooves (2) on the circuit board substrate (1); Step 2: Use a cutting device to cut out a heat-absorbing cotton layer (3) of the same size as the circuit board substrate (1), and glue and fix the heat-absorbing cotton layer (3) to the bottom surface of the circuit board substrate (1); Step 3: Cut out a copper heat-conducting plate (4) of the same size as the circuit board substrate (1) using a cutting device, and glue and fix the copper heat-conducting plate (4) to the bottom surface of the heat-absorbing cotton layer (3); Step 4: Cut out a heat dissipation aluminum plate (5) of the same size as the circuit board substrate (1) using a cutting device, and process heat dissipation fins (6) on the surface of the heat dissipation aluminum plate (5). Then, glue and fix the heat dissipation aluminum plate (5) to the bottom surface of the copper heat-conducting plate (4). Step 5: Punch out four diagonally distributed positioning slots (10) on the assembly of the circuit board substrate (1), heat-absorbing cotton layer (3), copper heat-conducting plate (4) and heat-dissipating aluminum plate (5). Step 6: Cut out a mounting plate (7) of the same size as the circuit board substrate (1) using a cutting device. Weld mounting feet (8) and guide posts (14) to the outer side of the mounting plate (7). Make the guide posts (14) pass through the waist-shaped hole (13). After putting a No. 2 telescopic spring (16) on the guide post (14), weld a limiting plate (15) to the end of the guide post (14) away from the mounting plate (7). Finally, according to the position and number of the positioning through slot (10), weld the same position and number of positioning posts (9) on the top surface of the mounting plate (7). Step 7: In the SMT placement equipment, chip components are mounted on the top surface of the circuit board substrate (1) using the SMT placement process; Step 8: Install the No. 1 telescopic spring (11) on the positioning post (9), and then install the combination of circuit board substrate (1), heat-absorbing cotton layer (3), copper heat-conducting plate (4) and heat-dissipating aluminum plate (5) on the mounting plate (7), so that the positioning post (9) passes through the corresponding positioning slot (10), and at the same time, the horizontal part of the limiting plate (12) presses down on the circuit board substrate (1).

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