Pressurizing device and electronic device comprising the same

CN115835525BActive Publication Date: 2026-08-11TYCO ELECTRONICS (SHANGHAI) CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-09-18
Publication Date
2026-08-11

AI Technical Summary

Technical Problem

在现有技术中,加压装置包括压板和加压单元,压板用于压在电子元件上,加压单元用于对压板施加压力,进而对电子元件施加压力,然而加压单元通常布置在压板的周边上,这种加压方式仅使得电子元件和电路板或连接器的周边区域得到加压,但电子元件和电路板或连接器(尤其是尺寸较大的电子元件和电路板或连接器)的中央区域得不到足够的压力,这种加压的不平衡使得电子元件中央区域的引脚与电路板或连接器中央区域的相应触头之间的相互接触力很小,电路板中央区域的触头产生很少的偏转,从而容易造成电子元件中央区域的引脚与电路板或连接器中央区域的相应触头的电接触不良,进而影响了电子元件与电路板或连接器之间正常的电连接

Benefits of technology

[0021] According to an exemplary embodiment of another aspect of the invention, the electronic device further includes a connector disposed on the circuit board, the electronic components being pressed onto the connector by the pressure device.

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Abstract

This invention discloses a pressurizing device for pressurizing an electronic component (8) on a circuit board (2). The pressurizing device includes: a pressure plate (3) comprising a first pressure plate surface (31) and a second pressure plate surface (32) opposite to each other, the first pressure plate surface (31) being used to directly or indirectly press the electronic component (8) on a first circuit board surface (22) of the circuit board (2); a plurality of peripheral pressurizing units (4) for applying pressure to the peripheral area of ​​the second pressure plate surface (32); and a plurality of central pressurizing units (5, 5') for applying pressure to the central area of ​​the second pressure plate surface (32). This pressurizing device ensures a good electrical connection between the electronic component and the circuit board or connectors on the circuit board.
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Description

Technical Field

[0001] This invention relates to the field of connectors, and more particularly to pressure devices and electronic devices including such pressure devices. Background Technology

[0002] Electronic components (e.g., electronic chips) are typically pressed onto circuit boards or connectors on circuit boards in electronic devices using a pressurizing device to achieve an electrical connection between the electronic component and the circuit board or connector by making the pins of the electronic component make electrical contact with the contacts of the circuit board or connector. In the prior art, the pressurizing device includes a pressure plate and a pressurizing unit. The pressure plate is used to press onto the electronic component, and the pressurizing unit is used to apply pressure to the pressure plate, thereby applying pressure to the electronic component. However, the pressurizing unit is usually arranged around the periphery of the pressure plate. This pressurizing method only pressurizes the peripheral areas of the electronic component and the circuit board or connector, but the central area of ​​the electronic component and the circuit board or connector (especially large electronic components and circuit boards or connectors) does not receive sufficient pressure. This imbalance in pressurization results in very small contact force between the pins in the central area of ​​the electronic component and the corresponding contacts in the central area of ​​the circuit board or connector. The contacts in the central area of ​​the circuit board deflect very little, which easily leads to poor electrical contact between the pins in the central area of ​​the electronic component and the corresponding contacts in the central area of ​​the circuit board or connector, thus affecting the normal electrical connection between the electronic component and the circuit board or connector. Summary of the Invention

[0003] The purpose of this invention is to solve at least one aspect of the aforementioned problems and defects existing in the prior art.

[0004] According to one aspect of the present invention, a pressurizing device is provided, which can be used to pressurize an electronic component on a circuit board, the pressurizing device comprising:

[0005] The pressure plate includes a first pressure plate surface and a second pressure plate surface that are opposite to each other, wherein the first pressure plate surface is used to directly or indirectly press the electronic components on the first circuit board surface of the circuit board;

[0006] Multiple peripheral pressurization units are used to apply pressure to the peripheral area of ​​the surface of the second pressure plate; and

[0007] Multiple central pressurization units are used to apply pressure to the central region of the surface of the second pressure plate.

[0008] According to an exemplary embodiment of the present invention, a connector is arranged on the surface of the first circuit board, and the surface of the first pressure plate presses the electronic component onto the connector.

[0009] According to another exemplary embodiment of the present invention, the pressurizing device further includes a support plate disposed on a second circuit board surface opposite to the first circuit board surface.

[0010] According to another exemplary embodiment of the present invention, each peripheral pressurizing unit includes: a first bolt, the shank of the first bolt extending from the peripheral region of the second pressure plate surface through the pressure plate to the support plate and being threadedly connected to the support plate; and a first compression spring, the first compression spring being axially fitted on the shank of the first bolt and being compressed between the head of the first bolt and the surface of the second pressure plate.

[0011] According to another exemplary embodiment of the present invention, each central pressurizing unit includes: a second bolt, the shank of which extends from the central region of the surface of the second pressure plate through the pressure plate to the support plate and is threadedly connected to the support plate; and a second compression spring, which is axially fitted onto the shank of the second bolt and is compressed between the head of the second bolt and the surface of the second pressure plate.

[0012] According to another exemplary embodiment of the present invention, each central pressurizing unit includes: an elastic plate fixed to the support plate; a nut fixedly disposed in the elastic plate and extending through the elastic plate, wherein the axial direction of the nut is perpendicular to the surface of the elastic plate; and a third bolt, wherein the shank of the third bolt extends from the central region of the surface of the second pressure plate through the pressure plate to the nut and is threadedly connected to the nut, and the head of the third bolt is recessed in a groove on the surface of the second pressure plate.

[0013] According to another exemplary embodiment of the present invention, the elastic plate includes an elastic plate body that protrudes toward the support plate in its natural state, and the nut is fixedly disposed in the central region of the elastic plate body.

[0014] According to another exemplary embodiment of the present invention, the opposite ends of the elastic plate body are bent toward the support plate to form a support portion, and the free end of the support portion is bent from the inside to the outside along a direction parallel to the support plate to form a fixing portion, the fixing portion being connected to the support plate by fasteners.

[0015] According to another exemplary embodiment of the present invention, the support plate has a recess, and the elastic plate is arranged in the recess.

[0016] According to another exemplary embodiment of the present invention, the support plate includes a solid plate and a hollow plate disposed on the solid plate, wherein a hollow region is formed in the hollow plate, and the elastic plate is fixed to the solid plate in the hollow region.

[0017] According to another exemplary embodiment of the present invention, the electronic component is an electronic chip or a chip processor.

[0018] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising electronic components, a circuit board and the aforementioned pressure device, wherein the electronic components are pressed onto the circuit board by the pressure device.

[0019] According to an exemplary embodiment of another aspect of the invention, the electronic device further includes a connector disposed on the circuit board, the electronic components being pressed onto the connector by the pressure device.

[0020] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising electronic components, a circuit board, a cooling plate and the aforementioned pressurizing device, wherein the electronic components are pressed onto the circuit board by the pressurizing device, and the cooling plate is disposed on the second pressurizing surface of the pressurizing plate.

[0021] According to an exemplary embodiment of another aspect of the invention, the electronic device further includes a connector disposed on the circuit board, the electronic components being pressed onto the connector by the pressure device.

[0022] In the aforementioned exemplary embodiments of the present invention, not only are multiple peripheral pressurizing units provided to apply pressure to the peripheral area of ​​the second pressure plate surface so that the pressure plate presses the peripheral area of ​​the electronic component, but multiple central pressurizing units are also provided to apply pressure to the central area of ​​the second pressure plate surface so that the pressure plate presses the central area of ​​the electronic component. This ensures that good electrical contact can be formed between the pins of the peripheral area of ​​the electronic component and the corresponding contacts of the peripheral area of ​​the circuit board or the connector on the circuit board, as well as between the pins of the central area of ​​the electronic component and the corresponding contacts of the central area of ​​the circuit board or the connector on the circuit board.

[0023] Other objects and advantages of the invention will become apparent from the following description of the invention with reference to the accompanying drawings, and will help to provide a comprehensive understanding of the invention. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments will be briefly described below. It should be understood that the drawings described below only relate to some embodiments of the present invention and are not intended to limit the invention, wherein:

[0025] Figure 1A and Figure 1B These are cross-sectional views of the pressurizing device according to the first embodiment of the present invention, shown from different sides, wherein the central pressurizing unit is omitted;

[0026] Figure 2 This is a schematic diagram illustrating the structure of an electronic device according to a first embodiment of the present invention;

[0027] Figure 3 This is a cross-sectional view showing a pressurizing device according to a second embodiment of the present invention;

[0028] Figure 4 This is a schematic diagram showing the structure of the pressurizing device according to the second embodiment of the present invention after the pressure plate and the third bolt are removed;

[0029] Figure 5 This is a schematic diagram showing the structure of the pressurizing device according to the second embodiment of the present invention after the hollow plate of the pressure plate and the support plate is removed;

[0030] Figure 6 This is a schematic diagram showing the structure of the elastic plate of the pressurizing device according to a second embodiment of the present invention;

[0031] Figure 7 This is a schematic diagram illustrating the structure of an electronic device according to a second embodiment of the present invention;

[0032] Figure 8 This is a cross-sectional view showing an electronic device according to a second embodiment of the present invention;

[0033] Figure 9 This is a schematic diagram showing the structure of an electronic device according to a second embodiment of the present invention after the cooling plate has been removed.

[0034] Figure label:

[0035] 1. 1': Support plate; 11': Solid plate; 12': Hollow plate; 2: Circuit board; 21: Second circuit board surface; 22: First circuit board surface; 3: Pressure plate; 31: First pressure plate surface; 32: Second pressure plate surface; 4: Peripheral pressure unit; 41: First bolt; 42: First compression spring; 5. 5': Central pressure unit; 51: Second bolt; 52: Second compression spring; 51': Elastic plate; 511': Elastic plate body; 512': Support part; 513': Fixing part; 514': Fastener; 52': Nut; 53': Third bolt; 6: Cable; 7: Cooling plate; 8: Electronic component; 9: Connector. Detailed Implementation

[0036] To more clearly illustrate the objectives, technical solutions, and advantages of the present invention, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the following description of the embodiments is intended to explain and illustrate the overall concept of the present invention and should not be construed as limiting the present invention. In the specification and drawings, the same or similar reference numerals refer to the same or similar parts or components. For clarity, the drawings are not necessarily drawn to scale, and some well-known parts and structures may be omitted from the drawings.

[0037] Unless otherwise defined, the technical or scientific terms used in this invention shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms “first,” “second,” and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. The word “a” or “an” does not exclude multiple components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” “right,” “top,” or “bottom,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described object changes. When an element is said to be located “upper” or “lower” than another element, the element may be located “directly” above or below the other element, or there may be intermediate elements present.

[0038] The pressurizing devices and electronic devices including the corresponding pressurizing devices of various embodiments will now be described in detail with reference to the accompanying drawings.

[0039] Example 1

[0040] like Figure 1A and Figure 1B (The central pressurizing unit 5 is omitted for clarity.) As shown, Embodiment 1 provides a pressurizing device for pressurizing an electronic component 8 on a circuit board 2. The pressurizing device includes a support plate 1, a pressure plate 3, a plurality of peripheral pressurizing units 4 and a plurality of central pressurizing units 5.

[0041] Specifically, the pressure plate 3 includes first pressure plate surfaces 31 that are opposite to each other (i.e. Figure 1A and Figure 1B The bottom surface of the pressure plate) and the second pressure plate surface 32 (i.e. Figure 1A and Figure 1B The top surface of the pressure plate in the circuit board 2), the first pressure plate surface 31 is used to directly or indirectly press the first circuit board surface 22 of the circuit board 2 (i.e., the top surface of the pressure plate in the circuit board 2). Figure 1Aand Figure 1B Electronic components 8 on the top surface of the circuit board. The first circuit board surface 22 and the second circuit board surface 21 (i.e. Figure 1A and Figure 1B The second pressure plate surface 32 is opposite to the bottom surface of the circuit board 2. Multiple peripheral pressure units 4 are used to apply pressure to the peripheral area of ​​the second pressure plate surface 32. Multiple central pressure units 5 are used to apply pressure to the central area of ​​the second pressure plate surface 32. A support plate 1 is arranged on the second circuit board surface 21 of the circuit board 2, which is opposite to the first circuit board surface 22, and is used to support the second circuit board surface 21.

[0042] Furthermore, a connector 9 can be arranged on the surface 22 of the first circuit board. In this case, the surface 31 of the first pressure plate presses the electronic component 8 onto the connector 9, such as... Figure 1B As shown in the image.

[0043] Each peripheral pressurizing unit 4 includes a first bolt 41 and a first compression spring 42. The screw of the first bolt 41 passes through the pressure plate 3 from the peripheral area of ​​the second pressure plate surface 32 to the support plate 1 and is threadedly connected to the support plate 1; the first compression spring 42 is axially fitted on the screw of the first bolt 41 and is pressed between the head of the first bolt 41 and the second pressure plate surface 32.

[0044] Each central pressurizing unit 5 includes a second bolt 51 and a second compression spring 52. The screw of the second bolt 51 passes through the pressure plate 3 from the central region of the second pressure plate surface 32 to the support plate 1 and is threadedly connected to the support plate 1; the second compression spring 52 is axially fitted on the screw of the second bolt 51 and is pressed between the head of the second bolt 51 and the second pressure plate surface 32.

[0045] Reference Figure 2 The central pressurizing unit 5 can be structurally identical to the peripheral pressurizing unit 4 to balance the loading forces in the central and peripheral areas, or it can be slightly different from the peripheral pressurizing unit 4 depending on the actual situation (e.g., slight differences in bolt type or size). In this embodiment, the first bolt 41 and the second bolt 51 can both be shoulder bolts.

[0046] In addition, such as Figure 2 As shown, Embodiment 1 also provides an electronic device, which includes an electronic component 8, a circuit board 2, and a pressure device according to this embodiment. The electronic component 8 in this embodiment can be an electronic chip or a chip processor. A cable 6 is connected to the circuit board 2. The electronic component is pressed onto the circuit board 2 by the pressure device.

[0047] Additionally, the electronic device in this embodiment may also include a connector 9 disposed on the circuit board 2, which can be fixed to the first circuit board surface 22 of the circuit board 2 by soldering. In this case, the electronic component 8 is pressed onto the connector 9 by the pressure device.

[0048] In addition, refer to Figure 2 As can be seen, in this embodiment there are four peripheral pressurizing units 4 and four central pressurizing units 5. The four peripheral pressurizing units 4 are evenly distributed around the pressure plate 3, and the four central pressurizing units 5 are evenly distributed in the central area of ​​the pressure plate 3. However, the number of peripheral pressurizing units 4 and central pressurizing units 5 is not limited to this.

[0049] The pressurizing device in this embodiment not only applies pressure to the peripheral area of ​​the second pressure plate surface 32 by setting multiple peripheral pressurizing units 4, so that the pressure plate 3 presses the peripheral area of ​​the electronic component, thereby increasing the contact force between the pins of the peripheral area of ​​the electronic component and the corresponding contacts of the peripheral area of ​​the circuit board or connector on the circuit board, and ensuring sufficient deflection of the corresponding contacts of the peripheral area of ​​the circuit board or connector on the circuit board, thus ensuring good electrical contact between the pins of the peripheral area of ​​the electronic component and the corresponding contacts of the peripheral area of ​​the circuit board or connector on the circuit board; but also applies pressure to the central area of ​​the second pressure plate surface 32 by setting multiple central pressurizing units 5, so that the pressure plate 3 presses the central area of ​​the electronic component, thereby increasing the contact force between the pins of the central area of ​​the electronic component and the corresponding contacts of the central area of ​​the circuit board or connector on the circuit board, and ensuring sufficient deflection of the corresponding contacts of the central area of ​​the circuit board or connector on the circuit board, thus ensuring good electrical contact between the pins of the central area of ​​the electronic component and the corresponding contacts of the central area of ​​the circuit board or connector on the circuit board; therefore, it ensures good electrical connection between the electronic component and the circuit board or connector on the circuit board (even for large electronic components and circuit boards or connectors).

[0050] Example 2

[0051] like Figures 3 to 6 As shown, Embodiment 2 provides another pressurization device, which is basically the same as the pressurization device in Embodiment 1, except that the central pressurization unit and the corresponding support plate are different.

[0052] Specifically, in Embodiment 2, each central pressurizing unit 5' includes an elastic plate 51', a nut 52', and a third bolt 53'. The elastic plate 51' is fixed on the support plate 1'; the nut 52' is fixedly disposed in the elastic plate 51' and passes through the elastic plate 51', and the axial direction of the nut 52' is perpendicular to the plate surface of the elastic plate 51'; the screw of the third bolt 53' passes through the pressure plate 3 from the central area of ​​the second pressure plate surface 32 to the nut 52' and is threadedly connected to the nut 52', and the head of the third bolt is recessed in a groove on the surface of the second pressure plate.

[0053] like Figure 6 As shown, the elastic plate 51' includes an elastic plate body 511'. A nut 52' is fixedly disposed in the central region of the elastic plate body 511', and the elastic plate body 511' faces the support plate 1' in its natural state (i.e., Figure 3 and Figure 6 The elastic plate body 511' protrudes downwards, meaning that it is concave in its natural state. Therefore, when the third bolt 53' tends to break free upwards as the usage time increases, the elastic plate body 511' can exert a downward pulling force on the third bolt 53', thereby preventing the third bolt 53' from breaking free upwards to a certain extent. This ensures that the central pressure unit 5' continuously applies pressure to the central area of ​​the second pressure plate surface 32 of the pressure plate 3, increasing the durability of the pressure application. The two opposite ends of the elastic plate body 511' are bent toward the support plate 1' to form support portions 512', and the free ends of the support portions 512' are bent from the inside to the outside (i.e., from the center of the elastic plate 51' toward the outside) in a direction generally parallel to the support plate 1' to form fixing portions 513'; the two fixing portions 513' formed are each fixedly connected to the support plate 1' by fasteners 514', which can be, for example, rivets; the elastic plate body 511', the two support portions 512' and the two fixing portions 513' are integrally connected.

[0054] In this embodiment, the support plate 1' is also arranged on the second circuit board surface 21 of the circuit board 2, opposite to the first circuit board surface 22, and is used to support the second circuit board surface 21. The support plate 1' may have a recess, and the elastic plate 51' may be arranged in the recess. Alternatively, as Figure 4 and Figure 5As shown, the support plate 1' in this embodiment may also include a solid plate 11' and a hollow plate 12' arranged on the solid plate 11'. The hollow plate 12' has a hollow area, and the elastic plate 51' can be fixed to the solid plate 11' in the hollow area. The recess or the hollow area provides space for the arrangement of the elastic plate 51', and also provides space for the elastic plate body 511' to exert elastic force in the vertical direction (i.e., the direction perpendicular to the support plate). The height of the recess or the hollow area should be at least such that the entire elastic plate 51' is accommodated in the recess or the hollow area.

[0055] In addition, such as Figures 7 to 9 As shown, Embodiment 2 also provides another electronic device, which includes an electronic component 8, a circuit board 2, a cooling plate 7, and a pressurizing device as described in this embodiment. The circuit board 2 is connected to a cable 6. The electronic component 8 in this embodiment can be an electronic chip or a chip processor. The electronic component 8 is pressed onto the circuit board 2 by the pressurizing device. The cooling plate 7 is used to cool the electronic component; the cooling plate 7 is disposed on the second pressure plate surface 32 of the pressure plate 3, and the cooling plate 7 can be... Figure 8 As shown, it is fixed to the support plate 1' by fasteners, but other conventional setup methods in this field can also be adopted according to customer needs.

[0056] Additionally, the electronic device in this embodiment may also include a connector 9 disposed on the circuit board 2, which can be fixed to the first circuit board surface 22 of the circuit board 2 by soldering. In this case, the electronic component 8 is pressed onto the connector 9 by the pressure device.

[0057] In addition, refer to Figure 9 As can be seen, in this embodiment, there are four peripheral pressurizing units 4 and four central pressurizing units 5'. The four peripheral pressurizing units 4 are evenly distributed around the pressure plate 3, and the four central pressurizing units 5' are evenly distributed in the central area of ​​the pressure plate 3. However, the number of peripheral pressurizing units 4 and central pressurizing units 5' is not limited to this.

[0058] The pressurizing device in this embodiment not only applies pressure to the peripheral area of ​​the second pressure plate surface 32 by setting multiple peripheral pressurizing units 4, so that the pressure plate 3 presses the peripheral area of ​​the electronic component, thereby increasing the contact force between the pins of the peripheral area of ​​the electronic component and the corresponding contacts of the peripheral area of ​​the circuit board or connector on the circuit board, and ensuring sufficient deflection of the corresponding contacts of the peripheral area of ​​the circuit board or connector on the circuit board, thus ensuring good electrical contact between the pins of the peripheral area of ​​the electronic component and the corresponding contacts of the peripheral area of ​​the circuit board or connector on the circuit board; but also applies pressure to the central area of ​​the second pressure plate surface 32 by setting multiple central pressurizing units 5', so that the pressure plate 3 presses the central area of ​​the electronic component, thereby increasing the contact force between the pins of the central area of ​​the electronic component and the corresponding contacts of the central area of ​​the circuit board or connector on the circuit board, and ensuring sufficient deflection of the corresponding contacts of the central area of ​​the circuit board or connector on the circuit board, thus ensuring good electrical contact between the pins of the central area of ​​the electronic component and the corresponding contacts of the central area of ​​the circuit board or connector on the circuit board; therefore, it ensures good electrical connection between the electronic component and the circuit board or connector on the circuit board (even for large electronic components and circuit boards or connectors).

[0059] Furthermore, regarding the central pressurizing unit 5' in this embodiment, the head of the third bolt 53' is recessed in the groove of the second pressure plate surface 32, and the central pressurizing unit 5' is entirely located between the pressure plate 3 and the support plate 1'. It can be seen that the central pressurizing unit 5' in this embodiment does not protrude from the second pressure plate surface 32 of the pressure plate 3 as in the first embodiment. Therefore, the central pressurizing unit 5' in this embodiment does not affect the arrangement of the cooling plate 7 (or other components) on the pressure plate 3, allowing the customer to freely choose whether to arrange the cooling plate 7 on the pressure plate 3 according to their needs.

[0060] Those skilled in the art will understand that the embodiments described above are exemplary and can be improved upon. The structures described in the various embodiments can be freely combined without causing any conflict in structure or principle.

[0061] Although the invention has been described in conjunction with the accompanying drawings, the embodiments disclosed in the drawings are intended to illustrate examples of the invention and should not be construed as limiting the invention. The dimensions and proportions in the drawings are merely illustrative and should not be construed as limiting the invention.

[0062] The above embodiments are merely illustrative of the principles and structure of the present invention and are not intended to limit the present invention. Those skilled in the art should understand that any changes and modifications made to the present invention without departing from the overall concept are within the scope of the present invention. The scope of protection of the present invention should be determined by the scope defined in the claims of this application.

Claims

1. A pressurizing device for pressurizing an electronic component (8) on a circuit board (2), the pressurizing device comprising: The pressure plate (3) includes a first pressure plate surface (31) and a second pressure plate surface (32) that are opposite to each other. The first pressure plate surface (31) is used to directly or indirectly press the electronic components (8) on the first circuit board surface (22) of the circuit board (2). Multiple peripheral pressurization units (4) are used to apply pressure to the peripheral area of ​​the second pressure plate surface (32); as well as Multiple central pressurization units (5, 5') are used to apply pressure to the central region of the second pressure plate surface (32).

2. The pressurizing device according to claim 1, characterized in that, A connector (9) is arranged on the surface (22) of the first circuit board, and the surface (31) of the first pressure plate presses the electronic component (8) onto the connector (9).

3. The pressurizing device according to claim 1 or 2, characterized in that, The pressurizing device further includes a support plate (1, 1') arranged on a second circuit board surface (21) of the circuit board (2) opposite to the first circuit board surface (22).

4. The pressurizing device according to claim 3, characterized in that, Each peripheral pressurization unit (4) includes: A first bolt (41), the shank of which extends from the peripheral region of the second pressure plate surface (32) through the pressure plate (3) to the support plate (1, 1'), and is threadedly connected to the support plate (1, 1'); and The first compression spring (42) is axially mounted on the screw of the first bolt (41) and is pressed between the head of the first bolt (41) and the surface of the second pressure plate (32).

5. The pressurizing device according to claim 4, characterized in that, Each central pressurization unit (5) includes: The second bolt (51), the shank of the second bolt (51) passes through the pressure plate (3) from the central region of the surface (32) of the second pressure plate to the support plate (1), and is threadedly connected to the support plate (1); and The second compression spring (52) is axially mounted on the screw of the second bolt (51) and is pressed between the head of the second bolt (51) and the surface of the second pressure plate (32).

6. The pressurizing device according to claim 4, characterized in that, Each central pressurization unit (5') includes: An elastic plate (51') is fixed to the support plate (1'); A nut (52') is fixedly disposed in and penetrates the elastic plate (51'), and the axial direction of the nut (52') is perpendicular to the surface of the elastic plate (51'); and The third bolt (53') has its thread extending from the central region of the second pressure plate surface (32) through the pressure plate (3) to the nut (52') and threadedly connected to the nut (52'), and the head of the third bolt (53') is recessed in the groove of the second pressure plate surface (32).

7. The pressurizing device according to claim 6, characterized in that, The elastic plate (51') includes an elastic plate body (511') that protrudes toward the support plate (1') in its natural state, and the nut (52') is fixedly disposed in the central region of the elastic plate body (511').

8. The pressurizing device according to claim 7, characterized in that, The two opposite ends of the elastic plate body (511') are bent toward the support plate (1') to form a support portion (512'), and the free end of the support portion (512') is bent from the inside to the outside along a direction parallel to the support plate (1') to form a fixing portion (513'), and the fixing portion (513') is connected to the support plate (1') by a fastener (514').

9. The pressurizing device according to claim 6, characterized in that, The support plate (1') has a recess, and the elastic plate (51') is arranged in the recess.

10. The pressurizing device according to claim 6, characterized in that, The support plate (1') includes a solid plate (11') and a hollow plate (12') arranged on the solid plate (11'). A hollow area is formed in the hollow plate (12'), and the elastic plate (51') is fixed on the solid plate (11') in the hollow area.

11. The pressurizing device according to claim 1, characterized in that, The electronic component (8) is an electronic chip or a chip processor.

12. An electronic device comprising electronic components (8), a circuit board (2), and a pressurizing device according to any one of claims 1 to 11, wherein, The electronic component (8) is pressed onto the circuit board (2) by the pressure device.

13. The electronic device according to claim 12, characterized in that, The electronic device also includes a connector (9) disposed on the circuit board (2), and the electronic components (8) are pressed onto the connector (9) by the pressure device.

14. An electronic device comprising electronic components (8), a circuit board (2), a cooling plate (7), and a pressurizing device according to any one of claims 6 to 11, wherein, The electronic component (8) is pressed onto the circuit board (2) by the pressurizing device, and the cooling plate (7) is disposed on the second pressure plate surface (32) of the pressure plate (3).

15. The electronic device according to claim 14, characterized in that, The electronic device also includes a connector (9) disposed on the circuit board (2), and the electronic components (8) are pressed onto the connector (9) by the pressure device.

Citation Information

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