Antenna module, connection member, and communication device equipped with antenna module

Abstract

The antenna module (100) includes a first substrate (122A), a second substrate (122B), a third substrate (250), and a switching circuit (130), each equipped with a radiating element (121). The third substrate (250) is equipped with an RFIC (110) for providing high-frequency signals to the first substrate (122A) and the second substrate (122B). The switching circuit (130) is configured to switch the connection between the RFIC (110) and the radiating element (121) on the first substrate (122A) and the connection between the RFIC (110) and the radiating element (121) on the second substrate (122B).

Description

Technical Field

[0001] This disclosure relates to an antenna module, a connecting member, and a communication device equipped with an antenna module, and more particularly, to a technique for increasing the degree of freedom in the configuration of an antenna module within a communication device. Background Technology

[0002] Portable communication devices, such as mobile phones and smartphones, typically use antenna modules for transmitting and receiving radio waves. The demand for miniaturization and thinness remains high in these devices, consequently requiring further miniaturization and lower profile of internal components like antenna modules.

[0003] Furthermore, in recent years, with the expansion of display areas (monitors) in communication equipment, the location where radiating elements (feeding elements) can be placed in communication equipment has sometimes become quite limited. In this case, it may be difficult to place the motherboard, which is configured with integrated circuits (ICs) for processing high-frequency signals, close to the feeding elements, or the configuration of circuits on the motherboard may be constrained.

[0004] Japanese Patent Application Publication No. 2010-538542 (Patent Document 1) discloses a mobile wireless communication device that includes an antenna array connected to a wireless unit disposed on a printed circuit board via a flexible interconnect. In the communication device described in Japanese Patent Application Publication No. 2010-538542 (Patent Document 1), the antenna array can be mounted away from the circuit board via a flexible interconnect, thus increasing the freedom of device configuration within the housing of the wireless device.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Publication No. 2010-538542 Summary of the Invention

[0008] The problem the invention aims to solve

[0009] In Japanese Patent Application Publication No. 2010-538542 (Patent Document 1), the wireless device includes an independent RF front-end corresponding to each of the multiple antenna arrays. That is, the same number of RF front-ends as the antenna arrays mounted on the wireless device are required. In this case, as the number of antenna arrays increases, the number of RF front-ends that should be disposed on the circuit board also increases. Therefore, a large mounting area is required on the circuit board, which may become a factor hindering the miniaturization of the antenna device.

[0010] This disclosure was made to solve the problems described above, with the aim of miniaturizing antenna modules.

[0011] Solution for solving the problem

[0012] An antenna module according to one aspect of this disclosure includes a first substrate, a second substrate, a third substrate, and a switching circuit, each each having a radiating element configured thereon. The third substrate is provided with a feed circuit for providing high-frequency signals to the first substrate and the second substrate. The switching circuit is configured to switch the connection between the feed circuit and the radiating element on the first substrate, and the connection between the feed circuit and the radiating element on the second substrate.

[0013] Other aspects of this disclosure relate to a connecting member for connecting a first substrate, a second substrate, and a third substrate, comprising a dielectric substrate and a switching circuit disposed on the dielectric substrate. Each of the first and second substrates has a radiating element disposed thereon. A feed circuit for providing high-frequency signals to the first and second substrates is disposed on the third substrate. Feed wiring for transmitting high-frequency signals between the feed circuit and each radiating element is formed inside the dielectric substrate. The switching circuit is configured to switch the connection between the feed circuit and the radiating element on the first substrate, and the connection between the feed circuit and the radiating element on the second substrate.

[0014] The effects of the invention

[0015] According to the antenna module disclosed herein, a feed circuit shared by two substrates (a first substrate and a second substrate) equipped with radiating elements is disposed on a third substrate. Furthermore, the high-frequency signal from the feed circuit is switched by the switching circuit and then supplied to the radiating element of the first substrate or the radiating element of the second substrate. That is, one feed circuit is shared by multiple antenna devices (radiating elements + substrates), thus reducing the number of feed circuits relative to the number of antenna devices. Therefore, the antenna module can be miniaturized. Attached Figure Description

[0016] Figure 1 This is a block diagram of a communication device using the antenna module described in Implementation Method 1.

[0017] Figure 2 This is a side view of the antenna module involved in Embodiment 1.

[0018] Figure 3 This is a side view of the antenna module involved in Variation Example 1.

[0019] Figure 4 yes Figure 3 A 3D view of the antenna module.

[0020] Figure 5This is a block diagram of a communication device using an antenna module according to implementation method 2.

[0021] Figure 6 It is shown Figure 5 A diagram showing the details of the front-end modules.

[0022] Figure 7 This is a side view of the antenna module involved in Embodiment 2.

[0023] Figure 8 This is a diagram illustrating an example of the internal structure of a connecting member.

[0024] Figure 9 This is a side view of the antenna module involved in Variation Example 2.

[0025] Figure 10 This is a side view of the antenna module involved in Variation Example 3.

[0026] Figure 11 This is a side view of the antenna module involved in Variation Example 4.

[0027] Figure 12 This is a top view of the antenna module involved in Variation Example 5.

[0028] Figure 13 This is a diagram illustrating an example configuration of an antenna device in a communication apparatus.

[0029] Figure 14 This is a diagram showing a first modified example of the connecting terminal.

[0030] Figure 15 It is shown Figure 14 A diagram showing an example of a connecting terminal.

[0031] Figure 16 This is a diagram showing a second modified example of the connecting terminal.

[0032] Figure 17 This is a block diagram of a communication device using an antenna module according to implementation method 3.

[0033] Figure 18 This is a diagram showing a variation of the front-end module.

[0034] Figure 19 This is a side view of the antenna module involved in Embodiment 3.

[0035] Figure 20 This is a partial cross-sectional view of the antenna device.

[0036] Figure 21 This is a diagram used to illustrate the structure of a co-directional duplexer.

[0037] Figure 22This is a diagram showing an example of the configuration of the filtering device in the motherboard.

[0038] Figure 23 This is a diagram showing an example of the configuration of the filtering device in an antenna assembly.

[0039] Figure 24 This is a block diagram of a communication device using the antenna module described in Modified Example 6.

[0040] Figure 25 It is a cross-sectional diagram used to illustrate the connection status of the feed wiring in the antenna device.

[0041] Figure 26 This is a block diagram of a communication device using an antenna module according to implementation method 4.

[0042] Figure 27 It is used for explanation Figure 26 A diagram showing the details of the front-end modules.

[0043] Figure 28 This is a side view of the antenna module involved in Embodiment 4. Detailed Implementation

[0044] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. Furthermore, the same or equivalent parts in the drawings will be labeled with the same reference numerals, and their descriptions will not be repeated.

[0045] [Implementation Method 1]

[0046] (Basic structure of a communication device)

[0047] Figure 1 This is an example of a block diagram of a communication device 10 using the antenna module 100 described in Embodiment 1. The communication device 10 may be, for example, a portable terminal such as a mobile phone, smartphone, or tablet, a personal computer with communication capabilities, or a base station. An example of the frequency band of the radio waves used in the antenna module 100 described in this embodiment is millimeter-wave radio waves with center frequencies of 28 GHz, 39 GHz, and 60 GHz, but radio waves in other frequency bands can also be used.

[0048] Reference Figure 1 The communication device 10 includes an antenna module 100 and a BBIC 200 constituting a baseband signal processing circuit. The antenna module 100 includes an RFIC 110 (as an example of a feed circuit), antenna devices 120A and 120B, and a switching circuit 130. The communication device 10 up-converts the signal transmitted from the BBIC 200 to the antenna module 100 into a high-frequency signal and radiates it from the antenna device 120. Furthermore, it down-converts the high-frequency signal received by the antenna device 120 and processes the signal using the BBIC 200.

[0049] exist Figure 1 In the example, for ease of explanation, it is shown that each antenna device in antenna device 120A and 120B (hereinafter also generally referred to as "antenna device 120") includes four feed elements (radiating elements). Specifically, antenna device 120A includes feed elements 121A1 to 121A4, and antenna device 120B includes feed elements 121B1 to 121B4.

[0050] Furthermore, power supply elements 121A1 to 121A4 are also generally referred to as "power supply element 121A". In addition, power supply elements 121B1 to 121B4 are also generally referred to as "power supply element 121B". Furthermore, power supply elements 121A and 121B are also generally referred to as "power supply element 121".

[0051] exist Figure 1 In this embodiment, the antenna device 120 is a one-dimensional antenna array in which four feed elements 121 are arranged in a row. Furthermore, multiple feed elements 121 are not necessarily required; the antenna device 120 may also be formed by a single feed element 121. Alternatively, it may be an array antenna in which multiple feed elements 121 are arranged two-dimensionally. In this embodiment, each feed element 121 is a patch antenna with a generally square planar shape.

[0052] RFIC 110 includes switches 111A-111D, 113A-113D, 117, power amplifiers 112AT-112DT, low-noise amplifiers 112AR-112DR, attenuators 114A-114D, phase shifters 115A-115D, signal synthesizer / demultiplexer 116, mixer 118, and amplifier circuit 119.

[0053] When transmitting high-frequency signals, switches 111A-111D and 113A-113D are switched to the power amplifier 112AT-112DT side, and switch 117 is connected to the transmitting-side amplifier of amplifier circuit 119. When receiving high-frequency signals, switches 111A-111D and 113A-113D are switched to the low-noise amplifier 112AR-112DR side, and switch 117 is connected to the receiving-side amplifier of amplifier circuit 119.

[0054] The switching circuit 130 includes switches 130A to 130D, which are single-pole multiple-throw (SPMD) switches. Switches 130A to 130D are respectively connected to switches 111A to 111D in RFIC 110. The switching circuit 130 is controlled, for example, by RFIC 110 and configured to switch the connection between RFIC 110 and the feed element 121A of antenna device 120A, and the connection between RFIC 110 and the feed element 121B of antenna device 120B.

[0055] Switch 130A includes a first terminal T1A, a second terminal T2A, and a third terminal T3A. The first terminal T1A is connected to the common terminal of switch 111A. The second terminal T2A is connected to the feed element 121A1 of antenna device 120A. The third terminal T3A is connected to the feed element 121B1 of antenna device 120B.

[0056] Similarly, regarding switch 130B, the first terminal T1B is connected to the common terminal of switch 111B, the second terminal T2B is connected to the feed element 121A2 of antenna device 120A, and the third terminal T3B is connected to the feed element 121B2 of antenna device 120B. Regarding switch 130C, the first terminal T1C is connected to the common terminal of switch 111C, the second terminal T2C is connected to the feed element 121A3 of antenna device 120A, and the third terminal T3C is connected to the feed element 121B3 of antenna device 120B. Regarding switch 130D, the first terminal T1D is connected to the common terminal of switch 111D, the second terminal T2D is connected to the feed element 121A4 of antenna device 120A, and the third terminal T3D is connected to the feed element 121B4 of antenna device 120B.

[0057] When transmitting / receiving high-frequency signals in antenna device 120A, each of the switches 130A to 130D is switched to the second terminals T2A to T2D respectively. When transmitting / receiving high-frequency signals in antenna device 120B, each of the switches 130A to 130D is switched to the third terminals T3A to T3D respectively.

[0058] The signal transmitted from BBIC 200 is amplified by amplifier circuit 119 and then up-converted by mixer 118. The up-converted high-frequency transmission signal is divided into four signals by signal synthesizer / demultiplexer 116 and fed to different feed elements 121 through four signal paths. At this time, the directivity of antenna device 120 can be adjusted by independently adjusting the phase shift of phase shifters 115A to 115D arranged in each signal path.

[0059] The received signals, which are high-frequency signals, received by each feed element 121 are combined by the signal synthesizer / demultiplexer 116 via four different signal paths. The combined received signals are down-converted by the mixer 118, amplified by the amplifier circuit 119, and then transmitted to the BBIC 200.

[0060] (Structure of the antenna module)

[0061] Figure 2 This is a side view of the antenna module 100 according to Embodiment 1. The antenna module 100 includes an RFIC 110, an antenna device 120A with a feed element 121A formed on a dielectric substrate 122A, an antenna device 120B with a feed element 121B formed on a dielectric substrate 122B, and a switching circuit 130. Furthermore, the dielectric substrates 122A and 122B are also generally referred to as "dielectric substrate 122".

[0062] RFIC 110 and switching circuit 130 are configured on motherboard 250. RFIC 110 is electrically connected to BBIC 200, also configured on motherboard 250, via connection wiring 260. Additionally, RFIC 110 is connected to switching circuit 130 via connection wiring 170. Furthermore, in Figure 2 In the following description, the normal direction of the motherboard 250 is set as the Z-axis direction, and the direction orthogonal to it (the in-plane direction of the motherboard 250) is set as the X-axis and Y-axis directions.

[0063] Antenna device 120A is connected to motherboard 250 via connection terminal 150A. Antenna device 120B is also connected to motherboard 250 via connection terminal 150B. Connection terminals 150A and 150B are configured as detachable connectors, for example. Alternatively, connection terminals 150A and 150B may be formed from solder bumps.

[0064] The dielectric substrate 122 forming the feed element 121 in the antenna device 120 may be, for example, a low-temperature co-fired ceramic (LTCC) multilayer substrate, a multilayer resin substrate formed by stacking multiple resin layers composed of resins such as epoxy and polyimide, a multilayer resin substrate formed by stacking multiple resin layers composed of liquid crystal polymer (LCP) with a low dielectric constant, a multilayer resin substrate formed by stacking multiple resin layers composed of fluorine-based resins, or a ceramic multilayer substrate other than LTCC. Furthermore, the dielectric substrate 122 may not necessarily be a multilayer structure and may also be a single-layer substrate.

[0065] The feed element 121 is formed of a conductor such as copper or aluminum with a flat plate shape. The shape of the feed element 121 is not limited to... Figure 1 The rectangle shown can also be polygonal, circular, elliptical, or cross-shaped. The power supply element 121 is formed on the surface or within a layer of the dielectric substrate 122. Figure 2 The example shows an array antenna with four feed elements 121 arranged in one direction, but the feed elements 121 can also be formed individually, or a structure can be formed by arranging multiple feed elements 121 in one or two dimensions. Furthermore, although in Figure 2 Not shown, but in the dielectric substrate 122, a ground electrode is arranged facing the power supply element 121.

[0066] The switching circuit 130 is connected to the antenna device 120A via connection terminal 150A and feed wiring 160A. Additionally, the switching circuit 130 is connected to the antenna device 120B via connection terminal 150B and feed wiring 160B. The high-frequency signal from RFIC 110, after being switched by the switching circuit 130, is supplied to either the feed element 121A of the antenna device 120A or the feed element 121B of the antenna device 120B. When a high-frequency signal is being supplied to the antenna device 120A, radio waves are radiated from feed element 121A, but not from feed element 121B. Conversely, when a high-frequency signal is being supplied to the antenna device 120B, radio waves are radiated from feed element 121B, but not from feed element 121A.

[0067] When an antenna module has multiple antenna devices, the RFIC is typically configured independently for each antenna device. In this case, the substrate (e.g., motherboard) on which the RFICs are configured needs to accommodate the mounting area of ​​all the RFICs. In communication devices such as portable terminals, multiple antenna devices are used to ensure connectivity with base stations, employing a structure capable of radiating and receiving radio waves in different directions. However, when the substrate area increases due to the increase in antenna devices, it may actually hinder the miniaturization of the antenna module and the wireless device.

[0068] However, by using a structure as described in Embodiment 1, which allows the RFIC to be shared for multiple antenna devices and switches between the antenna devices using a switching circuit, the number of RFICs can be reduced relative to the number of antenna devices, thus reducing factors that hinder the miniaturization of wireless devices. Furthermore, since RFICs are relatively expensive components compared to other components, reducing the number of RFICs also helps to reduce costs.

[0069] Furthermore, the above description illustrates an example of connecting two antenna devices to one RFIC via a switching circuit, but it is also possible to configure a structure that connects three or more antenna devices to the RFIC.

[0070] In Embodiment 1, “dielectric substrate 122A”, “dielectric substrate 122B” and “main board 250” correspond to “first substrate”, “second substrate” and “third substrate” in this disclosure, respectively.

[0071] (Variation Example 1)

[0072] In Embodiment 1, a structure in which antenna devices 120A and 120B are independently connected to the motherboard 250 is described. In Modification 1, a structure in which antenna devices 120A and 120B are connected to each other is described. Figure 3 This is a side view of the antenna module 100X involved in Modified Example 1. Additionally, Figure 4 This is a 3D view of the 100X antenna module. Furthermore, in... Figure 3 and Figure 4 In the description, elements that are repeated in the antenna module 100 of Embodiment 1 will not be repeated.

[0073] Reference Figure 3 and Figure 4 In antenna module 100X, similar to antenna module 100 in Embodiment 1, antenna device 120A is connected to motherboard 250 via connection terminal 150A. However, antenna device 120B is connected to antenna device 120A via a bent connecting member 123.

[0074] like Figure 3 As shown, when viewed from above along the Y-axis, antenna devices 120A, 120B, and connecting member 123 have a generally L-shaped configuration. Radio waves are radiated from the feed element 121A of antenna device 120A in the Z-axis direction. Additionally, radio waves are radiated from the feed element 121B of antenna device 120B in the X-axis direction.

[0075] like Figure 4 As shown, in antenna module 100X, antenna devices 120A and 120B extend along the Y-axis direction. The feed element 121A of antenna device 120A is arranged along the Y-axis direction on dielectric substrate 122A. In addition, the feed element 121B of antenna device 120B is arranged along the Y-axis direction on dielectric substrate 122B.

[0076] The power supply wiring 160B extends from the connection terminal 150A through the dielectric substrate 122A and the connection member 123 to the dielectric substrate 122B, transmitting high-frequency signals to the power supply element 121B on the dielectric substrate 122B.

[0077] Furthermore, in the antenna devices 120A and 120B of the antenna module 100X in Modified Example 1, the feed elements are arranged such that the polarization direction of the electromagnetic waves radiated from each feed element is tilted by θ relative to the arrangement direction (i.e., the Y-axis direction) of the feed elements. The value of θ is greater than 0° and less than 90°, and in one example, θ = 45°. By arranging the feed elements in this tilted manner, even when the size of the dielectric substrate in the polarization direction is limited, it is possible to increase the distance from the feed element to the end of the dielectric substrate (ground electrode) to suppress bandwidth degradation.

[0078] Furthermore, in the structure where antenna device 120A and antenna device 120B are connected by connecting member 123, as in antenna module 100X of Modified Example 1, by setting it to be a structure that allows RFIC 110 to be shared for multiple antenna devices and uses switching circuit 130 to switch the antenna devices, factors that hinder the miniaturization of wireless devices can be reduced.

[0079] In addition, Figure 3 The diagram shows a structure in which the dielectric substrate 122A in antenna device 120A and the dielectric substrate 122B in antenna device 120B are formed as independent substrates and connected by a connecting member 123. However, it can also be configured such that the dielectric substrates 122A and 122B and the connecting member 123 are integrally formed as one substrate, and the connecting member 123 is bent at a portion.

[0080] [Implementation Method 2]

[0081] In Implementation 1, an example of a structure in which multiple antenna devices are directly connected to a motherboard is described.

[0082] However, in recent years, with the expansion of the display area (monitor) in communication equipment, the space available for configuring antenna devices within the communication equipment has become quite limited, and there is a possibility that the antenna device cannot be configured close to the motherboard.

[0083] Therefore, in Embodiment 2, the following structure is adopted: by configuring a connecting member between the motherboard and the antenna device, the signal transmission path from the motherboard to the antenna device is extended, thereby increasing the flexibility of the antenna device layout within the communication device. Furthermore, in Embodiment 2, an amplifier circuit is also configured on the connecting member to suppress the decrease in loss caused by signal attenuation associated with the extension of the signal transmission path.

[0084] (Basic structure of a communication device)

[0085] Figure 5 This is a block diagram of the communication device 10A with antenna module 100A according to embodiment 2. The antenna module 100A has the following structure: Figure 1 The antenna module 100 of Embodiment 1 shown is supplemented with front-end modules (hereinafter also referred to as "FEM (Front End Module)") 180A and 180B. Figure 5 In antenna module 100A, the interaction with [other components] is not repeated. Figure 1 Description of the repeating elements of antenna module 100.

[0086] Reference Figure 5 In antenna module 100A, FEM 180A is configured in the signal transmission path between switching circuit 130 and antenna device 120A, and FEM 180B is configured in the signal transmission path between switching circuit 130 and antenna device 120B.

[0087] FEM 180A includes FEM 180A1 to FEM 180A4. FEM 180A1 is connected between the second terminal T2A of switch 130A and the power supply element 121A1. FEM 180A2 is connected between the second terminal T2B of switch 130B and the power supply element 121A2. FEM 180A3 is connected between the second terminal T2C of switch 130C and the power supply element 121A3. FEM 180A4 is connected between the second terminal T2D of switch 130D and the power supply element 121A4.

[0088] Additionally, FEM 180B includes FEM 180B1 to FEM 180B4. FEM 180B1 is connected between the third terminal T3A of switch 130A and the power supply element 121B1. FEM 180B2 is connected between the third terminal T3B of switch 130B and the power supply element 121B2. FEM 180B3 is connected between the third terminal T3C of switch 130C and the power supply element 121B3. FEM 180B4 is connected between the third terminal T3D of switch 130D and the power supply element 121B4. Furthermore, in the following description, FEM 180A, 180B (and each of their included FEMs) are also generally referred to as "FEM 180".

[0089] like Figure 6 As shown, FEM 180 includes switches 181 and 182, a power amplifier 183, and a low-noise amplifier 184. In FEM 180, similar to switches 111A-111D, 113A-113D, power amplifiers 112AT-112DT, and low-noise amplifiers 112AR-112DR located inside RFIC 110, switches 181 and 182 are switched to the power amplifier 183 side when transmitting high-frequency signals, and switches 181 and 182 are switched to the low-noise amplifier 184 side when receiving high-frequency signals.

[0090] FEM 180 is an amplifier circuit that amplifies the high-frequency signal transmitted between RFIC 110 and antenna device 120, thereby compensating for the attenuation that occurs between RFIC 110 and antenna device 120. It is particularly effective when the signal transmission path from RFIC 110 to each antenna device is relatively long, and the amplification of the power amplifier or low-noise amplifier within RFIC 110 is insufficient. Furthermore, in... Figure 6 The description of FEM 180 includes both power amplifier 183 and low noise amplifier 184. However, FEM 180 only needs to include at least one of power amplifier 183 and low noise amplifier 184, or it can be a structure that includes either power amplifier 183 or low noise amplifier 184.

[0091] Furthermore, "FEM 180A" and "FEM 180B" correspond to the "first amplifier circuit" and "second amplifier circuit" in this disclosure, respectively.

[0092] (Structure of the antenna module)

[0093] Figure 7 This is a side view of the antenna module 100A according to Embodiment 2. In addition to the RFIC 110, switching circuit 130, and antenna devices 120A and 120B configured on the motherboard 250, which are the same as in Embodiment 1, the antenna module 100A also includes a connecting member 140 and FEMs 180A and 180B. Furthermore, for the antenna module 100A, elements that overlap with those in the antenna module 100 will not be described again.

[0094] Reference Figure 7 The connecting member 140 is a component used to transmit high-frequency signals from the RFIC 110 configured on the motherboard 250 to the antenna devices 120A and 120B, such as... Figure 8 As described later, multiple power supply wirings are formed inside the connecting member 140. The connecting member 140 is used in the communication device 10 as a signal transmission path when the antenna devices 120A and 120B are configured in a position away from the motherboard 250.

[0095] The connecting member 140 has a dielectric substrate 143 formed of ceramic or resin, such as LTCC, similar to the dielectric substrate 122 forming the antenna device. Figure 8 The dielectric substrate 143 has a multilayer structure consisting of multiple stacked dielectric layers. The connecting member 140 can be formed of a non-deformable rigid material or, for example, a material such as... Figure 11 and Figure 12 The flexible material formed as described later.

[0096] The connecting member 140 is connected to the antenna devices 120A and 120B respectively on its surface 141 via connecting terminals 150A and 150B. Additionally, the connecting member 140 is connected to the main board 250 on its back surface 142 via connecting terminal 155. Connecting terminals 150A, 150B, and 155 are formed from connectors or solder bumps that are detachable.

[0097] FEM 180A is positioned in the connecting member 140 between the connection portion of the connecting member 140 to the dielectric substrate 122A of the antenna device 120A (i.e., connection terminal 150A) and the connection portion of the connecting member 140 to the main board 250 (i.e., connection terminal 155). FEM 180B is positioned in the connecting member 140 between the connection portion of the connecting member 140 to the dielectric substrate 122B of the antenna device 120B (i.e., connection terminal 150B) and the connection portion of the connecting member 140 to the main board 250 (i.e., connection terminal 155).

[0098] exist Figure 7 In this example, FEM 180 is positioned on the back side 142 of the connecting member 140. For example... Figure 6 As described herein, FEM 180 is an amplifier circuit including power amplifier 183 and / or low-noise amplifier 184, and therefore may generate heat during signal amplification. Antenna assembly 120 is housed within housing 50 of communication device 10A, as... Figure 7 As shown, the antenna device 120 is disposed on the surface 141 side of the connecting member 140 facing the housing 50. Therefore, when the FEM 180 is disposed on the surface 141 side of the connecting member 140, the FEM 180 is close to the housing 50, and the temperature of the housing 50 may locally increase due to heat from the FEM 180. By disposing the FEM 180 on the back surface 142 of the connecting member 140 to ensure a separation distance between the FEM 180 and the housing 50, heat transfer to the housing 50 can be suppressed.

[0099] In addition, it can also be like Figure 7 Similar to the FEM 180B, the FEM 180 is configured such that at least a portion of the FEM 180 is in contact with the motherboard 250. This structure allows heat generated by the FEM 180 to be directly transferred to the motherboard 250, thus further improving heat dissipation efficiency. Alternatively, the FEM 180 casing can be in direct contact with the motherboard 250, or a high-efficiency heat transfer component (such as copper) can be placed between the FEM 180 and the motherboard 250 to facilitate contact.

[0100] Furthermore, if the distance between the FEM 180 and the housing 50 can be sufficiently ensured, or if a heat-insulating component or other equipment is provided between the FEM 180 and the housing 50, the FEM 180 may be disposed on the surface 141 of the connecting member 140.

[0101] The FEM 180 can be directly connected to the connecting member 140 using solder bumps or connectors, or it can be connected via an intermediate substrate such as an interposer. Furthermore, to achieve a lower profile, the portion of the connecting member 140 where the FEM 180 is located can be thinner than other portions.

[0102] The high-frequency signal from RFIC 110 is supplied to antenna device 120A via switching circuit 130 and feed wiring 160A. Additionally, the high-frequency signal from RFIC 110 is supplied to antenna device 120B via switching circuit 130 and feed wiring 160B.

[0103] Figure 8 This is a diagram illustrating an example of the internal structure of the connecting member 140. Figure 8 For ease of explanation, the two signal transmission paths for antenna device 120A will be described below. Figure 8 In this example, an FEM 180A1 is disposed on the surface 141 of the connecting member 140, and an FEM 180A2 is disposed on the back surface 142 of the connecting member 140. Feed wirings 161 and 162 and a ground electrode GND are formed in the connecting member 140. Feed wiring 161 transmits high-frequency signals to the feed element 121A of the antenna device 120A via FEM 180A1. Additionally, feed wiring 162 transmits high-frequency signals to another feed element 121A via FEM 180A2.

[0104] In addition, Figure 8 The text describes a structure where the FEMs and feed lines corresponding to different radiating elements in the same antenna device are separately arranged on the surface and back of the connecting member. However, it is also possible to configure the structure where the FEMs and feed lines corresponding to different antenna devices are separately arranged on the surface and back of the connecting member. For example, the FEMs and feed lines corresponding to the first antenna device may be arranged on the surface of the connecting member, and the FEMs and feed lines corresponding to the second antenna device may be arranged on the back of the connecting member. Alternatively, the FEMs and feed lines corresponding to a portion of the radiating elements of the first and second antenna devices may be arranged on the surface of the connecting member, and the FEMs and feed lines corresponding to the remaining radiating elements may be arranged on the back of the connecting member.

[0105] Feed wiring 161 and feed wiring 162 are formed on different layers in the dielectric substrate 143. A ground electrode GND is formed between the layers forming feed wiring 161 and feed wiring 162, and is connected to a reference potential (not shown) formed on the motherboard 250 via a connection terminal 155. Additionally, the ground electrode GND is connected to a ground electrode (not shown) formed on the dielectric substrate 122A of the antenna device 120A via a connection terminal 150A.

[0106] In addition, “power supply wiring 161” and “power supply wiring 162” correspond to “first wiring” and “second wiring” of this disclosure, respectively.

[0107] In this way, when providing high-frequency signals to the antenna device 120 through multiple feed lines, by forming the feed lines in different layers within the connecting member 140, the area of ​​the connecting member 140 in the main plane direction (XY plane) can be reduced compared to forming all feed lines in the same layer. Furthermore, isolation between feed lines can be ensured by configuring the feed lines to sandwich the ground electrode in the middle.

[0108] In addition, although Figure 8 Not shown, but the signal transmission path towards antenna device 120B also uses the same structure. Additionally, in Figure 8 The text describes a structure where the power supply wiring is formed on two different layers, but it is also possible to form the power supply wiring on three or more different layers. In this case, it is preferable to place a grounding electrode between the dielectric layers forming the power supply wiring.

[0109] As described above, by arranging a connecting member between the motherboard and the antenna device, the signal transmission path from the motherboard to the antenna device is extended, thereby increasing the flexibility of the antenna device layout within the communication device. Furthermore, by arranging an amplifier circuit on the connecting member, the decrease in loss caused by signal attenuation associated with the extended signal transmission path can be suppressed.

[0110] (Variation Example 2)

[0111] exist Figure 7 In the antenna module 100A of Embodiment 2, a structure in which the switching circuit is disposed on the main board is described. In Modification 2, a structure in which the switching circuit is disposed on the connecting member is described.

[0112] Figure 9 This is a side view of the antenna module 100B involved in Variation Example 2. The antenna module 100B has the following structure: Figure 7 The switching circuit in the antenna module 100A shown has been moved to the connecting member 140. For antenna module 100B, the elements that are repeated in antenna module 100A will not be described again.

[0113] Reference Figure 9 Similarly, in antenna module 100B, connecting member 140 is connected to motherboard 250 via connecting terminal 155. Furthermore, antenna devices 120A and 120B are connected to connecting member 140 via connecting terminals 150A and 150B, respectively.

[0114] The switching circuit 130X is disposed on the surface 141 of the connecting member 140 and is connected to the RFIC 110 via the connecting terminal 155 and the connecting wiring 171. Furthermore, although... Figure 9 Not shown, but the switching circuit 130X supplies the high-frequency signal from the RFIC 110 to the antenna device 120 via the FEM 180 through a feed wiring formed inside the connecting member 140. Alternatively, the switching circuit 130X may also be configured on the back side 142 of the connecting member 140.

[0115] In this way, by placing the switching circuit within the connecting components, the number of components on the motherboard can be reduced, thus achieving motherboard miniaturization. This is especially true when a large number of antenna devices are incorporated into a communication device, increasing the number of switching circuits and thus making the miniaturization effect even more significant.

[0116] (Variation Example 3)

[0117] exist Figure 7 In the antenna module 100A of Embodiment 2, a structure is described in which multiple antenna devices are connected to a common connecting member. However, for example, when two antenna devices are configured to be far apart from each other, the length of the connecting member becomes longer when using the common connecting member, which may make it difficult to install the antenna devices in the communication device.

[0118] Therefore, in Modification 3, the following structure is described: connection members for connecting to the motherboard are independently provided for multiple antenna devices that are provided with high-frequency signals from a shared switching circuit.

[0119] Figure 10 This is a side view of the antenna module 100C involved in Variation 3. In the antenna module 100C, connecting members 140A and 140B are used instead of Figure 7 The connecting member 140 in the antenna module 100A shown. Furthermore, for the antenna module 100C, the elements that are repeated in the antenna module 100A will not be described again.

[0120] Reference Figure 10The connecting member 140A is connected to the main board 250 via connecting terminal 155A and to the antenna device 120A via connecting terminal 150A. An FEM 180A is disposed on the connecting member 140A. High-frequency signals from the switching circuit 130 disposed on the main board 250 are supplied by feed wiring 160A to the feed element 121A of the antenna device 120A via the connecting member 140A.

[0121] Similarly, the connecting member 140B is connected to the main board 250 via the connecting terminal 155B, and to the antenna device 120B via the connecting terminal 150B. An FEM 180B is disposed on the connecting member 140B. High-frequency signals from the switching circuit 130 disposed on the main board 250 are supplied by the feed wiring 160B to the feed element 121B of the antenna device 120B via the connecting member 140B.

[0122] In addition, Figure 10 In this configuration, FEM 180A is disposed on the back surface 142A of connecting member 140A, but it may also be disposed on the surface 141A of connecting member 140A. Similarly, FEM 180B may also be disposed on the surface 141B of connecting member 140B instead of the back surface 142B of connecting member 140B.

[0123] Furthermore, "connecting member 140A" and "connecting member 140B" correspond to the "first connecting member" and "second connecting member" in this disclosure, respectively. In addition, "FEM 180A" and "FEM 180B" correspond to the "first amplifier circuit" and "second amplifier circuit" in this disclosure, respectively.

[0124] In this way, by independently setting connecting components for multiple antenna devices, the overall size of the connecting components can be reduced compared to using a shared connecting component. This makes it easier to install antenna devices into communication devices.

[0125] (Variation Example 4)

[0126] In Modification 4 and Modification 5 described later, the use of a flexible connecting member is illustrated.

[0127] Figure 11 This is a side view of the antenna module 100D involved in Variation Example 4. In the antenna module 100D, Figure 7 The connecting member 140 of the antenna module 100A shown is replaced by the connecting member 140C. Furthermore, for the antenna module 100D, the elements that are repeated with those in the antenna module 100A will not be described again.

[0128] Reference Figure 11The connecting member 140C is a flexible substrate formed of a flexible material, configured to bend in the thickness direction. Figure 11 In the example, the connecting member 140C has a structure in which a second part 146 branches off from the first part 145. The second part 146 bends after branching off from the first part 145 and extends in the opposite direction to the first part 145.

[0129] The connecting member 140C is connected to the main board 250 via the connecting terminal 155 in the first part 145. The antenna device 120A is connected to the first part 145 of the connecting member 140C via the connecting terminal 150A. Additionally, the antenna device 120B is connected to the second part 146 of the connecting member 140C via the connecting terminal 150B. FEMs 180A and 180B are respectively disposed in the first part 145 and the second part 146.

[0130] Additionally, a switching circuit 130X is positioned closer to the connecting terminal 155 in the connecting member 140C than in the branch of the second part 146. Figure 9 Similarly, the switching circuit 130X of the antenna module 100B shown is connected to the RFIC 110 configured on the motherboard 250 via connection wiring 171. The high-frequency signal from the RFIC 110 is provided by the switching circuit 130X to either the antenna device 120A or the antenna device 120B.

[0131] In addition, Figure 11 The text describes a structure that utilizes a flexible material to form a common connecting member for multiple antenna devices, and branches and bends a portion of the connecting member. However, the connecting member may not necessarily branch midway. Additionally, in... Figure 10 In a structure with independent connecting members for the antenna device, as shown in Variation Example 3, some or all of the connecting members can also be formed using a flexible material.

[0132] In this way, by using a flexible connecting member to connect the antenna device to the motherboard, the layout freedom of the antenna device within the housing of the communication device can be increased. Furthermore, by configuring an FEM on the connecting member, the degradation of antenna characteristics associated with the extension of the signal transmission path can be suppressed.

[0133] (Variation Example 5)

[0134] exist Figure 11 In variation 4, an example of a structure in which the connecting member bends and branches in the thickness direction is illustrated. In variation 5, a structure in which the connecting member bends and branches in the in-plane direction of the main surface is illustrated.

[0135] Figure 12This is a top view of the antenna module 100E involved in Variation Example 5. In the antenna module 100E, Figure 7 The connecting member 140 of the antenna module 100A shown is replaced by the connecting member 140D. Furthermore, for the antenna module 100E, the elements that are repeated with those in the antenna module 100A will not be described again.

[0136] Reference Figure 12 The connecting member 140D is a flexible substrate formed of a flexible material, configured to be bent in the in-plane direction (i.e., in the XY plane) of its main surface. The connecting member 140D is configured to include a first portion 145A and a second portion 146A. Figure 12 In the connection member 140D, the first portion 145A extends along the X-axis from the connection point with the main board 250 and connects to the antenna device 120A. The second portion 146A bends and branches from the first portion 145A in the Y-axis direction, and then bends again in the X-axis direction before connecting to the antenna device 120B. Furthermore, each portion of the first portion 145A and the second portion 146A of the connecting member 140D can also be configured, similar to Modification 4, to be bent in the thickness direction. Additionally, the connecting member 140D can also be configured to be bent in a direction that is torsional about the axis of extension. The FEM 180 is disposed on the surface and / or back surface of the connecting member 140D.

[0137] In this way, by using a flexible connecting member to connect the antenna device to the motherboard, the layout freedom of the antenna device within the housing of the communication device can be increased. Furthermore, by configuring an FEM on the connecting member, the degradation of antenna characteristics associated with the extension of the signal transmission path can be suppressed.

[0138] [Example of antenna device configuration]

[0139] exist Figure 13 The following describes an example of the configuration of the antenna device in a communication device in which the antenna modules shown in the above embodiments are applied.

[0140] The housing 50 of the communication device 10 has a generally cuboid shape, including main surfaces 51 and 52 with the Z-axis as the normal direction, side surfaces 55 and 56 with the X-axis as the normal direction, and side surfaces 57 and 58 with the Y-axis as the normal direction.

[0141] exist Figure 13 In the first example of (a), antenna device 120A is disposed on side 55, and antenna device 120B is disposed on side 57. In the first example, it is capable of radiating radio waves in the negative direction of the X-axis and the positive direction of the Y-axis.

[0142] exist Figure 13In the second example of (b), antenna device 120A is disposed on the main surface 51, and antenna device 120B is disposed on the side surface 57. In the second example, it is capable of radiating radio waves in the positive Y-axis direction and the positive Z-axis direction.

[0143] exist Figure 13 In the third example (c), antenna device 120A is disposed on side 55, and antenna device 120B is disposed on side 56. In this third example, it is capable of radiating radio waves in both the positive and negative directions of the X-axis.

[0144] exist Figure 13 In the fourth example of (d), antenna device 120A is disposed on side 55, antenna device 120B is disposed on side 57, and antenna device 120C is disposed on main surface 51. In the fourth example, it is able to radiate radio waves in three directions: the negative direction of the X-axis, the positive direction of the Y-axis, and the positive direction of the Z-axis.

[0145] also, Figure 13 The configuration shown is one example; the surface on which the antenna device is configured can also be... Figure 13 Other combinations are also possible. For example, multiple antenna devices can be separately configured on the same side. Figure 13 In each configuration example, the antenna device is located at the end, but it can also be located near the center of each surface. Furthermore, the number of antenna devices configured within the communication device can be four or more.

[0146] When radiating radio waves from the communication device in all directions along the X, Y, and Z axes, at least six antenna devices are required. In such a case, when configuring RFICs for each antenna device, space is needed on the motherboard for six RFICs. By using a switching circuit to share RFICs among multiple antenna devices as described in this embodiment, the number of RFICs that should be configured on the motherboard can be reduced, thus enabling miniaturization of the motherboard and the communication device.

[0147] <Example of a modified connection terminal>

[0148] In the above embodiments, the following examples are illustrated: connection terminals 150A and 150B used in the connection between the connecting member or motherboard and the antenna device, and connection terminals 155, 155A, and 155B used in the connection between the motherboard and the connecting member, are formed between the opposing surfaces of the members to be connected. However, these connection terminals may also be used in other connection methods.

[0149] For example, when using Figure 2 Taking the connection between the motherboard 250 and the antenna device 120A as an example, the structure can also be as follows: (e.g.) Figure 14In this configuration, the ends of the motherboard 250 and the antenna device 120A are positioned facing each other, and the surfaces of the motherboard 250 and the antenna device 120A are connected to each other (or their back surfaces are connected to each other) via the connection terminal 150X. Furthermore, the connection terminal 150X can also be configured as follows: Figure 15 As shown, it is a combination of multiple connectors 150X1, 150X2, each of which has a conductor pin and / or a socket.

[0150] Alternatively, it can also have the following structure: such as Figure 16 In this way, a terminal portion is formed at the end of the antenna device 120A, so that the antenna device 120A can be engaged with the connection terminal 150Y mounted on the surface of the motherboard 250 to make connection.

[0151] also, Figures 14-16 This connection method can also be applied to the connection between the antenna device 120B and the motherboard 250. Furthermore, this connection method can also be applied to the connection between the antenna device and the connecting component, as well as the connection between the motherboard and the connecting component.

[0152] [Implementation Method 3]

[0153] (Structure of a communication device)

[0154] In Embodiment 3, an example of a so-called dual-band antenna module capable of radiating radio waves in two different frequency bands from the antenna device is described.

[0155] Figure 17 This is a block diagram of the communication device 10F of the antenna module 100F according to embodiment 3. (Refer to...) Figure 17 The communication device 10F includes an antenna module 100F and a BBIC 200. The antenna module 100F includes an RFIC 110F, antenna devices 120F and 120G, a switching circuit 130, FEMs 180A and 180B, and filter devices 190, 195A, and 195B.

[0156] Antenna devices 120F and 120G are dual-band antenna devices as described above. Each radiating element of each antenna device arranged in antenna devices 120F and 120G includes two feed elements. Antenna device 120F includes feed elements 121F and 125F, and antenna device 120G includes feed elements 121G and 125G. Each feed element is independently supplied with a high-frequency signal from RFIC 110F. Furthermore, "feed element 121F" and "feed element 121G" in Embodiment 3 correspond to the "first element" in this disclosure. Additionally, "feed element 125F" and "feed element 125G" in Embodiment 3 correspond to the "second element" in this disclosure.

[0157] The RFIC 110F includes switches 111A-111H, 113A-113H, 117A, and 117B; power amplifiers 112AT-112HT; low-noise amplifiers 112AR-112HR; attenuators 114A-114H; phase shifters 115A-115H; signal synthesizers / demultiplexers 116A and 116B; mixers 118A and 118B; and amplifier circuits 119A and 119B.

[0158] Among them, the switches 111A~111D, 113A~113D, 117A, power amplifiers 112AT~112DT, low noise amplifiers 112AR~112DR, attenuators 114A~114D, phase shifters 115A~115D, signal synthesizer / demultiplexer 116A, mixer 118A, and amplifier circuit 119A are circuits used for feeding the high-frequency side components 121F and 121G. In addition, the switches 111E~111H, 113E~113H, 117B, power amplifiers 112ET~112HT, low-noise amplifiers 112ER~112HR, attenuators 114E~114H, phase shifters 115E~115H, signal synthesizer / demultiplexer 116B, mixer 118B, and amplifier circuit 119B are circuits used for the low-frequency side feed elements 125F and 125G.

[0159] When transmitting high-frequency signals, switches 111A-111H and 113A-113H are switched to the power amplifier 112AT-112HT side, and switches 117A and 117B are connected to the transmitting-side amplifiers of amplifier circuits 119A and 119B. When receiving high-frequency signals, switches 111A-111H and 113A-113H are switched to the low-noise amplifier 112AR-112HR side, and switches 117A and 117B are connected to the receiving-side amplifiers of amplifier circuits 119A and 119B.

[0160] Filtering device 190 includes unidirectional duplexers 190A to 190D. Additionally, filtering device 195A includes unidirectional duplexers 195A1 to 195A4. Filtering device 195B includes unidirectional duplexers 195B1 to 195B4. Each unidirectional duplexer includes a high-pass filter (first filter) that allows high-frequency signals in the high-frequency band (first frequency band) to pass through, and a low-pass filter (second filter) that allows high-frequency signals in the low-frequency band (second frequency band) to pass through. In Embodiment 3, "filtering device 190" corresponds to "first filtering device" in this disclosure. Furthermore, in Embodiment 3, "filtering device 195A" and "filtering device 195B" correspond to "second filtering device" in this disclosure.

[0161] The high-pass filters in the duplexers 190A-190D are connected to switches 111A-111D in RFIC 110F, respectively. Additionally, the low-pass filters in the duplexers 190A-190D are connected to switches 111E-111H in RFIC 110F, respectively. The common terminal of the duplexers 190A-190D is connected to the first terminals T1A-T1D of switches 130A-130D in the switching circuit 130, respectively.

[0162] The second terminal T2A of switch 130A is connected to the same-direction duplexer 195A1 of filter device 195A via FEM 180A1. The third terminal T3A of switch 130A is connected to the same-direction duplexer 195B1 of filter device 195B via FEM 180B1. The second terminal T2B of switch 130B is connected to the same-direction duplexer 195A2 of filter device 195A via FEM 180A2. The third terminal T3B of switch 130B is connected to the same-direction duplexer 195B2 of filter device 195B via FEM 180B2.

[0163] The second terminal T2C of switch 130C is connected to the same-direction duplexer 195A3 of filter device 195A via FEM 180A3. The third terminal T3C of switch 130C is connected to the same-direction duplexer 195B3 of filter device 195B via FEM 180B3. The second terminal T2D of switch 130D is connected to the same-direction duplexer 195A4 of filter device 195A via FEM 180A4. The third terminal T3D of switch 130D is connected to the same-direction duplexer 195B4 of filter device 195B via FEM 180B4.

[0164] The high-pass filters in the duplexers 195A1 to 195A4 are respectively connected to the feed elements 121F1 to 121F4 in the antenna device 120F. The low-pass filters in the duplexers 195A1 to 195A4 are respectively connected to the feed elements 125F1 to 125F4 in the antenna device 120F.

[0165] The high-pass filters in the duplexers 195B1 to 195B4 are respectively connected to the feed elements 121G1 to 121G4 in the antenna device 120G. The low-pass filters in the duplexers 195B1 to 195B4 are respectively connected to the feed elements 125G1 to 125G4 in the antenna device 120G.

[0166] In this way, the path for transmitting high-frequency signals to each radiating element is shared between filter 190 and filter 195A or filter 195B.

[0167] Furthermore, for each FEM included in FEM 180A and 180B, it is possible to set it to be similar to... Figure 6 The same structure. Or, it can also be like... Figure 18 As shown in the FEM 180X, the antenna is configured with a power amplifier 183X1 and a low-noise amplifier 184X1 corresponding to the high-frequency side circuitry, and a power amplifier 183X2 and a low-noise amplifier 184X2 corresponding to the low-frequency side circuitry. By setting power amplifiers and low-noise amplifiers suitable for each frequency, the antenna characteristics can be appropriately adjusted.

[0168] (Structure of the antenna module)

[0169] Next, use Figures 19-21 The detailed structure of the antenna module 100F involved in Embodiment 3 will be explained below. Figure 19 This is a side view of antenna module 100F. Figure 20 This is a partial cross-sectional view of antenna device 120F. Additionally, Figure 21 This is a diagram illustrating an example of the structure of a co-directional duplexer.

[0170] exist Figure 19 In the above Figure 10 In the antenna module 100C described herein, antenna device 120A is replaced with antenna device 120F, and antenna device 120B is replaced with antenna device 120G. Additionally, RFIC 110 is replaced with RFIC 110F. Figure 19 The structure is modified as follows: a filter device 190 is newly installed on the mainboard 250, and filter devices 195A and 195B are newly installed on the antenna devices 120F and 120G, respectively. For Figure 19 Do not repeat with Figure 10 Explanation of recurring elements. Furthermore, in Figure 19 In this case, BBIC 200 is mounted on motherboard 250, but BBIC 200 can also be formed on another substrate not shown.

[0171] Reference Figures 19-21 The antenna devices in antenna devices 120F and 120G are configured as described above to radiate radio waves in two different frequency bands.

[0172] Antenna device 120F includes feed element 121F and feed element 125F formed on dielectric substrate 122F. Feed element 121F and feed element 125F are configured to overlap each other when viewed from the dielectric substrate 122F in a normal direction, with feed element 125F positioned between feed element 121F and ground electrode GND. Feed element 121F is smaller than feed element 125F. Therefore, higher frequency radio waves are radiated from feed element 121F than from feed element 125F. Each feed element in feed element 121F and feed element 125F is independently supplied with a high-frequency signal from RFIC 110F. More specifically, as... Figure 20 As shown, a high-frequency signal (e.g., 39 GHz band) is provided to the feed element 121F via feed wiring 191, and a low-frequency signal (e.g., 28 GHz band) is provided to the feed element 125F via feed wiring 192. Feed wiring 191 passes through the feed element 125F and connects to the feed point SP1 of the feed element 121F. Feed wiring 192 connects to the feed point SP2 of the feed element 125F.

[0173] Antenna device 120G includes feed element 121G and feed element 125G formed on dielectric substrate 122G. The structure of antenna device 120G is the same as that of antenna device 120F.

[0174] like Figure 21 As shown, each filter in filter devices 190, 195A, and 195B is configured to include a plate-shaped electrode and a path. More specifically, each filter in filter devices 190, 195A, and 195B includes a terminal T1 connected to a shared feed line, a terminal T2 connected to a feed line on the low-frequency side, and a terminal T3 connected to a feed line on the high-frequency side. A low-pass filter 210 is formed between terminal T1 and terminal T2, and a high-pass filter 220 is formed between terminal T1 and terminal T3.

[0175] The low-pass filter 210 includes a linear planar electrode 211 connected to terminals T1 and T2, and planar electrodes 212 and 213 branching from the planar electrode 211 and arranged facing each other at predetermined intervals. The planar electrodes 212 and 213 are arranged in a linearly symmetrical configuration when viewed from the normal direction of the substrate and are electromagnetically coupled to each other. The ends of the planar electrodes 212 and 213 are connected to the ground electrode GND via paths V1 and V2, respectively. That is, the low-pass filter 210 constitutes a so-called π-type LC series resonant circuit, including an inductor (planar electrode 211) formed in series between terminals T1 and T2, and two shunt short-circuit lines (planar electrodes 212, 213 + paths V1, V2) branching from the inductor.

[0176] The high-pass filter 220 includes a linear planar electrode 221, planar electrodes 222 and 223, and a capacitor electrode C1, one end of which is connected to terminal T1. Planar electrode 222 branches off from planar electrode 221, and one end of planar electrode 222 is connected to the ground electrode GND via passage V3. The other end of planar electrode 221 faces the capacitor electrode C1, which is disposed on a different layer. A capacitor is formed by planar electrode 221 and capacitor electrode C1. One end of planar electrode 223 is connected to the ground electrode GND via passage V4, and the other end is connected to capacitor electrode C1 via passage V5. Additionally, planar electrode 223 is also connected to terminal T3. That is, the high-pass filter 220 constitutes a so-called π-type LC series resonant circuit, including a capacitor (planar electrode 221, capacitor electrode C1) formed in series between terminals T1 and T3, and two shunt short lines (planar electrodes 222, 223 + passages V3, V5) branching off from the two ends of the capacitor.

[0177] Furthermore, the low-pass filter 210 and the high-pass filter 220 can both be used as Figure 21 In this way, the low-pass filter 210 and the high-pass filter 220 can be arranged on different layers such that they partially overlap when viewed from the normal direction of the substrate forming the filter device. When the low-pass filter 210 and the high-pass filter 220 are formed on different layers, a ground electrode GND is provided on the layer between the low-pass filter 210 and the high-pass filter 220 to prevent mutual coupling.

[0178] Filter device 190 is formed inside the motherboard 250. Filter device 195A is formed inside the dielectric substrate 122F of antenna device 120F. Filter device 195B is formed inside the dielectric substrate 122G of antenna device 120G.

[0179] Two high-frequency signals with different frequency bands, independently output from RFIC 110F, are transmitted to a common feed line via filter 190. This common feed line is switched by switching circuit 130 to either a signal transmission path to antenna device 120F or a signal transmission path to antenna device 120G. The feed line from switching circuit 130 extends to each antenna device 120F and 120G via connection terminal 155, connection member 140, and connection terminal 150.

[0180] The common feed wiring reaching each antenna device is branched into high-frequency and low-frequency paths by the filter devices 195A and 195B formed within the antenna devices 120F and 120G. The high-frequency path is connected to the feed elements 121F and 121G, and the low-frequency path is connected to the feed elements 125F and 125G.

[0181] In the case of a dual-band antenna module that independently feeds each feed element, the number of feed lines from the RFIC to the feed elements is essentially the same as the number of feed elements. In particular, in the case of a so-called dual-polarization antenna device capable of radiating radio waves from each feed element in two different polarization directions, twice the number of feed elements is required. For example, in... Figure 17 and Figure 19 With four feed elements per frequency band (a total of eight feed elements), a dual-polarized antenna device would require 16 feed wires per antenna. This necessitates increasing the width or thickness of the connecting components, potentially making internal configuration difficult or compromising the flexibility of the connecting components. Furthermore, the connection terminals 150A, 150B, 155A, and 155B require the same number of terminals as the feed wires on the connecting components, thus increasing the connector size and the overall connector placement area on the motherboard and antenna device.

[0182] In contrast, in the antenna module 100F of Embodiment 3, by configuring filter devices (same-direction duplexers) 190, 195A, and 195B on the main board 250 and antenna devices 120F and 120G respectively, the feed wiring can be partially shared, thereby reducing the total number of feed wirings configured on the connecting members 140A and 140B. This allows for miniaturization of the dimensions (width and thickness) of the connecting members 140A and 140B, and also reduces the mounting area in the main board 250 and antenna devices 120F and 120G. Furthermore, the number of terminals of the FEM configured on the connecting members can be reduced.

[0183] Next, an example of the configuration of the filtering device in the motherboard 250 and the antenna device will be described. Figure 22 This diagram shows an example of the configuration of the filter device 190 in the motherboard 250. Additionally, Figure 23 This diagram shows an example configuration of the filter 195A in the antenna device 120F. Furthermore, the filter 195B in the antenna device 120G can be configured to... Figure 23 It has the same configuration as the filter device 195A in the middle.

[0184] Reference Figure 22As described above, each of the duplexers included in the filter device 190 is connected to the RFIC 110F and the switching circuit 130. Therefore, when viewed from above the motherboard 250, the filter device 190 is positioned between the RFIC 110F and the switching circuit 130. Figure 22 (a)

[0185] Furthermore, the RFIC 110 and switching circuit 130 are mounted on the outer surface of the motherboard 250, while the filter device 190 is formed inside the motherboard 250. Therefore, the filter device 190 can also be... Figure 22 As in (b), it is positioned to partially overlap with the RFIC 110F and / or the switching circuit 130 when viewed from above the motherboard 250. Alternatively, if the filter device 190 is formed as a chip component, the filter device 190 may also be disposed on the outer surface of the motherboard 250.

[0186] Reference Figure 23 Each of the co-directional duplexers included in the filter device 195A is arranged on the path in the antenna device 120F that connects the connection terminal 150A to each feed element. Figure 23 (a) and (b) are examples of a filter device 195A disposed on one end of a connecting member 140A on a dielectric substrate 122F, in the space between the end of the filter device 195A and the radiating element closest to that end. Figure 23 In (a), the co-directional duplexers are arranged in two rows such that the long side of each co-directional duplexer faces a direction orthogonal to the arrangement direction of the radiating elements. Figure 23 In (b), the duplexers are arranged such that the long side of each duplexer's outline faces the arrangement direction of the radiating elements. In this arrangement, although the dimension of the dielectric substrate 122F in the radiating element arrangement direction is slightly larger, it will not be as described later... Figure 23 As in example (d), the dimension in the thickness direction is increased, thus making it suitable for the case of shortening.

[0187] Figure 23 (c) is an example of a configuration in which each co-directional duplexer is arranged laterally side-by-side with respect to its corresponding radiating element in a direction orthogonal to the arrangement direction of the radiating element. In this configuration, space near the connection to the connecting member 140A in the dielectric substrate 122F can be ensured, thus simplifying the design of the wiring layout within the dielectric substrate 122F. Furthermore, power can be supplied to the vicinity of each radiating element via shared feed wiring, thereby reducing the number of feed wires within the antenna device 120F. Additionally, in this case, the radiating element and the co-directional duplexer do not overlap when viewed from above the dielectric substrate 122F, making it suitable for low-profile applications as well.

[0188] exist Figure 23In the configuration example of (d), with Figure 23 Similarly, in (c), a duplexer is arranged near each radiating element, but in a top view of the dielectric substrate 122F, a portion of the duplexer overlaps with the corresponding radiating element. That is, the duplexer is arranged below the radiating elements in the dielectric substrate 122F. With this arrangement, although the dimension in the thickness direction of the dielectric substrate 122F may increase, the dimension W1 in the width direction (the direction orthogonal to the arrangement direction of the radiating elements) of the dielectric substrate 122F can be made small, thus making it suitable for miniaturizing the antenna device 120F.

[0189] As described above, in a dual-band antenna module capable of radiating two different frequency bands, by arranging unidirectional duplexers before and after the connecting member, the number of feed lines arranged on the connecting member can be reduced. As a result, the increase in size associated with the increase in the number of lines can be suppressed in the antenna module.

[0190] Furthermore, even in the case of radiating radio waves in one frequency band, the number of feed lines configured on the connecting members can be reduced by using the filtering device described above on a dual-polarized antenna module that can radiate radio waves in two different polarization directions.

[0191] Furthermore, in the antenna devices 120F and 120G described above, a structure is described in which the feed element 121F and the feed element 125F overlap when viewed from the normal direction of the dielectric substrate. However, the feed element 121F and the feed element 125F can also be arranged in a position where they do not overlap.

[0192] (Variation Example 6)

[0193] In Embodiment 3, an example of using a co-directional duplexer is described regarding the structure in which the radiating element is independently fed in a dual-band antenna module.

[0194] In Variation 6, an example is given of using a co-directional duplexer in a dual-band antenna module that uses both fed and unfed elements as radiating elements.

[0195] Figure 24 This is a block diagram of the communication device 10H using the antenna module 100H described in Modification 6. (Refer to...) Figure 24The communication device 10H includes an antenna module 100H and a BBIC 200. The antenna module 100H includes an RFIC 110H, antenna devices 120H and 120J, a switching circuit 130, FEMs 180A and 180B, and a filter device 190. Similar to the antenna module 100F in Embodiment 3, FEMs 180A and 180B are disposed on the connecting member 140, and the filter device 190 is disposed on the main board 250. Furthermore, the structure of the RFIC 110H is the same as that of the RFIC 110F in Embodiment 3, and therefore will not be described in detail again.

[0196] Antenna device 120H and antenna device 120F are both dual-band antenna devices, but their radiating elements include fed elements 121H (121H1 to 121H4) and unfed elements 126H (126H1 to 126H4). For example... Figure 25 As shown in a partial cross-sectional view of the antenna device 120H, a feed element 126H is disposed between the feed element 121H and the ground electrode GND in the antenna device 120H. Furthermore, "feed element 121H" and "feed element 121J" in Modification 6 correspond to the "first element" in this disclosure. Additionally, "no feed element 126H" and "no feed element 126J" in Modification 6 correspond to the "second element" in this disclosure.

[0197] The feed line 191 passes through the unfeeded element 126H and connects to the feed point SP1 of the feed element 121H. When a high-frequency signal (e.g., 39 GHz band) corresponding to the high-frequency side of the feed element 121H is supplied to the feed line 191, radio waves are radiated from the feed element 121H. On the other hand, when a high-frequency signal (e.g., 28 GHz band) corresponding to the low-frequency side of the unfeeded element 126H is supplied to the feed line 191, the high-frequency signal is transmitted to the unfeeded element 126H in a non-contact manner through electromagnetic field coupling between the feed line 191 and the unfeeded element 126H at the through portion of the feed line 191. Thus, radio waves are radiated from the unfeeded element 126H.

[0198] Antenna device 120J includes feed elements 121J (121J1 to 121J4) and unfeeded elements 126J (126J1 to 126J4) as radiating elements. The structure of antenna device 120J is the same as that of antenna device 120H, so detailed description will not be repeated.

[0199] Thus, in dual-band antenna modules using and without feed elements, high-frequency signals for each frequency band are independently output from RFIC 110H. Therefore, when these signals are transmitted to antenna devices 120H and 120J using independent feed lines, the same number of feed lines as the number of radiating elements needs to be configured on connecting members 140A and 140B. However, in antenna module 100H of Modified Example 6, a filter device 190 including a duplexer is provided on the main board 250, and the feed lines for transmitting high-frequency signals on the high-frequency side are shared with the feed lines for transmitting high-frequency signals on the low-frequency side. This reduces the number of feed lines configured on connecting members 140A and 140B. As a result, the increase in size associated with the increase in the number of lines can be suppressed in the antenna module.

[0200] Furthermore, in Embodiment 3 and Modification 6, a structure including a filter device with a co-directional duplexer was described for a dual-band antenna module. However, in an antenna module capable of radiating radio waves in three or more different frequency bands, the number of feed lines arranged on the connecting members can be reduced by using a filter device including a tripper or multiplexer.

[0201] [Implementation Method 4]

[0202] (Structure of a communication device)

[0203] In Embodiment 4, an example is given of a structure in which a co-directional duplexer is not used in a dual-band antenna module similar to that in Embodiment 3.

[0204] Figure 26 This is a block diagram of the communication device 10Y of the antenna module 100Y according to embodiment 4. (Refer to...) Figure 26 The communication device 10Y includes an antenna module 100Y and a BBIC 200. The antenna module 100Y includes an RFIC 110Y, antenna devices 120F and 120G, a switching circuit 130Y, and an FEM 180Y.

[0205] Antenna devices 120F and 120G are the same as in Embodiment 3, with each radiating element of each antenna device arranged in antenna devices 120F and 120G including two feed elements. Antenna device 120F includes feed elements 121F and 125F, and antenna device 120G includes feed elements 121G and 125G. Each feed element is independently supplied with a high-frequency signal from RFIC 110Y.

[0206] RFIC 110Y has removed Figure 17The structure shown is derived from the switches 111A-111H, power amplifiers 112AT-112HT, and low-noise amplifiers 112AR-112HR in the RFIC 110F. In other words, the RFIC 110Y includes switches 113A-113H, 117A, and 117B, attenuators 114A-114H, phase shifters 115A-115H, signal synthesizers / demultiplexers 116A and 116B, mixers 118A and 118B, and amplifier circuits 119A and 119B.

[0207] The circuitry of switches 113A-113D, 117A, attenuators 114A-114D, phase shifters 115A-115D, signal synthesizer / demultiplexer 116A, mixer 118A, and amplifier circuit 119A is for the high-frequency side feed elements 121F and 121G. The circuitry of switches 113E-113H, 117B, attenuators 114E-114H, phase shifters 115E-115H, signal synthesizer / demultiplexer 116B, mixer 118B, and amplifier circuit 119B is for the low-frequency side feed elements 125F and 125G.

[0208] FEM 180Y includes FEM 180YA to FEM 180YD. Switches 113A and 113E are connected to FEM 180YA, and switches 113B and 113F are connected to FEM 180YB. Similarly, switches 113C and 113G are connected to FEM 180YC, and switches 113D and 113H are connected to FEM 180YD.

[0209] The switching circuit 130Y includes switches 130YA to 130YD. Switch 130YA includes switches 130YA1 and 130YA2, and switch 130YB includes switches 130YB1 and 130YB2. Similarly, switch 130YC includes switches 130YC1 and 130YC2, and switch 130YD includes switches 130YD1 and 130YD2.

[0210] Figure 27 It is used for explanation Figure 26 A diagram detailing the FEM 180Y is provided. Furthermore, in... Figure 27 For ease of explanation, the structure of one of the switches 130YA to 130YD and the structure of one of the FEMs 180YA to 180YD are shown representatively.

[0211] Reference Figure 27The FEM 180Y includes a power amplifier 183Y1 and a low-noise amplifier 184Y1 corresponding to the high-frequency side circuitry, a power amplifier 183Y2 and a low-noise amplifier 184Y2 corresponding to the low-frequency side circuitry, and a switch 182Y.

[0212] Switch 182Y includes two switching circuits. One switching circuit of switch 182Y is connected to the high-frequency side power amplifier 183Y1 and low-noise amplifier 184Y1, and either power amplifier 183Y1 or low-noise amplifier 184Y1 is connected to the input terminal of switch 130Y1 of switching circuit 130Y. The other switching circuit of switch 182Y is connected to the low-frequency side power amplifier 183Y2 and low-noise amplifier 184Y2, and either power amplifier 183Y2 or low-noise amplifier 184Y2 is connected to the input terminal of switch 130Y2 of switching circuit 130Y.

[0213] Switch 182Y is used to switch between transmitting and receiving radio waves. When radiating radio waves from antenna devices 120F and 120G, the switching circuit of switch 182Y is connected to power amplifiers 183Y1 and 183Y2. On the other hand, when receiving radio waves using antenna devices 120F and 120G, the switching circuit of switch 182Y is connected to low-noise amplifiers 184Y1 and 184Y2.

[0214] Switching circuit 130Y is used to switch between antenna device 120F and antenna device 120G. Each of the switches 130Y1 and 130Y2 included in switching circuit 130Y has two output terminals. One output terminal of switch 130Y1 is connected to the feed element 121F in antenna device 120F. The other output terminal of switch 130Y1 is connected to the feed element 121G in antenna device 120G. Additionally, one output terminal of switch 130Y2 is connected to the feed element 125F in antenna device 120F. The other output terminal of switch 130Y2 is connected to the feed element 125G in antenna device 120G.

[0215] More specifically, such as Figure 26 As shown, switch 130YA1 in switch 130YA is connected to power supply components 121F1 and 121G1. Switch 130YA2 in switch 130YA is connected to power supply components 125F1 and 125G1. Switch 130YB1 in switch 130YB is connected to power supply components 121F2 and 121G2. Switch 130YB2 in switch 130YB is connected to power supply components 125F2 and 125G2.

[0216] Additionally, switch 130YC1 in switch 130YC is connected to power supply components 121F3 and 121G3. Switch 130YC2 in switch 130YC is connected to power supply components 125F3 and 125G3. Switch 130YD1 in switch 130YD is connected to power supply components 121F4 and 121G4. Switch 130YD2 in switch 130YD is connected to power supply components 125F4 and 125G4.

[0217] Figure 28 yes Figure 26 Side view of antenna module 100Y. Antenna module 100Y and Figure 7 The antenna module 100A of Embodiment 2 shown also has the following structure: antenna devices 120F and 120G are disposed on a common connecting member 140Y. In addition, a switching circuit 130Y and an FEM 180Y are disposed on the surface 141Y of the connecting member 140Y.

[0218] On the other hand, the switching circuit 130 on the motherboard 250 is removed, and the signal from RFIC 110Y is transmitted to FEM 180Y via connection terminal 155 using connection wiring 170. As described above, the signal from FEM 180Y is transmitted to antenna device 120F or antenna device 120G after being branched by switching circuit 130Y.

[0219] By configuring the structure in this way, even without using the co-directional duplexers 190, 195A, and 195B as in Embodiment 3, it is possible to radiate or receive both high-frequency and low-frequency radio waves from the antenna devices 120F and 120G while switching between high-frequency and low-frequency radio waves. Furthermore, by providing high-frequency and low-noise amplifiers on both the high-frequency and low-frequency sides in the FEM 180Y, the antenna characteristics at each frequency can be appropriately adjusted, and the structure of the RFIC 110Y can be simplified.

[0220] Furthermore, in the antenna module 100Y described above, a structure was described where a power amplifier and a low-noise amplifier were configured in the FEM 180Y, but the RFIC 110Y did not have a power amplifier and a low-noise amplifier. However, a structure could also be constructed where the power amplifier and the low-noise amplifier were located in both the FEM and the RFIC. In this case, the load of the power amplifier and the low-noise amplifier could be shared by the FEM and the RFIC. Therefore, although the size of the RFIC was slightly larger than that of the antenna module 100Y, the size of the FEM configured on the flexible substrate (connecting member 140Y) could be miniaturized.

[0221] The embodiments disclosed herein should be considered illustrative rather than restrictive in all respects. The scope of the invention is set forth in the claims, rather than in the description of the embodiments above, and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0222] Explanation of reference numerals in the attached figures

[0223] 10, 10A, 10F, 10H, 10Y: Communication devices; 50: Housing; 51, 52: Main surface; 55-58: Side surfaces; 100, 100A-100F, 100H, 100X, 100Y: Antenna modules; 110, 110F, 110H, 110Y: RFIC; 111A-111H, 113A-113H, 117, 117A, 117B, 130A-130D, 130Y1, 130Y2, 130YA-130YD, 181, 181X, 182, 182X, 182Y: Switches; 112AR-112HR, 184, 184X1, 184X2, 184Y1, 184Y2: Low-noise amplifiers Power amplifiers; 112AT~112HT, 183, 183X1, 183X2, 183Y1, 183Y2: power amplifiers; 114A~114H: attenuators; 115A~115H: phase shifters; 116, 116A, 116B: signal synthesizers / demultiplexers; 118, 118A, 118B: mixers; 119, 119A, 119B: amplifier circuits; 120, 120A~120C, 120F~120H, 120J: antenna devices; 121, 121A, 121A1~121A4, 121B, 121B1~121B4, 121F, 121F1~121F4, 121G, 121G1~121G4, 12 1H, 121H1~121H4, 121J, 121J1~121J4, 125F, 125F1~125F4, 125G, 125G1~125G4: Power supply components; 122, 122A, 122B, 122F~122H, 122J, 143: Dielectric substrates; 123, 140, 140A~140D, 140Y: Connecting components; 126H, 126H1~126H4, 126J, 126J1~126J4: No power supply components; 130, 130X, 130Y: Switching circuits; 150A, 150B, 150X, 150Y, 155, 155A, 155B: Connecting terminals; 160A, 160B 161, 162, 191, 192: Power supply wiring; 170, 171, 260: Connection wiring; 180A, 180A1~180A4, 180B, 180B1~180B4, 180X, 180Y, 180YA~180YD: FEM; 190, 195A, 195B: Filtering device; 190A~190D, 195A1~195A4, 195B1~195B4: Duplexer; 200: BBIC; 210: Low-pass filter; 220: High-pass filter; 211~213, 221~223: Planar electrode; 250: Main board; C1: Capacitor electrode; GND: Ground electrode; SP1, SP2: Power supply point;T1, T1A-T1D, T2, T2A-T2D, T3, T3A-T3D: Terminals; V1-V5: Passageways.

Claims

1. An antenna module, comprising: A first substrate and a second substrate, each equipped with a radiating element; A third substrate, configured with a feeding circuit for providing high-frequency signals to the first substrate and the second substrate; and The switching circuit is configured to switch the connection between the feed circuit and the radiating element on the first substrate, and the connection between the feed circuit and the radiating element on the second substrate. The antenna module further has a connection member connected to the first substrate, the second substrate, and the third substrate, the connection member transferring a high-frequency signal between the feed circuit and a radiating element provided on the first substrate, and between the feed circuit and a radiating element provided on the second substrate, wherein The connecting member includes a dielectric substrate, and feed wiring for transmitting the high-frequency signal is formed inside the dielectric substrate.

2. The antenna module according to claim 1, wherein, It also has: A first amplification circuit is disposed on the connecting member and configured to amplify a high-frequency signal transmitted between a radiating element disposed on the first substrate and the feeding circuit. as well as A second amplification circuit, disposed on the connecting member, is configured to amplify the high-frequency signal transmitted between the radiating element disposed on the second substrate and the feeding circuit.

3. The antenna module according to claim 2, wherein, The first amplifier circuit and the second amplifier circuit are chips. At least one of the first amplifier circuit and the second amplifier circuit is in contact with the third substrate.

4. The antenna module according to claim 1, wherein, The switching circuit is configured on the third substrate.

5. The antenna module according to claim 1, wherein, The switching circuit is configured on the connecting member.

6. The antenna module according to claim 1, wherein, The connecting member is flexible.

7. The antenna module according to any one of claims 4 to 6, wherein, The connecting member has a multilayer structure consisting of multiple dielectric layers, including a first wiring and a second wiring formed on different layers.

8. The antenna module according to any one of claims 1 to 3, wherein, The radiating element includes a first element capable of radiating radio waves in a first frequency band and a second element capable of radiating radio waves in a second frequency band different from the first frequency band. The antenna module also includes a first filtering device, which comprises a first filter that allows signals from the first frequency band to pass through and a second filter that allows signals from the second frequency band to pass through. The first filtering device is disposed in the signal transmission path between the power supply circuit and the switching circuit in the third substrate.

9. The antenna module according to claim 8, wherein, The antenna module also includes a second filtering device, which comprises the first filter and the second filter. The second filtering device is disposed in the signal transmission path between the radiating element and the connecting member in the first substrate and the second substrate.

10. The antenna module according to any one of claims 1 to 3, wherein, It also includes the aforementioned power supply circuit.

11. The antenna module according to claim 1, wherein, The connecting member is connected to the first substrate and the second substrate respectively on its surface via connecting terminals, and is connected to the third substrate on its back side via connecting terminals.

12. An antenna module, comprising: A first substrate and a second substrate, each equipped with a radiating element; The third substrate is configured with a power supply circuit for providing high-frequency signals to the first substrate and the second substrate. as well as The switching circuit is configured to switch the connection between the feed circuit and the radiating element on the first substrate, and the connection between the feed circuit and the radiating element on the second substrate. The antenna module also features: A first connecting member is connected between the first substrate and the third substrate, and transmits high-frequency signals between the power supply circuit and the radiating element disposed on the first substrate; as well as A second connecting member, which connects the second substrate and the third substrate, transmits high-frequency signals between the power supply circuit and the radiating element disposed on the second substrate. The first connecting member has a first dielectric substrate, and the second connecting member has a second dielectric substrate. Feed wiring for transmitting the high-frequency signal is formed inside both the first dielectric substrate and the second dielectric substrate.

13. The antenna module according to claim 12, wherein, It also has: A first amplification circuit is disposed on the first connecting member and configured to amplify a high-frequency signal transmitted between a radiating element disposed on the first substrate and the feeding circuit. as well as A second amplification circuit, disposed on the second connecting member, is configured to amplify the high-frequency signal transmitted between the radiating element disposed on the second substrate and the feeding circuit.

14. The antenna module according to claim 13, wherein, The first amplifier circuit and the second amplifier circuit are chips. At least one of the first amplifier circuit and the second amplifier circuit is in contact with the third substrate.

15. The antenna module according to any one of claims 12 to 14, wherein, At least one of the first connecting member and the second connecting member has a multilayer structure consisting of multiple dielectric layers, including a first wiring and a second wiring formed on different layers.

16. The antenna module according to claim 12, wherein, The switching circuit is configured on the third substrate.

17. The antenna module according to any one of claims 12 to 14, wherein, The radiating element includes a first element capable of radiating radio waves in a first frequency band and a second element capable of radiating radio waves in a second frequency band different from the first frequency band. The antenna module also includes a first filtering device, which comprises a first filter that allows signals from the first frequency band to pass through and a second filter that allows signals from the second frequency band to pass through. The first filtering device is disposed in the signal transmission path between the power supply circuit and the switching circuit in the third substrate.

18. The antenna module according to claim 17, wherein, The antenna module also includes a second filtering device, which comprises the first filter and the second filter. The second filtering device is disposed in the first substrate, in the signal transmission path between the radiating element and the first connecting member, and in the second substrate, in the signal transmission path between the radiating element and the second connecting member.

19. The antenna module according to any one of claims 12 to 14, wherein, It also includes the aforementioned power supply circuit.

20. A communication device, equipped with an antenna module according to any one of claims 1 to 19.

21. A communication device comprising: The antenna module according to claim 2 or 13; and A housing for storing the antenna module. in, The first amplifier circuit and the second amplifier circuit are configured separately from the housing.

22. A connecting member for connecting a first substrate and a second substrate, each having a radiating element disposed thereon, to a third substrate having a feed circuit for providing high-frequency signals to the first substrate and the second substrate, the connecting member comprising: A dielectric substrate, wherein feed wiring for transmitting high-frequency signals between the feed circuit and each radiating element is formed within the dielectric substrate; and A switching circuit, disposed on the dielectric substrate, is configured to switch the connection between the power supply circuit and the radiating element on the first substrate, and the connection between the power supply circuit and the radiating element on the second substrate.

23. The connecting member according to claim 22, wherein, It also has: A first amplification circuit is disposed on the dielectric substrate and configured to amplify a high-frequency signal transmitted between a radiating element disposed on the first substrate and the feeding circuit. as well as A second amplification circuit, disposed on the dielectric substrate, is configured to amplify the high-frequency signal transmitted between the radiating element disposed on the second substrate and the feeding circuit.

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