Compatible components for semiconductor processing systems

Abstract

An example substrate processing system can include a chamber body defining a transfer region. The system can include a first cover plate disposed on the chamber body along a first surface of the first cover plate. The first cover plate can define a plurality of apertures through the first cover plate. The system can include a plurality of cover stacks equal to a number of apertures in the plurality of apertures. The plurality of cover stacks can at least partially define a plurality of processing regions vertically offset from the transfer region. The system can include a second cover plate coupled with the plurality of cover stacks. The plurality of cover stacks can be positioned between the first cover plate and the second cover plate. Components of each cover stack in the plurality of cover stacks can be coupled with the second cover plate.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to U.S. Patent Application No. 16 / 856,262, filed April 23, 2020, entitled “COMPLIANCE COMPONENTS FORSEMICONDUCTOR PROCESSING SYSTEM”, the entirety of which is incorporated herein by reference. Technical Field

[0003] This technology relates to semiconductor processing equipment. More specifically... Background Technology

[0004] Semiconductor processing systems typically utilize clustering tools to integrate multiple processing chambers together. This configuration can facilitate the execution of several sequential processing operations without removing the substrate from a controlled processing environment, or it can allow similar processing to be performed simultaneously on multiple substrates in varying chambers. These chambers may include, for example, degassing chambers, pretreatment chambers, transfer chambers, chemical vapor deposition chambers, physical vapor deposition chambers, etching chambers, metrology chambers, and others. The combination of chambers in the clustering tool, along with the operating conditions and parameters for running these chambers, is selected to fabricate specific structures using specific processing formulations and processes.

[0005] Some processing systems may include multiple processing and transfer areas connected together. Processing areas may have individual stacked components, which may have been machined prior to production. When a vacuum is applied to the system, machine tolerances can affect component coupling and, in some cases, may lead to leaks.

[0006] Therefore, there is a need for improved systems and components that can be used to create sealed areas within semiconductor processing chambers and systems. This technology addresses these and other needs. Summary of the Invention

[0007] An exemplary substrate processing system may include a chamber body defining a transfer region. The system may include a first cover plate disposed on the chamber body along a first surface of the first cover plate. The first cover plate may define a plurality of holes through the first cover plate. The system may include a plurality of cover stacks, the number of cover stacks being equal to the number of holes in the plurality of holes. The plurality of cover stacks may at least partially define a plurality of processing regions vertically offset from the transfer region. The system may include a second cover plate coupled to the plurality of cover stacks. The plurality of cover stacks may be located between the first cover plate and the second cover plate. Components of each of the plurality of cover stacks may be coupled to the second cover plate.

[0008] In some embodiments, the system may include a plurality of substrate supports disposed around a transfer region. Each of the plurality of substrate supports is translatable vertically along a central axis of the substrate support between a first position and a second position. A first cover plate may further define a recessed bracket in a second surface of the first cover plate along each of a plurality of holes, the second surface being opposite to a first surface of the first cover plate. Each of a plurality of cover stacks may be disposed on the first cover plate on a separate recessed bracket defined in the second surface of the first cover plate. The transfer region may include a transfer device rotatable along a central axis and configured to engage a substrate and transfer the substrate between the plurality of substrate supports within the transfer region. A second cover plate may define a plurality of holes passing through the second cover plate. Each of the plurality of holes may receive a cover stack of the plurality of cover stacks. The substrate processing system may also include a plurality of output manifolds, each of the plurality of output manifolds being disposed in a separate hole in the plurality of holes defined through the second cover plate.

[0009] A component of each of a plurality of cover stacks coupled to a second cover plate may be characterized by a first surface facing the second cover plate and by a second surface relative to the first surface. The system may include a first O-ring positioned on the first surface of a component of each of the plurality of cover stacks coupled to the second cover plate. Each first O-ring may engage a corresponding output manifold. A component of each of the plurality of cover stacks may be coupled to the second cover plate at multiple locations by a plurality of engagement devices. Each engagement device may include a bolt extending through a component of each cover stack and engaging the second cover plate. The device may include: a washer abutting against the bolt; and a spring engaging the washer at a first end and engaging a component of each cover stack at a second end opposite the first end. Each engagement device may include a clamp extending around the bolt. The clamp may be sized to position the washer along the second surface of the washer when the bolt is disengaged from the second cover plate. A gap is maintained between the clamp and the washer when the bolt engages the second cover plate. Each engagement device may have a first clamp, and each engagement device may also include a second clamp extending around the bolt. Each second clamp may be sized to position the washer along the second surface of the washer when the bolt is disengaged from the second cover plate.

[0010] Some specific embodiments of this technology may include a substrate processing system. The system may include a chamber body defining a transfer region. The system may include a first cover plate disposed on the chamber body along a first surface of the first cover plate. The first cover plate may define a plurality of holes through the first cover plate. The system may include a plurality of cover stacks, the number of cover stacks being equal to the number of holes in the plurality of holes. The plurality of cover stacks may at least partially define a plurality of processing regions vertically offset from the transfer region. Each of the plurality of cover stacks may include an air chamber. The system may include a second cover plate coupled to the plurality of cover stacks. The plurality of cover stacks may be located between the first cover plate and the second cover plate. The air chamber of each of the plurality of cover stacks may be coupled to the second cover plate by a plurality of engagement devices. Each engagement device may include a spring that compressibly engages the air chamber to the second cover plate.

[0011] In some embodiments, each engagement device may include a shouldered bolt extending through the air chamber and engaging a second cover plate. When the shouldered bolt is fully engaged with the second cover plate, the shank of the shouldered bolt abuts against the second cover plate. Each engagement device may include a washer that rests against the shouldered bolt around the shank at the head of the shouldered bolt. Each engagement device may include a spring that engages the washer at a first end and engages the air chamber at a second end of the spring opposite the first end. Each engagement device may include a clamp disposed within the air chamber around the shouldered bolt. The clamp may be sized to position the washer along a second surface of the washer when the shouldered bolt disengages from the second cover plate. A gap may be maintained between the clamp and the washer when the shank of the shouldered bolt abuts against the second cover plate. The system may include a transfer device positioned within a transfer region and rotatable about a central axis. The transfer device may be configured to engage substrates and transfer substrates between multiple substrate supports within the transfer region. The second cover plate may define a plurality of holes through the second cover plate. Each of the plurality of holes may receive a stack of covers in a plurality of cover stacks. The substrate processing system may include multiple output manifolds, each of which is disposed in a separate hole among multiple holes defined by a second cover plate. The system may include a remote plasma unit, which is mounted on the second cover plate and fluidly coupled to each of the multiple output manifolds.

[0012] Some specific embodiments of this technology may include an air box assembly. The assembly may include an air box, characterized by a first surface and a second surface opposite the first surface. A recess is defined within the air box from the second surface, and a hole is defined therein through the first surface into the recess. A component may include a first clip disposed within the air box in the recess. A bolt may be included, positioned within the recess and extending through the hole defined in the first surface of the air box. The assembly may include a washer extending about the bolt and located between the first clip and the first surface of the air box. The assembly may include a second clip extending about the bolt and located between the washer and the first surface of the air box. The assembly may include a spring located in the recess and engaging the washer at a first end of the spring, and engaging the air box at a second end of the spring opposite the first end.

[0013] This technology offers several advantages over conventional systems and techniques. For example, the engagement device can help generate sufficient compression relative to the sealing gaskets used within the system. Additionally, the engagement device can balance gap formation on multiple sides of the chamber components to ensure a proper seal during processing. These, along with other specific embodiments (and many of their advantages and features), are described in more detail in conjunction with the following description and accompanying drawings. Attached Figure Description

[0014] The nature and advantages of the disclosed technology can be further understood by referring to the rest of the specification and the accompanying drawings.

[0015] Figure 1A A schematic top view of an exemplary processing tool according to some embodiments of the present technology is shown.

[0016] Figure 1B A schematic partial cross-sectional view of an exemplary processing system according to some embodiments of the present technology is shown.

[0017] Figure 2 A schematic perspective view of the transfer portion of an exemplary substrate processing system according to some embodiments of the present technology is shown.

[0018] Figure 3 A schematic cross-sectional view of an exemplary system arrangement of an exemplary substrate processing system according to some embodiments of the present technology is shown.

[0019] Figure 4 A schematic cross-sectional view of an exemplary system arrangement of an exemplary substrate processing system according to some embodiments of the present technology is shown.

[0020] Figure 5 A schematic bottom view of a cover stack component of an exemplary substrate processing system according to some embodiments of the present technology is shown.

[0021] Figure 6A schematic cross-sectional view of a component assembly according to some embodiments of the present technology is shown.

[0022] Figure 7 A schematic cross-sectional view of a component assembly according to some embodiments of the present technology is shown.

[0023] Several accompanying figures are included for illustrative purposes. It should be understood that the figures are for illustrative purposes and should not be considered as having actual dimensions or scale unless specifically stated otherwise. Furthermore, as illustrative, the figures are provided to aid understanding and may not include all aspects or information relative to the actual presentation, and may contain exaggerations for illustrative purposes.

[0024] In the accompanying drawings, similar parts and / or features may have the same reference numerals. Furthermore, parts of the same type may be distinguished by letters following the reference numerals, which differentiate similar parts. If only the first reference numeral is used in the description, its description is applicable to any similar parts having the same first reference numeral, regardless of the last letter. Detailed Implementation

[0025] Substrate processing can include time-consuming operations for adding, removing, or otherwise modifying materials on wafers or semiconductor substrates. Efficiently moving substrates can reduce queuing time and increase substrate throughput. To increase the number of substrates processed in a clustering tool, additional chambers can be incorporated into the main unit. While transfer robots and processing chambers can be added sequentially by lengthening the tool, space efficiency can decrease as the footprint of the clustering tool increases. Therefore, this technology can include clustering tools with an increased number of processing chambers within a defined footprint. To accommodate a limited footprint with respect to a transfer robot, this technology can increase the number of processing chambers laterally outward from the robot. For example, some conventional clustering tools may include one or two processing chambers positioned around a centrally located portion of the transfer robot to maximize the number of radial chambers surrounding the robot. This technology can be expanded conceptually by incorporating additional chambers laterally as another row or another set of chambers. For example, this technology can be applied with clustering tools comprising three, four, five, six, or more processing chambers, which can enter at each of one or more robot entry positions.

[0026] With the addition of additional processing locations, it may no longer be feasible to retrieve these locations from a central robot without additional transfer capabilities at each location. Some conventional techniques may include a wafer carrier on which the substrate is held during transport. However, wafer carriers can cause thermal inhomogeneity and particulate contamination on the substrate. This technology overcomes these problems by combining a transport section vertically aligned with the processing chamber area with a rotary conveyor or transfer device that can cooperate with a central robot to retrieve additional wafer locations. The substrate support can then be vertically translated between the transfer area and the processing area to transport the substrate for processing.

[0027] Each individual processing location may include separate cap stacks to deliver processing precursors to separate processing areas in an improved and more uniform manner. While each cap stack may include substantially identical components, machining and manufacturing tolerances can cause variations in component flatness, thickness, or other component characteristics. Although some of these tolerance inconsistencies may be accommodated by gaskets or O-rings placed between each cap component, some situations may result in one or more cap stacks exhibiting significant differences from other cap stacks, a situation that cannot be resolved by O-rings. This technology overcomes these problems by incorporating one or more engagement devices that control the clearance distance between system components while ensuring compliance with the characteristics of both O-rings and component structures.

[0028] While the following disclosure will conventionally identify specific structures for which this structure and method can be used, such as four-position transfer regions, it will be readily understood that the bonding devices or components are equally applicable to any number of other systems or chambers, and any other devices in which multiple components can be bonded or coupled. Therefore, the technology should not be considered limited to use with any particular chamber. Moreover, although exemplary tool systems will be described to provide the basis of this technology, it should be understood that this technology can be combined with any number of semiconductor processing chambers and tools that can benefit from some or all of the operation and embodiments of the systems to be described.

[0029] Figure 1AA top view of one embodiment of a substrate handling tool or system 100 for deposition, etching, baking, and curing chambers according to some embodiments of the present technology is shown. In the figure, a set of front-opening standard chambers 102 provide substrates of various sizes, which are received by robotic arms 104a and 104b in a factory interface 103 and placed in a load-locking device or low-pressure holding area 106 before being transferred to one of the substrate handling areas 108 located in a chamber system or quadruple sections 109a-c, each of which may be a substrate handling system having a transfer area fluidly coupled to multiple handling areas 108. Although a quadruple system is shown, it should be understood that platforms including independent chambers, dual chambers, and other multi-chamber systems are also covered by the present technology. A second robotic arm 110, housed in a transfer chamber 112, can be used to transfer substrate wafers from the holding area 106 to the quadruple section 109 and back, and the second robotic arm 110 may be housed in the transfer chamber, with each quadruple section or processing system connectable to the transfer chamber. Each substrate processing area 108 can be configured to perform a number of substrate processing operations, including any number of deposition processes, including cyclic layer deposition, atomic layer deposition, chemical vapor deposition, physical vapor deposition, as well as etching, pre-cleaning, annealing, plasma treatment, degassing, orientation, and other substrate processing.

[0030] Each quadruple section 109 may include a transfer area that can receive and transfer a substrate from and to the second robotic arm 110. The transfer area of ​​the chamber system may be aligned with a transfer chamber having the second robotic arm 110. In some embodiments, the transfer area may be laterally accessible to the robot. In subsequent operations, components of the transfer section may vertically translate the substrate into the overlay processing area 108. Similarly, the transfer area may also be used to rotate the substrate between locations within each transfer area. The substrate processing area 108 may include any number of system components for depositing, annealing, curing, and / or etching a film of material on a substrate or wafer. In one configuration, two sets of processing areas (e.g., processing areas in quadruple sections 109a and 109b) may be used to deposit material on the substrate, and a third set of processing chambers (e.g., processing chambers or areas in quadruple section 109c) may be used to cure, anneal, or process the deposited film. In another configuration, all three sets of chambers, such as all twelve chambers shown, may be configured to deposit and / or cure films on the substrate.

[0031] As shown, the second robotic arm 110 may include two arms for simultaneously transporting and / or retrieving multiple substrates. For example, each quadruple section 109 may include two inlets 107 along a surface of the housing of the transfer area, which may be laterally aligned with the second robotic arm. Inlets may be defined along a surface adjacent to the transfer chamber 112. In some embodiments, such as those shown, a first inlet may be aligned with a first substrate support among the multiple substrate supports of the quadruple section. Additionally, a second channel may be aligned with a second substrate support among the multiple substrate supports of the quadruple section. In some embodiments, the first substrate support may be adjacent to the second substrate support, and the two substrate supports may define a first column of substrate supports. In the configuration shown, the second column of substrate supports may be located behind the first column of substrate supports, which extend laterally outward from the transfer chamber 112. The two arms of the second robotic arm 110 may be spaced apart to allow both arms to simultaneously enter the quadruple section or chamber system to transport or retrieve one or two substrates to substrate supports within the transfer area.

[0032] Any one or more transfer regions described may be combined with additional chambers separate from the manufacturing systems shown in the different embodiments. It will be understood that System 100 is conceived of additional configurations for chambers for the deposition, etching, annealing, and curing of material films. Furthermore, this technology can utilize any number of other processing systems, which may be combined with a transport system for performing any specific operation such as substrate movement. In some embodiments, processing systems, such as the described holding and transfer regions, may provide access to multiple processing chamber regions while maintaining a vacuum environment in each section, allowing operations to be performed in multiple chambers while maintaining a specific vacuum environment between individual processes.

[0033] Figure 1B A schematic cross-sectional front view of one embodiment of an exemplary processing tool according to some embodiments of the present technology is shown, for example, through a chamber system. Figure 1B A cross-sectional view through any two adjacent processing regions 108 of any quadrant 109 can be shown. A front view can show the configuration or fluid coupling of one or more processing regions 108 with transfer regions 120. For example, continuous transfer regions 120 can be defined by a transfer region housing 125. The housing can define an open internal space in which multiple substrate supports 130 can be arranged. For example, as... Figure 1AAs shown, the exemplary processing system may include four or more substrate supports 130 distributed within a housing around a transfer region. As illustrated, the substrate supports may be bases, although many other configurations may also be used. In some embodiments, the bases may be vertically translatable between the transfer region 120 and a processing region covering the transfer region. The substrate supports may be vertically translatable along a path between a first and a second position within the chamber system along a central axis of the substrate support. Thus, in some embodiments, each substrate support 130 may be axially aligned with an overlying processing region 108 defined by one or more chamber components.

[0034] An open transfer area provides the ability of a transfer device 135, such as a rotary conveyor belt, to engage between various substrate supports and, for example, to rotate substrates. The transfer device 135 can rotate about a central axis. This allows substrates to be positioned for processing within any processing area 108 within the processing system. The transfer device 135 may include one or more end actuators that can engage the substrate from above, below, or with the outer edge of the substrate to move around the substrate support. The transfer device can receive substrates from a transfer chamber robot (e.g., the robot 110 described previously). The transfer device can then rotate the substrate in place of the substrate support to facilitate the transport of additional substrates.

[0035] Once positioned and awaiting processing, the transfer device can position the terminal actuator or arm between the substrate supports, allowing the substrate supports to be lifted through the transfer device 135 and the substrate to be transported into the processing area 108, which may be offset vertically relative to the transfer area. For example, and as shown, substrate support 130a may transport the substrate into processing area 108a, while substrate support 130b may transport the substrate into processing area 108b. This may occur in the other two substrate supports and processing areas, as well as in additional substrate supports and processing areas in embodiments that include additional processing areas. In this configuration, when operatively engaged, for example, at a second position, to process the substrate, the substrate supports may define the processing area 108 at least partially from below, and the processing area may be axially aligned with the associated substrate support. The processing area may be defined from above by the panel 140 and other cover stack components. In some embodiments, each processing area may have a separate cover stack component, although in some embodiments, these components may accommodate multiple processing areas 108. Based on this configuration, in some embodiments, each processing region 108 may be fluidly coupled to a transfer region while being fluidly isolated from each other processing region above within a chamber system or quadruple section.

[0036] In some embodiments, panel 140 may serve as an electrode of the system to generate localized plasma within processing region 108. As shown, each processing region may utilize or incorporate a separate panel. For example, panel 140a may be included to define processing region 108a from above, and panel 140b may be included to define processing region 108b from above. In some embodiments, a substrate support may serve as a mating electrode for generating capacitively coupled plasma between the panel and the substrate support. Depending on the spatial geometry, pumping liner 145 may define processing region 108 at least partially radially or laterally. Similarly, a separate pumping liner may be used for each processing region. For example, pumping liner 145a may define processing region 108a at least partially radially, while pumping liner 145b may define processing region 108b at least partially radially. In embodiments, a barrier 150 may be located between cover 155 and panel 140, and may again include separate barrier liners to facilitate fluid distribution within each processing region. For example, a barrier plate 150a may be included to distribute to the processing area 108a, and a barrier plate 150b may be included to distribute to the processing area 108b.

[0037] Cover 155 may be a separate component for each processing region, or it may include one or more common aspects. In some embodiments, cover 155 may be one of two separate covers of the system. For example, a first cover 158 may be located above transfer region housing 125. The transfer region housing may define an open space, and the first cover 158 may include a plurality of holes through the cover that divide the overlying space into specific processing regions. In some embodiments, such as those shown, cover 155 may be a second cover and may be a single component defining a plurality of holes 160 for delivering fluid to the respective processing regions. For example, cover 155 may define a first hole 160a for delivering fluid to processing region 108a, and cover 155 may define a second hole 160b for delivering fluid to processing region 108b. Additional holes may be defined when additional processing regions are included within each portion. In some embodiments, each quadruple portion 109 or multiple processing region portions that may accommodate more or fewer than four substrates may include one or more remote plasma units 165 for delivering plasma effluent to a processing chamber. In some embodiments, individual plasma units may be incorporated into each chamber processing area, although in some embodiments, fewer remote plasma units may be used. For example, as shown, a single remote plasma unit 165 may be used for multiple chambers, such as two, three, four or more chambers, up to all chambers in a particular quadrant. In embodiments of this technology, conduits may extend from the remote plasma unit 165 to each orifice 160 for delivering plasma effluent for processing or cleaning.

[0038] In some embodiments, the purification channel 170 may extend through the transfer area housing near or adjacent to each substrate support 130. For example, multiple purification channels may extend through the transfer area housing to provide a fluid pathway for delivering fluidly coupled purified gas into the transfer area. The number of purification channels may be the same as or different from the number of substrate supports within the processing system, including more or fewer. For example, the purification channel 170 may extend through the transfer area housing below each substrate support. In the case where two substrate supports 130 are shown, a first purification channel 170a may extend through the housing adjacent to substrate support 130a, and a second purification channel 170b may extend through the housing adjacent to substrate support 130b. It should be understood that any additional substrate support may similarly have a drooping purification channel extending through the transfer area housing to provide purified gas into the transfer area.

[0039] As the purge gas is delivered through one or more purge channels, it can similarly exit through a pumping liner 145, which provides all exhaust paths from the treatment system. Therefore, in some embodiments, both the treatment precursor and the purge gas can exit through the pumping liner. The purge gas can flow upwards to an associated pumping liner; for example, purge gas flowing through purge channel 170b can exit the treatment system from pumping liner 145b.

[0040] As indicated, the processing system 100, or more specifically, a quadruple or chamber system combined with the system 100 or other processing systems, may include a transfer section located below the processing chamber region shown. Figure 2 A schematic isometric view of the transfer portion of an exemplary chamber system 200 according to some embodiments of the present technology is shown. Figure 2 Other aspects or variations of the aforementioned transfer region 120 may be shown, and may include any of the described components or features. The illustrated system may include a transfer region housing 205 defining the transfer region, which may include multiple components. The transfer region may also be additionally defined from above, at least partially, by a processing chamber (or a processing region fluidly coupled to the transfer region), for example... Figure 1AThe processing chamber area 108 is shown in the quadruple section 109. The sidewalls of the transfer area housing may define one or more access points 207 through which substrates can be delivered and retrieved, for example, via the second robotic arm 110 as described above. The access point 207 may be a slit valve or other sealable access point; in some embodiments, the sealable access point may include a door or other sealing mechanism to provide an airtight environment within the transfer area housing 205. Although two such access points 207 are shown, it should be understood that in some embodiments, only a single access point 207 may be included, as well as access points on multiple sides of the transfer area housing. It should also be understood that the dimensions of the illustrated transfer portion can be configured to accommodate any substrate size, including substrates of 200 mm, 300 mm, 450 mm, or larger or smaller, including substrates characterized by any number of geometries or shapes.

[0041] Within the transfer area housing 205, there may be a plurality of substrate supports 210 spatially positioned around the transfer area. Although four substrate supports are shown, it should be understood that embodiments of the present technology similarly cover any number of substrate supports. For example, according to embodiments of the present technology, more than or approximately three, four, five, six, eight or more substrate supports 210 may be accommodated in the transfer area. A second robotic arm 110 may transfer substrates through inlet 207 to one or both of substrate supports 210a or 210b. Similarly, the second robotic arm 110 may retrieve substrates from these locations. Lifting pins may extend from the substrate supports 210 and may allow the robotic arm to access beneath the substrate. In some embodiments, the lifting pins may be fixed to the substrate supports, or fixed in a location where the substrate supports may be recessed below, or the lifting pins may additionally be raised or lowered via the substrate supports. The substrate supports 210 may be vertically translatable and, in some embodiments, may extend to a processing chamber region of the substrate processing system located above the transfer area housing 205, such as processing chamber region 108.

[0042] The transfer area housing 205 provides a channel 215 to an alignment system, which may include an aligner extending, as illustrated, through an aperture in the transfer area housing. This aligner may be operated in conjunction with a laser, camera, or other monitoring device protruding or transmitting through adjacent apertures to determine whether the transferred substrate is properly aligned. The transfer area housing 205 may also include a transfer device 220 operable in various ways to position and move substrates between various substrate supports. In one example, the transfer device 220 may move substrates from substrate supports 210a and 210b to substrate supports 210c and 210d, allowing additional substrates to be transferred into the transfer chamber. Additional transfer operations may include rotating the substrates between substrate supports for further processing within the covered processing area.

[0043] The transfer device 220 may include a central hub 225, which may include one or more shafts extending into the transfer chamber. Coupled to the shafts is a terminal actuator 235. The terminal actuator 235 may include a plurality of arms 237 extending radially or laterally outward from the central hub. Although shown with the arms extending from a central body, the terminal actuator may additionally include individual arms, each coupled to a shaft or the central hub in various embodiments. Any number of arms may be included in embodiments of the art. In some embodiments, the number of arms 237 may be similar to or equal to the number of substrate supports 210 included in the chamber. Thus, as shown, for four substrate supports, the transfer device 220 may include four arms extending from the terminal actuator. The arms may be characterized by any number of shapes and profiles, such as straight or arcuate profiles, and include any number of remote profiles, including hooks, loops, forks, or other designs for supporting and / or receiving substrates (e.g., for alignment or engagement).

[0044] The terminal actuator 235 or a component or portion thereof may be used to contact the substrate during transfer or movement. These components and the terminal actuator may be made of or comprise a variety of materials, including conductive and / or insulating materials. In some embodiments, the material may be coated or plated to withstand contact with precursors or other chemicals that may enter the transfer chamber from the overlay processing chamber.

[0045] In addition, materials can be provided or selected to withstand other environmental characteristics, such as temperature. In some embodiments, a substrate support can be used to heat a substrate disposed on the support. The substrate support can be configured to increase the surface or substrate temperature to greater than or about 100°C, greater than or about 200°C, greater than or about 300°C, greater than or about 400°C, greater than or about 500°C, greater than or about 600°C, greater than or about 700°C, greater than or about 800°C, or higher. Any of these temperatures can be maintained during operation, so components of the transfer device 220 may be exposed to any of these stated or covered temperatures. Therefore, in some embodiments, any material can be selected to accommodate these temperature ranges, and materials such as ceramics and metals may be included, which may be characterized by relatively low coefficients of thermal expansion or other beneficial properties.

[0046] The component coupler can also be adapted to operate in high-temperature and / or corrosive environments. For example, when both the terminal actuator and the end portion are ceramic, the coupler may include press-fit, snap-fit, or other fittings not made of other materials, such as bolts, which may expand and contract with temperature and may cause the ceramic to crack. In some embodiments, the end portion may be continuous with the terminal actuator and may be integrally formed with the terminal actuator. Any number of other materials that may facilitate or resist operation during operation can be used, and the present technology similarly covers other materials.

[0047] Figure 3 A schematic cross-sectional view of an exemplary processing system 300, representing an exemplary substrate processing system according to some embodiments of the present technology, is shown. This figure can illustrate aspects of the aforementioned processing system and components, and can also illustrate other aspects of the system. The figure can show a simplified form of the system, in which many components are removed to facilitate the illustration of the coupling of the cover stack components. It should be understood that processing system 300 may include any aspect of any part of a processing system described or shown elsewhere, and can illustrate aspects of a cover stack combined with any system described elsewhere. For example, processing system 300 may show a part of a system covering a transfer region of a chamber, and may show components located above the chamber body that define the transfer region, as previously described. It should be understood that any previously mentioned components can still be incorporated, such as those including the transfer region and any components previously described for a system including components of processing system 300.

[0048] As previously described, a multi-chamber system may include separate cover stacks for each processing region. Processing system 300 may show a view of two cover stacks, which may be part of a multi-chamber system comprising two, three, four, five, six, or more processing chamber portions. As described above, one or more cover plates may comprise separate cover stacks for each processing region. For example, as shown, processing system 300 may include a first cover plate 305, which may be or include any aspect of the cover plate 158 described above. For example, the first cover plate 305 may be a single cover plate, which may be disposed on a transfer region housing or chamber body as previously described. The first cover plate 305 may be disposed on the housing along a first surface of the cover plate. The cover plate 305 may define a plurality of holes 306 through the cover plate, thereby allowing vertical translation of a substrate into the defined processing region, as described above.

[0049] As previously described, multiple cover stacks may be located on the first cover plate 305. In some embodiments, the first cover plate 305 may define a recessed ledge 307 extending from a second surface of the first cover plate 305 opposite to a first surface. The recessed ledge 307 may extend around each of a plurality of holes 306. Each individual cover stack 310 may be located on a separate recessed ledge 307. The number of cover stacks included in the plurality of cover stacks 310 is equal to the number of holes defined by the plurality of holes through the first cover plate. As described above, the cover stacks may at least partially define a plurality of processing areas vertically offset from the transfer area. Although two holes 306 and two cover stacks 310 are shown, it should be understood that the processing system 300 may include any number of cover stacks having similar or previously discussed components in conjunction with the systems in the embodiments included in the present invention.

[0050] In embodiments, the cover stack may include any number of components, and may include any of the components described above. For example, the cover stack components may include a liner 312, a pumping pad 314, a panel 316, and a barrier plate 318. The panel 316 and the barrier plate 318 may define a plurality of holes for dispensing the processing precursor into a processing area defined above by the panel 316, and are at least partially defined radially by the pumping pad 314. A substrate support member, which translates upward toward the panel through a corresponding hole 306 in the first cover 305, may define the processing area at least partially from below.

[0051] Extending over the cover stack 310 may be a second cover plate 320. The second cover plate 320 may extend entirely over each cover stack of the processing system and may provide access to individual processing areas via a plurality of holes 321 defined through the second cover plate 320. Each hole 321 may provide a fluid passage to the respective cover stack, and the hole 321 may be axially aligned with the corresponding cover stack and / or substrate support, as previously shown. An output manifold 322 may be disposed within the holes of the second cover plate 320. As shown, the output manifold may be at least partially positioned within the holes through the second cover plate 320 and may be at least partially mounted on the second cover plate. The output manifold may be fluidly coupled to one or more precursor delivery sources and may provide a fluid passage from a remote plasma source as previously described. Each remote plasma source may be coupled to each output manifold, or one or more remote plasma sources may be coupled to multiple output manifolds, as described above.

[0052] The cover stack components 310 may be arranged together and may or may not be mechanically coupled together. As shown, resilient components (e.g., washers or O-rings) may be located between each plate. The resilient components may be located in grooves or channels formed along adjacent surfaces of the plates. In some embodiments shown, the resilient components may be vertically aligned to limit or prevent any cantilever effects of position when a vacuum is applied to the chamber. To facilitate a seal between the second cover plate 320 and the cover stack, in some embodiments, at least one component of each of the plurality of cover stacks may be coupled to the second cover plate 320.

[0053] As shown, at least one cover stack component (which may be a gas chamber 325 in some embodiments) may be coupled to the back side of the second cover plate 320 as shown. Although in some embodiments the output manifold may be located on the first surface of the cover along with a remote plasma source, the gas chamber may be coupled to the second surface of the second cover plate opposite the first surface. In some embodiments, a flange may extend from the first surface of the gas chamber 325, on which the gas chamber may be positioned against the second cover plate. In some embodiments, as will be further described below, a recessed cavity may extend from the second surface of the gas chamber 325, wherein the second surface of the gas chamber may be positioned on the barrier plate 318 as shown. Any number of cover stack components may be coupled to the second cover plate 320, while any number of other cover stack components may be located on or coupled to the first cover plate 305. In some embodiments, only a single plate may be coupled to the second cover plate 320, and this single plate may be the topmost plate of the cover stack (and may be the gas chamber 325).

[0054] As previously stated, each cover stack 310 may include identical components, all of which may be manufactured in a similar manner. However, machine tolerances may cause variations between components and may affect the flatness of any component, including the second cover. Furthermore, tolerances may affect the thickness of components. While any variations are likely to be relatively evenly distributed among the components of the individual cover stacks, in some cases, the combined effect may cause one cover stack to shift relative to one or more other cover stacks. Because the second cover 320 may be relatively flat relative to each of the multiple cover stacks, this shift can result in gaps forming within a cover stack.

[0055] Figure 3This illustrates a situation where tolerance differences may concentrate within a cover stack 310, potentially leading to a gap between the gas chamber 325 and the second cover plate 320. While the gap may be relatively small, such as less than 1 mm, or less than or approximately 0.5 mm, it can still be sufficient to cause leakage within the system. For example, an elastic component or O-ring 330 may be positioned or located between the gas chamber 325 and the second cover plate 320. As shown, the O-ring is located between the output manifold 322 and the gas chamber, and the O-ring can form a vacuum seal through the fluid path between the components. To ensure a sufficient seal, the O-ring can be placed at a specific pressure depending on the cross-sectional diameter of the component. For example, the O-ring 330 is characterized by a cross-sectional diameter less than or approximately 10 mm, less than or approximately 7 mm, less than or approximately 5 mm, or smaller. Gaps caused by tolerance issues can be characterized by a distance less than or approximately 1 mm, and can be less than or approximately 0.7 mm, less than or approximately 0.6 mm, less than or approximately 0.5 mm, or smaller.

[0056] In cases where the cover stack 310 has components mounted on the first cover plate 305 and one or more components coupled to the second cover plate 320, this gap can be accommodated in several ways. For example, if the second cover plate 320 rests entirely against the second cover plate 320, greater compression can be applied to the O-ring 330, which can limit or prevent any leakage between components. However, a gap may then form between the gas box 325 and the baffle plate 318, which could lead to system leakage when a vacuum is applied to the system. Therefore, the gas box 325 or any component coupled to the second cover plate 320 can be coupled less tightly to the second cover plate. Because the consistency of component coupling can affect system performance, stepped bolts (e.g., shoulder bolts or bolts that accommodate sleeves or liners) can be included to secure the gas box 325 to the second cover plate 320 to ensure a more uniform gap distribution between the second cover plate and the gas box (and between the baffle plate and the gas box). However, due to the elastomeric components between the gas chamber and the second cover plate, and by compensating for the gap with shoulder bolts, the O-ring 330 may not compress sufficiently when a vacuum is applied to the system, generating a force on the gas chamber to push it away from the second cover plate. For example, on a 7mm O-ring, to ensure sufficient deflection to produce a adequate seal, and depending on the O-ring's material and other properties, compression of approximately 15% or more may be required. When a vacuum is applied and the gas chamber 325 can be pulled away from the second cover plate, the weight of the components on the cover plate and the vacuum force may not be sufficient to maintain adequate compression of the O-ring.

[0057] When a vacuum is drawn into the system, the vacuum may act on the shoulder bolt 335 in the opposite direction to the coupling with the second cover plate. This may subsequently reduce the adjustment force on the gas box and potentially result in more clearance distribution between the gas box 325 and the second cover plate 320. For example, other cover stack components may be pulled toward the first cover plate, which could further compress the O-rings between these components and ensure adequate sealing. Because the gas box 325 or other components can be bolted to the second cover plate in the direction opposite to the suction force on the system, it can resist the force of the bolts and reduce the compression of the O-ring 330 when a vacuum is drawn in the opposite direction. With more clearance distribution between the gas box and the second cover plate, there may be no other reaction force, therefore, even if the O-rings between the gas box and the baffle plate are more fully compressed, the compression of the O-ring 330 may be reduced. As more full clearance appears at the interface between the gas box and the second cover, the compression of the O-ring may decrease to below 15% or about 15%, below 10% or about 10%, below 7% or about 7%, below 6% or about 6%, below 5% or about 5% or less, which may lead to system leakage. This technology can overcome this problem by providing a coupling device that generates a reaction force on the gas box and the O-ring, which can limit the clearance at the second cover when a vacuum is applied.

[0058] Figure 4 A schematic cross-sectional view of an exemplary processing system 300 according to some embodiments of the present technology is shown. This figure may have... Figure 3 The same components, and may include any feature, component, or characteristic of any component or aspect of any system previously described. Figure 4 The engagement of coupling device 405 can be illustrated. Coupling device 405 can provide a reaction force against bolt 335 and vacuum applied to the system to press gas box 325 against second cover plate 320 and reduce or control any gaps between components. Exemplary coupling devices will be described in more detail below and may include a spring that operates to provide a rearward force toward the gas box towards the second cover plate 320. Bolt 335 or any other coupling device may form a specific position of the gas box relative to the second cover plate 320, or may ensure a basic amount of compression before the system is evacuated, and may ensure a certain amount of compression on O-ring 330. Once evacuated, the compression on the O-ring may decrease, which can lead to system leakage at O-ring 330, although additional compression may occur on the O-ring between the gas box and the baffle plate.

[0059] Embodiments of this technology incorporating each bolt coupling the gas box 325 to the second cover plate 320 can at least partially compensate for the vacuum effect by engaging the gas box 325 and pressing the gas box back toward the second cover plate 320 by at least a certain amount. The engagement device may include any number of components as described below, and in some embodiments may include bolts 335, but the engagement device may include at least one spring component or compressible component that generates a reaction force when compressed. Therefore, when a vacuum is drawn into the system and force is applied toward the pump liner or lower cover plate on each component of the cover stack, the engagement device can provide a reaction force on the gas box or one or more components of the cover stack coupled to the second cover plate. This can reduce or limit the effect of vacuum on reducing the compression of the O-ring 330.

[0060] Figure 4 Embodiments according to some embodiments of the present technology are shown, including a flange or lip extending around the gas chamber and providing a coupling surface for bolts extending upward through the gas chamber to couple a component to a second cover plate. Additional embodiments may include one or more recesses or gaps formed within the gas chamber, and engagement devices according to some embodiments of the present technology may be arranged in the recesses or gaps. Figure 5 A schematic bottom view of a cover stack component 500 of an exemplary substrate processing system according to some embodiments of the present technology is shown. The cover stack component 500 may be (or include) any component of the cover stack component that can be coupled to a second cover plate, as previously described. For example, the cover stack component 500 may be an air box, and may be any air box as previously described, or include any feature or characteristic of an air box or any other cover stack component described above. A bottom view may show a second surface 505 of an exemplary air box, wherein a first surface opposite the second surface may abut against or be coupled to a second cover plate as previously described. The structure may show recesses or grooves 508 in which O-rings or other components may be placed, which may facilitate sealing between the components and any other cover stack plate (e.g., the barrier plate described above) or other components that can engage the air box.

[0061] The cover stack component 500 may also define one or more recesses 510, including a plurality of recesses surrounding the component. The recesses may extend from the second surface 505 toward a first surface opposite the second surface, but may not extend completely through the thickness of the component. Holes 512 may extend from the recesses 510 through the first surface, and the size or shape of the holes 512 may be configured to receive bolts or coupling components for engaging the component 500 with the second cover plate, as previously shown. The recesses may be characterized by any shape or geometry, and in some embodiments, the recesses may be substantially cylindrical or fully cylindrical, as shown. As shown, the recesses may also at least partially intersect the outer radial edge of the component, which can provide additional passages from the radial edge of the gas chamber and from below the gas chamber (e.g., at the second surface). Thus, the component 500 may be characterized by an incomplete outer radial edge, which may exhibit a gap at each recess, thereby providing passage along the outer radial edge of the component into the recess.

[0062] It should be understood that any other geometry of the component is also covered by embodiments of this technology and may include any of the features or characteristics described. Embodiments of this technology may include any number of grooves and corresponding engagement devices. The distribution between any two grooves may be equal, although the distance may be offset in some embodiments, although the distribution may be at least partially balanced around the component, and may include multiple aspects of the distribution symmetry shown. It should be understood that the configuration shown is merely an example, and this technology similarly covers any number of other arrangements.

[0063] Figure 6 A schematic cross-sectional partial view of component 600, such as a gas box component, is shown in some embodiments of the present technology. Component 600 can be included in any system previously described, and can be the gas box of any system discussed above. Component 605 can be or can include any component that can engage with another component of the system, including a second cover 610, which can include any aspect of a second cover as described above. It should be understood that this figure is not limited to any particular component and can include any two components that can be coupled together with engagement devices. Component 605 can be a gas box or other cover stack component. Component 605 can include one or more recesses defined around the periphery of the component, such as recess 510 shown above. A partial cross-section through recess 615 is shown, and engagement devices 620 may be included. According to embodiments of the present technology, the components can together include any number of engagement devices.

[0064] Component 605 may be characterized by a first surface 607, which may be adjacent to the second cover plate 610. Features of the component may be further characterized by a second surface 609, which may be a surface opposite to the first surface. A groove 615 may be formed by the second surface 609 and may extend at least partially toward the first surface 607 through the thickness of the component. In some embodiments, the groove may not extend through the first surface 607. A hole 617 may be formed by the first surface 607 and may provide a passage to the groove 615. In some embodiments, the hole may be characterized by a diameter smaller than that of the groove, and the hole 617 may be characterized by a diameter configured to receive a coupler (e.g., a bolt) passing through the hole to engage the second cover plate 610. As described above, the groove 615 may at least partially intersect the radial edge 619 of component 605 and may provide a radial passage to the groove as shown. An engagement device 620 may be disposed or positioned within the groove, and aspects of the engagement device 620 may extend at least partially outward to or beyond the radial edge 619 of component 605.

[0065] The engagement device 620 according to some embodiments of the present technology may include one or more aspects configured to generate a reaction force in a direction opposite to a vacuum or other force applied to the component 605, as previously explained. The engagement device 620 may include a plurality of components operatively coupled to apply force to the second cover plate 610 on the component 605. The engagement device 620 may specifically or may not specifically include a bolt 625 on which force can be applied, although in some embodiments the engagement device 620 may include a bolt 625. The bolt 625 may extend through a recess 615 and a hole 617 to engage the second cover plate 610, as shown. The bolt may include a head 626 characterized by a diameter greater than the bolt's shaft, and when engaged with the second cover plate 610, the head 626 may be located within the recess 615.

[0066] Although shown as a bolt, it should be understood that any of the various couplers can be used in embodiments of this technology, including screws or other fittings or components that can engage two parts. In some embodiments, the bolt may be at least partially threaded along the shaft (e.g., at the end remote from the head 626). The bolt may also define a step 627 near the distal end of the bolt, which can provide a platform where the bolt can be positioned against the second cover plate 610. The step 627 may be part of a sleeve or liner positioned around the bolt, or it may be part of the bolt itself. For example, in some embodiments, the bolt 625 may be a shoulder bolt or a stepped bolt, and the bolt 625 may form a step on the shaft portion as shown.

[0067] The engagement device may include a disc, such as washer 630. In some embodiments, the washer may be annular, characterized by an inner annular diameter and an outer annular diameter. As shown, the inner annular diameter may be larger than the shaft diameter of the bolt and may be larger than the diameter of the bolt bushing or shoulder. The outer annular diameter may be less than or equal to the groove diameter. The washer may be any substantially flat disc capable of distributing force over a larger area and may be a flat washer or a fender washer, as well as any other type of washer or disc. The washer may be positioned against the bolt and may contact the head 626 of the bolt when the bolt is engaged with the second cover plate 610.

[0068] The engagement device may also include a spring 635 or a compressible device, as shown, which engages with a washer 630 at a first end and with a component 605 at a second end, and may extend at least partially along the bolt. The spring may engage the component 605 along the inner surface of a recess, which may be a surface substantially parallel to the first surface 607 of the component. The first end of the spring may be located on the washer 630. Thus, when the bolt 625 engages with the second cover plate 610, the washer may compress the spring, and a force may then be applied to the component 605 toward the second cover plate 610. When a vacuum is applied to the system, this may generate a force in the opposite direction, which the spring may at least partially resist, which may help maintain adequate compression of the O-ring, as previously described. The spring may be configured to generate a degree of outward force when compressed to improve the compression of the O-ring without overcoming competing vacuum forces, which could otherwise increase the gap between the component 605 and the underlying component (e.g., the aforementioned barrier plate).

[0069] Therefore, in some embodiments, spring 635 may be configured to provide an outward force greater than or about 100 N, and may be configured to provide an outward force greater than or about 200 N, greater than or about 300 N, greater than or about 400 N, greater than or about 500 N, or greater. In some embodiments, multiple engagement devices may be included to provide a total force less than the force that can overcome vacuum forces and gravity due to the weight of the overlying component. For example, in some embodiments, the total force applied by the multiple engagement devices may be less than or about 5000 N, and may be less than or about 4000 N, less than or about 3500 N, less than or about 3000 N, less than or about 2800 N, less than or about 2600 N, less than or about 2400 N, less than or about 2200 N, less than or about 2000 N, or less. Any type of spring or compressible structure may be used as spring 635 and will generate a certain force upon compression. The spring may include a leaf spring, a compression spring, a wave spring, or any other type of spring. In some embodiments, wave springs can be used as shown, due to the range of expansion and the force sought for the component.

[0070] By utilizing springs as described and configured, engagement on the O-ring (e.g., O-ring 330 above) can be increased to provide compression greater than or about 15%, and compression greater than or about 18%, greater than or about 20%, greater than or about 22%, greater than or about 24%, greater than or about 26%, greater than or about 28%, or higher, although compression can be limited to ensure compression of components with underlying parts, such as between the gas chamber and the baffle. Therefore, compression can be maintained below 30% or about 30% before evacuating the system. Once evacuated, this may remove components from the second cover plate, reducing O-ring compression. The reaction force applied by the springs can ensure that O-ring compression remains greater than or about 10%, and compression can be maintained greater than or about 12%, greater than or about 14%, greater than or about 16%, greater than or about 18%, greater than or about 20%, or higher.

[0071] The engagement device may include additional components that retain the engagement device within a recess. For example, a first clamp 640 may be included within the recess to provide a stop for the components of the engagement device. For example, a groove or channel may be formed around the component 605 within the recess, and the first clamp 640, such as a C-clamp, retainer, or spring clip, may be positioned within the groove. When the bolt 625 is pulled from the second cover plate 610, the first clamp 640 may be sized to extend within the recess to engage a first surface of the washer 630, which opposes a second surface of the washer that contacts the spring 635. The outer annular edge of the washer 630 may be at least partially positioned on the clamp to ensure that the component is retained within the recess when it is disengaged from the second cover plate. Figure 6 The configuration of the bolt engaging with the second cover plate 610 is shown. When fully engaged with the cover plate, as shown, a gap can be maintained between the washer 630 and the clamp 640. Because the clamp is located within the component 605, if the washer remains in contact with the clamp during engagement, the spring will effectively exert force on the component in both directions when the component is pulled into the washer, thereby substantially eliminating any force on the second cover plate in one direction. Therefore, as shown, when the bolt is engaged in the second cover plate, a gap can be maintained between the washer and the clamp, and this gap can be greater than the distance by which the spring pulls the component back towards the second cover plate.

[0072] In some embodiments, the engagement device may include a second clamp 645, which may be located in a groove extending around the shaft or shoulder of the bolt 625. The second clamp may be sized to have an outer diameter greater than the inner annular diameter of the washer 630. Thus, when the bolt 625 is disengaged from the second cover plate 610, the second clamp 645 may be positioned on a second surface of the washer and ensure that the bolt is at least partially retained within the groove 615 for subsequent engagement. The second clamp 645 may be any type of clamp similar to the first clamp 640. Additionally, in embodiments, the grooves on the bolt shaft in which the clamp may be located may be spaced axially to ensure that the bolt can be completely removed from the second cover plate 610 before the second clamp engages the washer. The grooves may also be spaced axially to ensure that the clamp does not contact the component 605. For example, when the bolt is engaged with the second cover plate 610, the second clamp may be spaced apart from the gas chamber by a first distance, which may be greater than the distance adjustment during vacuuming on the system.

[0073] Because bolt 625 engages with second cover plate 610, the bolt and the corresponding second clamp will not move relative to the second cover plate when the system is evacuated. However, as described above, component 605, such as the gas box, can be at least partially pulled away from the second cover plate. Therefore, the second clamps can be spaced apart to ensure that their position is outside the change in component position after the system is evacuated. For example, in some embodiments, grooves can be spaced apart on the bolt relative to the position of the bolt through hole 617 to ensure a gap of a certain distance plus an additional amount corresponding to the tolerance clearance accommodated by the component. In an example where the tolerance clearance as described above can be approximately 0.5 mm, grooves can be formed along the bolt axis to ensure that the second clamp is at least 1 mm away from the gas box before the system is evacuated, while still allowing the bolt to be fully pulled out from the second cover plate before the second clamp contacts the washer. Therefore, in some embodiments, the distance of the grooves can be twice the corresponding tolerance clearance, or it can be the tolerance clearance plus some additional space amount, such as greater than or about 0.5 mm, greater than or about 1 mm, greater than or about 1.5 mm, greater than or about 2 mm, or greater.

[0074] Figure 7 A schematic cross-sectional partial view of component 600 according to some embodiments of the present technology is shown, and the component can be shown when bolt 625 is removed from second cover plate 610. As shown, bolt 625 is completely removed from second cover plate 610, which allows bolt to descend and spring 635 to extend. As shown, spring can extend until washer 630 is secured to first clip 640, and bolt 625 can descend until second clip 645 is secured to washer 630. Thus, component remains in recess to facilitate subsequent reinstallation. By utilizing the engagement device according to embodiments of the present technology, manufacturing tolerances can be controlled to limit or prevent sealing problems during system operation.

[0075] In the foregoing description, various details have been set forth for illustrative purposes in order to provide a thorough understanding of the various embodiments of this technology. However, it will be apparent to those skilled in the art that implementation of a particular embodiment may not require some of these specific details (or may require additional details).

[0076] Having disclosed several embodiments, those skilled in the art will understand that various modifications, alternative structures, and equivalent scopes can be used without departing from the spirit of the disclosed embodiments. Furthermore, some well-known processes and elements have not been described to avoid unnecessarily obscuring the technology. Therefore, the foregoing description should not be considered as limiting the scope of the technology. Additionally, methods or processes can be described as sequential or stepwise; however, it should be understood that operations can be performed simultaneously or in a different order than those listed.

[0077] When a range of values ​​is provided, it should be understood that, unless the context explicitly specifies otherwise, each intermediate value between the upper and lower limits of this range, down to the smallest portion of the lower limit unit, is also specifically disclosed. Any narrower range between any stated or unstated interventional value within the range and any other stated or interventional value within the range is included. The upper and lower limits of these narrower ranges may be independently included or excluded from this range, and each of the narrower ranges that includes one, both, or neither of the upper and lower limits is also included in this technique and subject to any specific exclusions in the stated range. When a stated range includes one or both of the upper and lower limits, ranges that exclude either or both of these upper and lower limits are also included.

[0078] The singular forms “a”, “an”, and “the” used in the specification and appended claims include plural references unless the background context clearly indicates otherwise. Thus, for example, a reference to “bolt” includes a plurality of such bolts, and a reference to “hole” includes a reference to one or more types of holes and an equivalent range known to a person skilled in the art, and so on.

[0079] Furthermore, the terms “comprise(s)”, “comprising”, “contain(s)”, “containing”, “include(s)”, and “having” as used in this specification and the following claims are intended to indicate the presence of the stated features, integers, components, or operations, but do not preclude the presence or addition of one or more other features, integers, components, operations, steps, or groups.

Claims

1. A substrate processing system, comprising: A chamber body defining a transfer area; A first cover plate is disposed on the chamber body along a first surface of the first cover plate, wherein the first cover plate defines a plurality of holes through the first cover plate; Multiple cap stacks, the number of cap stacks being equal to the number of holes through the multiple holes defined by the first cap plate, wherein the multiple cap stacks at least partially define multiple processing areas that are vertically offset from the transfer region; as well as A second cover plate is coupled to the plurality of cover stacks located between the first cover plate and the second cover plate, and a component of each of the plurality of cover stacks is coupled to the second cover plate, wherein the second cover plate defines a plurality of holes through the second cover plate, each of the plurality of holes of the second cover plate receiving the cover stacks of the plurality of cover stacks to provide access to each of the plurality of processing regions.

2. The substrate processing system of claim 1, further comprising a plurality of substrate supports disposed around the transfer region, each of the plurality of substrate supports being vertically translatable between a first position and a second position along the central axis of the substrate support.

3. The substrate processing system of claim 1, wherein the first cover plate further defines a recessed bracket in a second surface of the first cover plate surrounding each of the plurality of holes, the second surface being opposite to the first surface of the first cover plate, and wherein each of the plurality of cover stacks is disposed in the first cover plate on a separate recessed bracket defined in the second surface of the first cover plate.

4. The substrate processing system of claim 1, wherein the transfer region includes a transfer device rotatable along a central axis and configured to engage a substrate and transfer the substrate between a plurality of substrate supports within the transfer region.

5. The substrate processing system of claim 1, further comprising: Multiple output manifolds, each of the multiple output manifolds being disposed in a separate hole through one of the multiple holes defined by the second cover plate.

6. The substrate processing system of claim 5, wherein the component of each of the plurality of cover stacks coupled to the second cover is characterized by a first surface facing the second cover and by a second surface opposite to the first surface.

7. The substrate processing system of claim 6, further comprising: A first O-ring is positioned on the first surface of the component of each of the plurality of cap stacks coupled to the second cap plate, wherein each first O-ring engages with a corresponding output manifold.

8. The substrate processing system of claim 7, wherein the components of each of the plurality of cover stacks are coupled to the second cover plate at a plurality of locations using a plurality of bonding devices, and wherein each bonding device comprises: Bolts, which extend through the components of each cover stack and engage with the second cover plate. Washers, which rest against the bolts, and A spring, wherein the spring engages the washer at a first end and engages the component of each cap stack at a second end opposite to the first end.

9. The substrate processing system of claim 8, wherein each bonding device further includes a clamp extending around the bolt, wherein the clamp is sized to position the washer along a first surface of the washer when the bolt is disengaged from the second cover plate.

10. The substrate processing system of claim 9, wherein a gap is maintained between the clamp and the washer when the bolt engages the second cover plate.

11. The substrate processing system of claim 9, wherein the clamp of each bonding device is a first clamp, and wherein each bonding device further includes a second clamp extending around the bolt.

12. The substrate processing system of claim 11, wherein each of the second clamps is sized to rest on the washer along the second surface of the washer when the bolt is disengaged from the second cover plate.

13. A substrate processing system, comprising: A chamber body defining a transfer area; A first cover plate is disposed on the chamber body along a first surface of the first cover plate, wherein the first cover plate defines a plurality of holes through the first cover plate; Multiple cap stacks, the number of cap stacks equal to the number of holes in the plurality of holes, wherein the plurality of cap stacks at least partially define a plurality of processing regions vertically offset from the transfer region, and wherein each of the plurality of cap stacks includes an air chamber; and A second cover plate is coupled to the plurality of cover stacks located between the first cover plate and the second cover plate, and the air chamber of each of the plurality of cover stacks is coupled to the second cover plate via a plurality of engagement devices, each engagement device including a spring that compressibly engages the air chamber with the second cover plate, wherein the second cover plate defines a plurality of holes through the second cover plate, each of the plurality of holes engaging the cover stacks of the plurality of cover stacks to provide access to the plurality of processing areas.

14. The substrate processing system of claim 13, wherein each bonding device further comprises: A shouldered bolt extends through the air box and engages with the second cover plate, wherein when the shouldered bolt is fully engaged with the second cover plate, the shank of the shouldered bolt abuts against the second cover plate. A washer, the washer resting around the head of the shouldered bolt against the shouldered bolt, and A spring, wherein the spring engages the washer at a first end and the air box at a second end opposite to the first end.

15. The substrate processing system of claim 14, wherein each bonding device further includes a clamp disposed around the shoulder bolt within the gasket, wherein the clamp is sized to position the washer along a first surface of the washer when the shoulder bolt is disengaged from the second cover plate.

16. The substrate processing system of claim 15, wherein a gap is maintained between the clamp and the washer when the bar with the shoulder bolt abuts against the second cover plate.

17. The substrate processing system of claim 13, further comprising a transfer device located within the transfer region, the transfer device being rotatable along a central axis, wherein the transfer device is configured to engage a substrate and transfer the substrate between a plurality of substrate supports within the transfer region.

18. The substrate processing system of claim 13, further comprising: Multiple output manifolds, each of the multiple output manifolds being disposed in a separate hole through one of the multiple holes defined by the second cover plate.

19. The substrate processing system of claim 18, further comprising a remote plasma unit disposed on the second cover plate and fluidly coupled to each of the plurality of output manifolds.

20. A gas box component, comprising: An air chamber characterized by a first surface and a second surface opposite to the first surface, wherein a groove is defined within the air chamber from the second surface, and wherein an orifice is defined through the first surface into the groove; A first clip is placed in the groove within the air box; A bolt, the bolt being positioned within the groove and extending through the hole defined in the first surface of the gas box; A washer that extends around the bolt and is located between the first clamp and the first surface of the air box; A second clip extends around the bolt and is located between the washer and the first surface of the air box; and A spring, located in the groove, engages the washer at a first end of the spring and engages the air box at a second end of the spring opposite to the first end.

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