Conductor connecting structure and probe provided with the same

Abstract

The present invention provides a conductor connection structure that measures an electrical characteristic of a measured object with high precision and a probe provided with the conductor connection structure. A conductor connection structure (8) in a probe (1) extending from a base end side (A) to a tip end side (B), the probe connecting a coaxial cable (70) in which a center conductor (72), a dielectric (74), and an outer conductor (76) are coaxially arranged, the conductor connection structure (8) having a measurement pin (20) electrically connected to the center conductor of the coaxial cable, the conductor connection structure (8) being provided with: an outer cover member (10) that is electrically conductive, covering the outer conductor with a gap (16) with respect to the outer conductor; and an outer connection portion (61, 67) that is electrically conductive, fixing and electrically connecting the outer conductor with respect to the outer cover member, an end portion of the outer connection portion on the tip end side of the probe, that is, an outer connection end (62, 88) being arranged flush with or on the tip end side of the probe with respect to an end portion of the outer conductor on the tip end side of the probe, that is, an outer conductor end (77).

Description

Technical Field

[0001] The present invention relates to a conductor connection structure and a probe having the conductor connection structure. Background Technology

[0002] For example, Patent Document 1 discloses a coaxial connector for inspection that connects to the end of a coaxial cable. In the coaxial connector for inspection of Patent Document 1, the center conductor and the outer conductor of the coaxial cable are electrically connected to the socket of the coaxial connector, and are connected to the coaxial connector for inspection via the socket of the coaxial connector.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2014-123482

[0004] While Patent Document 1 describes the electrical connection between the coaxial cable and the coaxial connector, it does not specifically disclose the structure of the electrical connection.

[0005] However, when the signal flowing through the conductor is in the high-frequency band, such as microwaves or millimeter waves, the current density concentrates on the conductor surface due to the skin effect. When a conductive connecting component is used to connect the conductor to a conductive cover component that gaps over the conductor, improper positioning of the connecting component can complicate the current path due to return paths. This complexity can lead to unwanted resonance, hindering the accurate measurement of the electrical properties of the measured object. Summary of the Invention

[0006] Therefore, the technical problem to be solved by the present invention is to provide a conductor connection structure for measuring the electrical properties of a test object with high precision, and a probe having the conductor connection structure.

[0007] To address the aforementioned technical challenges, the present invention provides the following conductor connection structure.

[0008] That is, the conductor connection structure involved in this invention is a conductor connection structure in a probe extending from the base end side to the end end side. This probe is used to connect a coaxial cable that coaxially arranges a center conductor, a dielectric, and an outer conductor, and has a measuring pin electrically connected to the center conductor of the coaxial cable. The conductor connection structure is characterized by having:

[0009] A conductive outer cover component, which gaps over the aforementioned outer conductor; and

[0010] A conductive external connection portion fixes and electrically connects the external conductor relative to the external cover component.

[0011] The external connection end of the external connection portion, which is the end of the probe, is flush with or located at the end of the external conductor, which is the end of the probe.

[0012] According to the present invention, the current path does not have a return path, thereby suppressing unnecessary resonance and thus enabling high-precision measurement of the electrical properties of the analyte. Attached Figure Description

[0013] Figure 1 This is a perspective view of the probe according to the first embodiment of the present invention.

[0014] Figure 2 yes Figure 1 The probe shown is a top view.

[0015] Figure 3 yes Figure 2 The probe shown is a cross-sectional view along line III-III.

[0016] Figure 4 yes Figure 1 The exploded 3D view of the probe is shown.

[0017] Figure 5 yes Figure 3 The enlarged cross-sectional view of the main part of the probe shown.

[0018] Figure 6 This is an enlarged cross-sectional view of the main part of the probe according to the second embodiment of the present invention.

[0019] Figure 7 This is an enlarged cross-sectional view of the main part of the probe according to the third embodiment of the present invention.

[0020] Figure 8 This is an enlarged cross-sectional view of the main part of the probe according to the fourth embodiment of the present invention.

[0021] Figure 9 This is an enlarged cross-sectional view of the main part of the probe according to the fifth embodiment of the present invention.

[0022] Figure 10 This is an enlarged cross-sectional view of the main part of the probe according to the sixth embodiment of the present invention.

[0023] Figure 11 This is an enlarged cross-sectional view of the main part of the probe according to the seventh embodiment of the present invention.

[0024] Figure 12 This is an enlarged cross-sectional view of the main part of the probe according to the eighth embodiment of the present invention.

[0025] Figure 13 This is an enlarged cross-sectional view of the main part of the probe according to the ninth embodiment of the present invention. Detailed Implementation

[0026] Hereinafter, embodiments of the conductor connection structures 7 and 8 and the probe 1 having the conductor connection structures 7 and 8 according to the present invention will be described with reference to the accompanying drawings.

[0027] [First Implementation]

[0028] Reference Figures 1-5 The probe 1 according to the first embodiment will be described. Figure 1 This is a perspective view of probe 1 according to the first embodiment of the present invention. Figure 2 yes Figure 1 The top view of probe 1 shown. Figure 3 yes Figure 2 The cross-sectional view of probe 1 along line III-III is shown. Figure 4 yes Figure 1 The exploded three-dimensional view of probe 1 is shown. Figure 5 yes Figure 3 An enlarged cross-sectional view of the main part of probe 1 is shown.

[0029] like Figures 1-4 As shown, probe 1 includes a cylinder 10, a measuring pin 20, a first bushing 30, a second bushing 40, a socket 50, and a coaxial cable 70. Probe 1 extends from its base side A (i.e., one end A) to its end side B (i.e., the other end B) along the extension direction of probe 1. Figure 2 and Figure 3 (The middle part is in the X-axis direction). The probe 1 measures the electrical characteristics of the connector (object under test) 2 by elastically contacting the connector terminal (terminal under test) 3 of the connector (object under test) 2.

[0030] The cylinder 10 includes: a cylinder body 12 having a cylindrical shape extending along the X-axis; and a first receiving portion 14 formed inside the cylinder body 12. The end side B of the cylinder body 12 opens through an end through hole 15, into which the measuring end 22 of the measuring pin 20 is inserted. The base end side of the cylinder body 12 has a base end opening larger than the end through hole 15, into which a coaxial cable 70 is inserted. The cylinder 10 is made of a conductive material, such as a metallic material, for example, phosphor bronze.

[0031] A first receiving portion 14 is formed inside the cylinder 10. The first receiving portion 14 houses the measuring pin 20, the first bushing 30, the second bushing 40, the socket 50, and the coaxial cable 70. The cylinder 10 covers the outer conductor 76 of the coaxial cable 70 with an external gap 16, thus functioning as a conductive outer cover component. An external through hole 18 extending along the thickness direction of the cylinder body 12 is formed in the cylinder 10. For example, two external through holes 18 are arranged opposite each other at an angle of 180 degrees. The arrangement and number of external through holes 18 are not limited thereto. The external through hole 18 has an open end portion 19 on the end side B of the probe 1.

[0032] The measuring pin 20 is a retractable rod-shaped (needle-shaped) electrode with a built-in spring, also known as a contact probe, spring pin, or spring needle. The measuring pin 20 has a measuring end 22 on its distal end B and a connecting end 24 on its base end side. The measuring pin 20 is made of a conductive material, such as a metal.

[0033] A first bushing 30 is disposed at the end side B of the cylinder 10. The first bushing 30 has a cylindrical shape and is engaged with the end through hole 15 of the cylinder 10. The first bushing 30 is made of an electrically insulating material, such as resin. The measuring end 22 of the measuring pin 20 is inserted into the first insertion hole of the first bushing 30. The measuring pin 20 is disposed in the cylinder 10 in an electrically insulating state through the first bushing 30.

[0034] The second bushing 40 is disposed on the central side of the cylinder 10. The second bushing 40 is engaged by a stepped portion formed in the central part of the first receiving portion 14 of the cylinder 10. The second bushing 40 has a cylindrical shape. The second bushing 40 is made of an electrically insulating material, such as resin. The connecting end 24 of the measuring pin 20 is inserted into the small-diameter hole of the second insertion hole of the second bushing 40. The socket 50 is inserted into the large-diameter hole of the second insertion hole of the second bushing 40. The connecting end 24 of the measuring pin 20 contacts the socket 50. The measuring pin 20 is electrically connected to the socket 50 in a state supported by the second bushing 40.

[0035] The socket 50 is disposed in the large-diameter hole of the second insertion hole of the second bushing 40. The socket 50 has a bottomed cylindrical shape. The socket 50 is made of a conductive material, such as a metallic material, such as phosphor bronze. The socket 50 covers the center conductor 72 of the coaxial cable 70 with a center gap 56, thus functioning as a conductive center cover component. A second receiving portion 54 is formed inside the socket 50. The socket 50 has a socket end 57 on the base end side A. The socket end 57 functions as a center cover end. A central through hole 58 extending along the thickness direction of the socket 50 is formed in the socket 50. For example, two central through holes 58 are arranged opposite each other at an angle of 180 degrees. The arrangement and number of central through holes 58 are not limited thereto.

[0036] The coaxial cable 70 has a conductive center conductor 72, a dielectric 74 covering the center conductor 72, an outer conductor 76 covering the dielectric 74, and an electrically insulating outer sheath 78 covering the outer conductor 76. The end of the center conductor 72 protrudes from the dielectric 74. The dielectric 74 has a dielectric end 75 at the end side B of the probe 1. The outer conductor 76 has an outer conductor end 77 at the end side B of the probe 1. The end of the dielectric 74, including the dielectric end 75, protrudes from the outer conductor end 77 toward the end side B and protrudes from the outer conductor 76. The end of the outer conductor 76, including the outer conductor end 77, protrudes from the outer sheath 78. When the coaxial cable 70 including the outer sheath 78 is inserted into the first receiving portion 14 of the tube 10, the dielectric end 75 of the dielectric 74 is locked by the base end of the second bushing 40. The outer conductor end 77 separates from the end side B of the center conductor 72 toward the base end side A. This improves the short-circuit protection of the center conductor 72 and the outer conductor 76.

[0037] The corner of the dielectric end 75 of the dielectric 74 abuts against the tapered edge of the base end A of the second bushing 40, i.e., the defined insertion portion 44. This separates the filling area of ​​the solder 61 from the filling area of ​​the solder 64, thus preventing short circuits caused by contact between the solder 61 and the solder 64.

[0038] When the coaxial cable 70 is inserted into the first receiving portion 14 of the tube 10, an external gap 16 is formed between the outer peripheral surface of the outer conductor 76 and the inner peripheral surface 13 of the tube body 12. The end portion of the center conductor 72 is inserted and received in the second receiving portion 54 of the socket 50. At this time, a center gap 56 is formed between the outer peripheral surface 82 of the center conductor 72 and the inner peripheral surface of the socket 50.

[0039] Reference Figure 5 The conductor connection structures 7 and 8 of the probe 1 according to the first embodiment will be described.

[0040] like Figure 5 As shown, a center conductor connection structure (conductor connection structure) 7 is provided relative to the center conductor 72 of the coaxial cable 70, and an outer conductor connection structure (conductor connection structure) 8 is provided relative to the outer conductor 76.

[0041] First, the center conductor connection structure (conductor connection structure) 7 will be described. The socket 50, which functions as a center cover component, is configured to cover the center conductor 72 with a center gap 56 so that the end portion of the center conductor 72 can be inserted into the socket insertion portion 44. Solder 64 is provided to fix and electrically connect the end portion of the center conductor 72 relative to the socket 50. This facilitates fixing and electrically connecting the end portion of the center conductor 72 relative to the socket 50. The solder 64 functions as a center connection portion and as a center connection component. The solder 64 is supplied from the center through-hole 58, filling the center gap 56. This facilitates the supply of solder 64 to the center gap 56. Therefore, the center through-hole 58 functions as a solder supply portion. Viewed from the Z-axis direction, the center through-hole 58 is, for example, a circular through-hole. The center through-hole 58 is located on the base end side A, i.e., on one side of the socket end 57.

[0042] Solder 64 supplied from the central through-hole 58 fills at least the base end side A of the central gap 56. The solder 64 disposed in the central gap 56 has a central connecting end 65 on the base end side A. Figure 5 In the center conductor connection configuration 7 shown, the center connection end 65 of the solder 64 is located on the base side A from the socket end 57 of the socket 50, between the socket end 57 and the dielectric end 75. The center connection end 65 is, for example, flush with the socket end 57.

[0043] When the signal flowing through the central conductor 72 becomes a high-frequency band such as microwave or millimeter wave, the current density concentrates on the surface of the central conductor 72 due to the skin effect. Figure 5 In the center conductor connection structure 7 shown, the center connection end 65 of the solder 64 is configured to be flush with the socket end 57 of the socket 50. According to this center conductor connection structure 7, the current path from the center conductor 72 to the socket 50 consists of the outer peripheral surface 82 of the center conductor 72, the center connection end 65 of the solder 64, the socket end 57 of the socket 50, and the outer peripheral surface 51 of the socket 50. Therefore, in the aforementioned center conductor connection structure 7, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the object under test 2.

[0044] Next, the external conductor connection structure (conductor connection structure) 8 will be described. The cylinder 10, which functions as an external cover component, is configured to cover the external conductor 76 with an external gap 16 so that the coaxial cable 70 can be inserted into the first receiving portion 14. Solder 61 is provided to fix and electrically connect the cylinder 10 to the external conductor 76. This facilitates the fixing and electrical connection of the external conductor 76 to the cylinder 10. The solder 61 functions as an external connection portion and as an external connection component. The solder 61 is supplied through the external through-hole 18, filling the external gap 16. This facilitates the supply of solder 61 to the external gap 16. Therefore, the external through-hole 18 functions as a solder supply portion. Viewed from the Z-axis direction, the external through-hole 18 is, for example, a circular through-hole. The external through-hole 18 is provided in the cylinder body 12 at the end side B.

[0045] An external through-hole 18 is disposed above the external conductor end 77, so that solder 61 supplied from the external through-hole 18 fills at least the end side B of the external gap 16. The solder 61 disposed in the external gap 16 has an external connection end 62 at the end side B. Figure 5 In the external conductor connection configuration 8 shown, the external connection end 62 of the solder 61 is located at the end side B from the external conductor end 77 of the external conductor 76, between the external conductor end 77 and the dielectric end 75. The external connection end 62 is offset towards the end side B from the external conductor end 77. The external conductor end 77 is located closer to the base end A than the opening end portion 19 formed in the external through-hole 18 at the end side B, and is located opposite to the external through-hole 18. Thus, the external conductor end 77 is covered by the solder 61, and the external connection end 62 is offset towards the end side B from the external conductor end 77, thereby preventing the formation of a return path.

[0046] When the signal flowing through the outer conductor 76 becomes a high-frequency band such as microwave or millimeter wave, the current density concentrates on the surface of the outer conductor 76 due to the skin effect. Figure 5 In the external conductor connection configuration 8 shown, the external connection end 62 of the solder 61 is configured such that the external conductor end 77 of the external conductor 76 is located at the end side B. According to this external conductor connection configuration 8, the current path from the external conductor 76 to the cylinder 10 becomes the outer conductor inner circumferential surface 86 of the external conductor 76, the external connection end 62 of the solder 61, and the inner circumferential surface 13 of the cylinder 10. Therefore, in the external conductor connection configuration 8 described above, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the object under test 2.

[0047] Therefore, according to the above structure, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the test object 2.

[0048] [Second Implementation]

[0049] Reference Figure 6 The conductor connection structures 7 and 8 of the probe 1 according to the second embodiment will be described, but the description will focus on the differences from the first embodiment described above.

[0050] Figure 6 The probe 1 shown has the same center conductor connection structure 7 as the first embodiment, and has a center conductor connection structure 7 in which the external connection end 62 of the solder 61 supplied from the external through hole 18 is flush with the external conductor end 77 of the external conductor 76.

[0051] like Figure 6 As shown, the external through hole 18 is provided on the end side B. In detail, the external through hole 18 is provided with its opening end portion 19 on its end side B parallel to the external conductor end 77 of the external conductor 76.

[0052] Solder 61 supplied from the external through-hole 18 fills at least the end side B of the external gap 16. The solder 61 disposed in the external gap 16 has an external connecting end 62 at the end side B. Figure 6 In the external conductor connection configuration 8 shown, the external connection end 62 of the solder 61 is located at the end side B from the external conductor end 77 of the external conductor 76, between the external conductor end 77 and the dielectric end 75. The external connection end 62 is, for example, flush with the external conductor end 77.

[0053] According to the external conductor connection structure 8 described above, the current path from the external conductor 76 to the cylinder 10 consists of the outer conductor inner circumferential surface 86 of the external conductor 76, the outer conductor end 77 of the external conductor 76, the outer connection end 62 of the solder 61, and the inner circumferential surface 13 of the cylinder 10. Therefore, in the external conductor connection structure 8 described above, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the object under test 2.

[0054] Therefore, according to the above structure, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the test object 2.

[0055] [Third Implementation Method]

[0056] Reference Figure 7 The conductor connection structures 7 and 8 of the probe 1 according to the third embodiment will be described, but the description will focus on the differences from the first embodiment described above.

[0057] Figure 7The probe 1 shown has the same external conductor connection structure 8 as the first embodiment, and has a central conductor connection structure 7 in which the central connection end 65 of the solder 64 supplied from the central notch 59 is offset towards the base end A from the socket end 57.

[0058] like Figure 7 As shown, the center cutout 59 is positioned parallel to the socket end 57. Solder 64 is provided to fix and electrically connect the end of the center conductor 72 relative to the socket 50. The solder 64 functions as a center connection portion and as a center connection component. The center cutout 59, viewed from the Z-axis direction, has a shape such as a semicircle or ellipse and extends along the thickness direction of the socket 50. The center cutout 59 functions as a solder supply portion.

[0059] Solder 64 supplied from the center cutout 59 fills at least the base end side A of the center gap 56. This facilitates the fixing and electrical connection of the end portion of the center conductor 72 relative to the socket 50. The solder 64 disposed in the center gap 56 has a center connection end 65 on the base end side A. Figure 7 In the center conductor connection configuration 7 shown, the center connection end 65 of the solder 64 is located on the base side A from the socket end 57 of the socket 50, between the socket end 57 and the dielectric end 75. The center connection end 65 is offset, for example, from the socket end 57 towards the base side A.

[0060] According to the center conductor connection structure 7 described above, the current path from the center conductor 72 to the socket 50 consists of the outer peripheral surface 82 of the center conductor 72, the center connection end 65 of the solder 64, the socket end 57 of the socket 50, and the outer peripheral surface 51 of the socket 50. Therefore, in the center conductor connection structure 7 described above, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the object under test 2.

[0061] Therefore, according to the above structure, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the test object 2.

[0062] [Fourth Implementation Method]

[0063] Reference Figure 8 The conductor connection structures 7 and 8 of the probe 1 according to the fourth embodiment will be described, but the description will focus on the differences from the second embodiment described above.

[0064] Figure 8 The probe 1 shown has the same external conductor connection structure 8 as the second embodiment, and has a central conductor connection structure 7 in which the central connection end 65 of the solder 64 supplied from the central cutout 59 is flush with the socket end 57.

[0065] like Figure 8 As shown, the center cutout 59 is positioned parallel to the socket end 57. The center cutout 59 has a shape such as a semicircle or ellipse when viewed from the Z-axis direction, and extends along the thickness direction of the socket 50.

[0066] Solder 64 supplied from the center cutout 59 fills at least the base end side A of the center gap 56. The solder 64 disposed in the center gap 56 has a center connecting end 65 on the base end side A. Figure 8 In the center conductor connection configuration 7 shown, the center connection end 65 of the solder 64 is located on the base side A from the socket end 57 of the socket 50, between the socket end 57 and the dielectric end 75. The center connection end 65 is, for example, flush with the socket end 57.

[0067] According to the center conductor connection structure 7 described above, the current path from the center conductor 72 to the socket 50 consists of the outer peripheral surface 82 of the center conductor 72, the center connection end 65 of the solder 64, the socket end 57 of the socket 50, and the outer peripheral surface 51 of the socket 50. Therefore, in the center conductor connection structure 7 described above, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the object under test 2.

[0068] Therefore, according to the above structure, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the test object 2.

[0069] [Fifth Implementation Method]

[0070] Reference Figure 9 The conductor connection structures 7 and 8 of the probe 1 according to the fifth embodiment will be described, but the description will focus on the differences from the first embodiment described above.

[0071] Figure 9 The probe 1 shown has the same external conductor connection structure 8 as the first embodiment, and has a central conductor connection structure 7 with solder 64 filling the central gap 56.

[0072] like Figure 9 As shown, the socket 50 does not have a central through hole 58 or a central notch 59, and the solder 64 is configured to fill the central gap 56. The solder 64 configured in the central gap 56 has a central connecting end 65 on the base end side A. Figure 9 In the center conductor connection configuration 7 shown, the center connection end 65 of the solder 64 is located on the base end side A from the socket end 57 of the socket 50, between the socket end 57 and the dielectric end 75. The center connection end 65 is, for example, flush with the socket end 57. Alternatively, the center connection end 65 of the solder 64 may also be offset towards the base end side A from the socket end 57 of the socket 50.

[0073] According to the center conductor connection structure 7 described above, the current path from the center conductor 72 to the socket 50 consists of the outer peripheral surface 82 of the center conductor 72, the center connection end 65 of the solder 64, the socket end 57 of the socket 50, and the outer peripheral surface 51 of the socket 50. Therefore, in the center conductor connection structure 7 described above, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the object under test 2.

[0074] Therefore, according to the above structure, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the test object 2.

[0075] [Sixth Implementation Method]

[0076] Reference Figure 10 The conductor connection structures 7 and 8 of the probe 1 according to the sixth embodiment will be described, but the description will focus on the differences from the second embodiment described above.

[0077] Figure 10 The probe 1 shown has the same external conductor connection structure 8 as in the second embodiment, and has a central conductor connection structure 7 with solder 64 filling the central gap 56.

[0078] like Figure 10 As shown, the socket 50 does not have a central through hole 58 or a central notch 59, and the solder 64 is configured to fill the central gap 56. The solder 64 configured in the central gap 56 has a central connecting end 65 on the base end side A. Figure 10 In the center conductor connection configuration 7 shown, the center connection end 65 of the solder 64 is located at the base end A from the socket end 57 of the socket 50, between the socket end 57 and the dielectric end 75. The center connection end 65 is, for example, offset towards the base end A from the socket end 57. Therefore, in the center conductor connection configuration 7 described above, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the object under test 2. Furthermore, the center connection end 65 of the solder 64 can also be flush with the socket end 57 of the socket 50.

[0079] Therefore, according to the above structure, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the test object 2.

[0080] [Seventh Implementation Method]

[0081] Reference Figure 11 The conductor connection structures 7 and 8 of the probe 1 according to the seventh embodiment will be described, but the description will focus on the differences from the first embodiment described above.

[0082] Figure 11The probe 1 shown has the same center conductor connection structure 7 as the first embodiment, and an external conductor connection structure 8 with an external conductor 76 having a coaxial cable 70 fixed and electrically connected to the cylinder 10 via a conductive embedded member 67.

[0083] like Figure 11 As shown, a conductive insert 67, functioning as both an external connector and an external connecting member, is embedded in the external gap 16. The external gap 16 is formed between the inner circumferential surface 86 of the outer conductor 76 and the inner circumferential surface 13 of the cylinder body 12. The conductive insert 67 is configured to abut against both the outer conductor end 77 of the outer conductor 76 and the inner circumferential surface 13 of the cylinder 10. This facilitates the fixing and electrical connection of the outer conductor 76 relative to the cylinder 10. The insert 67 is made of a conductive material, such as a metallic material, for example, phosphor bronze.

[0084] The embedded member 67, for example, has an annular shape and includes an abutment end face 68, an abutment peripheral surface 69, an embedded inner peripheral surface 87, and an external connection end 88. The abutment end face 68 is formed on the base end side A, and the external connection end 88 is formed on the end side B. The embedded member 67 is embedded between the outer conductor 76 of the coaxial cable 70 and the second bushing 40, and pressed into the first receiving portion 14. Thus, the abutment end face 68 abuts against the outer conductor end 77, and the abutment peripheral surface 69 abuts against the inner peripheral surface 13 of the tube. The outer conductor 76 of the coaxial cable 70 is fixed and electrically connected relative to the tube 10 by the conductive embedded member 67. The external connection end 88 of the embedded member 67 is located on the end side B from the outer conductor end 77 of the outer conductor 76, between the outer conductor end 77 and the dielectric end 75. The external connection end 88 is, for example, offset towards the end side B from the outer conductor end 77.

[0085] According to the external conductor connection structure 8 described above, the current path from the external conductor 76 to the cylinder 10 consists of the outer conductor inner circumferential surface 86 of the external conductor 76, the embedded inner circumferential surface 87 of the embedded member 67 and the external connection end 88, and the inner circumferential surface 13 of the cylinder 10. Therefore, in the external conductor connection structure 8 described above, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the object under test 2.

[0086] Furthermore, the contact end face 68 is located closer to the base end side A than the opening end portion 19 formed on the end side B in the external through hole 18, and is located opposite to the external through hole 18. Therefore, the position of the embedded member 67 can be visually identified through the external through hole 18. Additionally, solder 61 can be supplied from the external through hole 18 to electrically connect the external conductor 76 and the embedded member 67. This strengthens the electrical connection. Alternatively, a structure in which the embedded member 67 is integrated with the cylinder 10 can also be adopted.

[0087] like Figure 11 As shown, a central through-hole 58 is disposed on the base end side A. Solder 64 supplied from the central through-hole 58 fills at least the base end side A of the central gap 56. The solder 64 disposed in the central gap 56 has a central connecting end 65 on the base end side A. Figure 11 In the center conductor connection configuration 7 shown, the center connection end 65 of the solder 64 is located on the base side A from the socket end 57 of the socket 50, between the socket end 57 and the dielectric end 75. The center connection end 65 is, for example, flush with the socket end 57.

[0088] According to the center conductor connection structure 7 described above, the current path from the center conductor 72 to the socket 50 consists of the outer peripheral surface 82 of the center conductor 72, the center connection end 65 of the solder 64, the socket end 57 of the socket 50, and the outer peripheral surface 51 of the socket 50. Therefore, in the center conductor connection structure 7 described above, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the object under test 2.

[0089] Therefore, according to the above structure, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the test object 2.

[0090] [Eighth Implementation Method]

[0091] Reference Figure 12 The conductor connection structures 7 and 8 of the probe 1 according to the eighth embodiment will be described, but the description will focus on the differences from the seventh embodiment described above.

[0092] Figure 12 The probe 1 shown has the same external conductor connection structure 8 as in the seventh embodiment, and has a central conductor connection structure 7 in which solder 64 supplied from the central cut 59 fills the base side A of the central gap 56.

[0093] like Figure 12 As shown, the center cutout 59 is positioned parallel to the socket end 57. The center cutout 59, when viewed from the Z-axis direction, has a shape such as a semicircle or ellipse and extends along the thickness direction of the socket 50. The socket end 57 abuts against the dielectric end 75.

[0094] Solder 64 supplied from the center cutout 59 fills at least the base end side A of the center gap 56. The solder 64 disposed in the center gap 56 has a center connecting end 65 on the base end side A. Figure 8 In the center conductor connection configuration 7 shown, the center connection end 65 of the solder 64 is located on the base side A from the socket end 57 of the socket 50, between the socket end 57 and the dielectric end 75. The center connection end 65 is, for example, flush with the socket end 57.

[0095] According to the center conductor connection structure 7 described above, the current path from the center conductor 72 to the socket 50 consists of the outer peripheral surface 82 of the center conductor 72, the center connection end 65 of the solder 64, the socket end 57 of the socket 50, and the outer peripheral surface 51 of the socket 50. Therefore, in the center conductor connection structure 7 described above, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the object under test 2.

[0096] Therefore, according to the above structure, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the test object 2.

[0097] [Ninth Implementation Method]

[0098] Reference Figure 13 The conductor connection structures 7 and 8 of the probe 1 according to the ninth embodiment will be described, but the description will focus on the differences from the seventh embodiment described above.

[0099] Figure 13 The probe 1 shown has the same external conductor connection structure 8 as in the seventh embodiment, and a center conductor connection structure 7 with solder 64 filling the center gap 56. Figure 13 In the center conductor connection structure 7 shown, the socket 50 does not have a center through hole 58 or a center cutout 59, and the solder 64 is configured to fill the center gap 56.

[0100] The socket end 57 abuts against the dielectric end 75. The solder 64, disposed in the center gap 56, has a center connection end 65 on the base end side A. Figure 9 In the center conductor connection configuration 7 shown, the center connection end 65 of the solder 64 is located on the base side A from the socket end 57 of the socket 50, between the socket end 57 and the dielectric end 75. The center connection end 65 is, for example, flush with the socket end 57.

[0101] According to the center conductor connection structure 7 described above, the current path from the center conductor 72 to the socket 50 consists of the outer peripheral surface 82 of the center conductor 72, the center connection end 65 of the solder 64, the socket end 57 of the socket 50, and the outer peripheral surface 51 of the socket 50. Therefore, in the center conductor connection structure 7 described above, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the object under test 2.

[0102] Therefore, according to the above structure, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the test object 2.

[0103] Specific embodiments of the present invention have been described, but the present invention is not limited to the above embodiments and can be implemented by various modifications within the scope of the present invention.

[0104] In the above embodiments, the probe 1 has both a central conductor connection structure 7 and an external conductor connection structure 8, but it may also have at least one of the central conductor connection structure 7 and the external conductor connection structure 8.

[0105] The above embodiments are illustrative, and the center conductor connection structure 7 and the outer conductor connection structure 8 in the above embodiments can be appropriately combined.

[0106] In the above embodiment, the external connecting portions 61 and 67 are separate components from the outer cover component 10. This allows for high-precision positioning of the external connecting ends 62 and 88. However, the external connecting portions can also be part of the outer cover component 10. The outer cover component 10, as an external connecting portion, has, for example, an external protrusion that protrudes towards and is pressed against the external conductor 76 at a position corresponding to the external through hole 18. This external protrusion is formed by a seam-forming process. Thus, the external protrusion engages with and is electrically connected to the external conductor 76. The external protrusion has, for example, a circular or rectangular shape when viewed from the Z-axis direction, and its cross-section has a rectangular shape. The external protrusion has an external connecting end at its other end side (end side) B. The external connecting end of the external protrusion is located at the other end side (end side) B from the external conductor end 77. Similar to the external connecting ends 62 and 88, the external connecting end of the external protrusion is offset from the external conductor end 77 towards the other end side (end side) B, or is flush with the external conductor end 77.

[0107] In the above embodiment, the center connecting portion 64 is a separate component from the center cover component 50. This allows for high-precision positioning of the center connecting end 65. However, the center connecting portion 64 can also be part of the center cover component 50. The center cover component 50, for example, has a center protrusion that protrudes towards and is pressed against the center conductor 72 at a position corresponding to the center through hole 58 or center cutout 59. This center protrusion is formed by a seam-forming process. Thus, the center protrusion engages with and is electrically connected to the center conductor 72. The center protrusion, for example, has a circular or rectangular shape when viewed from the Z-axis direction, and its cross-section has a rectangular shape. The center protrusion has a center connecting end on the base end side A. The center connecting end of the center protrusion is located on the base end side A from the center cover end 57. Like the center connecting end 65, the center connecting end of the center protrusion is offset towards the base end side A from the center cover end 57, or is flush with the center cover end 57.

[0108] The shapes of the central through hole 58, central cutout 59, and external through hole 18, which function as solder supply parts, are exemplified. When viewed from the Z-axis direction, they can have various shapes such as square, rectangle, trapezoid, parallelogram, oval, ovate, semi-oval, and semi-ovate.

[0109] Solder 64 may also be present in the central through hole 58 and the central notch 59, and solder 61 may also be present in the external through hole 18.

[0110] In the coaxial cable 70 described above, the end of the center conductor 72 protrudes from the dielectric 74, the end of the dielectric 74 protrudes from the outer conductor 76, and the end of the outer conductor 76 protrudes from the outer sheath 78. This improves the short-circuit protection of the center conductor 72 and the outer conductor 76. However, it is also possible for the coaxial cable 70 to have a structure where the ends of the dielectric 74 and the outer conductor 76 are flush, and the end of the center conductor 72 protrudes from both ends of the dielectric 74 and the outer conductor 76.

[0111] The present invention and its embodiments are summarized below.

[0112] One aspect of the present invention involves a conductor connection structure 8 in a probe 1 extending from the base end side A to the end side B. This probe 1 is used to connect a coaxial cable 70 coaxially arranged with a center conductor 72, a dielectric 74, and an outer conductor 76, and has a measuring pin 20 electrically connected to the center conductor 72 of the coaxial cable 70.

[0113] The conductor connection structure 8 described above is characterized by having:

[0114] The conductive outer cover component 10 covers the outer conductor 76 with a gap 16 relative to the outer conductor 76; and

[0115] The conductive external connecting parts 61 and 67 fix and electrically connect the external conductor 76 relative to the external cover component 10.

[0116] The external connection ends 62 and 88 of the external connection portions 61 and 67, which are the ends of the probe 1 at the end side B, are flush with or located at the end side B of the probe 1, relative to the external conductor end 77 of the external conductor 76, which is the end of the probe 1 at the end side B.

[0117] According to the above structure, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the test object 2. Furthermore, "external connection terminals 62 and 88 located at the other end (end side) B from external conductor terminal 77" means that external connection terminals 62 and 88 are located at positions offset from external conductor terminal 77 to the other end (end side) B, or flush with external conductor terminal 77.

[0118] In addition, in one embodiment of the conductor connection structure 8,

[0119] The aforementioned external connection terminals 62 and 88 are located between the dielectric terminal 75 of the dielectric 74, which serves as the end side B of the probe 1, and the aforementioned external conductor terminal 77.

[0120] According to the above embodiments, the short-circuit protection effect of the center conductor 72 and the outer conductor 76 can be improved.

[0121] In addition, in one embodiment of the conductor connection structure 8,

[0122] The aforementioned outer cover component 10 has an external through hole 18 extending along its thickness direction.

[0123] The external conductor end 77 is located closer to the base end A of the probe 1 than the opening end portion 19 formed on the end side B of the probe 1 in the external through hole 18, and is located opposite to the external through hole 18.

[0124] According to the above embodiment, the position of the external conductor end 77 can be confirmed through the external through hole 18, and it can be confirmed whether the external conductor 76 and the external connecting parts 61 and 67 are electrically connected.

[0125] In addition, in one embodiment of the conductor connection structure 8,

[0126] The aforementioned external connection part is solder 61.

[0127] The aforementioned external through hole 18 functions as a solder supply section for supplying the aforementioned solder 61.

[0128] According to the above implementation method, fixing and electrical connection are easy.

[0129] In addition, in one embodiment of the conductor connection structure 8,

[0130] The aforementioned external connection portion 61 is an embedded component 67 that is embedded in the aforementioned gap 16.

[0131] According to the above implementation method, fixing and electrical connection are easy.

[0132] In addition, in one embodiment of the conductor connection structure 8,

[0133] The external conductor end 77 separates from the end side B of the probe 1 relative to the center conductor 72 towards the base side A of the probe 1.

[0134] According to the above embodiments, the short-circuit protection effect of the center conductor 72 and the outer conductor 76 can be improved.

[0135] In addition, in one embodiment of the conductor connection structure 8,

[0136] The object 2 measured by the probe 1 is connector 2.

[0137] According to the above embodiments, the electrical characteristics of connector 2 can be measured with high precision.

[0138] The probe 1 according to another aspect of the present invention is characterized in that,

[0139] It has the conductor connection structure described above 8.

[0140] According to the above structure, the current path does not have a return path, which can suppress unnecessary resonance and thus enable high-precision measurement of the electrical characteristics of the test object 2.

[0141] Another aspect of the present invention relates to a conductor connection structure 7 in a probe 1 extending from the base end side A to the end end side B. This probe 1 is used to connect a coaxial cable 70 that coaxially arranges a center conductor 72, a dielectric 74, and an outer conductor 76, and has a measuring pin 20 electrically connected to the center conductor 72 of the coaxial cable 70.

[0142] The aforementioned conductor connection structure 7 includes:

[0143] A conductive center cover component 50 covers the center conductor 72 with a gap 56 relative to the center conductor 72; and

[0144] The conductive central connection portion 64 fixes and electrically connects the central conductor 72 relative to the central cover component 50.

[0145] The central connection end 65 of the central connection portion 64, which is the end of the base end A of the probe 1, is flush with or located at the base end A of the probe 1, relative to the central cover end 57 of the central cover member 50, which is the end of the probe 1.

[0146] According to the above structure, the current path does not have a return path, thereby suppressing unnecessary resonance and enabling high-precision measurement of the electrical characteristics of the test object 2. Furthermore, "the center connection end 65 is located on the base end side A from the center cover end 57" means that the center connection end 65 is offset from the center cover end 57 towards the base end side A, or is flush with the center cover end 57.

[0147] In addition, in one embodiment of the conductor connection structure 7,

[0148] The aforementioned central connection end 65 is located between the dielectric end 75 of the dielectric 74, which serves as the end side B of the probe 1, and the aforementioned central cover end 57.

[0149] According to the above embodiments, the short-circuit protection effect of the center conductor 72 and the outer conductor 76 can be improved.

[0150] In addition, in one embodiment of the conductor connection structure 7,

[0151] The aforementioned center cover component has a central through hole 58 or a central cutout 59 extending along the thickness direction of the aforementioned center cover component 50.

[0152] The central connecting part 64 is supplied through the central through hole 58 or the central cut 59.

[0153] According to the above embodiment, the supply of the central connecting portion 64 to the gap 56 is easy.

[0154] In addition, in one embodiment of the conductor connection structure 7,

[0155] The aforementioned central connection part 64 is solder 64.

[0156] According to the above implementation method, fixing and electrical connection are easy.

[0157] In addition, in one embodiment of the conductor connection structure 7,

[0158] The outer conductor end 77 of the outer conductor 76, which is the end of the probe 1 at the end side B, separates from the end side B of the probe 1 of the center conductor 72 towards the base end side A of the probe 1.

[0159] According to the above embodiments, the short-circuit protection effect of the center conductor 72 and the outer conductor 76 can be improved.

[0160] In addition, in one embodiment of the conductor connection structure 7,

[0161] The object 2 measured by the probe 1 is connector 2.

[0162] According to the above embodiments, the electrical characteristics of connector 2 can be measured with high precision.

[0163] The probe 1 according to another aspect of the present invention is characterized in that,

[0164] It has the conductor connection structure described above 7.

[0165] According to the above structure, the current path does not have a return path, which can suppress unnecessary resonance and thus enable high-precision measurement of the electrical characteristics of the test object 2.

[0166] Explanation of reference numerals in the attached figures

[0167] 1...Probe; 2...Connector (object to be measured); 3...Connector terminal (terminal to be measured); 7...Center conductor connection structure (conductor connection structure); 8...Outer conductor connection structure (conductor connection structure); 10...Cylinder (outer cover component); 12...Cylinder body; 13...Inner circumferential surface of cylinder; 14...First receiving part; 15...End through hole; 16...Outer gap (gap); 18...Outer through hole (solder supply part); 19...Opening end part; 20...Measuring pin; 22...Measuring end; 24...Connecting end; 30...First bushing; 40...Second bushing; 44...Socket insertion part; 50...Socket (center cover component); 51...Outer circumferential surface of socket; 54...Second receiving part; 56...Center gap (gap); 57...Socket end (center cover end) 58...Center through hole (solder supply part); 59...Center cut (solder supply part); 61...Solder (external connection part, external connection component); 62...External connection end; 64...Solder (center connection part, center connection component); 65...Center connection end; 67...Embedded component (external connection part, external connection component); 68...Abutting end face; 69...Abutting peripheral surface; 70...Coaxial cable; 72...Center conductor; 73...Center conductor end; 74...Dielectric; 75...Dielectric end; 76...External conductor; 77...External conductor end; 78...Sheath; 82...Outer peripheral surface of center conductor; 86...Inner peripheral surface of external conductor; 87...Embedded inner peripheral surface; 88...External connection end; A...Base end side (one end side); B...End side (the other end side).

Claims

1. A conductor connection structure in a probe extending from a base end to an end end, the probe being for connecting a coaxial cable coaxially arranged with a center conductor, a dielectric, and an outer conductor, and having a measuring pin electrically connected to the center conductor of the coaxial cable, wherein, The conductor connection structure includes: A conductive outer cover component, having a gap relative to the outer conductor and covering the outer conductor; and A conductive external connection portion secures and electrically connects the external conductor relative to the external cover component. The end of the probe of the external connection portion, i.e., the external connection end, is flush with the end of the probe of the external conductor, i.e., the external conductor end, or is located at the end of the probe. The outer cover component has an external through hole extending along its thickness direction. The external conductor end is located closer to the base end of the probe than the opening end portion formed on the end side of the probe in the external through hole, and is located opposite to the external through hole.

2. The conductor connection structure according to claim 1, wherein, The external connection end is located at the end of the probe of the dielectric, that is, between the dielectric end and the external conductor end.

3. The conductor connection structure according to claim 1, wherein, The external connection part is solder. The external through hole functions as a solder supply section for supplying the solder.

4. The conductor connection structure according to claim 1, wherein, The external connection part is an embedded component that is embedded in the gap.

5. The conductor connection structure according to claim 1, wherein, The outer conductor end separates from the probe's end side relative to the central conductor, toward the probe's base side.

6. The conductor connection structure according to claim 1, wherein, The object being measured by the probe is a connector.

7. A probe, wherein, The probe has the conductor connection structure described in any one of claims 1 to 6.

8. A conductor connection configuration in a probe extending from a base end to an end end, the probe being used to connect a coaxial cable coaxially arranged with a center conductor, a dielectric, and an outer conductor, and having a measuring pin electrically connected to the center conductor of the coaxial cable, wherein, The conductor connection structure includes: A conductive central cover component, having a gap relative to the central conductor and covering the central conductor; and A conductive central connecting portion fixes and electrically connects the central conductor relative to the central cover component. The end of the probe on the base side of the central connecting portion, i.e., the central connecting end, is flush with or located on the base side of the probe of the central cover component, i.e., the central cover end. The central cover component has a central through hole or central cutout extending along its thickness direction. The central connecting part is supplied through the central through hole or the central cut.

9. The conductor connection structure according to claim 8, wherein, The central connection end is located at the end of the probe of the dielectric, that is, between the dielectric end and the central cover end.

10. The conductor connection structure according to claim 8, wherein, The central connecting part is solder.

11. The conductor connection structure according to claim 8, wherein, The end of the probe on the outer conductor, i.e. the end of the outer conductor, separates from the end of the probe on the center conductor towards the base end of the probe.

12. The conductor connection structure according to claim 8, wherein, The object being measured by the probe is a connector.

13. A probe, wherein, The probe has the conductor connection structure described in any one of claims 8 to 12.

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