Cold plate assembly, high heat flux electronic device heat sink assembly, system, and method

Abstract

The application discloses a cold plate assembly, a high heat flux density electronic device heat dissipation assembly, a system and a method. The heat dissipation system comprises a compressor, a condenser and a heat dissipation assembly. The heat dissipation assembly comprises a cold plate assembly and an energy storage assembly. The cold plate assembly comprises a first throttling device and a phase change cold plate. The energy storage assembly comprises a second throttling device, an energy storage device and a second on-off control device. When the high heat flux density electronic device is operated at an over frequency, the working medium flowing from the phase change cold plate into the energy storage device stores part of the absorbed heat in the energy storage device to recover part of the cold. When switching to rated operation, the working medium flowing into the energy storage device through the second throttling device carries away the heat stored in the energy storage device to recover the heat storage capacity of the energy storage device, and the working medium flowing into the phase change cold plate through the first throttling device carries away the heat of the high heat flux density electronic device. In this way, the volume, weight and power consumption of the system can be reduced, the system is compact, light and low in power consumption, and is suitable for mobile devices.

Description

Technical Field

[0001] This application relates to the field of heat dissipation, and more particularly to a cold plate assembly. This application also relates to a heat dissipation assembly for high heat flux density electronic devices using the aforementioned cold plate assembly, a heat dissipation system for high heat flux density electronic devices including the aforementioned heat dissipation assembly, and a heat dissipation method for high heat flux density electronic devices using the aforementioned heat dissipation system. Background Technology

[0002] The continuous development of electronic technology has led to increased integration and performance of electronic devices, resulting in higher power and heat flux density. Consequently, high heat flux density electronic devices generate enormous amounts of heat during operation. To prevent excessively high temperatures from affecting the performance and operational stability of electronic devices, existing solutions employ liquid cooling technology. This includes liquid cooling systems that utilize single-phase liquid cooling plates for heat exchange or liquid cooling systems that employ phase change principles through gas-liquid two-phase boiling heat exchange to dissipate heat from high heat flux density electronic devices.

[0003] In the process of realizing this invention, the inventors discovered at least the following problems in the prior art:

[0004] In existing solutions, the system equipment still needs to be configured with maximum cooling capacity. For small systems of high heat flux density electronic devices, the system size, weight, and power consumption are large, the system's portability is limited, and it causes great inconvenience to users. Summary of the Invention

[0005] To address the issues of large size, weight, and power consumption in the heat dissipation systems of high heat flux density electronic devices in the prior art, this application provides a cold plate assembly, a heat dissipation assembly for high heat flux density electronic devices, a system, and a method, which can reduce the size, weight, and power consumption of the system and improve its portability.

[0006] In a first aspect, embodiments of this application provide a cold plate assembly applied to a heat dissipation system for heat dissipating high heat flux density electronic devices; the cold plate assembly includes: a phase change cold plate and a first throttling device connected to the phase change cold plate;

[0007] The phase change cold plate is provided with:

[0008] At least two non-communicating cavities, each of which is connected to the energy storage component of the heat dissipation system; and

[0009] The first connecting pipe is connected to all the cavities, and the phase change cold plate forms a working fluid flow channel after the first connecting pipe is connected to all the cavities; the first connecting pipe is provided with a first on / off control device.

[0010] The energy storage component includes:

[0011] The second throttling device, the energy storage device, and the second on / off control device are connected in sequence via pipelines; and

[0012] The second connecting pipe is used to connect the energy storage device to each of the cavities respectively; the second connecting pipe is provided with a third on / off control device;

[0013] Wherein: the cold plate assembly and the heat dissipation system form a circuit after being connected, and the heat dissipation system is filled with working fluid;

[0014] When the high heat flux density electronic device is operating in the first mode, the working fluid is not split; the working fluid flows sequentially through the first throttling device, the corresponding cavity, the energy storage device, and the corresponding cavity. The working fluid flowing into the cavity absorbs heat from the high heat flux density electronic device, and the working fluid flowing from the cavity into the energy storage device transfers the absorbed heat to the energy storage device to restore cooling capacity.

[0015] When the high heat flux density electronic device is operating in the second mode, the working fluid is divided into two parts; one part of the working fluid flows sequentially through the second throttling device, the energy storage device, and the second on / off control device, and the working fluid flowing into the energy storage device absorbs the heat of the energy storage device so that the energy storage device can restore its heat storage capacity; the other part of the working fluid flows sequentially through the first throttling device, the corresponding cavity, the first connecting pipe, and the corresponding cavity.

[0016] The cold plate assembly provided in this application includes a phase change cold plate and a first throttling device connected to the phase change cold plate. The phase change cold plate is provided with at least two non-communicating cavities and a first connecting pipe. The first connecting pipe is provided with a first on / off control device. The first connecting pipe is connected to all cavities of the phase change cold plate, so that the phase change cold plate forms a working fluid flow channel after the first connecting pipe is connected to all cavities. When the cold plate assembly is applied to a heat dissipation system, each cavity of the phase change cold plate is connected to an energy storage component of the heat dissipation system. The energy storage component includes a second throttling device, an energy storage device, and a second on / off control device connected sequentially through pipes, and a second connecting pipe connecting the energy storage device to each cavity respectively. The second connecting pipe is provided with a third on / off control device. After the cold plate assembly is connected to the heat dissipation system, a loop is formed. The heat dissipation system is filled with a working fluid. When the high heat flux density electronic device is operating in a first mode, the working fluid... The working fluid flows sequentially through the first throttling device, the corresponding cavity, the energy storage device, and the corresponding cavity. The working fluid flowing into the cavity absorbs heat from the high heat flux density electronic equipment. The working fluid flowing from the cavity into the energy storage device transfers the absorbed heat to the energy storage device to restore cooling capacity. This ensures that the working fluid flowing out of the phase change cold plate does not carry away all the heat generated by the high heat flux density electronic equipment, so the circulation rate of the working fluid does not need to reach the maximum cooling capacity. When the high heat flux density electronic equipment is operating in the second mode, the working fluid is divided into two parts. One part of the working fluid flows sequentially through the second throttling device, the energy storage device, and the second on / off control device. The working fluid flowing into the energy storage device absorbs heat from the energy storage device to restore the heat storage capacity of the energy storage device. The other part of the working fluid flows sequentially through the first throttling device, the corresponding cavity, the first connecting pipe, and the corresponding cavity. The working fluid flowing into the cavity absorbs heat from the high heat flux density electronic equipment. In this way, throughout the entire operating cycle, not only can the maximum temperature of the high heat flux density electronic equipment be controlled within a certain range to meet its heat dissipation requirements, but the system equipment can also be configured with maximum cooling capacity without requiring it to be of a smaller size. Furthermore, the amount of working fluid charged can be reduced. Therefore, for the heat dissipation system using the cold plate assembly provided in this application embodiment, the system's size, weight, and power consumption can be reduced, which is beneficial for achieving system compactness, lightweighting, and low power consumption, improving system portability, making it suitable for mobile devices, and more easily adapting to varying operating conditions. On the other hand, for the heat dissipation system using the cold plate assembly provided in this application embodiment, by setting the first and second throttling devices, it is beneficial to regulate the saturation temperature of the working fluid. This not only effectively controls the temperature uniformity of the high heat flux density electronic equipment throughout the entire operating cycle, but also further reduces the system's power consumption throughout the entire operating cycle.

[0017] Secondly, embodiments of this application provide a heat dissipation component for a high heat flux density electronic device, which is applied to a heat dissipation system for a high heat flux density electronic device. The heat dissipation component for the high heat flux density electronic device includes: at least one cold plate component and at least one energy storage component; the cold plate component is the cold plate component described in the first aspect, and the energy storage component is the energy storage component described in the first aspect.

[0018] Each of the energy storage devices is in communication with at least one of the cavities of the phase change cold plate;

[0019] Wherein: the high heat flux density electronic device heat dissipation system is connected to the cold plate assembly and the energy storage assembly to form a circuit, and the heat dissipation system is filled with working fluid;

[0020] When the high heat flux density electronic device is operating in the first mode, the working fluid first flows into the cold plate assembly; the working fluid flowing into the cold plate assembly flows sequentially through the first throttling device, the corresponding cavity, the energy storage device, and the corresponding cavity; the working fluid flowing into the cavity absorbs heat from the high heat flux density electronic device; the working fluid flowing from the cavity into the energy storage device transfers the absorbed heat to the energy storage device to restore cooling capacity;

[0021] When the high heat flux density electronic device is operating in the second mode, the working fluid is diverted; the working fluid flowing into the energy storage component flows sequentially through the second throttling device, the energy storage device, and the second on / off control device, and the working fluid flowing into the energy storage device absorbs the heat of the energy storage device so that the energy storage device can restore its heat storage capacity; the working fluid flowing into the cold plate assembly flows sequentially through the first throttling device, the corresponding cavity, the first connecting pipe, and the corresponding cavity.

[0022] The high heat flux density electronic device heat dissipation assembly provided in this application embodiment includes at least one cold plate assembly and at least one energy storage assembly; the cold plate assembly is the cold plate assembly described in the first aspect, and the energy storage assembly is the energy storage assembly described in the first aspect; each energy storage device is connected to at least all cavities of a phase change cold plate; when the high heat flux density electronic device heat dissipation assembly is applied to a high heat flux density electronic device heat dissipation system, the high heat flux density electronic device heat dissipation system is connected to the cold plate assembly and the energy storage assembly respectively to form a loop, and the heat dissipation system is filled with working fluid; when the high heat flux density electronic device is operating in the first mode, the working fluid first flows into the cold plate assembly, and the working fluid flowing into the cold plate assembly flows sequentially through the first throttling device, the corresponding cavity, the energy storage device, and the corresponding cavity, and the working fluid flowing into the cavity absorbs... Heat from the high heat flux density electronic device flows from the cavity into the working fluid of the energy storage device, where it absorbs heat and transfers it to the energy storage device to restore cooling capacity. This ensures that the working fluid flowing out of the phase change cold plate does not carry away all the heat generated by the high heat flux density electronic device, thus the circulation rate of the working fluid does not need to reach the maximum cooling capacity. When the high heat flux density electronic device operates in the second mode, the working fluid is diverted. The working fluid flowing into the energy storage component flows sequentially through the second throttling device, the energy storage device, and the second on / off control device. The working fluid flowing into the energy storage device absorbs the heat from the energy storage device to restore its heat storage capacity. The working fluid flowing into the cold plate assembly flows sequentially through the first throttling device, the corresponding cavity, the first connecting pipe, and the corresponding cavity. The working fluid flowing into the cavity absorbs the heat from the high heat flux density electronic device. Thus, throughout the entire operating cycle, not only can the maximum temperature of the high heat flux density electronic device be controlled within a certain range, but the system equipment does not need to be configured with maximum cooling capacity, allowing for the use of smaller system equipment and reducing the amount of working fluid charged. Therefore, for the high heat flux density electronic device heat dissipation system using the heat dissipation component provided in this application embodiment, the system's volume, weight, and power consumption can be reduced, which is beneficial for achieving system compactness, lightweighting, and low power consumption, improving system portability, making it suitable for mobile devices, and more easily adapting to varying operating modes. On the other hand, the high heat flux density electronic device heat dissipation component provided in this application embodiment, by setting the first throttling device and the second throttling device, is beneficial for regulating the saturation temperature of the working fluid, thereby not only effectively controlling the temperature uniformity of the high heat flux density electronic device throughout the entire operating cycle, but also further reducing the system's power consumption throughout the entire operating cycle.

[0023] Optionally, there are multiple cold plate assemblies and multiple energy storage assemblies;

[0024] Each of the phase change cold plates is connected to only one of the energy storage devices, and each of the energy storage devices is connected to only one of the phase change cold plates.

[0025] Optionally, the number of cold plate assemblies may be multiple, and the number of energy storage components may be one;

[0026] Each phase change cold plate is connected to the energy storage device.

[0027] Optionally, the number of both the cold plate assembly and the energy storage assembly is one.

[0028] Thirdly, embodiments of this application provide a heat dissipation system for high heat flux density electronic devices, including: a compressor, a condenser, and a heat dissipation component; wherein, the heat dissipation component is the high heat flux density electronic device heat dissipation component described in any of the second aspects;

[0029] The compressor, the condenser, and the heat dissipation assembly are connected in sequence through pipelines to form a circulation loop, and the working fluid circulates in the circulation loop.

[0030] The output end of the condenser is connected to the input ends of all the first throttling devices and all the input ends of the second throttling devices, respectively; the inlet end of the compressor is connected to all the second on / off control devices and at least one cavity of each phase change cold plate, respectively.

[0031] The compressor is used to draw in, compress, and deliver the working fluid.

[0032] Optional features also include: an oil separator;

[0033] The oil separator is located between the compressor and the condenser and is used to separate the lubricating oil from the working fluid.

[0034] Optionally, it may also include: a fourth on / off control device;

[0035] The compressor is provided with an oil return port, and the oil separator is provided with an oil separation port;

[0036] One end of the fourth on / off control device is connected to the oil return port, and the other end is connected to the oil separation port.

[0037] Optional features also include: a liquid storage tank;

[0038] The liquid storage tank is disposed between the condenser and the first throttling device and the second throttling device, and is used to regulate the circulation rate of the working fluid.

[0039] Optional features also include: a gas-liquid separator;

[0040] The gas-liquid separator is disposed between the second on / off control device, the phase change cold plate and the compressor, and is used to separate the gaseous and liquid components in the working fluid.

[0041] The high heat flux density electronic device heat dissipation system provided in this application embodiment has the same beneficial effects as the high heat flux density electronic device heat dissipation component provided in the application embodiment because it has the high heat flux density electronic device heat dissipation component described in any of the second aspects.

[0042] Fourthly, embodiments of this application provide a heat dissipation method for high heat flux density electronic devices, employing the high heat flux density electronic device heat dissipation system described in any of the third aspects, wherein the high heat flux density electronic device heat dissipation method includes:

[0043] When the high heat flux density electronic device is operating beyond its rated capacity, the first temperature of the high heat flux density electronic device is obtained.

[0044] Determine whether the first temperature exceeds a first preset range;

[0045] If so, based on the first temperature and the second temperature of the material or working fluid inside the energy storage device, the first throttling device is controlled, and the second throttling device is controlled to close, so that the saturation temperature of the working fluid is lower than the first temperature and higher than the second temperature.

[0046] or,

[0047] When the high heat flux density electronic device is operating at its rated speed, the third temperature of the high heat flux density electronic device is obtained;

[0048] Determine whether the third temperature exceeds the second preset range;

[0049] If so, the first throttling device and the second throttling device are controlled based on the third temperature and the fourth temperature of the material or working fluid inside the energy storage device, so that the saturation temperature of the working fluid output by the first throttling device is only lower than the third temperature, and the saturation temperature of the working fluid output by the second throttling device is lower than the fourth temperature.

[0050] The heat dissipation method for high heat flux density electronic devices provided in this application embodiment, when applied with the high heat flux density electronic device heat dissipation system described in any of the third aspects, enables the high heat flux density electronic device heat dissipation system provided in this application embodiment to have the same beneficial effects as the high heat flux density electronic device heat dissipation component provided in this application embodiment. Attached Figure Description

[0051] Figure 1 This is a schematic diagram of one embodiment of the heat dissipation component of this application;

[0052] Figure 2 This is a schematic diagram of another embodiment of the heat dissipation component of this application;

[0053] Figure 3This is a schematic diagram of another embodiment of the heat dissipation component of this application;

[0054] Figure 4 This is a schematic diagram of one embodiment of the heat dissipation system of this application;

[0055] Figure 5 This is a schematic diagram of another embodiment of the heat dissipation system of this application. Detailed Implementation

[0056] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0057] In the description of the embodiments of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0058] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0059] The continuous development of electronic technology has led to increased integration and performance of electronic devices, resulting in higher power and heat flux densities. Consequently, high heat flux density electronic devices generate enormous amounts of heat during operation. To prevent excessive temperature from affecting the performance and operational stability of these devices, heat dissipation is necessary. Common heat dissipation methods include air cooling and liquid cooling. Air cooling, due to its physical limitations, has low heat dissipation capacity and is highly susceptible to environmental influences, making it unsuitable for the heat dissipation needs of high heat flux density electronic devices. Liquid cooling offers superior heat dissipation capabilities and is gaining increasing attention; however, common components in water systems, such as water tanks, pumps, and heat exchangers, are large and heavy, resulting in a large system size and weight, poor mobility, and thus limiting its use and failing to meet the heat dissipation requirements of mobile devices. While liquid cooling systems utilizing single-phase liquid cooling plates or the phase change principle through gas-liquid two-phase boiling heat exchange can meet the heat dissipation needs of high heat flux density electronic devices, they present the following problems:

[0060] 1. Liquid cooling systems that utilize single-phase liquid cooling plates for heat dissipation require a large flow rate of cooling medium to meet the high heat flux density of heat dissipation, and the system equipment must be configured with maximum cooling capacity. Therefore, the system has a large size and weight, which limits its application in mobile devices and inevitably increases the system power consumption.

[0061] 2. Liquid cooling systems that utilize the phase change principle to dissipate heat through gas-liquid two-phase boiling heat exchange are suitable for high heat flux density electronic devices operating under variable conditions, such as intermittent operation in rated mode and overclocking mode. If only gas-liquid two-phase boiling heat exchange is used, the system still needs to be configured with maximum cooling capacity. For small systems of high heat flux density electronic devices, the system's size, weight, and power consumption are still excessive. In other words, the system's size, weight, and power consumption are relatively large, which limits its portability and restricts its application in mobile devices.

[0062] Therefore, the liquid cooling system in the existing solution still needs to be configured with the maximum cooling capacity. For small systems of high heat flux density electronic devices, the system size, weight and power consumption are large, the portability of the system is restricted, and it causes great inconvenience to users.

[0063] To reduce the size, weight, and power consumption of liquid cooling systems and improve system portability, embodiments of this application provide a cold plate assembly, a heat dissipation assembly for high heat flux density electronic devices, a system, and a method.

[0064] The cold plate assembly provided in this application is used in a heat dissipation system for cooling high heat flux density electronic devices. The cold plate assembly includes: a phase change cold plate and a first throttling device connected to the phase change cold plate;

[0065] Phase change cold plates are used to absorb heat generated by high heat flux density electronic devices and exchange heat with the working fluid flowing into the cavity. The phase change cold plate is equipped with:

[0066] At least two non-communicating cavities, each connected to the energy storage component of the heat dissipation system; it can be understood that at least two non-communicating cavities here means that at least two cavities are not directly connected, and each cavity has a working fluid inlet and a working fluid outlet for the working fluid to flow into and out of the cavity; high heat flux density electronic equipment here refers to equipment with a heat flux density higher than 100W / cm2, which can be lasers, IGBT modules, etc., and is not specifically limited here;

[0067] as well as

[0068] The first connecting pipe is connected to all cavities of the phase change cold plate, and the phase change cold plate forms a working fluid flow channel after the first connecting pipe is connected to all cavities; the first connecting pipe is provided with a first on / off control device; specifically, the first connecting pipe includes at least one first branch, each first branch is used to connect one of the cavities to another cavity so that the working fluid can flow from one cavity to another cavity; each first branch is provided with a first on / off control device to control the flow of the working fluid;

[0069] Energy storage components include:

[0070] The second throttling device, the energy storage device, and the second on / off control device are connected in sequence via pipelines; and

[0071] The second connecting pipeline is used to connect the energy storage device to each cavity of the phase change cold plate; the second connecting pipeline is equipped with a third on / off control device; specifically, the second connecting pipeline includes at least two second branches, and at least one second branch is provided between the energy storage device and each cavity of the phase change cold plate to allow the working fluid to flow from the cavity into the energy storage device and / or to allow the working fluid to flow from the energy storage device into the cavity; each second branch is equipped with a third on / off control device to control the flow of the working fluid;

[0072] Wherein: the cold plate assembly and the heat dissipation system form a loop after being connected. The heat dissipation system is filled with working fluid, which circulates in the loop.

[0073] When the high heat flux density electronic device is operating in the first mode, the working fluid does not split; the working fluid flows sequentially through the first throttling device, the corresponding cavity, the energy storage device, and the corresponding cavity. The working fluid flowing into the cavity absorbs the heat from the high heat flux density electronic device, and the working fluid flowing from the cavity into the energy storage device transfers the heat it has absorbed to the energy storage device to restore the cooling capacity.

[0074] When the high heat flux density electronic device is operating in the second mode, the working fluid is divided into two parts; one part of the working fluid flows sequentially through the second throttling device, the energy storage device, and the second on / off control device, and the working fluid flowing into the energy storage device absorbs the heat from the energy storage device so that the energy storage device can restore its heat storage capacity; the other part of the working fluid flows sequentially through the first throttling device, the corresponding cavity, the first connecting pipe, and the corresponding cavity, and the working fluid flowing into the cavity absorbs the heat from the high heat flux density electronic device.

[0075] Understandably, the first mode here can be an overclocking mode. High heat flux density electronic devices operating in the first mode means that the high heat flux density electronic devices are operating in overclocking mode. Overclocking mode refers to the mode of operation beyond the rated frequency / power. Correspondingly, the second mode here can be the rated mode. High heat flux density electronic devices operating in the second mode means that the high heat flux density electronic devices are operating in the rated mode. Rated mode refers to the mode of operation at the rated frequency / power.

[0076] Furthermore, the heat dissipation system has a working fluid delivery end and a working fluid return end. The working fluid delivery end is connected to the input end of the first throttling device and the input end of the second throttling device, respectively. The output end of the first throttling device is connected to the working fluid inlet of at least one cavity to input the working fluid into the corresponding cavity. The working fluid return end is connected to the second on / off control device and the working fluid outlet of at least one cavity to realize the return of the working fluid in the heat dissipation system. It can be understood that, in addition to the energy storage component, the heat dissipation system generally also has a compressor and a condenser connected in sequence by pipelines. Therefore, the working fluid delivery end here can be the output end of the condenser, and the working fluid return end can be the inlet end of the compressor. The specifics are not limited here.

[0077] in:

[0078] When high heat flux density electronic equipment is overclocked, the first throttling device and the third on / off control device are opened, and the second throttling device, the first on / off control device, and the second on / off control device are closed. Driven by the heat dissipation system, the working fluid flows sequentially through the working fluid delivery end, the first throttling device, the corresponding cavity, the energy storage device, and the corresponding cavity. The working fluid eventually flows into the corresponding cavity connected to the working fluid return end and flows into the working fluid return end through the working fluid outlet of the corresponding cavity. In this process, the working fluid flowing into the cavity absorbs the heat from the high heat flux density electronic equipment to remove the heat from the high heat flux density electronic equipment. The working fluid flowing into the energy storage device transfers the heat it absorbs to the energy storage device to restore the cooling capacity of the working fluid and restore its heat dissipation capacity. This achieves heat dissipation for the overclocking operation of high heat flux density electronic equipment with a smaller flow rate of working fluid.

[0079] When the high heat flux density electronic device is running at its rated speed, the first throttling device, the second throttling device, the first on / off control device, and the second on / off control device are opened, and the third on / off control device is also opened. Driven by the heat dissipation system, a portion of the working fluid flows sequentially through the working fluid delivery end, the second throttling device, the energy storage device, the second on / off control device, and the working fluid return end. During this process, the working fluid flowing into the energy storage device absorbs the heat from the energy storage device, allowing the energy storage device to restore its heat storage capacity. This allows the energy storage device to temporarily store the heat from the high heat flux density electronic device brought by the working fluid during overclocking. Another portion of the working fluid flows sequentially through the working fluid delivery end, the first throttling device, the corresponding cavity, the corresponding first branch, the corresponding cavity, and the working fluid return end. During this process, the working fluid flowing between the cavities of the phase change cold plate absorbs the heat from the high heat flux density electronic device, thus carrying away the heat from the high heat flux density electronic device and achieving cooling down of the high heat flux density electronic device.

[0080] The following describes some specific embodiments of the cold plate assembly provided in this application.

[0081] In the first specific embodiment, please refer to Figure 1 A cold plate assembly is used in a heat dissipation system for dissipating heat from electronic devices with high heat flux density; the cold plate assembly includes a phase change cold plate 6 and a first throttling device 4 connected to the phase change cold plate 6;

[0082] The phase change cold plate 6 is provided with two non-communicating cavities. For ease of understanding, the two cavities are divided into a first cavity 61 and a second cavity 62. It can be understood that both the first cavity 61 and the second cavity 62 have a working fluid inlet and a working fluid outlet for the working fluid to flow in and out.

[0083] The phase change cold plate 6 is also provided with a first connecting pipe, which is connected to all cavities. That is, one end of the first connecting pipe is connected to the working fluid outlet of the first cavity 61, and the other end is connected to the working fluid inlet of the second cavity 62, so that the working fluid can flow from the first cavity 61 to the second cavity 62. The first connecting pipe can be composed of a first branch, and the first branch is provided with a first on / off control device 13 to control the flow of the working fluid. Specifically, the first on / off control device 13 can be a solenoid valve.

[0084] The energy storage assembly includes a second throttling device 5, an energy storage device 7, and a second on / off control device 12, which are sequentially connected by pipelines. It also includes a second connecting pipeline for connecting the energy storage device 7 to each cavity of the phase change cold plate 6. Specifically, the second connecting pipeline connects the energy storage device 7 to the first cavity 61 and the second cavity 62, allowing the working fluid to flow from the first cavity 61 into the energy storage device 7 and from the energy storage device 7 into the second cavity 62. This second connecting pipeline can consist of two second branches: one branch between the energy storage device 7 and the working fluid outlet of the first cavity 61, and another branch between the energy storage device 7 and the working fluid inlet of the second cavity 62. Each cavity is provided with a second branch for the working medium to flow from the cavity into the energy storage device 7 or from the energy storage device 7 into the cavity; each second branch is provided with a third on / off control device 8 to control the flow of the working medium; specifically, the second on / off control device 12 and the third on / off control device 8 can both be solenoid valves; it is understood that the energy storage device 7 here has an input port and an output port to be used in conjunction with the phase change cold plate 6. The energy storage device 7 can be a phase change energy storage device or a non-phase change energy storage device, which can be used for heat storage; the energy storage device 7 provided in this application is preferably a phase change energy storage device, that is, the energy storage device 7 is preferably a phase change energy storage device, and heat storage is achieved through the phase change reaction of the phase change energy storage device;

[0085] The heat dissipation system has a working fluid delivery end and a working fluid return end. The working fluid delivery end is connected to the input end of the first throttling device 4 and the input end of the second throttling device 5, respectively. The output end of the first throttling device 4 is connected to the working fluid inlet of the first cavity 61 to input the working fluid into the first cavity 61. The working fluid return end is connected to the second on / off control device 12 and the working fluid outlet of the second cavity 62 to realize the return of the working fluid in the heat dissipation system. It can be understood that, in addition to the energy storage component, the heat dissipation system generally also has a compressor and a condenser connected in sequence by pipelines. Therefore, the working fluid delivery end here can be the output end of the condenser, and the working fluid return end can be the air inlet of the compressor. The specifics are not limited here.

[0086] in:

[0087] When high heat flux density electronic devices are overclocked, the first throttling device 4 and the third on / off control device 8 are both turned on, while the second throttling device 5, the first on / off control device 13, and the second on / off control device 12 are all turned off. Driven by the heat dissipation system, the working fluid flows sequentially through the working fluid delivery end, the first throttling device 4, the first cavity 61, the energy storage device 7, and the second cavity 62. The working fluid eventually flows into the second cavity 62, which is connected to the working fluid return end, and flows into the working fluid return end through the working fluid outlet of the second cavity 62. During this process, the working fluid flowing into the cavity absorbs heat from the high heat flux density electronic devices to remove the heat. The working fluid flowing into the energy storage device 7 transfers the absorbed heat to the energy storage device 7 to restore the working fluid's cooling capacity and heat dissipation ability. The working fluid flowing out of the phase change cold plate does not need to carry away all the heat generated by the high heat flux density electronic device. Therefore, the circulation volume of the working fluid does not need to reach the maximum cooling capacity, thereby achieving heat dissipation for the overclocking operation of the high heat flux density electronic device with a smaller flow rate of working fluid circulation. Specifically, the working fluid flowing into the first cavity 61 absorbs the heat from the high heat flux density electronic device, and the working fluid flowing into the energy storage device 7 transfers the heat absorbed in the first cavity 61 to the energy storage device for storage, so that the working fluid is restored to its cooling capacity, ensuring that the working fluid flowing into the second cavity 62 has sufficient heat dissipation capacity. After the working fluid flows out of the energy storage device 7, it will flow into the second cavity 62 to continue to absorb the heat from the high heat flux density electronic device, so as to carry away the heat from the high heat flux density electronic device and achieve cooling down of the high heat flux density electronic device.

[0088] When the high heat flux density electronic equipment is running at its rated speed, the first throttling device 4, the second throttling device 5, the first on / off control device 13, and the second on / off control device 12 are all turned on, and the third on / off control device 8 is turned off. Driven by the heat dissipation system, a portion of the working fluid flows sequentially through the working fluid delivery end, the second throttling device 5, the energy storage device 7, the second on / off control device 12, and the working fluid return end. During this process, the working fluid flowing into the energy storage device 7 absorbs the heat stored in the energy storage device 7, allowing the energy storage device 7 to restore its heat storage capacity. This allows the energy storage device 7 to provide heat storage during overclocking of the high heat flux density electronic equipment. 7. Temporarily store the heat from the high heat flux density electronic device brought by the working fluid; another part of the working fluid flows sequentially through the working fluid delivery end, the first throttling device 4, the first cavity 61, the second cavity 62, and the working fluid return end. During this process, a part of the working fluid flowing into the cold plate assembly first flows into the first cavity 61 to absorb the heat from the high heat flux density electronic device, and then flows into the second cavity 62 through the working fluid outlet of the first cavity 61, the first branch, and the working fluid inlet of the second cavity 62 to continue absorbing the heat from the high heat flux density electronic device, so as to remove the heat from the high heat flux density electronic device and achieve cooling down of the high heat flux density electronic device.

[0089] Thus, throughout the entire operating cycle, not only can the maximum temperature of high heat flux density electronic devices be controlled within a certain range to meet their heat dissipation requirements, but also, to cope with the overclocking operation of high heat flux density electronic devices, it is not necessary to configure the system equipment with maximum cooling capacity. Smaller system equipment can be used, and the amount of working fluid charged in the system can be reduced. Therefore, for the heat dissipation system using the cold plate assembly provided in this application, the system's size, weight, and power consumption can be reduced, which is conducive to achieving system compactness, lightweighting, and low power consumption, improving system portability, making it suitable for mobile devices, and more easily adapting to various operating modes. On the other hand, for the heat dissipation system using the cold plate assembly provided in this application, by setting the first throttling device and the second throttling device, it is beneficial to regulate the saturation temperature of the working fluid. This not only effectively controls the temperature uniformity of high heat flux density electronic devices throughout the entire operating cycle, but also further reduces the system's power consumption throughout the entire operating cycle.

[0090] In a second specific embodiment, a cold plate assembly is used in a heat dissipation system for dissipating heat from electronic devices with high heat flux density; the cold plate assembly includes a phase change cold plate 6 and a first throttling device 4 connected to the phase change cold plate 6;

[0091] The phase change cold plate has three non-communicating cavities. For ease of understanding, the three cavities are divided into the first cavity, the second cavity, and the third cavity. It can be understood that the first cavity, the second cavity, and the third cavity all have working fluid inlets and outlets for the working fluid to flow in and out.

[0092] The phase change cold plate is also equipped with a first connecting pipe, which connects to all cavities, namely the first cavity, the second cavity, and the third cavity. This first connecting pipe can consist of two first branches, which are referred to as first branch A and first branch B for ease of distinction and understanding. One end of first branch A connects to the working fluid outlet of the first cavity, and the other end connects to the working fluid inlet of the second cavity, allowing the working fluid to flow from the first cavity to the second cavity. One end of first branch B connects to the working fluid outlet of the second cavity, and the other end connects to the working fluid inlet of the third cavity, allowing the working fluid to flow from the second cavity to the third cavity. Both first branch A and first branch B are equipped with a first on / off control device to control the flow of the working fluid; specifically, all first on / off control devices can be solenoid valves.

[0093] The energy storage assembly includes a second throttling device, an energy storage device, and a second on / off control device, all connected sequentially by pipelines. It also includes a second connecting pipeline that connects the energy storage device to each cavity of the phase change cold plate, specifically connecting the energy storage device to the first, second, and third cavities. This second connecting pipeline can consist of four second branches: one branch between the energy storage device and the working fluid outlet of the first cavity; one branch between the energy storage device and the working fluid inlet and outlet of the second cavity; and another branch between the energy storage device and the working fluid inlet of the third cavity. In other words, the energy storage device is connected to each cavity. At least one second branch is provided for the working medium to flow from the cavity into the energy storage device and / or for the working medium to flow from the energy storage device into the cavity; each second branch is provided with a third on / off control device to control the flow of the working medium; specifically, all second on / off control devices and all third on / off control devices can be solenoid valves; it is understood that the energy storage device here has an input port and an output port to be used in conjunction with the phase change cold plate, and the energy storage device can be a phase change energy storage device or a non-phase change energy storage device, which can be used for heat storage; the energy storage device provided in this application is preferably a phase change energy storage device, that is, the energy storage device is preferably a phase change energy storage device, and heat storage is achieved through the phase change reaction of the phase change energy storage device;

[0094] The heat dissipation system has a working fluid delivery end and a working fluid return end. The working fluid delivery end is connected to the input ends of the first throttling device and the second throttling device, respectively. The output end of the first throttling device is connected to the working fluid inlet of the first cavity to input the working fluid into the first cavity. The working fluid return end is connected to the second on / off control device and the working fluid outlet of the third cavity to realize the return of the working fluid in the heat dissipation system. It can be understood that, in addition to energy storage components, the heat dissipation system generally also has a compressor and a condenser connected in sequence through pipelines. Therefore, the working fluid delivery end here can be the output end of the condenser, and the working fluid return end can be the inlet end of the compressor. The specifics are not limited here.

[0095] in:

[0096] When high heat flux density electronic devices are overclocked, the first throttling device and the third on / off control device are both activated, while the second throttling device, the first on / off control device, and the second on / off control device are all deactivated. Driven by the cooling system, the working fluid flows sequentially through the working fluid delivery end, the first throttling device, the first cavity, the energy storage device, the second cavity, the energy storage device, and the third cavity. The working fluid eventually flows into the third cavity, which is connected to the working fluid return end, and then flows back into the working fluid return end through the working fluid outlet of the third cavity. During this process, the working fluid flowing into the cavity absorbs heat from the high heat flux density electronic devices to remove the heat. Meanwhile, the working fluid flowing into the energy storage device transfers the absorbed heat to the energy storage device, restoring the working fluid's cooling capacity and thus its heat dissipation ability. This allows the overclocking of high heat flux density electronic devices to be completed with a smaller flow rate of working fluid. The heat dissipation during operation is as follows: Specifically, the working fluid flowing into the first cavity absorbs heat from the high heat flux density electronic equipment, and then flows into the energy storage device to transfer the heat absorbed in the first cavity to the energy storage device for storage, so that the working fluid recovers at least a portion of its cooling capacity to ensure that the working fluid flowing into the second cavity has sufficient heat dissipation capacity. After the working fluid flows out of the energy storage device, it flows into the second cavity to continue absorbing heat from the high heat flux density electronic equipment, and then flows into the energy storage device to transfer the heat absorbed in the second cavity to the energy storage device, so that the working fluid recovers at least a portion of its cooling capacity again to ensure that the working fluid flowing into the third cavity has sufficient heat dissipation capacity. After the working fluid flows out of the energy storage device again, it flows into the third cavity to continue absorbing heat from the high heat flux density electronic equipment. Finally, the working fluid flows into the working fluid return end through the working fluid outlet of the third cavity for the next cycle.

[0097] When high heat flux density electronic equipment is running at rated speed, the first throttling device, the second throttling device, the first on / off control device, and the second on / off control device are all turned on, while the third on / off control device is turned off. Driven by the heat dissipation system, a portion of the working fluid flows sequentially through the working fluid delivery end, the second throttling device, the energy storage device, the second on / off control device, and the working fluid return end. During this process, the working fluid flowing into the energy storage device absorbs the heat from the energy storage device, allowing the energy storage device to restore its heat storage capacity. This allows the high heat flux generated by the working fluid to be temporarily stored in the energy storage device during high heat flux density electronic equipment overclocking. The heat from the high heat flux density electronic device is absorbed by another part of the working fluid. The working fluid flows sequentially through the working fluid delivery end, the first throttling device, the first cavity, the second cavity, the third cavity, and the working fluid return end. During this process, a portion of the working fluid flowing into the cold plate assembly first flows into the first cavity to absorb the heat from the high heat flux density electronic device, then flows into the second cavity to continue absorbing the heat from the high heat flux density electronic device, and then flows into the third cavity to continue absorbing the heat from the high heat flux density electronic device, so as to remove the heat from the high heat flux density electronic device and achieve cooling down of the high heat flux density electronic device.

[0098] It should be understood that this specific embodiment has the same technical effects as the first specific embodiment of the cold plate assembly provided in this application, and will not be described in detail here.

[0099] In the third embodiment, the structure of the cold plate assembly is roughly the same as that described in the second embodiment of the cold plate assembly, except that the phase change cold plate is provided with a first branch; one end of the first branch is connected to the working fluid outlet of the first cavity, and the other end of the first branch is connected to the working fluid inlet of the second cavity and the working fluid inlet of the third cavity, respectively, so that the working fluid can flow from the first cavity to the second cavity and the third cavity, respectively.

[0100] Correspondingly, a second branch is provided between the energy storage device and the working fluid outlet of the first chamber, and a second branch is provided between the energy storage device and the working fluid inlet of the second chamber and the working fluid inlet of the third chamber.

[0101] Correspondingly, the working fluid return end is connected to the second on / off control device and the working fluid outlet of the second cavity and the working fluid outlet of the third cavity, respectively, so as to realize the working fluid return of the heat dissipation system.

[0102] in:

[0103] When high heat flux density electronic equipment is overclocked, the first throttling device and the third on / off control device are both activated, while the second throttling device, the first on / off control device, and the second on / off control device are all deactivated. Driven by the cooling system, the working fluid flows sequentially through the working fluid delivery end, the first throttling device, the first cavity, the energy storage device, the second cavity, and the third cavity. The working fluid eventually flows into the second and third cavities connected to the working fluid return end and then flows into the working fluid return end through the corresponding working fluid outlet. During this process, the working fluid flowing into the cavity absorbs heat from the high heat flux density electronic equipment to remove the heat, while the working fluid flowing into the energy storage device transfers the absorbed heat to the energy storage device, restoring at least some of the working fluid's cooling capacity and thus achieving cooling at a lower flow rate. The working fluid circulation is used to dissipate heat from the high heat flux density electronic equipment during overclocking. Specifically, the working fluid flowing into the first cavity absorbs heat from the high heat flux density electronic equipment. The working fluid flowing into the energy storage device then transfers the heat absorbed in the first cavity to the energy storage device for storage, restoring at least some of the working fluid's cooling capacity. This ensures that the working fluid flowing into the second and third cavities has sufficient heat dissipation capacity. After heat exchange in the energy storage device, part of the working fluid flows into the second cavity to continue absorbing heat from the high heat flux density electronic equipment and finally flows into the working fluid return end through the working fluid outlet of the second cavity. The other part flows into the third cavity to continue absorbing heat from the high heat flux density electronic equipment and finally flows into the working fluid return end through the working fluid outlet of the third cavity, thus completing the heat dissipation of the high heat flux density electronic equipment.

[0104] When the high heat flux density electronic equipment is running at its rated speed, the first throttling device, the second throttling device, the first on / off control device, and the second on / off control device are all activated, while the third on / off control device is deactivated. Driven by the cooling system, a portion of the working fluid flows sequentially through the working fluid delivery end, the second throttling device, the energy storage device, the second on / off control device, and the working fluid return end. During this process, the working fluid flowing into the energy storage device absorbs the heat stored in the energy storage device, allowing the energy storage device to restore its heat storage capacity. This allows the high heat flux density electronic equipment to temporarily store the heat generated by the working fluid during overclocking. Heat; another part of the working fluid flows sequentially through the working fluid delivery end, the first throttling device, the first cavity, the second cavity and the third cavity, and the working fluid return end. During this process, a portion of the working fluid flowing into the cold plate assembly first flows into the first cavity to absorb heat from the high heat flux density electronic equipment, and then is divided into two parts through the first branch. One part flows into the second cavity to continue absorbing heat from the high heat flux density electronic equipment, and the other part flows into the third cavity to continue absorbing heat from the high heat flux density electronic equipment, so as to remove the heat from the high heat flux density electronic equipment and achieve cooling down of the high heat flux density electronic equipment.

[0105] It should be understood that this specific embodiment has the same technical effects as the first specific embodiment of the cold plate assembly provided in this application, and will not be described in detail here.

[0106] In the fourth embodiment, the structure of the cold plate assembly is roughly the same as that described in the third embodiment of the cold plate assembly. The difference is that one end of the first branch is connected to the working fluid outlet of the first cavity and the working fluid outlet of the second cavity, respectively, and the other end of the first branch is connected to the working fluid inlet of the third cavity, so that the working fluid can flow from the first cavity and the second cavity to the third cavity.

[0107] Correspondingly, a second branch is provided between the energy storage device and the working medium outlet of the first chamber and the working medium outlet of the second chamber, and a second branch is also provided between the energy storage device and the working medium inlet of the third chamber.

[0108] Correspondingly, the output end of the first throttling device is connected to the working fluid inlet of the first cavity and the working fluid inlet of the second cavity, respectively, so as to input the working fluid into the first cavity and the second cavity; the working fluid return end is connected to the second on / off control device and the working fluid outlet of the third cavity, respectively, so as to realize the working fluid return of the heat dissipation system.

[0109] in:

[0110] When high heat flux density electronic equipment is overclocked, the first throttling device and the third on / off control device are both turned on, while the second throttling device, the first on / off control device, and the second on / off control device are all turned off. Driven by the heat dissipation system, the working fluid flows sequentially through the working fluid delivery end, the first throttling device, the first and second cavities, the energy storage device, and the third cavity. The working fluid eventually flows into the third cavity and then into the working fluid return end through the working fluid outlet of the third cavity. During this process, the working fluid flowing into the first cavity and the second cavity absorbs heat from the high heat flux density electronic equipment. The working fluid flowing into the energy storage device stores at least a portion of the absorbed heat in the energy storage device, restoring at least a portion of the cooling capacity of the working fluid to ensure that the working fluid flowing into the third cavity has sufficient heat dissipation capacity. After the working fluid completes heat exchange in the energy storage device, it flows into the third cavity to continue absorbing heat from the high heat flux density electronic equipment and finally flows into the working fluid return end through the working fluid outlet of the third cavity to complete the heat dissipation of the high heat flux density electronic equipment.

[0111] When the high heat flux density electronic device is running at its rated speed, the first throttling device, the second throttling device, the first on / off control device, and the second on / off control device are all turned on, while the third on / off control device is turned off. Driven by the heat dissipation system, a portion of the working fluid flows sequentially through the working fluid delivery end, the second throttling device, the energy storage device, the second on / off control device, and the working fluid return end. During this process, the working fluid flowing into the energy storage device absorbs the heat stored in the energy storage device, allowing the energy storage device to restore its heat storage capacity. This allows the energy storage device to temporarily store the heat from the high heat flux density electronic device during overclocking. Another portion of the working fluid flows sequentially through the working fluid delivery end, the first throttling device, the first and second cavities, the third cavity, and the working fluid return end. During this process, a portion of the working fluid flowing into the cold plate assembly first flows into the first and second cavities to absorb the heat from the high heat flux density electronic device. After converging through the first branch, it flows into the third cavity to continue absorbing the heat from the high heat flux density electronic device, thus carrying away the heat from the high heat flux density electronic device and achieving cooling down of the high heat flux density electronic device.

[0112] It should be understood that this specific embodiment has the same technical effects as the first specific embodiment of the cold plate assembly provided in this application, and will not be described in detail here.

[0113] It should be understood that, in other specific embodiments, the phase change cold plate may be provided with four or more non-interconnected cavities, each with a working fluid inlet and outlet, and two or more first branches. The connection methods and working principles are as described above and will not be repeated here. The shape and specific structural form of the phase change cold plate can be adaptively adjusted according to the high heat flux density electronic equipment being used to meet actual needs; specific details are not limited here.

[0114] This application also provides a heat dissipation component for high heat flux density electronic devices, which is described below.

[0115] Please see Figure 1 The high heat flux density electronic device heat dissipation component provided in this application is applied to a high heat flux density electronic device heat dissipation system, which is used to dissipate heat from high heat flux density electronic devices. The high heat flux density electronic device heat dissipation component includes: at least one cold plate component and at least one energy storage component; the cold plate component is the cold plate component described above, and the energy storage component is the energy storage component described above.

[0116] Each energy storage device 7 is connected to at least all cavities of a phase change cold plate 6;

[0117] Among them: the heat dissipation system of high heat flux density electronic equipment is connected to the cold plate assembly and the energy storage assembly to form a loop. The heat dissipation system is filled with working fluid, which circulates in the loop.

[0118] When the high heat flux density electronic device is operating in the first mode, the working fluid first flows into the cold plate assembly; the working fluid flowing into the cold plate assembly flows sequentially through the first throttling device 4, the corresponding cavity, the energy storage device 7, and the corresponding cavity. The working fluid flowing into the cavity absorbs the heat from the high heat flux density electronic device, and the working fluid flowing into the energy storage device 7 from the cavity transfers the heat it has absorbed to the energy storage device 7 to restore the cooling capacity.

[0119] When the high heat flux density electronic device is operating in the second mode, the working fluid is diverted; the working fluid flowing into the energy storage component flows sequentially through the second throttling device 5, the energy storage device 7, and the second on / off control device 12. The working fluid flowing into the energy storage device 7 absorbs the heat from the energy storage device 7, so that the energy storage device 7 can restore its heat storage capacity; the working fluid flowing into the cold plate assembly flows sequentially through the first throttling device 4, the corresponding cavity, the first connecting pipe, and the corresponding cavity. The working fluid flowing into the cavity absorbs the heat from the high heat flux density electronic device.

[0120] Furthermore, the high heat flux density electronic device heat dissipation system has a delivery end and a return end. The delivery end is connected to the input ends of all the first throttling devices 4 and all the input ends of all the second throttling devices 5 respectively. The output end of each first throttling device 4 is connected to the working fluid inlet of at least one cavity of a phase change cold plate 6 to input the working fluid into the corresponding cavity. The return end is connected to all the second on / off control devices 12 and the working fluid outlet of at least one cavity of each phase change cold plate 6.

[0121] in:

[0122] When high heat flux density electronic equipment is overclocked, the first throttling device 4 and the third on / off control device 8 are both turned on, and the second throttling device 5, the first on / off control device 13, and the second on / off control device 12 are all turned off. Driven by the heat dissipation system of high heat flux density electronic equipment, the working fluid first flows into the corresponding cavity through the delivery end and the first throttling device 4 to absorb the heat from the high heat flux density electronic equipment. Then, it flows into the corresponding energy storage device 7 through the corresponding second branch to store at least a portion of the absorbed heat in the energy storage device 7 so that the working fluid can restore its cooling capacity. Then, it flows into the corresponding cavity from the corresponding energy storage device 7 to continue absorbing the heat from the high heat flux density electronic equipment. Finally, the working fluid flows into the corresponding cavity connected to the return end and flows into the return end through the working fluid outlet of the corresponding cavity.

[0123] When the high heat flux density electronic device is running at its rated speed, the first throttling device 4, the second throttling device 5, the first on / off control device 13, and the second on / off control device 12 are all turned on, and the third on / off control device 8 is turned off. Driven by the heat dissipation system of the high heat flux density electronic device, a portion of the working fluid flows sequentially through the conveying end, the second throttling device 5, the energy storage device 7, the second on / off control device 12, and the return end. The working fluid flowing into the energy storage device 7 absorbs the heat stored in the energy storage device 7, so that the energy storage device 7 can restore its heat storage capacity. Another portion of the working fluid flows sequentially through the conveying end, the first throttling device 4, the cavity of the phase change cold plate 6, and the return end to remove the heat generated by the high heat flux density electronic device during its rated operation.

[0124] Thus, throughout the entire operating cycle, not only can the maximum temperature of the high heat flux density electronic equipment be controlled within a certain range, but the system equipment can also be configured with maximum cooling capacity without requiring it. Smaller system equipment can be used, and the working fluid charge can be reduced. Therefore, for a high heat flux density electronic equipment heat dissipation system using the heat dissipation component provided in this application, the system's size, weight, and power consumption can be reduced, which is beneficial for achieving system compactness, lightweighting, and low power consumption, improving system portability, making it suitable for mobile devices, and more easily adapting to varying operating conditions. On the other hand, the high heat flux density electronic equipment heat dissipation component provided in this application, by setting a first throttling device and a second throttling device, facilitates the regulation of the working fluid's saturation temperature. This not only effectively controls the temperature uniformity of the high heat flux density electronic equipment throughout the entire operating cycle but also further reduces the system's power consumption throughout the entire operating cycle.

[0125] In addition, the quantitative and connection relationships between cold plate modules and energy storage modules can be categorized into at least three situations: 1. Please refer to [link / reference]. Figure 2 There are multiple cold plate modules and energy storage modules, with each cold plate module connected to only one energy storage module, and each energy storage module connected to only one cold plate module; II. Please refer to Figure 3 There are multiple cold plate assemblies and one energy storage unit, and each cold plate assembly is connected to the energy storage unit; III. Please refer to Figure 1 There is one cold plate assembly and one energy storage assembly, and the cold plate assembly and the energy storage assembly are interconnected. Since each cold plate assembly has only one phase change cold plate, and each energy storage assembly has only one energy storage device, the quantity and connection relationship between the phase change cold plate 6 and the energy storage device 7 can be at least one of the following three cases: 1. Please refer to Figure 2 There are multiple phase change cold plates 6 and energy storage devices 7. Each phase change cold plate 6 is connected to only one energy storage device 7, and each energy storage device 7 is connected to only one phase change cold plate 6. II. Please refer to Figure 3There are multiple phase change cold plates 6 and one energy storage device 7, and each phase change cold plate 6 is connected to the energy storage device 7; III. Please refer to Figure 1 The phase change cold plate 6 and the energy storage device 7 are both one in number and are interconnected. Their working principle and beneficial effects are similar to those described above and will not be repeated here.

[0126] It should be understood that the high heat flux density electronic device heat dissipation component provided in this application can be applied to high heat flux density electronic device heat dissipation systems. Please refer to [link to relevant documentation]. Figures 1-5 It includes: at least one cold plate assembly and at least one energy storage assembly;

[0127] Each cold plate assembly includes a first throttling device 4 and a phase change cold plate 6. That is, each cold plate assembly is composed of the first throttling device 4 and the phase change cold plate 6 connected together. The input end of each first throttling device 4 can be used to connect to the delivery end of the heat dissipation system of the high heat flux density electronic device. The delivery end can output a liquid working fluid at room temperature and high pressure. The output end of each first throttling device 4 is connected to the working fluid inlet of at least one cavity of a phase change cold plate 6. Each phase change cold plate 6 has at least one cavity working fluid outlet for connecting to the return end of the heat dissipation system of the high heat flux density electronic device. The return end can allow the working fluid to flow back to the compressor of the heat dissipation system of the high heat flux density electronic device. That is, the working fluid flowing out of the working fluid outlet of the corresponding cavity of the phase change cold plate 6 connected to the return end can flow back to the compressor of the heat dissipation system of the high heat flux density electronic device through the return end for the next cycle. The first throttling device 4 is in the open state when the high heat flux density electronic device is running at rated speed or overclocked.

[0128] The phase change cold plate 6 is used to absorb the heat generated by high heat flux density electronic devices and exchange heat with the working fluid flowing into the phase change cold plate 6, so that the working fluid can carry away the heat from the high heat flux density electronic devices during the flow process. Each phase change cold plate 6 is provided with at least two non-communicating cavities. It can be understood that at least two non-communicating cavities here means that at least two cavities are not directly connected, and each cavity has a working fluid inlet and a working fluid outlet for the inflow and outflow of the working fluid. For ease of understanding, each phase change cold plate 6 is provided with two non-communicating cavities, each with a working fluid inlet and a working fluid outlet. Taking the cavities as an example, for ease of distinction, these two cavities are divided into a first cavity 61 and a second cavity 62. Thus, the working fluid inlet of the first cavity 61 can be regarded as the working fluid inflow end of the phase change cold plate 6, and the working fluid inlet of each first cavity 61 is connected to the output end of a first throttling device 4. The working fluid outlet of the second cavity 62 can be regarded as the working fluid outflow end of the phase change cold plate 6, and the working fluid outlet of each second cavity 62 is used to connect to the return end. In addition to the first cavity 61 and the second cavity 62, the phase change cold plate 6 is also provided with a first branch, one end of which is connected to the first cavity. The working fluid outlet of chamber 61 is connected to the working fluid inlet of the second chamber, and the other end is connected to the working fluid inlet of the second chamber. A first on / off control device 13 is provided on the first branch. The first on / off control device 13 controls the conduction or cutoff of the first branch, thereby controlling the connection or cutoff between the working fluid outlet of the first chamber 61 and the working fluid inlet of the second chamber 62. The first on / off control device 13 is in the open state when the high heat flux density electronic device is running at rated speed and in the closed state when the high heat flux density electronic device is running at overclock. Here, high heat flux density electronic device refers to device with a heat flux density higher than 100W / cm2, which can be a laser, IGBT module, etc., and is not limited here. The delivery end can be the output end of the condenser of the heat dissipation system of the high heat flux density electronic device (applicable when the heat dissipation system does not have a liquid storage tank) or the output end of the liquid storage tank of the heat dissipation system of the high heat flux density electronic device. The return end can be the air inlet of the compressor of the heat dissipation system of the high heat flux density electronic device (applicable when the heat dissipation system does not have a gas-liquid separator) or the input end of the gas-liquid separator of the heat dissipation system of the high heat flux density electronic device, and is not limited here.

[0129] Each energy storage component includes a second throttling device 5, an energy storage device 7, and a second on / off control device 12, all connected sequentially via pipelines. Specifically, each energy storage component includes a second throttling device 5, an energy storage device 7, a second on / off control device 12, and a second connecting pipeline. For ease of understanding, a high heat flux density electronic device heat dissipation component with a cold plate assembly and an energy storage component is used as an example. A second branch is provided between the energy storage device 7 and the working fluid outlet of the first cavity 61, and another second branch is provided between the energy storage device 7 and the working fluid inlet of the second cavity 62. Each second branch is equipped with a third on / off control device 8 to control the flow of the working fluid. It can be understood that the energy storage device 7 has an input port and an output port to cooperate with the phase change cold plate 6. That is, the energy storage device 7 can be configured with a corresponding number of input ports and output ports as needed. The energy storage device 7 can be used to store heat generated by phase change cooling when the high heat flux density electronic device is overclocked. At least a portion of the heat from the working fluid flowing into plate 6 is stored, and the stored heat is released to the working fluid flowing into it via the second throttling device 5 for cooling (i.e., restoring the stored heat) when the high heat flux density electronic device is operating at its rated speed. This allows the working fluid to carry away the heat stored in the energy storage device 7 during the overclocking operation of the high heat flux density electronic device. The second throttling device 5, the second on / off control device 12, and the third on / off control device 8 are all in the open state during the rated operation of the high heat flux density electronic device, and are all in the closed state during the overclocking operation of the high heat flux density electronic device. Specifically, the first throttling device 4 and the second throttling device 5 can both be electronic expansion valves, and the first on / off control device 13, the second on / off control device 12, and the third on / off control device 8 can all be solenoid valves. Rated operation here refers to the high heat flux density electronic device operating at its rated frequency / power, while overclocking operation refers to the high heat flux density electronic device operating at a frequency / power higher than its rated frequency / power.

[0130] Correspondingly, the heat dissipation system for high heat flux density electronic devices has a delivery end and a return end. The delivery end is connected to the input end of the first throttling device 4 and the input end of the second throttling device 5, respectively. The output end of the first throttling device 4 is connected to the working fluid inlet of the first cavity 61 to input the working fluid into the first cavity 61. The return end is connected to the second on / off control device 12 and the working fluid outlet of the second cavity 62, respectively.

[0131] When the high heat flux density electronic device heat dissipation component provided in this application is connected to the aforementioned high heat flux density electronic device heat dissipation system, when the high heat flux density electronic device is overclocked, the first throttling device 4 and the third on / off control device 8 are in the open state, while the second throttling device 5, the first on / off control device 13, and the second on / off control device 12 are in the closed state. In this case, there is only one flow path for the working fluid, namely, the delivery end - the first throttling device 4 - the first cavity 61 - the energy storage device 7 - the second cavity 62 - the return end. The working fluid flowing from the first cavity 61 into the energy storage device 7 can store at least a portion of the heat absorbed in the first cavity in the energy storage device 7, so that the working fluid recovers at least a portion of its cooling capacity, ensuring that the working fluid flowing from the energy storage device 7 into the second cavity 62 has sufficient heat dissipation capacity. The working fluid flowing into the second cavity 62 continues to absorb heat from the high heat flux density electronic device, so as to meet the heat dissipation requirements of the high heat flux density electronic device even when the working fluid flow rate is lower than the maximum working fluid flow rate required for the high heat flux density electronic device to overclock.

[0132] When the high heat flux density electronic equipment is operating at its rated speed, the first throttling device 4, the second throttling device 5, the first on / off control device 13, and the second on / off control device 12 are in the open state, while the third on / off control device 8 is in the closed state. In this case, the flow path of the working fluid is divided into the following two types:

[0133] The first type is a conveying end - first throttling device 4 - first cavity 61 - first on / off control device 13 - second cavity 62 - return end, in order to remove the heat generated by high heat flux density electronic equipment and meet the heat dissipation requirements of high heat flux density electronic equipment during rated operation.

[0134] The second type is: the conveying end - the second throttling device 5 - the energy storage device 7 - the second on / off control device 12 - the return end. The working fluid flowing into the energy storage device 7 through the second throttling device 5 can carry away the heat stored in the energy storage device 7, so that the energy storage device 7 can restore its heat storage capacity.

[0135] Thus, throughout the entire operating cycle, not only can the maximum temperature of high heat flux density electronic equipment be controlled within a certain range, but also the system equipment does not need to be configured with maximum cooling capacity to cope with the overclocking operation of high heat flux density electronic equipment. Smaller system equipment can be used, the amount of working fluid charged in the system can be reduced, and components such as water tanks, water pumps, and heat exchangers commonly found in water systems can be eliminated. Therefore, for the heat dissipation system using the heat dissipation components for high heat flux density electronic equipment provided in this application, the system size, weight, and power consumption can be reduced, which is conducive to achieving system compactness, lightweighting, and low power consumption, improving system portability, making it suitable for mobile devices, and making it easier to adapt to various operating modes under different working conditions.

[0136] The operating principle of the high heat flux density electronic device heat dissipation assembly provided in this application is described below. For ease of understanding, the high heat flux density electronic device heat dissipation assembly is described using a cold plate assembly and an energy storage assembly, and the phase change cold plate 6 of the cold plate assembly is only provided with a first cavity 61 and a second cavity 62. The specific operating principle is as follows: When the high heat flux density electronic device is operating intermittently in rated mode and overclocking mode, when the high heat flux density electronic device is overclocking, the working fluid flow rate of the system is lower than the maximum working fluid flow rate required for heat dissipation of the high heat flux density electronic device, and the saturation temperature of the working fluid is higher than the temperature (phase change temperature) of the material or working fluid in the energy storage device 7; the working fluid flows through the first throttling device. 4. The working fluid enters the first chamber 61 through the working fluid inlet. Within the first chamber 61, the working fluid absorbs heat from the high heat flux density electronic equipment, vaporizing into a low-temperature, low-pressure working fluid (steam) or a gas-liquid mixture. It then flows through the working fluid outlet of the first chamber 61 into the energy storage device 7, releasing at least a portion of the heat absorbed by the working fluid and storing it in the energy storage device 7. After releasing heat, the working fluid re-enters the phase change cold plate 6 through the working fluid inlet of the second chamber 62, undergoes boiling heat exchange within the second chamber 62, and again absorbs heat from the high heat flux density electronic equipment, vaporizing into a low-temperature, low-pressure working fluid (steam). This vapor then flows back to the compressor through the outlet of the second chamber 62 via the return end. Since the second throttling device 5 is closed, no working fluid flows through it. After the high heat flux density electronic device has been overclocked for a certain period of time, it will switch to the rated operating mode. At this time, the flow rate of the working fluid is higher than the flow rate of the working fluid required for the high heat flux density electronic device to dissipate heat in the rated operating mode. The saturation temperature of the working fluid flowing through the second throttling device 5 is lower than the temperature (phase change temperature) of the material or working fluid in the energy storage device 7. The saturation temperature of the working fluid flowing through the first throttling device 4 only needs to be lower than the temperature of the high heat flux density electronic device. The working fluid output from the first throttling device 4 enters the first cavity 61 through the inlet of the first cavity 61 of the phase change cold plate 6. After absorbing the heat of the high heat flux density electronic device in the first cavity 61, the working fluid vaporizes into a gas-liquid mixture (gas-liquid mixture). Then, it enters the second cavity 62 through the working fluid outlet of the first cavity 61, the first on / off control device 13, and the working fluid inlet of the second cavity 62. In the second cavity 62, it continues to absorb heat and vaporize into steam (gas-state working fluid). Then, the working fluid flows back to the compressor of the heat dissipation system of the high heat flux density electronic device through the working fluid outlet and return end of the second cavity 62. The working fluid output from the second throttling device 5 enters the energy storage device 7 to absorb the heat stored in the energy storage device 7, and finally flows back to the compressor of the high heat flux density electronic device heat dissipation system via the second on / off control device 12 and the return end.It is understandable that when the working fluid flow rate of the energy storage device 7 is lower than the maximum working fluid flow rate required for heat dissipation of the high heat flux density electronic device, and the saturation temperature of the working fluid is higher than the phase change temperature of the material or working fluid in the energy storage device 7, the energy storage device 7 can store the heat brought by the working fluid, thus playing a role in heat storage. Conversely, when the working fluid flow rate of the energy storage device 7 is higher than the maximum working fluid flow rate required for heat dissipation of the high heat flux density electronic device, and the saturation temperature of the working fluid is lower than the phase change temperature of the material or working fluid in the energy storage device 7, the heat stored in the energy storage device 7 can be carried away by the working fluid, allowing the energy storage device 7 to perform cold storage and regain its heat storage function. By setting the phase change cold plate 6 and the energy storage device 7, the working fluid flow rate required by the heat dissipation system of the high heat flux density electronic device heat dissipation component provided in this application is lower than that of the high heat flux density electronic device. The maximum working fluid flow rate required for heat dissipation in the overclocking mode of the high heat flux density electronic device is higher than that required in the rated mode. When the high heat flux density electronic device is overclocked, the energy storage device 7 stores at least a portion of the heat, thus enabling the system to be configured with only slightly more cooling capacity than required in the rated mode. Furthermore, since a portion of the heat from the energy storage device 7 is carried away by the working fluid during rated operation, the saturation temperature of the remaining working fluid flowing through the first throttling device 4 does not need to be too low; it only needs to be below the temperature of the phase change cold plate. This lower saturation temperature ensures the temperature uniformity of the high heat flux density electronic device, allowing it to operate continuously within a preset temperature range and guaranteeing its normal operation. Thus, throughout the entire operating cycle, not only can the maximum temperature of the high heat flux density electronic device be controlled within a certain range, but the system does not need to be configured with maximum cooling capacity even when the high heat flux density electronic device is overclocked. This not only meets the heat dissipation requirements of the intermittently operating high heat flux density electronic device but also facilitates adaptation to different operating conditions. In other words, for heat dissipation systems of high heat flux density electronic devices, the high heat flux density electronic device heat dissipation component provided in this application can reduce the system's size, weight, and power consumption, which is conducive to achieving system compactness, lightweighting, and low power consumption, improving system portability, making it suitable for mobile devices, and making it easier to adapt to various operating modes. On the other hand, the high heat flux density electronic device heat dissipation component provided in this application, by setting the first throttling device 4 and the second throttling device 5, is conducive to regulating the saturation temperature of the working fluid in the overclocking mode and rated mode of the high heat flux density electronic device. This not only effectively controls the temperature uniformity of the high heat flux density electronic device throughout the entire operating cycle, but also further reduces the power consumption of the system throughout the entire operating cycle.

[0137] The rated mode / rated operating mode here refers to the operation of high heat flux density electronic equipment at the rated frequency / power, while the overclocking mode / overclocking operating mode refers to the operation of high heat flux density electronic equipment at a frequency / power higher than the rated frequency / power.

[0138] This application also provides a heat dissipation system for high heat flux density electronic devices, which is described below.

[0139] Please see Figure 4 In one embodiment, the high heat flux density electronic device heat dissipation system provided in this application is used to dissipate heat from high heat flux density electronic devices; the high heat flux density electronic device heat dissipation system includes:

[0140] Compressor 1, condenser 2, and heat dissipation assembly 3; wherein, heat dissipation assembly 3 is the heat dissipation assembly for high heat flux density electronic equipment described above;

[0141] Compressor 1, condenser 2 and heat dissipation component 3 are connected in sequence through pipelines to form a circulation loop, in which the working fluid circulates.

[0142] The heat dissipation assembly 3 includes a cold plate assembly and an energy storage assembly. The cold plate assembly includes a first throttling device 4 and a phase change cold plate 6. The energy storage assembly includes a second throttling device 5, an energy storage device 7, a second on / off control device 12, and a second connecting pipe. There can be one or more cold plate assemblies and one or more energy storage assemblies. In one embodiment, there are multiple cold plate assemblies and multiple energy storage assemblies, with a one-to-one correspondence between the cold plate assemblies and the energy storage assemblies. That is, each phase change cold plate 6 is connected to only one energy storage device 7, and each energy storage device 7 is connected to only one phase change cold plate 6. In another embodiment, there is only one cold plate assembly and one energy storage assembly, with the phase change cold plate 6 and the energy storage device 7 interconnected. In another embodiment, there is one energy storage component and multiple cold plate components, with one energy storage device 7 connected to multiple phase change cold plates 6. It is understood that the phase change cold plate 6 is used to absorb heat generated by high heat flux density electronic devices and exchange heat with the working fluid entering the phase change cold plate 6, so that the working fluid can carry away the heat from the high heat flux density electronic devices during its flow. The phase change cold plate 6 is provided with at least two non-communicating cavities, each with a working fluid inlet and a working fluid outlet. The phase change cold plate 6 is also provided with at least one first branch, each first branch... Each branch is used to connect one cavity to another, allowing the working fluid to flow from one cavity to another; each first branch is provided with a first on / off control device; each energy storage device 7 is provided with at least one second branch between at least one phase change cold plate 6 and all cavities, allowing the working fluid to flow from the cavity into the energy storage device 7 and / or allowing the working fluid to flow from the energy storage device 7 into the cavity; each second branch is provided with a third on / off control device 8, wherein the third on / off control device 8 is in the off state during the rated operation of the high heat flux density electronic equipment;

[0143] The output end of the condenser 2 is connected to the input ends of all the first throttling devices 4 and all the input ends of the second throttling devices 5 respectively. The inlet end of the compressor 1 is connected to all the second on / off control devices 12 and at least one cavity of each phase change cold plate 6 respectively. It can be understood that each phase change cold plate 6 has at least one cavity whose working fluid outlet is connected to the inlet end of the compressor 1 so that the working fluid can flow back to the compressor 1.

[0144] For ease of description and understanding, the following description takes the example of a heat dissipation component 3 having a cold plate component and an energy storage component, and the phase change cold plate 6 of the cold plate component having two non-communicating cavities, each having a working fluid inlet and a working fluid outlet. These two cavities are the first cavity 61 and the second cavity 62, respectively.

[0145] The compressor 1 is the power unit of the entire high heat flux density electronic device heat dissipation system, playing the role of sucking in, compressing, and transporting the working fluid. Specifically, the compressor 1 can suck in, compress, and transport the working fluid (steam). Under the action of the compressor 1, the working fluid flowing out from the first throttling device 4 enters the first chamber 61 through the working fluid inlet and then enters the second chamber 62, before flowing out through the working fluid outlet of the second chamber 62. This absorbs heat from the phase change cold plate 6, thus removing the heat transferred to the phase change cold plate 6 by the high heat flux density electronic device. The condenser 2, as a heat exchange device, uses the ambient cooling medium (air or water) to remove the heat from the high-temperature, high-pressure working fluid (steam) from the compressor 1, causing the high-temperature, high-pressure working fluid (steam) to condense. The working fluid (liquid) is at room temperature and high pressure. The condenser 2 can be used to condense the high-temperature and high-pressure working fluid from the compressor 1 into a high-pressure and room-temperature working fluid (liquid). The first throttling device 4 and the second throttling device 5 play a throttling and pressure-reducing role for the working fluid. The first throttling device 4 reduces the pressure of the working fluid (liquid), thereby reducing the saturation temperature of the working fluid (liquid) and controlling and regulating the flow rate, velocity, and other parameters of the working fluid entering the phase change cold plate 6. The second throttling device 5 reduces the pressure of the working fluid (liquid), thereby reducing the saturation temperature of the working fluid (liquid) and controlling and regulating the flow rate, velocity, and other parameters of the working fluid entering the energy storage device 7. That is, the first throttling device 4 and the second throttling device 5 can be used to reduce the saturation temperature of the working fluid (liquid).

[0146] The energy storage device 7 is used to store the heat stored in the high heat flux density electronic device during overclocking operation by using the working fluid flowing through the second throttling device 5 to carry away the heat stored in the high heat flux density electronic device during rated operation, so as to restore the heat storage function.

[0147] The working principle of this embodiment is described below. For ease of understanding, it is taken as an example where the heat dissipation component 3 is equipped with a cold plate component and an energy storage component, and the phase change cold plate 6 of the cold plate component is equipped with two non-communicating cavities, each with a working fluid inlet and a working fluid outlet. These two cavities are the first cavity 61 and the second cavity 62, respectively. The specific operating principle is as follows: The temperature range of the high heat flux density electronic device is preset, including a first preset range and a second preset range. When the high heat flux density electronic device is running at its rated speed, the temperature of the high heat flux density electronic device (third temperature) is detected to see if it exceeds the preset temperature range, that is, whether the third temperature exceeds the second preset range. If it does, the real-time temperature of the surface in contact with the phase change cold plate 6 and the surface of the high heat flux density electronic device and the temperature of the material or working fluid inside the energy storage device 7 (fourth temperature) are collected. The first throttling device 4 and the second throttling device 5 are controlled according to these two temperatures. Since the temperature of the surface in contact with the phase change cold plate 6 and the surface of the high heat flux density electronic device is similar to the temperature of the high heat flux density electronic device, the temperature of the high heat flux density electronic device is collected for practicality. The temperature of the high heat flux density electronic device (third temperature) controls the first throttling device 4. When the first throttling device 4 is open, it regulates the pressure of the working fluid flowing through it, thereby adjusting the saturation temperature of the working fluid. This ensures that the saturation temperature of the working fluid flowing through the first throttling device 4 is lower than the temperature of the high heat flux density electronic device, but not so low that the temperature of the high heat flux density electronic device falls below a preset temperature range. The working fluid output from the first throttling device 4 flows through the first cavity 61 and the second cavity 62, where it vaporizes into steam (a gaseous working fluid, i.e., a low-temperature, low-pressure working fluid) after absorbing heat from the phase change cooling plate 6 through boiling heat exchange, and then flows back to the compressor 1. On the other hand, the temperature of the material or working fluid inside the energy storage device 7 (fourth temperature) controls the second throttling device 5. When the second throttling device 5 is open, it regulates the pressure of the working fluid flowing through it, thereby adjusting the saturation temperature of the working fluid. This ensures that the saturation temperature of the working fluid flowing through the second throttling device 5 is lower than the temperature of the material or working fluid inside the energy storage device 7. The working fluid output from the second throttling device 5 enters the energy storage device 7, absorbs heat, and vaporizes into steam (a gaseous working fluid, i.e., a low-temperature, low-pressure working fluid). The steam then flows back into the compressor 1.

[0148] In addition, when the high heat flux density electronic device is overclocked, the temperature of the high heat flux density electronic device (first temperature) is detected to see if it exceeds the preset temperature range. If it does, the temperature of the surface in contact with the phase change cold plate 6 and the high heat flux density electronic device, and the temperature of the material or working fluid inside the energy storage device 7 (second temperature) are collected in real time. The first throttling device 4 is controlled based on these two temperatures. Since the temperature of the surface in contact with the phase change cold plate 6 is similar to the temperature of the high heat flux density electronic device, the temperature of the high heat flux density electronic device is used instead for practical purposes. The second throttling device 5, the first on / off control device 13, and the second on / off control device 12 are closed, the first throttling device 4 is opened, and the third on / off control device 8 is opened. The first throttling device 4 adjusts the pressure of the flowing working fluid, thereby adjusting the saturation temperature of the working fluid. This ensures that the saturation temperature of the working fluid flowing through the first throttling device 4 is lower than the temperature of the high heat flux density electronic device, while simultaneously being higher than the temperature of the material inside the energy storage device 7. In other words, the saturation temperature of the working fluid is lower than the first temperature but higher than the second temperature. The working fluid can enter the energy storage device 7 through the third on / off control device 8 to store at least a portion of the heat absorbed in the first cavity 61 in the energy storage device 7, so that the working fluid can recover at least a portion of its cooling capacity and re-enter the phase change cold plate 6 to absorb the heat from the second cavity 62, so as to remove the heat from the high heat flux density electronic equipment and meet the heat dissipation requirements of the high heat flux density electronic equipment. After the working fluid (vapor) flows out of the phase change cold plate 6, it flows back to the compressor 1 for the next cycle.

[0149] When the high heat flux electronic device is operating at its rated speed, the first throttling device 4, the second throttling device 5, the first on / off control device 13, and the second on / off control device 12 are activated, while the third on / off control device 8 is deactivated. A portion of the working fluid flows through the first throttling device 4, the first cavity 61, the first on / off control device 13, and the second cavity 62, carrying away heat from the phase change cold plate 6. Another portion of the working fluid flows through the second throttling device 5, the energy storage device 7, and the second on / off control device 12, carrying away heat from the energy storage device 7. Since a portion of the heat from the energy storage device 7 is carried away by the working fluid during rated operation, the saturation temperature of the remaining portion of the working fluid flowing through the first throttling device 4 for heat dissipation in the high heat flux electronic device does not need to be too low; it only needs to be lower than the temperature of the phase change cold plate 6. This lower saturation temperature ensures the temperature uniformity of the high heat flux electronic device, allowing it to operate within a preset temperature range and guaranteeing its operating efficiency. Compared to water systems, it eliminates the need for common components such as water tanks, pumps, and heat exchangers. Therefore, for heat dissipation systems of high heat flux density electronic devices, it helps to control the size, weight, and power consumption of the system, achieving compactness, lightweighting, and low power consumption. It is suitable for mobile devices and is more adaptable to various operating modes under changing conditions.

[0150] Please see Figure 5 In another embodiment, the heat dissipation system provided in this application includes:

[0151] Compressor 1, oil separator 9, condenser 2, liquid receiver 11, heat dissipation assembly 3, gas-liquid separator 14, and fourth on / off control device 10;

[0152] The energy storage device 7 is a phase change energy storage device 7 or a non-phase change energy storage device 7, which can be used for heat storage or cold storage, and is preferably implemented by a phase change energy storage device 7.

[0153] The compressor 1, oil separator 9, condenser 2, liquid receiver 11, heat dissipation assembly 3 and gas-liquid separator 14 are connected in sequence through pipelines to form a circulation loop, in which the working fluid circulates.

[0154] The heat dissipation assembly 3 includes a cold plate assembly and an energy storage assembly. The cold plate assembly includes a first throttling device 4 and a phase change cold plate 6. The energy storage assembly includes a second throttling device 5, an energy storage device 7, a second on / off control device 12, and a second connecting pipe. There can be one or more cold plate assemblies and one or more energy storage assemblies. In one embodiment, there are multiple cold plate assemblies and multiple energy storage assemblies, with a one-to-one correspondence between the cold plate assemblies and the energy storage assemblies. That is, each phase change cold plate 6 is connected to only one energy storage device 7, and each energy storage device 7 is connected to only one phase change cold plate 6. In another embodiment, there is only one cold plate assembly and one energy storage assembly, with the phase change cold plate 6 and the energy storage device 7 interconnected. In another embodiment, there is one energy storage component and multiple cold plate components, with one energy storage device 7 connected to multiple phase change cold plates 6. It is understood that the phase change cold plate 6 is used to absorb heat generated by high heat flux density electronic devices and exchange heat with the working fluid entering the phase change cold plate 6, so that the working fluid can carry away the heat from the high heat flux density electronic devices during its flow. The phase change cold plate 6 is provided with at least two non-communicating cavities, each with a working fluid inlet and a working fluid outlet. The phase change cold plate 6 is also provided with at least one first branch, each first branch... Each branch is used to connect one cavity to another, allowing the working fluid to flow from one cavity to another; each first branch is provided with a first on / off control device; each energy storage device 7 is provided with at least one second branch between at least one phase change cold plate 6 and all cavities, allowing the working fluid to flow from the cavity into the energy storage device 7 and / or allowing the working fluid to flow from the energy storage device 7 into the cavity; each second branch is provided with a third on / off control device 8, wherein the third on / off control device 8 is in the off state during the rated operation of the high heat flux density electronic equipment;

[0155] The output end of the condenser 2 is connected to the input ends of all the first throttling devices 4 and all the input ends of the second throttling devices 5 respectively. The inlet end of the compressor 1 is connected to all the second on / off control devices 12 and at least one cavity of each phase change cold plate 6 respectively. It can be understood that each phase change cold plate 6 has at least one cavity whose working fluid outlet is connected to the inlet end of the compressor 1 so that the working fluid can flow back to the compressor 1.

[0156] For ease of description and understanding, the following description takes the example of a heat dissipation component 3 having a cold plate component and an energy storage component, and the phase change cold plate 6 of the cold plate component having two non-communicating cavities, each having a working fluid inlet and a working fluid outlet. These two cavities are the first cavity 61 and the second cavity 62, respectively.

[0157] The compressor 1 is the power unit of the entire high heat flux density electronic device heat dissipation system, playing the role of sucking in, compressing, and transporting the working fluid. Specifically, the compressor 1 can suck in, compress, and transport the working fluid (steam). Under the action of the compressor 1, the working fluid flowing out from the first throttling device 4 enters the first chamber 61 through the working fluid inlet and then enters the second chamber 62, before flowing out through the working fluid outlet of the second chamber 62. This absorbs heat from the phase change cold plate 6, thus removing the heat transferred to the phase change cold plate 6 by the high heat flux density electronic device. The condenser 2, as a heat exchange device, uses the ambient cooling medium (air or water) to remove the heat from the high-temperature, high-pressure working fluid (steam) from the compressor 1, causing the high-temperature, high-pressure working fluid (steam) to condense. The working fluid (liquid) is at room temperature and high pressure. The condenser 2 can be used to condense the high-temperature and high-pressure working fluid from the compressor 1 into a high-pressure and room-temperature working fluid (liquid). The first throttling device 4 and the second throttling device 5 play a throttling and pressure-reducing role for the working fluid. The first throttling device 4 reduces the pressure of the working fluid (liquid), thereby reducing the saturation temperature of the working fluid (liquid) and controlling and regulating the flow rate, velocity, and other parameters of the working fluid entering the phase change cold plate 6. The second throttling device 5 reduces the pressure of the working fluid (liquid), thereby reducing the saturation temperature of the working fluid (liquid) and controlling and regulating the flow rate, velocity, and other parameters of the working fluid entering the energy storage device 7. That is, the first throttling device 4 and the second throttling device 5 can be used to reduce the saturation temperature of the working fluid (liquid).

[0158] When the high heat flux density electronic device is running at its rated speed, under the action of the compressor 1, the working fluid flowing out from the first throttling device 4 enters the phase change cold plate 6 through the working fluid inlet of the first cavity 61, flows through the first cavity 61, the first on / off control device 13 and the second cavity 62, and then flows out through the working fluid outlet of the second cavity 62 to absorb the heat of the phase change cold plate 6 and carry away the heat transferred to the phase change cold plate 6 by the high heat flux density electronic device. When the high heat flux density electronic device is running at overclocked speed, the first on / off control device 13 is closed. Under the action of the compressor 1, the working fluid flowing out from the first throttling device 4 enters the phase change cold plate 6 through the working fluid inlet of the first cavity 61, flows through the first cavity 61, the third on / off control device 8, the energy storage device 7 and the second cavity 62, and then flows out through the working fluid outlet of the second cavity 62 to absorb the heat of the phase change cold plate 6.

[0159] The energy storage device 7 is used to store the heat stored by the working fluid flowing through the second throttling device 5 during the overclocking operation of the high heat flux density electronic device when it is running at its rated speed. This storage device is used to restore the heat storage function. When the high heat flux density electronic device is overclocking, it absorbs the heat from the working fluid flowing out of the phase change cold plate 6 for heat storage. The energy storage device 7 can meet the heat dissipation requirements of the high heat flux density electronic device even when the working fluid flow rate is lower than the maximum working fluid flow rate required for heat dissipation during the overclocking operation of the high heat flux density electronic device.

[0160] An oil separator 9 is located between the compressor 1 and the condenser 2, specifically between the discharge end of the compressor 1 and the input end of the condenser 2. It separates the lubricating oil from the working fluid, preventing it from entering the subsequent condenser 2 and phase change plate 6 and affecting heat exchange. The compressor 1 has an oil return port, and the oil separator 9 has an oil separation port. One end of the fourth on / off control device 10 is connected to the oil return port, and the other end is connected to the oil separation port, so that when the fourth on / off control device 10 is activated, the lubricating oil in the oil separator 9 flows back to the compressor 1. Specifically, the fourth on / off control device 10 can be a solenoid valve.

[0161] The liquid storage tank 11 is located between the condenser 2 and the heat dissipation assembly 3, specifically between the output end of the condenser 2 and the input end of the heat dissipation assembly 3. That is, the liquid storage tank 11 is located between the output end of the condenser 2 and the first throttling device 4 and the second throttling device 5. In other words, the input end of the liquid storage tank 11 is connected to the output end of the condenser 2, and the output end of the liquid storage tank 11 is connected to the input ends of the first throttling device 4 and the second throttling device 5, respectively. It is used to adjust the circulation volume of the working fluid when the high heat flux density electronic equipment switches between overclocking mode and rated operation mode, that is, to adjust the circulation volume of the working fluid when the system operating conditions change.

[0162] The gas-liquid separator 14 is disposed between the heat dissipation assembly 3 and the compressor 1. Specifically, it is disposed between the output end of the heat dissipation assembly 3 and the inlet end of the compressor 1. That is, the gas-liquid separator 14 is disposed between the inlet end of the compressor 1 and the second on / off control device 12 and the phase change cold plate 6. In other words, the input end of the gas-liquid separator 14 is connected to the output end of the second on / off control device 12 and the working fluid outlet of the cavity of the phase change cold plate 6 for connecting the return end, respectively. The output end of the gas-liquid separator 14 is connected to the inlet end of the compressor 1. It is used to separate the gaseous part and the liquid part in the working fluid to prevent the liquid working fluid from entering the compressor 1 and to prevent the compressor 1 from being liquid-slugged.

[0163] The working principle of this embodiment is described below. For ease of understanding, we will take the example of a heat dissipation component 3 having a cold plate component and an energy storage component, and the phase change cold plate 6 of the cold plate component having two non-communicating cavities, each with a working fluid inlet and a working fluid outlet. These two cavities are the first cavity 61 and the second cavity 62, respectively. The specific operating principle is as follows: the temperature range of the high heat flux density electronic device is preset, including a first preset range and a second preset range. When the high heat flux density electronic device is running at its rated speed, the first throttling device 4, the second throttling device 5, the first on / off control device 13, and the second on / off control device 12 are turned on, and the third on / off control device 8 is turned off. The temperature of the high heat flux density electronic device (third temperature) is detected to see if it exceeds the preset temperature range, i.e., whether the third temperature exceeds the second preset range. If it does, the real-time temperature of the surface in contact with the phase change cold plate 6 and the surface of the high heat flux density electronic device and the temperature of the material or working fluid inside the energy storage device 7 (fourth temperature) are collected. The first throttling device 4 and the second throttling device 5 are controlled according to these two temperatures. Since the temperature of the surface in contact with the phase change cold plate 6 and the surface of the high heat flux density electronic device is similar to the temperature of the high heat flux density electronic device, the temperature of the high heat flux density electronic device is collected instead for practical purposes. The temperature (third temperature) of the high heat flux density electronic device controls the first throttling device 4. When the first throttling device 4 is open, it adjusts the pressure of the flowing working fluid, thereby adjusting the saturation temperature of the working fluid. This ensures that the saturation temperature of the working fluid flowing through the first throttling device 4 is lower than the temperature (third temperature) of the high heat flux density electronic device, while not so low that the temperature of the high heat flux density electronic device falls below a preset temperature range. The working fluid output from the first throttling device 4 flows through the first cavity 61, the first on / off control device 13, and the second cavity 62. After absorbing heat from the phase change cold plate 6 through boiling heat exchange, it becomes steam (a low-temperature, low-pressure gaseous working fluid) and flows into the gas-liquid separator 14. On the other hand, the temperature (fourth temperature) of the material or working fluid inside the energy storage device 7 controls the second throttling device 5. When the second throttling device 5 is open, it adjusts the pressure of the flowing working fluid, thereby adjusting the saturation temperature of the working fluid. This ensures that the saturation temperature of the working fluid flowing through the second throttling device 5 is lower than the temperature (fourth temperature) of the material or working fluid inside the energy storage device 7. The working fluid output from the second throttling device 5 enters the energy storage device 7 to absorb heat and vaporize into steam (a low-temperature, low-pressure gaseous working fluid), which then enters the gas-liquid separator 14. The two converging steam streams (low-temperature, low-pressure gaseous working fluids) flow into the gas-liquid separator 14 and then return from the gas-liquid separator 14 to the compressor 1 for the next cycle.

[0164] In addition, the working principle of the heat dissipation system during overclocking is described. A temperature range for the high heat flux density electronic device is preset. When the high heat flux density electronic device is overclocked, the first throttling device 4 and the third on / off control device 8 are activated, while the second throttling device 5, the first on / off control device 13, and the second on / off control device 12 are deactivated. The system detects whether the temperature of the high heat flux density electronic device (first temperature) exceeds the preset temperature range. If it does, the system collects the real-time temperature of the surface in contact with the phase change cold plate 6 and the surface of the high heat flux density electronic device, as well as the temperature of the material or working fluid inside the energy storage device 7 (second temperature). The first throttling device 4 is controlled based on these two temperatures. Since the temperature of the surface in contact with the phase change cold plate 6 is similar to the temperature of the high heat flux density electronic device, the temperature of the high heat flux density electronic device is used as a substitute for this temperature for practical purposes. The temperature of the high heat flux density electronic device (first temperature) controls the first throttling device 4. When the first throttling device 4 is open, it adjusts the pressure of the working fluid flowing through it, thereby adjusting the saturation temperature of the working fluid. This ensures that the saturation temperature of the working fluid flowing through the first throttling device 4 is lower than the temperature of the high heat flux density electronic device (first temperature), while simultaneously being higher than the temperature of the material or working fluid inside the energy storage device 7 (second temperature), and ensuring that the temperature of the high heat flux density electronic device returns to the preset temperature range. The working fluid output from the first throttling device 4 flows through the first cavity 61, the third on / off control device 8, the energy storage device 7, and the second cavity 62. It first absorbs heat from the first cavity 61, then dissipates heat in the energy storage device 7, storing the heat. The working fluid, now in a liquid state, returns to the second cavity 62 of the phase change cold plate 6 to boil and absorb heat, vaporizing into steam (low-temperature, low-pressure gaseous working fluid), flowing to the gas-liquid separator 14, and then returning from the gas-liquid separator 14 to the compressor 1 for the next cycle.

[0165] In this embodiment, when the high heat flux electronic device is operating at its rated speed, a portion of the working fluid flows through the first throttling device 4, the first cavity 61, the first on / off control device 13, and the second cavity 62, carrying away the heat from the phase change cold plate 6. Another portion of the working fluid flows through the second throttling device 5 and the energy storage device 7, carrying away the heat from the energy storage device 7. Since a portion of the heat from the energy storage device 7 is carried away by the working fluid during rated operation, the saturation temperature of the other portion of the working fluid flowing through the first throttling device 4 does not need to be too low; it only needs to be lower than the temperature of the phase change cold plate 6. This lower saturation temperature ensures the temperature uniformity of the high heat flux electronic device, allowing it to operate within a preset temperature range. Furthermore, when the high heat flux electronic device is overclocked, the working fluid flows through the first throttling device 4, the first cavity 61, the third on / off control device 8, the energy storage device 7, and the second cavity 62. The working fluid absorbs the heat from the first cavity 61 and stores it in the energy storage device 7. The working fluid flowing out of the energy storage device 7 then enters the second cavity 62 to absorb heat again. Since the working fluid does not need to carry all the heat from the phase change cold plate 6, it does not need to be configured with maximum cooling capacity. This keeps the size and weight of the heat dissipation system from being too large, and it can greatly reduce power consumption during overclocking and continuous operation. Compared with water systems, it eliminates the water tank, water pump, heat exchanger, and other components commonly found in water systems. Therefore, for heat dissipation systems of high heat flux density electronic devices, it is beneficial to control the size, weight, and power consumption of the system, making it suitable for mobile devices and easier to adapt to various operating modes. At the same time, by setting the first throttling device 4 and the second throttling device 5, it is beneficial to regulate the saturation temperature of the working fluid in the overclocking and rated operating modes of high heat flux density electronic devices. This not only effectively controls the temperature uniformity of the electronic device throughout the entire operating cycle, but also further reduces the power consumption of the system throughout the entire operating cycle, achieving system compactness, lightweight, and low power consumption.

[0166] The above provides a detailed description of the cold plate assembly, high heat flux density electronic device heat dissipation assembly, system, and method provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A cold plate assembly, used in a heat dissipation system, characterized in that, The heat dissipation system is used to dissipate heat from electronic devices with high heat flux density; the cold plate assembly includes: a phase change cold plate and a first throttling device connected to the phase change cold plate; The phase change cold plate is provided with: At least two non-communicating cavities, each of which is connected to the energy storage component of the heat dissipation system; and The first connecting pipe is connected to all the cavities, and the phase change cold plate forms a working fluid flow channel after the first connecting pipe is connected to all the cavities; the first connecting pipe is provided with a first on / off control device. The energy storage component includes: The second throttling device, the energy storage device, and the second on / off control device are connected in sequence via pipelines; and The second connecting pipe is used to connect the energy storage device to each of the cavities respectively; the second connecting pipe is provided with a third on / off control device; Wherein: the cold plate assembly and the heat dissipation system form a circuit after being connected, and the heat dissipation system is filled with working fluid; When the high heat flux density electronic device is operating in the first mode, the working fluid is not split; the working fluid flows sequentially through the first throttling device, the corresponding cavity, the energy storage device, and the corresponding cavity. The working fluid flowing into the cavity absorbs heat from the high heat flux density electronic device, and the working fluid flowing from the cavity into the energy storage device transfers the absorbed heat to the energy storage device to restore cooling capacity. When the high heat flux density electronic device is operating in the second mode, the working fluid is divided into two parts; one part of the working fluid flows sequentially through the second throttling device, the energy storage device, and the second on / off control device, and the working fluid flowing into the energy storage device absorbs the heat of the energy storage device so that the energy storage device can restore its heat storage capacity; the other part of the working fluid flows sequentially through the first throttling device, the corresponding cavity, the first connecting pipe, and the corresponding cavity.

2. A heat dissipation component for high heat flux density electronic devices, characterized in that, A heat dissipation system for high heat flux density electronic devices is provided, wherein the high heat flux density electronic device heat dissipation component comprises: at least one cold plate component and at least one energy storage component; the cold plate component is the cold plate component as described in claim 1, and the energy storage component is the energy storage component as described in claim 1; Each of the energy storage devices is in communication with at least one of the cavities of the phase change cold plate; Wherein: the high heat flux density electronic device heat dissipation system is connected to the cold plate assembly and the energy storage assembly to form a circuit, and the heat dissipation system is filled with working fluid; When the high heat flux density electronic device is operating in the first mode, the working fluid first flows into the cold plate assembly; the working fluid flowing into the cold plate assembly flows sequentially through the first throttling device, the corresponding cavity, the energy storage device, and the corresponding cavity; the working fluid flowing into the cavity absorbs heat from the high heat flux density electronic device; the working fluid flowing from the cavity into the energy storage device transfers the absorbed heat to the energy storage device to restore cooling capacity; When the high heat flux density electronic device is operating in the second mode, the working fluid is diverted; the working fluid flowing into the energy storage component flows sequentially through the second throttling device, the energy storage device, and the second on / off control device, and the working fluid flowing into the energy storage device absorbs the heat of the energy storage device so that the energy storage device can restore its heat storage capacity; the working fluid flowing into the cold plate assembly flows sequentially through the first throttling device, the corresponding cavity, the first connecting pipe, and the corresponding cavity.

3. The high heat flux density electronic device heat dissipation assembly according to claim 2, characterized in that, The number of the cold plate assembly and the energy storage assembly are both multiple; Each of the phase change cold plates is connected to only one of the energy storage devices, and each of the energy storage devices is connected to only one of the phase change cold plates.

4. The high heat flux density electronic device heat dissipation assembly according to claim 2, characterized in that, The number of cold plate assemblies is multiple, and the number of energy storage components is one; Each phase change cold plate is connected to the energy storage device.

5. The high heat flux density electronic device heat dissipation assembly according to claim 2, characterized in that, The number of the cold plate assembly and the energy storage assembly is one.

6. A heat dissipation system for high heat flux density electronic devices, characterized in that, include: A compressor, a condenser, and a heat dissipation assembly; wherein the heat dissipation assembly is a high heat flux density electronic device heat dissipation assembly as described in any one of claims 2-5; The compressor, the condenser, and the heat dissipation assembly are connected in sequence through pipelines to form a circulation loop, and the working fluid circulates in the circulation loop. The output end of the condenser is connected to the input ends of all the first throttling devices and all the input ends of the second throttling devices, respectively; the inlet end of the compressor is connected to all the second on / off control devices and at least one cavity of each phase change cold plate, respectively. The compressor is used to draw in, compress, and deliver the working fluid.

7. The high heat flux density electronic device heat dissipation system according to claim 6, characterized in that, Also includes: Oil separator; The oil separator is located between the compressor and the condenser and is used to separate the lubricating oil from the working fluid.

8. The high heat flux density electronic device heat dissipation system according to claim 7, characterized in that, It also includes: a fourth on / off control device; The compressor is provided with an oil return port, and the oil separator is provided with an oil separation port; One end of the fourth on / off control device is connected to the oil return port, and the other end is connected to the oil separation port.

9. The high heat flux density electronic device heat dissipation system according to claim 6, characterized in that, Also includes: Storage tank; The liquid storage tank is disposed between the condenser and the first throttling device and the second throttling device, and is used to regulate the circulation rate of the working fluid.

10. The high heat flux density electronic device heat dissipation system according to claim 6, characterized in that, Also includes: Gas-liquid separator; The gas-liquid separator is disposed between the second on / off control device, the phase change cold plate and the compressor, and is used to separate the gaseous and liquid components in the working fluid.

11. A heat dissipation method for high heat flux density electronic devices, characterized in that, The high heat flux density electronic device heat dissipation system as described in any one of claims 6 to 10, wherein the high heat flux density electronic device heat dissipation method comprises: When the high heat flux density electronic device is operating beyond its rated capacity, the first temperature of the high heat flux density electronic device is obtained. Determine whether the first temperature exceeds a first preset range; If so, based on the first temperature and the second temperature of the material or working fluid inside the energy storage device, the first throttling device is controlled, and the second throttling device is controlled to close, so that the saturation temperature of the working fluid is lower than the first temperature and higher than the second temperature. or, When the high heat flux density electronic device is operating at its rated speed, the third temperature of the high heat flux density electronic device is obtained; Determine whether the third temperature exceeds the second preset range; If so, the first throttling device and the second throttling device are controlled based on the third temperature and the fourth temperature of the material or working fluid inside the energy storage device, so that the saturation temperature of the working fluid output by the first throttling device is only lower than the third temperature, and the saturation temperature of the working fluid output by the second throttling device is lower than the fourth temperature.

Images