半导体设备的制造方法、基板处理系统、基板处理装置以及记录介质

By collecting atmospheric pressure data in parallel and using a step-time adjustment (STA) model to segment the film deposition steps, the substrate processing conditions are adjusted in real time, which solves the problem of inaccurate film deposition results caused by atmospheric pressure fluctuations and ensures the stability of the film deposition process and the consistency of film thickness.

CN115863142BActive Publication Date: 2026-07-17KOKUSAI DENKI KK
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
KOKUSAI DENKI KK
Filing Date
2022-07-29
Publication Date
2026-07-17

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Abstract

本发明提供一种半导体设备的制造方法、基板处理系统以及记录介质，通过使制程应对特别是在需要长时间的成膜工序中产生的大气压的变动，来得到所期待的成膜结果。半导体设备的制造方法包括按照基板的处理条件对基板进行处理的工序；与对所述基板进行处理的工序并行地收集大气压数据的工序；使用收集到的所述大气压数据对所述基板的处理条件进行调整的工序；以及按照所述处理条件进行所述基板处理的控制的工序。
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