An apparatus for monitoring wafer position and final polishing equipment

Abstract

This invention discloses a device for monitoring wafer position and a final polishing apparatus. The device includes: an open storage module comprising multiple layers of equally spaced support members arranged in two vertical columns; each support member group includes two support members on the same horizontal plane, and the wafer is supported by abutting against two support members in different columns; at least four monitoring modules are evenly arranged radially around the outer periphery of the storage module, the monitoring modules being used to monitor whether the wafer position in the storage module is abnormal; wherein the monitoring modules are capable of emitting laser signals and receiving laser signals emitted by adjacent monitoring modules, and when there is inconsistency in the laser signals received by the monitoring modules, the wafer position is determined to be abnormal.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more particularly to a device for monitoring wafer position and a final polishing apparatus. Background Technology

[0002] Semiconductor manufacturing processes are performed using semiconductor equipment, which typically includes various chambers, such as pre-loading chambers, transfer chambers, and processing chambers. These chambers are arranged in clusters, in parallel, or a combination of clusters and in parallel to process single wafers or batches of wafers. Understandably, each chamber generally contains a wafer stage for placing and securing wafers, and the wafers to be processed are usually housed in wafer cassettes. During a particular process, such as final polishing, the wafer cassette is typically placed on the loading stage of the final polishing equipment, and then a robotic arm removes the wafer from the cassette and transfers it to the final polishing process. However, during the robotic arm's removal of the wafer from the cassette, if the wafer's position within the cassette is abnormal, there is a risk of the wafer falling or even shattering during the robotic arm's insertion into the cassette to retrieve the wafer. Currently, there is no simple and effective method to detect abnormal wafer position. Summary of the Invention

[0003] In view of this, the present invention aims to provide a device for monitoring wafer position and a final polishing equipment; it can detect wafers in abnormal positions in a timely manner, avoid the risk of semiconductor equipment downtime, improve production efficiency, and reduce production costs.

[0004] The technical solution of this invention is implemented as follows:

[0005] In a first aspect, embodiments of the present invention provide an apparatus for monitoring the position of a wafer, the apparatus comprising:

[0006] A storage module with an open top, the storage module comprising a multi-layered, equally spaced support group consisting of strip-shaped support members arranged in two vertical columns; wherein each support group comprises two support members in the same horizontal plane, and the wafer is supported by abutting against two support members in different columns;

[0007] At least four sets of monitoring modules are evenly arranged radially around the outer periphery of the storage module, and the monitoring modules are used to monitor whether the position of the wafer in the storage module is abnormal;

[0008] The monitoring module is capable of emitting laser signals and receiving laser signals emitted by adjacent monitoring modules. When the laser signals received by the monitoring modules are inconsistent, the wafer position is determined to be abnormal.

[0009] Secondly, embodiments of the present invention provide a final polishing apparatus, the final polishing apparatus comprising:

[0010] Polishing head;

[0011] Adsorption pad;

[0012] Polishing disc;

[0013] Polishing pads attached to the polishing disc;

[0014] The apparatus for monitoring wafer position as described in any one of claims 1 to 7;

[0015] A robotic arm for gripping a wafer in a storage module of the device for monitoring wafer position according to any one of claims 1 to 7 and transferring it to the adsorption pad.

[0016] This invention provides a device for monitoring wafer position and a final polishing equipment; by monitoring wafers with abnormal positions in real time, the position of wafers with abnormal positions can be improved before wafer transfer, which greatly reduces the risk of equipment downtime and avoids wafers falling or even breaking. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the final polishing equipment in a conventional technical solution.

[0018] Figure 2 This is a schematic diagram illustrating an incorrect placement method of a wafer in a wafer cassette according to an embodiment of the present invention;

[0019] Figure 3 A schematic diagram of a device for monitoring wafer position provided in an embodiment of the present invention;

[0020] Figure 4 A top view schematic diagram of a device for monitoring wafer position provided in an embodiment of the present invention;

[0021] Figure 5 A schematic diagram illustrating the composition of the monitoring module provided in an embodiment of the present invention;

[0022] Figure 6 A schematic diagram of another device for monitoring wafer position provided in an embodiment of the present invention;

[0023] Figure 7 This is a schematic diagram illustrating the monitoring process of the wafer by the monitoring module provided in an embodiment of the present invention;

[0024] Figure 8 This is a schematic diagram of the composition of a final polishing device provided in an embodiment of the present invention. Detailed Implementation

[0025] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0026] In semiconductor manufacturing, robotic arms are typically used to transfer wafers between chambers, or to pick up wafers from wafer cassettes and place them at designated processing locations for a specific process. For example, in the final polishing process, see [link to documentation]. Figure 1 The diagram illustrates the components of a conventional Finish Polishing (FP) apparatus 100, which specifically includes: a polishing head 101, an adsorption pad 102, a polishing slurry supply line 103, a polishing disk 104, a polishing pad 105 attached to the polishing disk 104, a first drive shaft 106, and a second drive shaft 107. When performing final polishing on a wafer W using the FP apparatus 100, with the adsorption pad 102 adsorbed to the back of the wafer W, a certain flow rate of polishing slurry is supplied to the polishing pad 105 through the polishing slurry supply line 103. Once the polishing slurry is supplied to the polishing pad 105 and comes into contact with the wafer W, the first drive shaft 106 and the second drive shaft 107 respectively drive the polishing disk 104 and the polishing head 101 to rotate relative to each other. The polishing head 101 applies pressure to the wafer W to complete the final polishing operation of the silicon wafer W. In the final polishing process, a robotic arm 108 is typically used to grip the wafer W placed in the wafer cassette 110 at the loading end 109 and cause the wafer W to adhere to the polishing pad 102, thereby performing the final polishing of the wafer W.

[0027] However, in the process preceding the final polishing process, when loading wafer W into wafer cassette 110, the following may occur: Figure 2 The phenomenon shown is that the wafers W are not parallel to each other on the corresponding support groups in the wafer cassette 110, but rather... Figure 2 The wafer W is misplaced. When the wafer W is misplaced, the robotic arm 108 may cause the wafer W to fall or even break during the process of reaching into and picking up the wafer W from the front of the wafer box 110.

[0028] Based on the above explanation, see Figure 3 and Figure 4 This illustrates the composition of a wafer position monitoring device 300 provided in an embodiment of the present invention, the device 300 comprising:

[0029] A storage module 301 with an open opening includes a multi-layered support member group 3011 composed of strip-shaped support members arranged in two vertical columns at equal intervals; wherein... Figure 3Nine support groups 3011 are illustrated exemplarily. Each support group 3011 includes two supports 3011-A and 3011-B on the same horizontal plane. The wafer W is supported by abutting against the two supports 3011-A and 3011-B in different columns. More specifically, the wafer W may be supported, or properly supported, by two supports 3011-A and 3011-B on the same horizontal plane (e.g., two supports 3011-A5 and 3011-B5 in support group 3011), as shown in... Figure 3 The third wafer W (counting from bottom to top) located in the middle of storage module 301 may also be supported by two supports 3011-A and 3011-B located on different horizontal planes, or in other words, it may be incorrectly supported, such as in... Figure 3 The fifth wafer W (counting from bottom to top) in the storage module 301 is supported by two supports 3011-A7 and 3011-B9, which are vertically spaced by a support group 3011.

[0030] At least four sets of monitoring modules 302 are evenly arranged radially around the outer periphery of the storage module 301. The monitoring modules 302 are used to monitor whether the position of the wafer W in the storage module 301 is abnormal.

[0031] The monitoring module 302 is capable of emitting laser signals and receiving laser signals emitted by adjacent monitoring modules 302. When there is inconsistency in the laser signals received by the monitoring module 302, the wafer W is determined to be in an abnormal position.

[0032] It should be noted that in this embodiment of the invention, only four sets of monitoring modules 302 are shown in the device 300, but in the actual implementation, more than four sets of monitoring modules 302 can be set according to specific needs.

[0033] In addition, such as Figure 4 As shown, the laser signal in the monitoring module 302 propagates in a straight line so that adjacent monitoring modules 302 can receive the laser signals emitted by each other.

[0034] for Figure 3 The device 300 shown, in some possible implementations, such as Figure 5 As shown, the monitoring module 302 includes:

[0035] Two laser sensors 3021 are set at a predetermined horizontal angle, and the laser sensors 3021 are used to receive laser signals;

[0036] A laser emitter 3022 is respectively disposed at the front end of each of the laser sensors 3021, and the laser emitter 3022 is used to emit the laser signal;

[0037] The lifting unit 3023 is used to drive the laser sensor 3021 and the laser generator 3022 to move up and down in the vertical direction.

[0038] It should be noted that, in specific implementation, for example, when four sets of monitoring modules are set, in order for the two laser sensors 3021 in each set of monitoring modules 302 to receive the laser signals emitted by the laser generators 3022 in the adjacent monitoring modules 302, the horizontal angle between the two laser sensors 3021 in each set of monitoring modules 302 is set to 90 degrees. Understandably, when the number of monitoring modules 302 changes, the horizontal angle between the two laser sensors 3021 in each set of monitoring modules 302 will also change accordingly.

[0039] Regarding the above implementation method, in some examples, such as Figure 4 As shown, the laser generator 3022 is configured to emit a laser signal ( Figure 4 (As shown by the dashed line in the diagram) the laser signal can pass through the interior of the storage module 301 and can be blocked by the wafer W. Understandably, the storage module 301 typically has a certain wall thickness. To ensure that the laser signal can accurately monitor the position of the wafer W without being affected by the storage module 301 itself, in this embodiment of the invention, the laser generator 3022 is configured such that the laser signal it emits can pass through the interior of the storage module 301. Furthermore, it should be noted that since the monitoring modules 302 are uniformly arranged in this embodiment of the invention, even if the wafer W is in an abnormal position, it can still be ensured that the laser signal emitted by the laser generator 3022 in the monitoring module 302 will be blocked by the wafer W.

[0040] for Figure 3 The device 300 shown, in some possible implementations, such as Figure 6 As shown, the device 300 also includes a control module 303, which is connected to the lifting unit 3023 in the monitoring module 302. The control module 303 controls the monitoring module 302 to move synchronously up and down in the vertical direction so that the monitoring module 302 always remains at the same horizontal position. Understandably, in this embodiment of the invention, the position of the wafer W is determined by whether multiple monitoring modules 302 can receive laser signals from each other. Therefore, in the specific implementation process, it is first necessary to ensure that all monitoring modules 302 are at the same horizontal position.

[0041] In some examples of the above implementation, the control module 303 controls the monitoring module 302 to move a predetermined first distance vertically upwards or downwards so that after each movement, the monitoring module 302 is positioned in the middle of two vertically adjacent support groups 3011.

[0042] For example, such as Figure 7 As shown, when the monitoring module 302 is in the middle position of two vertically adjacent support groups 3011 after each movement, for example, when the monitoring module 302 is between support groups 3011-5 and 3011-6 after the movement, if the positions of the two wafers W that are respectively abutted by support groups 3011-5 and 3011-6 do not change abnormally, then the laser signals emitted by each laser generator 3022 in the monitoring module 302 can pass through the gap between the two wafers W and be received by the corresponding laser sensors 3021. That is to say, all laser sensors 3021 will receive laser signals at this time, and the laser signals received by the monitoring module are consistent.

[0043] Conversely, for example, if the moved monitoring module 302 is located between support components 3011-2 and 3011-3, then if at this time... Figure 7 If the position of the supported assembly 3011-2 abutting the wafer W is abnormal, then at this time... Figure 4 As shown, due to the obstruction of the tilted wafer W, the monitoring modules 302-1 and 302-2 on the left cannot receive the laser signals emitted by the monitoring modules 302-3 and 302-4 on the right. However, the monitoring modules 302-1 and 302-2 on the left can receive the laser signals emitted by each other, and the monitoring modules 302-3 and 302-4 on the right can also receive the laser signals emitted by each other. In other words, there is an inconsistency in the laser signals received by the monitoring module 302 at this time.

[0044] In some examples of the above implementation, the control module 303 controls the monitoring module 302 to move a set second distance vertically upwards or downwards so that the monitoring module 302 is aligned with the wafer W after each movement.

[0045] For example, such as Figure 7 As shown, when the monitoring module 302 is aligned with the wafer W to be monitored after each movement, for example, when the monitoring module 302 is aligned with the wafer W placed on the support assembly 3011-5, if the position of the wafer W abutted by the support assembly 3011-5 does not change, the laser signals emitted by each laser generator 3022 in the monitoring module 302 will be blocked by the wafer W abutted by the support assembly 3011-5, so that the corresponding laser sensors 3021 cannot receive the laser signal. In other words, the laser signals received by the monitoring module 302 are consistent at this time.

[0046] Conversely, in monitoring Figure 7When the monitoring module 302 moves to the support assembly 3011-2, and the second wafer W (counting from bottom to top) is in position, each laser generator 3022 emits a laser signal. Because the position of the second wafer W is abnormal, at this time... Figure 4 The laser sensors 3021-2 and 3021-3 in the monitoring modules 302-1 and 302-2 on the left, and the laser sensors 3021-6 and 3021-7 in the monitoring modules 302-3 and 302-4 on the right, can all receive laser signals. However, the laser sensors 3021-1 and 3021-4 in the monitoring modules 302-1 and 302-2 on the left, and the laser sensors 3021-5 and 3021-6 in the monitoring modules 302-3 and 302-4 on the right, cannot receive laser signals from each other. In other words, the laser signals received by the monitoring module 302 are inconsistent.

[0047] for Figure 3 The device 300 shown, in some possible implementations, such as Figure 4 As shown, the device 300 further includes an alarm module 304; the alarm module 304 is connected to the laser sensor 3021 in the monitoring module 302; wherein,

[0048] The alarm module 304 is configured to issue an alarm signal when an abnormality is detected at the position of wafer W in the storage module 301.

[0049] Understandably, when there is an inconsistency in the laser signals received by the laser sensors 3021 in all monitoring modules 302, the alarm module 304 is triggered to remind the process personnel to check the wafers W in the storage module 301 and adjust the positions of the wafers W with abnormal positions; at the same time, the alarm module 304 is triggered to generate an early warning, reducing equipment alarms caused by human factors and improving production efficiency.

[0050] The device 300 provided in this embodiment of the invention can improve the position of wafer W before the robotic arm 108 picks it up by real-time monitoring of wafer W with abnormal position, greatly reducing the risk of equipment downtime and preventing wafer W from falling or even breaking. Secondly, in this embodiment of the invention, the device 300 is located on the outer periphery of the storage module 301, so it will not cause contamination to the inside of the storage module 301 during implementation, and also ensures the cleanliness of the surface of wafer W. Finally, during implementation, the device 300 can monitor the wafer W in the storage module 301 multiple times to minimize the risk of wafer W breaking, reducing production costs while improving production efficiency.

[0051] See Figure 8 This illustration shows a final polishing apparatus 800 provided in an embodiment of the present invention, the final polishing apparatus 800 comprising:

[0052] Polishing head 101;

[0053] Adsorption pad 102;

[0054] Polishing pad 104;

[0055] Polishing pad 105 attached to the polishing disc;

[0056] The device 300 for monitoring wafer position according to any one of claims 1 to 7;

[0057] Robotic arm 108, the robotic arm 108 being used to grip the wafer W in the storage module 301 of the device 300 for monitoring wafer position according to any one of claims 1 to 7 and transfer it to the adsorption pad 102.

[0058] It should be noted that the technical solutions described in the embodiments of the present invention can be combined arbitrarily without conflict.

[0059] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A device for monitoring wafer position, characterized in that, The device includes: A storage module with an open top, the storage module comprising a multi-layered, equally spaced support group consisting of strip-shaped support members arranged in two vertical columns; wherein each support group comprises two support members in the same horizontal plane, and the wafer is supported by abutting against two support members in different columns; At least four sets of monitoring modules are evenly arranged radially around the outer periphery of the storage module, and the monitoring modules are used to monitor whether the position of the wafer in the storage module is abnormal; The monitoring module is capable of emitting laser signals and receiving laser signals emitted by adjacent monitoring modules to form a ring monitoring link around the storage module. When the laser signals received by the monitoring modules are inconsistent, the wafer position is determined to be abnormal.

2. The apparatus of claim 1, wherein, The monitoring module includes: Two laser sensors are set at a predetermined horizontal angle, and the laser sensors are used to receive laser signals; A laser emitter is respectively disposed at the front end of each of the laser sensors, and the laser emitter is used to emit the laser signal; A lifting unit is provided to drive the laser sensor and the laser generator to move up and down in the vertical direction.

3. The apparatus of claim 2, wherein, The laser generator in each of the monitoring modules is configured to emit laser signals that can pass through the interior of the storage module and be blocked by the wafer.

4. The apparatus of claim 1, wherein, The device also includes a control module, which is connected to the lifting unit in the monitoring module and is used to control the monitoring module to move up and down synchronously in the vertical direction so that the monitoring module always remains at the same horizontal position.

5. The apparatus according to claim 4, characterized in that, The control module controls the monitoring module to move vertically upwards or downwards by a predetermined first distance, so that after each movement the monitoring module is positioned in the middle of two vertically adjacent support groups.

6. The apparatus of claim 4, wherein, The control module controls the monitoring module to move vertically upwards or downwards by a predetermined second distance so that the monitoring module is aligned with the wafer after each movement.

7. The apparatus of claim 1, wherein, The device further includes an alarm module; the alarm module is connected to the laser sensor in the monitoring module; wherein... The alarm module is configured to issue an alarm signal when an abnormality is detected in the wafer position of the storage module.

8. A final polishing apparatus characterized by comprising: The final polishing equipment includes: Polishing head; Adsorption pad; Polishing disc; Polishing pads attached to the polishing disc; The apparatus for monitoring wafer position as described in any one of claims 1 to 7; A robotic arm for gripping a wafer in a storage module of the device for monitoring wafer position according to any one of claims 1 to 7 and transferring it to the adsorption pad.

Images