温度测量装置及基板处理方法
By combining a thermal conductivity test substrate, a circuit board layer, and a bonding agent, the problem of insufficient accuracy in temperature measurement devices is solved, and the temperature control accuracy of the substrate processing method is improved, making it suitable for temperature measurement of materials with different coefficients of thermal expansion.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SYSTEM ENGINEERING MEGA SOLUTION CO LTD
- Filing Date
- 2022-06-24
- Publication Date
- 2026-07-17
AI Technical Summary
Existing temperature measurement devices and substrate processing methods suffer from insufficient accuracy, making it difficult to accurately measure temperature changes in the substrate.
The system employs a combined structure of a thermal conductivity test substrate, a circuit board layer, a thermally conductive adhesive, and a temperature sensor. Through-hole and air gap design, indirect temperature measurement is achieved, and the adhesive is used to compensate for differences in the coefficient of thermal expansion, thereby improving measurement accuracy.
It improves the accuracy and consistency of temperature measurement, ensures the temperature control effect of the process substrate, and adapts to substrate materials with different coefficients of thermal expansion.
Smart Images
Figure CN115810553B_ABST