Overlay error compensation method and apparatus, electronic device, and storage medium

Abstract

Embodiments of the present application provide overlay error compensation methods and devices, electronic equipment and storage media. An etched inspection pattern of a sample to be detected and a wiring direction of the sample to be detected are obtained. X-direction deviation and Y-direction deviation are determined according to the etched inspection pattern. X-direction compensation values and Y-direction compensation values are determined according to the wiring direction, the X-direction deviation and the Y-direction deviation, and overlay error compensation data is obtained. In the process of determining the X-direction compensation values and the Y-direction compensation values, the wiring direction is also considered. The X-direction deviation, the Y-direction deviation and the wiring direction can be used to remove the overcompensation part in the compensation data, so as to obtain the X-direction compensation values and the Y-direction compensation values. The obtained overlay error compensation data is more accurate and can reduce the overcompensation.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to methods, apparatus, electronic devices and storage media for overlay error compensation. Background Technology

[0002] In semiconductor manufacturing processes, overlay error is an important indicator for measuring the alignment accuracy and yield assurance between the current layer and the previous layer. However, during the manufacturing process, there are often deviations between the pattern after photolithography and the pattern after etching, which leads to problems with pattern alignment. In order to improve the yield of chips, it is necessary to use the detection results of the pattern after etching to correct or compensate for it, thereby reducing overlay error. Summary of the Invention

[0003] The purpose of this application is to provide a method, apparatus, electronic device, and storage medium for overprinting error compensation, so as to improve the compensation effect of overprinting error.

[0004] In a first aspect, embodiments of this application provide a method for compensating overlay errors, including: The etched pattern of the sample to be tested and the wiring direction of the sample to be tested are obtained; Based on the etching post-etching inspection pattern, determine the X-direction deviation and the Y-direction deviation; Based on the wiring direction, the X-direction deviation, and the Y-direction deviation, determine the X-direction compensation value and the Y-direction compensation value.

[0005] In one exemplary embodiment, the wiring direction includes the word line direction and the active area pattern direction; The step of determining the X-direction compensation value and the Y-direction compensation value based on the wiring direction, the X-direction deviation, and the Y-direction deviation includes: The angle between the active area pattern and the character line is determined based on the direction of the character line and the direction of the active area pattern. The X-direction compensation value and the Y-direction compensation value are determined based on the character line direction, the included angle, the X-direction deviation, and the Y-direction deviation.

[0006] In one exemplary embodiment, determining the X-direction compensation value and the Y-direction compensation value based on the character line direction, the included angle, the X-direction deviation, and the Y-direction deviation includes: When the direction of the character line is the Y direction, the X direction deviation is used as the X direction compensation value; Based on the included angle and the X-direction deviation, the overcompensation value in the Y-direction is calculated using trigonometric functions; The Y-direction compensation value is obtained by subtracting the Y-direction overcompensation value from the Y-direction deviation.

[0007] In one exemplary embodiment, the step of calculating the overcompensation value in the Y direction using trigonometric functions based on the included angle and the X-direction deviation includes: Based on the included angle and the X-direction deviation, the Y-direction overcompensation value is calculated using the following formula:

[0008] in, This indicates the overcompensation value in the Y direction. This indicates the deviation in the X direction. This indicates the included angle.

[0009] In one exemplary embodiment, determining the X-direction compensation value and the Y-direction compensation value based on the character line direction, the included angle, the X-direction deviation, and the Y-direction deviation includes: When the direction of the character line is the X direction, the deviation in the Y direction is used as the Y-direction compensation value; Based on the included angle and the Y-direction deviation, the overcompensation value in the X-direction is calculated using trigonometric functions; The X-direction compensation value is obtained by adding the X-direction deviation to the X-direction overcompensation value.

[0010] In one exemplary embodiment, the step of calculating the X-direction overcompensation value using trigonometric functions based on the included angle and the Y-direction deviation includes: Based on the included angle and the Y-direction deviation, the X-direction overcompensation value is calculated using the following formula:

[0011] in, This indicates the overcompensation value in the X direction. This indicates the deviation in the Y direction. This indicates the included angle.

[0012] In one exemplary embodiment, after determining the X-direction compensation value and the Y-direction compensation value based on the wiring direction, the X-direction deviation, and the Y-direction deviation, the method further includes: The photolithography process conditions of the sample to be tested are obtained, and the photolithography process conditions are compensated using the X-direction compensation value and the Y-direction compensation value.

[0013] Secondly, embodiments of this application provide an overlay error compensation device, the device comprising: The wiring direction acquisition module is used to acquire the post-etching inspection pattern of the sample to be tested and the wiring direction of the sample to be tested. The pattern deviation determination module is used to determine the X-direction deviation and the Y-direction deviation based on the etched inspection pattern. The compensation data determination module is used to determine the X-direction compensation value and the Y-direction compensation value based on the wiring direction, the X-direction deviation, and the Y-direction deviation.

[0014] In one exemplary embodiment, the wiring direction includes the word line direction and the active area pattern direction; the compensation data determination module includes: Angle determination submodule is used to determine the angle between the active area pattern and the character line based on the direction of the character line and the direction of the active area pattern; The distance determination submodule is used to determine the X-direction compensation value and the Y-direction compensation value based on the character line direction, the included angle, the X-direction deviation, and the Y-direction deviation.

[0015] In one exemplary embodiment, the distance determination submodule includes: The X-direction compensation value determination unit is used to determine the X-direction deviation as the X-direction compensation value when the word line direction is the Y direction. The Y-direction overcompensation value determination unit is used to calculate the Y-direction overcompensation value using trigonometric functions based on the included angle and the X-direction deviation. The Y-direction compensation value determination unit is used to obtain the Y-direction compensation value by subtracting the Y-direction overcompensation value from the Y-direction deviation.

[0016] In one exemplary embodiment, the Y-direction overcompensation value determination unit is specifically used for: Based on the included angle and the X-direction deviation, the Y-direction overcompensation value is calculated using the following formula:

[0017] in, This indicates the overcompensation value in the Y direction. This indicates the deviation in the X direction. This indicates the included angle.

[0018] In one exemplary embodiment, the distance determination submodule includes: Y-direction compensation value determination unit, used to determine the Y-direction deviation as the Y-direction compensation value when the word line direction is the X-direction; The X-direction overcompensation value determination unit is used to calculate the X-direction overcompensation value using trigonometric functions based on the included angle and the Y-direction deviation. The X-direction compensation value determination unit is used to obtain the X-direction compensation value by adding the X-direction deviation to the X-direction overcompensation value.

[0019] In one exemplary embodiment, the X-direction overcompensation value determination unit is specifically used for: Based on the included angle and the Y-direction deviation, the X-direction overcompensation value is calculated using the following formula:

[0020] in, This indicates the overcompensation value in the X direction. This indicates the deviation in the Y direction. This indicates the included angle.

[0021] In one exemplary embodiment, the apparatus further includes: a photolithography process condition compensation module, configured to acquire the photolithography process conditions of the sample to be tested, and to compensate the photolithography process conditions using the X-direction compensation value and the Y-direction compensation value.

[0022] Thirdly, embodiments of this application provide an electronic device, including a processor and a memory; The memory is used to store computer programs; When the processor executes the program stored in the memory, it implements any of the overlay error compensation methods described in this application.

[0023] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program, which, when executed by a processor, implements any of the overlay error compensation methods described in this application.

[0024] Fifthly, embodiments of this application also provide a computer program product containing instructions that, when run on a computer, cause the computer to execute any of the overlay error compensation methods described in this application.

[0025] The overlay error compensation method, apparatus, electronic device, and storage medium provided in this application acquire the post-etching inspection pattern and wiring direction of the sample to be tested; determine the X-direction deviation and Y-direction deviation based on the post-etching inspection pattern; determine the X-direction compensation value and Y-direction compensation value based on the wiring direction, X-direction deviation, and Y-direction deviation, thus obtaining overlay error compensation data; in the process of determining the X-direction compensation value and Y-direction compensation value, the wiring direction is also considered, and the overcompensated part can be removed from the compensation data using the X-direction deviation, Y-direction deviation, and wiring direction, thereby obtaining the X-direction compensation value and Y-direction compensation value. The obtained overlay error compensation data is more accurate and can reduce overcompensation. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0027] Figure 1a This is a schematic diagram of layout design data in an embodiment of this application; Figure 1b This is a schematic diagram of a pattern for post-etching inspection in an embodiment of this application; Figure 2 This is a schematic diagram of the first embodiment of the overlay error compensation method of this application; Figure 3 This is a schematic diagram of an exemplary implementation of step S13 in an embodiment of this application; Figure 4 This is a schematic diagram illustrating the angle between the active area pattern and the character line in an embodiment of this application. Figure 5 This is a schematic diagram of a first exemplary implementation of step S132 in the embodiments of this application; Figure 6a This is a first schematic diagram of an etched post-excavation inspection pattern with the word line direction in the Y direction, according to an embodiment of this application. Figure 6b This is a second schematic diagram of an etching inspection pattern with the character line direction in the Y direction, according to an embodiment of this application. Figure 7 This is a schematic diagram of a second exemplary implementation of step S132 in the embodiments of this application; Figure 8a This is a first schematic diagram of an etched post-excavation inspection pattern with the character line direction in the X direction, according to an embodiment of this application. Figure 8b This is a second schematic diagram of an etching inspection pattern with the character line direction in the X direction, according to an embodiment of this application. Figure 9 This is a second schematic diagram of the overlay error compensation method according to an embodiment of this application; Figure 10 This is a schematic diagram of an overlay error compensation device according to an embodiment of this application; Figure 11 This is a schematic diagram of an electronic device according to an embodiment of this application. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art based on this application are within the scope of protection of this application.

[0029] Since there is often a deviation between the post-development inspection pattern (ADI) and the post-etching inspection pattern (AEI), the chip pattern alignment is inaccurate, which affects the chip yield.

[0030] This application provides a method for compensating for overlay errors. See also... Figure 2 The method includes: S11, Obtain the etched inspection pattern of the sample to be tested and the wiring direction of the sample to be tested.

[0031] The overlay error compensation method of this application embodiment can be implemented by an electronic device, such as a personal computer, server, or lithography machine.

[0032] The sample to be tested is used to detect overlay errors. For example, SEM (Scanning Electron Microscopy) can be used to etch and inspect the sample to obtain the etched inspection pattern. The wiring direction of the sample to be tested can be obtained from the layout design data of the sample to be tested or from the etched inspection pattern; for example, the wiring direction of the sample to be tested can include the word line direction and the active area pattern direction in the sample to be tested. Figure 1a This is a schematic diagram of layout design data in an embodiment of this application. For example, in a DRAM (Dynamic Random Access Memory) memory cell, AA represents the active area pattern, WL represents the word line, and BLC represents the bit line contact point. The extension direction along WL can be defined as the Y direction, and the extension direction perpendicular to WL can be defined as the X direction.

[0033] S12, based on the etched inspection pattern, determine the X-direction deviation and Y-direction deviation.

[0034] By measuring the difference between the etched inspection pattern and the layout design data, the X-direction and Y-direction deviations of the etched inspection pattern can be determined. For example, ... Figure 1a As shown, in the layout design data, the center point O of BLC falls on AA, and the center point O of BCL is located on the center line between the two adjacent WLs. Figure 1b As shown, by measuring and inspecting the pattern after etching, the distance WO between the center point O of BLC and the center line of the adjacent word line WL can be obtained. That is, the X-direction deviation of BLC is ; Alternatively, the distance AO between the center point O of BLC and AA in the Y direction can be obtained as follows: That is, the Y-direction deviation of BLC is

[0035] S13, determine the X-direction compensation value and the Y-direction compensation value based on the wiring direction, the X-direction deviation, and the Y-direction deviation.

[0036] Overlay error compensation data includes X-direction compensation values ​​and Y-direction compensation values. Different types of wiring in the sample under test have different orientations; therefore, directly using X-direction and Y-direction deviations as overlay error compensation data will result in overcompensation. For example, for... Figure 1b As shown, if X-direction deviation is used directly for X-direction compensation and Y-direction deviation is used directly for Y-direction compensation, overcompensation in the Y-direction will occur because the active area pattern and the character lines are in different directions.

[0037] In this embodiment of the application, the wiring direction is also considered in the process of determining the overlay error compensation data. The overcompensated part can be removed from the compensation data by using the X-direction deviation, Y-direction deviation and wiring direction, so as to obtain the X-direction compensation value and Y-direction compensation value. The obtained overlay error compensation data is more accurate and can reduce the overcompensation situation, thereby increasing the yield of the chip after compensation by using the X-direction compensation value and Y-direction compensation value.

[0038] In one exemplary embodiment, the wiring direction includes the word line direction and the active area pattern direction; see also Figure 3 The step of determining the X-direction compensation value and the Y-direction compensation value based on the wiring direction, the X-direction deviation, and the Y-direction deviation includes: S131, determine the angle between the active area pattern and the character line based on the direction of the character line and the direction of the active area pattern.

[0039] For example, the angle between the active area pattern and the character line can be an acute angle formed by the active area pattern and the character line, for example... Figure 4 The β angle shown is understood to be equivalent to the angle between the active area pattern and the letter line, which can also be replaced by other angles related to the active area pattern and the letter line, such as... Figure 4 Angles such as λ or α in the equation are all within the scope of protection of this application.

[0040] S132, determine the X-direction compensation value and the Y-direction compensation value based on the character line direction, the included angle, the X-direction deviation, and the Y-direction deviation.

[0041] Based on the direction of the character lines, it can be determined whether the correction is for overcompensation of the X-direction deviation or overcompensation of the Y-direction deviation. Then, based on the included angle and the X-direction deviation, trigonometric functions are used to calculate the overcompensation value in the Y-direction, or vice versa. This ultimately yields the X-direction compensation value and the Y-direction compensation value.

[0042] Below, examples will be given for cases where the direction of the character line is the Y direction and the X direction, respectively.

[0043] In one exemplary implementation, see Figure 5 The step of determining the X-direction compensation value and the Y-direction compensation value based on the character line direction, the included angle, the X-direction deviation, and the Y-direction deviation includes: S1321, when the direction of the character line is the Y direction, the X direction deviation is used as the X direction compensation value.

[0044] For example, Figure 6a and Figure 6b As shown, when the character line direction is the Y direction, X = Where X represents the compensation value in the X direction. This indicates the deviation in the X direction.

[0045] S1322, Based on the included angle and the X-direction deviation, calculate the Y-direction overcompensation value using trigonometric functions.

[0046] For example, the included angle is as follows Figure 4 In As shown in the figure, the calculation of the overcompensation value in the Y direction using trigonometric functions based on the included angle and the X-direction deviation includes: Based on the included angle and the X-direction deviation, the Y-direction overcompensation value is calculated using the following formula:

[0047] in, This indicates the overcompensation value in the Y direction. This indicates the deviation in the X direction. This indicates the included angle.

[0048] For example, the included angle is as follows Figure 4 In As shown in the figure, the calculation of the overcompensation value in the Y direction using trigonometric functions based on the included angle and the X-direction deviation includes: Based on the included angle and the X-direction deviation, the Y-direction overcompensation value is calculated using the following formula:

[0049] in, This indicates the overcompensation value in the Y direction. α represents the deviation in the X direction, and α represents the included angle.

[0050] S1323, the Y-direction compensation value is obtained by subtracting the Y-direction overcompensation value from the Y-direction deviation.

[0051] For example, Figure 6a and Figure 6b As shown, when the character line direction is the Y direction, ,in This indicates the deviation in the Y direction, where Y represents the compensation value in the Y direction.

[0052] In this application embodiment, a specific calculation method for the X-direction compensation value and the Y-direction compensation value when the word line direction is Y-direction is given. For chips with the word line direction in Y-direction, the obtained overlay error compensation data is more accurate, which can reduce overcompensation and thus improve the yield of chips with the word line direction in Y-direction.

[0053] In one exemplary implementation, see Figure 7 The step of determining the X-direction compensation value and the Y-direction compensation value based on the character line direction, the included angle, the X-direction deviation, and the Y-direction deviation includes: S1324, when the direction of the character line is the X direction, the deviation in the Y direction is used as the Y direction compensation value.

[0054] For example, Figure 8a and Figure 8b As shown, when the direction of the character line is the X direction, Where Y represents the compensation value in the Y direction, This indicates the deviation in the Y direction.

[0055] S1325, Based on the included angle and the Y-direction deviation, calculate the X-direction overcompensation value using trigonometric functions.

[0056] For example, the included angle is as follows Figure 4 In As shown in the figure, the step of calculating the overcompensation value in the X direction using trigonometric functions based on the included angle and the Y-direction deviation includes: Based on the included angle and the Y-direction deviation, the X-direction overcompensation value is calculated using the following formula:

[0057] in, This indicates the overcompensation value in the X direction. This indicates the deviation in the X direction. This indicates the included angle.

[0058] For example, the included angle is as follows Figure 4 In As shown in the figure, the step of calculating the overcompensation value in the X direction using trigonometric functions based on the included angle and the Y-direction deviation includes: Based on the included angle and the Y-direction deviation, the X-direction overcompensation value is calculated using the following formula:

[0059] in, This indicates the overcompensation value in the X direction. This indicates the deviation in the Y direction. This indicates the included angle.

[0060] S1326, The X-direction compensation value is obtained by adding the X-direction deviation to the X-direction overcompensation value.

[0061] For example, Figure 8a and Figure 8b As shown, when the direction of the character line is the X direction, Where X represents the compensation value in the X direction. This indicates the deviation in the X direction.

[0062] In this application embodiment, the calculation method of the X-direction compensation value and the Y-direction compensation value when the word line direction is X-direction is given. For chips with the word line direction in X-direction, the obtained overlay error compensation data is more accurate, which can reduce the overcompensation situation and thus improve the yield of chips with the word line direction in X-direction.

[0063] It is understood that the above embodiments are only illustrative examples with the Y and X directions as the word line direction. Other wiring directions will not be described here. All other embodiments obtained by those skilled in the art based on this application are within the scope of protection of this application.

[0064] In one exemplary implementation, see Figure 9 After determining the X-direction compensation value and the Y-direction compensation value based on the wiring direction, the X-direction deviation, and the Y-direction deviation, the method further includes: S14, obtain the photolithography process conditions of the sample to be tested, and compensate the photolithography process conditions using the X-direction compensation value and the Y-direction compensation value.

[0065] Overlay error compensation data includes X-direction compensation values ​​and Y-direction compensation values. For the photolithography process conditions of the patterned layer in the sample under test, compensation is performed in the X-direction using the X-direction compensation value, and in the Y-direction using the Y-direction compensation value. For example, the patterned layer can be a BLC layer. When performing photolithography on the BLC layer, the compensated photolithography process conditions can be obtained by updating the X-direction and Y-direction compensation values ​​to the original photolithography process conditions. Using the compensated photolithography process conditions for chip fabrication can reduce overcompensation and increase chip yield.

[0066] This application provides an overlay error compensation device, see [link to relevant documentation]. Figure 10 The device includes: The wiring direction acquisition module 101 is used to acquire the etched inspection pattern of the sample to be tested and the wiring direction of the sample to be tested. The pattern deviation determination module 102 is used to determine the X-direction deviation and the Y-direction deviation based on the etched inspection pattern. The compensation data determination module 103 is used to determine the X-direction compensation value and the Y-direction compensation value based on the wiring direction, the X-direction deviation, and the Y-direction deviation.

[0067] In one exemplary embodiment, the wiring direction includes the word line direction and the active area pattern direction; the compensation data determination module includes: Angle determination submodule is used to determine the angle between the active area pattern and the character line based on the direction of the character line and the direction of the active area pattern; The distance determination submodule is used to determine the X-direction compensation value and the Y-direction compensation value based on the character line direction, the included angle, the X-direction deviation, and the Y-direction deviation.

[0068] In one exemplary embodiment, the distance determination submodule includes: The X-direction compensation value determination unit is used to determine the X-direction deviation as the X-direction compensation value when the word line direction is the Y-direction. The Y-direction overcompensation value determination unit is used to calculate the Y-direction overcompensation value using trigonometric functions based on the included angle and the X-direction deviation. The Y-direction compensation value determination unit is used to obtain the Y-direction compensation value by subtracting the Y-direction overcompensation value from the Y-direction deviation.

[0069] In one exemplary embodiment, the Y-direction overcompensation value determination unit is specifically used for: Based on the included angle and the X-direction deviation, the Y-direction overcompensation value is calculated using the following formula:

[0070] in, This indicates the overcompensation value in the Y direction. This indicates the deviation in the X direction. This indicates the included angle.

[0071] In one exemplary embodiment, the distance determination submodule includes: Y-direction compensation value determination unit, used to determine the Y-direction deviation as the Y-direction compensation value when the word line direction is the X-direction; The X-direction overcompensation value determination unit is used to calculate the X-direction overcompensation value using trigonometric functions based on the included angle and the Y-direction deviation. The X-direction compensation value determination unit is used to obtain the X-direction compensation value by adding the X-direction deviation to the X-direction overcompensation value.

[0072] In one exemplary embodiment, the X-direction overcompensation value determination unit is specifically used for: Based on the included angle and the Y-direction deviation, the X-direction overcompensation value is calculated using the following formula:

[0073] in, This indicates the overcompensation value in the X direction. This indicates the deviation in the X direction. This indicates the included angle.

[0074] In one exemplary embodiment, the apparatus further includes: a photolithography process condition compensation module, configured to acquire the photolithography process conditions of the sample to be tested, and to compensate the photolithography process conditions using the X-direction compensation value and the Y-direction compensation value.

[0075] This application also provides an electronic device, including: a processor and a memory; The aforementioned memory is used to store computer programs; When the processor executes the computer program stored in the memory, it implements any of the overlay error compensation methods described in this application.

[0076] Optional, see Figure 11 The electronic device in this application embodiment also includes a communication interface 202 and a communication bus 204, wherein the processor 201, the communication interface 202, and the memory 203 communicate with each other through the communication bus 204.

[0077] The communication bus mentioned in the above electronic devices can be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus, etc. This communication bus can be divided into address bus, data bus, control bus, etc. For ease of illustration, only one thick line is used to represent it in the diagram, but this does not mean that there is only one bus or one type of bus.

[0078] The communication interface is used for communication between the aforementioned electronic devices and other devices.

[0079] The memory may include RAM (Random Access Memory) or NVM (Non-Volatile Memory), such as at least one disk storage device. Optionally, the memory may also be at least one storage device located remotely from the aforementioned processor.

[0080] The processors mentioned above can be general-purpose processors, including CPUs (Central Processing Units), NPs (Network Processors), etc.; they can also be DSPs (Digital Signal Processors), ASICs (Application Specific Integrated Circuits), FPGAs (Field-Programmable Gate Arrays), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components.

[0081] This application also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements any of the overlay error compensation methods described in this application.

[0082] In another embodiment provided in this application, a computer program product containing instructions is also provided, which, when run on a computer, causes the computer to execute any of the overlay error compensation methods described in this application.

[0083] In the above embodiments, implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., a solid-state drive (SSD)).

[0084] It should be noted that, in this document, the technical features of the various alternative solutions can be combined to form solutions as long as they are not contradictory, and these solutions are all within the scope of this application. Relational terms such as "first" and "second" are merely used to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0085] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, embodiments of devices, electronic devices, computer program products, and storage media are basically similar to the method embodiments, and therefore the descriptions are relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0086] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. A method for compensating overlay error, characterized in that, include: The etched pattern of the sample to be tested and the wiring direction of the sample to be tested are obtained; Based on the etching post-etching inspection pattern, determine the X-direction deviation and the Y-direction deviation; Based on the wiring direction, the X-direction deviation, and the Y-direction deviation, determine the X-direction compensation value and the Y-direction compensation value; The determination of the X-direction compensation value and the Y-direction compensation value based on the wiring direction, the X-direction deviation, and the Y-direction deviation includes: Based on the character line direction, the angle between the active area pattern and the character line, the X-direction deviation, and the Y-direction deviation, determine the X-direction compensation value and the Y-direction compensation value; and based on the character line direction, determine whether to correct overcompensation of the X-direction deviation or overcompensation of the Y-direction deviation; calculate the Y-direction overcompensation value using trigonometric functions based on the angle and the X-direction deviation, or calculate the X-direction overcompensation value using trigonometric functions based on the angle and the Y-direction deviation, thereby obtaining the X-direction compensation value and the Y-direction compensation value.

2. The method according to claim 1, characterized in that, The wiring direction includes the word line direction and the active area pattern direction; The step of determining the X-direction compensation value and the Y-direction compensation value based on the wiring direction, the X-direction deviation, and the Y-direction deviation includes: The angle between the active area pattern and the character line is determined based on the direction of the character line and the direction of the active area pattern. The X-direction compensation value and the Y-direction compensation value are determined based on the character line direction, the included angle, the X-direction deviation, and the Y-direction deviation.

3. The method according to claim 2, characterized in that, The step of determining the X-direction compensation value and the Y-direction compensation value based on the character line direction, the included angle, the X-direction deviation, and the Y-direction deviation includes: When the direction of the character line is the Y direction, the X direction deviation is used as the X direction compensation value; Based on the included angle and the X-direction deviation, the overcompensation value in the Y-direction is calculated using trigonometric functions; The Y-direction compensation value is obtained by subtracting the Y-direction overcompensation value from the Y-direction deviation.

4. The method according to claim 3, characterized in that, The step of calculating the overcompensation value in the Y direction using trigonometric functions based on the included angle and the X-direction deviation includes: Based on the included angle and the X-direction deviation, the Y-direction overcompensation value is calculated using the following formula: in, This indicates the overcompensation value in the Y direction. This indicates the deviation in the X direction. This indicates the included angle.

5. The method according to claim 2, characterized in that, The step of determining the X-direction compensation value and the Y-direction compensation value based on the character line direction, the included angle, the X-direction deviation, and the Y-direction deviation includes: When the direction of the character line is the X direction, the deviation in the Y direction is used as the Y-direction compensation value; Based on the included angle and the Y-direction deviation, the overcompensation value in the X-direction is calculated using trigonometric functions; The X-direction compensation value is obtained by adding the X-direction deviation to the X-direction overcompensation value.

6. The method according to claim 5, characterized in that, The step of calculating the overcompensation value in the X direction using trigonometric functions based on the included angle and the Y-direction deviation includes: Based on the included angle and the Y-direction deviation, the X-direction overcompensation value is calculated using the following formula: in, This indicates the overcompensation value in the X direction. This indicates the deviation in the Y direction. This indicates the included angle.

7. The method according to claim 1, characterized in that, After determining the X-direction compensation value and the Y-direction compensation value based on the wiring direction, the X-direction deviation, and the Y-direction deviation, the method further includes: The photolithography process conditions of the sample to be tested are obtained, and the photolithography process conditions are compensated using the X-direction compensation value and the Y-direction compensation value.

8. A device for compensating overlay errors, characterized in that, The device includes: The wiring direction acquisition module is used to acquire the post-etching inspection pattern of the sample to be tested and the wiring direction of the sample to be tested. The pattern deviation determination module is used to determine the X-direction deviation and the Y-direction deviation based on the etched inspection pattern. The compensation data determination module is used to determine the X-direction compensation value and the Y-direction compensation value based on the wiring direction, the X-direction deviation, and the Y-direction deviation. The determination of the X-direction compensation value and the Y-direction compensation value based on the wiring direction, the X-direction deviation, and the Y-direction deviation includes: Based on the character line direction, the angle between the active area pattern and the character line, the X-direction deviation, and the Y-direction deviation, determine the X-direction compensation value and the Y-direction compensation value; and based on the character line direction, determine whether to correct overcompensation of the X-direction deviation or overcompensation of the Y-direction deviation; calculate the Y-direction overcompensation value using trigonometric functions based on the angle and the X-direction deviation, or calculate the X-direction overcompensation value using trigonometric functions based on the angle and the Y-direction deviation, thereby obtaining the X-direction compensation value and the Y-direction compensation value.

9. The apparatus according to claim 8, characterized in that, The wiring direction includes the word line direction and the active area pattern direction; The compensation data determination module includes: Angle determination submodule is used to determine the angle between the active area pattern and the character line based on the direction of the character line and the direction of the active area pattern; The distance determination submodule is used to determine the X-direction compensation value and the Y-direction compensation value based on the character line direction, the included angle, the X-direction deviation, and the Y-direction deviation.

10. The apparatus according to claim 9, characterized in that, The distance determination submodule includes: The X-direction compensation value determination unit is used to determine the X-direction deviation as the X-direction compensation value when the word line direction is the Y-direction. The Y-direction overcompensation value determination unit is used to calculate the Y-direction overcompensation value using trigonometric functions based on the included angle and the X-direction deviation. The Y-direction compensation value determination unit is used to obtain the Y-direction compensation value by subtracting the Y-direction overcompensation value from the Y-direction deviation.

11. The apparatus according to claim 10, characterized in that, The Y-direction overcompensation value determination unit is specifically used for: Based on the included angle and the X-direction deviation, the Y-direction overcompensation value is calculated using the following formula: in, This indicates the overcompensation value in the Y direction. This indicates the deviation in the X direction. This indicates the included angle.

12. The apparatus according to claim 9, characterized in that, The distance determination submodule includes: Y-direction compensation value determination unit, used to determine the Y-direction deviation as the Y-direction compensation value when the word line direction is the X-direction; The X-direction overcompensation value determination unit is used to calculate the X-direction overcompensation value using trigonometric functions based on the included angle and the Y-direction deviation. The X-direction compensation value determination unit is used to obtain the X-direction compensation value by adding the X-direction deviation to the X-direction overcompensation value.

13. The apparatus according to claim 12, characterized in that, The X-direction overcompensation value determination unit is specifically used for: Based on the included angle and the Y-direction deviation, the X-direction overcompensation value is calculated using the following formula: in, This indicates the overcompensation value in the X direction. This indicates the deviation in the Y direction. This indicates the included angle.

14. The apparatus according to claim 8, characterized in that, The device further includes a photolithography process condition compensation module, used to acquire the photolithography process conditions of the sample to be tested, and to compensate the photolithography process conditions using the X-direction compensation value and the Y-direction compensation value.

15. An electronic device, characterized in that, Including processor and memory; The memory is used to store computer programs; When the processor executes the program stored in the memory, it implements the method described in any one of claims 1-7.

16. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the method described in any one of claims 1-7.

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