Circuit board, lens driving device, and camera module including the same

Abstract

The circuit board of the embodiment includes an insulating portion and a patterned portion thereon. The insulating portion includes first and second insulating regions spaced apart from each other by an opening region. The patterned portion includes a first terminal portion disposed in a plurality of first side regions adjacent to the opening region in the first insulating region, a second terminal portion disposed in a plurality of second side regions facing the plurality of first side regions in the second insulating region by an opening region, and a connecting portion disposed in the opening region and connecting the first and second terminal portions. The connecting portion includes a plurality of curved portions connecting the first and second terminal portions disposed in the first and second side regions that do not face each other and formed at a plurality of corners in the opening region. The plurality of curved portions are curved in a manner that rotates in the same direction as each other. Each of the first and second terminal portions and the connecting portion includes a metal layer and a surface treatment layer thereon. The metal layer includes a first metal layer and a second metal layer disposed thereon with a different conductivity.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2021-0124377, filed on September 16, 2021, and Korean Patent Application No. 10-2021-0124378, filed on September 16, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments relate to a substrate, and more specifically, to a substrate, a lens driving device, and a camera module including the lens driving device. Background Technology

[0004] With the widespread use of various portable terminals and the commercialization of wireless internet services, consumer demands related to portable terminals have diversified, leading to the installation of various add-on devices in portable terminals.

[0005] A representative example of these add-ons is a camera module that captures images or videos of objects. Furthermore, recent camera modules can perform autofocus (AF), which automatically adjusts the distance between the image sensor and the lens to align the lens in focus.

[0006] In addition, the camera module can perform zoom functions, which increase or decrease the magnification of distant objects through a zoom lens.

[0007] In addition, recently, camera modules have adopted image stabilization (IS) technology to correct or prevent image instability caused by unstable mounting devices or camera movement caused by user movement, vibration or impact. Summary of the Invention

[0008] Technical issues

[0009] The embodiments aim to provide a substrate, a lens driving device, and a camera module including the lens driving device that can improve the driving capability of an image sensor.

[0010] Furthermore, the embodiments aim to provide a substrate including a patterned portion having a multilayer structure, a lens driving device, and a camera module including the lens driving device.

[0011] Furthermore, the embodiments aim to provide a substrate including a patterned portion that satisfies physical properties while having a low resistivity, a lens driving device, and a camera module including the lens driving device.

[0012] Furthermore, the embodiments aim to provide a substrate including a patterned portion that increases the allowable current while also improving the communication speed, a lens driving device, and a camera module including the lens driving device.

[0013] Furthermore, the embodiments aim to provide a substrate including a patterned portion that increases the allowable current while also improving the communication speed, a lens driving device, and a camera module including the lens driving device.

[0014] Technical solution

[0015] A circuit board according to an embodiment includes: an insulating portion; and a patterned portion disposed on the insulating portion, wherein the insulating portion includes a first insulating region and a second insulating region spaced apart from each other, and an opening region is inserted between the first insulating region and the second insulating region; the patterned portion includes: a first terminal portion disposed on a plurality of first side regions of the first insulating region adjacent to the opening region; a second terminal portion disposed on a plurality of second side regions of the second insulating region facing the plurality of first side regions, and the opening region is inserted between the plurality of first side regions and the plurality of second side regions; and a connecting portion disposed on the opening region. The opening region is connected between the first terminal portion and the second terminal portion. The connecting portion includes a plurality of bends that connect the first terminal portion and the second terminal portion located in the first side region and the second side region, which do not face each other, and are formed at a plurality of corners of the opening region. The plurality of bends are bent to rotate in the same direction as each other. Each of the first terminal portion, the second terminal portion, and the connecting portion includes a metal layer and a surface treatment layer disposed on the metal layer. The metal layer includes a first metal layer and a second metal layer. The second metal layer is disposed on the first metal layer and the conductivity of the second metal layer is different from that of the first metal layer.

[0016] In addition, the circuit board also includes a third metal layer, which is disposed between the insulating portion and the first metal layer.

[0017] Furthermore, the conductivity of the second metal layer is greater than that of the first metal layer.

[0018] Furthermore, the surface roughness of the upper surface of the second metal layer is lower than that of the lower surface of the third metal layer.

[0019] In addition, the second metal layer includes a first region that overlaps perpendicularly with the upper surface of the first metal layer and a second region that does not overlap perpendicularly with the upper surface of the first metal layer but overlaps perpendicularly with the side surface of the first metal layer.

[0020] Furthermore, the vertical cross-sectional shape of the first metal layer is different from that of the second metal layer.

[0021] Furthermore, a second metal layer is disposed on the upper surface of the first metal layer, the lower surface of the first metal layer does not contact the second metal layer, and the surface treatment layer includes a portion that contacts the first metal layer and a portion that contacts the second metal layer.

[0022] Furthermore, the second metal layer includes a 2-1 metal layer disposed on the upper surface of the first metal layer and a 2-2 metal layer disposed on the lower surface of the first metal layer, and the surface treatment layer includes a portion in contact with the first metal layer, a portion in contact with the 2-1 metal layer, and a portion in contact with the 2-2 metal layer.

[0023] Furthermore, the vertical cross-sectional shape of the 2-1 metal layer is different from that of the 2-2 metal layer.

[0024] In addition, the thickness of the second metal layer is in the range of 1 μm to 15 μm.

[0025] In addition, the thickness of the 2-2 metal layer is less than the thickness of the 2-1 metal layer.

[0026] Furthermore, at least a portion of the 2-1 metal layer overlaps with the side surface of the 2-2 metal layer in the vertical direction.

[0027] In addition, a second metal layer is disposed on the upper surface, lower surface and side surface of the first metal layer.

[0028] Furthermore, the surface treatment layer is configured to surround the second metal layer and not contact the first metal layer.

[0029] In addition, the thickness of the second metal layer is in the range of 0.5 μm to 4.0 μm.

[0030] Furthermore, the first metal layer has a slope whose width increases from the upper surface of the first metal layer toward the lower surface, and the second metal layer has a slope corresponding to the slope of the first metal layer and is disposed on the side surface of the first metal layer.

[0031] In addition, the surface treatment layer includes at least one of organic materials, inorganic materials, and organic-inorganic composite materials.

[0032] Beneficial effects

[0033] The lens driving device according to an embodiment includes a circuit board for moving an image sensor connected to a sensor section. The circuit board includes an insulating portion and a patterned portion. Furthermore, the patterned portion includes a metal layer and a surface treatment layer formed on the metal layer. In this case, the metal layer may include a first metal layer and a second metal layer. The second metal layer may be configured to address the low conductivity and high resistivity of the first metal layer.

[0034] For example, the second metal layer is formed of a metallic material with high conductivity. Therefore, in this embodiment, the specific resistance can be reduced while lowering the overall conductivity of the patterned portion. Thus, in this embodiment, the allowable current or communication speed of the patterned portion can be increased. Therefore, in this embodiment, a circuit board suitable for a mobile image sensor with a high resolution can be provided.

[0035] Furthermore, in this embodiment, when the patterned portion is formed by the etching process, the second metal layer is etched at the lowest possible etching rate. Therefore, the second metal layer includes a first region that perpendicularly overlaps with the upper surface of the first metal layer and a second region that does not perpendicularly overlap with the upper surface of the first metal layer. Additionally, the second region may perpendicularly overlap with the side surface of the first metal layer and at least a portion of the side surface of the first metal layer. Thus, in this embodiment, by making the width of the second metal layer greater than the width of the upper surface of the first metal layer, the width of the upper and lower surfaces of the patterned portion can be reduced, and the etching factor of the patterned portion can be increased. Therefore, in this embodiment, by reducing the difference between the upper and lower widths of the patterned portion, signal transmission loss can be reduced, and communication performance can be improved.

[0036] Furthermore, in one embodiment, the second metal layer may be disposed only on the upper surface of the first metal layer. In another embodiment, the second metal layer may be disposed on both the upper and lower surfaces of the first metal layer. Therefore, in these embodiments, the conductivity can be increased while further reducing the resistivity of the patterned portion. Consequently, in these embodiments, the allowable current of the patterned portion can be further increased, and the communication speed of the patterned portion can be improved.

[0037] Furthermore, in this embodiment, the thickness of the 2-1 metal layer disposed on top of the first metal layer in the second metal layer is greater than the thickness of the 2-2 metal layer disposed below the first metal layer. This allows for a reduction in the resistivity of the patterned portion while increasing the etching factor.

[0038] In another embodiment, the second metal layer can be configured to completely cover the outer surface of the first metal layer, i.e., the second metal layer is formed on the first metal layer after the first metal layer is etched. Therefore, the second metal layer can be formed on the first metal layer while maintaining the shape of the etched first metal layer. Thus, in this embodiment, the shape of the patterned portion is easily controlled, thereby improving the uniformity of the patterned portion's shape. Furthermore, in this embodiment, since the second metal layer is formed after etching the first metal layer, the second metal layer is not only disposed on the upper surface of the first metal layer, but also on a portion of the side and lower surfaces. Therefore, in this embodiment, the thickness of the second metal layer required to reduce the resistivity of the patterned portion below a certain level can be reduced. Therefore, in this embodiment, as the thickness of the second metal layer increases, the resistivity can be further reduced, and the thickness of the second metal layer required to achieve the target resistivity can be reduced. Thus, in this embodiment, product reliability can be further improved, and the product unit price can be reduced.

[0039] Furthermore, in this embodiment, the surface treatment layer is in contact with the second metal layer during its formation. For example, the first metal layer is covered by the second metal layer, thereby preventing the surface treatment layer from contacting the first metal layer. Therefore, in this embodiment, the stability of the chemical reaction can be ensured, thereby improving the uniformity of the surface treatment layer's structure.

[0040] Furthermore, the surface treatment layer in the embodiments can be a thin film formed by coating an organic material. In this case, the relative permittivity ε of the organic material is... r The value is 3.24. This is significantly lower than the relative permittivity ε of nickel or gold (Au) that constitute the surface treatment layers in the past. r The value of ε. For example, the relative permittivity ε of nickel or gold (Au). r The value is 4 or higher. Therefore, in this embodiment, by forming a surface treatment layer via coating with an organic material, the signal transmission speed of wiring, which is inversely proportional to the relative permittivity, can be improved. Therefore, in this embodiment, the product reliability of the circuit board can be improved.

[0041] Furthermore, the thermal conductivity of the organic material constituting the surface treatment layer in this embodiment is greater than that of conventional nickel or metal layers. Therefore, in this embodiment, the thermal conductivity of the patterned portion including the surface treatment layer can be improved. Recently, heat dissipation has become a major issue in products such as camera modules. That is, various components included in a camera module have difficulty dissipating heat, and efforts are being made to improve heat dissipation. In this case, in this embodiment, during the surface treatment of the patterned portion as described above, the thermal conductivity of the patterned portion can be increased by applying the surface treatment layer via organic coating. Therefore, the heat dissipation of the circuit board can be improved, and furthermore, the heat dissipation of the camera module using the circuit board can be improved.

[0042] Furthermore, in this embodiment, the patterned portion included in the circuit board is one of the components of the first moving portion. That is, the connecting portion constituting the patterned portion can move in multiple directions during the operation of the camera module. For example, the connecting portion, together with the image sensor, can shift or tilt in at least one of the X-axis, Y-axis, and Z-axis directions to autofocus the camera module or prevent camera shake. In this case, the patterned portion included in the circuit board may come into contact with other components during the movement operation described above. Furthermore, when the patterned portion comes into contact with other components, the electrical reliability of the patterned portion may be compromised. In this case, in this embodiment, by forming a surface treatment layer via organic coating of the patterned portion as described above, electrical reliability can be improved. For example, in this embodiment, the conductivity of the surface treatment layer is lower than that of conventional nickel or gold (Au). Therefore, in this embodiment, when the patterned portion comes into contact with other components, the surface treatment layer can perform an insulating function, thereby improving the electrical reliability of the circuit board. Furthermore, in this embodiment, since the surface treatment layer of the patterned portion is formed by organic coating, the electroplating process can be simplified compared to conventional surface treatment layers, and further, the cost of the electroplating process can be reduced. Attached Figure Description

[0043] Figure 1 This is a perspective view of the camera module according to an embodiment.

[0044] Figure 2 yes Figure 1 An exploded perspective view of the lens drive mechanism.

[0045] Figure 3 This is an exploded perspective view of the substrate according to an embodiment.

[0046] Figure 4 This is a view used to describe the layer structure of a circuit board according to an embodiment.

[0047] Figure 5 It is used to describe Figure 4 A view of the layer structure of the metal layer in the patterned section of the comparative example.

[0048] Figure 6 This is a view showing the allowable current and communication speed of the pattern section required based on the size of the image sensor.

[0049] Figure 7 This is a view illustrating the materials used for manufacturing a substrate according to an embodiment.

[0050] Figure 8 This is a view illustrating the layer structure of the metal layer of the patterned portion according to the first embodiment.

[0051] Figure 9 It shows the basis Figure 9A view of an optical microscope photograph of a vertical cross-section of the patterned portion in an actual product of an embodiment.

[0052] Figure 10 This is a view used to describe the layer structure of the metal layer of the patterned portion according to the second embodiment.

[0053] Figure 11 It shows the basis Figure 10 A view of an optical microscope photograph of the vertical cross-section of the patterned section in an actual product.

[0054] Figure 12 This is a view illustrating the layer structure of the metal layer of the patterned portion according to the third embodiment.

[0055] Figure 13 This is a graph showing the resistivity of the patterned portion according to the thickness of the second metal layer, based on the third embodiment.

[0056] Figure 14 This is a view used to describe the layer structure of the metal layer of the patterned portion according to the fourth embodiment.

[0057] Figure 15 This is a view showing a mobile terminal using a camera module according to an embodiment.

[0058] Figure 16 This is an exterior view of a vehicle that includes a vehicle driving assistance device that applies a camera module according to an embodiment. Detailed Implementation

[0059] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0060] However, the spirit and scope of this disclosure are not limited to the portion of the described embodiments, and may be implemented in a variety of other forms, and one or more elements of the embodiments may be selectively combined and substituted within the spirit and scope of this disclosure.

[0061] Furthermore, unless otherwise expressly defined and described, the terms (including technical and scientific terms) used in the embodiments of this disclosure are to be interpreted as having the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms (such as those defined in common dictionaries) are to be interpreted as having the same meaning as they would in the context of the relevant art. Moreover, the terminology used in the embodiments of this disclosure is for describing embodiments and is not intended to limit this disclosure.

[0062] In this specification, unless specifically stated in the wording, the singular form may also include the plural form, and when described as "at least one (or more) of A (and), B, and C", it may include at least one of all combinations that can be combined with A, B, and C. Furthermore, in describing elements of embodiments of this disclosure, terms such as first, second, A, B, (a), and (b) may be used.

[0063] These terms are used only to distinguish an element from other elements, and these terms are not limited to the nature, order, or sequence of the elements. Furthermore, when an element is described as “connected,” “joined,” or “bonded” to another element, it may include not only cases where the element is directly “connected,” “joined,” or “bonded” to the other element, but also cases where the element is “connected,” “joined,” or “linked” to another element through another element between the element and the other element.

[0064] Furthermore, when described as being formed or disposed "above" or "below," "above" or "below" can include not only cases where two elements are directly connected to each other, but also cases where one or more other elements are formed or disposed between the two elements. Additionally, when expressed as "above" or "below," it can include not only an upward direction based on a single element, but also a downward direction based on a single element.

[0065] The configuration of the camera module will be described below with reference to the accompanying drawings.

[0066] Figure 1 This is a perspective view of the camera module according to an embodiment. Figure 2 yes Figure 1 An exploded perspective view of the lens drive mechanism.

[0067] In the following text, reference will be made to Figure 1 and Figure 2 A brief description of the camera module according to an embodiment.

[0068] The camera module may include a lens drive unit 10 and a housing.

[0069] The housing may include a first housing 20 and a second housing 30.

[0070] In addition, the lens driving device 10 may include a fixing part 100, a first moving part 200, a second moving part 300, a guiding member 400, a first elastic member 500, a second elastic member 600, and a substrate 700.

[0071] The substrate 700 can be an intermediate portion. The substrate 700 can be bonded to the first moving portion 200. For example, the substrate 700 can be bonded to the sensor portion 240 of the first moving portion 200. Furthermore, the substrate 700 can electrically connect the fixing portion 100 and the sensor portion 240. Additionally, the substrate 700 can move the sensor portion 240 relative to the fixing portion 100. For example, the substrate 700 can electrically connect the sensor portion 240 to the fixing portion 100 and can elastically support the sensor portion 240 so that the sensor portion 240 can move relative to the fixing portion 100.

[0072] The fixing part 100 can refer to a component whose position is fixed in the lens driving device 10. For example, the position of the fixing part 100 may be fixed during OIS operation or AF operation of the lens driving device 10. The fixing part 100 may be configured to surround the outer side of the first moving part 200. The fixing part 100 may be spaced apart from the first moving part 200. Preferably, the fixing part 100 may be a component whose position is fixed when the first moving part 200 moves during OIS operation of the lens driving device 10. Furthermore, the fixing part 100 may be a component whose position is fixed when the second moving part 300 moves during AF operation of the lens driving device 10. The fixing part 100 may include the main substrate 110, the first frame 120, and the first driving member 130.

[0073] The first moving part 200 can be disposed within the internal space of the fixed part 100. The first moving part 200 can be spaced apart from the fixed part 100 within the internal space of the fixed part 100. The first moving part 200 can move relative to the fixed part 100 within the internal space of the fixed part 100. For example, the first moving part 200 can rotate based on a first axis. For example, the first moving part 200 can perform a yaw motion configured to rotate based on the x-axis corresponding to the first axis. For example, the first moving part 200 can rotate based on a second axis perpendicular to the first axis. For example, the first moving part 200 can perform a pitching motion configured to rotate based on the y-axis corresponding to the second axis. Specifically, the first moving part 200 can be an OIS module for OIS operation. Here, rotation can include tilting or tumbling. The first moving part 200 can include a second frame 210, a sub-frame 220, a second drive member 230, and a sensor part 240.

[0074] The second moving part 300 may be disposed within the internal space of the first moving part 200. The second moving part 300 may move relative to the fixed part 100 and the first moving part 200. For example, the second moving part 300 may move based on a third axis. For example, the second moving part 300 may perform an autofocus operation configured to move along the z-axis (or optical axis) corresponding to the third axis. Specifically, the second moving part 300 may be an AF module for AF operation. The second moving part 300 may include a third frame 310, a lens 320, and a third drive member 330.

[0075] The guide member 400 may be a rolling member. For example, the guide member 400 may include a plurality of balls. The guide member 400 may be disposed between the fixed portion 100 and the first moving portion 200. The guide member 400 may guide the first moving portion 200 to move relative to the fixed portion 100. The guide member 400 may include an upper guide member 410 and a lower guide member 420.

[0076] The first elastic member 500 may be a pressure member. The first elastic member 500 may correspond to the guide member 400. The number of the first elastic member 500 may correspond to the number of balls constituting the guide member 400. The first elastic member 500 may be disposed on the fixing portion 100. The first elastic member 500 may press against the guide member 400. Specifically, the first elastic member 500 may include an engagement region that engages with the fixing portion 100 and a contact region that extends from the engagement region and contacts the guide member 400. Furthermore, the contact region of the first elastic member 500 may have elasticity, thus allowing the guide member 400 to be pressed in the z-axis direction. The first elastic member 500 may include a first upper elastic member 510 and a first lower elastic member 520.

[0077] The second elastic member 600 can elastically engage the second movable part 300 with the first movable part 200. For example, the second elastic member 600 can elastically support the second movable part 300 relative to the first movable part 200, allowing the second movable part 300 to move within the internal space of the first movable part 200. Therefore, in the state where the second movable part 300 is elastically engaged with the first movable part 200, the second movable part 300 can move along the z-axis direction corresponding to the optical axis by the elastic force of the second elastic member 600. The second elastic member 600 may include a second upper elastic member 610 and a second lower elastic member 620.

[0078] The substrate 700 can electrically connect the fixing portion 100 and the first moving portion 200. In this case, the substrate 700 can be elastically connected, allowing the first moving portion 200 to move relative to the fixing portion 100. The substrate 700 may include a "patterned portion" that elastically bends when the first moving portion 200 moves while the fixing portion 100 is electrically connected to the first moving portion 200. For example, the substrate 700 may be referred to as an "intermediate portion" disposed between the fixing portion 100 and the sensor portion 240 of the first moving portion 200. For example, the substrate 700 may be referred to as a "sensor moving substrate" that enables the sensor portion 240 of the first moving portion 200 to move relative to the fixing portion 100.

[0079] Figure 3 This is an exploded perspective view of the substrate according to an embodiment. (Refer to...) Figure 3 A substrate 700 and its electrical connection structure according to an embodiment are described.

[0080] The insulating portion 710 may include a first insulating region 711 and a second insulating region 712. An opening region 713 may be formed between the first insulating region 711 and the second insulating region 712. For example, the opening region 713 may be formed around the entire periphery of the first insulating region 711.

[0081] As another example, the opening region 713 may be partially formed in a localized area surrounding the first insulating region 711. When the opening region 713 is partially formed, it may perpendicularly overlap with the connecting portion 721-3 of the first patterned portion 721. For example, the connecting portion 721-3 of the first patterned portion 721 may be configured to fly over the opening region 713. Furthermore, since the opening region 713 is not formed in an area that does not perpendicularly overlap with the connecting portion 721-3 of the first patterned portion 721, the first insulating region 711 and the second insulating region 712 may be connected to each other.

[0082] The insulating portion 710 may include a first insulating region 711 and a second insulating region 712, with an opening region 713 positioned between the first insulating region 711 and the second insulating region 712. For example, the second insulating region 712 may be positioned around the outer side of the first insulating region 711, with the opening region 713 positioned between the first insulating region 711 and the second insulating region 712. Each of the first insulating region 711 and the second insulating region 712 may have a rectangular shape, but the embodiments are not limited thereto. For example, the first insulating region 711 may be circular, elliptical, or polygonal, and the second insulating region 712 may have a shape corresponding to the shape of the first insulating region 711.

[0083] The first insulating region 711 may correspond to the sensor section 240, and the second insulating region 712 may correspond to the main substrate 110. For example, the first insulating region 711 may overlap with the sensor section 240 along the optical axis, and the second insulating region 712 may overlap with the main substrate 110 along the optical axis.

[0084] The first insulating region 711 and the second insulating region 712 can be separated from each other. Here, separation of the first insulating region 711 and the second insulating region 712 can mean that there is no other insulating region between the first insulating region 711 and the second insulating region 712. In an embodiment, with the first insulating region 711 and the second insulating region 712 separated from each other, the first insulating region 711 and the second insulating region 712 can be positioned at a distance from each other. Therefore, the embodiment can improve the mobility of the lens driving device. Here, the mobility of the lens driving device can include tilting characteristics based on the x-axis, y-axis, and z-axis, and displacement characteristics along the x-axis, y-axis, and z-axis directions. Specifically, in an embodiment, the first insulating region 711, which is connected to the sensor section 240 as the first moving part, and the second insulating region 712, which is connected to the main substrate 110 as the fixing part, are separated from each other. Therefore, the intensity of the driving force required to move the first moving part can be reduced, and the first insulating region 711 can move freely together with the first moving part without being interfered with by the second insulating region 712.

[0085] The patterned portion 720 may include a conductive metal material. For example, the first patterned portion 721 and the second patterned portion 722 may be formed of the same conductive metal material. However, the embodiment is not limited to this, and the first patterned portion 721 and the second patterned portion 722 may include different metal materials. However, in this embodiment, to simplify the manufacturing process, the first patterned portion 721 and the second patterned portion 722 are formed of the same metal material. Therefore, in the embodiment, the first patterned portion 721 and the second patterned portion 722 may be formed simultaneously by an electroplating process or an etching process.

[0086] The patterned portion 720 of the embodiment may have a multilayer structure. For example, the patterned portion 720 may include a metal layer and a surface treatment layer. The metal layer of the patterned portion 720 may include a metal layer of the rolled material constituting the patterned portion 720. For example, the metal layer of the patterned portion 720 may include an alloy layer of the rolled material as described above. For example, the metal layer constituting the patterned portion 720 may include a copper alloy layer, which includes copper as the rolled material.

[0087] When a surface treatment layer is not formed on the surface of the metal layer of the patterned portion 720, oxidation or discoloration of the exposed surface of the patterned portion 720 may occur, thereby degrading electrical reliability. Therefore, in an embodiment, a surface treatment layer may be formed on the metal layer of the patterned portion 720 to protect the surface of the metal layer of the patterned portion 720.

[0088] The surface treatment layer may be an electroless nickel-palladium immersion gold (ENEPIG) layer comprising electroless nickel / electroless palladium / substituted gold. Alternatively, the surface treatment layer may consist only of a gold (Au) layer. Alternatively, the surface treatment layer may be an electroless nickel-palladium immersion gold (ENIG) layer comprising electroless nickel / substituted gold. Alternatively, the surface treatment layer may be an organic coating. Preferably, in an embodiment, the surface treatment layer is configured as an organic coating.

[0089] Specifically, the embodiment enables the formation of a surface treatment layer by coating an organic material onto the metal layer of the patterned portion 720. However, when the surface treatment layer includes nickel, it is difficult to control the phosphorus concentration in the nickel plating bath, resulting in deterioration of processability. Furthermore, when the phosphorus concentration in the nickel plating bath is not properly controlled, nickel oxidation occurs, leading to a black pad phenomenon where the surface of the patterned portion 720 turns black. In this case, gold (Au) plating is not properly performed on the areas where the black pad phenomenon occurs. Therefore, when the patterned portion 720 is used as a chip mounting pad, it is difficult to perform normal gold (Au) plating, resulting in deterioration of chip bonding performance.

[0090] Furthermore, when the surface treatment layer contains nickel, signal interference occurs in the high-frequency band due to the magnetism of nickel, thus degrading the electrical reliability of the patterned portion 720. Therefore, in this embodiment, an organic material is used instead of a material such as nickel or gold (Au) to form the surface treatment layer of the patterned portion 720.

[0091] In this case, in the embodiment, the surface treatment layer of the patterned portion 720 is preferably formed as an organic coating rather than a nickel-containing metal layer, thereby improving the electrical properties of the patterned portion 720.

[0092] The first patterned portion 721 can electrically connect the main substrate 110 and the sensor portion 240, and can move the first moving portion 200 relative to the fixed portion 100. For this purpose, the first patterned portion 721 can be elastic. The first patterned portion 721 may include an alloy layer formed of an alloy containing copper (Cu). For example, the first patterned portion 721 may be a binary alloy containing at least one of titanium (Ti), nickel (Ni), tin (Sn), beryllium (Be), and cobalt (Co) in copper (Cu), and may be a ternary alloy containing at least two of them. For example, the first patterned portion 721 may include an alloy layer containing nickel and copper.

[0093] However, the embodiments are not limited thereto. The first patterned portion 721 may include an alloy such as iron (Fe), nickel (Ni), zinc, etc., which has elasticity that can be used as a spring and good electrical properties.

[0094] Specifically, the first patterned part 721 may have a feature value of a certain level or higher that will not be destroyed even when the first moving part 200 moves.

[0095] For example, the first pattern section 721 may have 500 N / mm. 2 Above, 800N / mm 2 Above, 1000N / mm 2 Or 1400N / mm 2 The above tensile strength. For example, the first patterned portion 721 can have 500 N / mm. 2 Above, 800N / mm 2 Above, 1000N / mm 2 Above, or 1400 N / mm 2 The above is 0.2% offset yield strength.

[0096] Meanwhile, the first patterned portion 721 includes a surface that contacts the first insulating region 711 and the second insulating region 712. For example, a portion of the lower surface of the first terminal portion 721-1 and a portion of the second terminal portion 721-2 of the first patterned portion 721 may contact the first insulating region 711 and the second insulating region 712. In this case, the physical reliability and / or electrical reliability of the substrate 700 can be determined based on the roughness of the contact surfaces.

[0097] In this case, when the average roughness Ra of the centerline of the contact surface is in the range of 0.025 μm to 0.035 μm and / or the average roughness of 10 points is in the range of 0.3 μm to 0.5 μm, the first patterned portion 721 may detach from the insulating portion 710.

[0098] In an embodiment, the surface of the first patterned portion 721 may have a centerline average roughness Ra in the range of 0.05 μm to 0.5 μm, 0.05 μm to 0.2 μm, or 0.08 μm to 0.15 μm. For example, in an embodiment, the surface of the first patterned portion 721 may have a 10-point average roughness Rz in the range of 0.6 μm to 5 μm, 0.7 μm to 3.0 μm, or 1.0 μm to 2.5 μm.

[0099] The first pattern portion 721 may include: a first terminal portion 721-1 connected to a pad (not shown) of the sensor portion 240; a second terminal portion 721-2 connected to a pad (not shown) of the main substrate; and a connecting portion 721-3 connecting the first terminal portion 721-1 and the second terminal portion 721-2. In this case, the first terminal portion 721-1, the second terminal portion 721-2, and the connecting portion 721-3 are distinguished only for the purpose of configuration description; in reality, they may be integrally formed with each other.

[0100] The first terminal portion 721-1 may be formed in each of the first outer regions of the first insulating region 711. Furthermore, at least a portion of the first terminal portion 721-1 may be exposed through each of the first terminal openings in the first insulating region 711.

[0101] Meanwhile, the connecting part 721-3 can be connected between the first terminal part 721-1 and the second terminal part 721-2.

[0102] In the first insulating region 711 and the second insulating region 712, the connecting portion 721-3 may not have a structure in which the first terminal portion and the second terminal portion disposed in the side regions facing each other are connected to each other. However, the connecting portion 721-3 may have a structure in which the first terminal portion and the second terminal portion disposed in the side regions that do not face each other are connected to each other.

[0103] The connecting portion 721-3 may not overlap with the insulating portion 710 in the optical axis direction. For example, the connecting portion 721-3 may be configured to span the opening region 713 of the insulating portion 710. Here, "spanning" may mean that the connecting portion 721-3 does not contact other configurations of the substrate on the opening region 713.

[0104] Therefore, the embodiment can improve the mobility of the first moving part 200 by means of the connecting part 721-3. That is, the embodiment can improve the elasticity of the connecting part 721-3 to improve the mobility of the first moving part 200.

[0105] The connecting portion 721-3 of the embodiment includes multiple connecting portions connecting between multiple first terminal portions 721-1 and multiple second terminal portions 721-2. Furthermore, each of the multiple connecting portions includes a curved portion disposed at a different corner of the opening region 713. In this case, the curved portions of the multiple connecting portions can bend and extend in the same direction as each other, which is the direction of rotation. Therefore, according to the embodiment, the reliability of the connecting portion 721-3 can be improved, and further, the mobility of the lens driving device to the first moving portion 200 can be improved.

[0106] For example, when the bent portions of multiple connecting parts bend in different directions as the rotation direction, the forces acting on each connecting part may differ as the first moving part 200 moves, thus potentially deteriorating the mobility of the first moving part 200. Furthermore, when the bent portions of multiple connecting parts bend in different directions as the rotation direction, the force may concentrate on a specific connecting part, potentially causing the connecting part with concentrated force to break earlier than other connecting parts.

[0107] On the other hand, in this embodiment, when the first moving part 200 moves, by bending the curved portions of the plurality of connecting parts in the same direction as each other as the direction of rotation, the force acting on each connecting part can be evenly distributed. Therefore, the mobility of the first moving part 200 can be improved. Furthermore, this embodiment solves the problem of a particular connecting part breaking first by evenly distributing the force acting on each connecting part as described above. Moreover, even if a connecting part breaks, all connecting parts break simultaneously, thus the first moving part 200 can have strong anti-tilting characteristics.

[0108] The connecting portion 721-3 may not be supported by the first insulating region 711 and the second insulating region 712. For example, the connecting portion 721-3 may include a portion that does not overlap with the first insulating region 711 and the second insulating region 712 in the optical axis direction. Specifically, the curved portion of the connecting portion 721-3 may not overlap with the first insulating region 711 and the second insulating region 712 in the optical axis direction.

[0109] Meanwhile, in the embodiments, the number of first terminal portions 721-1, second terminal portions 721-2, and connecting portions 721-3 can be the same. For example, the first terminal portions 721-1, second terminal portions 721-2, and connecting portions 721-3 can be connected to each other in a 1:1 ratio. In the embodiments, making the number of first terminal portions 721-1, the number of second terminal portions 721-2, and the number of connecting portions 721-3 equal can improve the mobility of the first moving part 200. For example, when the first terminal portions, second terminal portions, and connecting portions are concentrated in a specific area, or when the number of first terminal portions, second terminal portions, and connecting portions in a specific area is greater than the number in another area, a difference may occur between the amount of movement in the concentrated area and the amount of movement in the less concentrated area, and therefore, the mobility of the first moving part 200 may deteriorate. In contrast, in this embodiment, the first terminal portion 721-1, the second terminal portion 721-2, and the connecting portion 721-3 are arranged in the four first side regions of the first insulating region 711, the four second side regions of the second insulating region 712, and the four corners of the opening region 713. Therefore, the mobility of the first moving part 200 can be improved, thereby improving the reliability of operation.

[0110] Meanwhile, the total number of first terminal portions 721-1, the total number of second terminal portions 721-2, and the total number of connecting portions 721-3 can correspond to the number of channels for signals exchanged between the main substrate 110 and the sensor portion 240. For example, the number of communication channels between the main substrate 110 and the sensor portion 240 can be 32, but the embodiment is not limited to this.

[0111] The thickness of the first patterned portion 721 can be from 20 μm to 80 μm. For example, the thickness of the first patterned portion 721 can be from 25 μm to 75 μm. For example, the thickness of the first patterned portion 721 can be from 30 μm to 70 μm.

[0112] When the thickness of the first patterned portion 721 is less than 20 μm, the first patterned portion 721 may easily break when the first moving portion 200 moves. Furthermore, when the thickness of the first patterned portion 721 is greater than 80 μm, the elasticity of the connecting portion 721-3 may decrease, thereby hindering the movement of the first moving portion 200. For example, when the thickness of the first patterned portion 721 is greater than 80 μm, the reduced elasticity may increase the driving force required for the first moving portion 200 to move, thus increasing power consumption. Therefore, in this embodiment, the thickness of the first patterned portion 721 can be within the range of 35 μm ± 5 μm, so that the first moving portion 200 can move stably.

[0113] The length of the connecting portion 721-3 can be at least 1.5 times the width of the opening region 713. Furthermore, the length of the connecting portion 721-3 can be less than 20 times the width of the opening region 713. In this case, the width of the opening region 713 can be 1.5 mm. When the length of the connecting portion 721-3 is less than 1.5 times the width of the opening region 713, the mobility of the first moving part 200 may deteriorate due to the reduced elasticity of the connecting portion 721-3. Furthermore, when the length of the connecting portion 721-3 is greater than 20 times the width of the opening region 713, the resistance increases as the signal transmission distance increases due to the connecting portion 721-3; therefore, the signal transmitted through the connecting portion 721-3 may include noise.

[0114] Simultaneously, the main substrate 110 is electrically connected to the first terminal portion 721-1 of the substrate 700, and the sensor portion 240 is electrically connected to the second terminal portion 721-2 of the first patterned portion 721 of the substrate 700. In this case, the connecting portion 721-3 can be provided between the first terminal portion 721-1 and the second terminal portion 721-2 to electrically connect the first terminal portion 721-1 and the second terminal portion 721-2 while having elasticity. Therefore, the main substrate 110 and the sensor portion 240 can be electrically connected to each other. The first moving portion 200 constituting the sensor portion 240 can be rotated based on the x-axis or y-axis by the elasticity of the connecting portion 721-3. At the same time, the sensor portion 241 can be electrically connected to the third drive member 330.

[0115] Figure 4 This is a view used to describe the layer structure of a circuit board according to an embodiment.

[0116] Reference Figure 4 The pattern portion 720 may include a first pattern portion 721 and a second pattern portion 722.

[0117] The first pattern portion 721 may include a first terminal portion 721-1, a second terminal portion 721-2, and a connecting portion 721-3. The second pattern portion 722 may be a reinforcing pattern portion and / or a dummy pattern portion. The second pattern portion 722 may include a 2-1 pattern portion 722-1 and a 2-2 pattern portion 722-2.

[0118] The first pattern portion 721 and the second pattern portion 722 can be formed simultaneously and can have the same material and the same layer structure. However, the embodiments are not limited to this, and the first pattern portion 721 and the second pattern portion 722 can have different layer structures.

[0119] The first terminal portion 721-1, the second terminal portion 721-2, the connecting portion 721-3, the 2-1 pattern portion 722-1, and the 2-2 pattern portion 722-2 may each include a metal layer and a surface treatment layer.

[0120] The first terminal portion 721-1 of the first pattern portion 721 may include a first metal layer 721-11 disposed on the first insulating region 711. In addition, the first terminal portion 721-1 may include a surface treatment layer 721-12 disposed on the first metal layer 721-11.

[0121] Furthermore, the second terminal portion 721-2 of the first pattern portion 721 may include a first metal layer 721-21 and a surface treatment layer 721-22. Furthermore, the connecting portion 721-3 of the first pattern portion 721 may include a first metal layer 721-31 and a surface treatment layer 721-32. Furthermore, the 2-1 pattern portion 722-1 may include a first metal layer 722-11 and a surface treatment layer 722-12. Furthermore, the 2-2 pattern portion 722-2 may include a first metal layer 722-21 and a surface treatment layer 722-22.

[0122] The first metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 of each of the first patterned portion 721 and the second patterned portion 722 can be alloy layers made of rolled material. For example, the first metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 of each of the first patterned portion 721 and the second patterned portion 722 can be copper alloy layers made of rolled material. However, the surface roughness of the first metal layer made of rolled material may be relatively low, and therefore, the bonding strength with the insulating portion may deteriorate. Therefore, the metal layers of the first patterned portion 721 and the second patterned portion 722 may further include third metal layers 721-13, 721-23, 721-33, 722-13, and 722-23. The third metal layers 721-13, 721-23, 721-33, 722-13, and 722-23 can be disposed on the lower surface of the first metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. The third metal layers 721-13, 721-23, 721-33, 722-13, and 722-23 can be used to improve the adhesion between the first metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 and the insulating portion.

[0123] Meanwhile, the third metal layers 721-13, 721-23, 721-33, 722-13, and 722-23 can be selectively omitted. Therefore, in one embodiment, each of the metal layers of the first patterned portion 721 and the second patterned portion 722 may include only the first metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. Furthermore, in another embodiment, each of the metal layers of the first patterned portion 721 and the second patterned portion 722 may include the first metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 and the third metal layers 721-13, 721-23, 721-33, 722-13, and 722-23. Therefore, the metal layers described below may include only the first metal layers 721-11, 721-21, 721-31, 722-11 and 722-21, and unlike that, the metal layers described below may include all of the first metal layers 721-11, 721-21, 721-31, 722-11 and 722-21 and the third metal layers 721-13, 721-23, 721-33, 722-13 and 722-23.

[0124] Meanwhile, the first patterned portion 721 and the second patterned portion 722 may include surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2. Surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 may be disposed on the first metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. Furthermore, surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 can be disposed on the first metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 and the third metal layers 721-13, 721-23, 721-33, 722-13, and 722-23. Surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 can include organic materials.

[0125] Surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 may comprise non-conductive organic materials. However, the embodiments are not limited thereto, and surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 may comprise any of organic materials, inorganic materials, and composite materials thereof with low conductivity.

[0126] In this case, the organic materials constituting the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 as described above may have a relative permittivity ε. In this case, the relative permittivity ε may affect the transmission speed v of the signal transmitted through the patterned portion 720. For example, the signal transmission speed v can be determined by the following Equation 1.

[0127] [Equation 1]

[0128]

[0129] Here, v corresponds to the signal transmission speed, ε corresponds to the relative permittivity of the material constituting the pattern section 720, C corresponds to the speed of light, and K is an integer.

[0130] Here, the relative permittivity ε of surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 can be 3.24. This can be a value significantly smaller than the relative permittivity ε of nickel or gold (Au). For example, the relative permittivity ε of nickel or gold (Au) can be 4 or higher. Therefore, in this embodiment, the signal transmission speed v can be improved by including organic materials in surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2. Therefore, in this embodiment, the product reliability of the circuit board can be improved.

[0131] Furthermore, in the embodiments, the thermal conductivity of the organic materials constituting surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 can be greater than that of nickel and copper. Therefore, in the embodiments, the thermal conductivity of the patterned portion 720 can be improved. Recently, heat dissipation has become a major problem in products such as camera modules. That is, the various components included in a camera module do not easily dissipate heat, and therefore, efforts are being made to improve heat dissipation. In this case, in the embodiments, the thermal conductivity of the patterned portion 720 can be improved by using organic materials with high thermal conductivity to form the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2. Therefore, the embodiments can improve the heat dissipation of the camera module on the circuit board and the application circuit board.

[0132] Furthermore, in this embodiment, the patterned portion 720 included in the circuit board is one of the components of the first moving portion. That is, during operation of the camera module, the connecting portion 721-3 constituting the patterned portion 720 can move in multiple directions. For example, the connecting portion 721-3, together with the image sensor (not shown) constituting the sensor portion 240, can be shifted or tilted in at least one of the X-axis, Y-axis, and Z-axis directions to autofocus the camera module or prevent camera shake. In this case, during the moving operation as described above, the patterned portion 720 included in the circuit board may come into contact with other components. Furthermore, when the patterned portion 720 comes into contact with other components, the electrical reliability of the patterned portion 720 may be compromised. In this case, in this embodiment, by forming surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 through organic coating of the patterned portion 720 as described above, the electrical reliability can be improved. For example, in this embodiment, the conductivity of surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 is lower than that of conventional nickel or gold (Au). Therefore, in this embodiment, when the patterned portion 720 comes into contact with other components, the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 can perform an insulating function, thereby improving the electrical reliability of the circuit board. Furthermore, in this embodiment, since the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 of the patterned portion 720 are formed by organic coating, the electroplating process can be simplified compared to conventional surface treatment layers. In addition, the cost of the electroplating process can be reduced.

[0133] Meanwhile, the surface treatment layers 721-12, 721-22, 721-32, 722-12 and 722-2 can be disposed on the outer surface of the first metal layers 721-11, 721-21, 721-31, 722-11 and 722-21 and / or the third metal layers 721-13, 721-23, 721-33, 722-13 and 722-23 that do not contact the insulating portion.

[0134] The upper and side surfaces of the outer surface of the metal layer of the first terminal portion 721-1 may not contact the first insulating region 711. Therefore, the surface treatment layer 721-12 of the first terminal portion 721-1 may be integrally disposed on the upper and side surfaces of the metal layer of the first terminal portion 721-1. Furthermore, the lower surface of the outer surface of the metal layer of the first terminal portion 721-1 may partially contact the first insulating region 711. Therefore, a portion of the lower surface of the metal layer of the first terminal portion 721-1 may contact the first insulating region 711, and the remaining portion may contact the surface treatment layer 721-12.

[0135] The upper and side surfaces of the outer surface of the metal layer of the second terminal portion 721-2 may not contact the second insulating region 712. Therefore, the surface treatment layer 721-22 of the second terminal portion 721-2 may be integrally disposed on the upper and side surfaces of the metal layer of the second terminal portion 721-2. Furthermore, the lower surface of the outer surface of the metal layer of the second terminal portion 721-2 may partially contact the second insulating region 712. Therefore, a portion of the lower surface of the metal layer of the second terminal portion 721-2 may contact the second insulating region 712, while the remaining portion may contact the surface treatment layer 721-22.

[0136] The outer surface of the metal layer of the connector 721-3 may not be in complete contact with the insulating portion 710. Therefore, the upper, side, and lower surfaces of the outer surface of the metal layer of the connector 721-3 can be completely covered by the surface treatment layer 721-32. Thus, the surface treatment layer 721-32 of the connector 721-3 can also perform the insulation function of the connector 721-3 when the image sensor moves, thereby improving the electrical reliability of the circuit board.

[0137] Simultaneously, the lower surface of the outer surface of each of the pattern portions 722-1 (2-1) and 722-2 (2-2) can fully contact the insulating portion 710. Furthermore, the upper and side surfaces of the outer surface of each of the pattern portions 722-1 and 722-2 (2-2) can be in contact with the insulating portion 710. Therefore, the surface treatment layers 722-12 and 722-22 of the pattern portions 722-1 and 722-2 can contact the side and upper surfaces of the pattern portions 722-1 and 722-2 (2-1) but not the lower surfaces of the pattern portions 722-1 and 722-2 (2-2).

[0138] Surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 can have a thickness ranging from 0.1 μm to 10 μm. For example, surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 can have a thickness ranging from 0.15 μm to 8 μm. For example, surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 can have a thickness ranging from 0.2 μm to 5 μm. When the thickness of surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 is less than 0.1 μm, there is a possibility that a uniform surface treatment layer may not be formed on the surface of the patterned portion 720. That is, when the thickness of surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 is less than 0.1 μm, there may be a problem that the surface treatment layer may not be provided on a portion of the surface of the patterned portion 720, and oxidation may occur in the areas where the surface treatment layer is not provided. Furthermore, when the thickness of surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 exceeds 10 μm, there is a problem that the resistance increases with the thickness of the patterned portion 720, thus increasing signal loss. Moreover, when the thickness of surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 exceeds 10 μm, there is a problem that the cost of coating for forming the surface treatment layer increases.

[0139] Meanwhile, when the metal layer of the patterned portion only includes the first metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 and the third metal layers 721-13, 721-23, 721-33, 722-13, and 722-23, the electrical characteristics of the patterned portion may deteriorate. Therefore, the metal layer of the patterned portion in this embodiment further includes a second metal layer that contacts at least a portion of the outer surface of the first metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. Furthermore, depending on the arrangement structure of the second metal layer, the embodiments can be classified into various embodiments.

[0140] First, there is the issue of excluding the second metal layer when describing the metal layer of the patterned area.

[0141] Figure 5 It is used to describe Figure 4 A view of the layer structure of the metal layer in the patterned portion of the comparative example; Figure 6 This is a view showing the allowable current and communication speed of the pattern section required based on the size of the image sensor.

[0142] Reference Figure 5 and Figure 6 In the comparative example, the metal layer of the patterned portion includes a first metal layer 810 and a third metal layer 820. The first metal layer 810 may refer to first metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. Furthermore, the third metal layer 820 may refer to third metal layers 721-13, 721-23, 721-33, 722-13, and 722-23.

[0143] Figure 5 A is a view showing the vertical cross-sectional shape of the patterned portion of the comparative example. Figure 5 B is a view of an optical microscope photograph showing a vertical cross-section of the patterned portion in the actual product of the comparative example.

[0144] The characteristics of the first metal layer 810 are shown in Table 1 below.

[0145] Table 1

[0146] category characteristic Ingredients (wt%) Ti 2.9wt%~3.5wt% Tensile strength [MPa] 1400(1300～1600) Yield strength [MPa] 1300 Elongation [%) 1.5 Vickers hardness [Hv] 400(350～450) Young's modulus [Pa] 127k <![CDATA[Density [g / cm 3 > 8.7 conductivity 10% IACS Resistivity [nΩ·m] 172 Thermal conductivity [W / m·K] 47

[0147] The first metal layer 810 can have very low conductivity. For example, as shown in Table 1, the conductivity of the first metal layer 810 in the comparative example is about 10% of that of pure copper. Therefore, the first metal layer 810 in the comparative example cannot be used in a high-resolution image sensor due to its low conductivity. In other words, the allowable current and signal communication speed of the patterned portion used for signal transmission are proportional to the conductivity; therefore, the low conductivity of the first metal layer 810 may degrade the electrical characteristics, including allowable current and communication speed.

[0148] For example, refer to Figure 6 It can be seen that as the size of the image sensor increases, the required allowable current and communication speed (e.g., data transfer rate) also increase.

[0149] In addition, since the first metal layer 810 has low conductivity, the resistivity per unit area (3cm*3cm) is 17.29μΩ*cm, and it can be seen that the resistivity of the first metal layer 810 is much higher than that of pure copper.

[0150] On the other hand, when etching for pattern formation is performed while the first metal layer 810 and the third metal layer 820 are formed, the uppermost part of the first metal layer 810 is etched first, and the third metal layer 820 is etched last. Therefore, in the comparative example, since the third metal layer 820 and the first metal layer 810 have similar etching rates, the upper part of the first metal layer 810 is etched the most, and the lower part of the third metal layer 820 is etched the least.

[0151] Therefore, as Figure 5 and Figure 6 As shown, the patterned portion 720 of the comparative example may have an inclination that gradually decreases in width from its upper surface to its lower surface.

[0152] In this case, the etching factor of the patterned portion 720 in the comparative example was confirmed to be at the level of 1.810.

[0153] The etching factor can be calculated using Equation 1 below.

[0154] [Formula 1]

[0155] Etching factor = h1 / (w2-w1)

[0156] Where h1 is the thickness of the pattern portion 720, w2 refers to the width of the upper surface of the pattern portion 720, and w1 refers to the width of the lower surface of the pattern portion 720. Furthermore, because the thickness h1 of the pattern portion 720 results in a large difference between the widths of the upper and lower surfaces, the etching factor has a low value.

[0157] For example, in the comparative example, the thickness h1 of the patterned portion 720 is 34.31 μm, the width w1 of the upper surface of the patterned portion 720 is 46.27 μm, and the width w2 of the lower surface is 58.81 μm. Furthermore, it was confirmed that the etch factor of the patterned portion 720 in the comparative example has a level of 1.810. On the other hand, when the etch factor is low, the difference between the width of the upper surface and the width of the lower surface of the patterned portion 720 is large. Moreover, when the difference between the widths of the upper and lower surfaces of the patterned portion 720 is large, there is a problem of increased signal loss transmitted through the patterned portion 720. For example, a typical signal has the property of flowing along the surface of the patterned portion; when the difference between the widths of the upper and lower surfaces of the patterned portion 720 is large as described above, there is a characteristic of reduced signal transmission characteristics.

[0158] Therefore, the embodiments aim to provide a new layer structure for the patterned portion 720, which can improve the conductivity of the patterned portion 720, reduce the specific resistivity and increase the etching factor.

[0159] Figure 7 This is a view used to describe the materials used in manufacturing the substrate in an embodiment.

[0160] Reference Figure 7 In the embodiments, such as Figure 7 As shown in Figure A, the patterned portion 720 can be used as the substrate for forming the patterned portion 720 of the substrate 700 to prepare the first metal layer 910.

[0161] After that, as Figure 7As shown in Figure B, in this embodiment, the third metal layer 920 may be formed on the lower surface of the first metal layer 910 that contacts the insulating portion 711. The thickness of the third metal layer 920 may be in the range of 2 μm to 10 μm. For example, the thickness of the third metal layer 920 may be in the range of 3 μm to 9 μm. For example, the thickness of the third metal layer 920 may be in the range of 3.5 μm to 8.5 μm.

[0162] When the thickness of the third metal layer 920 is less than 2 μm, it may not be able to provide a roughness above a certain level for the lower surface of the first metal layer 910. Therefore, the bonding strength between the first metal layer 910 and the insulating portion 710 may deteriorate.

[0163] When the thickness of the third metal layer 920 is greater than 10 μm, the overall thickness of the patterned portion 720 may increase, which in turn may increase the overall thickness of the substrate. Furthermore, when the thickness of the third metal layer 920 is greater than 10 μm, there are limitations to reducing the linewidth of the patterned portion 720, making it difficult to form the patterned portion 720.

[0164] The lower surface of the third metal layer 920 may have a centerline average roughness Ra in the range of 0.05 μm to 0.5 μm. For example, the centerline average roughness Ra of the lower surface of the third metal layer 920 in this embodiment may be in the range of 0.05 μm to 0.2 μm. For example, the centerline average roughness Ra of the lower surface of the third metal layer 920 in this embodiment may be in the range of 0.08 μm to 0.15 μm. For example, the 10-point average roughness Rz of the lower surface of the third metal layer 920 in this embodiment may be in the range of 0.6 μm to 5 μm. For example, the 10-point average roughness Rz of the lower surface of the third metal layer 920 in this embodiment may be in the range of 0.7 μm to 3.0 μm. For example, the 10-point average roughness Rz of the lower surface of the third metal layer 920 may be in the range of 1.0 μm to 2.5 μm.

[0165] like Figure 7 As shown in Figure C, in this embodiment, a second metal layer 930 is formed on the upper surface of the first metal layer 910. The second metal layer 930 can be formed on the upper surface of the first metal layer 910 by a non-electroplating process, unlike the first metal layer 910 which can be formed by a coating process, and unlike the first metal layer 910 which can be formed by a deposition process.

[0166] The second metal layer 930 may include a metallic material with high conductivity. For example, the second metal layer 930 may include a metallic material selected from copper (Cu), aluminum (Al), and silver (Ag), which have high conductivity. Alternatively, the second metal layer 930 may include a conductive polymer material with high conductivity.

[0167] The second metal layer 930 may have a thickness in the range of 1 μm to 15 μm and may be disposed on the upper surface of the first metal layer 910. For example, the second metal layer 930 may have a thickness in the range of 2 μm to 13 μm and may be disposed on the upper surface of the first metal layer 910. For example, the second metal layer 930 may have a thickness in the range of 3 μm to 12 μm and may be disposed on the upper surface of the first metal layer 910.

[0168] When the thickness of the second metal layer 930 is less than 1 μm, the increase in conductivity or the decrease in resistivity of the patterned portion 720 caused by the second metal layer 930 may not be significant. Therefore, the patterned portion 720 may be difficult to apply to camera modules requiring high allowable current and high communication speed. Furthermore, when the thickness of the second metal layer 930 is less than 1 μm, the etch factor of the patterned portion 720 in this embodiment may have a similar level to that of the comparative example, thereby increasing the signal transmission loss of the patterned portion 720.

[0169] When the thickness of the second metal layer 930 exceeds 15 μm, the overall thickness of the patterned portion 720 increases accordingly, thereby increasing the overall thickness of the circuit board. Furthermore, when the thickness of the second metal layer 930 exceeds 15 μm, it may be difficult to refine the patterned portion 720. Moreover, when the thickness of the second metal layer 930 exceeds 15 μm, it was confirmed that the reduction in the etching factor or the reduction in the resistivity of the patterned portion 720 is not significant; in fact, it was confirmed that the etching factor actually increases.

[0170] In this case, when the second metal layer 930 is formed by electroplating, it can be formed using a different electroplating method than that used for the third metal layer 920. For example, to provide a roughness of a certain degree as described above, the third metal layer 920 can be formed quickly by changing the voltage value to a high value. In contrast, the second metal layer 930 can be formed slowly with a fixed voltage value, so the surface roughness of the upper surface of the second metal layer 930 can have a very low value. For example, the surface roughness of the upper surface of the second metal layer 930 is lower than that of the lower surface of the third metal layer 920. That is, when the second metal layer 930 is electroplated in the same manner as the third metal layer 920, the upper surface of the second metal layer 930 will also have a surface roughness of a certain degree. In this case, when the surface roughness of the upper surface of the second metal layer 930 is large, a skin effect will occur due to the characteristics of signals that have the property of flowing along the surface, which may increase signal transmission loss. Therefore, in this embodiment, the upper surface of the second metal layer 930 has a low surface roughness, so the signal is transmitted along the surface of the second metal layer 930, thereby improving the signal transmission characteristics.

[0171] Next, in the embodiments, as Figure 7 As shown in Figure D, the metal layers, consisting of a second metal layer 930, a first metal layer 910, and a third metal layer 920 stacked sequentially from top to bottom, can be bonded to the insulating portion 711. In this case, the insulating portion 711 can contact the lower surface of the third metal layer 920, and the bonding strength between the insulating portion and the metal layer can be improved due to the high surface roughness of the third metal layer 920.

[0172] Figure 8 This is a view used to describe the layer structure of the metal layer of the patterned portion in the first embodiment. Figure 9 It is shown Figure 9 A view of an optical microscope photograph of a vertical cross-section of the patterned portion in an actual product of an embodiment.

[0173] Reference Figure 8 and Figure 9 The patterned portion 720 includes a metal layer and a surface treatment layer. The metal layer may include a third metal layer 920, a first metal layer 910 on the third metal layer 920, and a second metal layer 930 on the first metal layer 910.

[0174] In this case, the third metal layer 920 can be omitted. When the third metal layer 920 is omitted, the lower surface of the patterned portion 720 can be the lower surface of the first metal layer 910 instead of the lower surface of the third metal layer 920.

[0175] The second metal layer 930 may have an etch rate different from that of the first metal layer 910 and the third metal layer 920.

[0176] For example, the etching rate of the second metal layer 930 in the embodiment may be slower than the etching rates of the first metal layer 910 and the third metal layer 920. For example, when etching is performed under the same conditions, the etching extent of the second metal layer 930 may be less than that of the first metal layer 910 and the third metal layer 920.

[0177] Therefore, due to the second metal layer 930, the patterned portion 720 in the embodiment can have a different shape than the patterned portion in the comparative example. For example, the first metal layer 910 and the third metal layer 920 can correspond to the shapes of the first metal layer 810 and the third metal layer 820 in the comparative example.

[0178] However, in the embodiments, the overall shape of the patterned portion 720 may differ from the overall shape of the patterned portion in the comparative example, depending on the etching characteristics of the second metal layer 930.

[0179] Specifically, the etching rates of the second metal layer 930 and the first metal layer 910 can be different from each other. That is, the etching rate of the first metal layer 910 can be faster than the etching rate of the second metal layer 930. Therefore, since the first metal layer 910 is etched more than the second metal layer 930, the second metal layer 930 can have an inwardly concave curved surface or a conical shape. Furthermore, the third metal layer 920 can have an etching rate similar to that of the first metal layer 910, and thus the third metal layer 920 can have a shape corresponding to that of the first metal layer 910. However, since the second metal layer 930 is etched at a lower etching rate than both the second metal layer 930 and the first metal layer 910, the second metal layer 930 can be approximately quadrilateral in a vertical cross-section. For example, the widths of the upper and lower surfaces of the second metal layer 930 can be similar to each other. For example, the width of the upper surface of the second metal layer 930 can be in the range of 95% to 105% of the width of its lower surface. The boundary portion between the upper and side surfaces of the second metal layer 930 or the boundary portion between the side and lower surfaces of the second metal layer 930 may have a curved surface.

[0180] In this configuration, the second metal layer 930 may include a first region R1 that vertically overlaps with the upper surface of the first metal layer 910 and a second region R2 that does not vertically overlap with the upper surface of the first metal layer 910. For example, at least one of the width W1 of the upper surface and the width of the lower surface of the second metal layer 930 may be greater than the width of the upper surface of the first metal layer 910. For example, the second metal layer 930 may have a cantilever structure that is spaced apart from and protrudes outward from the upper surface of the first metal layer 910.

[0181] Therefore, the second metal layer 930 may include a first region R1 that is perpendicularly overlapped with the upper surface of the first metal layer 910 and a second region R2 that is not perpendicularly overlapped with the upper surface of the first metal layer 910.

[0182] In this case, the second region R2 of the second metal layer 930 can overlap perpendicularly with the side surface of the first metal layer 910 instead of the top surface of the first metal layer 910.

[0183] Furthermore, at least a portion of the second region R2 of the second metal layer 930 may perpendicularly overlap with the side surface of the third metal layer 920. Thus, in this embodiment, the difference between the width of the upper surface and the width of the lower surface of the patterned portion 720 can be reduced, thereby increasing the etch factor.

[0184] For example, in the comparative example, there is no layer identical to the second metal layer 930 of the embodiment, thus resulting in a low etch factor. Conversely, in the embodiment, the second metal layer 930 is formed on the first metal layer 910, and the second metal layer 930 has a drooping structure. Therefore, in the embodiment, compared to the comparative example, the difference in width between the upper and lower surfaces of the patterned portion 720 can be reduced to decrease the width corresponding to the second region R2, thereby increasing the etch factor.

[0185] Specifically, it was confirmed that the etching factor of the width W1 of the upper surface, the width W2 of the lower surface, and the thickness H1 of the patterned portion 720 in the embodiment is 2.5 or greater.

[0186] For example, it was confirmed that the width W1 of the upper surface of the patterned portion 720 is 54.30 μm, the width W2 of the lower surface is 67.24 μm, and the thickness H1 is approximately 40.58 μm. Therefore, the etch factor of the patterned portion 720 in this embodiment is confirmed to be approximately 2.641.

[0187] Furthermore, in the embodiments, it was confirmed that forming a second metal layer 930 on the first metal layer 910 reduced the resistivity per unit area of ​​the patterned portion 720.

[0188] Specifically, since the patterned portion 720 in the embodiment has a structure in which a second metal layer 930 with high conductivity is provided on the first metal layer 910, the resistivity per unit area (3cm*3cm) is confirmed to be 7.14μΩ*cm, which is 41% of that in the comparative example. Thus, in the embodiment, a high-tolerance current and high transmission speed can be achieved for a high-resolution image sensor applicable to the patterned portion 720.

[0189] More specifically, it was confirmed that as the thickness of the second metal layer 930 in the patterned section 720 increases, the resistivity per unit area (3cm*3cm) also decreases.

[0190] For example, when the thickness of the second metal layer 930 is 4 μm, the resistivity per unit area (3 cm * 3 cm) is confirmed to be 7.14 μΩ * cm. When the thickness of the second metal layer 930 is 8 μm, the resistivity is confirmed to be further reduced to 5.49 μΩ * cm.

[0191] However, when the thickness of the second metal layer 930 is 15 μm, the resistivity per unit area (3 cm * 3 cm) is confirmed to be 2.8 μΩ * cm. However, when the thickness of the second metal layer 930 exceeds 15 μm, the resistivity per unit area (3 cm * 3 cm) is confirmed to be close to the level of 2.8 μΩ * cm, which confirms a reduction in the etching factor.

[0192] Figure 10This is a view used to describe the layer structure of the metal layer of the patterned portion in the second embodiment. Figure 11 It is shown Figure 10 A view of an optical microscope photograph of the vertical cross-section of the patterned section in an actual product.

[0193] Reference Figure 10 The patterned portion 720 in the second embodiment is similar to Figure 8 The patterned section 720 has a layered structure. However, Figure 10 The second metal layer can be disposed on the lower surface and the upper surface of the first metal layer.

[0194] In other words, the patterned portion 720 of the second embodiment may include a first metal layer 910. Furthermore, the patterned portion 720 of the second embodiment may include a second metal layer. For example, the second metal layer may include a 2-1 metal layer 930 disposed on the upper surface of the first metal layer 910. The 2-1 metal layer 930 may correspond to the second metal layer 930 described in the first embodiment. Therefore, its description will be omitted.

[0195] On the other hand, the patterned portion 720 of the second embodiment may further include a 2-2 metal layer 940 disposed on the lower surface of the first metal layer 910. In this case, when the patterned portion includes a third metal layer 920, the 2-2 metal layer 940 may be disposed between the first metal layer 910 and the third metal layer 920. The thickness of the 2-2 metal layer 940 may be in the range of 1 μm to 15 μm, in the range of 2 μm to 13 μm, or in the range of 3 μm to 12 μm.

[0196] On the other hand, the 2-2 metal layer 940 is a metal layer with the same characteristics as the 2-1 metal layer 930, but the 2-2 metal layer 940 can have a different etching rate than the 2-1 metal layer 930.

[0197] In other words, the 2-2 metal layer 940 can be etched while positioned between the first metal layer 910 and the third metal layer 920. Therefore, the 2-2 metal layer 940 can follow the etching characteristics of the first metal layer 910 and the third metal layer 920. Consequently, the side surface of the 2-2 metal layer 940 can have a curved or conical shape corresponding to the side surfaces of the first metal layer 910 and the third metal layer 920.

[0198] In this case, when the 2-2 metal layer 940 is disposed between the first metal layer 910 and the third metal layer 920, the resistivity per unit area can be further reduced.

[0199] In other words, when the overall thickness of the metal layer is 8 μm, the resistivity was confirmed when the 2-1 metal layer 930 was formed to be 8 μm with only the 2-1 metal layer 930 present, and when each of the 2-1 metal layer 930 and the 2-2 metal layer 940 was formed to be 4 μm. As a result, the resistivity was confirmed to be 5.10 μΩ*cm when both the 2-1 metal layer 930 and the 2-2 metal layer 940 were included. This is a lower value compared to the case where only the second metal layer 930 is formed with a thickness of 8 μm. However, when the thickness of the 2-2 metal layer 940 increased, the resistivity was confirmed to decrease, but the etching factor of the patterned portion 720 also decreased. Therefore, in this embodiment, the 2-2 metal layer 940 is formed within a range that keeps the etching factor at a certain level, thereby reducing the resistivity without affecting the etching factor.

[0200] For example, when the thickness of the 2-2 metal layer 940 is less than or equal to the thickness of the 2-1 metal layer 930, it can be confirmed that the etching factor of the patterned portion 720 is reduced. Therefore, in this embodiment, the thickness of the 2-1 metal layer 930 can be greater than the thickness of the 2-2 metal layer 940, thereby increasing the etching factor while reducing the overall resistivity of the patterned portion 720.

[0201] On the other hand, such as Figure 10 As shown, the second region R2 of the 2-1 metal layer 930 may include a region that vertically overlaps with each of the side surfaces of the first metal layer 910, the 2-2 metal layer 940, and the third metal layer 920.

[0202] Figure 12 This is a view used to describe the layer structure of the metal layer of the patterned portion in the third embodiment.

[0203] In the third embodiment, the layer structure of the second metal layer may differ from that of the first and second embodiments. That is, in the first embodiment, the second metal layer is only disposed on the upper surface of the first metal layer. Alternatively, in the second embodiment, the second metal layer is disposed on both the upper and lower surfaces of the first metal layer. Alternatively, in the third embodiment, the second metal layer may be configured to completely cover the upper, lower, and side surfaces of the first metal layer. Furthermore, in the third embodiment, the metal layer of the patterned portion may have a structure that omits the third metal layer. However, in the first and second embodiments, the second metal layer may be formed on the first metal layer before performing the etching process for forming the patterned portion. Alternatively, in the third embodiment, the second metal layer may be formed on the first metal layer after performing the etching process for forming the pad portion.

[0204] In other words, Figure 12View A may show the first terminal portion 721-1. At least a portion of the lower surface of the first metal layer 1721-11 of the first terminal portion 721-1 may contact the first insulating region 1711. Therefore, the second metal layer 1721-14 of the first terminal portion 721 may be partially disposed on the lower surface of the first metal layer 1721-11 and may be completely disposed on the side and upper surfaces of the first metal layer 1721-11. Furthermore, the surface treatment layer 1721-12 of the first terminal portion 721-1 may be configured to surround the second metal layer 1721-14.

[0205] In other words, Figure 12 View B may show the second terminal portion 721-2. At least a portion of the lower surface of the first metal layer 1721-21 of the second terminal portion 721-2 is in contact with the second insulating region 1712. Therefore, the second metal layer 1721-24 of the second terminal portion 721-2 may be partially disposed on the lower surface of the first metal layer 1721-21, and may be completely disposed on the side and upper surfaces of the first metal layer 1721-21. Furthermore, the surface treatment layer 1721-22 of the second terminal portion 721-2 may be configured to surround the second metal layer 1721-24.

[0206] In other words, Figure 12 View C may show the connection portion 721-3. The connection portion 721-3 may not contact the insulating portion. Therefore, the second metal layer 1721-34 of the connection portion 721-3 may be configured to completely surround the upper surface, lower surface, and side surface of the first metal layer 1721-31. Furthermore, the surface treatment layer 1721-32 of the connection portion 721-3 may be configured to surround the second metal layer 1721-34.

[0207] Figure 13 This is a graph showing the change in resistivity of the patterned portion as a function of the thickness of the second metal layer in the third embodiment.

[0208] Reference Figure 13 In the embodiments, it was confirmed that as the thickness of the second metal layers 1721-14, 1721-24, and 1721-34 increases, the resistivity of the patterned portion decreases inversely. Therefore, in the third embodiment, the second metal layer is provided not only on the upper and lower surfaces of the first metal layer, but also on its side surfaces. This further reduces the resistivity of the patterned portion using a relatively thin second metal layer.

[0209] Reference Figure 13 Before the formation of the second metal layers 1721-14, 1721-24 and 1721-34, the resistivity was at the level of 17.29 μΩ*cm.

[0210] Furthermore, when the thickness of the second metal layers 1721-14, 1721-24, and 1721-34 was 0.5 μm, it was confirmed that the resistivity of the patterned portion decreased to 6.30 μΩ*cm.

[0211] Furthermore, when the thickness of the second metal layers 1721-14, 1721-24, and 1721-34 was 2.0 μm, it was confirmed that the resistivity of the patterned portion decreased to 5.74 μΩ*cm.

[0212] Furthermore, when the thickness of the second metal layers 1721-14, 1721-24, and 1721-34 was 2.5 μm, it was confirmed that the resistivity of the patterned portion decreased to 5.60 μΩ*cm.

[0213] Furthermore, when the thickness of the second metal layers 1721-14, 1721-24, and 1721-34 was 3.0 μm, it was confirmed that the resistivity of the patterned portion decreased to 5.50 μΩ*cm.

[0214] Furthermore, when the thickness of the second metal layers 1721-14, 1721-24, and 1721-34 exceeds 4.0 μm, the decrease in resistivity is not significant. Moreover, when the thickness of the second metal layers 1721-14, 1721-24, and 1721-34 is less than 0.5 μm, the resistivity of the patterned portion is at a level similar to that of the first metal layer.

[0215] Therefore, the second metal layers 1721-14, 1721-24, and 1721-34 in the third embodiment can have a thickness in the range of 0.5 μm to 4.0 μm. For example, the thickness of the second metal layers 1721-14, 1721-24, and 1721-34 in the third embodiment can be in the range of 1.0 μm to 3.5 μm. For example, the thickness of the second metal layers 1721-14, 1721-24, and 1721-34 in the third embodiment can be in the range of 1.5 μm to 3.0 μm.

[0216] When the thickness of the second metal layers 1721-14, 1721-24, and 1721-34 is less than 0.5 μm, the decrease in resistivity is not significant, but the electrical characteristics may deteriorate. Furthermore, when the thickness of the second metal layers 1721-14, 1721-24, and 1721-34 exceeds 4 μm, the weight of the patterned portion of the connection in the opening region increases, potentially leading to reliability issues such as downward sag of the connection. Additionally, when the thickness of the second metal layers 1721-14, 1721-24, and 1721-34 exceeds 4 μm, this should be taken into account when determining the spacing between the patterned portions; therefore, the integration density of the circuit pattern may decrease.

[0217] Figure 14 This is a view used to describe the layer structure of the metal layer of the patterned portion in the fourth embodiment.

[0218] Reference Figure 14 In the embodiment, the metal layer of the patterned portion may have a structure in which a third metal layer 1721-13, 1721-23 and 1721-33 is additionally provided on the lower surface of the first metal layers 1721-11, 1721-21 and 1721-31 in the metal layer of the patterned portion of the third embodiment.

[0219] In other words, referencing Figure 12 A. The third metal layer 1721-13 may be disposed on the lower surface of the first metal layer 1721-11 of the first terminal portion 721-1. Therefore, the second metal layer 1721-14 may be disposed on the outer surface surrounding the first metal layer 1721-11 and the third metal layer 1721-13.

[0220] In other words, referencing Figure 12 B. The third metal layer 1721-23 may be disposed on the lower surface of the first metal layer 1721-21 of the second terminal portion 721-2. Therefore, the second metal layer 1721-24 of the second terminal portion 721-2 may be disposed on the outer surface surrounding the first metal layer 1721-21 and the third metal layer 1721-23.

[0221] In other words, referencing Figure 12 C. The third metal layer 1721-33 can be disposed on the lower surface of the connecting portion 721-3. Therefore, the second metal layer 1721-34 can be disposed on the outer surface surrounding the first metal layer 1721-31 and the third metal layer 1721-33.

[0222] The lens driving device of this embodiment includes a circuit board for moving an image sensor connected to a sensor section. The circuit board includes an insulating portion and a patterned portion. Furthermore, the patterned portion includes a metal layer and a surface treatment layer formed on the metal layer. In this case, the metal layer may include a first metal layer and a second metal layer. A second metal layer can be provided to address the low conductivity and high resistivity of the first layer.

[0223] For example, the second metal layer is formed of a metallic material with high conductivity. Therefore, in this embodiment, the resistivity can be reduced while simultaneously lowering the overall conductivity of the patterned portion. Thus, in this embodiment, the allowable current or communication speed of the patterned portion can be increased. Therefore, in this embodiment, a circuit board suitable for a mobile image sensor with a high resolution can be provided.

[0224] Furthermore, in this embodiment, when the patterned portion is formed by the etching process, the second metal layer is etched at the lowest possible etching rate. Therefore, the second metal layer includes a first region that perpendicularly overlaps with the upper surface of the first metal layer and a second region that does not perpendicularly overlap with the upper surface of the first metal layer. Additionally, the second region may perpendicularly overlap with the side surface of the first metal layer and at least a portion of the side surface of the first metal layer. Thus, in this embodiment, by making the width of the second metal layer greater than the width of the upper surface of the first metal layer, the width of the upper and lower surfaces of the patterned portion can be reduced, thereby increasing the etching factor of the patterned portion. Therefore, in this embodiment, by reducing the difference in width between the upper and lower surfaces of the patterned portion, signal transmission loss can be reduced, thereby improving communication performance.

[0225] Furthermore, in one embodiment, the second metal layer may be disposed only on the upper surface of the first metal layer. In another embodiment, the second metal layer may be disposed on both the upper and lower surfaces of the first metal layer. Therefore, in these embodiments, the conductivity can be increased while further reducing the resistivity of the patterned portion. Consequently, in these embodiments, the allowable current of the patterned portion can be further increased, and the communication speed of the patterned portion can be improved.

[0226] Furthermore, in this embodiment, the thickness of the 2-1 metal layer disposed on top of the first metal layer in the second metal layer is greater than the thickness of the 2-2 metal layer disposed below the first metal layer. This allows for a reduction in the resistivity of the patterned portion while increasing the etching factor.

[0227] On the other hand, in another embodiment, the second metal layer can be configured to completely cover the outer surface of the first metal layer, that is, the second metal layer is formed on the first metal layer after the first metal layer is etched. Therefore, the second metal layer can be disposed on the first metal layer while maintaining the shape of the etched first metal layer. Thus, in this embodiment, the shape of the patterned portion is easily controlled, thereby improving the uniformity of the patterned portion's shape. Furthermore, in this embodiment, since the second metal layer is formed after etching the first metal layer, the second metal layer is disposed not only on the upper surface of the first metal layer, but also on a portion of the side surface and the lower surface. Therefore, in this embodiment, the thickness of the second metal layer required to reduce the resistivity of the patterned portion to below a certain level can be reduced. Therefore, in this embodiment, as the thickness of the second metal layer increases, the resistivity can be further reduced, and the thickness of the second metal layer required to achieve the target resistivity can be reduced. Thus, in this embodiment, product reliability can be further improved, and the product unit price can be reduced.

[0228] Furthermore, in this embodiment, the surface treatment layer is in contact with the second metal layer during its formation. For example, the first metal layer is covered by the second metal layer, thereby preventing the surface treatment layer from contacting the first metal layer. Therefore, in this embodiment, the stability of the chemical reaction can be ensured, thereby improving the uniformity of the surface treatment layer's structure.

[0229] Furthermore, the surface treatment layer in the embodiments can be a thin film formed by coating an organic material. In this case, the relative permittivity ε of the organic material is... r The value is 3.24. This is significantly lower than the relative permittivity ε of nickel or gold (Au) that constitutes conventional surface treatment layers. r The value of ε. For example, the relative permittivity ε of nickel or gold (Au). r The value is 4 or higher. Therefore, in this embodiment, by coating an organic material to form a surface treatment layer, it is possible to improve the signal transmission speed of wiring, which is inversely proportional to the relative permittivity. Therefore, in this embodiment, the product reliability of the circuit board can be improved.

[0230] Furthermore, the thermal conductivity of the organic material constituting the surface treatment layer in this embodiment is greater than that of conventional nickel or metal layers. Therefore, in this embodiment, the thermal conductivity of the patterned portion including the surface treatment layer can be improved. Here, recently, heat dissipation characteristics have become a major problem in products such as camera modules. That is, the various components included in a camera module have difficulty dissipating heat, and therefore, efforts are being made to improve heat dissipation. In this case, in this embodiment, during the surface treatment of the patterned portion as described above, the thermal conductivity of the patterned portion can be increased by applying the surface treatment layer with an organic coating. Therefore, the heat dissipation characteristics of the circuit board can be improved, and furthermore, the heat dissipation characteristics of the camera module using the circuit board can be improved.

[0231] Furthermore, in this embodiment, the patterned portion included in the circuit board is one of the components of the first moving portion. That is, during operation of the camera module, the connecting portion constituting the patterned portion can move in multiple directions. For example, the connecting portion, together with the image sensor, can shift or tilt in at least one of the X-axis, Y-axis, and Z-axis directions to autofocus the camera module or prevent camera shake. In this case, during the moving operation as described above, the patterned portion included in the circuit board may come into contact with other components. Furthermore, when the patterned portion comes into contact with other components, the electrical reliability of the patterned portion may be compromised. In this case, in this embodiment, a surface treatment layer is formed by organic coating of the patterned portion as described above, thereby improving electrical reliability. For example, in this embodiment, the conductivity of the surface treatment layer is lower than that of conventional nickel or gold (Au). Therefore, in this embodiment, when the patterned portion comes into contact with other components, the surface treatment layer can perform an insulating function, thereby improving the electrical reliability of the circuit board. Furthermore, in this embodiment, since the surface treatment layer of the patterned portion is formed by organic coating, the electroplating process can be simplified compared to conventional surface treatment layers, and the cost of the electroplating process can be reduced.

[0232] The lens driving device of the embodiment includes a sensor section and a circuit board for moving an image sensor connected to the sensor section. The circuit board may be an interposer. The sensor section includes a sensor plate connected to the circuit board and an image sensor mounted on the sensor plate. In this case, the sensor plate includes solder pads electrically connected to the circuit board and fixed pads in addition to the solder pads. In this case, the circuit board may include an opening for inserting the fixed pads of the sensor plate. Therefore, in the embodiment, during the soldering process between the circuit board and the sensor plate, alignment between the circuit board and the sensor plate can be facilitated by inserting the fixed pads into the opening of the circuit board. Furthermore, in one embodiment, the movement of the sensor plate is restricted when the circuit board and the sensor plate are aligned; therefore, the positional misalignment problem between the circuit board and the sensor plate can be resolved during the soldering process, thereby improving operability. In addition, in the embodiment, the improved positional alignment between the sensor plate and the circuit board improves the electrical connectivity between the sensor plate and the circuit board, thereby improving product reliability.

[0233] Furthermore, in this embodiment, the circuit board includes an insulating portion and a patterned portion. The insulating portion includes a first insulating region, a second insulating region, and an opening region between them. The patterned portion includes a first terminal portion disposed in the first insulating region and connected to the sensor board, a second terminal portion disposed in the second insulating region and connected to the main substrate, and a connecting portion disposed in the opening region and connecting the first and second terminal portions. In this case, the connecting portion includes a bent portion disposed at each corner of the opening region. In this case, each bent portion of the connecting portion bends at the corner in the same direction as the rotation direction. Therefore, in this embodiment, the structure of the connecting portion as described above improves the mobility of the circuit board-based sensor portion and, moreover, improves the accuracy of the sensor portion's movement position.

[0234] Furthermore, in an embodiment, the curved portion of the connecting part includes a first opening region, which partially opens at each corner of the opening region. In this case, the first opening region may be formed at a position overlapping with the protrusion of the second frame constituting the first moving part 200 in the optical axis direction. Additionally, the connecting part includes an inner connecting part disposed inside the first opening region, avoiding the first opening region, and an outer connecting part disposed outside the first opening region. In this case, the number of inner connecting parts may be less than the number of outer connecting parts. Therefore, in the above-described connecting part, by making the number of outer connecting parts disposed outside the first opening region greater than the number of inner connecting parts disposed inside the first opening region, the mobility of the first moving part can be improved. For example, when the number of outer connecting parts is greater than the number of inner connecting parts, the amount of movement of the first moving part can be more easily controlled compared to when the number of outer connecting parts is less than the number of inner connecting parts. For example, since the outer connecting parts are disposed outside the first opening region OR, the length of the outer connecting parts can be greater than the length of the inner connecting parts. Furthermore, since the length of the outer connecting parts is greater than the length of the inner connecting parts, the intensity of the driving force required to move the first moving part can be reduced compared to the inner connecting parts. Therefore, in the embodiment, the mobility of the first moving part can be improved, and the amount of movement of the first moving part can be finely adjusted by making the number of outer connecting parts greater than the number of inner connecting parts.

[0235] Furthermore, in the embodiments, each of the outer connecting portion and the inner connecting portion includes multiple bending points. In this case, the number of bending points in the outer connecting portion can be the same as the number of bending points in the inner connecting portion. Therefore, in the embodiments, the mobility of the first moving portion can be increased by making the number of bending points in the outer connecting portion equal to the number of bending points in the inner connecting portion. For example, when the number of bending points in the outer connecting portion is different from the number of bending points in the inner connecting portion, the force may be concentrated on the connecting portion with more bending points. Therefore, the connecting portion with concentrated force may break earlier than other connecting portions, which may lead to problems with the movement accuracy of the first moving portion. Alternatively, in the embodiments, the number of bending points in the outer connecting portion and the number of bending points in the inner connecting portion are equal to each other. Therefore, when the first moving portion moves, the force applied to the inner and outer connecting portions can be evenly distributed. Therefore, in the embodiments, since the force is evenly distributed to the inner and outer connecting portions, the problem of a specific connecting portion breaking first can be solved, and even if a connecting portion breaks, the inner and outer connecting portions can break simultaneously.

[0236] Figure 15 This is a view showing a mobile terminal 2000 with the camera module of the embodiment applied.

[0237] like Figure 15 As shown, the mobile terminal 2000 of this embodiment may include a camera module 2100, a flash module 2400, and an autofocus device 2300 disposed on the back. The mobile terminal 2000 of this embodiment may also include a second camera module 2200.

[0238] Camera module 2100 may include image capture functionality and autofocus functionality. For example, camera module 2100 may include autofocus functionality that utilizes an image.

[0239] The camera module 2100 processes still or moving image frames acquired by the image sensor in shooting mode or video call mode. The processed image frames can be displayed on a predetermined display unit and stored in memory. The camera (not shown) can be mounted on the front surface of the main body of the mobile terminal.

[0240] For example, camera module 2100 may include a first camera module and a second camera module, and OIS may be implemented by the first camera module together with AF or zoom functions.

[0241] The flash module 2400 may include a light-emitting device therein. The flash module 2400 can be operated via camera operation of a mobile terminal or by user control.

[0242] The autofocus device 2300 may include one of the packages of a surface-emitting laser element as a light-emitting unit.

[0243] The autofocus device 2300 may include an autofocus function using a laser. The autofocus device 2300 can be used primarily in situations where the autofocus function of the image from the camera module 2100 is degraded (e.g., in close-range environments of 10m or less or in dark environments). The autofocus device 2300 may include a light-emitting unit and a light-receiving unit (e.g., a photodiode), the light-emitting unit including a vertical-cavity surface-emitting laser (VCSEL) semiconductor device, and the light-receiving unit converting light energy into electrical energy.

[0244] Figure 16 This is an exterior view of a vehicle equipped with a camera module according to an application embodiment.

[0245] Reference Figure 16 The vehicle 3100 in this embodiment may include wheels 3000FL and 3000FR that rotate via a power source, as well as predetermined sensors. The sensors may be camera sensors 3000, but the embodiment is not limited thereto.

[0246] The camera sensor 3000 may be the camera sensor of the camera module 2100 in the application embodiment.

[0247] The vehicle 3100 in this embodiment can acquire image information by capturing images of the front or surroundings through a camera sensor 3000, and can use the image information to determine if a lane is not recognized and can generate a virtual lane when it is not recognized.

[0248] For example, camera sensor 3000 can acquire a frontal image by photographing the front of vehicle 3100, and processor (not shown) can acquire image information by analyzing objects included in the frontal image.

[0249] For example, when the image captured by the camera sensor 3000 contains objects such as lanes, adjacent vehicles, driving obstacles and median strips, curbs and roadside trees that correspond to indirect road markings, the processor detects the objects to be included in the image information.

[0250] In this scenario, the processor can acquire distance information to objects detected by the camera sensor 3000 to further supplement the image information. The image information can be about the objects captured in the image.

[0251] Camera sensor 3000 may include an image sensor and an image processing module. Camera sensor 3100 can process still images or moving images acquired by the image sensor (e.g., CMOS or CCD). The image processing module can process the still images or moving images acquired by the image sensor to extract necessary information and can send the extracted information to a processor.

[0252] The features, structures, and effects described in the above embodiments are included in at least one embodiment, but are not limited to one embodiment. Furthermore, those skilled in the art to which the embodiments pertain can combine or modify the features, structures, and effects shown in each embodiment with respect to other embodiments. Therefore, anything related to such combinations and modifications should be understood to be included within the scope of the embodiments.

[0253] The above description focuses on embodiments, but it is illustrative only and does not limit the embodiments. Those skilled in the art will understand that various modifications and applications not shown above are possible without departing from the essential characteristics of the embodiments. For example, each component specifically represented in the embodiments can be modified and implemented. Furthermore, it should be understood that differences associated with these changes and applications are included within the scope of the embodiments defined in the appended claims.

Claims

1. A circuit board, comprising: Insulation part; as well as The patterned portion is disposed on the insulating portion. The insulating portion includes a first insulating region and a second insulating region spaced apart from each other by an opening region. The patterned portion includes: The first terminal portion is disposed in a plurality of first side portions adjacent to the opening region in the first insulating region; The second terminal portion is disposed on a plurality of second side regions of the second insulating region facing the plurality of first side regions across the opening region; and A connecting portion is disposed in the opening area and connects the first terminal portion and the second terminal portion. The connecting portion includes a plurality of curved portions, which connect the first terminal portion and the second terminal portion disposed in the first side region and the second side region, which do not face each other, and are formed at a plurality of corners of the opening region. Each of the first terminal portion, the second terminal portion, and the connecting portion includes a metal layer and a surface treatment layer disposed on the metal layer, and The metal layer includes: A first metal layer, the first metal layer comprising a rolled alloy layer and disposed on the insulating portion; A second metal layer, wherein the second metal layer is disposed on the first metal layer; and A third metal layer is disposed between the first metal layer and the insulating portion. The surface treatment layer is disposed on the first metal layer, the second metal layer, and the third metal layer, and includes at least one of organic materials, inorganic materials, and organic-inorganic composite materials. The lower surface of the third metal layer includes protrusions that project toward the insulating portion. The sides of the first metal layer and the third metal layer have shapes different from those of the sides of the second metal layer. Wherein, the side surface of the first metal layer and the side surface of the third metal layer include curved surfaces whose width increases horizontally toward the insulating portion, and The width of the lower surface of the third metal layer is greater than the width of each of the upper and lower surfaces of the first metal layer. Wherein, the thickness of each of the second metal layer and the third metal layer is less than the thickness of the first metal layer, and The second metal layer comprises a metal material selected from copper (Cu), aluminum (Al), and silver (Ag) that has a higher conductivity than the first metal layer.

2. The circuit board according to claim 1, wherein, The surface roughness of the upper surface of the second metal layer is less than the surface roughness of the lower surface of the third metal layer.

3. The circuit board according to claim 1, wherein, The second metal layer includes: A first region overlapping the upper surface of the first metal layer in the vertical direction; and A second region that does not overlap with the upper surface of the first metal layer in the vertical direction but overlaps with the side surface of the first metal layer in the vertical direction.

4. The circuit board according to claim 3, wherein, The vertical cross-sectional shape of the first metal layer is different from that of the second metal layer.

5. The circuit board according to claim 3, in, The surface treatment layer includes a portion in contact with the first metal layer, a portion in contact with the second metal layer, and a portion in contact with the third metal layer.

6. The circuit board according to claim 3, wherein, The second metal layer includes: A 2-1 metal layer disposed on the upper surface of the first metal layer; and A 2-2 metal layer is disposed on the lower surface of the first metal layer. The third metal layer is disposed between the 2-2 metal layer and the insulating portion.

7. The circuit board according to claim 6, wherein, The vertical cross-sectional shape of the 2-1 metal layer is different from that of the 2-2 metal layer.

8. The circuit board according to claim 3, wherein, The thickness of the second metal layer is in the range of 1 μm to 15 μm.

9. The circuit board according to claim 6, wherein, The thickness of the 2-2 metal layer is less than the thickness of the 2-1 metal layer.

10. The circuit board according to claim 9, wherein, At least a portion of the 2-1 metal layer overlaps with the side surface of the 2-2 metal layer in the vertical direction.

11. A lens driving device, comprising: Fixing part; The first movable part is configured to be movable relative to the fixed part; as well as The circuit board of claim 1, the circuit board including a region connected to the fixed part and a region connected to the first movable part.

12. A camera module, comprising: The lens driving device according to claim 11, The lens driving device includes a second moving part, which is disposed inside the first moving part and is movable relative to the fixed part and the first moving part in the optical axis direction.

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