Earphone pressure sensing assembly, assembling method thereof and bluetooth earphone

Abstract

The earphone pressure sensing assembly comprises a mounting bracket and a pressure sensor, the pressure sensor is fixedly connected to one surface of the mounting bracket, two side edges of the mounting bracket are formed with mounting portions for being supported on two oppositely arranged side walls in the shell of the earphone and being welded and fixed with the side walls, and the pressure sensor is arranged in a spaced manner with a bottom wall of the shell. Through the technical scheme, the earphone pressure sensing assembly, the assembly method thereof and the Bluetooth earphone provided by the present disclosure can solve the technical problem that the earphone pressure sensing assembly is prone to loosening, displacement and even falling off after being assembled into the shell of the earphone.

Description

Technical Field

[0001] This disclosure relates to the field of Bluetooth headset technology, and in particular to headset pressure-sensitive components and their assembly methods, and Bluetooth headsets. Background Technology

[0002] Bluetooth headphones are simple and convenient to use, making them one of the best choices for headphone users. Bluetooth headphones typically use internal pressure sensors to detect when the headphones are being worn, thus intelligently controlling music playback and pause. The in-ear detection function synchronizes music playback or pause with the wearing or removal of the headphones, making them more intelligent.

[0003] In related technologies, the pressure sensor of Bluetooth earphones is usually glued to the inside of the earphone shell with adhesive. When the Bluetooth earphone is dropped on the ground or after long-term use, the pressure sensor may become loose, shift, or even fall off, causing the Bluetooth earphone's in-ear detection function to fail. Summary of the Invention

[0004] To overcome the problems existing in the related technologies, this disclosure provides a headphone pressure-sensitive component and its assembly method, as well as a Bluetooth headphone.

[0005] According to a first aspect of the present disclosure, an earphone pressure-sensitive assembly is provided, including a mounting bracket and a pressure sensor. The pressure sensor is fixedly connected to one surface of the mounting bracket. Mounting portions are formed on both sides of the mounting bracket for supporting two opposing side walls inside the earphone housing and for welding and fixing to the side walls. The pressure sensor is spaced apart from the bottom wall of the housing.

[0006] Optionally, it also includes a positioning piece removably connected to another surface of the mounting bracket opposite the pressure sensor, the two ends of the positioning piece extending beyond the mounting bracket and having positioning holes at the extended positions, the positioning holes being used to engage with positioning posts within the housing.

[0007] Optionally, the positioning piece and the mounting bracket are attracted to each other by electrostatic attraction or bonded together by adhesive.

[0008] Optionally, the mounting bracket is constructed in a U-shape, the pressure sensor is disposed on the outer side of the bottom of the U-shape, and the mounting portion is formed on the top edge of the U-shape.

[0009] Optionally, the bottom of the U-shaped structure is constructed as a flat plate.

[0010] Optionally, the mounting portion includes a flange extending outward from the top of the U-shaped structure and an engaging tooth extending downward from the end of the flange, the engaging tooth being able to be embedded in the sidewall.

[0011] Optionally, the end of the flange is provided with two engagement teeth, the length of which is 0.2mm-0.4mm.

[0012] According to a second aspect of the present disclosure, a Bluetooth headset is provided, including a housing, wherein the housing is provided with the headset pressure-sensitive component described above.

[0013] Optionally, two opposing sidewalls inside the housing are respectively formed with support bosses, the mounting part is supported on the support bosses and welded to the support bosses.

[0014] Optionally, the thickness of the sidewall is 0.5mm-0.7mm.

[0015] Optionally, the bottom wall of the housing is formed with positioning posts for positioning the pressure-sensitive component.

[0016] According to a third aspect of the present disclosure, a method for assembling a headphone pressure-sensitive component is provided. The pressure-sensitive component includes a mounting bracket and a pressure sensor. The assembly method includes: fixing the pressure sensor to one surface of the mounting bracket; aligning the surface of the mounting bracket where the pressure sensor is disposed with the bottom wall of the housing; welding and fixing the two side edges of the mounting bracket to two opposite side walls inside the headphone housing, and spaced the pressure sensor from the bottom wall of the housing.

[0017] Optionally, the pressure-sensitive component further includes a positioning piece removably connected to the mounting bracket on the other surface opposite to the pressure sensor. The two ends of the positioning piece extend beyond the mounting bracket and positioning holes are formed at the extended positions. The bottom wall is formed with a positioning post for positioning the pressure-sensitive component. The assembly method further includes: inserting the positioning post into the positioning hole before the step of welding and fixing the two side edges of the mounting bracket to the two side walls opposite to the inside of the earphone housing; and removing the positioning piece from the mounting bracket after the step of welding and fixing the two side edges of the mounting bracket to the two side walls opposite to the inside of the earphone housing.

[0018] The technical solutions provided by the embodiments of this disclosure can include the following beneficial effects: In the headphone pressure-sensitive assembly provided by this disclosure, the mounting bracket is welded and fixed to the headphone housing through the mounting part, which can improve the connection reliability between the mounting bracket and the housing, thereby avoiding relative displacement between the pressure sensor and the housing, and ensuring the working stability of the pressure sensor. In addition, the spaced arrangement between the pressure sensor and the bottom wall of the housing can avoid interference of the housing with the signal of the pressure sensor, thereby improving the signal accuracy of the pressure sensor. The Bluetooth headphone provided by this disclosure has the same technical effects as the pressure-sensitive assembly in the above technical solution, and will not be described in detail here to avoid unnecessary repetition. In the assembly method of the headphone pressure-sensitive assembly provided by this disclosure, the mounting bracket is welded and fixed to the opposite side walls inside the headphone housing through the mounting part, which can improve the connection reliability between the mounting bracket and the housing, and also allow the pressure sensor to be spaced apart from the bottom wall of the housing, so as to avoid interference of the housing with the signal of the pressure sensor, thereby improving the signal accuracy of the pressure sensor.

[0019] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0021] Figure 1 This is a front view of an earphone pressure-sensitive component according to an exemplary embodiment.

[0022] Figure 2 This is a bottom view of an earphone pressure-sensitive component according to an exemplary embodiment.

[0023] Figure 3 This is an isometric view of an earphone pressure-sensitive assembly according to an exemplary embodiment, wherein the surface of the mounting bracket on which the pressure sensor is disposed faces upward;

[0024] Figure 4 This is a schematic diagram illustrating the structure of a pressure-sensitive component assembled inside the housing of an earphone according to an exemplary embodiment;

[0025] Figure 5 yes Figure 4 A magnified view of a section at point A in the middle;

[0026] Figure 6 It is along Figure 4 Sectional view of the middle BB line;

[0027] Figure 7 This is a flowchart illustrating an assembly method for a headphone pressure-sensitive component according to an exemplary embodiment.

[0028] Explanation of reference numerals in the attached figures

[0029] 1-Mounting bracket, 11-Mounting part, 111-Flange, 112-Matching tooth, 2-Pressure sensor, 3-Positioning piece, 31-Positioning hole, 4-Housing, 41-Side wall, 411-Supporting boss, 42-Bottom wall, 43-Positioning post. Detailed Implementation

[0030] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. In the following description, when referring to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims. In this disclosure, unless otherwise stated, directional terms such as "inner" and "outer" refer to the inner and outer contours of the corresponding component itself, and "upper" and "lower" can be referred to in the accompanying drawings. Figure 6 The top and bottom of the drawing. The terms "first," "second," etc., used in this disclosure are for distinguishing one element from another and do not indicate order or importance.

[0031] According to a first aspect of the present disclosure, a headphone pressure-sensitive component is provided, with reference to... Figures 1 to 6 As shown, the pressure-sensitive assembly may include a mounting bracket 1 and a pressure sensor 2. The pressure sensor 2 is fixedly connected to one surface of the mounting bracket 1. For example, the pressure sensor 2 is fixed to one surface of the mounting bracket 1 by ultrasonic welding. The two sides of the mounting bracket 1 may form mounting portions 11 for supporting two opposing side walls 41 inside the earphone housing 4 and fixing them to the side walls 41 by ultrasonic welding. The pressure sensor 2 is spaced apart from the bottom wall 42 of the housing 4, that is, the pressure sensor 2 does not contact the bottom wall 42 of the housing 4.

[0032] Through the above technical solution, in the headphone pressure-sensitive assembly provided in this disclosure, the mounting bracket 1 is welded and fixed to the headphone housing 4 via the mounting part 11, which can improve the connection reliability between the mounting bracket 1 and the housing 4, thereby avoiding relative displacement between the pressure sensor 2 and the housing 4, and ensuring the working stability of the pressure sensor 2. In addition, the pressure sensor 2 and the bottom wall 42 of the housing 4 are spaced apart, which can avoid the housing 4 from interfering with the signal of the pressure sensor 2, thereby improving the signal accuracy of the pressure sensor 2.

[0033] refer to Figures 1 to 3As shown, the pressure-sensitive assembly may further include a positioning piece 3 removably connected to the mounting bracket 1 on the other surface opposite the pressure sensor 2. Both ends of the positioning piece 3 extend beyond the mounting bracket 1 and have positioning holes 31 at the extended positions. The positioning holes 31 are used to engage with positioning posts 43 within the housing 4. Specifically, each end of the positioning piece 3 at the extended position beyond the mounting bracket 1 may have a positioning hole 31, meaning the mounting bracket 1 can be located between the two positioning holes 31 of the positioning piece 3. (Refer to...) Figure 4 As shown, when assembling the pressure-sensing component into the housing 4, the positioning pin 43 can be quickly positioned in the assembly position within the housing 4 by inserting it into the corresponding positioning hole 31. This prevents displacement of the pressure-sensing component before the mounting bracket 1 is welded to the side wall 41 of the housing 4, thereby improving assembly efficiency and accuracy and ensuring the consistency of the functional signal of the pressure sensor 2. After the mounting bracket 1 is welded to the housing 4, the positioning piece 3 can be removed to prevent interference between the positioning piece 3 and other components within the housing 4.

[0034] In order to fix the positioning piece 3 to the mounting bracket 1, the positioning piece 3 and the mounting bracket 1 can be attracted to each other by electrostatic attraction or bonded together by adhesive. This ensures the reliability of the connection between the positioning piece 3 and the mounting bracket 1, and also makes it easy to remove the positioning piece 3 from the mounting bracket 1 quickly.

[0035] refer to Figure 3 and Figure 6 As shown, the mounting bracket 1 can be constructed as a U-shaped structure. The pressure sensor 2 can be set on the outer side of the bottom of the U-shaped structure, and the positioning piece 3 can be set on the inner side of the bottom of the U-shaped structure. The mounting part 11 can be formed on the top edge of the U-shaped structure. After the pressure sensing assembly is assembled with the housing 4, the outer side of the bottom of the U-shaped structure faces the bottom wall 42, so that the pressure sensor 2 can face the bottom wall 42 but not contact the bottom wall 42. The positioning piece 3 faces the side of the housing 4 with the opening, so as to facilitate the removal of the positioning piece 3.

[0036] In addition, refer to Figure 3 and Figure 6 As shown, the bottom of the U-shaped structure can be constructed as a flat plate to increase the contact area between the pressure sensor 2 and the positioning plate 3 and the mounting bracket 1. The two side facades of the U-shaped structure can extend upward and outward from the two sides of the bottom respectively.

[0037] refer to Figures 1 to 6As shown, the mounting portion 11 may include a flange 111 extending outward from the top of the U-shaped structure and an engaging tooth 112 extending downward from the end of the flange 111. The flange 111 can be supported on the upper surface of the support boss 411 and fixed relative to the support boss 411 by ultrasonic welding. The engaging tooth 112 can be embedded in the side wall 41. Specifically, the engaging tooth 112 can be embedded in the gap formed between the support boss 411 and the side wall 41 and ultrasonically welded to the gap to increase the contact area between the mounting portion 11 and the housing 4, thereby further improving the connection reliability between the mounting bracket 1 and the housing 4.

[0038] To improve the assembly accuracy of mounting bracket 1, refer to Figures 1 to 5 As shown, each flange 111 has two engaging teeth 112 at its end to ensure that the distance between the two sides of the mounting bracket 1 and the bottom wall 42 is consistent, thereby increasing the signal of the pressure sensor 2. Furthermore, the length of the engaging teeth 112 can be 0.2mm-0.4mm, that is, the length of the engaging teeth 112 embedded in the side wall 41 can be 0.2mm-0.4mm. Preferably, the length of the engaging teeth 112 is 0.3mm, so that the mounting bracket 1 and the housing 4 can withstand a pull-out force of at least 800g.

[0039] According to a second aspect of the embodiments of the present disclosure, a Bluetooth headset is provided, with reference to... Figures 4 to 6 As shown, the Bluetooth headset may include a housing 4, and the housing 4 may contain the headphone pressure-sensitive component described in the above technical solution.

[0040] Through the above technical solution, the Bluetooth headset provided in this disclosure has the same technical effect as the pressure-sensitive component in the above technical solution. To avoid unnecessary repetition, it will not be described in detail here.

[0041] To secure the pressure-sensitive component inside housing 4, refer to Figure 6 As shown, the two opposing sidewalls 41 inside the housing 4 can each form a support boss 411 protruding towards the opposite side. The flange 111 of the mounting part 11 is supported on the upper surface of the support boss 411 and is fixed relative to the support boss 411 by ultrasonic welding. A gap for inserting the engaging tooth 112 can be formed between the support boss 411 and the sidewall 41. The two sides of the engaging tooth 112 are ultrasonically welded to the inner wall of the gap to increase the contact area between the housing 4 and the mounting part 11 and improve the connection reliability between the mounting part 11 and the housing 4.

[0042] In addition, the thickness of the sidewall 41 can be 0.5mm-0.7mm to ensure that the housing 4 has sufficient strength while avoiding the sidewall 41 being too thick and affecting the signal of the pressure sensor 2.

[0043] To position the pressure-sensitive component within housing 4, refer to Figure 4 and Figure 5 As shown, a positioning post 43 for positioning the pressure-sensitive component can be formed on the bottom wall 42 of the housing 4. Specifically, a positioning post 43 can be provided on each side of the support boss 411 for connecting with the mounting bracket 1, so as to correspond to the position of the two positioning holes 31 on the positioning plate 3. In addition, the shape of the cross section of the positioning post 43 can also match the shape of the positioning hole 31 to improve the positioning accuracy.

[0044] According to a third aspect of the present disclosure, a method for assembling a headphone pressure-sensitive component is provided, wherein, with reference to Figures 1 to 6 As shown, the pressure-sensitive assembly may include a mounting bracket 1 and a pressure sensor 2.

[0045] refer to Figure 7 As shown, the assembly method may include:

[0046] S1: Fix the pressure sensor 2 to one surface of the mounting bracket 1;

[0047] S2: Position the surface of the mounting bracket 1 containing the pressure sensor 2 toward the bottom wall 42 of the housing 4;

[0048] S3: Weld and fix the two sides of the mounting bracket 1 to the two side walls 41 that are opposite to the inside of the earphone housing 4, and make the pressure sensor 2 spaced apart from the bottom wall 42 of the housing 4.

[0049] Through steps S1 and S2, the pressure sensor 2 can be positioned so that it faces the bottom wall 42 but does not contact it. In step S3, the two side edges of the mounting bracket 1 can be relatively fixed to the side wall 41 by ultrasonic welding, and during the ultrasonic welding process, the fixture only presses against the two side edges of the mounting bracket 1.

[0050] Through the above technical solution, in the assembly method of the headphone pressure sensing component provided in this disclosure, the mounting bracket 1 is welded and fixed to the headphone housing 4, which can improve the connection reliability between the mounting bracket 1 and the housing 4, and also allow the pressure sensor 2 to be spaced apart from the bottom wall 42 of the housing 4, so as to avoid the housing 4 interfering with the signal of the pressure sensor 2, thereby improving the signal accuracy of the pressure sensor 2.

[0051] In addition, refer to Figures 1 to 3 As indicated, the pressure-sensitive assembly may further include a positioning piece 3 removably connected to the mounting bracket 1 on the other surface opposite the pressure sensor 2. Both ends of the positioning piece 3 extend beyond the mounting bracket 1 and are provided with positioning holes 31 at the extended positions. The bottom wall 42 is formed with positioning posts 43 for positioning the pressure-sensitive assembly. (Reference) Figure 7 As shown, the assembly method may also include:

[0052] Step S30 before step S3: Insert the positioning pin 43 into the positioning hole 31; and step S31 after step S2: Remove the positioning piece 3 from the mounting bracket 1.

[0053] Step S30 positions the pressure-sensitive component within the housing 4 at its designated assembly location. Before the mounting bracket 1 is welded to the side wall 41 of the housing 4, displacement of the pressure-sensitive component is prevented, thus improving assembly efficiency and accuracy and ensuring the consistency of the functional signal of the pressure sensor 2. Step S31 allows the positioning piece 3 to be removed after the mounting bracket 1 is welded to the side wall 41, preventing interference between the positioning piece 3 and other components within the housing 4.

[0054] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of this disclosure. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0055] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A headphone pressure-sensitive component, characterized in that, The device includes a mounting bracket (1) and a pressure sensor (2). The pressure sensor (2) is fixedly connected to one surface of the mounting bracket (1). The mounting bracket (1) has mounting portions (11) formed on both sides of its edges, which are supported on two opposing side walls (41) inside the earphone housing (4) and welded to the side walls (41). The pressure sensor (2) is spaced apart from the bottom wall (42) of the housing (4). The mounting bracket (1) is constructed in a U-shape, the pressure sensor (2) is disposed on the outer side of the bottom of the U-shape, and the mounting part (11) is formed on the top edge of the U-shape. The mounting portion (11) includes a flange (111) extending outward from the top of the U-shaped structure and an engagement tooth (112) extending downward from the end of the flange (111), the engagement tooth (112) being able to be embedded in the sidewall (41).

2. The pressure-sensitive component according to claim 1, characterized in that, It also includes a positioning piece (3) removably connected to the mounting bracket (1) on the other surface opposite to the pressure sensor (2), the two ends of the positioning piece (3) extending beyond the mounting bracket (1) and having positioning holes (31) at the extended positions, the positioning holes (31) being used to cooperate with positioning posts (43) inside the housing (4).

3. The pressure-sensitive component according to claim 2, characterized in that, The positioning piece (3) and the mounting bracket (1) are attracted to each other by electrostatic attraction or bonded together by adhesive.

4. The pressure-sensitive component according to claim 1, characterized in that, The bottom of the U-shaped structure is flat.

5. The pressure-sensitive component according to claim 1, characterized in that, The end of the flange (111) is provided with two engagement teeth (112), the length of which is 0.2mm-0.4mm.

6. A Bluetooth headset, characterized in that, Includes a housing (4), wherein the housing (4) is provided with a pressure-sensitive component as described in any one of claims 1-5.

7. The Bluetooth headset according to claim 6, characterized in that, The housing (4) has two opposing sidewalls (41) with support bosses (411) formed on them respectively. The mounting part (11) is supported on the support bosses (411) and welded to the support bosses (411).

8. The Bluetooth headset according to claim 7, characterized in that, The thickness of the sidewall (41) is 0.5mm-0.7mm.

9. The Bluetooth headset according to claim 6, characterized in that, The bottom wall (42) of the housing (4) is formed with a positioning post (43) for positioning the pressure-sensitive component.

10. A method for assembling a headphone pressure-sensitive component, characterized in that, The pressure-sensitive assembly includes a mounting bracket (1) and a pressure sensor (2). Mounting portions (11) are formed on both sides of the mounting bracket (1). The mounting bracket (1) is constructed in a U-shape, and the mounting portions (11) are formed on the top edge of the U-shape. The mounting portion (11) includes a flange (111) that bends outward from the top of the U-shaped structure and an engagement tooth (112) that bends downward from the end of the flange (111). The assembly method includes: The pressure sensor (2) is fixedly connected to the outside of the bottom of the U-shaped structure; The surface of the mounting bracket (1) on which the pressure sensor (2) is located faces the bottom wall (42) of the housing (4). The engagement tooth (112) is embedded in the side wall (41), and the flange (111) and the engagement tooth (112) are welded and fixed to the two side walls (41) that are opposite to each other inside the earphone housing (4), and the pressure sensor (2) is spaced apart from the bottom wall (42) of the housing (4).

11. The assembly method according to claim 10, characterized in that, The pressure-sensitive component also includes a positioning piece (3) removably connected to the mounting bracket (1) on the other surface opposite to the pressure sensor (2). The two ends of the positioning piece (3) extend beyond the mounting bracket (1) and are provided with positioning holes (31) at the extended positions. The bottom wall (42) is formed with positioning posts (43) for positioning the pressure-sensitive component. The assembly method further includes: Before the steps of embedding the engagement tooth (112) into the sidewall (41) and welding the flange (111) and the engagement tooth (112) to the two opposing sidewalls (41) inside the earphone housing (4), the positioning pin (43) is inserted into the positioning hole (31); and After the steps of embedding the engagement tooth (112) into the side wall (41) and welding and fixing the flange (111) and the engagement tooth (112) to the two side walls (41) that are respectively disposed opposite to each other inside the earphone housing (4), the positioning piece (3) is removed from the mounting bracket (1).

Images