Crimping methods for PCB boards and crimping components

Abstract

This application discloses a PCB board and a crimping method for a crimping device, relating to the field of PCB board pad technology. The apparatus of this application includes: a pad corresponding to a crimping device; the pad includes a via matrix, the via matrix including multiple ordinary vias and multiple special vias, the multiple special vias located at the edge of the via matrix; wherein, for any one of the special vias, the wall of the special via has a copper layer, and both ends of the special via have soldered copper rings, the copper layer of the special via is connected to two soldered copper rings, the soldered copper rings including soldered portions and non-soldered portions.

Description

Technical Field

[0001] This application relates to the field of PCB board pad technology, and in particular to a crimping method for a PCB board and a crimping device. Background Technology

[0002] Crimping devices are electronic devices that are connected to the pads of a PCB board by crimping.

[0003] Currently, due to manufacturing process limitations, there are dimensional tolerances in the through holes on PCB board pads, and the pins of crimped components also have dimensional tolerances. Therefore, when crimped components are connected to PCB board pads, poor contact may occur between the pins of the crimped components and the through holes on the PCB board pads. This can lead to poor stability of the crimped components connected to the PCB board, resulting in PCB board performance failing to meet standards and PCB boards not meeting actual production requirements. Summary of the Invention

[0004] This application provides a crimping method for a PCB board and a crimping device, the main purpose of which is to ensure a stable connection between the crimping device and the PCB board pads.

[0005] To address the aforementioned technical problems, this application provides the following technical solutions:

[0006] In a first aspect, this application provides a PCB board, the PCB board comprising:

[0007] The pads corresponding to the crimping device;

[0008] The pad includes a via matrix, which includes multiple ordinary vias and multiple special vias, with the multiple special vias located at the edge of the via matrix;

[0009] Specifically, for any one of the special through holes, the hole wall has a copper layer, and both ends of the special through hole have welded copper rings. The copper layer of the special through hole is connected to the two welded copper rings, and the welded copper rings include welded parts and non-welded parts.

[0010] Optionally, the plurality of special through holes include: a first special through hole and a second special through hole, wherein the first special through hole is located on a first side of the edge of the through hole matrix, and the second special through hole is located on a second side of the edge of the through hole matrix, and the first side is the opposite side of the second side.

[0011] Optionally, the first special through hole and the second special through hole are diagonally related.

[0012] Optionally, the welded copper ring is specifically a teardrop-shaped copper ring, with the arc end of the teardrop-shaped copper ring being the non-welded part and the tip of the teardrop-shaped copper ring being the welded part, and the tip of the teardrop-shaped copper ring being away from the center side of the through-hole matrix.

[0013] Optionally, the included angle of the tip of the teardrop-shaped copper ring is 40° to 60°.

[0014] Optionally, the included angle of the tip of the teardrop-shaped copper ring is specifically 50°.

[0015] Optionally, the welding copper ring is specifically an elliptical copper ring, with the end of the elliptical copper ring closer to the center of the through-hole matrix being the non-welded part, and the end of the elliptical copper ring farther from the center of the through-hole matrix being the welded part.

[0016] Optionally, the welding copper ring is specifically a rectangular copper ring, with the end of the rectangular copper ring closer to the center of the through-hole matrix being a non-welded part, and the end of the rectangular copper ring farther from the center of the through-hole matrix being a welded part.

[0017] Secondly, this application also provides a crimping method for a crimping device, the method comprising:

[0018] The crimping device is crimped to the pads on the PCB board, wherein the pads include a through-hole matrix, the through-hole matrix includes multiple ordinary through-holes and multiple special through-holes, and the multiple special through-holes are located at the edge of the through-hole matrix;

[0019] Each of the special through holes and the crimping device is then soldered with tin.

[0020] Optionally, the special through-hole has soldered copper rings at both ends, the soldered copper rings including soldered and non-soldered portions, and the crimping device includes multiple pins; the step of soldering each special through-hole to the crimping device includes:

[0021] For any given special through hole, the welded portions of the copper rings at both ends of the special through hole are soldered to the corresponding pins of the special through hole.

[0022] Thirdly, embodiments of this application provide a storage medium including a stored program, wherein, when the program is executed, it controls the device where the storage medium is located to perform the crimping method of the crimping device described in the second aspect.

[0023] Fourthly, embodiments of this application provide a crimping apparatus for a crimping device, the apparatus including a storage medium; and one or more processors, the storage medium being coupled to the processors, the processors being configured to execute program instructions stored in the storage medium; the program instructions, when executed, perform the crimping method of the crimping device described in the second aspect.

[0024] By employing the above-described technical solution, the technical solution provided in this application has at least the following advantages:

[0025] This application provides a PCB board and a crimping method for crimping devices. The PCB board provided by this application includes: pads corresponding to the crimping devices; the pads include a through-hole matrix, the through-hole matrix includes multiple ordinary through-holes and multiple special through-holes, the multiple special through-holes are located at the edge of the through-hole matrix; wherein, for any one special through-hole, the wall of the special through-hole has a copper layer, and both ends of the special through-hole have solder copper rings, the copper layer of the special through-hole is connected to the two solder copper rings, and the solder copper rings include soldered parts and non-soldered parts. Compared to existing technologies that simply crimp the crimping device to the PCB board pads, this application, after crimping the device to the PCB board pads, requires tin soldering to each special through-hole and the crimping device separately. Specifically, the soldered portions of the copper rings at both ends of the first special through-hole are tin-soldered to the pins inserted into it; then the soldered portions of the copper rings at both ends of the second special through-hole are tin-soldered to the pins inserted into it; and so on, until finally the soldered portions of the copper rings at both ends of the last special through-hole are tin-soldered to the pins inserted into it. By tin-soldering the soldered portions of the copper rings at both ends of the special through-holes to the pins inserted into them, the stability of the crimping device connection to the PCB board can be effectively improved, thereby ensuring that the PCB board meets performance testing standards and actual production requirements.

[0026] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0027] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0028] Figure 1A schematic diagram of the structure of the first type of PCB board provided in this application embodiment is shown;

[0029] Figure 2 A schematic diagram of the structure of the second type of PCB board provided in this application embodiment is shown;

[0030] Figure 3 A schematic diagram of the structure of the third type of PCB board provided in this application embodiment is shown;

[0031] Figure 4 A schematic diagram of the structure of the fourth type of PCB board provided in this application embodiment is shown;

[0032] Figure 5 A schematic diagram of the structure of the first type of welded copper ring provided in this application embodiment is shown;

[0033] Figure 6 A schematic diagram of the structure of the second type of welded copper ring provided in this application embodiment is shown;

[0034] Figure 7 A schematic diagram of the structure of the third type of welded copper ring provided in this application embodiment is shown;

[0035] Figure 8 A flowchart illustrating a crimping method for a crimping device provided in an embodiment of this application is shown. Detailed Implementation

[0036] Exemplary embodiments of this application will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of this application are shown in the drawings, it should be understood that this application may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of this application and to fully convey the scope of this application to those skilled in the art.

[0037] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains.

[0038] Firstly, embodiments of this application provide a PCB board, such as... Figure 1As shown, the PCB board includes: pads 1 corresponding to the pressure bonding devices; pads 1 include a via matrix, which includes multiple ordinary vias 2 and multiple special vias 3, with the special vias 3 located at the edge of the via matrix; wherein, for any one special via 3, the wall of the special via 3 has a copper layer, and both ends of the special via 3 have solder copper rings 4, the copper layer of the special via 3 is connected to the two solder copper rings 4, and the solder copper rings 4 at both ends of the special via 3 are used to fix the copper layer on the wall of the special via 3 to ensure that the copper layer on the wall of the hole does not fall off, and the solder copper rings 4 include a soldering part. The copper ring 4 has two parts: a) and non-soldering. The soldering part a can be soldered to the pins of the crimping device, which can effectively improve the stability of the crimping device connection to the PCB board. For any ordinary through hole 2, there is a copper layer on the hole wall and non-soldering copper rings 5 ​​at both ends of the ordinary through hole 2. The copper layer of the ordinary through hole 2 is connected to the two non-soldering copper rings 5. The non-soldering copper rings 5 ​​at both ends of the ordinary through hole 2 are used to fix the copper layer on the hole wall of the ordinary through hole 2 to ensure that the copper layer on the hole wall does not fall off. The non-soldering copper rings 5 ​​are specifically circular copper rings.

[0039] It should be noted that the embodiments of this application do not specifically limit the number of special vias 3 included in the pad 1, and may include, but are not limited to: two, three, four, six, etc.

[0040] It should be noted that in practical applications, copper layers can be electroplated onto the walls of special through holes 3, copper rings 4 can be electroplated onto both ends of special through holes 3, copper layers can be electroplated onto the walls of ordinary through holes 2, and non-welded copper rings 5 ​​can be electroplated onto both ends of ordinary through holes 2, but this is not limited to these.

[0041] The following combination Figure 1 The PCB board shown illustrates the detailed process of crimping the components to pad 1 on the PCB board:

[0042] The crimping device includes multiple pins arranged in a matrix, and the total number of multiple ordinary through holes 2 and multiple special through holes 3 is the same as the number of pins.

[0043] First, the crimping device is crimped to the pad 1 of the PCB board, that is, the multiple pins of the crimping device are inserted into the multiple ordinary through holes 2 and multiple special through holes 3 of the pad 1 respectively;

[0044] Next, each special through hole 3 is soldered to the crimping device. Specifically, the soldering part a of the copper ring 4 at both ends of the first special through hole 3 is soldered to the PIN inserted into the first special through hole 3. Then, the soldering part a of the copper ring 4 at both ends of the second special through hole 3 is soldered to the PIN inserted into the second special through hole 3. Finally, the soldering part a of the copper ring 4 at both ends of the last special through hole 3 is soldered to the PIN inserted into the last special through hole 3.

[0045] It should be noted that by soldering the welding part a of the copper ring 4 at both ends of the special through hole 3 to the PIN inserted into the special through hole 3 with tin, the stability of the crimping device connection to the PCB board can be effectively improved.

[0046] This application provides a PCB board, which includes: pads corresponding to pressure bonding devices; the pads include a through-hole matrix, which includes multiple ordinary through holes and multiple special through holes, with the multiple special through holes located at the edge of the through-hole matrix; wherein, for any one special through hole, the hole wall has a copper layer, and both ends of the special through hole have solder copper rings, the copper layer of the special through hole is connected to the two solder copper rings, and the solder copper rings include soldered parts and non-soldered parts. Compared to existing technologies that simply crimp the crimping device to the PCB board pads, this embodiment of the application, after crimping the device to the PCB board pads, requires soldering each special through-hole to the crimping device. Specifically, the soldered portions of the copper rings at both ends of the first special through-hole are soldered to the pins inserted into it; then the soldered portions of the copper rings at both ends of the second special through-hole are soldered to the pins inserted into it; and so on, until the soldered portions of the copper rings at both ends of the last special through-hole are soldered to the pins inserted into it. By soldering the copper rings at both ends of the special through-holes to the pins inserted into them, the stability of the crimping device connection to the PCB board can be effectively improved, thereby ensuring that the PCB board meets performance testing standards and actual production requirements.

[0047] Furthermore, such as Figure 2 As shown, the multiple special through holes 3 include: a first special through hole 31 and a second special through hole 32. The first special through hole 31 is located on the first side of the edge of the through hole matrix, and the second special through hole 32 is located on the second side of the edge of the through hole matrix. The first side is the opposite side of the second side.

[0048] In this embodiment, since the size of the soldered copper rings 4 at both ends of the special through hole 3 is larger than that of the non-soldered copper rings 5 ​​at both ends of the ordinary through hole 2, that is, the manufacturing cost of the soldered copper rings 4 is higher than that of the non-soldered copper rings 5, in order to limit the manufacturing cost of the PCB board, the pad 1 can be limited to include two special through holes 3, namely the first special through hole 31 and the second special through hole 32. In addition, in order to ensure the stability of the connection between the crimping device and the PCB board, it is necessary to ensure that the first special through hole 31 and the second special through hole 32 are located on opposite sides of the edge of the through hole matrix, that is, the first special through hole 31 is located on the first side of the edge of the through hole matrix, and the second special through hole 32 is located on the second side of the edge of the through hole matrix, with the first side being the opposite side of the second side.

[0049] Furthermore, such as Figure 3 and Figure 4 As shown, the first special through hole 31 and the second special through hole 32 are diagonally related.

[0050] In this embodiment of the application, in order to further improve the stability of the crimping device connection to the PCB board, the first special through hole 31 and the second special through hole 32 can be set on the diagonal of the through hole matrix, that is, the first special through hole 31 and the second special through hole 32 are in a diagonal relationship, such as... Figure 3 As shown, when the first special through-hole 31 is specifically the first through-hole in the first row of the through-hole matrix, the second special through-hole 32 is specifically the last through-hole in the last row of the through-hole matrix, as follows: Figure 4 As shown, when the first special through hole 31 is specifically the last through hole in the first row of the through hole matrix, the second special through hole 32 is specifically the first through hole in the last row of the through hole matrix.

[0051] Furthermore, such as Figure 5 As shown, the welding copper ring 4 is specifically a teardrop-shaped copper ring. The arc end of the teardrop-shaped copper ring is the non-welded part, and the tip of the teardrop-shaped copper ring is the welded part a. The tip of the teardrop-shaped copper ring is far away from the center side of the through hole matrix.

[0052] In this embodiment, to facilitate the soldering of the welding portion a of the copper ring 4 at both ends of the special through hole 3 to the PIN inserted into the special through hole 3, the welding copper ring 4 can be set as a teardrop shape, that is, the welding copper ring 4 is specifically a teardrop-shaped copper ring, wherein the arc end of the teardrop-shaped copper ring is the non-welding portion, the tip of the teardrop-shaped copper ring is the welding portion a, and the tip of the teardrop-shaped copper ring is far away from the center side of the through hole matrix, so that the ordinary through hole 2 will not be touched during the soldering process of the welding portion a of the teardrop-shaped copper ring at both ends of the special through hole 3 to the PIN inserted into the special through hole 3.

[0053] Furthermore, such as Figure 5 As shown, the included angle of the tip of the teardrop-shaped copper ring is 40° to 60°; specifically, the included angle of the tip of the teardrop-shaped copper ring is 50°.

[0054] In this embodiment, when the included angle of the tip of the teardrop-shaped copper ring is too small, it is not convenient to perform soldering on the tip of the teardrop-shaped copper ring (i.e., the soldering part a) and the PIN inserted into the special through hole 3. When the included angle of the tip of the teardrop-shaped copper ring is too large, the manufacturing cost of the teardrop-shaped copper ring is high. Therefore, the included angle of the tip of the teardrop-shaped copper ring can be set to 40° to 60°; specifically, the included angle of the tip of the teardrop-shaped copper ring can be set to 50°.

[0055] Furthermore, such as Figure 6 As shown, the welding copper ring 4 is specifically an elliptical copper ring. The end of the elliptical copper ring closest to the center of the through-hole matrix is ​​the non-welded part, and the end of the elliptical copper ring furthest from the center of the through-hole matrix is ​​the welded part a.

[0056] In this embodiment, to facilitate the soldering of the welding portion a of the copper ring 4 at both ends of the special through hole 3 to the PIN inserted into the special through hole 3, the welding copper ring 4 can be set to an elliptical shape. Specifically, the welding copper ring 4 is an elliptical copper ring, wherein the end of the elliptical copper ring closer to the center of the through hole matrix is ​​the non-welded portion, and the end of the elliptical copper ring farther from the center of the through hole matrix is ​​the welding portion a. This ensures that during the soldering of the welding portion a of the elliptical copper ring at both ends of the special through hole 3 to the PIN inserted into the special through hole 3, the ordinary through hole 2 will not be touched.

[0057] Furthermore, such as Figure 7 As shown, the welding copper ring 4 is specifically a rectangular copper ring. The end of the rectangular copper ring closest to the center of the through hole matrix is ​​the non-welded part, and the end of the rectangular copper ring furthest from the center of the through hole matrix is ​​the welded part a.

[0058] In this embodiment, to facilitate the soldering of the welding portion a of the copper ring 4 at both ends of the special through hole 3 to the PIN inserted into the special through hole 3, the copper ring 4 can be set as a rectangle, that is, the copper ring 4 is specifically a rectangular copper ring. The end of the rectangular copper ring closer to the center of the through hole matrix is ​​the non-soldering portion, and the end of the rectangular copper ring farther from the center of the through hole matrix is ​​the welding portion a. This ensures that during the soldering of the welding portion a of the rectangular copper ring at both ends of the special through hole 3 to the PIN inserted into the special through hole 3, the ordinary through hole will not be touched.

[0059] Secondly, another embodiment of this application also provides a crimping method for a crimping device. This method is applied to a crimping machine to crimp the crimping device onto the PCB board pads described in the first aspect, specifically as follows: Figure 8 As shown, the method includes:

[0060] 201. Press the crimping device onto the pads on the PCB board.

[0061] The pads include a via matrix, which includes multiple ordinary vias and multiple special vias, with the special vias located at the edges of the via matrix; the crimping device includes multiple pins, which are arranged in a matrix, and the total number of ordinary vias and multiple special vias is the same as the number of pins.

[0062] In this embodiment of the application, after the worker places the PCB board and the crimping device at the designated position on the crimping machine, the crimping machine can crimp the crimping device to the pads on the PCB board, that is, the multiple pins of the crimping device are inserted into the multiple ordinary through holes and multiple special through holes of the pads.

[0063] 202. Solder each special through hole and crimping device separately.

[0064] In this embodiment, after the crimping machine crimps the crimping device onto the pads of the PCB board, it can perform tin soldering on each special through hole and the crimping device separately. That is, the first special through hole and the crimping device are tin soldered first, then the second special through hole and the crimping device are tin soldered, and so on, and finally the last special through hole and the crimping device are tin soldered, thereby effectively improving the stability of the crimping device connection to the PCB board.

[0065] It should be noted that by soldering the special through-holes to the crimping device, the stability of the crimping device connection to the PCB board can be effectively improved.

[0066] Furthermore, in the embodiments of this application, for any special through hole, the special through hole has welding copper rings at both ends. The welding copper rings include welding parts and non-welding parts. The specific method for tinning the special through hole and the crimping device is as follows: the welding parts of the welding copper rings at both ends of the special through hole are tinned and soldered to the PIN pins corresponding to the special through hole (i.e., the PIN pins inserted into the special through hole).

[0067] This application provides a PCB board and a crimping method for crimping devices. The PCB board provided in this application includes: pads corresponding to the crimping devices; the pads include a through-hole matrix, the through-hole matrix includes multiple ordinary through-holes and multiple special through-holes, the multiple special through-holes are located at the edge of the through-hole matrix; wherein, for any one special through-hole, the wall of the special through-hole has a copper layer, and both ends of the special through-hole have solder copper rings, the copper layer of the special through-hole is connected to the two solder copper rings, and the solder copper rings include soldered parts and non-soldered parts. Compared to existing technologies that simply crimp the crimping device to the PCB board pads, this embodiment of the application, after crimping the device to the PCB board pads, requires soldering each special through-hole to the crimping device. Specifically, the soldered portions of the copper rings at both ends of the first special through-hole are soldered to the pins inserted into it; then the soldered portions of the copper rings at both ends of the second special through-hole are soldered to the pins inserted into it; and so on, until the soldered portions of the copper rings at both ends of the last special through-hole are soldered to the pins inserted into it. By soldering the copper rings at both ends of the special through-holes to the pins inserted into them, the stability of the crimping device connection to the PCB board can be effectively improved, thereby ensuring that the PCB board meets performance testing standards and actual production requirements.

[0068] This application provides a storage medium including a stored program, wherein the program controls the device containing the storage medium to execute the crimping method of the crimping device described above when it is running.

[0069] Storage media may include non-permanent memory in the form of computer-readable media, random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM, and the memory includes at least one memory chip.

[0070] This application also provides a crimping device for a crimping device, the device including a storage medium and one or more processors, the storage medium being coupled to the processors, the processors being configured to execute program instructions stored in the storage medium; the program instructions, when executed, perform the crimping method of the crimping device described above.

[0071] This application provides a device, which includes a processor, a memory, and a program stored in the memory and executable on the processor. When the processor executes the program, it performs the following steps:

[0072] The crimping device is crimped to the pads on the PCB board, wherein the pads include a through-hole matrix, the through-hole matrix includes multiple ordinary through-holes and multiple special through-holes, and the multiple special through-holes are located at the edge of the through-hole matrix;

[0073] Each of the special through holes and the crimping device is then soldered with tin.

[0074] Furthermore, the special through-hole has soldered copper rings at both ends, the soldered copper rings including soldered and non-soldered portions, and the crimping device includes multiple pins; the step of soldering each special through-hole to the crimping device includes:

[0075] For any given special through hole, the welded portions of the copper rings at both ends of the special through hole are soldered to the corresponding pins of the special through hole.

[0076] This application also provides a computer program product, which, when executed on a data processing device, is suitable for executing program code that initializes the following steps: pressing a crimping device onto a pad on a PCB board, wherein the pad includes a via matrix, the via matrix includes a plurality of ordinary vias and a plurality of special vias, the plurality of special vias being located at the edge of the via matrix; and tinning each of the special vias to the crimping device.

[0077] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0078] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0079] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0080] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0081] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0082] Memory may include non-persistent memory in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM. Memory is an example of computer-readable media.

[0083] Computer-readable media includes both permanent and non-permanent, removable and non-removable media that can store information using any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic magnetic disk storage or other magnetic storage devices, or any other non-transferable medium that can be used to store information accessible by a computing device. As defined herein, computer-readable media does not include transient computer-readable media, such as modulated data signals and carrier waves.

[0084] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0085] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0086] The above are merely embodiments of this application and are not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A PCB board, characterized in that, The PCB board includes: The pads corresponding to the crimping device; The pad includes a via matrix, which includes multiple ordinary vias and multiple special vias, with the multiple special vias located at the edge of the via matrix; Specifically, for any one of the special through holes, the wall of the special through hole has a copper layer, and both ends of the special through hole have welded copper rings. The copper layer of the special through hole is connected to the two welded copper rings. The welded copper rings include welded parts and non-welded parts. The welded parts are away from the center side of the through hole matrix, and the non-welded parts are close to the center side of the through hole matrix.

2. The PCB board according to claim 1, characterized in that, The plurality of special through holes include: a first special through hole and a second special through hole, wherein the first special through hole is located on a first side of the edge of the through hole matrix, and the second special through hole is located on a second side of the edge of the through hole matrix, and the first side is the opposite side of the second side.

3. The PCB board according to claim 2, characterized in that, The first special through hole and the second special through hole are diagonally related.

4. The PCB board according to claim 1, characterized in that, The welded copper ring is specifically a teardrop-shaped copper ring, with the arc end of the teardrop-shaped copper ring being the non-welded part and the tip of the teardrop-shaped copper ring being the welded part, and the tip of the teardrop-shaped copper ring being away from the center side of the through hole matrix.

5. The PCB board according to claim 4, characterized in that, The included angle at the tip of the teardrop-shaped copper ring is 40° to 60°.

6. The PCB board according to claim 5, characterized in that, The included angle at the tip of the teardrop-shaped copper ring is specifically 50°.

7. The PCB board according to claim 1, characterized in that, The welding copper ring is specifically an elliptical copper ring, with the end of the elliptical copper ring closest to the center of the through-hole matrix being the non-welded part, and the end of the elliptical copper ring furthest from the center of the through-hole matrix being the welded part.

8. The PCB board according to claim 1, characterized in that, The welding copper ring is specifically a rectangular copper ring, with the end of the rectangular copper ring closest to the center of the through-hole matrix being the non-welded part, and the end of the rectangular copper ring furthest from the center of the through-hole matrix being the welded part.

9. A crimping method for a crimping device, characterized in that, The method includes: A crimping device is crimped onto a pad on a PCB board, wherein the pad includes a via matrix, the via matrix includes multiple ordinary vias and multiple special vias, the multiple special vias are located at the edge of the via matrix, and for any one of the special vias, the special vias have soldered copper rings at both ends, the soldered copper rings include soldered parts and non-soldered parts, the soldered parts are away from the center side of the via matrix, and the non-soldered parts are close to the center side of the via matrix; Each of the special through holes and the crimping device is then soldered with tin.

10. A crimping device for a crimping component, characterized in that, The device includes a storage medium; and one or more processors, the storage medium being coupled to the processors, the processors being configured to execute program instructions stored in the storage medium; the program instructions, when executed, perform the crimping method of the crimping device according to claim 9.

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