An inter-chip wire bonding process apparatus for deep cavity devices

Abstract

This invention belongs to the field of integrated circuit device manufacturing and relates to a wire bonding process equipment for deep cavity devices. It includes a marble reference platform, on which a motion platform is set. The platform includes a Y-axis moving guide rail mounting base, a Y-axis moving platform guide rail mounted on the Y-axis moving guide rail mounting base, a Y-axis moving slider mounted on the Y-axis moving platform guide rail, an X-axis moving guide rail mounting base on the top surface of the Y-axis moving slider, an X-axis moving platform guide rail suspended on the X-axis moving guide rail mounting base, an X-axis moving slider mounted on the X-axis moving platform guide rail, and a Z-axis connecting plate fixed on the X-axis moving slider. This invention has a simple structure, is easy to implement, occupies little space, improves the bonding accuracy of the wire bonding process equipment, and can complete the wire bonding process within the cavity of an integrated circuit device with a certain depth, thus expanding the applicability of the wire bonding process equipment.

Description

Technical Field

[0001] This invention relates to integrated circuit device manufacturing equipment, and particularly to an inter-chip wire bonding process equipment for deep cavity devices. Background Technology

[0002] Wire bonding equipment is primarily used for wire interconnection processes in integrated circuit device manufacturing. It completes wire interconnection bonding between chips and between chips and substrates, enabling packages to possess superior high-frequency and flexible circuit characteristics. This effectively improves the reliability and flexibility of circuit, component, or system assembly and interconnection. Wire bonding equipment mainly consists of four parts: the first part is a motion platform capable of four-axis (X, Y, Z, θ) movement; the second part is a vision system fixed on the motion platform, aligning the bonding chip and pads; the third part is the bonding head mechanism that performs wire bonding; and the fourth part is a heating platform that heats the device. The working principle of the wire bonding equipment is as follows: the vision system aligns the chip or substrate pads on the device placed on the heating platform; the motion platform drives the bonding head mechanism to the aligned chip or substrate pad position, initiating the wire bonding step and completing the wire bonding process.

[0003] Existing wire bonding equipment uses a vision system and bonding head mechanism fixed on a motion platform. However, due to space constraints, they are mounted on two independent guide rails, making it impossible to guarantee that they remain parallel during operation. When the device height varies, there is a difference between the position obtained by the vision system and the position reached by the bonding head, failing to achieve the "align and bond" effect. Visual calibration at different heights is required, which is a cumbersome process. Furthermore, the existing wire bonding equipment uses a 45-degree wire feed mechanism with a 45-degree wire clamp installed behind the bonding cutter, which cannot reach into the cavity of integrated circuit devices with sufficient depth to complete the wire bonding process. Summary of the Invention

[0004] Therefore, the purpose of this invention is to provide a wire bonding process equipment for deep cavity devices, which solves the problem of positional differences between the vision system and the bonding head at different heights, and can complete the wire bonding process within the cavity of an integrated circuit device with a certain depth.

[0005] To achieve the above objectives, the following technical solution is adopted:

[0006] An inter-chip wire bonding process apparatus for deep cavity devices includes a marble reference platform and a motion platform set on the marble reference platform;

[0007] A motion platform includes a Y-axis moving guide rail mounting base, on which a Y-axis moving platform guide rail is mounted. A Y-axis moving slider is provided on the Y-axis moving platform guide rail. An X-axis moving guide rail mounting base is provided on the top surface of the Y-axis moving slider. An X-axis moving platform guide rail is suspended on the X-axis moving guide rail mounting base. An X-axis moving slider is provided on the X-axis moving platform guide rail. A Z-axis connecting plate is fixed on the X-axis moving slider. A Z-axis motion plate is connected to the Z-axis connecting plate through a cross roller guide rail. A cross roller collar and a vision system are fixed on the Z-axis motion plate to realize θ-axis motion perpendicular to the plane formed by the X and Y directions.

[0008] The vision system includes a vision mount, a camera, a lens, and a light source. The lens is fixed to the vision mount by an internal hexagon head screw. The camera's threaded interface is connected to the lens's threaded interface. The light source is fixed to a cross roller collar. A bonding head mechanism for wire bonding is fixed on the cross roller collar. When the cross roller collar rotates at 0°, the bonding head mechanism and the vision system are relatively stationary regardless of the motion platform's movement in the X, Y, or Z directions.

[0009] As a further improvement of the present invention, the bonding head mechanism includes a leaf spring assembly for applying bonding pressure. The leaf spring assembly includes a voice coil motor and a leaf spring. The stator of the voice coil motor and one end of the leaf spring are fixed on the fixed plate of the bonding head mechanism, and the mover of the voice coil motor and the other end of the leaf spring are connected to the ultrasonic transducer assembly.

[0010] As a further improvement of the present invention, the ultrasonic transducer assembly includes a transducer, a bonding wedge, a bonding lead wire, and a 90-degree wire feed clamp. The bonding wedge passes through a vertical small hole at the tip of the transducer and is locked by a flat-end set screw. The 90-degree wire feed clamp is fixed behind the bonding wedge, and the bonding lead wire passes through the gap formed by the bonding wedge and the 90-degree wire feed clamp.

[0011] As a further improvement of the present invention, a heating platform is fixedly installed on the marble reference platform. A heating tube and a thermocouple are arranged inside the heating platform. The heating tube realizes the heating of the heating platform, and the thermocouple provides temperature feedback, thus realizing precise temperature control of the heating platform. There is a negative pressure hole in the middle of the heating platform, which can realize the adsorption and fixation of the bonded deep cavity device.

[0012] The beneficial effects of this invention are:

[0013] This invention has a simple structure, is easy to implement, occupies little space, improves the bonding accuracy of wire bonding equipment, and can complete the wire bonding process in the cavity of an integrated circuit device with a certain depth, thus expanding the applicability of the wire bonding equipment. Attached Figure Description

[0014] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0015] Figure 1 This is a schematic diagram of the structure of the present invention;

[0016] Figure 2 This is a schematic diagram of the motion platform in this invention;

[0017] Figure 3 This is a schematic diagram of the vision system in this invention;

[0018] Figure 4 This is a schematic diagram of the bonding head mechanism in this invention;

[0019] Figure 5 This is a schematic diagram of the heating platform structure in this invention. Detailed Implementation

[0020] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0021] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0022] Please refer to Figure 1-5 A chip-to-chip wire bonding process device for deep cavity devices includes a marble reference platform (1), and a motion platform 2 is set on the marble reference platform 1. The motion platform 2 includes a Y-direction moving guide rail mounting base 6, a Y-direction moving platform guide rail 7 is mounted on the Y-direction moving guide rail mounting base 6, a Y-direction moving slider 8 is set on the Y-direction moving platform guide rail 7, an X-direction moving guide rail mounting base 9 is set on the top surface of the Y-direction moving slider 8, an X-direction moving platform guide rail 10 is suspended on the X-direction moving guide rail mounting base 9, an X-direction moving slider 11 is set on the X-direction moving platform guide rail 10, a Z-direction moving slider 12 is fixed on the X-direction moving slider 11, a Z-direction moving plate 14 is connected to the Z-direction connecting plate 12 through a cross roller guide rail 13, and a cross roller collar 15 and a vision system 3 are fixed on the Z-direction moving plate 14 to realize θ-axis movement perpendicular to the plane formed by the X and Y directions.

[0023] The vision system 3 includes a vision mount 16, a camera 17, a lens 18, and a light source 19. The lens 18 is fixed to the vision mount 16 by a hexagon socket head cap screw. The camera 17 has a threaded interface that connects to the threaded interface of the lens 18. The light source 19 is fixed to a cross roller collar 15. A bonding head mechanism 4 for wire bonding is fixed on the cross roller collar 15. When the cross roller collar 15 rotates at 0°, the bonding head mechanism 4 and the vision system 3 remain relatively stationary regardless of the movement of the motion platform in the X, Y, or Z directions. This means that the bonding head mechanism 4 can bond to the same position as the vision system 3.

[0024] The bonding head mechanism 4 includes a leaf spring assembly for applying bonding pressure. The leaf spring assembly includes a voice coil motor 20 and a leaf spring 21. The stator of the voice coil motor 20 and one end of the leaf spring 21 are fixed to the fixed plate of the bonding head mechanism 4, and the mover of the voice coil motor 21 and the other end of the leaf spring 21 are connected to the ultrasonic transducer assembly.

[0025] The ultrasonic transducer assembly includes a transducer 22, a bonding wedge 23, bonding leads 24, and a 90-degree wire feed clamp 25. The bonding wedge 23 passes through a vertical hole at the tip of the transducer 22 and is locked by a flat-end set screw. The 90-degree wire feed clamp 25 is fixed behind the bonding wedge 23. The bonding leads 24 pass through the gap formed by the bonding wedge 23 and the 90-degree wire feed clamp 25. The voice coil motor 20 can apply an upward or downward force, which, together with the leaf spring 21, provides the bonding pressure required for the bonding leads of the bonding wedge 23 to bond. The transducer converts electrical signals into mechanical vibrations, and ultrasonic energy is transmitted to the bonding wedge 23, causing the bonding wedge 23 to drive the bonding leads 24 to rub against the pads of the chip or substrate, and finally bond them together. The 90-degree wire feed clamp 25 is very small and is close to the bonding wedge 23. Therefore, during wire bonding, the 90-degree wire feed clamp 25 can be inserted into the cavity of the integrated circuit device with a certain depth along with the bonding wedge 23 to complete the wire bonding process.

[0026] A heating platform 5 is fixedly installed on the marble reference platform 1. A heating tube 26 and a thermocouple 27 are arranged inside the heating platform 5. The heating tube 26 heats up the heating platform 5, and the thermocouple 27 provides temperature feedback, thus achieving precise temperature control of the heating platform 5. There is a negative pressure hole 28 in the middle of the heating platform 5, which can be used to adsorb and fix the bonded deep cavity device.

[0027] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An inter-chip wire bonding process apparatus for deep cavity devices, comprising a marble reference platform (1), characterized in that, A motion platform (2) is set on a marble reference platform (1); The motion platform (2) includes a Y-axis moving guide rail mounting base (6), on which a Y-axis moving platform guide rail (7) is mounted, and a Y-axis moving slider (8) is provided on the Y-axis moving platform guide rail (7). An X-axis moving guide rail mounting base (9) is provided on the top surface of the Y-axis moving slider (8). An X-axis moving platform guide rail (10) is suspended on the X-axis moving guide rail mounting base (9). An X-axis moving slider (11) is provided on the X-axis moving platform guide rail (10). A Z-axis connecting plate (12) is fixed on the X-axis moving slider (11). A Z-axis moving plate (14) is connected to the Z-axis connecting plate (12) via a cross roller guide rail (13). A cross roller collar (15) and a vision system (3) are fixed on the Z-axis moving plate (14) to realize θ-axis movement perpendicular to the plane formed by the X and Y directions. The vision system (3) includes a vision mount (16), a camera (17), a lens (18), and a light source (19). The lens (18) is fixed to the vision mount (16) by a hexagon socket head cap screw. The camera (17) has a threaded interface that is connected to the threaded interface of the lens (18). The light source (19) is fixed to a cross roller collar (15). A bonding head mechanism (4) for wire bonding is fixed on the cross roller collar (15). When the cross roller collar (15) rotates at 0°, the bonding head mechanism (4) and the vision system (3) are relatively stationary regardless of whether the motion platform moves in the X, Y, or Z directions.

2. The inter-chip wire bonding process equipment for deep cavity devices according to claim 1, characterized in that, The bonding head mechanism (4) includes a leaf spring assembly for applying bonding pressure. The leaf spring assembly includes a voice coil motor (20) and a leaf spring (21). The stator of the voice coil motor (20) and one end of the leaf spring (21) are fixed on the fixing plate of the bonding head mechanism (4). The mover of the voice coil motor (21) and the other end of the leaf spring (21) are connected to the ultrasonic transducer assembly.

3. The inter-chip wire bonding process equipment for deep cavity devices according to claim 2, characterized in that, The ultrasonic transducer assembly includes a transducer (22), a bonding wedge (23), a bonding lead (24), and a 90-degree wire feed clamp (25). The bonding wedge (23) passes through a vertical hole at the tip of the transducer (22) and is locked by a flat-end set screw. The 90-degree wire feed clamp (25) is fixed behind the bonding wedge (23). The bonding lead (24) passes through the gap formed by the bonding wedge (23) and the 90-degree wire feed clamp (25).

4. The inter-chip wire bonding process equipment for deep cavity devices according to claim 1, characterized in that, A heating platform (5) is fixedly installed on the marble reference platform (1). A heating tube (26) and a thermocouple (27) are arranged inside the heating platform (5). The heating tube (26) heats up the heating platform (5), and the thermocouple (27) provides temperature feedback, thus achieving precise temperature control of the heating platform (5). There is a negative pressure hole (28) in the middle of the heating platform (5), which can be used to adsorb and fix the bonded deep cavity device.

Images