A water-cooled heat sink

Abstract

This invention provides a water-cooled radiator with an inlet, an outlet, and a mounting slot. A flow-dispersing column assembly is positioned on the radiator corresponding to the IGBT module. The flow-dispersing column assembly has flow channels communicating with the inlet and outlet. The assembly includes a base plate and flow-dispersing columns spaced apart on the base plate, located within the flow channels. One end of each flow-dispersing column is spherical, and the other end is conical. The conical structures on adjacent sets of flow-dispersing columns are arranged in opposite directions, while the spherical structures on the flow-dispersing columns face the direction of fluid flow. This water-cooled radiator, by optimizing the distribution structure of the flow-dispersing columns in the water-cooling flow channels, forms a composite flow-dispersing column combination that enhances turbulence and reduces flow resistance. This optimizes the temperature distribution on the radiator surface, effectively improving the radiator's heat exchange performance, reducing flow resistance, and ensuring good temperature uniformity of the IGBT heat source.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for IGBT modules in converters, and specifically to a water-cooled heat sink. Background Technology

[0002] In recent years, under the guiding principle of introducing, digesting, absorbing, and re-innovating foreign technologies to build Chinese brands, my country's rail transit industry has achieved leapfrog development in locomotives, EMUs, and urban rail transit through independent innovation. With the increasing speed and high performance demands of rail transit, high-power, highly integrated, and lightweight power support is inevitable. The IGBT converter module is a high-frequency switch that controls the operation of the vehicle's motor. The continuous switching on and off of current generates enormous heat loss, making it one of the main heat sources in trains. Ensuring that the IGBT converter module operates under efficient and uniform heat dissipation conditions ensures stable operation and a longer service life. As train development continues to accelerate, converters are evolving towards higher power, higher heat flux density, lighter weight, and smaller size; correspondingly, heat sink technology must also be upgraded to meet high-performance requirements.

[0003] When designing heat dissipation for traction converters in the rail transit industry, for a single IGBT module, air-cooled profiles can be used when the heat output is less than 900W, while heat pipes can be used for 900-1200W. Water cooling has a heat transfer coefficient two orders of magnitude higher than air cooling and is widely used in high-power converters, such as high-power locomotives and high-speed trains. For applications with operating conditions exceeding 1200W / IGBT, water-cooled radiators should generally be selected. Water-cooled radiators represent the development trend for high heat flux density IGBT cooling. The rapid increase in IGBT heat flux density has also increased the demand for water-cooled applications. How to rationally design the flow channel structure of water-cooled radiators, effectively reduce flow resistance, and improve heat dissipation performance is the goal of improving the applicability of water-cooled radiators and is currently a key research focus.

[0004] Temperature rise, flow resistance, and temperature uniformity are the main indicators for evaluating the quality of a heat sink. A smaller temperature rise indicates stronger heat exchange performance, meaning a lower operating junction temperature for the IGBT, effectively improving IGBT efficiency and significantly reducing the failure rate. Good heat exchange performance is crucial for the stable operation of IGBTs. Lower flow resistance indicates that the water-cooling channel structure minimizes the flow loss of the working fluid. In a specified water-cooling system, according to the pump's PQ curve, lower flow resistance allows for a larger inlet flow rate and a higher working fluid velocity, which is beneficial for enhanced heat transfer. For heat sinks using forced convection technology, one common method to enhance heat transfer is to enhance flow turbulence in the flow channels to increase the heat transfer coefficient and reduce temperature rise. However, turbulence generally increases flow resistance significantly, thus reducing the flow velocity that the heat sink can match in the water-cooling system. Another common method is to increase the flow velocity in the flow channels to increase the heat transfer coefficient and reduce temperature rise. Increasing the flow velocity requires the heat sink itself to minimize flow resistance as much as possible. Therefore, only by taking into account both reducing temperature rise and reducing flow resistance, and combining the advantages of both flow resistance and temperature rise, can the performance of the radiator be optimized.

[0005] The flow channel structure of water-cooled heat sinks is a major factor affecting flow resistance and heat transfer performance. Scholars have conducted in-depth research on various water-cooled heat sink structures and found that when circular turbulence columns are used in the flow channel, the turbulence effect is significant, and the circular shape has the largest lateral dimension among all structures when the flow is directed towards the frontal turbulence, resulting in strong heat transfer but also huge flow resistance. When a high-flow-resistance heat sink is placed in a water-cooling system, the pump head is limited due to noise constraints and economic considerations, thus restricting the flow rate provided to the heat sink and posing a certain risk to high heat flux density heat dissipation. Furthermore, power electronic devices such as IGBTs are highly sensitive to temperature; for every 5°C increase in junction temperature, their performance decreases by approximately 10%. Since an IGBT contains multiple chip cells, localized overheating can lead to significant performance differences among the IGBT chip cells, amplifying the risk of failure. Therefore, temperature uniformity is particularly important for heat dissipation in precision IGBT equipment.

[0006] This invention discloses a composite turbulence structure water-cooled radiator for rail transit. Based on a circular turbulence column, a semi-circle is taken, and the other half is a triangle, forming a semi-circular cone design. The flow direction is enhanced by turbulence heat transfer, and the cone's sharp corner splits the flow, effectively reducing flow resistance. The combination of these two features provides the comprehensive advantages of strong heat transfer performance and low flow resistance. At the same time, based on the uniform temperature design method, a non-equidistant distribution design of the turbulence column at θ° is adopted to improve the temperature uniformity of the IGBT junction. Furthermore, the flow channel can be modularly molded according to the commonly used IGBT size, which can effectively reduce the manufacturing cost and facilitate the flexible combination of water-cooled flow channels according to actual application conditions, thus possessing good economic benefits. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a water-cooled heat sink. By optimizing and adjusting the distribution structure of the turbulence columns in the water-cooling channel, a composite turbulence column combination is formed to enhance turbulence and reduce flow resistance. This optimizes the temperature distribution of the heat sink surface, effectively improves the heat exchange performance of the heat sink, reduces flow resistance, and ensures that the IGBT heat source has good temperature uniformity.

[0008] To solve the above-mentioned technical problems, the technical solution proposed by this invention is as follows:

[0009] A water-cooled radiator is provided with an inlet, an outlet, and a mounting slot for arranging IGBT modules. A flow-dispersing column assembly is provided on the radiator at a position corresponding to the IGBT module. The flow-dispersing column assembly has flow channels communicating with the inlet and outlet respectively. The flow-dispersing column assembly includes a base plate and flow-dispersing columns spaced apart on the base plate. The flow-dispersing columns are located in the flow channels. One end of the flow-dispersing column is a spherical structure, and the other end is a conical structure. The conical structures on two adjacent sets of flow-dispersing columns in the transverse and longitudinal directions are arranged in opposite directions. The spherical structure on the flow-dispersing column faces the fluid flow direction.

[0010] According to the water-cooled radiator of the present invention, a semi-circular hemispherical structure is formed on the basis of a circular turbulence column, and the other half is a pointed triangle with a preset angle. The preset angle can be selected according to the rated power and flow rate to form a semi-conical structure. The conical structures on two adjacent sets of turbulence columns in the horizontal and vertical directions are arranged in opposite directions. The spherical surface, as the fluid flow front, can effectively enhance turbulence heat transfer and increase the heat transfer area. The pointed corner of the cone is conducive to flow diversion and resistance reduction. The combination of the two has the comprehensive advantages of strong heat transfer performance and low flow resistance, so that the water-cooled radiator with this flow channel structure can play a stronger heat dissipation performance in the entire water cooling system.

[0011] The above technical solution can be further improved as described below.

[0012] According to a preferred embodiment of the water-cooled radiator of the present invention, the radiator includes a radiator base plate and a radiator cover plate disposed on the radiator base plate, an inlet and an outlet are respectively disposed on the radiator cover plate, a mounting groove is correspondingly disposed on the radiator base plate and the radiator cover plate, and the opening of the mounting groove is disposed on the radiator cover plate such that the mounting surface of the IGBT module is located on the same side as the inlet and the outlet.

[0013] The water-cooled radiator with the above-described structure facilitates the installation of IGBT modules.

[0014] Furthermore, in a preferred embodiment, the spoiler column assembly is attached to the IGBT module located within the mounting slot.

[0015] The above structure uses the bottom surface of the substrate of the turbulence column assembly as the mounting surface of the IGBT module, ensuring that the heat source of the IGBT module is in direct contact with the turbulence column, effectively reducing the additional thermal resistance caused by the solder layer and the gap between the solder layers, and improving the heat sink effect.

[0016] Furthermore, in a preferred embodiment, a thermally conductive grease of a predetermined thickness is applied between the substrate and the IGBT module.

[0017] The above-mentioned structural design can effectively reduce the thermal resistance generated by the air gap.

[0018] Specifically, in a preferred embodiment, the spoiler columns are arranged with equal spacing.

[0019] The aforementioned baffle column assembly has a simple structure and is easy to manufacture.

[0020] Specifically, in another preferred embodiment, the turbulence pillars are arranged with a non-equidistant spacing that decreases along the direction of increasing temperature gradient of the IGBT module.

[0021] Water-cooled radiators are typically used for cooling high-power IGBTs. Generally, along the fluid flow direction, the working fluid carries heat from upstream heat exchange with the IGBTs downstream, causing the working fluid to gradually heat up. This results in a temperature gradient of 5-10K between one or more IGBTs along the flow path. This gradient depends primarily on the IGBT's power rating; the higher the power, the more pronounced the temperature gradient, which is the main cause of uneven temperature distribution in the water-cooled radiator. Therefore, based on the principle of enhanced convection heat transfer (higher flow velocity leads to stronger heat transfer), a non-equidistant layout is designed, where the spacing between the turbulence columns decreases along the increasing temperature gradient direction. Along the flow direction of the working fluid, the higher the radiator surface temperature, the smaller the spacing between the turbulence columns, resulting in a faster flow velocity, stronger heat transfer coefficient, and improved heat transfer performance. This reduces temperature rise, achieves better temperature uniformity, and ultimately improves the temperature uniformity of the radiator surface.

[0022] Specifically, in a preferred embodiment, the non-equal spacing layout is as follows: along the transverse position of the flow channel, a preset center is set, and preset groups of circles are drawn at equal intervals in the vertical arrangement. All circles are divided into equal parts by preset angles, and a turbulence column is set at the intersection of all circles and the turbulence column, with the intersection being the center of the spherical structure of the turbulence column.

[0023] The non-equidistant arrangement of the turbulence columns determined by the above method results in a gradually narrowing and dense distribution of the entire flow channel, with a large spacing and low velocity at the inlet and a small spacing and high velocity at the outlet. Furthermore, this distribution not only ensures that the spherical structure of a single turbulence column faces the flow direction, but also that the spherical structure of the entire row of turbulence columns is distributed on the arc, forming a larger circle, which is more conducive to enhancing turbulence heat transfer. At the same time, the cone direction points to the center of the circle, and the sharp corner diversion during the narrowing process can further enhance the flow resistance reduction effect.

[0024] Specifically, in a preferred embodiment, the set of equations for calculating the preset angle θ is as follows:

[0025] tan(A / 2)=W / (2*R1) (1);

[0026] tan(B / 2)=W / (2*(R1+L)) (2);

[0027] A / B = Tin / Tout (3);

[0028] (A+B) / θ=2*(W / x) (4);

[0029] Where W is the width of the flow channel, L is the length of the flow channel, Tin is the average temperature at the inlet of the flow channel, Tout is the average temperature at the outlet of the flow channel, x is the equal spacing between the horizontal rows of turbulence columns, R1 is the straight-line distance between the preset center and the outlet of the flow channel, A is the angle value connecting the preset center with the inlet edge of the flow channel as a chord, and B is the angle value connecting the preset center with the outlet edge of the flow channel as a chord.

[0030] The above method for calculating the preset angle θ is simple, accurate, and can effectively ensure that the radiator surface reaches the uniform temperature standard.

[0031] Furthermore, in a preferred embodiment, after calculating the non-equidistant arc layout at a preset angle, if the measured Tin' is less than Tout', it is corrected using the following formula: A / B=(Tin / Tout)*(Tin' / Tout') (5),

[0032] Wherein, Tin and Tin' are the average temperatures at the inlet of the flow channel, Tout and Tout' are the average temperatures at the outlet of the flow channel, A is the angle value of connecting the preset center with the inlet edge of the flow channel as a chord, and B is the angle value of connecting the preset center with the outlet edge of the flow channel as a chord.

[0033] The preset angle θ, corrected by the above calculation formula, can fully ensure that the radiator surface reaches the uniform temperature standard.

[0034] Specifically, in a preferred embodiment, the radiator substrate, radiator cover, and baffle column assembly are vacuum brazed.

[0035] Brazing has high welding strength, which can meet the water pressure resistance requirements of water-cooled radiators in rail transit, ensure good sealing and structural strength, and effectively avoid the risk of water leakage to the safe and stable operation of power electronic devices IGBTs and the damage to the contact surface of the device caused by radiator bulging due to high water pressure.

[0036] Specifically, in a preferred embodiment, the spoiler column assembly is a one-piece molded structure completed by die casting.

[0037] The radiator's baffle column assembly has a relatively complex structure and is integrally formed by mold casting, which simplifies the production process and reduces costs.

[0038] Compared with the prior art, the advantages of the present invention are: by optimizing and adjusting the distribution structure of the turbulence columns in the water-cooling channel, a composite turbulence column combination that enhances turbulence and reduces flow resistance is formed, thereby optimizing the temperature distribution of the radiator surface, effectively improving the heat exchange performance of the radiator, reducing flow resistance, and ensuring that the IGBT heat source has good temperature uniformity. Attached Figure Description

[0039] The invention will now be described in more detail with reference to embodiments and the accompanying drawings.

[0040] Figure 1 The schematic diagram illustrates the split structure of the water-cooled radiator according to an embodiment of the present invention;

[0041] Figure 2 The schematic diagram illustrates the overall structure of the water-cooled radiator according to an embodiment of the present invention;

[0042] Figure 3 The schematic diagram shows a top view of the spoiler column assembly in an embodiment of the present invention;

[0043] Figure 4 The diagram schematically shows a partially enlarged structure of the turbulence column assembly in an embodiment of the present invention;

[0044] Figure 5 The illustration schematically shows the non-equidistant distribution structure of the turbulence-distributing columns arranged based on the uniform temperature method in an embodiment of the present invention.

[0045] In the accompanying drawings, the same parts use the same reference numerals. The drawings are not drawn to scale. Detailed Implementation

[0046] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments, but this does not limit the scope of protection of the present invention.

[0047] Figure 1 The schematic diagram shows the split structure of the water-cooled radiator 10 according to an embodiment of the present invention. Figure 2 The schematic diagram shows the overall structure of the water-cooled radiator 10 according to an embodiment of the present invention. Figure 3 The schematic diagram shows the top view of the spoiler column assembly 1 in an embodiment of the present invention. Figure 4 The schematic diagram shows a partially enlarged structure of the turbulence column assembly 1 in an embodiment of the present invention. The turbulence column 12 with the sharp corner pointing to the right is the positive turbulence column 12, and the opposite corner is the negative turbulence column 12. The turbulence column assembly 1 includes several rows of positive turbulence columns 12 and negative turbulence columns 12 arranged alternately, wherein the arrow indicates the direction of the working fluid water flow. Figure 5 The schematic diagram illustrates the non-equidistant distribution structure of the turbulence columns 12 arranged based on the uniform temperature method in an embodiment of the present invention.

[0048] like Figures 1 to 4 As shown in the figure, a water-cooled radiator 10 according to an embodiment of the present invention is provided with an inlet 2, an outlet 3 and a mounting slot 4 for arranging IGBT modules. A baffle column assembly 1 is provided on the radiator 10 at a position corresponding to the IGBT module. The baffle column assembly 1 is provided with flow channels that are respectively connected to the inlet 2 and the outlet 3. The baffle column assembly 1 includes a base plate 11 and baffle columns 12 arranged at intervals on the base plate 11. The baffle columns 12 are located in the flow channels. One end of the baffle column 12 is a spherical structure and the other end is a conical structure. The conical structures on two adjacent sets of baffle columns 12 in the horizontal and vertical directions are arranged in opposite directions. The spherical structure on the baffle column 12 faces the direction of fluid flow.

[0049] According to an embodiment of the present invention, the water-cooled radiator is based on a circular turbulence column, with a semi-circle forming a hemispherical surface structure and the other half being a pointed triangle with a preset angle. The preset angle can be selected according to the rated power and flow rate to form a semi-conical structure. Furthermore, the conical surface structures on two adjacent sets of turbulence columns in the horizontal and vertical directions are arranged in opposite directions. The spherical surface, as the fluid flow-facing side, can effectively enhance turbulence heat transfer and increase the heat transfer area. The pointed corner of the cone is conducive to flow diversion and resistance reduction. The combination of the two has the comprehensive advantages of strong heat transfer performance and low flow resistance, enabling the water-cooled radiator with this flow channel structure to exert stronger heat dissipation performance in the entire water cooling system.

[0050] Specifically, in some embodiments not shown, the structure of the turbulence column also includes teardrop-shaped, date-shaped, rhomboid, cylindrical, and triangular structures.

[0051] Specifically, such as Figure 1 and Figure 2As shown, in this embodiment, the heat sink 10 includes a heat sink substrate 101 and a heat sink cover plate 102 disposed on the heat sink substrate 101. An inlet 2 and an outlet 3 are respectively disposed on the heat sink cover plate 102. A mounting groove 4 is correspondingly disposed on the heat sink substrate 101 and the heat sink cover plate 102, and the opening of the mounting groove 4 is disposed on the heat sink cover plate 102 such that the mounting surface of the IGBT module is located on the same side as the inlet 2 and the outlet 3. This water-cooled heat sink with the above-described structure facilitates the installation of the IGBT module. Further, in this embodiment, the baffle column assembly 1 is attached to the IGBT module located within the mounting groove 4. Specifically, the IGBT module is fastened by bolts. This structure uses the bottom surface of the baffle column assembly substrate as the mounting surface of the IGBT module, ensuring direct contact between the heat source of the IGBT module and the baffle column, effectively reducing the additional thermal resistance due to the welding layer and the gap between the welding layers, and improving the heat sink effect. Further, in this embodiment, a thermally conductive silicone grease of a predetermined thickness is applied between the substrate 11 and the IGBT module. The above-mentioned structural design can effectively reduce the thermal resistance generated by the air gap.

[0052] Specifically, in this embodiment, the radiator substrate 101, radiator cover 102, and baffle column assembly 1 are vacuum brazed. Brazing provides high weld strength, meeting the water pressure resistance requirements of water-cooled radiators in rail transit, ensuring good sealing and structural strength, and effectively avoiding the risk of water leakage to the safe and stable operation of IGBT power electronic devices and the damage to the device contact surfaces caused by radiator bulging due to high water pressure.

[0053] Specifically, in this embodiment, the baffle column assembly 1 is a one-piece structure formed by die casting. The baffle column assembly of the radiator has a relatively complex structure, and using die casting to form it as a single piece simplifies the production process and reduces costs.

[0054] like Figure 3 and Figure 4 As shown, specifically in this embodiment, the spoiler columns 12 are arranged with equal spacing. The spoiler column assembly with the above-described structure is simple in structure and easy to manufacture.

[0055] like Figure 5As shown, specifically in this embodiment, the turbulence-enhancing columns 12 are arranged in a non-equidistant layout with decreasing spacing along the increasing temperature gradient direction of the IGBT module. Water-cooled radiators are generally used for cooling high-power IGBTs. Typically, along the fluid flow direction, the working fluid carries heat from upstream heat exchange with the IGBTs downstream, continuously accumulating and gradually heating up. This results in a 5-10K temperature gradient between one or more IGBTs along the flow channel. This temperature gradient depends primarily on the IGBT power; the higher the power, the more pronounced the temperature gradient, which is the main cause of uneven temperature distribution in the entire water-cooled radiator. Therefore, based on the principle of enhanced convection heat transfer, the higher the flow velocity, the stronger the heat transfer capacity. The traditional equidistant distribution of the turbulence-enhancing columns is changed, and a non-equidistant layout with decreasing spacing along the increasing temperature gradient direction is designed. Along the flow direction of the working fluid, the higher the radiator surface temperature, the smaller the spacing of the turbulence-enhancing columns, the faster the flow velocity, the stronger the heat transfer coefficient, and the improved heat transfer performance. This reduces temperature rise, achieves better temperature uniformity, and ultimately improves the temperature uniformity of the radiator surface.

[0056] Specifically, in this embodiment, the non-equidistant layout is as follows: along the transverse position of the flow channel, a predetermined center is set, and predetermined groups of circles are drawn at equal intervals in the longitudinal direction. All circles are divided into equal sections at predetermined angles. A turbulence column is set at the intersection of all circles and the bisectors, and the intersection point is the center of the spherical structure of the turbulence column. According to the non-equidistant arrangement of the turbulence columns determined by the above method, since the turbulence columns are combined in a row on both sides of the arc, the entire flow channel is distributed in a gradually narrowing and dense pattern. The spacing at the inlet of the flow channel is large, and the flow velocity is low, while the spacing at the outlet is small, and the flow velocity is high. Moreover, this distribution method not only has the spherical structure of a single turbulence column facing the flow direction, but the spherical structure of the entire row of turbulence columns is also distributed on the arc, forming a larger circle, which is more conducive to enhancing turbulent heat transfer. At the same time, the cone direction points to the center of the circle, and the sharp corner diversion during the narrowing process can further enhance the flow resistance reduction effect.

[0057] like Figure 5 As shown, specifically, in this embodiment, the set of equations for calculating the preset angle θ is as follows:

[0058] tan(A / 2)=W / (2*R1) (1);

[0059] tan(B / 2)=W / (2*(R1+L)) (2);

[0060] A / B = Tin / Tout (3);

[0061] (A+B) / θ=2*(W / x) (4);

[0062] Where W is the width of the flow channel, L is the length of the flow channel, Tin is the average temperature at the flow channel inlet, Tout is the average temperature at the flow channel outlet, x is the equal spacing between the horizontal rows of baffles, R1 is the straight-line distance between the preset center and the flow channel outlet, A is the angle connecting the preset center with the flow channel inlet edge as a chord, and B is the angle connecting the preset center with the flow channel outlet edge as a chord. Calculating the preset angle θ using the above method is simple, yields accurate results, and effectively ensures that the radiator surface reaches the uniform temperature standard.

[0063] Furthermore, in this embodiment, after calculating the non-uniformly spaced arc layout with a preset angle θ, if the measured Tin' is less than Tout', it is corrected using the following formula: A / B=(Tin / Tout)*(Tin' / Tout')(5), where Tin and Tin' are the average temperatures at the inlet end of the flow channel, Tout and Tout' are the average temperatures at the outlet end of the flow channel, A is the angle value connecting the preset center with the inlet edge of the flow channel as a chord, and B is the angle value connecting the preset center with the outlet edge of the flow channel as a chord. The preset angle θ corrected by the above calculation formula can fully ensure that the radiator surface reaches the uniform temperature standard.

[0064] Specifically, in this embodiment, the method for distributing the turbulence-causing columns at a preset angle θ with non-equidistant arcs based on the temperature equalization method is as follows:

[0065] The working fluid temperature directly affects the radiator surface temperature. Therefore, under the same flow channel structure, even with consistent flow rates, the working fluid carries heat from upstream heat exchange with IGBTs downstream, causing it to gradually heat up. This results in a temperature gradient of 5-10K or even higher with one or more IGBTs along the flow channel direction. This gradient depends primarily on the IGBT power; the higher the power, the more pronounced the temperature gradient. This is the main cause of inconsistent temperature distribution in the entire water-cooled radiator, which is particularly detrimental to current and future high-power applications. To eliminate this temperature gradient, based on the principle of forced convection enhanced heat transfer, the working fluid velocity directly affects the convective heat transfer coefficient; the higher the velocity, the stronger the heat transfer capacity. In this embodiment of the invention, the turbulence columns in the radiator are arranged non-equidistantly using a uniform temperature method, thereby altering the turbulence structure throughout the flow channel. This enhances the temperature gradient along the flow velocity direction by increasing the flow velocity, achieving the desired overall surface temperature reduction.

[0066] S01: Based on the IGBT layout, rated power, size, and rated flow, determine a reasonable main channel structure and the optimal size and spacing between the equidistant baffles. The channel length corresponding to the IGBT size is L and the width is W.

[0067] S02: As Figure 4In the initial flow channel structure, along the flow channel direction, a set of temperature probes are equidistantly arranged at the heat sink platform position corresponding to each row of baffle columns to obtain a set of measuring points that can reflect the temperature gradient. The number of probes is N, which is determined according to the size of the IGBT and the spacing between the baffle columns. The temperature gradient is obtained by testing at rated power and flow rate. The temperature gradient originates from the fact that the measuring point Tin at the inlet end of the flow channel is smaller than the measuring point Tout at the outlet end of the flow channel.

[0068] S03: Will Figure 4 The horizontal and vertical spoiler columns shown are arranged at equal intervals as follows: Figure 5 The non-equidistant design shown, in which Figure 4 The turbulence columns described herein are equidistant horizontally by x and equidistant vertically by y, as shown in the example. Figure 5 The layout shown involves drawing a sufficient number of circles with equal radii (y) at a central point. These circles are then divided into equal sections at a predetermined angle (θ°). The intersection of each circle with the dividing line is the center point of a semicircle of a turbulence column, meaning one turbulence column sits at each intersection. This arrangement uses a composite combination of two rows along the arc, one on each side. The entire flow channel exhibits a gradually narrowing, dense distribution. The inlet has a large spacing and low velocity, while the outlet has a small spacing and high velocity. This distribution not only ensures that the circular surface of each individual turbulence column faces the flow direction, but also that the entire row of spherical turbulence columns is distributed along the arc, forming a larger circle that enhances heat transfer. Furthermore, the conical direction points towards the center, and the sharp angles during the narrowing process further enhance the flow resistance reduction. The θ° division line can be calculated using the following equations: Figure 5 As shown, W and L are determined based on the flow channel dimensions, while Tin and Tout are obtained based on temperature measurements.

[0069] tan(A / 2)=W / (2*R1) (1)

[0070] tan(B / 2)=W / (2*(R1+L)) (2)

[0071] A / B = Tin / Tout (3)

[0072] (A+B) / θ=2*(W / x) (4)

[0073] S04: Determine the uniform temperature standard according to the experimental application requirements, such as allowing a temperature difference of 1K on the radiator platform. After calculating the non-equidistant distribution of the θ° arc through S03, repeat S02 to measure the temperature. If the temperature difference is still greater than the uniform temperature standard of 1K, then obtain Tin and Tout and continue to S03 to iterate and find a new θ° distribution until the uniform temperature standard is reached. Initially, because the working fluid gradually heats up along the flow direction, Tin will usually be less than Tout along the flow channel direction. If Tin' is greater than Tout' after one iteration, it indicates that the gradual contraction and increase of the flow rate is excessive. Equation (3) needs to be corrected as follows before continuing to complete the next iteration, that is, A / B=(Tin / Tout)*(Tin' / Tout').

[0074] Therefore, based on the uniform temperature distribution method, the provided θ° non-equidistant distribution structure of the turbulence pillars can effectively eliminate the temperature gradient that appears along the working fluid flow towards the heat sink surface when using heat sinks for high-power devices, improving the uniformity of IGBT junction temperature. This provides more efficient thermal management capabilities for current and future high-power applications. The θ° non-equidistant distribution of the turbulence pillars based on the uniform temperature design can further enhance the efficient heat exchange and flow resistance reduction effect of the composite turbulence structure, and can more fully tap the potential of heat dissipation and flow resistance. The flow channel structure can be modularly molded according to the common size of IGBTs, effectively reducing process costs and facilitating flexible combination of water-cooled flow channels according to actual application conditions, thus possessing good economic efficiency.

[0075] As can be seen from the above embodiments, the water-cooled radiator of the present invention optimizes and adjusts the distribution structure of the turbulence columns in the water-cooling channel to form a composite turbulence column combination that enhances turbulence and reduces flow resistance, thereby optimizing the temperature distribution of the radiator surface, effectively improving the heat exchange performance of the radiator, reducing flow resistance, and ensuring that the IGBT heat source has good temperature uniformity.

[0076] Although the invention has been described with reference to preferred embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the invention. In particular, the technical features mentioned in the various embodiments can be combined in any manner as long as there is no structural conflict. The invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A water-cooled heat sink, characterized by, The radiator is provided with an inlet, an outlet, and a mounting slot for arranging IGBT modules; a baffle column assembly is provided on the radiator at a position corresponding to the IGBT module, and the baffle column assembly is provided with flow channels that are respectively connected to the inlet and the outlet; The turbulence column assembly includes a substrate and turbulence columns spaced apart on the substrate, and the turbulence columns are located within the flow channel; One end of the turbulence column is a spherical structure, and the other end is a conical structure. The conical structures on two adjacent sets of turbulence columns in the horizontal and vertical directions are arranged in opposite directions, and the spherical structure on the turbulence column faces the direction of fluid flow. The turbulence-disrupting columns are arranged with non-equidistant spacing, with the spacing decreasing along the increasing temperature gradient direction of the IGBT module. The non-equal spacing layout is as follows: along the transverse position of the flow channel, a preset center is set, and preset groups of circles are drawn in equal increments along the vertical rows. All circles are divided into equal parts according to a preset angle θ. A turbulence column is set at the intersection of all circles and the turbulence column, and the intersection is the center of the spherical structure of the turbulence column.

2. The water-cooled heat sink of claim 1, wherein, The radiator includes a radiator base plate and a radiator cover plate arranged on the radiator base plate; the water inlet and the water outlet are respectively disposed on the radiator cover plate. The mounting slot is correspondingly disposed on the heat sink base plate and the heat sink cover plate, and the opening of the mounting slot is disposed on the heat sink cover plate such that the mounting surface of the IGBT module is located on the same side as the water inlet and the water outlet.

3. The water-cooled heat sink of claim 2, wherein, The spoiler column assembly is attached to the IGBT module located within the mounting slot.

4. The water-cooled heat sink of claim 3, wherein, A thermally conductive silicone grease of a predetermined thickness is applied between the substrate and the IGBT module.

5. The water-cooled heat sink of claim 1, wherein, The set of equations for calculating the preset angle θ is as follows: （1）； （2）； （3）； （4）； Where W is the width of the flow channel, L is the length of the flow channel, Tin is the average temperature at the inlet of the flow channel, Tout is the average temperature at the outlet of the flow channel, x is the equal spacing between the horizontal rows of turbulence columns, R1 is the straight-line distance between the preset center and the outlet of the flow channel, A is the angle value connecting the preset center with the inlet edge of the flow channel as a chord, and B is the angle value connecting the preset center with the outlet edge of the flow channel as a chord.

6. The water-cooled heat sink of claim 5, wherein, After calculating the non-equal spacing of the arcs at the preset angle, if the measured Tin' is greater than Tout', the following formula is used for correction: （5）； Wherein, Tin and Tin' are the average temperatures at the inlet of the flow channel, Tout and Tout' are the average temperatures at the outlet of the flow channel, A is the angle value of connecting the preset center with the inlet edge of the flow channel as a chord, and B is the angle value of connecting the preset center with the outlet edge of the flow channel as a chord.

7. The water-cooled heat sink of any one of claims 2 to 4, wherein, The radiator substrate, the radiator cover, and the baffle column assembly are vacuum brazed.

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