Chip mounting apparatus and method of manufacturing semiconductor device

Abstract

The present disclosure provides a chip mounting device and a manufacturing method of a semiconductor device, and provides a technology for self-diagnosis based on log data of inspection results. The chip mounting device includes a coating device that coats paste adhesive onto a substrate, a camera that captures the paste adhesive coated onto the substrate, and a control device that performs appearance inspection based on an image of the paste adhesive captured by the camera. The control device is configured to perform appearance inspection each time the paste adhesive is coated onto the substrate, and record data including a coating area of the paste adhesive calculated from the image and a coating position of the paste adhesive, or data including one of them, as log data in a storage device. The control device judges whether a state of the coated paste adhesive is normal or abnormal based on data acquired at the time of appearance inspection and log data recorded in the storage device before the appearance inspection.

Description

Technical Field

[0001] This disclosure relates to chip mounting apparatus, for example, a chip mounting machine that can be applied to use resin paste as an adhesive. Background Technology

[0002] A chip mounting machine, as a chip mounting apparatus, is an apparatus that uses resin paste, solder, gold plating, etc., as bonding materials to mount (place and bond) semiconductor chips (hereinafter referred to as bare chips) onto a substrate such as a wiring board or lead frame, or onto a previously mounted bare chip. For example, in a chip mounting machine that mounts bare chips onto a substrate surface, the following actions (operations) are repeatedly performed: using a suction nozzle called a collet mounted on the top of the mounting head to pick up and pick up the bare chip from the wafer, placing the bare chip at a predetermined position on the substrate, applying pressure, and heating the bonding material, thereby performing the mounting.

[0003] For example, when resin is used as the bonding material, resin pastes such as Ag (silver) epoxy resin paste and acrylic resin paste are used as adhesives (hereinafter referred to as paste adhesives). The paste adhesive for bonding the bare die to the substrate is sealed in a syringe, which moves up and down relative to the substrate to inject and apply the paste adhesive. That is, a predetermined amount of paste adhesive is applied to a predetermined location using a syringe containing the paste adhesive, and the bare die is pressed and baked onto the paste adhesive to bond it to the paste adhesive. A recognition camera (preform camera) is installed near the syringe. This recognition camera is used to confirm the location of the applied paste adhesive for positioning and to confirm whether the applied paste adhesive is applied in a predetermined shape and at a predetermined location in a predetermined amount.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2021-44466 Summary of the Invention

[0007] An error occurred and the device stopped when an abnormality was detected during the visual inspection of the paste adhesive. However, the inspection results were not recorded in the log.

[0008] The subject of this disclosure is to provide a technique for self-diagnosis based on log data of inspection results. Other issues and novel features will become clear from the description and accompanying drawings in this specification.

[0009] If we were to simply summarize the representative schemes in this disclosure, it would be as follows.

[0010] That is, the chip mounting apparatus includes: a coating device that applies a paste adhesive to a substrate; an imaging device that captures images of the paste adhesive applied to the substrate; and a control device that performs an appearance inspection based on the image of the paste adhesive captured by the imaging device. The control device is configured to perform an appearance inspection each time the paste adhesive is applied to the substrate, and to record data, including the coating area and coating position of the paste adhesive calculated from the image, or data including either the coating area or the coating position, as log data in a storage device. Based on the data acquired during the appearance inspection and the log data recorded in the storage device before the appearance inspection, the control device determines whether the applied paste adhesive is in a normal or abnormal state.

[0011] Invention Effects

[0012] Based on the chip mounting device described above, self-diagnosis can be performed based on log data of the inspection results. Attached Figure Description

[0013] Figure 1 This is a schematic top view showing the chip mounting machine in the embodiment.

[0014] Figure 2 Is Figure 1 The diagram illustrates the actions of the pickup head and the mounting head when viewed from the direction of arrow A.

[0015] Figure 3 It means Figure 1 A schematic cross-sectional view of the main part of the bare chip supply section shown.

[0016] Figure 4 It means Figure 1 The diagram shown is a schematic representation of the control system of a chip mounting machine.

[0017] Figure 5 It means that it was used. Figure 1 The flowchart shown is a process for manufacturing semiconductor devices using a chip mounting machine.

[0018] Figure 6 This is a block diagram illustrating an example of the structure of the pre-processing section.

[0019] Figure 7 This is a top view showing an example of the substrate configuration in the embodiment.

[0020] Figure 8 This is a flowchart illustrating the application process of a paste-like adhesive.

[0021] Figure 9 This is a graph showing an example of log data during the application and inspection of a paste-like adhesive.

[0022] Figure 10This is a graph showing an example of log data from a pre-application inspection of a paste adhesive.

[0023] Figure 11 This is a top view showing the condition of the paste adhesive during the application and inspection.

[0024] Figure 12 This is a top view showing the condition of the paste adhesive during pre-application inspection.

[0025] Figure 13 This is a graph showing the progression of the number of coats and the area covered.

[0026] Figure 14 This is a graph representing examples of anomalies in inspection results and log data based on the coating area.

[0027] Figure 15 It is a graph showing the progression of the number of applications and the application location Y.

[0028] Figure 16 This is a diagram illustrating examples of abnormal causes in inspection results based on the coating location and coating area.

[0029] Figure 17 It is a graph showing the progression of coating times and coating area, as well as the correction of the spray pressure setting.

[0030] Figure 18 It is a graph showing the progression of coating times and coating area, as well as the correction of the spray pressure setting.

[0031] Explanation of reference numerals in the attached figures

[0032] 8: Control unit, 10: Chip placement machine (chip placement device), 41: Placement head, 94: Pre-processing camera (first shooting device), D: Bare chip, FS: Pre-processing stage (first stage), S: Substrate. Detailed Implementation

[0033] The embodiments will now be described using the accompanying drawings. However, in the following description, the same reference numerals will sometimes be used to refer to the same constituent elements and repeated descriptions will be omitted. Furthermore, in order to make the description clearer, there are instances where the width, thickness, shape, etc. of each part are schematically shown in the drawings compared to the actual form, but these are always just examples and are not intended to limit the interpretation of this disclosure.

[0034] use Figure 1 and Figure 2 The structure of the chip mounting machine in the embodiment will be described. Figure 1 This is a schematic top view showing the chip mounting machine in the embodiment. Figure 2 Is Figure 1The diagram illustrates the actions of the pickup head and the mounting head when viewed from the direction of arrow A.

[0035] The chip placement machine 10 generally includes a bare chip supply unit 1 for supplying bare chips D to be mounted on a substrate S, a pick-up unit 2, an intermediate stage unit 3, a pre-processing unit 9, a placement unit 4, a transport unit 5, a substrate supply unit 6, a substrate removal unit 7, and a control unit 8 for monitoring and controlling the operation of each part. The Y-axis direction is the front-to-back direction of the chip placement machine 10, and the X-axis direction is the left-to-right direction. The bare chip supply unit 1 is located near the front of the chip placement machine 10, and the placement unit 4 is located on the inner side. Multiple product areas (hereinafter referred to as attachment areas P) are formed on the substrate S to ultimately form a package. For example, if the substrate S is a lead frame, the attachment area P has tabs for mounting the bare chips D.

[0036] First, the bare die supply unit 1 supplies a bare die D mounted to the attachment area P of the substrate S. The bare die supply unit 1 includes a wafer holding stage 12 that holds a wafer 11, and a stripping unit 13 (shown in dashed lines) that lifts the bare die D from the wafer 11. The bare die supply unit 1 moves in the XY axis direction using a drive mechanism (not shown) to move the bare die D to be picked up to the position of the stripping unit 13.

[0037] The pickup unit 2 includes a pickup head 21, a Y-drive unit 23, various drive units (not shown) for raising, rotating, and moving the collet 22 in the X-axis direction, and a chip recognition camera 24. The pickup head 21 has a collet 22 that holds the raised bare chip D at its top, picks up the bare chip D from the bare chip supply unit 1, and places it on the intermediate stage 31. The Y-drive unit 23 moves the pickup head 21 in the Y-axis direction. The chip recognition camera 24 determines the pickup position of the bare chip D picked up from the chip 11.

[0038] The intermediate stage 3 includes: an intermediate stage 31 for temporarily mounting the bare chip D; and a stage recognition camera 32 for recognizing the bare chip D on the intermediate stage 31.

[0039] The pre-processing unit 9 includes a syringe 91, a drive unit 93, a pre-processing camera 94 serving as an imaging device (first imaging device), and a pre-processing stage FS. The syringe 91 applies a paste-like adhesive to the substrate S, which is conveyed to the pre-processing stage FS by the transport unit 5. The drive unit 93 moves the syringe 91 in the X-axis direction, Y-axis direction, and vertical direction. The pre-processing camera 94 controls the application position of the syringe 91. The pre-processing stage FS rises while applying the paste-like adhesive to the substrate S, supporting the substrate S from below. The pre-processing stage FS has suction holes (not shown) for vacuum suction of the substrate S, enabling it to hold the substrate S in place.

[0040] The mounting section 4 includes a mounting head 41, a Y-drive unit 43, a substrate recognition camera 44 serving as a second imaging device, and a mounting stage BS. The mounting head 41, like the pick-up head 21, has a collet 42 that holds the bare die D at its top. The Y-drive unit 43 moves the mounting head 41 in the Y-axis direction. The substrate recognition camera 44 captures images of the position recognition mark (not shown) of the mounting area P on the substrate S, identifying the mounting position. The mounting stage BS rises as the bare die D is placed onto the substrate S, supporting the substrate S from below. The mounting stage BS has suction holes (not shown) for vacuum suction of the substrate S, enabling it to hold the substrate S in place. With this structure, the mounting head 41 corrects its pick-up position and posture based on the imaging data from the stage recognition camera 32, picking up the bare die D from the intermediate stage 31. Furthermore, the mounting head 41 mounts the bare die D onto the mounting area P of the transported substrate S, which is coated with a paste adhesive, based on the imaging data from the substrate recognition camera 44.

[0041] The transfer section 5 includes: a substrate transfer claw 51 for gripping and transferring a substrate S; and a transfer channel 52 serving as a transfer path for moving the substrate S. The substrate S is moved by driving a nut (not shown) of the substrate transfer claw 51 provided in the transfer channel 52 using a ball screw (not shown) provided along the transfer channel 52. With this structure, the substrate S moves along the transfer channel 52 from the substrate supply section 6 to the mounting position, and after mounting, moves to the substrate removal section 7 for transfer to the substrate removal section 7.

[0042] Next, use Figure 3 The structure of the bare chip supply unit 1 will be explained. Figure 3 It means Figure 1 A schematic cross-sectional view of the main part of the bare chip supply section shown.

[0043] The bare die supply unit 1 includes a wafer holding stage 12 that moves in the horizontal direction (XY direction) and a stripping unit 13 that moves in the vertical direction. The wafer holding stage 12 includes an extension ring 15 that holds a wafer ring 14 and a support ring 17 that horizontally positions a dicing tape 16 fixed to the wafer ring 14. The bare die D, which has been cut into a mesh shape in the wafer 11, is bonded and fixed to the dicing tape 16. The stripping unit 13 is disposed inside the support ring 17.

[0044] When the bare die D is lifted, the bare die supply unit 1 lowers the extension ring 15 that holds the wafer ring 14. As a result, the dicing strip 16 held in the wafer ring 14 is stretched and the spacing of the bare dies D increases. The pickability of the bare die D is improved by using the stripping unit 13 to lift the dicing strip 16 from below the bare die D or to move the dicing strip 16 horizontally.

[0045] use Figure 4 The control system of the chip mounting machine 10 is described. Figure 4It means Figure 1 The diagram shown is a schematic representation of the control system of a chip mounting machine.

[0046] like Figure 4 As shown, the control system 80 includes a control unit 8, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 8 is generally divided into a control and arithmetic unit 81 composed of a CPU (Central Processing Unit), a storage unit 82, an input / output unit 83, a bus 84, and a power supply unit 85. The storage unit 82 includes: a main storage unit 82a, which is composed of RAM (Random Access Memory) storing processing programs, etc.; and an auxiliary storage unit 82b, which is composed of HDD (Hard Disk Drive) storing control data, image data, etc., required for control. The input / output unit 83 includes: a monitor 83a, which displays device status, information, etc.; a touch panel 83b, which is used to input operator instructions; a mouse 83c, which is used to operate the monitor; and an image acquisition device 83d, which acquires image data from the optical system 88. Additionally, the input / output device 83 includes: a motor control device 83e, which controls the drive units 86 and 93 of the XY stage (not shown) of the bare die supply unit 1, the ZY drive axis of the placement head stage, etc.; and an I / O signal control device 83f, which receives or controls various sensor signals and receives or controls signals from signal units 87 such as switches of lighting devices, etc. The optical system 88 includes... Figure 1 or Figure 2 The chip recognition camera 24, pre-processing camera 94, stage recognition camera 32, and substrate recognition camera 44 are shown. The control and processing unit 81 acquires the required data via the bus 84 and performs calculations to control the mounting head 41, etc., and sends information to the monitor 83a, etc.

[0047] The control unit 8 saves the image data captured by the optical system 88 to the storage device 82 using the image acquisition device 83d. Based on the saved image data and using programmed software, the control calculation unit 81 performs positioning of the bare chip D and the substrate S, inspection of the paste adhesive application pattern, and surface inspection of the bare chip D and the substrate S. Based on the calculated positions of the bare chip D and the substrate S, the control calculation unit 81 uses software to move the drive unit 86 via the motor control device 83e. According to this process, the bare chip D on the wafer 11 is positioned, and the bare chip D is mounted onto the substrate S by moving the drive units of the bare chip supply unit 1 and the mounting unit 4. The recognition camera used in the optical system 88 is a grayscale camera, a color camera, etc., which quantifies brightness (light intensity) and color.

[0048] Next, use Figure 5 A method for manufacturing semiconductor devices using the chip mounting machine described in the embodiment will be explained. Figure 5 It means that it was used. Figure 1 The flowchart shown is a process for manufacturing semiconductor devices using a chip mounting machine.

[0049] (Step S51: Wafer / Substrate Handling Process)

[0050] The wafer ring 14, with the dicing tape 16 attached, is placed in a wafer cassette (not shown) and fed into the die mounter 10. The dicing tape 16 holds the bare dies D diced from the wafer 11. The control unit 8 supplies the wafer ring 14 from the wafer cassette containing the wafer ring 14 to the bare die supply unit 1. Additionally, a substrate S is prepared and fed into the die mounter 10. The control unit 8 uses the substrate supply unit 6 to mount the substrate S onto the substrate transport claw 51.

[0051] (Step S52: Pick-up process)

[0052] The control unit 8 uses the wafer holding stage 12 to move the wafer ring 14 so that the desired bare chip D can be picked up from the wafer ring 14, and performs positioning and surface inspection based on data captured by the wafer recognition camera 24. The control unit 8 uses the peeling unit 13 to peel the positioned bare chip D from the dicing tape 16. In parallel, the control unit 8 lowers the pick-up head 21 to directly above the bare chip D to be picked up, and uses the clamp 22 of the pick-up head 21 to vacuum-adsorb the bare chip D peeled from the dicing tape 16. Then, the control unit 8 causes the pick-up head 21 to perform an upward movement, a parallel movement, and a downward movement to place the bare chip D at a predetermined position on the intermediate stage 31. At this time, the control unit 8 uses the suction holes (not shown) of the intermediate stage 31 to adsorb the bare chip D and separate it from the pick-up head 21. In this way, the bare chip D peeled from the dicing tape 16 is adsorbed, held in the clamp 22, and transported and placed on the intermediate stage 31.

[0053] The control unit 8 uses the stage recognition camera 32 to capture images of the bare chip D on the intermediate stage 31, positions the bare chip D, and performs surface inspection. The control unit 8 uses image processing to calculate the offset (X, Y, θ directions) of the bare chip D on the intermediate stage 31 relative to the bare chip position reference point of the chip placement machine. Furthermore, the predetermined position of the intermediate stage 31 is maintained as the initial setting of the device for the bare chip position reference point. The control unit 8 then performs surface inspection of the bare chip D using image processing.

[0054] Furthermore, the control unit 8 returns the pick-up head 21, which has already transported the bare chip D to the intermediate stage 31, to the bare chip supply unit 1. Following the above sequence, the next bare chip D is peeled off from the dicing tape 16, and thereafter, the bare chips D are peeled off from the dicing tape 16 one by one in the same sequence.

[0055] (Step S53: Mounting process)

[0056] The control unit 8 uses the transfer unit 5 to transfer the substrate S to the pre-processing stage FS. The control unit 8 uses the pre-processing camera 94 to acquire an image of the surface of the substrate S before coating to confirm the surface where the paste adhesive should be applied. If there are no problems with the surface to be coated, the control unit 8 confirms and positions the substrate S supported by the pre-processing stage FS at the position where the paste adhesive should be applied. Positioning is performed using pattern matching, etc., similar to the mounting head. The paste adhesive is applied from the syringe 91. The control unit 8 ejects the paste adhesive from the nozzle at the tip of the syringe 91 and applies it according to the trajectory of the nozzle. The control unit 8 uses the drive unit 93 to drive the syringe 91 along the XYZ axis in the shape to be applied, and applies (draws / paints) the paste adhesive by drawing a free trajectory such as an × mark shape or a cross shape according to its trajectory. After application, the control unit 8 uses the pre-processing camera 94 to confirm again whether the paste adhesive has been applied accurately and to check the applied paste adhesive. In other words, the visual inspection confirms whether the applied paste adhesive has been applied in the prescribed shape and at the prescribed location in the prescribed amount. Inspection items include, for example, the presence or absence of the paste adhesive, the applied area, and the shape of the application (insufficient or excessive). The inspection is performed not only by calculating the number of pixels after separating the paste adhesive area through binarization processing, but also by methods such as difference-based comparison and comparison of scores based on pattern matching.

[0057] If the coating process is successful, the control unit 8 uses the transport unit 5 to transport the substrate S to the placement stage BS. Then, the control unit 8 uses the substrate recognition camera 44 to photograph the substrate S placed on the placement stage BS. The control unit 8 uses image processing to calculate the offset (X, Y, θ directions) of the substrate S relative to the substrate position reference point of the chip placement machine. Furthermore, the predetermined position of the substrate inspection unit is pre-set as the initial setting of the device for the substrate position reference point. The control unit 8 can also inspect the applied paste adhesive based on the image data captured by the substrate recognition camera 44.

[0058] The control unit 8 corrects the adsorption position of the mounting head 41 based on the offset of the bare chip D calculated in step S52, and uses the clamp 42 to adsorb the bare chip D. The mounting head 41, with the bare chip D adsorbed, rises from the intermediate stage 31, moves horizontally, and descends to place the bare chip D onto a predetermined position on the substrate S supported on the mounting stage BS. Then, the control unit 8 checks whether the bare chip D has been placed in the desired position based on image data captured by the substrate recognition camera 44.

[0059] (Step S54: Substrate removal process)

[0060] The control unit 8 transports the substrate S with the bare chip D mounted on it to the substrate removal unit 7. The control unit 8 uses the substrate removal unit 7 to remove the substrate S with the bare chip D mounted on it from the substrate transport claw 51. The substrate S is then removed from the chip mounting machine 10.

[0061] As described above, the bare die D is mounted on the substrate S and sent out from the die mounter. Then, in the wire bonding process, it is electrically connected to the electrodes of the substrate S using Au wires or the like. Afterwards, the substrate S is transported to the molding process, where the bare die D and the Au wires are sealed with molding resin (not shown), thus completing the encapsulation.

[0062] use Figure 6 The application of the paste adhesive in the pre-processing section is explained. Figure 6 This is a block diagram illustrating an example of the structure of the pre-processing section.

[0063] like Figure 6 As shown, the pre-processing unit 9 includes a syringe 91, a drive unit 93, a pre-processing camera 94, a syringe holder 95, a dispenser 96, a pipe 97 for supplying air pressure, and a pre-processing stage FS. The syringe 91, drive unit 93, syringe holder 95, dispenser 96, and pipe 97 constitute a coating device.

[0064] When applying a paste adhesive to the substrate S, the paste adhesive is pre-placed in a syringe 91 with a coating nozzle 92 at the top of the lower part. Pressurized gas, such as air, is supplied from the upper part of the syringe 91 at constant intervals by a gas pulse dispenser 96, causing a predetermined amount of paste adhesive to be sprayed out. During coating, with the coating nozzle 92 close to the substrate, the syringe 91 performs a two-dimensional one-stroke scanning (drawing action) in the XY plane (generally starting from the center and returning to the center).

[0065] The distributor 96 includes: a compressed air supply port 96a connected to a positive pressure source; a vacuum exhaust port 96b connected to a negative pressure source; an exhaust port 96c for venting the compressed air supplied to the syringe; and an air control output port 96d.

[0066] The operation of the distributor 96 is explained. Compressed air introduced from the compressed air supply port 96a is adjusted to the appropriate pressure by the ejection regulator (not shown) and delivered from the air control output port 96d via a valve unit (not shown). A pressure sensor 96e for monitoring the output is located inside the air control output port 96d. Compressed air supplied to the syringe 91 is forcibly vented from the exhaust port 96c via the valve unit (not shown). Additionally, when not ejecting, a slight vacuum is required to prevent liquid dripping due to the weight of the paste adhesive. For this vacuum, the compressed air from the compressed air supply port 96a is adjusted to the appropriate pressure (negative pressure) by a vacuum regulator (not shown) and discharged from the vacuum exhaust port 96b. This negative pressure is controlled by the valve unit (not shown) and connected to the air control output port 96d.

[0067] The spraying process of the paste adhesive is described. The paste adhesive is contained in the syringe 91. Initially, according to the instruction of the control unit 8, the drive unit 93 lowers the syringe holder 95, thereby lowering the tip of the coating nozzle 92 from a relatively high position and reaching a position at a predetermined height (nozzle height (Hn)) above the upper surface of the substrate S at the start of spraying. The nozzle height (Hn) is, for example, 100 to 200 μm. Here, if compressed air is supplied from the dispenser 96 via the piping 97 according to the instruction of the control unit 8, the air pressure in the syringe 91 rises rapidly, and spraying gradually begins. Simultaneously, the painting operation begins. That is, specifically, according to the instruction of the control unit 8, the drive unit 93 moves the syringe holder 95, thereby moving the coating nozzle 92 horizontally in two dimensions. The coating nozzle 92 generally returns to the starting position, at which point the painting operation ends. Simultaneously, if the supply of compressed air from the dispenser 96 is stopped according to the instruction of the control unit 8, the air pressure in the syringe 91 drops rapidly, the spray gradually weakens and stops. Approximately simultaneously with the stop, the drive unit 93 raises the coating nozzle 92 according to the instruction of the control unit 8.

[0068] use Figure 8 The application process for paste adhesives is explained. Figure 8 This is a flowchart illustrating the application process of a paste-like adhesive.

[0069] (Application: Step S1)

[0070] First, use Figure 7 Instructions are provided on the application of paste adhesives. Figure 7 This is a top view showing an example of the substrate configuration in the embodiment.

[0071] The control unit 8 applies a paste adhesive downwards using a syringe 91, starting from the first row of the first column on the upper right of the substrate S, where the attachment areas P are arranged in a grid pattern. Then, after applying the paste adhesive to the fourth row of the first column on the lower right, the control unit 8 applies the paste adhesive PA downwards from the top position (first row) of the second column from the right. The control unit 8 then applies the paste adhesive to the third, fourth, ..., and eighth columns in the same manner.

[0072] (Visual inspection: Step S2)

[0073] Next, use Figure 7 The visual inspection of the paste adhesive is explained. Each time the control unit 8 applies paste adhesive to an attachment area P of the substrate S, it uses a pre-processing camera 94 to capture an image of the applied paste adhesive and performs a visual inspection based on the captured image. That is, the control unit 8 performs the above-mentioned visual inspection after applying paste adhesive to each row number within a column number unit of the substrate S.

[0074] (Saving the inspection results: Step S3)

[0075] Next, use Figures 9-12 Instructions are provided on how to preserve the results of inspections such as visual inspections. Figure 9 This is a graph showing an example of log data during the application and inspection of a paste-like adhesive. Figure 10 This is a graph showing an example of log data from a pre-application inspection of a paste adhesive. Figure 11 This is a top view showing the condition of the paste adhesive during the application and inspection. Figure 12 This is a top view showing the condition of the paste adhesive during pre-application inspection.

[0076] (a) Pre-processing department

[0077] Control Department 8 Figure 9 The inspection results (measured values) and set conditions based on the images captured by the pre-processed camera 94, along with the date and time when the paste adhesive was applied according to the column number (column No.) and row number (row No.), are stored as log data in the storage device 82.

[0078] The stored inspection results include the X-coordinate (coating position X) and Y-coordinate (coating position Y) of the application location (centroid position of the area) of the paste adhesive, the area of ​​the paste adhesive (coating area), and the application width of the paste adhesive at the first location (coating width 1) and the application width at the second location (coating width 2). Additionally, the stored inspection results include the X-coordinate (substrate identification position X) and Y-coordinate (substrate identification position Y) of the identification position of the substrate S before the application of the paste adhesive. The inspection results for the application location and area of ​​the paste adhesive can also be stored for only one of them.

[0079] Control unit 8 uses pre-processed camera 94 to capture images. Figure 11 The above-mentioned inspection results are calculated by image processing using the applied paste adhesive PA or substrate S as shown. The application position of the paste adhesive PA is the centroid position (C) of the pixel, the application area (CA) of the paste adhesive PA is the number of pixels, and the application width 1 (W1) and application width 2 (W2) are the number of pixels.

[0080] Furthermore, the stored settings include the application conditions of the paste adhesive, such as nozzle height, spray pressure, and spray time. Other stored measurements include spray pressure measurement, spray time measurement, actual operating time of the drive unit 93's worktable, an image of the paste adhesive PA at the time of registration, and an image of the paste adhesive PA when an abnormality occurs. "At the time of registration" refers to the time when production begins after adjustments before device operation are completed and the paste adhesive application state is within the standard range or equal to the target value. The standard range refers to the application amount being within the specified range, or the paste adhesive overflow, thickness, or shape relative to the bare chip meeting the process standards during chip mounting. Additionally, the spray pressure is measured based on the pressure signal (PRS) output from the dispenser 96. The spray time is measured by measuring the spray signal (DSC) output from the dispenser 96.

[0081] (b) Mounting Department

[0082] like Figure 10 As shown, the control unit 8 stores the inspection results (measured values) based on the images captured by the substrate recognition camera 44, along with the pre-placement inspection date and time, as log data in the storage device 82 according to the column and row numbers. Here, "pre-placement" refers to the period before the substrate S, coated with a paste adhesive, is transferred from the pre-processing stage FS to the placement stage BS, and before the bare chip D is placed.

[0083] The stored inspection results are captured by the substrate recognition camera 44 and calculated through image processing. These results include the area of ​​the paste adhesive PB before mounting (coating area before mounting), the width of the paste adhesive PB at the first position (coating width 1 before mounting), and the coating width at the second position (coating width 2 before mounting).

[0084] The control unit 8 uses the board to recognize the camera 44 to capture images. Figure 12 The applied paste adhesive PB, as shown, was used to calculate the above inspection results through image processing. The pre-mount coating area (CAB) is in pixels, and the pre-mount coating width 1 (WB1) and pre-mount coating width 2 (WB2) are also in pixels. Sometimes the pre-mount coating area (CAB), pre-mount coating width 1 (WB1), and pre-mount coating width 2 (WB2) are more than... Figure 9 The coating area (CA), coating width 1 (W1), and coating width 2 (W2) shown are large. This is because, in the case of a substrate that has undergone pear-like surface treatment or a paste adhesive with low viscosity, the paste adhesive expands over time.

[0085] (Exception detection: Step S4)

[0086] The control unit 8 determines that the coating area is abnormal if the coating area exceeds the upper limit (CAmax) or falls below the lower limit (CAmin). Similarly, the control unit 8 determines that the coating position is abnormal if the coating location exceeds the upper limit (CPmax) or falls below the lower limit (CPmin).

[0087] (Self-diagnosis: Step S5)

[0088] Control Unit 8 performs self-diagnosis based on log data.

[0089] First, the control unit 8 compares the inspection data during the visual inspection with the log data obtained before the visual inspection (compared to the visual inspection) to grasp the trend and determine the type of abnormality.

[0090] (a) Coating area

[0091] use Figure 13 An explanation of anomaly detection for log data based on coating area is provided. Figure 13 This is a graph showing the progression of the number of coats and the area covered.

[0092] Figure 13This is a graph showing the number of times the paste adhesive was applied for each row on the horizontal axis and the area covered on the vertical axis. With continuous use, the area covered gradually decreases due to the head difference of the paste adhesive within syringe 91. Additionally, the area covered gradually decreases due to viscosity changes caused by the viscosity of the paste adhesive over time. In these cases, the area covered changes approximately the same along the straight line ML shown as a dashed line in the diagram (the amount of change in the area is approximately the same). Here, the straight line ML is an approximate straight line calculated using the least squares method based on log data recorded up to the time the anomaly occurred. "Approximately the same" means changing between the upper limit UL of the specified range, represented by a straight line parallel to the dashed line ML, and the lower limit LL of the specified range, also represented by a straight line parallel to the dashed line ML.

[0093] If the coated area exceeds the upper limit of the specified range (UL) and also exceeds the upper limit of the coated area (CAmax), or if the coated area is lower than the lower limit of the specified range (LL) and also lower than the lower limit of the coated area (CAmin), the control unit 8 determines it as a sudden anomaly (ERR1). If the coated area is below the upper limit of the specified range (UL), above the lower limit of the specified range (LL), and exceeds the upper limit of the coated area (CAmax) or is lower than the lower limit of the coated area (CAmin), the control unit 8 determines it as an anomaly caused by changes over time (ERR2).

[0094] An anomaly was detected when the area covered by the 11th coat was below the lower limit of the coverage area (CAmin). Since it was below the lower limit of the specified range (LL), this was a sudden anomaly (ERR1). An anomaly was also detected when the area covered by the 33rd coat was below the lower limit of the coverage area (CAmin). However, since the area covered by the 33rd coat was below the upper limit of the specified range (UL) and above the lower limit of the specified range (LL), this was an anomaly caused by a change over time (ERR2). The upper limit of the coverage area (CAmax) is 495 pixels, and the lower limit (CAmin) is 465 pixels. Here, "pixel" represents the number of pixels.

[0095] By using such log data, it is possible to distinguish between anomalies (ERR2) where the coating area gradually exceeds the lower limit (CAmin) and anomalies (ERR1) where the coating area suddenly exceeds the lower limit (CAmin).

[0096] (Sudden anomaly)

[0097] If the control unit 8 determines that an anomaly is sudden, for example, it will infer the cause of the anomaly based on a matrix table generated from log data and inspection results (described later). If the control unit 8 determines that the anomaly is caused by a malfunction of the coating device, it will issue a warning confirming the difference between the set spray pressure and the measured spray pressure, and the difference between the set spray time and the measured spray time. If the control unit 8 determines that the anomaly is caused by other anomalies, it will issue a warning confirming the presence of air bubbles after the replacement of the paste adhesive (paste adhesive replacement operation history).

[0098] use Figure 14 The method for inferring the cause of anomalies based on log data and inspection results is explained. Figure 14 This is a graph representing examples of anomalies in inspection results and log data based on the coating area.

[0099] Figure 14 It is a matrix table obtained by comparing the measured data and set data when the abnormality (error) occurs with the log data before the abnormality occurred. The control unit 8 infers the cause of the abnormality based on this table.

[0100] For example, such as Figure 14 As shown in lines four through six, the control unit 8 compares the set spray pressure, set spray time, or set nozzle height at the time the coating area is measured when an anomaly occurs with the set spray pressure, set spray time, or set nozzle height in the log data. Furthermore, if the results differ significantly (show changes), the control unit 8 determines that the setting is incorrect (an error caused by a change in setting). Additionally, as... Figure 14 As shown in the first or second line, if the log data is the same as the settings when the anomaly occurred (without change), the control unit 8 determines that the anomaly is due to the distributor 96, a component of the piping 97, or a malfunction of the syringe 91. The malfunction of the component of the piping 97 or the syringe 91 could be, for example, a blockage or leakage.

[0101] like Figure 14 As shown in the third line, when the measured ejection time differs significantly from that in the log data, the depiction time changes, and the control unit 8 determines that the drive unit 93 has a control abnormality. Alternatively, instead of measuring the ejection time, the control unit 93's XY axis movement time can be measured; if this movement time changes, the control unit 93 is determined to have an abnormality.

[0102] Furthermore, although not illustrated, it is also possible that if the measured spraying time changes significantly relative to the set spraying time, it could be determined as an anomaly of the dispenser 96. Moreover, it is also possible to further determine the cause by comparing the image of the paste adhesive saved during the aforementioned registration with the image of the paste adhesive saved when the anomaly occurred.

[0103] (Abnormalities caused by changes over time)

[0104] If the control unit 8 determines that an abnormality is caused by changes over time, it will issue a warning regarding low remaining amount of the paste adhesive or changes in the viscosity of the paste adhesive. The following explains the determination of viscosity changes (deterioration) of the paste adhesive.

[0105] Based on the difference between the coating width (coating width 1, coating width 2) of the paste adhesive obtained by the pre-processing camera 94 and the coating width (pre-mount coating width 1, pre-mount coating width 2) of the paste adhesive obtained by the substrate recognition camera 44, and the data of transport time (comparison of data for the same transport time), the deterioration (viscosity change) of the paste adhesive can be grasped. If the coating width of the paste adhesive is the same in the recognition performed by the pre-processing camera 94, but the coating width of the paste adhesive is different in the recognition performed by the substrate recognition camera 44 (data for the same transport time), then the viscosity change of the paste adhesive can be conceived.

[0106] For example, comparison Figure 11 The coating widths (W1, W2) shown are... Figure 12 The pre-mount coating widths (WB1, WB2) are shown. Furthermore, if the rate of change (WB1 / W1, WB2 / W2) significantly differs from the rate of change calculated based on the coating width and the pre-mount coating width recorded as log data, it is considered a deterioration of the paste adhesive. Specifically, log data where the difference between the application time of the paste adhesive and the inspection time before mounting is equal is used for comparison.

[0107] Furthermore, when it is difficult to measure the coating width of a paste adhesive due to its application pattern, the coating area (CA) and the pre-mount coating area (CAB) are compared. If the rate of change (CAB / CA) significantly differs from the rate of change calculated based on log data, it is considered a deterioration of the paste adhesive.

[0108] (b) Application location

[0109] use Figure 15 An explanation of anomaly detection in log data based on coating location is provided. Figure 15 It is a graph showing the progression of the number of applications and the application location Y.

[0110] Figure 15This is a graph showing the number of coatings applied for each row on the horizontal axis and the coating location Y on the vertical axis. The coating location Y varies approximately the same along the straight line ML, represented by the dashed line shown in the figure. The straight line ML is an approximate straight line calculated using least squares based on log data recorded up to the point of an anomaly. "Variates the same" means it varies between the upper limit UL of the specified range, represented by the dashed line parallel to the straight line ML, and the lower limit LL of the specified range, also represented by the dashed line parallel to the straight line ML.

[0111] If the coating location exceeds the upper limit (UL) of the specified range and also exceeds the upper limit (CPmax) of the coating location, or if the coating location is below the lower limit (LL) of the specified range and also below the lower limit (CPmin) of the coating location, the control unit 8 determines it as a sudden anomaly (ERR1). If the coating location is below the upper limit (UL) of the specified range, above the lower limit (LL) of the specified range, and exceeds the upper limit (CPmax) of the coating location or is below the lower limit (CPmin) of the coating location, the control unit 8 determines it as an anomaly caused by changes over time (ERR2).

[0112] An anomaly exists because the application position Y at the 11th application is below the lower limit (CPmin) of the application position Y. Since the application position Y at the 11th application is below the lower limit (LL) of the specified range, this is a sudden anomaly (ERR1). An anomaly also exists because the application position Y at the 33rd application is below the upper limit (UL) and above the lower limit (LL) of the specified range. This anomaly is caused by a change over time (ERR2). The upper limit (CPmax) of the application position is 755 pixels, and the lower limit (CPmin) is -75 pixels.

[0113] If the control unit 8 determines that the abnormality is sudden, it will identify the cause of the abnormality as a sudden change in position caused by loose parts, and issue a warning.

[0114] If the control unit 8 determines that the abnormality is caused by changes over time, it will issue a warning that the coating position has changed due to the elongation caused by the continuous operation of the worktable of the drive unit 93.

[0115] Based on the difference between the identification positions (substrate identification position X, substrate identification position Y) of the substrate S before the application of the paste adhesive and the application positions (application position X, application position Y) after application, an abnormality in the worktable of the drive unit 93 or the substrate transport mechanism of the transport unit 5 can be determined. If the position of the substrate S is normal but the application position is deviated, it can be determined that the operation of the worktable of the drive unit 93 is abnormal.

[0116] In addition, using Figure 16 This describes a method for inferring the cause of anomalies by examining the presence or absence of abnormalities in the coating area. Figure 16 This is a diagram illustrating examples of abnormal causes in inspection results based on the coating location and coating area.

[0117] like Figure 16 As shown, if the coating area inspection result is normal, but the coating position X or coating position Y changes significantly, it is determined that the fixed position of the syringe 91 has changed or the worktable of the drive unit 93 is faulty. If the coating area inspection result is abnormal and the coating position X or coating position Y changes significantly, the cause of the coating area error is identified.

[0118] (Correction: Step S6)

[0119] use Figure 17 This describes a method for correcting setpoints based on log data of the coating area. Figure 17 It is a graph showing the progression of coating times and coating area, as well as the adjustment of the spray pressure setting.

[0120] This can be achieved by comparing the current coating area data with log data, and if the coating area data changes similarly, by adjusting (increasing or decreasing) the spray pressure or spray time settings to maintain the specified coating area in a manner that makes the change in the measured coating area close to zero. Specifically, for example, it can be done as follows.

[0121] Let N be the number of samples for the correction calculation. The figure shows the case where N=8.

[0122] If N samples are obtained, the approximate straight line shown by the dashed line in the graph is calculated using the least squares method based on these N samples, and the slope (A) of the approximate straight line is calculated.

[0123] The settings for ejection pressure, ejection time, etc., are adjusted based on the slope (A). When the slope (A) exceeds the upper limit (A > Amax), the ejection pressure or ejection time is decreased; when the slope (A) is below the lower limit (A < Amin), the ejection pressure or ejection time is increased. Here, Amax is the upper limit of the slope (A), and Amin is the lower limit of the slope (A). In the case shown in the graph, where A < Amin, the ejection pressure is increased, thus increasing the slope (A) of the approximate straight line represented by the solid line in the graph.

[0124] The correction of the setpoint based on the log data of the coating location is performed in the same way as the correction of the setpoint based on the log data of the coating area. By comparing the current coating location data, under the same change, the coating location setting is changed in a way that makes the measured change in coating location close to 0, thereby maintaining the specified coating location.

[0125] use Figure 18 This section describes other methods for adjusting settings based on log data of the coating area. Figure 18 It is a graph showing the progression of coating times and coating area, as well as the adjustment of the spray pressure setting.

[0126] By comparing the current coating area data with the existing data, and under the same change conditions, a correction threshold is set inside the upper and lower limits. If the correction threshold is exceeded, the setting of the spray pressure or spray time is changed to maintain the specified coating area.

[0127] The method for correcting settings based on log data of the coating area involves adjusting the spray pressure or spray time to ensure that the deviation between the measured coating area (MCA) and the registered coating area (RCA) is within a reference range. At this time, different from the upper limit (CAmax) and lower limit (CAmin) of the coating area, correction thresholds (CCAmax and CCAmin) for the coating area are set as the criteria for initiating spray volume correction. In the figure, the correction threshold (CCAmax) for the coating area is 490 pixels, and the correction threshold (CCAmin) is 470 pixels. The upper limit (CAmax) of the coating area is 495 pixels, and the lower limit (CAmin) is 465 pixels.

[0128] When MCA < CCAmin and CAmin < MCA, the spray pressure or spray time is increased. When CCAmax < MCA and MCA < CAmax, the spray pressure or spray time is decreased. If the measured coating area (MCA) reaches the registered coating area (RCA), the control of increasing or decreasing the spray pressure or spray time ends. In the figure, at the 26th coating pass, the lower threshold for corrected coating area (CCAmin) is exceeded (below), therefore, the spray pressure is increased.

[0129] Corrections to the setpoints based on log data of the coating location are performed in the same manner as corrections to the setpoints based on log data of the coating area. Comparing the current coating location data, and under similar conditions of change, a correction threshold is set within the upper and lower limits. If the value exceeds this correction threshold, the coating location setting is changed to maintain the specified coating location. The setting is corrected by increasing or decreasing the X or Y coordinate of the coating location to ensure that the deviation between the measured coating location (MCP) and the registered coating location (RCP) is within a reference range. At this time, different from the upper limit (CPmax) and lower limit (CPmin) of the coating location, the upper correction threshold (CCPmax) and lower correction threshold (CCPmin) of the coating location are set as the judgment criteria for starting the correction of the coating location.

[0130] When MCP < CCPmin and CPmin < MCP, increase the coating position setting. When CCPmax < MCP and MCP < CPmax, decrease the coating position setting.

[0131] According to this embodiment, the visual inspection results (coating area, coating position, etc.) and the current setting data are recorded as log data. Therefore, it is possible to compare and combine other conditions, thereby enabling self-diagnosis of the location of coating abnormalities (visual inspection abnormalities) of the paste adhesive applied to the substrate, as well as the current conditions, the paste adhesive used, and abnormalities in the coating apparatus mechanism. Furthermore, the setting data for coating amount and coating position can be corrected based on this judgment. This improves mounting accuracy and reduces equipment failures (pre-maintenance period judgment).

[0132] The above describes the disclosure made by the inventors of this disclosure in detail based on the embodiments, but this disclosure is not limited to the above embodiments, and it goes without saying that various changes can be made.

[0133] For example, when automatically adjusting the spray volume of the paste adhesive, the system can use log data to monitor the shift in settings such as spray pressure used to maintain normal operation, and determine the deterioration (viscosity change) of the paste adhesive over time.

[0134] In addition, in the embodiment, the following example is described: An intermediate stage 3 is provided between the bare chip supply section 1 and the mounting section 4. The bare chip D picked up from the bare chip supply section 1 by the pick-up head 21 is placed on the intermediate stage 31. The bare chip D is picked up again from the intermediate stage 31 by the mounting head 41 and mounted on the transported substrate S. Alternatively, the bare chip D picked up from the bare chip supply section 1 by the mounting head 41 can also be mounted on the substrate S.

Claims

1. A chip mounting apparatus, characterized in that, have: The first stage supports the substrate. A coating apparatus for applying a paste-like adhesive onto the substrate; A first imaging device is used to image the substrate and the paste adhesive applied to the substrate. A mounting head that mounts a bare chip onto a substrate coated with the paste adhesive; as well as The control device performs a first visual inspection based on a first image of the paste-like adhesive captured by the first imaging device. The control device is configured such that, Each time a paste adhesive is applied to the substrate, a visual inspection is performed, and data including the application area and application position of the paste adhesive calculated based on the first image, or data including either the application area or the application position, are recorded as log data in a storage device. Based on the log data recorded in the storage device prior to visual inspection, an approximate straight line representing the shift in the coating area, the shift in the coating position, or both, is calculated. The system determines whether the data obtained during the visual inspection is within a specified range relative to the approximate straight line, thereby determining whether the applied paste adhesive is in a normal or abnormal state.

2. The chip mounting apparatus according to claim 1, characterized in that, The paste adhesive is applied to the substrate while it is supported on the first stage.

3. The chip mounting apparatus according to claim 1, characterized in that, The control device is configured to determine a sudden anomaly when the data obtained during the visual inspection deviates from the specified range relative to the approximate straight line and from the normal range.

4. The chip mounting apparatus according to claim 3, characterized in that, The application apparatus includes: a syringe for receiving the paste adhesive; and a dispenser for supplying pressurized gas to spray the paste adhesive from the syringe. The control device is configured such that, The set value of the ejection pressure of the pressurized gas, the set value of the ejection time of the pressurized gas, the measured value of the ejection pressure, and the measured value of the ejection time are also recorded as log data in the storage device. The distributor is identified as malfunctioning when a sudden abnormality in the coating area is detected, either when the set value of the spray pressure differs from the measured value of the spray pressure, or when the set value of the spray time differs from the measured value of the spray time.

5. The chip mounting apparatus according to claim 1, characterized in that, It also has: A conveying device that conveys the substrate coated with the paste adhesive to a second platform; and The second imaging device images the paste-like adhesive on the substrate that has been transferred to the second platform. The control device is configured such that, A second visual inspection is performed based on the image of the paste-like adhesive captured by the second imaging device. The application width of the paste adhesive calculated based on the first image and the pre-application application width of the paste adhesive calculated based on the second image captured by the second imaging device will also be recorded as log data in the storage device. Based on the rate of change between the coating width during visual inspection and the coating width before mounting, as well as the rate of change between the coating width and the coating width before mounting, which were recorded as log data in the storage device before the visual inspection, it is determined whether the paste adhesive has deteriorated.

6. The chip mounting apparatus according to claim 1, characterized in that, It also has: A conveying device that conveys the substrate coated with the paste adhesive to a mounting table; and The second imaging device photographs the paste-like adhesive on the substrate being transported to the mounting table. The control device is configured such that, A second visual inspection is performed based on the image of the paste-like adhesive captured by the second imaging device. The pre-application coating area of ​​the paste adhesive, calculated based on the second image captured by the second imaging device, will also be recorded as log data in the storage device. Based on the rate of change between the coating area during visual inspection and the coating area before mounting, as well as the rate of change between the coating area and the coating area before mounting, which were recorded as log data in the storage device before the visual inspection, it is determined whether the paste adhesive has deteriorated.

7. The chip mounting apparatus according to claim 1, characterized in that, The control device is configured such that, A third image is obtained by photographing the substrate using the first imaging device before the paste adhesive is applied. The substrate identification position calculated based on the third image is recorded as log data in the storage device. If the application position of the paste adhesive is determined to be abnormal, the cause of the abnormality is determined based on the substrate identification position and the application position.

8. The chip mounting apparatus according to claim 1, characterized in that, The application apparatus includes: a syringe for receiving the paste adhesive; a dispenser for supplying pressurized gas to spray the paste adhesive from the syringe; and a drive unit for moving the syringe. The control device is configured such that, If, during the visual inspection, the coating area is within the specified range relative to the approximate straight line but deviates from the normal range, a warning is issued indicating that the remaining amount of the paste adhesive in the syringe is low or the viscosity has changed. If, during the visual inspection, the coating position is within the specified range relative to the approximate straight line but deviates from the normal range, a warning is issued regarding an abnormality caused by elongation due to the continuous operation of the drive unit.

9. The chip mounting apparatus according to claim 8, characterized in that, The anomaly is that the application position of the paste adhesive is off.

10. The chip mounting apparatus according to claim 1, characterized in that, The application apparatus includes: a syringe for receiving the paste adhesive; a dispenser for supplying pressurized gas to spray the paste adhesive from the syringe; and a drive unit for moving the syringe. The control device is configured such that, The set values ​​for the ejection pressure of the pressurized gas, the ejection time of the pressurized gas, and the application position are also recorded as log data in the storage device. If the data obtained during the visual inspection is within a specified range and within the normal range relative to the approximate straight line, the setting value of the spray pressure, the setting value of the spray time, or the setting value of the coating position is corrected in a manner that makes the change close to 0.

11. The chip mounting apparatus according to claim 10, characterized in that, The control device is configured such that, For every N visual inspections, based on the coating area from the log data and using the least squares method, the approximate straight line is calculated, and the slope of the approximate straight line is determined. If the slope is greater than the specified maximum slope, the set value of the ejection pressure or the set value of the ejection time is reduced. If the slope is smaller than the specified minimum slope, the set value of the ejection pressure or the set value of the ejection time is increased.

12. The chip mounting apparatus according to claim 10, characterized in that, The control device is configured such that, A correction threshold is set inside the upper and lower limits of the normal range. If the coating area obtained during the visual inspection exceeds the correction threshold but does not exceed the lower limit, the set value of the spray pressure or the set value of the spray time is increased. If the coating area obtained during the visual inspection exceeds the correction threshold but does not exceed the upper limit, the setting value of the spray pressure or the setting value of the spray time is reduced.

13. A method for manufacturing a semiconductor device, characterized in that, The process includes the following steps: In the coating process, a paste-like adhesive is applied onto the substrate; In the inspection process, each time a paste adhesive is applied to the substrate, an image of the paste adhesive applied to the substrate is captured using an imaging device, and an appearance inspection is performed based on the image. as well as In the mounting process, the bare chip is mounted onto the substrate coated with the paste adhesive. In the inspection process, Data including the application area and application location of the paste adhesive calculated from the image, or data including either the application area or the application location, are recorded as log data in the storage device. Based on the log data recorded prior to the visual inspection, an approximate straight line representing the shift in the coating area, the shift in the coating position, or both, is calculated. The system determines whether the data obtained during the visual inspection is within a specified range relative to the approximate straight line, thereby determining whether the applied paste adhesive is normal or abnormal.

14. The method for manufacturing a semiconductor device according to claim 13, characterized in that, In the coating process, the paste adhesive is applied to the substrate while the substrate is supported on the first stage.

15. The method for manufacturing a semiconductor device according to claim 13, characterized in that, In the inspection process, if the data obtained during the visual inspection deviates from the specified range relative to the approximate straight line and from the normal range, it is judged as a sudden anomaly.

16. The method for manufacturing a semiconductor device according to claim 13, characterized in that, The coating process is performed by a coating apparatus comprising: a syringe for receiving the paste adhesive; and a distributor for supplying pressurized gas to eject the paste adhesive from the syringe. In the inspection process, The set values ​​for the ejection pressure of the pressurized gas, the ejection time of the pressurized gas, and the application position are also recorded as log data in the storage device. If the data obtained during the visual inspection is within a specified range and within the normal range relative to the approximate straight line, the setting value of the spray pressure, the setting value of the spray time, or the setting value of the coating position is corrected in a manner that makes the change close to 0.

Images