An aspiration device for a chip packaging process and method of use

Abstract

The application discloses a kind of suction device and use method for chip packaging process, suction device includes: stem, first installation port being arranged in one end of stem, blocking structure being arranged in stem interior, side through hole being arranged on the side wall of stem between first installation port and blocking structure, vacuum adapter being arranged on the outside of stem and surrounding side through hole, second baffle being arranged on the inner wall of stem between first installation port and side through hole and close to side through hole;Blocking structure includes the first collection structure towards second baffle;Through the suction device of the application, the residue on the surface of chip can be collected automatically, when sucking chip, residue will enter the interior of stem from first installation port and be collected by first collection structure, then fall into second baffle when releasing chip and be blown to the outside of vacuum adapter through side through hole, which can effectively avoid the problems of chip bridge short-circuit failure caused by tin residue and vacuum source pollution caused by conventional operation mode.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, specifically to a pick-up device and method for use in the chip packaging process. Background Technology

[0002] With the trend towards miniaturization and high density in electronic packaging, flip-chip technology has become increasingly widely used. However, various failure problems arise during the flip-chip process, among which solder dross residue is one of the most common causes of product failure, and currently, there is no effective solution to this problem. For example, when using existing pick-up devices to transfer chips, the first mounting port of the pick-up device will cause friction and compression with the chip's bumps, generating solder dross. The pick-up device inevitably picks up some solder dross along with the chip, which can easily cause circuit bridging on the chip surface, leading to failure. Furthermore, it can easily draw residual solder dross from the pick-up device into the subsequent vacuum source.

[0003] Therefore, in order to improve product yield during the packaging process, a suction device is needed to prevent solder residue from contaminating the chip. Summary of the Invention

[0004] The purpose of this invention is to overcome the problem that existing suction devices pick up residue, and to provide a suction device and method for use in the chip packaging process.

[0005] To achieve the above objectives, the present invention provides a pick-up device for a chip packaging process, comprising:

[0006] Rod body;

[0007] A first mounting port is provided at one end of the rod body, and the first mounting port is suitable for mounting a suction nozzle;

[0008] A second mounting port is provided at the other end of the rod, and the second mounting port is adapted to be connected to an external first vacuum source;

[0009] A vacuum cavity is provided inside the rod body;

[0010] A barrier structure disposed within the vacuum cavity;

[0011] A side through hole is provided on the side wall of the rod, and the side through hole is located between the first mounting port and the blocking structure;

[0012] A vacuum connector is provided on the outside of the rod body, and the vacuum connector communicates with the vacuum cavity through the side through hole and is connected to an external second vacuum source;

[0013] A second baffle wall is provided in the vacuum cavity between the first mounting port and the side through hole;

[0014] The blocking structure includes a first flow channel and a first collection structure facing the first installation port. The second baffle corresponds to the first collection structure and the side through hole of the blocking structure. The residue collected by the first collection structure falls into the second baffle using the second baffle and is sucked out of the vacuum chamber through the side through hole and vacuum connector.

[0015] The second retaining wall has a second flow channel, and the first flow channel and the second flow channel enable the first installation port and the second installation port to communicate.

[0016] In one possible implementation, the first collecting structure includes a convex structure facing the second retaining wall and a first retaining wall disposed outside the convex structure and extending towards the second retaining wall, wherein a first flow channel is provided between the outer side of the first retaining wall and the inner wall of the rod.

[0017] As one possible implementation, the first retaining wall extends toward the second retaining wall while tilting toward the inner wall of the outer pole.

[0018] As one possible implementation, the convex structure is a bowl-shaped structure or a cone-shaped structure.

[0019] As one possible implementation, the first radial distance between the end of the second retaining wall near the first collecting structure and the inner wall of the rod is greater than the second radial distance between the inner wall of the rod at the position on the convex surface of the convex structure that is on the same radial plane as the end of the first retaining wall near the second retaining wall.

[0020] In one possible implementation, one end of the second baffle is located on the inner wall of the rod near the bottom of the side through hole, and the other end of the second baffle extends obliquely toward the blocking structure. A second flow channel is formed between the inner sides of the second baffle away from the inner wall of the rod.

[0021] In one possible implementation, the second retaining wall is disposed on the inner wall of the rod body that is in close contact with the side through hole.

[0022] As one possible implementation, both the first retaining wall and the second retaining wall are plate-shaped structures.

[0023] As one possible implementation, both the first retaining wall and the second retaining wall are ring structures.

[0024] In one possible implementation, the first retaining wall is a first annular retaining wall that surrounds the outer side of the convex structure, and the second retaining wall is a second annular retaining wall that surrounds the inner wall of the rod.

[0025] As one possible implementation, the side through hole is also connected to a one-way valve, which is used to open or close the side through hole.

[0026] As one possible implementation, the one-way valve is a one-way valve that opens only towards the vacuum connector, and automatically opens or closes the side passage using an external first vacuum source and a second vacuum source.

[0027] In one possible implementation, the number of side through holes is at least two, and the number of vacuum connectors corresponds to the number of side through holes.

[0028] As one possible implementation, at least two side through holes are arranged at equal intervals.

[0029] In one possible implementation, a conduit is connected between the second vacuum connector and an external second vacuum source, and a filter element is provided inside the conduit.

[0030] This invention also provides a method of using the above-described suction device, comprising the following steps:

[0031] When it is necessary to pick up the chip, the second mounting port is evacuated by an external first vacuum source. Under the evacuation state, the chip is picked up by a suction nozzle installed on the first mounting port. Under the action of evacuating the second mounting port, the residue on the surface of the chip enters the rod body through the suction nozzle and the first mounting port and is collected by the first collection structure.

[0032] When the chip needs to be released, the vacuum of the second mounting port is broken by the first external vacuum source. Under the action of breaking the vacuum of the second mounting port, the residue collected by the first collection structure falls into the second baffle wall. At the same time, the vacuum connector is evacuated by the second external vacuum source. Under the action of evacuating the vacuum connector, the residue that falls into the second baffle wall is sucked away through the side through hole and the vacuum connector.

[0033] The beneficial effects of this invention are:

[0034] This invention provides a pick-up device for chip packaging processes, comprising: a rod body, a first mounting port at one end of the rod body, a blocking structure inside the rod body, a side through-hole on the side wall of the rod body between the first mounting port and the blocking structure, a vacuum connector on the outside of the rod body surrounding the side through-hole, and a second baffle on the inner wall of the rod body between the first mounting port and the side through-hole, close to the side through-hole; the blocking structure includes a first collection structure facing the second baffle; the pick-up device of this invention can automatically collect residues on the chip surface. When picking up a chip, the residue enters the rod body from the first mounting port and is collected by the first collection structure, and then falls into the second baffle and is blown to the outside of the vacuum connector through the side through-hole when the chip is released, greatly reducing chip bridging short-circuit failures and vacuum source contamination. Attached Figure Description

[0035] Figures 1A-1E This is a schematic diagram of the suction process of a traditional suction device;

[0036] Figure 2 This is a front sectional view of the suction device according to an embodiment of the present invention;

[0037] Figure 3 for Figure 2 AA side section view;

[0038] Figure 4 This is a top view of the suction device according to an embodiment of the present invention;

[0039] Figure 5 This is a schematic diagram of the first radial distance and the second radial distance of the suction device according to an embodiment of the present invention;

[0040] Figure 6 This is a diagram showing the gas flow direction when the suction device of this embodiment of the invention suctions a chip;

[0041] Figure 7 This is a diagram showing the gas flow direction when the extraction device releases the chip according to an embodiment of the present invention;

[0042] Figure 8 This is a flowchart illustrating the steps of the method used in an embodiment of the present invention. Detailed Implementation

[0043] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0044] During the chip transfer process using existing suction devices, residue can contaminate the chip. Specifically: such as... Figure 1A As shown, the suction device 20 activates the vacuum suction chip 10. During the suction process, as... Figure 1B As shown, the residue 11 on the chip surface is simultaneously drawn into the suction device 20; then, as... Figure 1C As shown, during the handover process with other tools 30, the suction device 20 releases the chip 10 by blowing air, but at the same time blows the residue 11 onto the surface of the chip 10; for example... Figure 1D and Figure 1E As shown in the subsequent processing, residue 11 remained on the chip, which could potentially lead to a series of problems such as short circuits in the chip bridging.

[0045] Therefore, in order to solve the above problems, the present invention provides a technical solution: a pick-up device for chip packaging process, comprising: a rod;

[0046] A first mounting port is provided at one end of the rod body, and the first mounting port is suitable for mounting a suction nozzle;

[0047] A second mounting port is provided at the other end of the rod, and the second mounting port is adapted to be connected to an external first vacuum source;

[0048] A vacuum cavity is provided inside the rod body;

[0049] A barrier structure disposed within the vacuum cavity;

[0050] A side through hole is provided on the side wall of the rod, and the side through hole is located between the first mounting port and the blocking structure;

[0051] A vacuum connector is provided on the outside of the rod body, and the vacuum connector communicates with the vacuum cavity through the side through hole and is connected to an external second vacuum source;

[0052] A second baffle wall is provided in the vacuum cavity between the first mounting port and the side through hole;

[0053] The blocking structure includes a first flow channel and a first collection structure facing the first installation port. The second baffle corresponds to the first collection structure and the side through hole of the blocking structure. The residue collected by the first collection structure falls into the second baffle using the second baffle and is sucked out of the vacuum chamber through the side through hole and vacuum connector.

[0054] The second retaining wall has a second flow channel, and the first flow channel and the second flow channel enable the first installation port and the second installation port to communicate.

[0055] The first collecting structure includes a convex structure with a convex surface facing the second barrier wall and a first barrier wall located outside the convex structure and extending toward the second barrier wall. A first flow channel is formed between the outer side of the first barrier wall and the inner wall of the rod.

[0056] One end of the second baffle is located on the inner wall of the rod near the bottom of the side through hole, and the other end of the second baffle extends obliquely toward the blocking structure. There is a second flow channel between the inner sides of the second baffle away from the inner wall of the rod.

[0057] The second baffle is located on the inner wall of the rod body that is close to the side through hole, so that there is no dead corner for suction. The residue between the second baffle and the inner wall of the rod body can be completely sucked away by the external second vacuum source through the side through hole and vacuum connector.

[0058] Specifically, such as Figure 2 The image shown is a front sectional view of the suction device, as follows: Figure 3 As shown Figure 2 AA section view, Figure 4 This is a top view of the suction device. The suction device in this embodiment includes a rod 21. A first mounting port 27 of the rod 21 is used to mount a suction nozzle. The other end of the rod 21 is a second mounting port 15 for connecting to a first vacuum source. The rod has an internal vacuum cavity. A blocking structure is provided within the vacuum cavity near the second mounting port 15. A side through-hole 26 is provided on the side wall of the rod between the first mounting port 27 and the blocking structure. A vacuum connector 24 is provided on the outer side of the rod 21, surrounding the side through-hole 26. The vacuum cavity inside the rod 21 communicates with the interior of the vacuum connector 24 through the side through-hole 26. The vacuum connector 24 is used to connect to an external second vacuum source. A second baffle 28 is provided on the inner wall of the rod between the side through-hole 26 and the first mounting port 27, and near the side through-hole 26. This baffle 28 extends obliquely towards the blocking structure and surrounds the inner wall of the rod.

[0059] The blocking structure includes a convex structure 25 facing the first mounting port 27 and a first barrier wall 22 located outside the convex structure 25 and extending toward the second barrier wall 28. The convex structure 25 and the first barrier wall 22 constitute the first collecting structure 12.

[0060] A first flow channel 23 is provided between the outer side of the first retaining wall 22 and the inner wall of the rod 21; a second flow channel 14 is provided between the inner side of the second retaining wall 28 away from the inner wall of the rod, and the second mounting port 15 communicates with the first flow channel 23, the second flow channel 14 and the first mounting port 27.

[0061] In this embodiment, the first radial distance between the end of the second baffle near the first collecting structure and the inner wall of the rod is greater than the second radial distance between the position on the convex surface of the convex structure that is on the same radial plane as the end of the first baffle near the second baffle and the inner wall of the rod. However, in other embodiments, the second radial distance may not be the distance between the position on the convex surface of the convex structure that is on the same radial plane as the end of the first baffle near the second baffle and the inner wall of the rod, but may be determined based on the amount of residue that may exist on the surface of a typical chip during the actual absorption process, so as to be able to accommodate the absorbed residue.

[0062] In other embodiments, when the radial distance between the end of the second baffle wall near the first collecting structure and the inner wall of the rod is not fixed, the first radial distance is an average distance. Correspondingly, the first radial distance is also an average distance. When the first radial distance is greater than the second radial distance, it can still be ensured that the residue collected by the first collecting structure can fall into the second baffle wall and be blown out of the vacuum chamber through the side through hole and the vacuum connector.

[0063] like Figure 5As shown, the second retaining wall has a first radial distance b between one end near the blocking structure and the inner wall of the rod, and the convex surface of the convex structure has a second radial distance a between the end of the first retaining wall near the second retaining wall and the inner wall of the rod, wherein the first radial distance b is greater than the second radial distance a.

[0064] Furthermore, to prevent residue sucked away by the vacuum connector from being drawn into the rod body during repeated use of the suction device, the side through-hole 26 is also connected to a one-way valve 29. This one-way valve is used to open or close the side through-hole 26. Specifically, the one-way valve 29 is a one-way valve that can be opened unidirectionally towards the vacuum connector 24. The one-way valve 29 is used to automatically open or close the side through-hole 26 using an external first vacuum source or a second vacuum source. Figure 2-3 Both are in the state when the side through hole is closed, such as Figure 6 The image shows the state when the side through-hole is closed, as shown below. Figure 7 The image shows the state when the side through hole is open.

[0065] In other embodiments, the one-way valve may also be located at the vacuum connector or other positions to open or close the connection between the vacuum connector and an external second vacuum source.

[0066] like Figure 6 and Figure 7 As shown, when it is necessary to pick up the chip, firstly, air is drawn into the second mounting port 15 through an external first vacuum source to create a vacuum, which is... Figure 6 The arrows shown indicate the gas flow direction. While the chip is being sucked up, the residue on the chip surface will enter the rod body through the suction nozzle 16 and the first mounting port 27, and will be blocked by the blocking structure after passing through the second fluid channel. The convex structure of the blocking structure guides the residue into the first collection structure 12 formed by the convex structure and the first baffle. During this process, the external second vacuum source does not evacuate the vacuum connector, and the one-way valve remains in the closed side through-hole state.

[0067] When the chip needs to be released, air is blown into the second mounting port through the first vacuum source to break the vacuum, while a vacuum is simultaneously evacuated from the vacuum connector through the second vacuum source. Figure 7 The middle arrow indicates the gas flow direction. At this time, since the first radial distance b is greater than the second radial distance a, the residue collected by the first collecting structure falls between the second baffle and the inner wall of the rod, and between the second baffle and the inner wall of the side through hole, and is blown out by the vacuum connector due to the vacuum breaking, thereby achieving the effect of removing residue.

[0068] like Figure 7As shown, the connection between the one-way valve and the side through hole is located inside the side through hole on the side side close to the side through hole. The one-way valve and the second baffle wall form a second collection structure 13. When the first vacuum source blows air into the second mounting port and the second vacuum source sucks air into the vacuum connector, the residue collected by the first collection structure falls into the second collection structure 13 and between the second baffle wall and the inner wall of the rod, and is blown out through the vacuum connector.

[0069] The suction device in this embodiment is used to suction chips, and can also be applied to other target objects that can be suctioned by this suction device during the chip packaging process; the residue includes solder dross and other foreign matter residues. In addition, in this embodiment, the geometry formed around the inner wall of the rod can be a cylinder, a cuboid, or other shapes, and the radial direction mentioned in this embodiment refers to the straight line direction perpendicular to the axis of the geometry formed around the inner wall of the rod.

[0070] As one embodiment, both the first and second retaining walls can be plate-shaped structures, and both can be ring-shaped structures, but are not limited to any other structures that can achieve the blocking effect.

[0071] Specifically, such as Figure 4 As shown, the first baffle 22 is a first annular baffle surrounding the outer side of the convex structure 25, so that when the residue enters the rod body 21 through the suction nozzle and the first mounting port 27 and is blown to the baffle structure, it can be completely collected by the first collection structure 12 composed of the convex structure 25 and the first annular baffle; the second baffle 28 is a second annular baffle surrounding the inner wall of the rod body 21, so that the residue falling into the first collection structure composed of the convex structure 25 and the first annular baffle can be completely collected.

[0072] Furthermore, such as Figure 2 As shown, the first barrier wall 22 extends toward the second barrier wall 28 while tilting toward the inner wall of the outer rod, thereby expanding the opening range of the first collecting structure 12 toward the blocking structure.

[0073] In this embodiment, the number of side through holes is at least two, enabling complete collection of residue between the second retaining wall and the inside of the rod. The number of vacuum connectors corresponds to the number of side through holes. As one implementation, at least two side through holes are arranged at equal intervals, such as... Figure 2 As shown, there are two side through holes arranged opposite to each other, and there are also two corresponding vacuum connectors.

[0074] As one embodiment, the convex surface of the convex structure can be a convex arc surface, so that after the residue is blown onto the arc surface, it can move to the first collection structure 12 between the outer side of the convex structure and the first baffle under the action of vacuum.

[0075] Furthermore, the convex structure can be a bowl-shaped structure with a concave opening facing the second mounting port, forming a third collection structure. The reason for this arrangement is that when a vacuum is drawn through the second mounting port, a very small amount of residue may still pass through the first flow channel to the space between the second mounting port and the first vacuum source. When the first vacuum source blows air onto the second mounting port, the residue will fall into the third collection structure for further collection. Subsequently, the very small amount of residue in the third collection structure can be removed simply by performing regular maintenance on the suction device, which is very convenient.

[0076] In another embodiment, the convex structure can be a conical structure, such as a cone, a triangular pyramid, a tetrahedron, etc., or other convex structures.

[0077] In this embodiment, a conduit is connected between the vacuum connector and the second vacuum source. A filter element is installed inside the conduit so that when the residue falls into the second baffle and the vacuum is broken, the residue is blown into the conduit and adsorbed by the filter element.

[0078] The suction device disclosed in this embodiment can automatically collect residues from the chip surface. When the vacuum connector picks up the chip, the residue enters the rod body from the nozzle and the first mounting port and is collected by the blocking structure. When the chip is released, it falls between the second baffle and the inner wall of the rod body and is blown to the outside of the vacuum connector through the side through-hole. This effectively avoids solder dross caused by conventional operations, greatly reducing chip bridging short-circuit failures and vacuum source contamination. For example, during chip mounting, the device can automatically collect the solder dross generated during chip mounting, effectively reducing chip bridging short-circuit failures and vacuum source contamination. The residue is blown from the second collection structure into the solder dross filters on both sides of the vacuum connector, requiring only periodic filter replacement, saving manpower and time costs in machine maintenance. Furthermore, cleaning the suction device at regular intervals can remove a very small amount of solder dross from the third collection structure, which is very convenient.

[0079] The suction device provided in this embodiment solves the risk of residue contamination, effectively improves chip manufacturing yield and reduces costs during the packaging process.

[0080] Accordingly, see Figure 8 The present invention also provides a method of using the suction device described above, comprising the following steps:

[0081] S100, when it is necessary to pick up the chip, the second mounting port is evacuated by the first external vacuum source. Under the vacuum state, the chip is picked up by the suction nozzle installed on the first mounting port. Under the action of evacuating the second mounting port, the residue on the surface of the chip enters the rod body through the suction nozzle and the first mounting port and is collected by the first collection structure.

[0082] S200, when the chip needs to be released, the vacuum of the second mounting port is broken by the first external vacuum source. Under the action of breaking the vacuum of the second mounting port, the residue collected by the first collection structure falls into the second baffle wall. At the same time, the vacuum connector is evacuated by the second external vacuum source. Under the action of evacuating the vacuum connector, the residue that falls into the second baffle wall is sucked away through the side through hole and the vacuum connector.

[0083] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present invention by utilizing the methods and techniques disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the protection scope of the technical solutions of the present invention.

Claims

1. A pick-up device for chip packaging process, characterized in that, include: Rod body; A first mounting port is provided at one end of the rod body, and the first mounting port is suitable for mounting a suction nozzle; A second mounting port is provided at the other end of the rod, and the second mounting port is adapted to be connected to an external first vacuum source; A vacuum cavity is provided inside the rod body; A barrier structure disposed within the vacuum cavity; A side through hole is provided on the side wall of the rod, and the side through hole is located between the first mounting port and the blocking structure; A vacuum connector is provided on the outside of the rod body, and the vacuum connector communicates with the vacuum cavity through the side through hole and is connected to an external second vacuum source; A second baffle wall is provided in the vacuum cavity between the first mounting port and the side through hole; The blocking structure includes a first flow channel and a first collection structure facing the first installation port. The second baffle corresponds to the first collection structure and the side through hole of the blocking structure. The residue collected by the first collection structure falls into the second baffle using the second baffle and is sucked out of the vacuum chamber through the side through hole and vacuum connector. The second retaining wall has a second flow channel, and the first flow channel and the second flow channel enable the first installation port and the second installation port to communicate.

2. The pick-up device for chip packaging process according to claim 1, characterized in that, The first collecting structure includes a convex structure facing the second retaining wall and a first retaining wall located outside the convex structure and extending towards the second retaining wall, with a first flow channel between the outer side of the first retaining wall and the inner wall of the rod.

3. The pick-up device for chip packaging process according to claim 2, characterized in that, The first retaining wall extends toward the second retaining wall while tilting toward the inner wall of the outer pole.

4. The pick-up device for chip packaging process according to claim 2, characterized in that, The convex structure is either a bowl-shaped structure or a cone-shaped structure.

5. The pick-up device for chip packaging process according to claim 2, characterized in that, The first radial distance between the end of the second retaining wall near the first collecting structure and the inner wall of the rod is greater than the second radial distance between the end of the convex structure near the second retaining wall and the inner wall of the rod.

6. The pick-up device for chip packaging process according to claim 1, characterized in that, One end of the second baffle is located on the inner wall of the rod near the bottom of the side through hole, and the other end of the second baffle extends obliquely toward the blocking structure. There is a second flow channel between the inner sides of the second baffle away from the inner wall of the rod.

7. The pick-up device for chip packaging process according to claim 6, characterized in that, The second retaining wall is located on the inner wall of the rod body that is close to the side through hole.

8. The pick-up device for chip packaging process according to claim 2, characterized in that, Both the first retaining wall and the second retaining wall are plate-shaped structures.

9. The pick-up device for chip packaging process according to claim 2, characterized in that, Both the first retaining wall and the second retaining wall are ring structures.

10. The pick-up device for chip packaging process according to claim 9, characterized in that, The first retaining wall is a first annular retaining wall that surrounds the outer side of the convex structure, and the second retaining wall is a second annular retaining wall that surrounds the inner wall of the rod.

11. The pick-up device for chip packaging process according to claim 1, characterized in that, The side through hole is also connected to a one-way valve, which is used to open or close the side through hole.

12. The pick-up device for chip packaging process according to claim 11, characterized in that, The one-way valve is a one-way valve that opens only towards the vacuum connector, and automatically opens or closes the side passage using an external first vacuum source and a second vacuum source.

13. The pick-up device for chip packaging process according to claim 1, characterized in that, The number of side through holes is at least two, and the number of vacuum connectors corresponds to the number of side through holes.

14. The pick-up device for chip packaging process according to claim 13, characterized in that, At least two side through holes are arranged at equal intervals.

15. The pick-up device for chip packaging process according to claim 1, characterized in that, A conduit is connected between the vacuum connector and the external second vacuum source, and a filter element is installed inside the conduit.

16. A method of using the suction device according to any one of claims 1-15, characterized in that, Includes the following steps: When it is necessary to pick up the chip, the second mounting port is evacuated by an external first vacuum source. Under the evacuation state, the chip is picked up by a suction nozzle installed on the first mounting port. Under the action of evacuating the second mounting port, the residue on the surface of the chip enters the rod body through the suction nozzle and the first mounting port and is collected by the first collection structure. When the chip needs to be released, the vacuum of the second mounting port is broken by the first external vacuum source. Under the action of breaking the vacuum of the second mounting port, the residue collected by the first collection structure falls into the second baffle wall. At the same time, the vacuum connector is evacuated by the second external vacuum source. Under the action of evacuating the vacuum connector, the residue that falls into the second baffle wall is sucked away through the side through hole and the vacuum connector.

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