一种基于增材工艺的带有反射杯的LED灯珠封装方法

By laying a transition layer around the LED chip and using additive manufacturing technology to expand the electrode surface to form a reflective cup, the problem of low efficiency in existing LED packaging is solved, achieving high-efficiency production and cost reduction.

CN115832145BActive Publication Date: 2026-07-17SHENZHEN REWO MICRO SEMICON TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN REWO MICRO SEMICON TECH CO LTD
Filing Date
2022-08-31
Publication Date
2026-07-17

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Abstract

本申请提供了一种基于增材工艺的带有反射杯的LED灯珠封装方法，所述方法包括将若干所述LED芯片放置于第一载带表面，并在若干所述LED芯片周侧铺设低于所述LED芯片电极面的过渡层；其中，所述电极面与所述第一载带相对；通过增材制造方式扩展所述LED芯片的电极面得到封装支架电极；去除所述过渡层，将所述封装支架电极压塑成反射杯并进行灌胶封装，切割所述反射杯得到LED灯珠。通过在完成芯片与电极互联后，再进行压塑成型工艺，批量制成反射杯，然后进行点胶封装和烘烤，完成LED封装制作，可大大提高生产效率，缩短制作周期，提升产品的可靠性，降低生产制作成本。
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