magnetic sensor

Abstract

The magnetic sensor of the present invention includes: an insulating layer, a coil element disposed on the insulating layer, and a first insulating film. The insulating layer has a first inclined surface and a second inclined surface. The coil element has a first side surface and a second side surface. The first side surface includes: a first portion and a second portion disposed at a position farther from the upper surface of the substrate than the first portion. The first portion is inclined in a manner intersecting the first and second inclined surfaces, and is inclined in a manner that approaches the second side surface as it approaches the upper surface of the substrate. The first insulating film covers the first portion.

Description

Technical Field

[0001] The present invention relates to a magnetic sensor having a metal layer disposed on an inclined surface. Background Technology

[0002] In recent years, magnetic sensors utilizing magnetoresistive elements have been employed for various applications. In systems incorporating magnetic sensors, it is sometimes desirable to detect a magnetic field component that includes a direction perpendicular to the surface of the substrate using a magnetoresistive element disposed on a substrate. In such cases, by providing a soft magnetic material that converts the magnetic field perpendicular to the surface of the substrate into a magnetic field parallel to the surface of the substrate, or by disposing of a magnetoresistive element on an inclined surface formed on the substrate, it is possible to detect a magnetic field component that includes a direction perpendicular to the surface of the substrate.

[0003] Japanese Patent Application Publication No. 2006-194733 discloses a magnetic sensor having a magnetoresistive element formed on an inclined surface. In this magnetic sensor, the surface of the substrate on which the magnetoresistive element is disposed is covered by a protective film made of an insulating material.

[0004] Furthermore, magnetic sensors incorporate coils for various applications. For example, International Publication No. 2016 / 021260 discloses a magnetic sensor with a coil through which the measured current flows, and a magnetically balanced current sensor comprising a magnetic sensor and a feedback coil. In the magnetic sensor disclosed in International Publication No. 2016 / 021260, the coil is formed on a plane above the magnetic measuring element.

[0005] Here, consider a magnetic sensor, such as the one disclosed in Japanese Patent Application Publication No. 2006-194733, which has a magnetoresistive element formed on an inclined surface, and the one disclosed in International Patent Publication No. 2016 / 021260, in which a coil is positioned near the top of the magnetoresistive element. In this case, an insulating layer with a substantially constant thickness is provided between the magnetoresistive element and the coil. The insulating layer has an inclined surface with a shape corresponding to the inclined surface on which the magnetoresistive element is disposed. The coil is also formed on the inclined surface of the insulating layer. Typically, the coil is formed with a rectangular cross-sectional shape. However, at least a portion of the coil sometimes does not have a rectangular cross-sectional shape due to the influence of the inclined surface of the insulating layer. For example, sometimes at least a portion of the coil has a cross-sectional shape that becomes an inverted trapezoidal shape with a width that decreases towards the lower surface of the coil.

[0006] Typically, the surface of a coil is covered by a protective film made of insulating material. As mentioned above, when the coil has an inverted trapezoidal cross-sectional shape, the protective film is more difficult to adhere near the lower surface of the coil compared to the upper surface. As a result, seams formed during the formation of the protective film are located closer to the coil. When seams exist near the coil, problems arise such as coil corrosion caused by resist stripping fluid or the like seeping in through the seams.

[0007] The above problems are not limited to coils, but also apply to wiring formed on inclined surfaces. Summary of the Invention

[0008] The purpose of this invention is to provide a magnetic sensor that can prevent corrosion of a metal layer disposed on an inclined surface.

[0009] The magnetic sensor of the present invention comprises: a substrate having a reference plane, a magnetic detection element and an insulating layer disposed on the substrate, and at least one metal layer and a plurality of first insulating films disposed on the insulating layer. The insulating layer has at least one inclined surface inclined relative to the reference plane. The at least one metal layer has a shape that is elongated in a predetermined direction and has a first side surface and a second side surface located on both sides of the shorter side of the at least one metal layer. Each of the first and second side surfaces includes: a first portion and a second portion disposed at a position farther from the reference plane than the first portion. The first portion is inclined in a manner intersecting the at least one inclined surface. The first portion of the first side surface is also inclined in a manner that approaches the second side surface as it approaches the reference plane. The first portion of the second side surface is also inclined in a manner that approaches the first side surface as it approaches the reference plane. The plurality of first insulating films include: portions covering the first portion of the first side surface and extending in a direction intersecting the at least one inclined surface, and portions covering the first portion of the second side surface and extending in a direction intersecting the at least one inclined surface.

[0010] In the magnetic sensor of the present invention, a plurality of first insulating films cover a first portion of a first side surface and a first portion of a second side surface. Therefore, according to the present invention, corrosion of the metal layer disposed on the inclined surface can be prevented.

[0011] Other objects, features and benefits of the present invention will become fully apparent from the following description. Attached Figure Description

[0012] Figure 1 This is a perspective view showing the magnetic sensor according to the first embodiment of the present invention.

[0013] Figure 2 This is a functional block diagram illustrating the structure of a magnetic sensor device including the magnetic sensor of the first embodiment of the present invention.

[0014] Figure 3 This is a circuit diagram showing the circuit structure of the first detection circuit according to the first embodiment of the present invention.

[0015] Figure 4 This is a circuit diagram showing the circuit structure of the second detection circuit according to the first embodiment of the present invention.

[0016] Figure 5 This is a top view showing a portion of the magnetic sensor according to the first embodiment of the present invention.

[0017] Figure 6 This is a cross-sectional view showing a portion of the magnetic sensor according to the first embodiment of the present invention.

[0018] Figure 7 This is a side view showing the magnetoresistive effect element according to the first embodiment of the present invention.

[0019] Figure 8 This is a cross-sectional view showing the main parts of the magnetic sensor according to the first embodiment of the present invention.

[0020] Figure 9 It is shown Figure 8 A cross-sectional view of the portion near the first side of the coil element shown.

[0021] Figure 10 It is shown Figure 8 A cross-sectional view of the portion near the second side of the coil element shown.

[0022] Figure 11 This is a cross-sectional view showing one step in the manufacturing method of the magnetic sensor according to the first embodiment of the present invention.

[0023] Figure 12 It shows the next step. Figure 11 The diagram shows a cross-sectional view of the process.

[0024] Figure 13 It shows the next step. Figure 12 The diagram shows a cross-sectional view of the process.

[0025] Figure 14 It shows the next step. Figure 13 The diagram shows a cross-sectional view of the process.

[0026] Figure 15 This is a cross-sectional view showing a portion of the magnetic sensor according to a second embodiment of the present invention. Detailed Implementation

[0027] [First Implementation Method]

[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, referring to... Figure 1 and Figure 2 The structure of the magnetic sensor according to the first embodiment of the present invention will be described. Figure 1 This is a perspective view showing the magnetic sensor of this embodiment. Figure 2 This is a functional block diagram showing the structure of a magnetic sensor device including the magnetic sensor of this embodiment.

[0029] like Figure 1 As shown, the magnetic sensor 1 has the form of a cuboid-shaped chip. The magnetic sensor 1 has an upper surface 1a and a lower surface located opposite each other, and four side surfaces connecting the upper surface 1a and the lower surface. Additionally, the magnetic sensor 1 has multiple electrode pads disposed on the upper surface 1a.

[0030] Here, refer to Figure 1 The reference coordinate system of this embodiment will be explained. The reference coordinate system is a coordinate system based on the magnetic sensor 1, and is an orthogonal coordinate system defined by three axes. In the reference coordinate system, the X direction, Y direction, and Z direction are defined. The X direction, Y direction, and Z direction are orthogonal to each other. In this embodiment, specifically, the direction perpendicular to the upper surface 1a of the magnetic sensor 1, that is, the direction from the lower surface of the magnetic sensor 1 towards the upper surface 1a, is defined as the Z direction. Furthermore, the direction opposite to the X direction is defined as the -X direction, the direction opposite to the Y direction is defined as the -Y direction, and the direction opposite to the Z direction is defined as the -Z direction. The three axes of the reference coordinate system are defined as the axis parallel to the X direction, the axis parallel to the Y direction, and the axis parallel to the Z direction.

[0031] Hereinafter, the position in front of the reference position in the Z direction will be referred to as "above," and the position on the opposite side of the reference position relative to "above" will be referred to as "below." Furthermore, regarding the components of the magnetic sensor 1, the surface located at the Z-direction end will be referred to as the "upper surface," and the surface located at the -Z-direction end will be referred to as the "lower surface." Additionally, the expression "when viewed from the Z-direction" refers to viewing the object from a position separated along the Z-direction.

[0032] like Figure 2 As shown, the magnetic sensor 1 includes a first detection circuit 20 and a second detection circuit 30. Each of the first and second detection circuits 20 and 30 includes a plurality of magnetic detection elements, configured to detect the magnetic field of the target object and generate at least one detection signal. In this embodiment, in particular, the plurality of magnetic detection elements are a plurality of magnetoresistive effect elements. Hereinafter, the magnetoresistive effect elements will be referred to as MR elements.

[0033] The multiple detection signals generated by the first and second detection circuits 20 and 30 are processed by the processor 40. The magnetic sensor 1 and the processor 40 constitute the magnetic sensor device 100. The processor 40 is configured to process the multiple detection signals generated by the first and second detection circuits 20 and 30 to generate a first detection value and a second detection value that correspond to components of the magnetic field in two mutually different directions at a predetermined reference position. In this embodiment, specifically, the two mutually different directions are a direction parallel to the XY plane and a direction parallel to the Z direction. The processor 40 is, for example, constructed from an application-specific integrated circuit (ASIC).

[0034] The processor 40 may also be included in a support body that supports the magnetic sensor 1. This support body has multiple electrode pads. The first and second detection circuits 20 and 30 and the processor 40 are connected, for example, via the multiple electrode pads of the magnetic sensor 1, the multiple electrode pads of the support body, and multiple bonding wires. When the multiple electrode pads of the magnetic sensor 1 are disposed on the upper surface 1a of the magnetic sensor 1, the magnetic sensor 1 may also be mounted on the upper surface of the support body with its lower surface facing the upper surface of the support body.

[0035] Next, refer to Figures 3-6 The first and second detection circuits 20 and 30 will be described. Figure 3 This is a circuit diagram showing the circuit structure of the first detection circuit 20. Figure 4 This is a circuit diagram showing the circuit structure of the second detection circuit 30. Figure 5 This is a top view showing a portion of the magnetic sensor 1. Figure 6 This is a cross-sectional view showing a portion of the magnetic sensor 1.

[0036] Here, as Figure 5 As shown, the U direction and V direction are defined as follows. The U direction is the direction of rotation from the X direction toward the -Y direction. The V direction is the direction of rotation from the Y direction toward the X direction. In this embodiment, specifically, the U direction is defined as the direction of rotation from the X direction toward the -Y direction by an amount α, and the V direction is defined as the direction of rotation from the Y direction toward the X direction by an amount α. Furthermore, α is an angle greater than 0° and less than 90°. In one example, α is 45°. In addition, the direction opposite to the U direction is defined as the -U direction, and the direction opposite to the V direction is defined as the -V direction.

[0037] In addition, such as Figure 6As shown, the W1 and W2 directions are defined as follows. The W1 direction is the direction of rotation from the V direction toward the -Z direction. The W2 direction is the direction of rotation from the V direction toward the Z direction. In this embodiment, specifically, the W1 direction is defined as the direction of rotation by an amount β from the V direction toward the -Z direction, and the W2 direction is defined as the direction of rotation by an amount β from the V direction toward the Z direction. Furthermore, β is an angle greater than 0° and less than 90°. In addition, the direction opposite to the W1 direction is defined as the -W1 direction, and the direction opposite to the W2 direction is defined as the -W2 direction. The W1 and W2 directions are both orthogonal to the U direction.

[0038] The first detection circuit 20 is configured to detect the component of the magnetic field parallel to the W1 direction of the object, and generate at least one first detection signal corresponding to the component. The second detection circuit 30 is configured to detect the component of the magnetic field parallel to the W2 direction of the object, and generate at least one second detection signal corresponding to the component.

[0039] like Figure 3 As shown, the first detection circuit 20 includes: a power supply terminal V2, a ground terminal G2, signal output terminals E21 and E22, a first resistor R21, a second resistor R22, a third resistor R23, and a fourth resistor R24. The multiple MR elements of the first detection circuit 20 constitute the first to fourth resistors R21, R22, R23, and R24.

[0040] The first resistor R21 is located between the power supply terminal V2 and the signal output terminal E21. The second resistor R22 is located between the signal output terminal E21 and the ground terminal G2. The third resistor R23 is located between the signal output terminal E22 and the ground terminal G2. The fourth resistor R24 ​​is located between the power supply terminal V2 and the signal output terminal E22.

[0041] like Figure 4 As shown, the second detection circuit 30 includes: a power supply terminal V3, a ground terminal G3, signal output terminals E31 and E32, a first resistor R31, a second resistor R32, a third resistor R33, and a fourth resistor R34. The multiple MR elements of the second detection circuit 30 constitute the first to fourth resistors R31, R32, R33, and R34.

[0042] The first resistor R31 is located between the power supply terminal V3 and the signal output terminal E31. The second resistor R32 is located between the signal output terminal E31 and the ground terminal G3. The third resistor R33 is located between the signal output terminal E32 and the ground terminal G3. The fourth resistor R34 is located between the power supply terminal V3 and the signal output terminal E32.

[0043] Apply a specified voltage or current to power supply terminals V2 and V3 respectively. Ground terminals G2 and G3 are grounded respectively.

[0044] Hereinafter, the plurality of MR elements in the first detection circuit 20 will be referred to as a plurality of first MR elements 50B, and the plurality of MR elements in the second detection circuit 30 will be referred to as a plurality of second MR elements 50C. The first and second detection circuits 20 and 30 are constituent elements of the magnetic sensor 1; therefore, it can also be said that the magnetic sensor 1 includes a plurality of first MR elements 50B and a plurality of second MR elements 50C. Furthermore, any MR element will be indicated by the symbol 50.

[0045] Figure 7 This is a side view showing the MR element 50. The MR element 50 is a spin-valve type MR element. The MR element 50 has: a magnetized fixed layer 52 having magnetization with a fixed direction; a free layer 54 having magnetization with an direction that can vary according to the direction of the object's magnetic field; and a gap layer 53 disposed between the magnetized fixed layer 52 and the free layer 54. The MR element 50 can also be a TMR (tunneling magnetoresistance) element or a GMR (giant magnetoresistance) element. In a TMR element, the gap layer 53 is a tunnel barrier layer. In a GMR element, the gap layer 53 is a non-magnetic conductive layer. In the MR element 50, the resistance value varies according to the angle formed by the direction of magnetization of the free layer 54 relative to the direction of magnetization of the magnetized fixed layer 52, with the resistance value being the minimum at an angle of 0° and the resistance value being the maximum at an angle of 180°. In each MR element 50, the free layer 54 has a shape anisotropy in which the easy magnetization axis is orthogonal to the magnetization direction of the magnetization of the magnetization fixed layer 52. Furthermore, as a means of setting a predetermined direction for the easy magnetization axis of the free layer 54, a magnet that applies a bias magnetic field to the free layer 54 can also be used.

[0046] The MR element 50 also has an antiferromagnetic layer 51. The antiferromagnetic layer 51, the magnetization fixation layer 52, the gap layer 53, and the free layer 54 are stacked sequentially. The antiferromagnetic layer 51 is made of an antiferromagnetic material and generates exchange coupling with the magnetization fixation layer 52, fixing the magnetization direction of the magnetization fixation layer 52. Alternatively, the magnetization fixation layer 52 can be a so-called self-pinning fixation layer (SFP layer). A self-pinning fixation layer has a stacked ferromagnetic structure consisting of a ferromagnetic layer, a non-magnetic intermediate layer, and a ferromagnetic layer, with the two ferromagnetic layers antiferromagnetically coupled. When the magnetization fixation layer 52 is a self-pinning fixation layer, the antiferromagnetic layer 51 can be omitted.

[0047] Furthermore, the arrangement of layers 51-54 of the MR element 50 can also be consistent with... Figure 7 The configuration shown is reversed from top to bottom.

[0048] exist Figure 3 and Figure 4In the diagram, solid arrows indicate the magnetization direction of the magnetized fixed layer 52 of the MR element 50. Hollow arrows indicate the magnetization direction of the free layer 54 of the MR element 50 when no target magnetic field is applied to the MR element 50.

[0049] exist Figure 3 In the example shown, the magnetization direction of the magnetization fixing layer 52 of the first and third resistors R21 and R23 is the W1 direction. The magnetization direction of the magnetization fixing layer 52 of the second and fourth resistors R22 and R24 is the -W1 direction. Furthermore, the free layer 54 of each of the plurality of first MR elements 50B has an anisotropic shape with its easy magnetization axis direction parallel to the U direction. When no target magnetic field is applied to the first MR element 50B, the magnetization direction of the free layer 54 of the first and second resistors R21 and R22 is the U direction. In the above case, the magnetization direction of the free layer 54 of the third and fourth resistors R23 and R24 is the -U direction.

[0050] exist Figure 4 In the example shown, the magnetization direction of the magnetization fixing layer 52 of the first and third resistors R31 and R33 is the W2 direction. The magnetization direction of the magnetization fixing layer 52 of the second and fourth resistors R32 and R34 is the -W2 direction. Furthermore, the free layer 54 of each of the plurality of second MR elements 50C has an anisotropic shape, with its easy magnetization axis direction parallel to the U direction. When no target magnetic field is applied to the second MR element 50C, the magnetization direction of the free layer 54 of the first and second resistors R31 and R32 is the U direction. In the above case, the magnetization direction of the free layer 54 of the third and fourth resistors R33 and R34 is the -U direction.

[0051] The magnetic sensor 1 includes a magnetic field generator configured to apply a magnetic field of a predetermined direction to the free layers 54 of each of the plurality of first MR elements 50B and the plurality of second MR elements 50C. In this embodiment, the magnetic field generator includes a coil 80 that applies a magnetic field of a predetermined direction to the free layers 54 of each of the plurality of first MR elements 50B and the plurality of second MR elements 50C. The coil 80 is made of a conductive material such as Cu.

[0052] Furthermore, from the perspective of manufacturing precision of the MR element 50, the magnetization direction of the magnetization of the magnetization fixing layer 52 and the direction of the easy magnetization axis of the free layer 54 can be slightly deviated from the aforementioned directions. Additionally, the magnetization of the magnetization fixing layer 52 can also be configured to include a magnetization component with the aforementioned direction as the primary component. In this case, the magnetization direction of the magnetization fixing layer 52 becomes the aforementioned direction or approximately the aforementioned direction.

[0053] The following is for reference Figure 5 and Figure 6The specific structure of magnetic sensor 1 will be described in detail. Figure 6 Show Figure 5 A portion of the cross section at the location indicated by line 6-6.

[0054] The magnetic sensor 1 includes: a substrate 301 having an upper surface 301a; insulating layers 302, 303, 304, 305, 307, 308, 309, and 310; multiple lower electrodes 61B and 61C; multiple upper electrodes 62B and 62C; multiple lower coil elements 81; and multiple upper coil elements 82. The upper surface 301a of the substrate 301 is parallel to the XY plane. The Z direction is also perpendicular to the upper surface 301a of the substrate 301. Furthermore, the coil elements are part of the winding of a coil.

[0055] An insulating layer 302 is disposed on a substrate 301. A plurality of lower coil elements 81 are disposed on the insulating layer 302. An insulating layer 303 is disposed on the insulating layer 302 around the plurality of lower coil elements 81. Insulating layers 304 and 305 are sequentially stacked on the plurality of lower coil elements 81 and the insulating layer 303.

[0056] Multiple lower electrodes 61B and multiple lower electrodes 61C are disposed on insulating layer 305. Insulating layer 307 is disposed on insulating layer 305 around the multiple lower electrodes 61B and around the multiple lower electrodes 61C. Multiple first MR elements 50B are disposed on the multiple lower electrodes 61B. Multiple second MR elements 50C are disposed on the multiple lower electrodes 61C. Insulating layer 308 is disposed on the multiple lower electrodes 61B, the multiple lower electrodes 61C, and insulating layer 307 around the multiple first MR elements 50B and around the multiple second MR elements 50C. Multiple upper electrodes 62B are disposed on the multiple first MR elements 50B and insulating layer 308. Multiple upper electrodes 62C are disposed on the multiple second MR elements 50C and insulating layer 308. Insulating layer 309 is disposed on insulating layer 308 around the multiple upper electrodes 62B and around the multiple upper electrodes 62C.

[0057] An insulating layer 310 is disposed on a plurality of upper electrodes 62B, a plurality of upper electrodes 62C, and an insulating layer 309. A plurality of upper coil elements 82 are disposed on the insulating layer 310.

[0058] The magnetic sensor 1 also includes a plurality of first insulating films 311 and second insulating films 312. The plurality of first insulating films 311 and second insulating films 312 cover a plurality of upper coil elements 82 and an insulating layer 310. The plurality of first insulating films 311 and second insulating films 312 will be described in detail later.

[0059] The magnetic sensor 1 includes a support member supporting a plurality of first MR elements 50B and a plurality of second MR elements 50C. The support member has at least one inclined surface that is inclined relative to the upper surface 301a of the substrate 301. In this embodiment, the support member is specifically formed of an insulating layer 305. Furthermore, in… Figure 5 The diagram shows the insulating layer 305, a plurality of first MR elements 50B, a plurality of second MR elements 50C, and a plurality of upper coil elements 82 among the constituent elements of the magnetic sensor 1.

[0060] The insulating layer 305 has a plurality of convex surfaces 305c extending in a direction (Z direction) away from the upper surface 301a of the substrate 301. Each of the plurality of convex surfaces 305c extends in a direction parallel to the U direction. The overall shape of the convex surfaces 305c is such that... Figure 6 The convex surface 305c shown is a semi-cylindrical curved surface formed by moving its curved shape (arch shape) along a direction parallel to the U direction. Furthermore, multiple convex surfaces 305c are arranged at predetermined intervals in a direction parallel to the V direction.

[0061] Each of the plurality of convex surfaces 305c has an upper end portion furthest from the upper surface 301a of the substrate 301. In this embodiment, the upper end portion of each of the plurality of convex surfaces 305c is an upper end portion extending in a direction parallel to the U direction. Here, we focus on any one of the plurality of convex surfaces 305c. The convex surface 305c includes a first inclined surface 305a and a second inclined surface 305b. The first inclined surface 305a is the surface of the convex surface 305c that is further toward the V direction side than the upper end portion of the convex surface 305c. The second inclined surface 305b is the surface of the convex surface 305c that is further toward the -V direction side than the upper end portion of the convex surface 305c. Figure 5 In the diagram, the boundaries of the first inclined surface 305a and the second inclined surface 305b are represented by dashed lines.

[0062] The upper end of the convex surface 305c can also be the boundary between the first inclined surface 305a and the second inclined surface 305b. In this case, Figure 5 The dashed line shown represents the upper end of the convex surface 305c.

[0063] The upper surface 301a of the substrate 301 is parallel to the XY plane. The first inclined surface 305a and the second inclined surface 305b are each inclined relative to the upper surface 301a of the substrate 301, i.e., the XY plane. In a cross-section perpendicular to the upper surface 301a of the substrate 301, the spacing between the first inclined surface 305a and the second inclined surface 305b decreases as the distance from the upper surface 301a of the substrate 301 increases.

[0064] In this embodiment, there are multiple convex surfaces 305c, and therefore, there are also multiple first inclined surfaces 305a and second inclined surfaces 305b. The insulating layer 305 has multiple first inclined surfaces 305a and multiple second inclined surfaces 305b.

[0065] The insulating layer 305 also has a flat surface 305d surrounding the plurality of convex surfaces 305c. The flat surface 305d is a surface parallel to the upper surface 301a of the substrate 301. Each of the plurality of convex surfaces 305c protrudes from the flat surface 305d in the Z direction. In addition, in this embodiment, the plurality of convex surfaces 305c are arranged at predetermined intervals. Therefore, a flat surface 305d exists between two adjacent convex surfaces 305c in the V direction.

[0066] The insulating layer 305 includes a plurality of protrusions projecting along the Z-direction and flat portions surrounding the protrusions. Each of the protrusions extends in a direction parallel to the U-direction and has a convex surface 305c. Furthermore, the protrusions are arranged at predetermined intervals in a direction parallel to the V-direction. The thickness (dimension in the Z-direction) of the flat portions is substantially constant. Additionally, the insulating layer 304 has a substantially constant thickness (dimension in the Z-direction) and is formed along the lower surface of the insulating layer 305.

[0067] Multiple lower electrodes 61B are disposed on multiple first inclined surfaces 305a. Multiple lower electrodes 61C are disposed on multiple second inclined surfaces 305b. As described above, the first inclined surfaces 305a and the second inclined surfaces 305b are each inclined relative to the upper surface 301a of the substrate 301, i.e., the XY plane. Therefore, the upper surfaces of each of the multiple lower electrodes 61B and each of the multiple lower electrodes 61C are also inclined relative to the XY plane. Thus, it can be said that multiple first MR elements 50B and multiple second MR elements 50C are disposed on inclined surfaces inclined relative to the XY plane. The insulating layer 305 is a component for supporting each of the multiple first MR elements 50B and multiple second MR elements 50C in an inclined manner relative to the XY plane.

[0068] Furthermore, in this embodiment, the first inclined surface 305a is curved. Therefore, the first MR element 50B is bent along the curved surface (first inclined surface 305a). In this embodiment, for convenience, the magnetization direction of the magnetization fixing layer 52 of the first MR element 50B is defined as a straight line direction as described above. The magnetization direction of the magnetization fixing layer 52 of the first MR element 50B, i.e., the W1 direction and the -W1 direction, is also the direction in which the wiring that connects to the portion of the first inclined surface 305a near the first MR element 50B extends.

[0069] Similarly, in this embodiment, the second inclined surface 305b is curved. Therefore, the second MR element 50C is bent along the curved surface (second inclined surface 305b). In this embodiment, for convenience, the magnetization direction of the magnetization fixing layer 52 of the second MR element 50C is defined as a straight line direction as described above. The magnetization direction of the magnetization fixing layer 52 of the second MR element 50C, i.e., the W2 direction and the -W2 direction, is also the direction in which the wiring connected to the portion of the second inclined surface 305b near the second MR element 50C extends.

[0070] like Figure 5 As shown, a plurality of first MR elements 50B are arranged in parallel in both the U and V directions. On a first inclined surface 305a, the plurality of first MR elements 50B are arranged in a single column. Similarly, a plurality of second MR elements 50C are arranged in parallel in both the U and V directions. On a second inclined surface 305b, the plurality of second MR elements 50C are arranged in a single column. In this embodiment, the columns of the plurality of first MR elements 50B and the columns of the plurality of second MR elements 50C are alternately arranged in a direction parallel to the V direction.

[0071] Furthermore, when viewed from the Z direction, an adjacent first MR element 50B and a second MR element 50C can be offset in a direction parallel to the U direction, or they can be perfectly offset. Additionally, when viewed from the Z direction, two adjacent first MR elements 50B separated by one second MR element 50C can be offset in a direction parallel to the U direction, or they can be perfectly offset. Furthermore, when viewed from the Z direction, two adjacent second MR elements 50C separated by one first MR element 50B can be offset in a direction parallel to the U direction, or they can be perfectly offset.

[0072] Multiple first MR elements 50B are connected in series via multiple lower electrodes 61B and multiple upper electrodes 62B. Referring here... Figure 7 The connection method of multiple first MR elements 50B is described in detail. Figure 7 In the diagram, symbol 61 represents the lower electrode corresponding to any MR element 50, and symbol 62 represents the upper electrode corresponding to any MR element 50. For example... Figure 7 As shown, each lower electrode 61 has an elongated shape. A gap is formed between two adjacent lower electrodes 61 along their long sides. MR elements 50 are disposed near both ends of the upper surface of the lower electrodes 61 along their long sides. Furthermore, each upper electrode 62 has an elongated shape, and two adjacent MR elements 50 disposed on adjacent lower electrodes 61 along their long sides are electrically connected to each other.

[0073] Although not shown, one MR element 50 located at one end of a column of multiple MR elements 50 arranged in a row is connected to another MR element 50 located at one end of a column of multiple other MR elements 50 adjacent to it in a direction intersecting the long side direction of the lower electrode 61. The two MR elements 50 are connected to each other by an electrode not shown. The electrode not shown may also be an electrode that connects the lower surfaces or upper surfaces of the two MR elements 50 to each other.

[0074] exist Figure 7 When the MR element 50 shown is the first MR element 50B, Figure 7 The lower electrode 61 shown corresponds to the lower electrode 61B. Figure 7 The upper electrode 62 shown corresponds to the upper electrode 62B. Furthermore, in this case, the long side direction of the lower electrode 61 is parallel to the U direction.

[0075] Similarly, multiple second MR elements 50C are connected in series via multiple lower electrodes 61C and multiple upper electrodes 62C. The description of the connection method for the multiple first MR elements 50B also applies to the connection method for the multiple second MR elements 50C. Figure 7 When the MR element 50 shown is the second MR element 50C, Figure 7 The lower electrode 61 shown corresponds to the lower electrode 61C. Figure 7 The upper electrode 62 shown corresponds to the upper electrode 62C. Furthermore, in this case, the long side direction of the lower electrode 61 is parallel to the U direction.

[0076] Each of the plurality of upper coil elements 82 extends in a direction parallel to the Y direction. Furthermore, the plurality of upper coil elements 82 are arranged side-by-side in the X direction. In this embodiment, in particular, when viewed from the Z direction, two upper coil elements 82 overlap in each of the plurality of first MR elements 50B and the plurality of second MR elements 50C.

[0077] Each of the plurality of lower coil elements 81 extends in a direction parallel to the Y direction. Furthermore, the plurality of lower coil elements 81 are arranged side-by-side in the X direction. The shape and arrangement of the plurality of lower coil elements 81 may be the same as or different from the shape and arrangement of the plurality of upper coil elements 82. Figure 5 and Figure 6 In the example shown, the X-direction dimension of each of the plurality of lower coil elements 81 is smaller than the X-direction dimension of each of the plurality of upper coil elements 82. Furthermore, the spacing between two adjacent lower coil elements 81 in the X-direction is smaller than the spacing between two adjacent upper coil elements 82 in the X-direction.

[0078] exist Figure 5 and Figure 6In the example shown, multiple lower coil elements 81 and multiple upper coil elements 82 are electrically connected to form a coil 80 that applies a magnetic field parallel to the X-direction to the free layers 54 of each of the multiple first MR elements 50B and the multiple second MR elements 50C. Alternatively, the coil 80 may be configured to, for example, apply an X-direction magnetic field to the free layers 54 of the first and second resistors R21 and R22 of the first detection circuit 20 and the first and second resistors R31 and R32 of the second detection circuit 30, and apply a -X-direction magnetic field to the free layers 54 of the third and fourth resistors R23 and R24 of the first detection circuit 20 and the third and fourth resistors R33 and R34 of the second detection circuit 30. Furthermore, the coil 80 may also be controlled by the processor 40.

[0079] Next, the first and second detection signals will be explained. First, refer to... Figure 3 The first detection signal will be explained below. When the intensity of the component of the object's magnetic field parallel to the W1 direction changes, the resistance values ​​of the resistors R21 to R24 in the first detection circuit 20 change as follows: the resistance values ​​of resistors R21 and R23 increase and the resistance values ​​of resistors R22 and R24 decrease, or the resistance values ​​of resistors R21 and R23 decrease and the resistance values ​​of resistors R22 and R24 increase. As a result, the potentials of the signal output terminals E21 and E22 change. The first detection circuit 20 is configured to generate a first detection signal S21 as the signal corresponding to the potential of the signal output terminal E21, and to generate a first detection signal S22 as the signal corresponding to the potential of the signal output terminal E22.

[0080] Next, refer to Figure 4 The second detection signal will now be explained. When the intensity of the component of the object's magnetic field parallel to the W2 direction changes, the resistance values ​​of the resistors R31 to R34 in the second detection circuit 30 change as follows: the resistance values ​​of resistors R31 and R33 increase while the resistance values ​​of resistors R32 and R34 decrease, or the resistance values ​​of resistors R31 and R33 decrease while the resistance values ​​of resistors R32 and R34 increase. Consequently, the potentials of the signal output terminals E31 and E32 change. The second detection circuit 30 is configured to generate a second detection signal S31 corresponding to the potential of the signal output terminal E31, and to generate a second detection signal S32 corresponding to the potential of the signal output terminal E32.

[0081] Next, the operation of the processor 40 will be explained. The processor 40 is configured to generate a first detection value and a second detection value based on the first detection signals S21 and S22 and the second detection signals S31 and S32. The first detection value corresponds to the component of the object's magnetic field parallel to the V direction. The second detection value corresponds to the component of the object's magnetic field parallel to the Z direction. Hereinafter, the first detection value will be denoted by the symbol Sv, and the second detection value by the symbol Sz.

[0082] Processor 40 generates the first and second detection values ​​Sv and Sz as follows. Processor 40 first generates value S1 by an operation involving calculating the difference S21-S22 between the first detection signal S21 and the first detection signal S22, and generates value S2 by an operation involving calculating the difference S31-S32 between the second detection signal S31 and the second detection signal S32. Then, processor 40 calculates values ​​S3 and S4 using the following equations (1) and (2).

[0083] S3=(S2+S1) / (2cosα)…(1)

[0084] S4=(S2-S1) / (2sinα)…(2)

[0085] The first detection value Sv can be the value S3 itself, or it can be a value to which a specified correction, such as gain adjustment and offset adjustment, has been applied. Similarly, the second detection value Sz can be the value S4 itself, or it can be a value to which a specified correction, such as gain adjustment and offset adjustment, has been applied.

[0086] Next, the structural features of the magnetic sensor 1 of this embodiment will be described. The magnetic sensor 1 of this embodiment includes: a substrate 301 having a reference plane; at least one magnetic detection element and an insulating layer 310 disposed on the substrate 301; at least one metal layer and a plurality of first insulating films 311 disposed on the insulating layer 310; and a second insulating film 312 covering the at least one metal layer and the plurality of first insulating films 311. In this embodiment, the upper surface 301a of the substrate 301 (refer to...) Figure 6 The Z-direction is a direction perpendicular to the reference plane (the upper surface 301a of the substrate 301).

[0087] In this embodiment, at least one magnetic detection element is a plurality of first MR elements 50B and a plurality of second MR elements 50C. Additionally, in this embodiment, at least one metal layer is a plurality of upper coil elements 82. The plurality of upper coil elements 82 are arranged at predetermined intervals. Hereinafter, the structural features of the magnetic sensor 1 will be described in detail with regard to one upper coil element 82. Furthermore, in the following description, the upper coil element 82 will be simply referred to as coil element 82.

[0088] Figure 8 This is a cross-sectional view showing the main part of the magnetic sensor 1. Figure 8 The diagram shows a first MR element 50B, a second MR element 50C, and a coil element 82. Figure 9 It is shown Figure 8 A cross-sectional view of the portion near the first side of coil element 82 shown. Figure 10 It is shown Figure 8 A cross-sectional view of the portion near the second side of coil element 82 shown.

[0089] The insulating layer 310 covers a plurality of first MR elements 50B, a plurality of second MR elements 50C, a plurality of lower electrodes 61B, a plurality of lower electrodes 61C, a plurality of upper electrodes 62B, a plurality of upper electrodes 62C, and insulating layers 305, 307 to 309. The insulating layer 310 may also have a substantially constant thickness.

[0090] The insulating layer 310 has an upper surface 301a relative to the reference plane, i.e., the substrate 301 (see reference). Figure 6 At least one inclined surface. In this embodiment, in particular, the upper surface of the insulating layer 310 has a shape corresponding to the upper surface of the insulating layer 305. That is, the insulating layer 310 has a plurality of first inclined surfaces 310a and a plurality of second inclined surfaces 310b as at least one inclined surface. The plurality of first inclined surfaces 310a are respectively located above the plurality of first inclined surfaces 305a of the insulating layer 305. The plurality of second inclined surfaces 310b are respectively located above the plurality of second inclined surfaces 305b of the insulating layer 305. The shape and arrangement of the plurality of first inclined surfaces 310a and the plurality of second inclined surfaces 310b are the same as those of the plurality of first inclined surfaces 305a and the plurality of second inclined surfaces 305b. The description of the plurality of first inclined surfaces 305a and the plurality of second inclined surfaces 305b also applies to the plurality of first inclined surfaces 310a and the plurality of second inclined surfaces 310b.

[0091] The insulating layer 310 also has a flat surface 310d surrounding a plurality of first inclined surfaces 310a and a plurality of second inclined surfaces 310b. The flat surface 310d is a surface parallel to or substantially parallel to the upper surface 301a of the substrate 301.

[0092] At least a portion of the coil element 82 has a shape that is elongated in a predetermined direction. In this embodiment, in particular, the coil element 82 has a shape that is elongated in a direction parallel to the Y direction (see reference). Figure 5 Furthermore, each of the plurality of first inclined surfaces 310a and the plurality of second inclined surfaces 310b, like each of the plurality of convex surfaces 305c of the insulating layer 305, has a shape that extends in a direction parallel to the U direction. Therefore, the long side direction of the coil element 82 intersects the long side direction of each of the plurality of first inclined surfaces 310a and the plurality of second inclined surfaces 310b. The coil element 82 passes over the plurality of first inclined surfaces 310a and the plurality of second inclined surfaces 310b.

[0093] Furthermore, the long side direction of the coil element 82 intersects the long side directions of each of the plurality of convex surfaces 305c. The coil element 82 passes over the plurality of convex surfaces 305c. The dimension of the coil element 82 in the short side direction, i.e., the direction parallel to the X direction, may be larger or smaller than the dimension of the convex surface 305c in the short side direction, i.e., the direction parallel to the V direction. Alternatively, the dimension of the coil element 82 in the direction parallel to the X direction may be equal to or approximately equal to the dimension of the convex surface 305c in the direction parallel to the V direction. The thickness of the coil element 82 (dimension in the Z direction) may, for example, be in the range of 2 to 3 μm.

[0094] The coil element 82 has two side surfaces located at both ends in the short-side direction of the coil element 82, i.e., in the direction parallel to the X direction. Hereinafter, the side surface in the -X direction will be referred to as the first side surface 82a, and the side surface in the X direction will be referred to as the second side surface 82b. Furthermore, in Figure 8 The diagram shows a cross-section where the first side surface 82a is located above the first inclined surface 310a, and the second side surface 82b is located above the second inclined surface 310b. When... Figure 8 When the cross section shown moves in a direction parallel to the Y direction, the first side surface 82a also exists above the second inclined surface 310b and the flat surface 310d, and the second side surface 82b also exists above the first inclined surface 310a and the flat surface 310d.

[0095] The coil element 82 also has a lower surface 82c and an upper surface 82d. The lower surface 82c is opposite to a plurality of first inclined surfaces 310a and a plurality of second inclined surfaces 310b. The upper surface 82d is located in front of the upper surface 301a of the substrate 301 in a direction away from the reference plane (Z direction).

[0096] like Figure 8 and Figure 9As shown, the first side surface 82a includes: a first portion 82a1, and a second portion 82a2 disposed at a position farther from the reference plane, i.e., the upper surface 301a of the substrate 301, than the first portion 82a1. The first portion 82a1 is inclined in a manner that intersects with the first and second inclined surfaces 310a, 310b. Figure 8 and Figure 9 In the cross-section shown, the first portion 82a1 is inclined in a manner that intersects with the first inclined surface 310a. In addition, the first portion 82a1 is inclined in a manner that approaches the second side surface 82b as it approaches the upper surface 301a of the substrate 301.

[0097] The first part 82a1 can also be connected to the lower surface 82c. The second part 82a2 can also be connected to the first part 82a1 and the upper surface 82d.

[0098] like Figure 8 and Figure 10 As shown, the second side surface 82b includes: a first portion 82b1, and a second portion 82b2 disposed at a position farther from the reference plane, i.e., the upper surface 301a of the substrate 301, than the first portion 82b1. The first portion 82b1 is inclined in a manner that intersects with the first and second inclined surfaces 310a, 310b. Figure 8 and Figure 10 In the cross-section shown, the first portion 82b1 is inclined in a manner that intersects with the second inclined surface 310b. In addition, the first portion 82b1 is inclined in a manner that it approaches the first side surface 82a as it approaches the upper surface 301a of the substrate 301.

[0099] The first part 82b1 can also be connected to the lower surface 82c. The second part 82b2 can also be connected to the first part 82b1 and the upper surface 82d.

[0100] In addition, Figures 8-10 For convenience, the first parts 82a1 and 82b1 are depicted as straight lines. That is, in Figures 8-10 In the diagram, the first portions 82a1 and 82b1 are depicted as planes (planes inclined relative to the YZ plane). However, the first portions 82a1 and 82b1 can also be curved surfaces. Even if the first portions 82a1 and 82b1 are curved surfaces, they can each be inclined in a manner that intersects with the first and second inclined surfaces 310a and 310b.

[0101] In addition, Figures 8-10 For convenience, the second parts 82a2 and 82b2 are depicted as straight lines parallel to the Z direction. That is, in Figures 8-10In the diagram, the second parts 82a2 and 82b2 are depicted as planes (planes parallel to the YZ plane). However, the second parts 82a2 and 82b2 can also each be a curved surface.

[0102] Each of the plurality of first insulating films 311 covers either a first side 82a or a second side 82b. Hereinafter, the first insulating film 311 covering the first side 82a will be designated by the symbol 311A, and the first insulating film 311 covering the second side 82b will be designated by the symbol 311B. The first insulating films 311A ​​and 311B may each have a substantially constant thickness.

[0103] The first insulating film 311A ​​includes a first portion 82a1 covering the first side surface 82a and a portion 311A1 extending in a direction intersecting the first and second inclined surfaces 310a and 310b. The portion 311A1 also extends along the long side direction of the coil element 82, i.e., in a direction parallel to the Y direction. The first insulating film 311A ​​further includes a second portion 82a2 covering the first side surface 82a and a portion 311A2.

[0104] The first insulating film 311A ​​does not cover the upper surface 82d of the coil element 82. For example... Figure 9 As shown, the first insulating film 311A ​​may also include a portion located further from the upper surface 301a of the substrate 301 than the corner portion located at the intersection of the first side surface 82a and the upper surface 82d. Alternatively, an imaginary line formed by the intersection of a curved surface and the first side surface 82a may be used as the aforementioned corner portion, and this curved surface approximates the overall shape of the upper surface 82d. Alternatively, the shape of the portion of the upper surface 82d other than the area near the first side surface 82a may be approximated as a curved surface, and this curved surface may be extended to the first side surface 82a, with the imaginary line formed by the intersection of the extended curved surface and the first side surface 82a serving as the aforementioned corner portion.

[0105] The first insulating film 311B includes: a first portion 82b1 covering the second side surface 82b and extending in a direction intersecting the first and second inclined surfaces 310a, 310b. The portion 311B1 also extends along the long side direction of the coil element 82, i.e., parallel to the Y direction. The first insulating film 311B further includes: a second portion 82b2 covering the second side surface 82b and extending in a direction parallel to the Y direction.

[0106] The first insulating film 311B does not cover the upper surface 82d of the coil element 82. For example... Figure 10As shown, the first insulating film 311B may also include a portion located further from the upper surface 301a of the substrate 301 than the corner portion located at the intersection of the second side surface 82b and the upper surface 82d. Alternatively, an imaginary line formed by the intersection of a curved surface and the second side surface 82b may be used as the aforementioned corner portion, and this curved surface approximates the overall shape of the upper surface 82d. Alternatively, the shape of the portion of the upper surface 82d other than the area near the second side surface 82b may be approximated as a curved surface, and this curved surface may be extended to the second side surface 82b, with the imaginary line formed by the intersection of the extended curved surface and the second side surface 82b serving as the aforementioned corner portion.

[0107] like Figures 8-10 As shown, the magnetic sensor 1 includes a non-magnetic metal film 83 situated between a coil element 82 and the first and second inclined surfaces 310a, 310b and the flat surface 310d. The coil element 82 can also be formed by plating. In this case, the non-magnetic metal film 83 can also be used as a seed and electrode in the process of forming the coil element 82.

[0108] The size of the non-magnetic metal film 83 in the direction of the short side of the coil element 82, i.e., parallel to the X direction, is larger than the minimum size of the coil element 82 in the direction parallel to the X direction. In this embodiment, specifically, the non-magnetic metal film 83 includes a portion extending from the first side surface 82a of the coil element 82 in the -X direction (see reference). Figure 9 ), and the portion extending in the X direction from the second side 82b of coil element 82 (see reference). Figure 10 ).

[0109] The size of the non-magnetic metal film 83 in the direction parallel to the X direction can be larger or smaller than the maximum size of the coil element 82 in the direction parallel to the X direction. Alternatively, the size of the non-magnetic metal film 83 in the direction parallel to the X direction can be equal to or approximately equal to the maximum size of the coil element 82 in the direction parallel to the X direction.

[0110] Furthermore, in this embodiment, since there are multiple coil elements 82, there are also multiple non-magnetic metal films 83.

[0111] like Figure 9 and Figure 10 As shown, the magnetic sensor 1 further includes a plurality of non-magnetic films 84 respectively attached to the surfaces of a plurality of first insulating films 311. The plurality of non-magnetic films 84 may also be reattached films formed by the material scattered from the etching of non-magnetic metal films 83 during the manufacturing process of the magnetic sensor 1 and attached to the surfaces of the plurality of first insulating films 311.

[0112] like Figures 8-10As shown, the second insulating film 312 covers multiple coil elements 82, multiple non-magnetic metal films 83, multiple non-magnetic films 84, insulating layer 310, and multiple first insulating films 311.

[0113] Thus far, the structural features of the magnetic sensor 1 have been described with regard to one coil element 82. Here, we focus on: two adjacent coil elements 82 in a direction parallel to the X direction; a first side 82a of one of the two coil elements 82; and a second side 82b of the other coil element 82, that is, a second side 82b opposite to the first side 82a of one of the two coil elements 82. The spacing between the first portion 82a1 of the first side 82a and the first portion 82b1 of the second side 82b increases as it approaches the upper surface 301a of the substrate 301.

[0114] Each of the plurality of first insulating films 311 and second insulating films 312 is formed of an insulating material. For example, Al2O3 can be used as the insulating material for forming each of the plurality of first insulating films 311. For example, Si3N4 can be used as the insulating material for the second insulating film 312.

[0115] The non-magnetic metal film 83 can be formed, for example, by Ti, by Cu, or by a stack of Ti and Cu.

[0116] Next, the manufacturing method of the magnetic sensor 1 according to this embodiment will be described. The manufacturing method of the magnetic sensor 1 includes: forming constituent elements other than the substrate 301 of the multiple magnetic sensor 1 on a wafer including a portion of the substrate 301 that will become multiple magnetic sensor 1, and fabricating a basic structure in which the sensor predetermined portions that will later become magnetic sensor 1 are arranged in multiple rows; and separating the multiple sensor predetermined portions from each other by cutting the basic structure. In this way, multiple magnetic sensors 1 are manufactured.

[0117] The following describes in more detail the manufacturing method of the magnetic sensor 1 according to this embodiment, focusing on a magnetic sensor 1. First, referring to... Figure 5 and Figure 6 The processes up to the formation of insulating layer 310 will be described. In the manufacturing method of magnetic sensor 1, firstly, insulating layer 302 is formed on substrate 301. Next, a plurality of lower coil elements 81 and insulating layer 303 are formed on insulating layer 302. Next, insulating layer 304 is formed on the plurality of lower coil elements 81 and insulating layer 303.

[0118] Next, an insulating layer 305 is formed on the insulating layer 304. The plurality of convex surfaces 305c of the insulating layer 305 are formed, for example, by etching the insulating layer 305 and the plurality of etching masks after forming a plurality of etching masks on the insulating layer 305, thereby removing the plurality of etching masks. The plurality of etching masks have shapes corresponding to the plurality of convex surfaces 305c. The portion of the insulating layer 305 not covered by the plurality of etching masks is called a flat surface 305d.

[0119] Next, on the insulating layer 305, a plurality of lower electrodes 61B, a plurality of lower electrodes 61C, a plurality of first MR elements 50B, a plurality of second MR elements 50C, a plurality of upper electrodes 62B, a plurality of upper electrodes 62C, and insulating layers 307 to 310 are formed.

[0120] Next, refer to Figures 11-14 The process following the formation of insulating layer 310 is described below. Figures 11-14 The laminated structure during the manufacturing process of magnetic sensor 1 is shown. Additionally, in Figures 11-14 In the text, the portion that is closer to the substrate 301 than the insulating layer 305 is omitted.

[0121] Figure 11 The process following the formation of the insulating layer 310 is shown. In this process, firstly, a non-magnetic metal film 83 is formed on the insulating layer 310. Next, a photoresist layer (not shown) for forming a plurality of coil elements 82 is formed on the non-magnetic metal film 83.

[0122] Figure 12 The next step is shown. In this step, firstly, a plurality of coil elements 82 are formed on a non-magnetic metal film 83. The plurality of coil elements 82 are formed, for example, by plating. Next, a photoresist layer (not shown) is removed.

[0123] Figure 13 The next step is shown. In this step, an insulating film 311P, which will later become a plurality of first insulating films 311, is formed by covering a plurality of coil elements 82 and a non-magnetic metal film 83. The insulating film 311P can also be formed, for example, by atomic layer deposition (ALD). The insulating film 311P covers the first side 82a, the second side 82b, and the upper surface 82d of each of the plurality of coil elements 82, as well as the portion of the upper surface of the non-magnetic metal film 83 that is not covered by the plurality of coil elements 82.

[0124] Figure 14The next step is shown. In this step, the non-magnetic metal film 83 and the insulating film 311P are etched to remove portions of the non-magnetic metal film 83 that are not covered by the plurality of coil elements 82. The etching of the non-magnetic metal film 83 and the insulating film 311P is performed, for example, using ion milling. This etching removes portions of the insulating film 311P that cover the upper surfaces 82d of each of the plurality of coil elements 82 and portions that cover the non-magnetic metal film 83 (excluding portions near the coil elements 82). The unetched portions of the insulating film 311P that remain become a plurality of first insulating films 311.

[0125] In addition, multiple non-magnetic films 84 (see reference) are formed during this etching. Figure 9 and Figure 10 Multiple non-magnetic films 84 are reattached films formed by the material scattered from the etching of non-magnetic metal films 83 adhering to the surface of multiple first insulating films 311.

[0126] Alternatively, in this etching, over-etching can be performed in such a way that portions of the insulating film 311P covering the upper surfaces 82d of each of the plurality of coil elements 82 are reliably removed until each of the plurality of coil elements 82 is slightly etched.

[0127] Next, refer to Figure 6 The process of forming the second insulating film 312 will be described. In the manufacturing method of the magnetic sensor 1, after etching the non-magnetic metal film 83 and the insulating film 311P, the second insulating film 312 is formed in a manner that covers a plurality of coil elements 82 and a plurality of first insulating films 311. The second insulating film 312 can be formed, for example, by chemical vapor deposition (CVD).

[0128] In the manufacturing method of the magnetic sensor 1, after forming the second insulating film 312, a sensor pre-position that becomes the magnetic sensor 1 is formed by forming multiple electrode pads, etc. Then, the magnetic sensor 1 is completed by cutting around the sensor pre-position.

[0129] Next, the function and effects of the magnetic sensor 1 of this embodiment will be explained. First, the manufacturing method of the magnetic sensor of the comparative example will be described. The manufacturing method of the magnetic sensor of the comparative example is the same as the manufacturing method of the magnetic sensor 1 of this embodiment before the step of removing the photoresist layer (not shown) used to form the plurality of coil elements 82. In the manufacturing method of the magnetic sensor of the comparative example, the non-magnetic metal film 83 is then etched to remove the portions of the non-magnetic metal film 83 that are not covered by the plurality of coil elements 82. Next, a second insulating film 312 is formed to cover the plurality of coil elements 82. The subsequent steps are the same as the manufacturing method of the magnetic sensor 1 of this embodiment.

[0130] In the comparative example magnetic sensor, the plurality of first insulating films 311 of this embodiment are not formed. Therefore, in the comparative example magnetic sensor, the second insulating film 312 is directly in contact with the first and second sides 82a, 82b of the coil element 82. Figures 8-10 As shown, the first portion 82a1 of the first side surface 82a and the first portion 82b1 of the second side surface 82b of the coil element 82 are inclined as described above. Compared to the second portions 82a2 of the first side surface 82a and the second portions 82b2 of the second side surface 82b, the second insulating film 312 is less likely to adhere to the first portion 82a1 of the first side surface 82a and the second portion 82b1 of the second side surface 82b of the coil element 82. As a result, the seam formed during the deposition of the second insulating film 312 is located closer to the coil element 82. When the seam exists near the coil element 82, problems arise such as corrosion of the coil element 82 caused by etching in processes such as forming electrode pads, and by resist stripping solutions used in processes for separating multiple sensor pre-defined parts.

[0131] In contrast, in this embodiment, the first portion 82a1 of the first side 82a and the first portion 82b1 of the second side 82b of the coil element 82 are covered by the first insulating films 311A ​​and 311B, respectively. That is, in this embodiment, the second insulating film 312 is not in direct contact with the first portion 82a1 of the first side 82a and the first portion 82b1 of the second side 82b of the coil element 82. Therefore, according to this embodiment, it is possible to prevent the resist stripping liquid that seeps in from the seam of the second insulating film 312 from corroding the coil element 82.

[0132] [Second Implementation]

[0133] Next, refer to Figure 15 The magnetic sensor 1 of the second embodiment of the present invention will be described. Figure 15 This is a cross-sectional view showing a portion of the magnetic sensor 1 according to this embodiment.

[0134] In this embodiment, the overall shape of each of the plurality of convex surfaces 305c of the insulating layer 305 is such that Figure 15 The triangular shape of the convex surface 305c shown is a triangular roof shape formed by moving it along a direction parallel to the U direction. Furthermore, the plurality of first inclined surfaces 305a and the plurality of second inclined surfaces 305b of the insulating layer 305 are each planar. Each of the plurality of first inclined surfaces 305a is a plane parallel to both the U and W1 directions. Each of the plurality of second inclined surfaces 305b is a plane parallel to both the U and W2 directions.

[0135] Insulation layer 305 and Figure 6Similarly, the example shown may also include multiple protrusions forming multiple convex surfaces 305c. Alternatively, the insulating layer 305 may also include multiple grooves arranged in a direction parallel to the V direction. Each of the multiple grooves has a first wall surface corresponding to the first inclined surface 305a and a second wall surface corresponding to the second inclined surface 305b. A convex surface 305c is formed by the first wall surface of a groove and the second wall surface of another groove adjacent to that groove on the -V direction side.

[0136] In addition, Figure 15 In the example shown, each of the multiple slots also has a bottom surface corresponding to the flat surface 305d. However, each of the multiple slots may also not have a bottom surface.

[0137] The insulating layer 310 has a plurality of first inclined surfaces and a plurality of second inclined surfaces. The plurality of first inclined surfaces of the insulating layer 310 are respectively located above the plurality of first inclined surfaces 305a of the insulating layer 305. The plurality of second inclined surfaces of the insulating layer 310 are respectively located above the plurality of second inclined surfaces 305b of the insulating layer 305. The shape and arrangement of the plurality of first inclined surfaces and the plurality of second inclined surfaces of the insulating layer 310 are the same as those of the plurality of first inclined surfaces 305a and the plurality of second inclined surfaces 305b of the insulating layer 305. The description of the plurality of first inclined surfaces 305a and the plurality of second inclined surfaces 305b also applies to the plurality of first inclined surfaces and the plurality of second inclined surfaces of the insulating layer 310.

[0138] The insulating layer 310 also has a flat surface surrounding a plurality of first inclined surfaces and a plurality of second inclined surfaces. The flat surface is a surface parallel to or substantially parallel to the upper surface 301a of the substrate 301.

[0139] The other structures, functions, and effects of this embodiment are the same as those of the first embodiment.

[0140] Furthermore, the present invention is not limited to the embodiments described above, and various modifications can be made. For example, the shape of the coil element 82 is not limited to the examples shown in each embodiment, but can be arbitrary, as long as the requirements of the claims are met. Additionally, the metal layer of the present invention is not limited to the coil element, and can be any wiring. Furthermore, the magnetic detection element of the present invention is not limited to MR elements, and can be an element that detects magnetic fields other than MR elements, such as a Hall element.

[0141] Additionally, the magnetic sensor 1 may also include a third detection circuit configured to detect a component in a direction parallel to the XY plane of the object's magnetic field and generate at least one third detection signal corresponding to that component. In this case, the processor 40 may also be configured to generate a detection value corresponding to the component in the U direction parallel to the object's magnetic field based on at least one third detection signal. The third detection circuit may also be integrated with the first and second detection circuits 20 and 30, or it may be contained in a different chip than the first and second detection circuits 20 and 30.

[0142] As described above, the magnetic sensor of the present invention comprises: a substrate having a reference plane, a magnetic detection element and an insulating layer disposed on the substrate, and at least one metal layer and a plurality of first insulating films disposed on the insulating layer. The insulating layer has at least one inclined surface that is inclined relative to the reference plane. The at least one metal layer has a shape that is elongated in a predetermined direction and has a first side surface and a second side surface located on both sides in the short side direction of the at least one metal layer. Each of the first and second side surfaces includes: a first portion and a second portion disposed at a position farther from the reference plane than the first portion. The first portion is inclined in a manner intersecting the at least one inclined surface. The first portion of the first side surface is also inclined in a manner that approaches the second side surface as it approaches the reference plane. The first portion of the second side surface is also inclined in a manner that approaches the first side surface as it approaches the reference plane. The plurality of first insulating films include: portions covering the first portion of the first side surface and extending in a direction intersecting the at least one inclined surface, and portions covering the first portion of the second side surface and extending in a direction intersecting the at least one inclined surface.

[0143] Alternatively, the magnetic sensor of the present invention may further include: a second insulating film covering at least one metal layer and a plurality of first insulating films.

[0144] Alternatively, in the magnetic sensor of the present invention, the plurality of first insulating films may also include: a portion covering a second portion of a first side surface and a portion covering a second portion of a second side surface.

[0145] Alternatively, in the magnetic sensor of the present invention, at least one metal layer may also have an upper surface located in a direction away from the reference plane. Alternatively, each of the plurality of first insulating films may not cover the upper surface of at least one metal layer. Alternatively, the plurality of first insulating films may further include portions located further from the reference plane than the corners at the intersection of the first side surface and the upper surface of at least one metal layer, and portions located further from the reference plane than the corners at the intersection of the second side surface and the upper surface of at least one metal layer.

[0146] Alternatively, in the magnetic sensor of the present invention, at least one inclined surface may have a shape that is elongated in a direction parallel to a reference plane. Alternatively, the long side direction of at least one metal layer and the long side direction of at least one inclined surface may intersect each other.

[0147] Alternatively, in the magnetic sensor of the present invention, at least one inclined surface may comprise multiple inclined surfaces. Alternatively, at least one metal layer may pass over multiple inclined surfaces.

[0148] Alternatively, in the magnetic sensor of the present invention, at least one metal layer may comprise two adjacent metal layers in the short-side direction of the at least one metal layer. Alternatively, the spacing between a first portion of one of the two metal layers and a first portion of the other of the two metal layers may increase as they approach a reference plane. Alternatively, the two metal layers may be arranged at a predetermined interval.

[0149] Alternatively, the magnetic sensor of the present invention may further include a non-magnetic metal film located between at least one metal layer and at least one inclined surface. Alternatively, the size of the non-magnetic metal film in the short-side direction of the at least one metal layer may be larger than the minimum size of the at least one metal layer in the short-side direction.

[0150] Alternatively, the magnetic sensor of the present invention may also include: a plurality of non-magnetic films respectively attached to the surface of a plurality of first insulating films.

[0151] Alternatively, in the magnetic sensor of the present invention, at least one metal layer may be part of the winding of a coil.

[0152] As can be seen from the above description, various methods and variations of the present invention can be implemented. Therefore, within the equivalent scope of the claims, the present invention can be implemented even in ways other than the preferred methods described above.

Claims

1. A magnetic sensor, characterized in that, have: A substrate with a reference plane; A magnetic detection element disposed on the substrate; An insulating layer disposed on the substrate; At least one metal layer and a plurality of first insulating films disposed on the insulating layer; as well as A second insulating film covering the at least one metal layer and the plurality of first insulating films, The insulating layer has at least one inclined surface that is tilted relative to the reference plane. The at least one metal layer has a shape that is elongated in a predetermined direction, and has a first side surface and a second side surface located on both sides of the shorter side of the at least one metal layer. The first side and the second side each include: a first portion and a second portion disposed at a position farther from the reference plane than the first portion. The first portion is inclined in a manner that intersects with the at least one inclined surface. The first portion of the first side is also inclined in such a way that it approaches the second side as it moves closer to the reference plane. The first portion of the second side is also inclined in a manner that it approaches the first side as it moves closer to the reference plane. The plurality of first insulating films include: a portion covering the first portion of the first side surface and extending in a direction intersecting the at least one inclined surface, and a portion covering the first portion of the second side surface and extending in a direction intersecting the at least one inclined surface.

2. A magnetic sensor, characterized in that, have: A substrate with a reference plane; A magnetic detection element disposed on the substrate; An insulating layer disposed on the substrate; as well as At least one metal layer and a plurality of first insulating films disposed on the insulating layer, The insulating layer has at least one inclined surface that is tilted relative to the reference plane. The at least one metal layer has a shape that is elongated in a predetermined direction, and has a first side surface and a second side surface located on both sides of the shorter side of the at least one metal layer. The first side and the second side each include: a first portion and a second portion disposed at a position farther from the reference plane than the first portion. The first portion is inclined in a manner that intersects with the at least one inclined surface. The first portion of the first side is also inclined in such a way that it approaches the second side as it moves closer to the reference plane. The first portion of the second side is also inclined in a manner that it approaches the first side as it moves closer to the reference plane. The plurality of first insulating films include: a portion covering the first portion of the first side surface and extending in a direction intersecting the at least one inclined surface, a portion covering the first portion of the second side surface and extending in a direction intersecting the at least one inclined surface, a portion covering the second portion of the first side surface, and a portion covering the second portion of the second side surface.

3. The magnetic sensor according to claim 1 or 2, characterized in that, The at least one metal layer further comprises: an upper surface located in front of the reference plane in a direction away from the reference plane. Each of the plurality of first insulating films does not cover the upper surface of the at least one metal layer.

4. The magnetic sensor according to claim 3, characterized in that, The plurality of first insulating films further include: portions located at a position farther from the reference plane than the corners at the intersection of the first side surface and the upper surface of the at least one metal layer, and portions located at a position farther from the reference plane than the corners at the intersection of the second side surface and the upper surface of the at least one metal layer.

5. The magnetic sensor according to claim 1 or 2, characterized in that, The at least one inclined surface has a shape that is elongated in a direction parallel to the reference plane. The long side direction of the at least one metal layer and the long side direction of the at least one inclined surface intersect each other.

6. A magnetic sensor, characterized in that, have: A substrate with a reference plane; A magnetic detection element disposed on the substrate; An insulating layer disposed on the substrate; as well as At least one metal layer and a plurality of first insulating films disposed on the insulating layer, The insulating layer has at least one inclined surface that is tilted relative to the reference plane. The at least one metal layer has a shape that is elongated in a predetermined direction, and has a first side surface and a second side surface located on both sides of the shorter side of the at least one metal layer. The first side and the second side each include: a first portion and a second portion disposed at a position farther from the reference plane than the first portion. The first portion is inclined in a manner that intersects with the at least one inclined surface. The first portion of the first side is also inclined in such a way that it approaches the second side as it moves closer to the reference plane. The first portion of the second side is also inclined in a manner that it approaches the first side as it moves closer to the reference plane. The plurality of first insulating films include: portions covering the first portion of the first side surface and extending in a direction intersecting the at least one inclined surface, and portions covering the first portion of the second side surface and extending in a direction intersecting the at least one inclined surface. The at least one inclined surface comprises a plurality of inclined surfaces. The at least one metal layer passes over the plurality of inclined surfaces.

7. The magnetic sensor according to any one of claims 1, 2, and 6, characterized in that, The at least one metal layer comprises two adjacent metal layers in the short-side direction of the at least one metal layer. The spacing between the first portion of one of the two metal layers and the first portion of the other of the two metal layers increases as they approach the reference plane.

8. The magnetic sensor according to any one of claims 1, 2, and 6, characterized in that, The at least one metal layer comprises two adjacent metal layers in the short-side direction of the at least one metal layer. The two metal layers are arranged at a predetermined interval.

9. The magnetic sensor according to any one of claims 1, 2, and 6, characterized in that, It also includes: a non-magnetic metal film located between the at least one metal layer and the at least one inclined surface. The size of the non-magnetic metal film in the short side direction of the at least one metal layer is greater than the minimum size of the at least one metal layer in the short side direction.

10. The magnetic sensor according to any one of claims 1, 2, and 6, characterized in that, It also includes: a plurality of non-magnetic films respectively attached to the surface of each of the plurality of first insulating films.

11. A magnetic sensor, characterized in that, have: A substrate with a reference plane; A magnetic detection element disposed on the substrate; An insulating layer disposed on the substrate; as well as At least one metal layer and a plurality of first insulating films disposed on the insulating layer, The insulating layer has at least one inclined surface that is tilted relative to the reference plane. The at least one metal layer has a shape that is elongated in a predetermined direction, and has a first side surface and a second side surface located on both sides of the shorter side of the at least one metal layer. The first side and the second side each include: a first portion and a second portion disposed at a position farther from the reference plane than the first portion. The first portion is inclined in a manner that intersects with the at least one inclined surface. The first portion of the first side is also inclined in such a way that it approaches the second side as it moves closer to the reference plane. The first portion of the second side is also inclined in a manner that it approaches the first side as it moves closer to the reference plane. The plurality of first insulating films include: portions covering the first portion of the first side surface and extending in a direction intersecting the at least one inclined surface, and portions covering the first portion of the second side surface and extending in a direction intersecting the at least one inclined surface. The at least one metal layer is part of the coil winding.

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