Mounting device and mounting method

Abstract

A mounting apparatus and method capable of achieving sub-micron level high-precision mounting are provided. Specifically, a mounting apparatus is provided, comprising: a substrate stage for holding a substrate; a mounting head for holding a chip component; a lifting unit for lifting the mounting head in a direction perpendicular to the substrate; an identification mechanism having the function of acquiring position information of a chip identification mark and a substrate identification mark using a camera unit, and being movable in the in-plane direction of the substrate; and a control unit connected to the identification mechanism, having the function of calculating the positional offset between the chip component and the substrate based on the positional information of the chip identification mark and the substrate identification mark obtained from the identification mechanism, and having the function of driving the mounting head and / or the substrate stage for alignment based on the positional offset, so that the chip component is close to the substrate, and alignment is performed while the camera unit of the identification mechanism can simultaneously capture images of the chip identification mark and the substrate identification mark within the depth of field.

Description

Technical Field

[0001] This invention relates to a mounting apparatus and a mounting method for mounting chip components onto a substrate. More particularly, it relates to a mounting apparatus and a mounting method for mounting the substrate with the electrode surfaces of the chip components facing the same direction upwards. Background Technology

[0002] As one method of mounting semiconductor chips and other chip components on a substrate such as a wiring substrate, there is mounting with the electrode surfaces of the substrate and the chip components facing the same direction, or mounting with the surface facing upwards.

[0003] In face-up mounting, the electrodes of the substrate are not directly bonded to the electrodes of the chip components. However, alignment is required to mount the chip components at specified positions on the substrate. Identification marks for alignment are attached to both the chip components and the substrate. Here, aligning the chip components to the specified positions on the substrate ensures that the positional relationship between the electrodes of the substrate and the electrodes of the chip components is mounted with a specified precision. The identification marks on both the substrate and the chip components are positioned based on the electrode positions and are generally attached to the electrode surfaces with clearly defined relative positions.

[0004] In addition, the following method is proposed: In face-up mounting, when aligning the chip component with the substrate, a transparent component is used in the part of the mounting head that holds the chip component, so that each identification mark can be observed through the mounting head (e.g., Patent Document 1, Patent Document 2).

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: International Publication No. 2003 / 041478

[0008] Patent Document 2: Japanese Patent Application Publication No. 2017-208522

[0009] Patent Document 3: Japanese Patent Application No. 2019-009174 Summary of the Invention

[0010] The problem that the invention aims to solve

[0011] The increasing density, multi-electrode configuration, and narrow-pitch design of semiconductor components necessitate mounting devices that perform face-up mounting with higher precision and faster alignment than ever before, without a significant increase in cost. In the device described in Patent Document 2, the chip identification mark and the substrate identification mark differ in height during the alignment stage. Consequently, the optical path lengths of the first chip identification mark AC1 and the first substrate identification mark AS1 (and the second chip identification mark AC2 and the second substrate identification mark AS2) are different. Due to depth-of-field limitations, it is difficult to acquire high-resolution images of both the chip identification mark and the substrate identification mark simultaneously. This necessitates driving a camera unit to focus on each identification mark, resulting in reduced mounting accuracy and lower productivity. Furthermore, the reflective optical system is extremely complex, leading to increased costs.

[0012] To address this issue, the applicant has invented an installation device with an identification mechanism. This identification mechanism independently sets up a chip identification camera unit for identifying chip identification marks and a substrate identification camera unit for identifying substrate identification marks, and sets them up differently with their focal positions via a common optical axis path. This enables simultaneous identification of chip identification marks and substrate identification marks (Patent Document 3), thereby achieving high-speed and high-precision alignment without a significant increase in cost.

[0013] However, the increasing demand for high-precision installation has created a necessity for installation devices with sub-micron level accuracy. However, under current conditions, even with sub-micron level alignment, installation accuracy sometimes exceeds 1 μm. That is, due to factors such as deviations in the straightness of the mounting head as it descends from the alignment height to the installation height, errors generated during the alignment and installation process cannot be ignored.

[0014] On the other hand, recently, there has been an increase in the method of embedding and mounting chip components in embedded substrates (component-integrated substrates). That is, such as... Figure 27 As shown in (a), the mounting portion SC of the substrate S is located in the recess, as follows: Figure 27 The installation method shown in (b) also requires an alignment method suitable for such an installation method.

[0015] The present invention was made in view of the above-mentioned problems, and provides a mounting apparatus and mounting method that can achieve high-precision mounting at the submicron level in the case of mounting in which the electrode surface of the substrate and the electrode surface of the chip component are aligned in the same direction.

[0016] Methods for solving problems

[0017] To address the aforementioned issues, the first aspect of the invention is a mounting device that mounts a chip component having a chip identification mark for alignment and a substrate having a substrate identification mark for alignment with alignment, with the chip identification mark and the substrate identification mark facing upwards, wherein... The installation device includes: A substrate mounting stage that holds the substrate; The mounting head holds the chip component; A lifting unit that allows the mounting head to move up and down in a direction perpendicular to the substrate; An identification mechanism that identifies the chip identification mark and the substrate identification mark from above the mounting head, and is movable in the in-plane direction of the substrate; and A control unit, connected to the identification mechanism, has the function of calculating the positional offset between the chip component and the substrate based on the positional information of the chip identification mark and the substrate identification mark obtained from the identification mechanism, and the function of driving the mounting head and / or the substrate mounting stage for alignment based on the positional offset. After aligning the chip component with the substrate, and with the camera unit of the identification mechanism capable of simultaneously capturing images of the chip identification mark and the substrate identification mark within the depth of field, the chip component is brought close to the substrate.

[0018] The second aspect of the invention, in the mounting apparatus described in the first aspect, the control unit has the following functions: identifying a substrate identification mark of the substrate held on the substrate mounting stage by means of the camera unit, and storing position information of the part where the chip component is mounted based on the position information of the substrate obtained from the camera unit.

[0019] The third aspect of the invention, in the mounting apparatus described in the second aspect, further includes a chip delivery unit having a chip slider for delivering chip components to the mounting head. The camera unit acquires the position information of the chip identification mark of the chip component that is transferred from the chip slider to the mounting head, and compares it with the position information of the part of the substrate where the chip is mounted. If the position offset is within the allowable value, the chip component is brought close to the substrate. When the camera unit can simultaneously capture the chip identification mark and the substrate identification mark within the depth of field, after alignment, the chip component is made to be tightly attached to the substrate.

[0020] The fourth aspect of the invention is a mounting device that mounts a chip component having a chip identification mark for alignment onto a mounting portion of a substrate having the substrate identification mark for alignment, with the chip identification mark and the substrate identification mark facing the same direction. The installation device includes: A substrate mounting stage that holds the substrate; The mounting head holds the chip component; A lifting unit that allows the mounting head to move up and down in a direction perpendicular to the substrate; The identification mechanism has the function of acquiring positional information of the chip identification mark and the substrate identification mark using a camera unit, and is capable of moving in the in-plane direction of the substrate; and A control unit, connected to the identification mechanism, has the function of calculating the positional offset between the chip component and the substrate based on the positional information of the chip identification mark and the substrate identification mark obtained from the identification mechanism, and the function of driving the mounting head and / or the substrate mounting stage for alignment based on the positional offset. The chip component is brought close to the substrate. After alignment, the chip component is brought into close contact with the substrate when the camera unit of the identification mechanism captures the chip identification mark and the substrate identification mark within the depth of field.

[0021] In the fifth aspect of the invention, in the mounting apparatus described in the fourth aspect, the identification mechanism acquires position information of a substrate identification mark on the substrate held on the substrate mounting stage, and the control unit controls the substrate mounting stage based on the position information of the substrate identification mark, thereby arranging a mounting portion of the substrate directly below the mounting head.

[0022] The sixth aspect of the invention, in the mounting apparatus described in the fifth aspect, further includes a chip delivery unit having a chip slider for transferring the chip component to the mounting head. Based on the position information of the chip identification mark obtained by the camera unit from the chip component transferred from the chip slider to the mounting head, the position offset of the chip component relative to the mounting location is calculated. If the position offset is within an allowable range, the mounting head is lowered so that the chip component and the substrate are close enough that the camera unit can simultaneously capture the chip identification mark and the substrate identification mark within the depth of field.

[0023] In the seventh aspect of the invention, in the mounting apparatus described in the sixth aspect, if the positional offset is outside the permissible range, the amount of movement of the chip component required to be within the permissible range is calculated, and after the chip component is moved to enter the permissible range, the chip component and the substrate are brought close together to a state in which the camera unit can simultaneously capture the chip identification mark and the substrate identification mark within the depth of field.

[0024] In the eighth aspect of the invention, in the mounting apparatus described in the first or fourth aspect, the identification mechanism comprises a chip identification camera unit focused on the chip identification mark and a substrate identification camera unit focused on the substrate identification mark, arranged in an optical path branching off from a common optical axis.

[0025] In the ninth aspect of the invention, in the mounting apparatus described in the eighth aspect, if the relationship between the position information of the chip identification mark obtained using the chip identification camera unit and the position information of the substrate identification mark obtained using the substrate identification camera unit is within an acceptable range, then the chip component and the substrate are brought close together such that either the chip identification camera unit or the substrate identification camera unit can simultaneously capture the chip identification mark and the substrate identification mark within the depth of field.

[0026] In the tenth aspect of the invention, in the mounting apparatus described in the ninth aspect, if the relationship between the position information of the chip identification mark obtained using the chip identification camera unit and the position information of the substrate identification mark obtained using the substrate identification camera unit is outside the permissible range, the amount of movement of the chip component required to be within the permissible range is calculated. After moving the chip component to enter the permissible range, the chip component and the substrate are brought close together to a state in which the camera unit can simultaneously capture the chip identification mark and the substrate identification mark within the depth of field.

[0027] In the mounting apparatus described in any one of the first to tenth aspects of the invention, the mounting apparatus further comprises a length measuring unit for measuring the distance between the surface of the substrate and the lower surface of the chip component. Based on the measurement results of the length measuring unit, the height of the mounting head during the alignment is determined.

[0028] The twelfth aspect of the invention, in the mounting device described in the eleventh aspect, involves placing the length measuring unit on the mounting head.

[0029] The invention of the thirteenth aspect, in the mounting apparatus described in the eleventh or twelfth aspect, enables the in-plane height distribution of the substrate or the substrate mounting stage to be determined by the length measuring unit.

[0030] The fourteenth aspect of the invention is a mounting method in which a chip component having a chip identification mark for alignment is mounted on a substrate having the substrate identification mark for alignment with the chip identification mark and the substrate identification mark facing upwards, wherein... The mounting method uses a substrate mounting stage to hold the substrate, a mounting head to hold the chip component, a lifting unit to move the mounting head up and down in a direction perpendicular to the substrate, and an identification mechanism that has the function of acquiring position information of the chip identification mark and the substrate identification mark using a camera unit and is capable of moving in the in-plane direction of the substrate, and performs the following steps: A precision alignment process is performed so that the chip component and the substrate are brought close enough that the imaging unit of the identification mechanism can simultaneously capture the state of the chip identification mark and the substrate identification mark within the depth of field, and then alignment is performed; and In the crimping process, after the precision alignment process, the mounting head is lowered further to bond the chip component tightly to the substrate.

[0031] The fifteenth aspect of the invention, in the mounting method described in the fourteenth aspect, involves a pre-alignment process prior to the precision alignment process. In this pre-alignment process, the camera unit identifies a substrate identification mark on the substrate held on the substrate mounting stage. Based on the position information of the substrate obtained from the camera unit, the mounting portion of the substrate on which the chip component is mounted is positioned directly below the mounting head. Based on the position information of the chip identification mark and the position information of the mounting part obtained from the identification mechanism, the positional offset between the chip component and the substrate is calculated. If the positional offset exceeds the allowable range, the mounting head and / or the substrate stage are driven to correct the positional offset.

[0032] The invention of the sixteenth aspect, in the mounting method described in the invention of the fifteenth aspect, includes a pre-alignment process in which, if the positional offset exceeds an allowable range, the mounting head and / or the substrate stage are driven to correct the positional offset.

[0033] The invention of the seventeenth aspect refers to the mounting method described in the fifteenth or sixteenth aspect, in which the pre-alignment process is performed when the height of the mounting head is above the height at which the chip component is transferred from the chip delivery unit.

[0034] Invention Effects

[0035] According to the present invention, in a mounting process where the electrode surfaces of the substrate and the electrode surfaces of the chip components face upwards in the same direction, sub-micron level high-precision mounting can be achieved. This is particularly suitable for high-precision mounting of chip components to embedded substrates. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the installation device according to an embodiment of the present invention.

[0037] Figure 2 (a) is a diagram showing the constituent elements of the mounting device according to an embodiment of the present invention, and (b) is a diagram showing the constituent elements of the mounting device viewed from the side.

[0038] Figure 3 This is a block diagram illustrating the control system of the installation apparatus according to an embodiment of the present invention.

[0039] Figure 4 This diagram illustrates the mounting locations of each chip component and the identification marks on each substrate, which are mounted on a substrate containing multiple chip components.

[0040] Figure 5 This diagram illustrates an example of obtaining location information of the identification marks on each substrate of a substrate on which multiple chip components are mounted.

[0041] Figure 6 (a) is a diagram showing the state in which the chip component is transferred from the chip slider to the auxiliary tool in the mounting apparatus according to an embodiment of the present invention, and (b) is a diagram showing this state viewed from the side.

[0042] Figure 7 The figures illustrate the pre-alignment process performed in the mounting apparatus according to an embodiment of the present invention. (a) shows the state in which the position information of the first chip identification mark is obtained immediately after the chip component is transferred from the chip slider to the auxiliary tool. (b) is a view of this state from the side.

[0043] Figure 8 This is an enlarged view showing the state of obtaining the position information of the chip identification first mark during the pre-alignment process performed in the mounting device according to an embodiment of the present invention.

[0044] Figure 9 The figures illustrate the pre-alignment process performed in the mounting apparatus according to an embodiment of the present invention. (a) is a figure showing the state in which position information of the second chip identification mark is obtained when the chip slider is in a retracted state. (b) is a figure showing the state viewed from the side.

[0045] Figure 10The diagram shows the position information of the first identification mark of the chip obtained in the pre-alignment process of the embodiment of the present invention. (a) is a diagram showing the state where the position offset exceeds the allowable range, and (b) is a diagram showing the state where the position offset is within the allowable range.

[0046] Figure 11 The figures illustrate the necessity of pre-alignment for embodiments of the present invention. (a) shows a state in which the chip component protrudes from the opening of the recess in the substrate, and (b) shows a state in which the chip component is to be embedded in the recess of the substrate in this state.

[0047] Figure 12 The figures illustrate a precision alignment process performed using the mounting apparatus according to an embodiment of the present invention. (a) is a figure showing a state in which position information of the substrate identification second mark and position information of the chip identification second mark are simultaneously acquired in the same field of view. (b) is a figure showing this state viewed from the side.

[0048] Figure 13 The figures illustrate a precision alignment process performed using the mounting apparatus according to an embodiment of the present invention. (a) is a figure showing a state in which position information of the substrate identification first mark and position information of the chip identification first mark are acquired simultaneously in the same field of view. (b) is a figure showing this state viewed from the side.

[0049] Figure 14 This is an enlarged view showing the state in which the position information of the first substrate identification mark and the position information of the first chip identification mark are simultaneously acquired in the same field of view during a precision alignment process performed using the mounting device according to an embodiment of the present invention.

[0050] Figure 15 This is a diagram illustrating an image example of a camera unit that simultaneously acquires position information of a substrate identification first mark and position information of a chip identification first mark within the same field of view during a precision alignment process performed using the mounting apparatus according to an embodiment of the present invention.

[0051] Figure 16 The figures illustrate the crimping process performed in the mounting apparatus according to an embodiment of the present invention. (a) shows the state in which the chip components are bonded to the substrate, and (b) is a view of this state from the side.

[0052] Figure 17 The figures illustrate the measurement of installation position accuracy during the crimping process stage in the installation apparatus according to an embodiment of the present invention. (a) is a figure showing the state in which the position information of the first substrate identification mark and the position information of the first chip identification mark are simultaneously acquired in the same field of view. (b) is a figure showing the state viewed from the side.

[0053] Figure 18 The figures illustrate the measurement of installation position accuracy during the crimping process stage in the installation apparatus according to an embodiment of the present invention. (a) is a figure showing the state in which the position information of the substrate identification second mark and the position information of the chip identification second mark are simultaneously acquired in the same field of view. (b) is a figure showing the state viewed from the side.

[0054] Figure 19 (a) is a diagram showing the constituent elements of a modified example of the mounting device according to an embodiment of the present invention, and (b) is a diagram showing the constituent elements of the mounting device viewed from the side.

[0055] Figure 20 The following diagram illustrates a pre-alignment process performed in a modified example of the mounting apparatus according to an embodiment of the present invention. (a) is a diagram showing the state in which position information of the substrate identification first mark and position information of the chip identification first mark are simultaneously acquired. (b) is a diagram showing this state as viewed from the side.

[0056] Figure 21 The figures illustrate a pre-alignment process performed in a modified example of the mounting apparatus according to an embodiment of the present invention. (a) is a figure showing the state in which position information of the substrate identification second mark and position information of the chip identification second mark are simultaneously acquired. (b) is a figure showing this state viewed from the side.

[0057] Figure 22 This is an enlarged view showing the state in which the position information of the first substrate identification mark and the position information of the first chip identification mark are simultaneously acquired in the same field of view during the pre-alignment process in a modified example of the mounting apparatus of the present invention.

[0058] Figure 23 The diagrams show the state in which the position information of the first substrate identification mark and the position information of the first chip identification mark are simultaneously acquired during the pre-alignment process of the mounting device in the embodiment of the present invention, when the chip component and the substrate are pre-aligned. (a) is a diagram showing an image example of the substrate imaging unit focused on the first substrate identification mark, and (b) is a diagram showing an image example of the substrate imaging unit focused on the first chip identification mark.

[0059] Figure 24 The diagram illustrates an example of mounting a chip component face up on a flat substrate. (a) shows the chip component in the state of being removed from the substrate, and (b) shows the mounted state.

[0060] Figure 25 This diagram illustrates that the mounting apparatus in the embodiments of the present invention is also applicable to mounting conditions using a flat substrate.

[0061] Figure 26 This is a diagram illustrating the function of the displacement sensor in an embodiment of the present invention.

[0062] Figure 27 The diagram illustrates the mounting with the embedded substrate facing upwards. (a) shows the state where the bottom of the chip component moves away from the bottom of the recess in the substrate, and (b) shows the mounting state. Detailed Implementation

[0063] Embodiments of the present invention will be described using the accompanying drawings. Figure 1 This is a schematic diagram of the installation device 1 in an embodiment of the present invention.

[0064] Mounting devices are used to mount chip components onto substrates such as wiring substrates, but Figure 1 The mounting device 1 is a structure suitable for mounting with the electrode surface of the chip component and the electrode surface of the substrate in the same direction, with the surface facing upwards.

[0065] The mounting device 1 comprises a substrate mounting stage 2, a lifting and pressurizing unit 3, a mounting head 4, an identification mechanism 5, and a chip delivery unit 6.

[0066] exist Figure 1 In the mounting apparatus 1, the substrate mounting stage 2 is composed of a mounting stage movement control unit 20 and an adsorption stage 23. The adsorption stage 23 is used to adsorb and hold the substrate disposed on the surface, and the adsorption stage 23 can move in the in-plane direction of the substrate surface while holding the substrate by means of the mounting stage movement control unit 20.

[0067] The stage movement control unit 20 includes a Y-direction stage movement control unit 22 capable of linearly moving the adsorption stage 23 in the Y direction, and an X-direction stage movement control unit 21 mounted on the base 200, capable of linearly moving the Y-direction stage movement control unit 22 in the X direction. The Y-direction movement control unit 22 mounts the adsorption stage 23 on a movable part disposed on a slide rail, and the movable part is moved and positioned via a Y-direction servo 221. Similarly, the X-direction movement control unit 21 mounts the Y-direction movement control unit 22 on a movable part disposed on a slide rail, and the movable part is moved and positioned via an X-direction servo 211.

[0068] The lifting and pressurizing unit 3 is fixed to a gantry frame (not shown). The upper and lower drive shafts are arranged vertically relative to the adsorption table 23, and the mounting head 4 is connected to the upper and lower drive shafts. The lifting and pressurizing unit 3 has the function of driving the mounting head 4 up and down and applying a pressure corresponding to a set value. Furthermore, in the mounting device 1, the lifting and pressurizing unit 3 is supported from two directions and linearly connected to the mounting head 4, making it difficult to apply a lateral force to the mounting head 4 during pressurization.

[0069] The mounting head 4 is used to hold the chip component C (held on the adsorption stage 23 of the substrate mounting stage 2) and press it in a parallel state with the substrate. The mounting head 4 consists of a mounting head body 40, a heater section 41, an auxiliary tool 42, and a tool position control unit 43. The head body 40 is connected to the lifting and pressing unit 3 via the tool position control unit 43, and the heater section 41 is fixedly disposed on its lower side. The heater section 41 has a heating function and heats the chip component C via the auxiliary tool 42. In addition, the heater section 41 has the function of adsorbing and holding the auxiliary tool 42 using a depressurization flow path. The auxiliary tool 42 is used to adsorb and hold the chip component C and is replaced according to the shape of the chip component C. The tool position control unit 43 makes a fine adjustment to the position of the mounting head body 40 in the plane direction perpendicular to the upper and lower drive shafts of the lifting and pressing unit 3, and accordingly adjusts the position of the auxiliary tool 42 and the chip component C held by the auxiliary tool 42 (in the XY plane of the figure).

[0070] The tool position control unit 43 consists of an X-direction tool position control unit 431, a Y-direction tool position control unit 432, and a tool rotation control unit 433. Figure 1 In the embodiment shown, the tool rotation control unit 433 adjusts the rotation direction of the head body 40, the Y-direction tool position control unit 432 adjusts the Y-direction position of the tool rotation control unit 433, and the X-direction tool position control unit 431 adjusts the X-direction position of the Y-direction position control unit. However, it is not limited to this, as long as the X-direction position, Y-direction position, and rotation angle of the head body 40 (and the constituent elements below it) can be adjusted.

[0071] exist Figure 2 The diagram shows the periphery of the mounting head body 40. Figure 2 (a) is the main view. Figure 2 (b) is a side view), in this embodiment, the face-up installation, as Figure 27 As shown, chip identification marks AC (chip identification first mark AC1 and chip identification second mark AC2) are provided at diagonal positions on the electrode surface of the chip component C, and substrate identification marks AS (substrate identification first mark AS1 and substrate identification second mark AS2) are provided at diagonal reference positions on the chip component mounting part of the electrode surface of the substrate S, both facing the direction of the mounting head 4.

[0072] Therefore, in the mounting device 1, the chip identification mark AC is configured to be visible through the mounting head 4, and an auxiliary tool 42 is formed from a transparent component, or a through hole is provided that aligns with the position of the chip identification mark AC. Additionally, for the heater section 41, in order to be able to observe the chip identification mark AC, it is also necessary to use a transparent component or provide an opening; in this embodiment, for example... Figure 2The through-hole 41H is thus configured. Here, the through-hole 41H can be configured corresponding to the position of each chip identification mark AC, but since it is not necessary to change the shape based on the chip component C, it can also be formed into a hole shape that corresponds to all size ranges. Furthermore, in order to observe the chip identification mark AC and / or the substrate identification mark AS, the mounting head 4 requires space that the image acquisition section 50 of the identification mechanism 5 can penetrate. In this embodiment, as shown... Figure 2 The head space 40V is set up as shown. That is, the head body 40 is a structure consisting of a side plate connected to the heater 41 and a top plate connecting the two side plates.

[0073] The identification mechanism 5 is used to capture images and obtain position information of the chip identification mark AC and / or the substrate identification mark AS by focusing across the mounting head 4 (through the auxiliary tool 42 and the heater part 41). In this embodiment, the identification mechanism 5 is composed of an image acquisition part 50, an optical path 52, and an imaging unit 53 connected to the optical path 52.

[0074] The image acquisition unit 50 is positioned above the object to be identified in the camera unit 53, and the object is brought into the field of view.

[0075] Furthermore, the identification mechanism 5 is configured to move in the in-plane direction of the substrate S (and the chip component C) within the head space 40V via a drive mechanism not shown. Moreover, in order to adjust the focus position, it is preferable that the substrate S can also be moved in the vertical direction (Z direction).

[0076] The mounting head 4 moves in a direction perpendicular to the substrate S via the lifting and pressurizing unit 3, but this movement can be performed independently of the movement of the identification mechanism 5. Therefore, the head space 40V needs to be designed with the following dimensions: even if the mounting head 4 moves in the vertical direction, the identification mechanism 5 entering the head space 40V will not be interfered with.

[0077] Furthermore, the movable range of the image acquisition unit 50 of the recognition mechanism 5 is not limited to within the head space 40V, but can also move above the substrate S from outside the head space 40V to acquire the position information of the substrate recognition mark AS.

[0078] The chip transport unit 6 consists of a transport track 60 and a chip slider 61. The chip slider 61 holds the chip component C supplied by the chip supply unit (not shown) and slides it to the area directly below the auxiliary tool 42.

[0079] Here, the chip supply unit (not shown) positions the chip component C at a predetermined location on the chip slider 61. Depending on the needs, the chip component C positioned on the chip slider 61 can also be identified by a recognition mechanism (not shown). Thus, by controlling the position of the chip slider 61 and the chip component C positioned on it, the chip component C can be transferred to a predetermined range within the auxiliary tool 42. After the auxiliary tool 42 holds the chip component C, the chip slider 61, having released the holding of the chip component C, moves to a retracted position.

[0080] like Figure 3 As shown in the block diagram, the mounting device 1 includes a control unit 10 connected to the substrate mounting stage 2, the lifting and pressurizing unit 3, the mounting head 4, the identification mechanism 5, and the chip delivery unit 6.

[0081] The control unit 10 is essentially composed of a CPU and a storage device, and may include interfaces and other devices as needed. Furthermore, the control unit 10 can perform calculations on the acquired data using built-in programs, and output the corresponding calculation results. Preferably, it also has the function of recording the acquired data and calculation results for use in new calculations.

[0082] The control unit 10 is connected to the substrate mounting stage 2 and performs operation control of the X-direction mounting stage movement control unit 21 and the Y-direction mounting stage movement control unit 22, and performs in-plane movement control of the adsorption stage 23. In addition, the control unit 10 controls the adsorption stage 23 to control the adsorption, holding and release of the substrate S.

[0083] The control unit 10 is connected to the lifting and pressing unit 3 to control the position of the mounting head 4 in the up and down direction (Z direction), and also has the function of controlling the pressure applied when pressing the chip component C onto the substrate S.

[0084] The control unit 10 is connected to the mounting head 4 and has the functions of using the tool position control unit 43 to control the adsorption, holding and release of the accessory tool 42 on the chip component C, the heating temperature of the heater unit 41, and the position of the head body 40 (and the heater unit 41 and accessory tool 42) in the XY plane.

[0085] The control unit 10 is connected to the identification mechanism 5 and has the function of controlling the drive in the horizontal (XY plane) and vertical (Z direction) directions, and controlling the camera unit 53 to acquire image data. Furthermore, the control unit 10 has an image processing function, which calculates the position of the chip identification mark AC and / or the substrate identification mark AS based on the image acquired by the camera unit 53.

[0086] The control unit 10 is connected to the chip delivery unit 6 and has the function of controlling the position of the chip slider 61 that moves along the delivery track 60.

[0087] The following describes the process by which the mounting apparatus 1 mounts the chip component C onto the substrate S. Figure 4 An example of a substrate S processed in an embodiment of the present invention is shown. For example... Figure 4 As shown, the substrate S has multiple mounting portions SC, and a substrate identification first mark AS1 and a substrate identification second mark AS2 are provided on each mounting portion SC. In addition, as a reference mark (substrate reference mark AS0) for confirming the overall configuration of the substrate, a substrate reference first mark AS01 and a substrate reference second mark AS02 may also be provided, and each mounting portion SC (and the substrate identification mark AS) is configured with high precision relative to the reference mark.

[0088] For such a substrate S, the control unit 10 of the mounting apparatus 1 has the function of calculating and storing the position information of each mounting part SC of the substrate S disposed on the adsorption stage 23. An example of this is shown below. Figure 5 This demonstrates a scenario where, while the stage 23 holding the substrate S is moved using the stage moving unit 20, the identification mechanism 5 captures images of each substrate identification mark AS disposed on the substrate S to obtain position information, and the position information of each mounting part SC is calculated and stored. Furthermore, when a substrate reference first mark AS01 and a substrate reference second mark AS02 are provided, by storing the mapping of the mounting parts SC in the substrate S in advance by the control unit 10, the position information of each mounting part SC within the substrate S can also be calculated and stored based on the position information obtained by identifying the substrate reference first mark AS01 and the substrate reference second mark AS02. In addition, an example is described where the substrate S is moved by the stage moving unit 20 when identifying each substrate identification mark AS or each substrate reference mark AS0, but the identification mechanism 5 can also be moved.

[0089] After obtaining the position information of each mounting part SC configured on the adsorption stage 23 as described above, the chip component C is installed onto each mounting part SC.

[0090] The following describes the process of mounting the chip component C to each mounting position SC using the attached drawings. However, regarding the substrate S, only the mounting position SC is described.

[0091] Figure 6 This describes a mounting preparation process where the auxiliary tool 42 of the mounting head 4 holds the chip component C, and the mounting position SC of the substrate S to be mounted on is positioned directly below the mounting head 4. In this mounting preparation process, to shorten the time of subsequent processes, it is preferable to improve the positional accuracy of the chip component C held by the auxiliary tool 42 and the positional accuracy of the mounting position SC beforehand.

[0092] Therefore, it is preferable to use a chip supply unit (not shown) to precisely position the chip component C at a predetermined position on the chip slider 61, and to precisely transport the chip slider 61 via the chip transport unit 6. Furthermore, in order to precisely position the mounting portion SC of the substrate S directly below the mounting head 4, it is preferable to use a stage movement control unit 20 that precisely controls the position of the adsorption stage 23 based on previously obtained position information of each mounting portion SC.

[0093] In the mounting preparation process, the mounting portion SC of the substrate S is precisely positioned directly below the mounting head 4. Therefore, in the subsequent pre-alignment process, provided that the mounting portion SC of the substrate S is within a specified range directly below the mounting head 4, the identification mechanism 5 acquires only the position information of the chip component C.

[0094] Figure 7 This describes the pre-alignment process, but a gap is provided between the chip slider 61 and the lower surface of the chip component C when the chip slider 61 is retracted. Therefore, the mounting head 4 is slightly raised during the pre-alignment process. That is, if the distance between the mounting head height BHZ and the lower surface of the auxiliary tool 42 of the mounting head 4, based on the surface of the adsorption stage 23, is defined as the mounting head height BHZ, then the mounting head height BHZ in the pre-alignment process increases by Δz from Dz in the mounting preparation process to become Dz + Δz. Here, Δz is the necessary and minimum distance for the chip slider 61 to retract without interfering with the lower surface of the chip component C, and is approximately 1 mm to 2 mm. Furthermore, if the chip component C is raised and lowered towards the chip slider 61 and then handed over to the auxiliary tool 42, then Δz can also be set to 0.

[0095] The pre-alignment process is also like this Figure 8 As shown, the chip component C is held in the auxiliary tool 42, but the identification mechanism 5 only observes the chip identification mark AC. Therefore, even during the retraction of the chip slider 61, the position information of the chip component C can be obtained. Furthermore, when the identification mechanism 5 identifies the chip identification mark AC, after identifying the first chip identification mark AC1, it identifies the second chip identification mark AC2. Therefore, as... Figure 9 As shown, the recognition mechanism 5 moves in the XY plane such that the image acquisition unit 50 is aligned with the recognition mark AC of each chip. Furthermore, in Figure 9 The image shows an example of chip slider 61 retracting during the stage when the identification chip identifies the second mark AC2.

[0096] In this embodiment, during the pre-alignment process, based on the pre-acquired position information of the mounting part SC, the mounting part SC to be installed next is positioned directly below the mounting head 4 within a specified accuracy. Therefore, it is also possible to determine the allowable range PAC where the chip identification mark AC of the chip component C should be located. Figure 10 The relationship between the chip identification first mark AC1 acquired by the camera unit 53 of the identification unit 5 and the allowable range PAC in which the chip identification first mark AC1 should be located is shown.

[0097] Here, as Figure 10 As shown in (b), if the center position of the chip identifies the first mark AC1 is within the allowable range PAC, and the center position of the chip identifies the second mark AC2 is also within the allowable range PAC (if the chip slider 61 is in a further retracted state), then proceed to the next process.

[0098] On the other hand, such as Figure 10 As shown in (a), if the center position of the first chip identification mark AC1 deviates from the allowable range PAC, the position information of the center of the second chip identification mark AC2 is also obtained. The correction movement of the substrate S and the chip component C in the substrate plane is calculated to correct the positional offset of the chip component C relative to the mounting location SC. The XY plane position of the "(fixed relative position) adsorption stage 23 and identification mechanism 5" or accessory tool 42 is adjusted, such as... Figure 10 As shown in (b), the chip identification first mark AC1 is brought within the allowable range PAC. Here, generally, the weight load on the auxiliary tool 42 is smaller when moving the adsorption stage 23, so it is preferable to adjust the position on the mounting head 4 side during pre-alignment.

[0099] In addition, the pre-alignment process involves embedding and mounting the chip components in... Figure 27 This is important in cases where the substrate is embedded (component-embedded substrate) as shown. That is, there are often cases where the opening area of ​​the recess is not sufficient relative to the mounting area SC, such as... Figure 11 As shown in (a), with the outer edge EC of the chip component C located outside the edge portion EB of the recess, if the mounting head 4 is lowered, the chip component C contacts the surface of the substrate S outside the recess. If it is desired to further lower the mounting head 4 from this state to the height for precise alignment as described later ( Figure 11 If (b) occurs, it will cause faults such as damage to chip component C.

[0100] After the pre-alignment process, as a head-lowering process, the mounting head 4 is lowered by the lifting and pressurizing unit 3. This brings the chip component C as close as possible without contacting the substrate S and stops it there. Preferably, through this head-lowering process, the vertical distance dS between the upper surface of the chip component C, which has the first chip identification mark AC1 (and the second chip identification mark AC2), and the upper surface of the substrate S, which has the first substrate identification mark AS1 (and the second substrate identification mark AS2), enters the depth of field of the identification mechanism 5. Therefore, the conditions for the vertical distance dS to enter the depth of field of the identification mechanism 5 are described below.

[0101] first, Figure 8 The relationship between the vertical distance dS, the distance (gap) G to the bonding surface of the mounting chip component C on the substrate S, the thickness TC of the chip component C, and the depth DSC of the recess on the substrate S can be expressed by the following formula (1).

[0102] dS = G + TC - DSC .....(1)

[0103] Here, "+TC-DSC" is smaller than the thickness TC of the chip component C, which is typically less than 100 μm, and is less than tens of μm. Furthermore, it becomes less than zero when the chip component C is completely embedded in the substrate S. Therefore, if the descent of the mounting head 4 can be stopped and the gap G reduced just before the chip component C is about to contact the bottom surface of the recess in the substrate S, the chip identification first mark AC1 and the substrate identification first mark AS1 (or the chip identification second mark AC2 and the substrate identification second mark AS2) can be included within the depth of field.

[0104] The distance G, which is the specific gap that satisfies this condition, becomes, according to equation (1): G=dS-(TC-DSC)=dS+DSC-TC······(2) In relation to depth of field (DOF) dS≤DOF······(3) Therefore, the following condition needs to be met: 0 < G ≤ DOF + DSC - TC ······ (4) Therefore, the control unit 10 of the mounting device 1 measures the surface height of the stage 2 (or the surface height of the substrate S) and the height of the mounting head 4 using a displacement sensor 7 (not shown). It calculates the gap G using design values ​​such as the thickness TC of the chip component, the thickness TS of the substrate S, and the depth DSC of the recess, and stops the descent of the mounting head 4 at a height that satisfies the condition of equation (4). Furthermore, in equation (4), the gap G is a value exceeding zero, but for alignment and relative movement between the chip component C and the substrate S, it is preferably several μm or more. Additionally, the actual values ​​of the thickness TC of the chip component C, the thickness TS of the substrate S, the thickness of the thermosetting adhesive, and the depth DSC of the recess deviate from the design values; therefore, it is preferable to also consider these deviations. Here, since it is preferable to determine the vertical distance between the surface of the substrate S and the lower surface of the mounting head 4 (the lower surface of the auxiliary tool 42), the displacement sensor 7 can be fixedly mounted on the mounting head 4, but it is not limited to this; it can also be fixed to the image acquisition unit 50, etc.

[0105] Following the head descent process is the precision alignment process, using... Figure 12 , Figure 13 , Figure 14 as well as Figure 15 An explanation will be provided here. Figure 12 Is Figure 9 After pre-alignment in the specified state, the position information of the substrate identification second mark AS2 and the chip identification second mark AC2 is acquired while the head is lowered. Then, the control unit 10 controls the drive unit of the identification mechanism 5 to move the identification mechanism 5 to... Figure 13 The system obtains the position information of the substrate identification first marker AS1 and the chip identification first marker AC1. Additionally, Figure 14 yes Figure 13 A magnified view of (a).

[0106] In the precision alignment process, it is possible to simultaneously capture images of the substrate identification first mark AS1 and the chip identification first mark AC1 (as well as the substrate identification second mark AS2 and the chip identification second mark AC2) within the depth of field (DOF). Figure 14 To explain this, the vertical distance dS between the upper surface of the chip component C with the chip identification first mark AC1 and the upper surface of the substrate S with the substrate identification first mark AS1 becomes the gap G below the depth of field DOF of the camera unit 53.

[0107] Therefore, as Figure 15 As shown, the camera unit 53 can clearly capture images of both the substrate identification first mark AS1 and the chip identification first mark AC1.

[0108] Similarly, in Figure 12In this state, the camera unit 53 clearly captures images of both the substrate identification second mark AS2 and the chip identification second mark AC2, so the control unit 10 can accurately determine the relative positions of the substrate identification second mark AS2 and the chip identification second mark AC2.

[0109] Afterwards, it was used in Figure 13 The relative position information of the substrate identification first mark AS1 and the chip identification first mark AC1 obtained in the state, and in Figure 12 Based on the relative position information of the substrate identification second mark AS2 and the chip identification second mark AC2 obtained under the given conditions, the substrate S and the chip component C are aligned. Specifically, firstly, the control unit 10 calculates and determines the positional offset between the substrate S and the chip component C based on the relative position information of the substrate identification first mark AS1 and the chip identification first mark AC1, and the relative position information of the substrate identification second mark AS2 and the chip identification second mark AC2. Then, the control unit 10 calculates the correction movement amount of the substrate S and the chip component C within the substrate surface to correct this positional offset. Under the control of the control unit 10, the substrate mounting stage 2 and / or the mounting head 4 are driven in the in-plane (XY and θ) directions to achieve precise alignment with the positional offset of the substrate S and the chip component C within an acceptable range.

[0110] After the precision alignment process is completed, the chip component C is thermally pressed onto the substrate S in a bonding process. During the bonding process, the control unit 10 lowers the mounting head 4, causing the chip component C to adhere tightly to the substrate S, and mounting is performed with a specified pressure. Figure 16 Here, the descent distance of the mounting head 4 is the gap G, and the gap G shown in equation (7) is about several μm to tens of μm. Therefore, the positional accuracy obtained in the alignment process can be maintained during the installation process, achieving high-precision installation.

[0111] In the installation process, the thermosetting adhesive between the substrate S and the chip component C is heated by the heater section 41 of the mounting head 4, thereby fixing the chip component C to the substrate S. After pressurization and heating for a specified time, the mounting head 4 releases the chip component C from its hold and rises, completing the installation process.

[0112] Furthermore, from a quality management perspective, it is required to perform a full measurement and inspection of the installation position accuracy after the installation process is completed. However, in the installation device 1 of the present invention, a full measurement of the installation position accuracy can be performed without increasing costs. That is, if in Figure 17 and Figure 18 The crimping process shown is carried out in the following steps. Figure 13 The relative position information of the substrate identification first mark AS1 and the chip identification first mark AC1 is obtained and... Figure 12By acquiring the relative position information of the substrate identification second mark AS2 and the chip identification second mark AC2, the position information relative to the substrate S during the pressing process can be obtained for each chip component C, i.e., the mounting accuracy. Moreover, if the time required for hot pressing in the pressing process is longer than the time required for acquiring the position information, the mounting position accuracy can be measured within the time of the pressing process, which can be carried out without affecting the production cycle time of the installation.

[0113] After pressurizing for the specified time, the crimping process ends. If a new chip component C is present, the installation preparation process begins.

[0114] The above describes a series of installation steps in this embodiment. In this embodiment, if the "position where the chip component C will be installed next" of the substrate S and the chip component C are configured with high precision before the pre-alignment step, the tool position control unit 43 is less likely to operate during the pre-alignment step, and essentially only accuracy verification is performed. Therefore, the production cycle time is shortened, resulting in an installation device with excellent productivity. Here, in a device where each component is precisely machined, if the positional deviation will not deviate from the allowable range as long as there are no abnormalities in each mechanism, only device fault determination can be performed. In such a case, only the positional information of either the chip identification first mark AC1 or the chip identification second mark AC2 can be obtained.

[0115] On the other hand, to meet the high precision requirements before the pre-alignment process, precision machining and assembly of each part of the installation device are necessary, which correspondingly increases the cost of the device. Therefore, in Figure 19 The diagram shows the structure of a mounting apparatus, a variation of this embodiment, that can handle situations where the "part of the substrate S to be mounted next" before the pre-alignment process and the difficulty of high-precision configuration of the chip component C is encountered.

[0116] Figure 2 The mounting device 1 shown is configured such that, during pre-alignment, assuming the mounting portion SC of the substrate S is positioned below the mounting head 4 with a predetermined precision, it only acquires the position information of the chip component identification mark AC. In contrast, in Figure 19 In the modified example shown, the position information of the substrate identification mark AS is also obtained during the pre-alignment process.

[0117] Therefore, in Figure 19 In the installation device shown, the identification mechanism 5 includes an image acquisition unit 50, an optical system (shared) 51, two optical paths 52a and 52b branching from the optical system 51 with a common optical axis, and a camera unit 53a connected to the optical path 52a and a camera unit 53b connected to the optical path 52b as constituent elements.

[0118] Furthermore, by setting the optical path lengths of "the path from the image acquisition unit 50 through the optical system 51 and optical path 52a to the imaging unit 53a" and "the path from the image acquisition unit 50 through the optical system 51 and optical path 52b to the imaging unit 53b" to be different, the focal positions of the imaging unit 53a and the imaging unit 53b are different. Here, the optical system (common) 51 has the function of changing the direction of the optical path through the reflection unit 500 and the reflection unit 520, and the optical path is branched by the semi-reflective mirror 511. The optical systems 52a and 52b have optical lenses, and can also have the function of magnifying the image in order to obtain high resolution.

[0119] The following uses Figure 20 , Figure 21 , Figure 22 as well as Figure 23 For use Figure 19 The pre-alignment process of a modified embodiment of the present invention shown will be described. In this pre-alignment process, the control unit 10 holds the substrate S on the substrate stage 2 and holds the chip component C on the mounting head 4. At this time, the substrate S is positioned within a predetermined range of the substrate stage 2, and the chip component C is held in a predetermined in-plane position on the lower surface of the auxiliary tool 42. That is, the chip component C and the substrate S are substantially aligned. Therefore, the substrate identification first mark AS1, the substrate identification second mark AS2, the chip identification first mark AC1, and the chip identification second mark AC2 are all in a state that can be observed through the through hole 41H of the heater 41 and the auxiliary tool 42, across the mounting head 4.

[0120] In the pre-alignment process of the modified example, when there is a height difference between the substrate identification mark AS and the chip identification mark AC, making it difficult to capture both identification marks in the depth of field at the same time, the substrate S and the chip component C are aligned, and the substrate identification mark and the chip identification mark are observed by other camera units with different focal lengths.

[0121] Here, use Figure 20 A magnified view of (a) Figure 22 The following explanation addresses situations where it is difficult to simultaneously capture two identification markers within the depth of field. Furthermore, in the following description, the height is referenced to the surface of the adsorption stage 23.

[0122] exist Figure 22 In this context, based on the relationship between the thickness TS of the substrate S and the mounting head height BHz (which is the height of the lower surface of the auxiliary tool 42), the vertical distance dS between the upper surface of the chip component C where the chip identification first mark AC1 is located and the upper surface of the substrate S where the substrate identification first mark AS1 is located is defined as follows: dS=BHz-TS······(5) Here, Figure 5 The mounting head height BHz in the current state is Δz higher than the mounting head height Dz during chip handover, becoming... BHz=Dz+Δz······(6) Substituting into equation (1), we get: dS=Dz+Δz-TS······(7).

[0123] Here, Dz is thicker than the chip slider 61 on which the chip component C is mounted, so it is about 10 mm. Δz is above 1 mm and below 2 mm as described above. In contrast, the thickness TS of the substrate S is generally below 2 mm, so dS is about 10 mm.

[0124] Therefore, in order to simultaneously observe the chip identification first mark AC1 and the substrate identification first mark AS1, a depth of field of approximately 10 mm is required. However, under the condition of determining the positions of the chip identification first mark AC1 and the substrate identification first mark AS1 with high precision at the μm level or above, it is practically impossible to achieve a depth of field of approximately 10 mm.

[0125] Based on the above reasons, during the pre-alignment process, the substrate identification mark AS and the chip identification mark AC are observed separately using camera units with different focal lengths.

[0126] That is, the position information is obtained by simultaneously identifying the first mark AS1 on the substrate and the first mark AC1 on the chip. Figure 20 (as well as Figure 22 In the state of ), Figure 19 In (b), either the imaging unit 53a or the imaging unit 53b focuses on the substrate identification first mark AS1 and takes an image, while the other focuses on the chip identification first mark AC1 and takes an image. In the following description, an example of imaging unit 53a taking an image of the substrate identification first mark AS1 and imaging unit 53b taking an image of the chip identification first mark AC1 will be described. Furthermore, it is preferable that imaging units 53a and 53b, as well as optical systems 52a and 52b, have the same specifications for the number of imaging elements, optical lens magnification, etc., and preferably adopt a structure in which the optical path length from the substrate identification first mark AS1 to imaging unit 53a is equal to the optical path length from the chip identification first mark AC1 to imaging unit 53b.

[0127] With this structure, in the camera unit 53a, such as Figure 23 As shown in (a), an image focused on the first mark AS1 for substrate identification is obtained in the imaging unit 53b, as shown in (a). Figure 23As shown in (b), an image focused on the chip identification first mark AC1 is obtained. Moreover, images focused on the substrate identification first mark AS1 and the chip identification first mark AC1 can be obtained simultaneously via a shared optical axis path. Here, if the coordinate position relationship of the images obtained by the two imaging units is made clear, the relative position information of the substrate identification first mark AS1 and the chip identification first mark AC1 can be obtained.

[0128] exist Figure 20 After obtaining position information by recognizing the first mark AS1 on the substrate and the first mark AC1 on the chip, the control unit 10 controls the drive unit of the recognition mechanism 5, such as... Figure 21 As shown, the image acquisition unit 50 is positioned so that the substrate identification second mark AS2 and the chip identification second mark AC2 enter the same field of view. At this time, if the movement is in the in-plane direction of the substrate (XY), the position of the identification mechanism 5 is not adjusted in the vertical direction (Z direction), and the state of focusing on the substrate identification mark and the chip identification mark is maintained respectively.

[0129] Therefore, an image focused on the second substrate identification mark AS12 is obtained in imaging unit 53a, and an image focused on the second chip identification mark AC2 is obtained in imaging unit 53b. Furthermore, images focused on the first substrate identification mark AS1 and the first chip identification mark AC1 can be obtained simultaneously via a shared optical axis path. Here, if the coordinate position relationship between the images obtained by the two imaging units is clearly defined, the relative position information of the second substrate identification mark AS2 and the second chip identification mark AC2 can be obtained.

[0130] Next, use in Figure 20 The relative position information of the substrate identification first mark AS1 and the chip identification first mark AC1 obtained in the state, and in Figure 21 Based on the relative position information of the substrate identification second mark AS2 and the chip identification second mark AC2 obtained under the given conditions, the position of the substrate S and the chip component C is adjusted. Specifically, firstly, the control unit 10 calculates and determines the positional offset of the substrate S and the chip component C based on the relative position information of the substrate identification first mark AS1 and the chip identification first mark AC1, and the relative position information of the substrate identification second mark AS2 and the chip identification second mark AC2. If the positional offset exceeds the allowable range, the control unit 10 calculates the correction movement amount of the substrate S and the chip component C within the substrate surface to correct the positional offset, and drives the substrate mounting stage 2 and / or the mounting head 4 in the in-plane (XY) direction to adjust the position so that the positional offset of the substrate S and the chip component C is within the allowable range, thus completing the pre-alignment.

[0131] Afterwards, the head lowering process, the precision alignment process, and the pressing process are performed. In addition, in the precision alignment process, any of the camera units 53a and 53b can be used as the camera unit, but the camera unit that observes the first substrate identification mark AS1 (and the second substrate identification mark AS2) does not need to change the focus even when the mounting head 4 is lowered, so it is preferred.

[0132] The above is about the use Figure 1 The installation device 1 of the illustrated embodiment or its variants ( Figure 19 )conduct Figure 27 The example of embedded installation as shown is illustrated, but the invention can also be applied to other types of installations, such as... Figure 24 The mounting portion SC of the substrate S without a recess, as in (a), Figure 24 The case where chip component C is installed as in (b). In this case, since it is not installed into the recess of the substrate S, during the precision alignment process, it is sufficient for both the substrate identification first mark AS1 and the chip identification first mark AC1 (and both the substrate identification second mark AS2 and the chip identification second mark AC2) to be within the same field of view of the camera unit, thus reducing the necessity for pre-alignment.

[0133] Among them, Figure 25 In that installation method, setting DSC in equation (7) to zero requires obtaining a gap G that satisfies the following equation: 0<G≤DOF-TC······(8) That is, it can be performed in the mounting of thin and thick chip components, such as when the thickness TC of the chip component C is smaller than the depth of field (DOF). However, when the mounting head 4 is lowered in the mounting head lowering process, measurements can be taken each time using the displacement sensor 7, but the in-plane distribution of the surface height of the substrate stage 2 or the surface height of the substrate S can also be known in advance, and the height of the mounting head 4 can be finely corrected for each alignment process based on this height distribution. As a result, the time from the pre-alignment process to the alignment process can be shortened.

[0134] It should be noted that, as a measurement of the in-plane distribution of the surface height of the substrate mounting stage 2 or the surface height of the substrate S, it is sufficient to use a displacement sensor 7 set as the reference height, and measure the surface height while moving the substrate mounting stage 2 relative to the displacement sensor 7 in the XY plane. Figure 26 An example is shown of measuring the height direction (Z direction) distribution of the surface F2 of the substrate stage 2 by means of displacement sensor 7, and a state is shown of measuring the Z direction distance LZ of the surface F2 while moving the substrate stage 2 relative to each other in the XY direction using displacement sensor 7 with constant height in the Z direction.

[0135] The description up to this point has described an example of applying the present invention to a face-up mounting, provided that a chip identification mark is given on the electrode surface side of the chip component C. However, when using a chip component that has a chip identification mark given on the side opposite to the electrode surface, the present invention can also be applied to a face-down mounting.

[0136] Explanation of reference numerals in the attached figures

[0137] 1 Installation device

[0138] 2. Substrate mounting stage

[0139] 3 Lifting and Pressurizing Unit

[0140] 4 mounting heads

[0141] 5. Identification Agency

[0142] 6 chip delivery units

[0143] 7 Displacement Sensor

[0144] 10. Control Department

[0145] 20. Platform Motion Control Unit

[0146] 21 X-axis stage movement control unit

[0147] 22 Y-direction stage movement control unit

[0148] 23 Adsorption stage

[0149] 40 heads

[0150] 41V head space

[0151] 41 Heater Section

[0152] 41H Through Hole

[0153] 42. Attachment Tools

[0154] 43 Tool Position Control Unit

[0155] 50 Image acquisition unit

[0156] 51 Optical System (Common Part)

[0157] Optical paths 52, 52a, and 52b

[0158] Camera units 53, 53a, and 53b

[0159] 52a, 52b Optical Systems (Branch)

[0160] Camera units 53a and 53b

[0161] 60 Conveyor Track

[0162] 61 Chip Slider

[0163] 200 abutment

[0164] 211 X-axis server

[0165] 221 Y-direction server

[0166] 431 X-direction tool position control unit

[0167] 432 Y-direction tool position control unit

[0168] 433 Tool Rotation Control Unit

[0169] 500, 520 reflective devices

[0170] 511 Semi-reflective mirror

[0171] C chip components

[0172] S substrate

[0173] AC1 and AC2 chip identification marks

[0174] AS1 and AS2 substrate identification marks

[0175] SC mounting location

[0176] BHZ Mounting head height (vertical distance between the lower surface of the auxiliary tool and the surface of the substrate stage)

[0177] Vertical distance between dS chip identification mark and substrate identification mark

[0178] Depth of the recess in the DSC substrate

[0179] Mounting head height during Dz chip component handover

[0180] Gap between G chip components and substrate

Claims

1. A mounting apparatus for mounting a chip component having a chip identification mark for alignment and a substrate having a substrate identification mark for alignment with alignment, wherein the chip identification mark and the substrate identification mark face upwards, The installation device includes: A substrate mounting stage that holds the substrate; The mounting head holds the chip component; A lifting unit that allows the mounting head to move up and down in a direction perpendicular to the substrate; A chip delivery unit having a chip slider that delivers the chip component to the mounting head; An identification mechanism that identifies the chip identification mark and the substrate identification mark from above the mounting head, and is movable in the in-plane direction of the substrate; and A control unit, connected to the identification mechanism, has the following functions: storing position information of the portion where the chip component is mounted, based on position information of the substrate identification mark on the substrate held on the substrate mounting stage, obtained by the identification mechanism; calculating the positional offset between the chip component and the substrate based on the position information of the chip identification mark and the substrate identification mark obtained from the identification mechanism; and driving the mounting head and / or the substrate mounting stage for alignment based on the positional offset. Before the chip slider retracts from directly below the chip component, the camera unit of the identification mechanism acquires the position information of the chip identification mark on the chip component and compares it with the position information of the part of the substrate where the chip is mounted. If the position offset is within the allowable value, the chip component is brought close to the substrate. When the camera unit can simultaneously capture the chip identification mark and the substrate identification mark within the depth of field, after alignment, the chip component is brought tightly against the substrate.

2. A mounting apparatus for mounting a chip component having a chip identification mark for alignment onto a mounting portion of a substrate having the substrate identification mark for alignment, wherein the chip identification mark and the substrate identification mark are oriented in the same direction. The installation device includes: A substrate mounting stage that holds the substrate; The mounting head holds the chip component; A lifting unit that allows the mounting head to move up and down in a direction perpendicular to the substrate; The identification mechanism has the function of using a camera unit to acquire position information of the chip identification mark and the substrate identification mark, and is capable of moving in the in-plane direction of the substrate; A chip delivery unit having a chip slider for delivering the chip component to the mounting head; as well as A control unit, connected to the identification mechanism, has the function of calculating the positional offset between the chip component and the substrate based on the positional information of the chip identification mark and the substrate identification mark obtained from the identification mechanism, and the function of driving the mounting head and / or the substrate mounting stage for alignment based on the positional offset. The identification mechanism acquires the position information of the substrate identification mark on the substrate held on the substrate mounting stage. The control unit controls the substrate mounting stage based on the position information of the substrate identification mark, and positions the substrate mounting part directly below the mounting head. Based on the position information of the chip identification mark obtained by the camera unit before the chip slider finishes retracting from directly below the chip component, as the chip component is transferred from the chip slider to the mounting head, the positional offset of the chip component relative to the mounting location is calculated. If the positional offset is within the allowable range, the chip component is brought close to the substrate. After alignment, the chip component is brought into close contact with the substrate when the camera unit of the identification mechanism captures the chip identification mark and the substrate identification mark within the depth of field.

3. The mounting device of claim 2, wherein, If the position offset is outside the allowable range, the amount of movement of the chip component required to enter the allowable range is calculated. After the chip component is moved into the allowable range, the chip component and the substrate are brought close together until the camera unit can simultaneously capture the chip identification mark and the substrate identification mark within the depth of field.

4. The mounting device of claim 1 or 2, wherein, In the identification mechanism, a chip identification camera unit focusing on the chip identification mark and a substrate identification camera unit focusing on the substrate identification mark are arranged on an optical path that has a common optical axis but branches out.

5. The mounting device of claim 4, wherein, If the relationship between the position information of the chip identification mark obtained using the chip identification camera unit and the position information of the substrate identification mark obtained using the substrate identification camera unit is within an acceptable range, then the chip component and the substrate are brought close enough that either the chip identification camera unit or the substrate identification camera unit can simultaneously capture the chip identification mark and the substrate identification mark within the depth of field.

6. The mounting device of claim 4, wherein, If the relationship between the position information of the chip identification mark obtained using the chip identification camera unit and the position information of the substrate identification mark obtained using the substrate identification camera unit is outside the allowable range, then the amount of movement of the chip component required to be within the allowable range is calculated. After moving the chip component into the allowable range, the chip component and the substrate are brought close to a state where either the chip identification camera unit or the substrate identification camera unit can simultaneously capture the chip identification mark and the substrate identification mark within the depth of field.

7. The mounting device of claim 1 or 2, wherein, The mounting device also includes a length measuring unit for measuring the distance between the surface of the substrate and the lower surface of the chip component. Based on the measurement results of the length measuring unit, the height of the mounting head during the alignment is determined.

8. The mounting device of claim 7, wherein, The length measuring unit is placed on the mounting head.

9. The mounting device of claim 7, wherein, The in-plane height distribution of the substrate or the substrate mounting stage can be determined by the length measuring unit.

10. A mounting method comprising mounting a chip component having a chip identification mark for alignment onto a substrate having the substrate identification mark for alignment, with the chip identification mark and the substrate identification mark facing upwards, wherein, The mounting method uses a substrate mounting stage to hold the substrate, a mounting head to hold the chip component, a lifting unit to move the mounting head up and down in a direction perpendicular to the substrate, an identification mechanism that has the function of acquiring position information of the chip identification mark and the substrate identification mark using a camera unit and is capable of moving in the in-plane direction of the substrate, and a chip transport unit having a chip slider to transfer the chip component to the mounting head, and performs the following steps: In the pre-alignment process, the camera unit identifies the substrate identification mark of the substrate held on the substrate mounting stage. Based on the position information of the substrate obtained from the camera unit, the mounting part of the substrate on which the chip component is mounted is positioned directly below the mounting head. According to the position information of the chip identification mark and the position information of the mounting part obtained from the identification mechanism before the chip slider retracts from directly below the chip component, the positional offset between the chip component and the substrate is calculated. If the positional offset exceeds the allowable range, the mounting head and / or the substrate mounting stage are driven to correct the positional offset. The precision alignment process involves bringing the chip component and the substrate close together until the camera unit of the identification mechanism can simultaneously capture the state of the chip identification mark and the substrate identification mark within the depth of field, and then performing alignment. as well as In the crimping process, after the precision alignment process, the mounting head is lowered further to bond the chip component tightly to the substrate.

11. The mounting method of claim 10, wherein, The pre-alignment process is performed when the height of the mounting head is above the height at which the chip component is transferred from the chip delivery unit.

Images