Camera module and optical device comprising the same

Abstract

Embodiments disclose a camera module and an optical device including the same. The camera module of embodiments includes a lens barrel, a holder, a filter disposed in the holder, a circuit board having an opening, a reinforcement including a first region corresponding to the opening and a second region disposed with the circuit board, and an image sensor disposed in the first region of the reinforcement, wherein the first region of the reinforcement includes a protrusion more protruding than the second region of the reinforcement, and the image sensor is disposed on an upper surface of the protrusion.

Description

[0001] This case is a divisional application, the parent application being the application filed on March 18, 2019, with application number 201980034275.8 and invention title "Camera Module and Optical Device Including the Camera Module". Technical Field

[0002] The embodiments relate to a camera module and an optical device including the camera module. Background Technology

[0003] The technology of voice coil motors (VCMs) used in conventional general-purpose camera modules is difficult to apply to miniature camera modules designed to demonstrate low power consumption, and related research has been actively carried out.

[0004] When a camera module is configured to be installed in a small electronic device such as a smartphone, the camera module may be frequently subjected to vibration during use, and may experience minor shaking due to, for example, the user's hand tremor when capturing an image. In view of this fact, techniques have recently been developed to additionally install devices to suppress the transmission of hand tremors to the camera module. Summary of the Invention

[0005] Technical issues

[0006] The embodiments provide a camera module and optical device that can improve optical performance, ensure the reliability of wiring connections between the printed circuit board and the image sensor, and enhance the bonding force between the reinforcement and the image sensor.

[0007] Technical solution

[0008] The camera module according to an embodiment may include: a lens barrel; a retainer; a filter disposed in the retainer; a printed circuit board having an opening therein; a reinforcement including a first region corresponding to the opening and a second region on which the printed circuit board is disposed; and an image sensor disposed in the first region of the reinforcement. The first region of the reinforcement may include a protrusion that protrudes more than the second region of the reinforcement, and the image sensor may be disposed on the upper surface of the protrusion.

[0009] The height from the lower surface of the reinforcing member to the upper surface of the protrusion can be less than the height to the upper surface of the printed circuit board mounted on the reinforcing member.

[0010] The protrusions may include a plurality of protrusions spaced apart from each other. The camera module may further include an adhesive member disposed in the space between the upper surface of the plurality of protrusions and the lower surface of the image sensor, and in the space between the plurality of protrusions.

[0011] The thickness of an image sensor can be less than the thickness of a printed circuit board.

[0012] The camera module may further include a first adhesive member disposed between a second region of the reinforcement and a lower surface of the printed circuit board. The first adhesive member may include an opening corresponding to an opening in the printed circuit board.

[0013] Additionally, the camera module may further include a second adhesive member disposed between the upper surface of the protrusion and the lower surface of the image sensor. The second adhesive member may be located at a higher position than the first adhesive member.

[0014] The printed circuit board may include a first terminal, and the image sensor may include a second terminal. The camera module may further include wiring connecting the first terminal to the second terminal.

[0015] The ratio of the first height from the upper surface of the second region of the reinforcing member to the upper surface of the protrusion to the second height from the lower surface of the reinforcing member to the upper surface of the second region of the reinforcing member can be from 1:0.67 to 1:2.1.

[0016] According to another embodiment, the camera module may include: a lens barrel; a retainer; a filter disposed in the retainer; a printed circuit board having an opening therein; a reinforcement including a first region corresponding to the opening and a second region on which the printed circuit board is disposed; and an image sensor disposed in the first region of the reinforcement. The first region of the reinforcement may include a cavity that is more recessed than the second region of the reinforcement, and the image sensor may be disposed on the bottom surface of the cavity.

[0017] According to another embodiment, the camera module may include: a lens barrel; a retainer; a filter disposed in the retainer; a printed circuit board having an opening therein; a reinforcement including a first region corresponding to the opening and a second region on which the printed circuit board is disposed; an image sensor disposed in the first region of the reinforcement; and an adhesive member including a first adhesive member disposed between the first region of the reinforcement and the image sensor, and a second adhesive member disposed between the second region of the reinforcement and the printed circuit board. The first adhesive member and the second adhesive member may be connected to each other.

[0018] Beneficial effects

[0019] The embodiments can improve the optical performance of the camera module, ensure the reliability of the wiring connection between the printed circuit board and the image sensor, and improve the bonding force between the reinforcement and the image sensor. Attached Figure Description

[0020] Figure 1 This is an exploded perspective view of the camera module according to an embodiment.

[0021] Figure 2 yes Figure 1 A cross-sectional view of an embodiment of the camera module.

[0022] Figure 3 yes Figure 2 An enlarged view of the portion indicated by the dashed line.

[0023] Figure 4a This is a perspective view of the reinforcement according to another embodiment.

[0024] Figure 4b This is a perspective view of the reinforcement according to yet another embodiment.

[0025] Figure 5 It shows Figure 4a The reinforcement components, image sensor, and printed circuit board.

[0026] Figure 6 An image sensor and printed circuit board disposed on a reinforcement member according to yet another embodiment are shown.

[0027] Figures 7a to 7e It shows the formation Figure 6 Methods for strengthening components.

[0028] Figure 8 This is an exploded perspective view of a camera module according to another embodiment.

[0029] Figure 9 yes Figure 8 Cross-sectional view of the reinforcement, image sensor and printed circuit board.

[0030] Figures 10a to 10d It shows that Figure 9 The process of coupling the reinforcing member, image sensor, printed circuit board and adhesive components is shown.

[0031] Figure 11 This illustrates the wiring connection between the printed circuit board and the image sensor when there are areas without adhesive filling.

[0032] Figure 12 It shows the relationship with the Figure 11 The height difference caused by the warping of the printed circuit board shown, and the height difference caused by... Figure 9 Simulation results related to the height difference caused by the warping of the printed circuit board. Figure 11 The warping of the printed circuit board shown is caused by the forces applied to it during wiring bonding. Figure 9 The warping of the printed circuit board is caused by the force applied to it during in-line bonding.

[0033] Figure 13 yes Figure 8 Cross-sectional views of other embodiments of the reinforcing members, image sensors, and printed circuit boards.

[0034] Figure 14a and Figure 14b It shows that Figure 13 The process of coupling the reinforcing member, image sensor, printed circuit board and adhesive components is shown.

[0035] Figure 15 This is a perspective view of a portable terminal according to an embodiment.

[0036] Figure 16 This is a structural diagram of the portable terminal shown in Figure 14. Detailed Implementation

[0037] In the following description, embodiments of the present disclosure that can specifically achieve the above objectives will be described with reference to the accompanying drawings.

[0038] In the following description of the embodiments, it will be understood that when each element is referred to as being "on" or "under" another element, it may be directly on or under the other element, or it may be indirectly formed such that one or more intermediate elements are also present. Additionally, when an element is referred to as being "on" or "under," the element may include both "under" and "on" the element.

[0039] Furthermore, the relational terms “first,” “second,” “upper,” “lower,” and “below” used herein are used only to distinguish one subject or element from another and do not necessarily require or relate to any physical or logical relationship or order between these subjects or elements. Wherever possible, the same reference numerals will be used to refer to the same parts in all figures.

[0040] Furthermore, the terms “comprising,” “including,” and “having” as described herein should not be construed as excluding other elements, but rather as further including those other elements, since the corresponding elements may be inherent unless otherwise specified. Additionally, the term “corresponding to” as used herein may cover at least one of the meanings of “facing” and “overlapping.”

[0041] In the following description, a camera module according to an embodiment and an optical device including the camera module will be described with reference to the accompanying drawings. For ease of description, a Cartesian coordinate system (x, y, z) will be used to describe the camera module according to the embodiment; however, the embodiment is not limited to this, and other coordinate systems may be used. In the various figures, the x-axis and y-axis may be directions perpendicular to the z-axis (the z-axis is the direction of the optical axis (OA)). The z-axis direction, which is the direction of the optical axis (OA), may be referred to as the "first direction," the x-axis direction may be referred to as the "second direction," and the y-axis direction may be referred to as the "third direction."

[0042] The "shake compensation function" used in small camera modules of mobile devices such as smartphones or tablets can be a function that moves the lens in a direction perpendicular to the optical axis or tilts the lens relative to the optical axis to eliminate vibration (or movement) caused by the user's hand tremor.

[0043] In addition, the "autofocus function" can be a function that automatically focuses on the object by moving the lens in the optical axis direction according to the distance to the object, so that the image sensor can obtain a clear image of the object.

[0044] Figure 1 This is an exploded perspective view of the camera module 200 according to an embodiment. Figure 2 yes Figure 1 A cross-sectional view of an embodiment of the camera module 200. Figure 3 yes Figure 2 An enlarged view of the portion indicated by the dashed line 15 in the image.

[0045] refer to Figures 1 to 3 The camera module 200 may include a lens or lens barrel 400, a lens moving device 100, a filter 610, a holder 600, a printed circuit board 800, a reinforcing member 900, and an image sensor 810. Here, "camera module" may be referred to as "image capturing device" or "image capturing device", and the holder 600 may be referred to as sensor base.

[0046] Additionally, the camera module 300 may further include a blocking member 1500 disposed on the filter 610.

[0047] Additionally, the camera module 300 may further include an adhesive member 612.

[0048] Additionally, the camera module 300 may further include a motion sensor 820, a controller 830, and a connector 840.

[0049] The lens or lens barrel 400 can be installed in the spool 110 of the lens moving device 100.

[0050] The lens moving device 100 can move the lens or lens barrel 400.

[0051] Camera module 200 can be either an autofocus (AF) camera module or an optical image stabilizer (OIS) camera module. An AF camera module is a camera module configured to perform only autofocus function, and an OIS camera module is a camera module configured to perform both autofocus and optical image stabilizer (OIS) functions.

[0052] For example, the lens mobile device 100 can be an AF lens mobile device or an OIS lens mobile device, and the meanings of "AF" and "OIS" can be the same as those in the AF camera module and the OIS camera module.

[0053] For example, the lens mobile device 100 of the camera module 200 can be an OIS lens mobile device.

[0054] The lens moving device 100 may include: a housing 140; a spool 110 disposed in the housing 140 for mounting a lens or lens barrel 400 thereon; a first coil 120 disposed at the spool 110; a magnet 130 disposed in the housing 140 facing the first coil 120; at least one upper elastic member (not shown) coupled to the upper portion of the spool 110 and the upper portion of the housing 140; at least one lower elastic member (not shown) coupled to the lower portion of the spool 110 and the lower portion of the housing 140; a second coil 230 disposed below the spool 110 (and / or the housing 140); a printed circuit board 250 disposed below the second coil 230; and a base 210 disposed below the printed circuit board 250.

[0055] Additionally, the lens moving device 100 may further include a cover member 300 coupled to the base 210 to provide space for accommodating components of the lens moving device 100 together with the base 210.

[0056] Additionally, the lens moving device 100 may further include a support member (not shown) that electrically connects the printed circuit board 250 to the upper elastic member and supports the housing 140 relative to the base 210. Each of the first coil 120 and the second coil 230 may be electrically connected to the printed circuit board 250 and may receive a drive signal (drive current) from the printed circuit board 250.

[0057] For example, the upper elastic member may include multiple upper springs, the support member may include a support member connected to the upper springs, and the first coil 120 may be electrically connected to the printed circuit board 250 via the upper springs and the support member. The printed circuit board 250 may include multiple terminals, and some of the multiple terminals may be electrically connected to the first coil 120 and / or the second coil 230.

[0058] Due to the electromagnetic force generated by the interaction between the first coil 120 and the magnet 130, the spool 110 and the lens or lens barrel 400 coupled to the spool 110 can move in the optical axis direction. Therefore, the displacement of the spool 110 in the optical axis direction can be controlled, thereby enabling AF operation.

[0059] Furthermore, due to the electromagnetic force generated by the interaction between the second coil 230 and the magnet 130, the housing 140 can move in a direction perpendicular to the optical axis, thus enabling hand tremor compensation or OIS operation.

[0060] In addition, to achieve AF feedback operation, the lens moving device 100 of the camera module 200 may further include a sensing magnet (not shown) disposed at the line cylinder 110 and an AF position sensor (e.g., a Hall sensor) (not shown) disposed in the housing 140. Furthermore, the lens moving device 100 may further include a printed circuit board (not shown) disposed in the housing and / or on the base for mounting or disposing of the AF position sensor thereon. In another embodiment, the AF position sensor may be disposed at the line cylinder, and the sensing magnet may be disposed in the housing. Additionally, the lens moving device 100 may further include a balancing magnet disposed at the line cylinder 110 corresponding to the sensing magnet.

[0061] The AF position sensor can output a signal based on the detection result of the magnitude of the magnetic field of the sensing magnet when the bobbin 100 moves. The AF position sensor can be electrically connected to the printed circuit board 250 via an upper (or lower) elastic member and / or a support member. The printed circuit board 250 can provide a drive signal to the AF position sensor, and the output of the AF position sensor can be transmitted to the printed circuit board 250.

[0062] In another embodiment, the lens moving device 100 may be an AF lens moving device, and the AF lens moving device may include: a housing; a spool disposed in the housing; a coil disposed at the spool; a magnet disposed in the housing; at least one elastic member coupled to the spool and the housing; and a base disposed below the spool (and / or the housing). For example, the elastic member may include the upper elastic member and the lower elastic member described above.

[0063] A drive signal (e.g., drive current) can be supplied to the coil, and the spool can move along the optical axis due to the electromagnetic force generated by the interaction between the coil and the magnet. In another embodiment, the coil can be disposed in the housing, and the magnet can be disposed at the spool.

[0064] Additionally, to enable AF feedback operation, the AF lens moving device may further include: a sensing magnet disposed at the line cylinder; an AF position sensor (e.g., a Hall sensor) disposed in the housing; and a printed circuit board disposed in or mounted on the housing and / or base such that the AF position sensor is mounted thereon. In another embodiment, the AF position sensor may be disposed at the line cylinder, and the sensing magnet may be disposed in the housing.

[0065] According to another embodiment, the camera module may include a housing coupled to the lens or lens barrel 400 to secure the lens or lens barrel 400, replacing... Figure 1 The lens moving device 100 is coupled to or attached to the upper surface of the retainer 600. The housing attached to or fixed to the retainer 600 may remain stationary, and the position of the housing may be fixed while the housing is attached to the retainer 600.

[0066] The printed circuit board can be electrically connected to the coil and the AF position sensor. The drive signal can be supplied to each of the coil and the AF position sensor through the printed circuit board, and the output of the AF position sensor can be transmitted to the printed circuit board.

[0067] The retainer 600 can be positioned below the base 210 of the lens moving device 100.

[0068] The filter 610 can be mounted to the retainer 600, and the retainer 600 can include a mounting portion 500 on which the filter 610 is mounted.

[0069] The adhesive member 612 can couple or attach the base 210 of the lens moving device 100 to the retainer 600. For example, the adhesive member 612 can be disposed between the lower surface of the base 210 and the upper surface of the retainer 600, and can bond the two components together.

[0070] The adhesive member 612 can not only be used to bond components as described above, but also prevent foreign objects from entering the lens moving device 100. For example, the adhesive member 612 can be epoxy resin, thermosetting adhesive, or UV-curing adhesive.

[0071] The filter 610 can be installed in the mounting portion 500 of the retainer 600.

[0072] The placement portion 500 of the retainer 600 may include, but is not limited to, a protrusion 500a projecting from the upper surface of the retainer 600. In another embodiment, the placement portion may be a recess, cavity, or hole recessed into the upper surface of the retainer 600.

[0073] The protrusion 500a of the mounting portion 500 can be used to prevent the lower end of the lens or lens barrel 400 from contacting or colliding with the filter 610 (and / or the blocking member 1500).

[0074] The protrusion 500a can be formed to protrude along the side surface of the filter 610 in the optical axis direction. For example, the protrusion 500a can be provided around the side surface of the filter 610 such that it surrounds the side surface of the filter 610.

[0075] The inner surface of the protrusion 500a can be configured to face the side surface of the filter 610, and the two parts can be spaced apart from each other. This is to ensure machining tolerances so that the filter 610 can be installed in the mounting portion 500 of the retainer 600.

[0076] Additionally, the upper surface of the protrusion 500a can be positioned above the upper surface 610 of the filter 610 in the optical axis direction. This is to prevent the lower end of the lens or lens barrel 400 from directly colliding with the filter 610 when the lens or lens barrel 400 is installed in the lens moving device 100 and moves along the optical axis direction or toward the filter 610 due to external impact.

[0077] The shape of the protrusion 500a, as viewed from above, can match the shape of the filter 610, but is not limited thereto. In another embodiment, the shape of the protrusion 500a can be similar to or different from the shape of the filter 610.

[0078] The retainer 600 may have an opening 501, which is formed in the area where the retainer 600 is mounted or where the filter 610 is provided, so that light passing through the filter 610 enters the image sensor 810.

[0079] For example, opening 501 can penetrate retainer 600 in the optical axis direction and can be referred to as a "through hole".

[0080] For example, the opening 501 can pass through the center of the retainer 600 and can be provided in the placement part 500. The area of ​​the opening 501 can be smaller than the area of ​​the filter 610.

[0081] The retainer 600 can be disposed on the printed circuit board 800 and can house the filter 610 therein. The retainer 600 can support the lens moving device 100 located thereon. The lower surface of the base 210 of the lens moving device 100 can be disposed on the upper surface of the retainer 600.

[0082] For example, the lower surface of the base 210 of the lens moving device 100 can contact the upper surface of the holder 600 and can be supported by the upper surface of the holder 600.

[0083] For example, the filter 610 may be provided in the mounting portion 500 of the retainer 600.

[0084] The filter 610 can be used to block light of a specific frequency band from entering the image sensor 810 in the light passing through the lens barrel 400.

[0085] For example, filter 610 can be an infrared cutoff filter, but is not limited to this. For example, filter 610 can be arranged parallel to the xy plane perpendicular to the optical axis OA.

[0086] The filter 610 can be attached to the mounting portion 500 of the retainer 600 using an adhesive component (not shown) such as UV epoxy resin.

[0087] The printed circuit board 800 can be disposed below the retainer 600, and the retainer 600 can be disposed on the upper surface of the printed circuit board 800.

[0088] The retainer 600 can be attached or secured to the upper surface of the printed circuit board 800 using adhesive components such as epoxy resin, thermosetting adhesive, or UV-curing adhesive. In this case, the adhesive component can be disposed between the lower surface of the retainer 600 and the upper surface of the printed circuit board 800.

[0089] The printed circuit board 800 may have an opening 801 corresponding to the opening 501 in the holder 600. The opening 801 in the printed circuit board 800 may be a through hole extending through the printed circuit board 800 in the optical axis direction.

[0090] The image sensor 810 can be disposed in an opening 801 in the printed circuit board 800.

[0091] The reinforcement 900 may be disposed below the printed circuit board 800 and may include a protrusion 901 formed corresponding to the opening 801 in the printed circuit board 800 to allow the image sensor 810 to be mounted thereon.

[0092] The protrusion 901 may protrude from a region of the upper surface of the reinforcement 900 in the optical axis direction. The image sensor 810 may be disposed on the upper surface of the protrusion 901 and may be exposed through an opening 801 in the printed circuit board 800.

[0093] The image sensor 810, which is disposed on the upper surface of the protrusion 901 of the reinforcement 900, can be electrically connected to the printed circuit board 800 via wiring 21. For example, wiring 21 can connect the terminal 813 of the image sensor 810 and the terminal 1830 of the printed circuit board 800 to each other.

[0094] The reinforcing member 900 is a plate-shaped component with a specified thickness and hardness, which can stably support the image sensor 810 and prevent the image sensor from being damaged due to external impact or contact.

[0095] In addition, the reinforcement 900 can improve the heat dissipation effect by dissipating the heat generated by the image sensor to the outside.

[0096] For example, the reinforcing member 900 may be formed of a metallic material with high thermal conductivity (e.g., SUS or aluminum), but is not limited thereto. In another embodiment, the reinforcing member 900 may be formed of glass epoxy resin, plastic, or synthetic resin.

[0097] Additionally, the reinforcement 900 can be electrically connected to the ground terminal of the printed circuit board 800, and thus can be used as a ground to protect the camera module from electrostatic discharge (ESD).

[0098] Image sensor 810 can be a part in which light passing through filter 610 is incident, and an image contained in the light is formed therein.

[0099] The printed circuit board 800 can be equipped with various circuits, components, and controllers to convert the image formed by the image sensor 810 into electrical signals and transmit the electrical signals to external devices. Circuit patterns that electrically connect to the image sensor and various components can be formed on the printed circuit board 800.

[0100] Holder 600 can be referred to as the first holder, and printed circuit board 800 can be referred to as the second holder.

[0101] The image sensor 810 can receive an image contained in light introduced via the lens mobile device 100, and can convert the received image into an electrical signal.

[0102] The filter 610 and the image sensor 810 can be configured to be spaced apart from each other and face each other in the optical axis (OA) direction or a first direction.

[0103] Additionally, the protrusion 500a of the retainer 600 can be configured to face the filter 610 in the optical axis direction.

[0104] The blocking member 1500 can be disposed on the upper surface of the filter 610. The blocking member 1500 can be referred to as a "shielding part".

[0105] For example, the blocking member 1500 may be disposed on the edge portion of the upper surface of the filter 610 and may be used to block at least a portion of the light traveling toward the edge portion of the filter 610 via the lens or lens barrel 400 from passing through the filter 610. For example, the blocking member 1500 may be coupled to or attached to the upper surface of the filter 1610.

[0106] For example, when viewed in the direction of the optical axis, the filter 610 can be formed in a rectangular shape, and the blocking member 1500 can be formed symmetrical with respect to the filter 610 along each side of the upper surface of the filter 610.

[0107] In this case, the blocking member 1500 can be formed to have a specified width on each side of the upper surface of the filter 1610.

[0108] The blocking member 1500 may be formed of an opaque material. For example, the blocking member 1500 may be an opaque and adhesive material applied to the filter 610, or it may be provided in the form of a film attached to the filter 610.

[0109] The filter 610 and the image sensor 810 may be configured to face each other in the optical axis direction, and at least a portion of the blocking member 1500 may overlap with the terminal 1830 and / or wiring 21 disposed on the printed circuit board 800 in the optical axis direction.

[0110] Wiring 21 and terminals 1830 can be formed of conductive materials such as gold, silver, copper, or copper alloys, and these conductive materials can have the property of reflecting light. Light that has passed through filter 610 can be reflected by terminals 1830 and wiring 21 of the printed circuit board 800, and due to this reflected light, flickering may occur. This flickering may distort the image formed by image sensor 810 or may degrade the image quality.

[0111] Since the blocking member 1500 is configured such that at least a portion of it overlaps with the terminal 1830 and / or wiring 21 in the optical axis direction, the blocking member 1500 can block light traveling toward the terminal 1830 and / or wiring 21 of the printed circuit board 800 in the light passing through the lens or lens barrel 400, thereby preventing the aforementioned flickering phenomenon from occurring, and thus preventing distortion or deterioration of the image formed by the image sensor 810.

[0112] The motion sensor 820 can be mounted or disposed on the printed circuit board 800 and can be electrically connected to the controller 830 through the circuit pattern disposed on the printed circuit board 800.

[0113] The motion sensor 820 outputs rotational angular velocity information based on the motion of the camera module 200. The motion sensor 820 can be implemented as a 2-axis or 3-axis gyroscope sensor or an angular velocity sensor.

[0114] The controller 830 is mounted or set on the printed circuit board 800.

[0115] Printed circuit board 800 can be electrically connected to lens moving device 100. For example, printed circuit board 800 can be electrically connected to printed circuit board 250 of lens moving device 100.

[0116] For example, a drive signal can be supplied through the printed circuit board 800 to each of the first coil 120 and the second coil 230 of the lens moving device 100, and the drive signal can also be supplied to the AF position sensor (or OIS position sensor). Furthermore, the output of the AF position sensor (or OIS position sensor) can be transmitted to the printed circuit board 800.

[0117] Connector 840 can be electrically connected to printed circuit board 800 and may include a port for electrical connection to an external device.

[0118] The adhesive member 1750 can be disposed between the lower surface of the image sensor 810 and the upper surface 901a of the protrusion 901, and the image sensor 810 can be attached or fixed to the upper surface 901a of the protrusion 901 using the adhesive member 1750. The adhesive member 1750 can be epoxy resin, thermosetting adhesive, ultraviolet curable adhesive, or adhesive film, but is not limited thereto.

[0119] Additionally, the adhesive member 1700 may be disposed between the lower surface of the printed circuit board 800 and the upper surface 900a of the second region S2 of the reinforcing member 900, and the adhesive member 1700 may be used to attach or fix the printed circuit board 800 to the reinforcing member 900. For example, the adhesive member 1700 may be epoxy resin, thermosetting adhesive, UV-curable adhesive, or adhesive film, but is not limited thereto.

[0120] The area of ​​the upper surface of the protrusion 901 can be equal to or greater than the area of ​​the lower surface of the image sensor 810. For example, the edge of the lower surface of the image sensor 810 can contact the edge of the upper surface 901a of the protrusion 901, but is not limited thereto. In another embodiment, the edge of the lower surface of the image sensor 810 can be spaced apart from the edge of the upper surface 901a of the protrusion 901.

[0121] For example, the ratio (H1:H2) of the first height H1 from the upper surface 900a of the second region S2 of the reinforcing member 900 to the upper surface 901a of the protrusion 901 to the second height H2 from the lower surface 900b of the reinforcing member 900 to the upper surface 900a of the second region S2 of the reinforcing member 900 can be from 1:0.67 to 1:2.1.

[0122] When the value obtained by dividing the second height by the first height (H2 / H1) is less than 0.67, the reinforcement 900 is prone to bending or deformation to the point that it can no longer support the printed circuit board 800.

[0123] Furthermore, when the value (H2 / H1) obtained by dividing the second height by the first height is greater than 2.1, the height of the protrusion 901 is too small to improve the flatness of the reinforcement 900, and the effect of reducing the height difference between the upper surface of the image sensor 810 and the upper surface of the printed circuit board 800 in the optical axis direction is reduced. Therefore, the reliability of the wiring connection between the two components may not be guaranteed.

[0124] For example, H1 can be 80 [μm] to 150 [μm], and H2 can be 100 [μm] to 170 [μm].

[0125] The height from the lower surface 900b of the reinforcing member 900 to the upper surface 901a of the protrusion 901 of the reinforcing member 900 can be less than the height to the upper surface of the printed circuit board 800 disposed on the reinforcing member 900.

[0126] For example, the reinforcement 900 may include a first region S1 and a second region S2. The first region S1 may be the region where the image sensor 810 is attached, and the second region S2 may be the region where the printed circuit board 800 is attached.

[0127] The first region S1 of the reinforcing member 900 may include a protrusion 901 protruding from the second region S2 in a direction from the lower surface of the reinforcing member toward the upper surface of the reinforcing member, and the image sensor 810 may be disposed on the upper surface of the protrusion 901.

[0128] For example, the first region S1 of the reinforcement 900 may include a protrusion 901 that protrudes further than the second region S2 of the reinforcement 900.

[0129] The thickness T1 of the first region S1 of the reinforcing member 900 is greater than the thickness T2 of the second region S2 of the reinforcing member 900 (T1 > T2).

[0130] Since T1 > T2, warping of the upper surface 901a of the protrusion 901 of the reinforcing member 900 can be suppressed, and the flatness of the upper surface 901a of the protrusion 901 can be improved. Therefore, in the embodiment, the reliability of the image sensor 810 disposed on the upper surface of the protrusion 901 can be improved, and the optical performance of the camera module can be improved.

[0131] Since the second region S2 of the reinforcing member 900 has a constant thickness, it does not affect the overall height of the camera module according to the embodiment.

[0132] Since the image sensor 910 is disposed on the upper surface 901a of the protrusion 901, the height difference between the upper surface of the printed circuit board 800 and the upper surface of the image sensor 810 can be reduced. As a result, the length of the wiring between the printed circuit board 800 and the image sensor 810 can be reduced, thereby improving the reliability of the wiring connection.

[0133] The distance D1 between the side surface of the protrusion 901 of the reinforcing member 900 and the side surface of the opening in the printed circuit board can be from 100 [μm] to 250 [μm].

[0134] When D1 is less than 100 [μm], the attachment tolerance of the printed circuit board 800 to the reinforcement 900 may decrease, which may lead to misalignment between the opening 801 in the printed circuit board 800 and the protrusion 901 of the reinforcement 900, and damage to the printed circuit board 800 due to collision between the printed circuit board 800 and the protrusion 901.

[0135] When D1 is greater than 250 μm, the spacing between the image sensor and the printed circuit board may be too large, which may reduce the reliability of the wiring connection.

[0136] Figure 4a This is a perspective view of the reinforcing member 900-1 according to another embodiment. Figure 5 It shows Figure 4a The reinforcement component 900-1, the image sensor 810, and the printed circuit board 800.

[0137] refer to Figure 4a and Figure 5 The reinforcement 900-1 may include a protrusion 901A disposed in the first region S1 to allow an image sensor to be disposed thereon or attached thereon.

[0138] The protrusion 901A may include a plurality of protrusions 901-1 to 901-n (n is a natural number and n>1).

[0139] The plurality of protrusions 901-1 to 901-n may be spaced apart from each other, and each of the plurality of protrusions 901-1 to 901-n may protrude in the optical axis direction based on the upper surface 900a of the second region of the reinforcing member 901-1.

[0140] The adhesive member 1750a can be disposed between the upper surfaces of the plurality of protrusions 901-1 to 901-n and the lower surface of the image sensor 810.

[0141] Additionally, the adhesive member 1750a can be disposed between the plurality of protrusions 901-1 to 901-n, or can fill the space between the plurality of protrusions 901-1 to 901-n.

[0142] refer to Figure 3 The description can be applied to Figure 5 H1 and H2.

[0143] Each of the plurality of protrusions 901-1 to 901-n may have a line shape or a strip shape, but is not limited thereto. In another embodiment, it may be formed in a mesh shape, a shape of multiple dots, or a shape of multiple islands.

[0144] Figure 4b This is a perspective view of the reinforcing member 900-2 according to yet another embodiment.

[0145] refer to Figure 4b The reinforcing member 900-2 may include a protrusion 902, which includes a plurality of protrusions 902-1 to 902-m (m is a natural number and m>1) disposed in the first region S1.

[0146] Each of the multiple protrusions 902-1 to 902-m may protrude from the upper surface of the reinforcement 901-2 in the direction of the optical axis.

[0147] Each of the multiple protrusions 901-2 to 902-m can be linear or strip-shaped.

[0148] One end of the plurality of protrusions 901-2 to 902-m can be connected to each other. In addition, the opposite ends of the plurality of protrusions 902-1 to 902-m can be connected to each other.

[0149] For reference Figure 4a As described, adhesive members can be filled in the space between the upper surfaces of the plurality of protrusions 902-1 to 902-m and the lower surface of the image sensor 810, as well as in the space between the plurality of protrusions 902-1 to 902-m.

[0150] The reinforcement and image sensor are secured to each other using adhesive components. Depending on the material of the reinforcement, the bonding strength between the reinforcement and the image sensor may be reduced, which could cause reliability issues related to the bonding.

[0151] Additionally, pressure is typically applied to the adhesive when the reinforcement and image sensor are bonded together. This pressure can cause the adhesive to overflow from the bonding surface between the reinforcement and the image sensor, potentially reducing the bond strength between the two components.

[0152] Additionally, to prevent adhesive spillage, if the area or size of the adhesive is made smaller than the size (or area) of the lower surface of the image sensor, such that the adhesive is placed inside the edge of the lower surface of the image sensor, the flatness of the image sensor will deteriorate during wiring bonding, and therefore the reliability of wiring bonding may be reduced.

[0153] exist Figures 4a to 5 In the embodiment shown, an uneven portion of a specified size is formed on the upper surface of the protrusion 901A, thereby increasing the bonding area between the adhesive member 1750a and the protrusion 901A or 902 of the reinforcement 900-1 or 900-2, thus increasing the bonding force between the reinforcement 900-1 or 900-2 and the image sensor 810.

[0154] Here, the convex portion of the uneven part can be the protrusions 901-1 to 901-n or 902-1 to 902-m mentioned above, and the concave portion of the uneven part can be the space between the protrusions 901-1 to 901-n or 902-1 to 902-m.

[0155] Furthermore, even when pressure is applied to the adhesive member 1750a to bond the image sensor 810 and the protrusions 901A or 902 to each other, the protrusions or bumps 901-1 to 901-n or 902-1 to 902-m of the uneven portion can suppress the overflow of adhesive, thereby preventing the bonding force from deteriorating and preventing the image sensor from being contaminated by adhesive.

[0156] In addition, since adhesive overflow is suppressed as described above, the edge of the adhesive member 1750a can extend to the edge of the lower surface of the image sensor 810, thereby preventing a decrease in the reliability of wiring bonding when wiring bonding is performed between the image sensor and the printed circuit board.

[0157] Figure 6 An image sensor 810 and a printed circuit board 800 disposed on a reinforcing member 900-3 are shown according to yet another embodiment.

[0158] refer to Figure 6 The reinforcing member 900-3 may include a cavity 905 or a groove formed in the first region S1. The cavity 905 may have a structure that is recessed from the upper surface of the reinforcing member 900-3.

[0159] For example, the first region S1 of the reinforcing member 900-3 may include a cavity 905 that is recessed more than the second region S2 of the reinforcing member 900-3.

[0160] The image sensor 810 can be disposed in the chamber 905 and can be attached or fixed to the bottom surface 905a of the chamber 905 using the adhesive member 1750.

[0161] The printed circuit board 800 can be disposed in the second region S2 of the reinforcing member 900-3, and the lower surface of the printed circuit board 800 can be attached or fixed to the second region S2 of the reinforcing member 900-3 using the adhesive member 1700.

[0162] To increase the bonding strength between the reinforcing member 900-3 and the image sensor 810 Figure 6 The bottom surface 905a of the cavity 905 of the reinforcing member 900-3 may be provided with a reference. Figure 4a and Figure 4b The uneven parts or protrusions (not shown) that are the same as or similar to those of the described component.

[0163] The image sensor 810 and the printed circuit board 800 can have different thicknesses. That is, the thickness of each component in the image sensor and printed circuit board mounted in the camera module is not uniform, but can be varied according to customer requirements, design specifications, or the size of the camera module. When wiring between image sensors and printed circuit boards with varying thicknesses, the reliability of the wiring may be reduced if there is a significant height difference between the terminals of the image sensor and the terminals of the printed circuit board in the optical axis direction.

[0164] The depth DT from the upper surface 900a of the reinforcing member 900-3 to the bottom surface 905a of the cavity 905 can be less than or equal to the thickness T4 of the image sensor (DT≤T4). This is to prevent a decrease in the reliability of the wiring connection between the image sensor 810 and the printed circuit board 800 due to the increased height difference between the upper surface of the image sensor 810 and the upper surface of the printed circuit board 800 in the optical axis direction.

[0165] However, in another embodiment, DT can be greater than T4 (DT > T4) depending on the thickness of the image sensor 810 and the thickness of the printed circuit board 800.

[0166] In an embodiment, to prevent a decrease in the reliability of the wiring connection between the printed circuit board 800 and the image sensor 810, which have different thicknesses, the camera module according to the embodiment may include... Figure 3 , Figure 4a or Figure 4b The reinforcing parts are 900, 900-1 or 900-2, or Figure 6Reinforcement member 900-3.

[0167] For example, when the thickness T4 of the image sensor 810 is greater than the thickness T3 of the printed circuit board 800 (T4 > T3), the embodiment includes Figure 6 Reinforcement member 900-3 to reduce the height difference DP in the optical axis direction between the above two components, thereby preventing a reduction in the reliability of the wiring connection.

[0168] On the other hand, as Figure 3 shown, when the thickness T4 of the image sensor 810 is less than the thickness T3 of the printed circuit board 800 (T4 < T3), the embodiment may include Figure 3 , Figure 4a or Figure 4b Reinforcement members 900, 900-1 or 900-2 to reduce the height difference between the above two components in the optical axis direction, thereby preventing a reduction in the reliability of the wiring connection.

[0169] Figures 7a to 7d Shows a method of forming Figure 6 Reinforcement member 900-3.

[0170] Refer to Figure 7a , and prepare a reinforcement plate member 90 for forming the reinforcement member.

[0171] As Figure 7b shown, a first mask 92 or a second mask 92a is formed on the reinforcement plate member 90. For example, the first mask 92 may be formed on the first region S1 where the image sensor 810 is to be provided, and the second mask 92a may be formed on the second region S2 where the printed circuit board 800 is to be provided.

[0172] Subsequently, use the first mask 92 or the second mask 92a as an etching mask to etch the reinforcement plate member 90 to form Figure 3 Reinforcement member 900 or Figure 6 Reinforcement member 900-3. The reinforcement member 900-1 or 900-2 of Figure 4a or Figure 4b can be formed according to the shape of the patterns of the first mask 92 and the second mask 92a.

[0173] After forming the reinforcement member 900 or 900-3, remove the first mask 92 or the second mask 92a.

[0174] Subsequently, as Figure 7c shown, attach the bonding member 1700 to the lower surface of the printed circuit board 800. For example, the bonding member 1700 may be attached to the entire area of the lower surface of the printed circuit board 800.

[0175] For example, the ratio of the area of ​​the lower surface of the printed circuit board 800 to the area of ​​the adhesive member 1700 attached to the lower surface of the printed circuit board 800 can be 1:1.

[0176] exist Figure 7c In this context, the thickness of the printed circuit board 800 is expressed as varying depending on the embodiment 900 or 900-3 of the reinforcing member.

[0177] Subsequently, as Figure 7d As shown, an opening 89 is formed by selectively etching the printed circuit board 800 and the adhesive member 1700 on the printed circuit board 800 attached to the adhesive member 1700 using a mask (not shown) to allow penetration of the printed circuit board 800 and the adhesive member 1700.

[0178] Subsequently, as Figure 7e As shown, fixed to Figure 7d The adhesive component 1700 of the printed circuit board 800 is attached to the second region of the reinforcement 900 or 900-3.

[0179] like Figure 7c and Figure 7d As shown, since the opening 89 is formed by etching after the adhesive member 1700 is attached to the printed circuit board 800, the edge of the adhesive member 1700 can extend to the opening 801 in the printed circuit board 800, thereby preventing a decrease in the reliability of the wiring bond when wiring bond is performed between the image sensor and the printed circuit board.

[0180] In another embodiment, with Figure 7c and Figure 7d Depending on the processing, adhesive components can be formed in Figure 7b In the second region of the reinforcement, a printed circuit board having an opening therein can be attached to an adhesive member disposed in the second region of the reinforcement.

[0181] Figure 8 This is an exploded perspective view of a camera module 200-1 according to another embodiment. Figure 9 yes Figure 8 A cross-sectional view of the reinforcing member 900-4, the image sensor 810, and the printed circuit board 800. (Compared to...) Figure 1 The same reference numerals in the accompanying drawings indicate the same parts, and the same parts will be omitted or described briefly.

[0182] refer to Figure 8 and Figure 9 The reinforcing member 900-4 includes a first region S1 and a second region S2, and no [something] is formed in the first region S1 of the reinforcing member 900-4. Figure 3 The protrusion 901 or cavity 905. For example, the first region S1 of the reinforcement 900-4 can be a flat surface.

[0183] The printed circuit board 800 is attached to the second region S2 of the reinforcement 900-4 using the adhesive member 1700. An opening 89 may be formed to penetrate the printed circuit board 800 and the adhesive member 1700 to expose the first region S1 of the reinforcement 900-4.

[0184] The printed circuit board 800 may have a structure in which a first insulating layer 81-1, a first conductive layer 82-1, a second insulating layer 81-2, a second conductive layer 82-2 and a third insulating layer 81-3 are stacked in sequence.

[0185] The printed circuit board 800 may include at least one terminal 1830, which is disposed on the third insulating layer 81-3 and electrically connected to at least one of the first conductive layer 82-1 or the second conductive layer.

[0186] The inner surface 17a of the adhesive member 1700 can extend to the inner surface 17b of the opening 801 in the printed circuit board 800.

[0187] For example, the inner surface 17a of the adhesive member 1700 and the inner surface 17b of the opening 801 in the printed circuit board 800 can be located in the same plane in the optical axis direction.

[0188] The adhesive member 1750 disposed in the first region S1 may be spaced apart from the adhesive member 1700 disposed in the second region S2. For example, the adhesive member 1750 and the adhesive member 1700 may have different thicknesses or may be formed by different processes.

[0189] An image sensor 810 is disposed on a first region S1 of a reinforcing member 900-4, the first region S1 being exposed through an opening 801, and the image sensor 810 is attached to the first region S1 using an adhesive member 1750.

[0190] The image sensor 810 may include a terminal 813, which is electrically connected to a terminal 1830 of a printed circuit board 800 via wiring 21.

[0191] Figures 10a to 10d It shows that Figure 9 The process of coupling the reinforcing member 900-4, image sensor 810, printed circuit board 800 and adhesive member 800 shown.

[0192] refer to Figure 10a and Figure 10b A printed circuit board 800 having an opening 801 therein to expose an image sensor 810, and an adhesive member 1700b having dimensions corresponding to the dimensions of the printed circuit board 800, are prepared. Here, the opening 801 may be a through hole penetrating the printed circuit board 800.

[0193] For example, the area of ​​the printed circuit board 800 defined by its horizontal and vertical lengths can be the same as the area of ​​the adhesive member 1700 defined by its horizontal and vertical lengths.

[0194] Subsequently, the adhesive member 1700b is attached to the lower surface of the printed circuit board 800, which has an opening 801 therein. A portion of the adhesive member 1700b attached to the lower surface of the printed circuit board 800 may be exposed through the opening 801 in the printed circuit board 800. For example, the area of ​​the adhesive member 1700b exposed through the opening 801 may be the same as the area of ​​the opening 801.

[0195] Subsequently, reference Figure 10c The area 1700a of the adhesive member 1700b exposed through the opening 801 is removed by an etching process using a mask to form an adhesive member 1700 having an opening therein, and then the mask is removed.

[0196] Opening 89 can be formed as a passage Figure 10c The process penetrates the printed circuit board 800 and the adhesive component 1700.

[0197] Subsequently, reference Figure 10d The adhesive member 1700 is attached to the reinforcement 900-4. The first region S1 of the reinforcement 900-4 can be exposed through the opening 89.

[0198] Subsequently, the image sensor 810 is disposed or mounted in the first region S1 of the reinforcing member 900-4. The image sensor 810 can be attached to the first region S1 of the reinforcing member 900-4 using the adhesive member 1750. Subsequently, wires connecting the terminals of the printed circuit board 800 to the terminals of the image sensor 810 are formed by a wiring bonding process.

[0199] Since the opening 89 is formed by etching after the adhesive member 1700 is bonded to the printed circuit board 800, and since the printed circuit board 800 and the adhesive member 1700, which have the opening 89 and are coupled to each other, are simultaneously attached to the reinforcement 900-4, the embodiment is able to prevent the formation of an unfilled area between the lower surface of the printed circuit board 800 and the second region S2 of the unfilled adhesive member 1700 of the reinforcement 900-4.

[0200] Typically, when adhesives are used to attach printed circuit boards and reinforcements to each other, pressure is applied to the adhesive. Due to this pressure, the adhesive may overflow from the bonding surface between the reinforcement and the printed circuit board, which may reduce the bonding strength between the two components or contaminate the image sensor.

[0201] To prevent adhesive overflow and ensure adhesion tolerances, the adhesive is applied to the printed circuit board (PCB) with a spacing of 200 to 300 μm inward from the inner surface of the opening in the PCB. However, when the adhesive is applied to the PCB with a spacing of 200 to 300 μm inward from the inner surface of the opening in the PCB, unfilled areas of unfilled adhesive are created between the PCB and the reinforcement. This can lead to PCB warping, and the reliability of the wiring bond may be reduced when wiring is performed between the warped PCB and the image sensor.

[0202] Figure 11 The wiring connection between the printed circuit board 32 and the image sensor 33 is shown when there is an area 12-1 without adhesive filling.

[0203] refer to Figure 11 When the adhesive 30 is set to be spaced inward from the inner surface of the opening in the printed circuit board 32 by a specified distance (d1 = 200 [μm] to 300 [μm]), an area 12-1 unfilled with adhesive 30 may be formed between the printed circuit board 32 and the reinforcement 31, and the printed circuit board 30 may warp due to the presence of the area 12-1 unfilled with adhesive 30.

[0204] When using the wiring harness 25 to form a wiring 35 that connects the terminal 32a located at the warped portion of the printed circuit board 30 to the terminal 33a of the image sensor 33, wire bouncing may occur, and the reliability of the wiring harness may be reduced.

[0205] Figure 12 It shows the relationship with Figure 11 The height difference caused by the warping of the printed circuit board 32 shown, and according to Figure 9 The simulation results related to the height difference caused by the warpage of the printed circuit board 800 in the embodiment, wherein, Figure 11 The height difference caused by the warpage of the printed circuit board 32 shown is due to the force applied to it during wiring bonding, according to Figure 9 The height difference caused by the warping of the printed circuit board 800 in the embodiment is due to the force applied to it during wiring bonding.

[0206] here, Figure 12 The height difference can be the height difference from one end of the printed circuit board 32 to its opposite end, which is represented by F1. For example, Figure 12The height difference can be the height difference between the highest and lowest points of the printed circuit board. The X-axis represents the force applied to the printed circuit board 32 or 800 via the wiring harness, and the unit of force can be [g·cm / s^2]. The Y-axis represents the height difference, and its unit can be micrometers.

[0207] g1 represents the height difference caused by the warping of printed circuit board 32, and g2 represents the height difference caused by the warping of printed circuit board 800.

[0208] refer to Figure 12 As the force applied to the printed circuit board 32 increases, the height difference g1 increases; however, even when the force applied to the printed circuit board 800 increases, the height difference g2 can remain constant.

[0209] according to Figure 12 According to the simulation results, in the embodiment, the printed circuit board 800 does not warp significantly during the wiring connection, so the height difference is constant, thereby ensuring the reliability of the wiring connection between the printed circuit board 800 and the image sensor 810.

[0210] Figure 13 yes Figure 8 Cross-sectional views of other embodiments of the reinforcing member 900-4, image sensor 810, and printed circuit board 800. (Compared to...) Figure 8 The same reference numerals in the accompanying drawings indicate the same parts, and the description of the same parts will be omitted or simplified.

[0211] refer to Figure 13 A single adhesive member 1700b can be used to attach the printed circuit board 800 and the image sensor 810 to the reinforcement 900-4.

[0212] In other words, the adhesive member 1700b may include a first adhesive member 1700b1 disposed in the first region S1 of the reinforcing member 900-4, and a second adhesive member 1700b2 disposed in the second region S2 of the reinforcing member 900-4 and connected to or adjacent to the first adhesive member 1700b1.

[0213] For example, the first adhesive member 1700b1 may contact the opening 801 in the printed circuit board 800 along the inner surface of the opening 801 in the printed circuit board 800.

[0214] For example, the adhesive member 1700b can cover the entire area of ​​the first region S1 of the reinforcing member 900-4.

[0215] For example, the upper surface of the first adhesive member 1700b1 and the upper surface of the second adhesive member 1700b2 may be located in the same plane.

[0216] Figure 14a and Figure 14b It shows that Figure 13 The process of coupling the reinforcing member 900-4, image sensor 810, printed circuit board 800 and adhesive member 1700b shown.

[0217] First, as referenced Figure 10a and Figure 10b The adhesive member 1700b is attached to the lower surface of the printed circuit board 800, which has an opening 801 therein.

[0218] Subsequently, as Figure 14a and Figure 14b As shown, the adhesive member 1700b is attached to the upper surface of the reinforcement 900-4. For example, the adhesive member 1700b may cover both the first region S1 and the second region S2 of the reinforcement 900-4.

[0219] For example, the adhesive member 1700b may include a first adhesive member 1700b1 covering the entire area of ​​the first region S1 of the reinforcement 900-4, and a second adhesive member 1700b2 covering the entire area of ​​the second region S2 of the reinforcement 900-4. The first adhesive member 1700b1 may be exposed through an opening 801 in the printed circuit board 800.

[0220] Subsequently, the image sensor 810 is set or mounted on the first adhesive member 1700b1 and exposed through the opening 801 in the printed circuit board 800.

[0221] Subsequently, wiring is formed by connecting the terminals of the printed circuit board 800 to the terminals of the image sensor 810 through a wiring bonding process.

[0222] exist Figure 14a and Figure 14b In this case, since the adhesive member 1700b is formed and continuously held over the entire area of ​​the first region S1 and the entire area of ​​the second region S2 of the reinforcing member 900-4, there are no gaps or areas of unfilled adhesive between the lower surface of the printed circuit board 800 and the upper surface of the reinforcing member 900-4, or between the lower surface of the image sensor 810 and the upper surface of the reinforcing member. Therefore, when wiring is bonded between the image sensor and the printed circuit board, no wiring jumps occur, thus ensuring the reliability of the wiring bond.

[0223] According to an embodiment, the camera module 200 may include a printed circuit board 800 having an opening 801 therein to allow an image sensor 810 to be disposed therein, thereby reducing the height of the camera module 200.

[0224] Additionally, the camera module 200 according to the embodiment may include a reinforcement 900 that supports the printed circuit board 800 and the image sensor 810 is mounted on the reinforcement 900 to dissipate heat generated from the image sensor 810.

[0225] The height of the camera module is proportional to the thickness of the reinforcing member. If the thickness of the reinforcing member is reduced to reduce the height of the camera module, the flatness of the reinforcing member 900 on which the image sensor is mounted may deteriorate, and the optical performance of the camera module may be reduced.

[0226] like Figure 3 As shown, the embodiment includes a reinforcement 900 having a protrusion 901 on which an image sensor 810 is mounted, thereby improving the flatness of the reinforcement 900 and thus improving the optical performance of the camera module.

[0227] Furthermore, the embodiments selectively employ different thicknesses depending on the image sensor thickness and the printed circuit board thickness. Figure 3 The shape of the reinforcing member in the embodiment or Figure 6 The shape of the reinforcing member in the embodiment reduces the height difference between the image sensor 810 and the printed circuit board 800 in the optical axis direction, thus ensuring the reliability of the wiring connection.

[0228] In addition, such as Figure 4a and Figure 4b As shown, in this embodiment, an uneven portion is formed on the protrusion 901 of the reinforcing member 900 for mounting the image sensor, thereby increasing the bonding force between the reinforcing member and the image sensor and preventing a decrease in bonding force due to adhesive overflow and contamination of the image sensor.

[0229] Additionally, in the embodiments, by Figures 7a to 7e , Figures 10a to 1 0D or Figure 14a and Figure 14b The method couples the printed circuit board 800, the reinforcement 900, the image sensor 810, and the adhesive member 1700 or 1700b. Therefore, during wiring connections to electrically connect the printed circuit board 800 to the image sensor 810, warping of the printed circuit board 800 can be suppressed, thereby ensuring the reliability of the wiring connections.

[0230] The camera module according to the embodiments can be included in an optical instrument to form an image of an object existing in space by utilizing the properties of light, such as reflection, refraction, absorption, interference, and diffraction, to increase visibility, to record and reproduce images through a lens, or to perform optical measurements or image propagation or transmission. For example, the optical instrument according to the embodiments may include a smartphone and a portable terminal equipped with a camera.

[0231] Figure 15 This is a perspective view of the portable terminal 200A according to an embodiment. Figure 16 yes Figure 15 The diagram shows the configuration of the portable terminal 200A.

[0232] refer to Figure 15 and Figure 16 The portable terminal 200A (hereinafter referred to as the "terminal") may include a main body 850, a wireless communication unit 710, an A / V input unit 720, a sensor 740, an input / output unit 750, a memory 760, an interface 770, a controller 780, and a power supply 790.

[0233] Figure 15 The main body 850 shown has a strip shape, but is not limited to it, and can be any of various types such as sliding, folding, swinging or rotating, wherein two or more sub-bodies are coupled so that they are movable relative to each other.

[0234] The main body 850 may include a housing (e.g., a shell, cover, or cover) that defines its appearance. For example, the main body 850 may be divided into a front housing 851 and a rear housing 852. Various electronic components of the terminal may be installed in the space formed between the front housing 851 and the rear housing 852.

[0235] The wireless communication unit 710 may include one or more modules that enable wireless communication between the terminal 200A and the wireless communication system or between the terminal 200A and the network where the terminal 200A is located. For example, the wireless communication unit 710 may include a broadcast receiving module 711, a mobile communication module 712, a wireless internet module 713, a near-field communication module 714, and a location information module 715.

[0236] The audio / video (A / V) input unit 720 is used to input audio or video signals and may include a camera 721 and a microphone 722.

[0237] according to Figure 1 or Figure 8 In the illustrated embodiment, camera 721 may include camera module 200 or 200-1.

[0238] Sensor 740 can sense the current state of terminal 200A (e.g., whether terminal 200A is on or off), the position of terminal 200A, whether a user is touching it, the orientation of terminal 200A, or the acceleration / deceleration of terminal 200A, and can generate sensing signals to control the operation of terminal 200A. For example, when terminal 200A is a slider phone, it can detect whether the slider phone is on or off. Additionally, sensor 740 is used to sense whether power is being supplied from power source 790 or whether interface 770 is coupled to an external device.

[0239] The input / output unit 750 is used to generate visual, auditory, or tactile inputs or outputs. The input / output unit 750 can generate input data to control the operation of the terminal 200A, and can display information processed in the terminal 200A.

[0240] The input / output unit 750 may include a keyboard unit 730, a display panel 751, a sound output module 752, and a touch screen panel 753. The keyboard unit 730 can generate input data in response to input to the keyboard.

[0241] Display panel 751 may include a plurality of pixels, the color of which changes in response to an electrical signal. For example, display panel 751 may include at least one of liquid crystal display, thin-film transistor liquid crystal display, organic light-emitting diode, flexible display, or 3D display.

[0242] The audio output module 752 can output audio data received from the wireless communication unit 710 in call signal receiving mode, call mode, recording mode, voice recognition mode or broadcast receiving mode, or it can output audio data stored in the memory 760.

[0243] The touchscreen panel 753 can convert the capacitance change caused by the user touching a specific area of ​​the touchscreen into an electrical input signal.

[0244] The memory 760 can store programs for processing and control of the controller 780, and can temporarily store input / output data (e.g., phone book, messages, audio, still images, pictures, and moving images). For example, the memory 760 can store images captured by the camera 721, such as pictures or moving images.

[0245] Interface 770 serves as a channel for connection between terminal 200A and external devices. Interface 770 can receive data or power from external devices and can send data or power to various components within terminal 200A, or can send data from within terminal 200A to external devices. For example, interface 770 may include a wired / wireless headphone jack, an external charger port, a wired / wireless data port, a memory card port, a port for connecting devices with identification modules, an audio input / output (I / O) port, a video input / output (I / O) port, and a headphone port.

[0246] The controller 780 can control the general operation of the terminal 200A. For example, the controller 780 can perform control and processing related to voice calls, data communications, and video calls.

[0247] The controller 780 may include a multimedia module 781 for multimedia playback. The multimedia module 781 may be located inside the controller 780 or may be located separately from the controller 780.

[0248] The controller 780 can perform pattern recognition processing, through which handwriting or drawing input to the touch screen is perceived as characters or images.

[0249] The power supply 790 can supply the power required to operate various components after receiving external or internal power under the control of the controller 780.

[0250] The features, structures, effects, etc., described above in the embodiments are included in at least one embodiment of this disclosure, but are not necessarily limited to one embodiment. Furthermore, the features, structures, effects, etc., exemplified in the various embodiments can be combined with other embodiments or modified by those skilled in the art. Therefore, anything relating to such combinations and modifications should be interpreted as falling within the scope of this disclosure.

[0251] Industrial applicability

[0252] The embodiments can be used in camera modules and optical devices that can improve optical performance, ensure the reliability of wiring connections between printed circuit boards and image sensors, and enhance the bonding strength between reinforcements and image sensors.

Claims

1. A camera module, comprising: A reinforcing member, the reinforcing member including a protrusion extending from the upper surface of the reinforcing member; A printed circuit board, the printed circuit board being disposed on the upper surface of the reinforcing member and including a through hole, the protrusion of the reinforcing member being disposed in the through hole, and the printed circuit board including a first terminal; An image sensor is disposed on the upper surface of the protrusion of the reinforcement and includes a second terminal; Wiring, wherein the wiring connects the first terminal and the second terminal; as well as A lens barrel, which is positioned above the image sensor. Wherein, the upper surface of the protrusion is located below the upper surface of the printed circuit board, and The thickness of the image sensor is less than the thickness of the printed circuit board.

2. The camera module according to claim 1, comprising a first adhesive member disposed between the upper surface of the protrusion and the lower surface of the image sensor.

3. The camera module according to claim 1, comprising: A retainer disposed on the printed circuit board; A filter is disposed on the holder and opposite the image sensor.

4. The camera module according to claim 2, wherein, The reinforcement includes an uneven portion formed on the upper surface of the protrusion.

5. The camera module according to claim 4, wherein, The uneven portion includes convex and concave parts.

6. The camera module according to claim 5, wherein, The protrusion has the shape of multiple lines, stripes, meshes, points, or islands.

7. The camera module according to claim 5, wherein, A portion of the first adhesive member is disposed in the protrusion.

8. The camera module according to claim 2, comprising: A second adhesive member is disposed between the reinforcing member and the printed circuit board.

9. The camera module according to claim 8, wherein, The first adhesive member is located at a higher position than the second adhesive member.

10. The camera module according to claim 1, wherein, The first terminal is disposed on the upper surface of the printed circuit board, and the second terminal is disposed on the upper surface of the image sensor.

11. The camera module according to claim 1, wherein, When viewed from above, the image sensor is disposed within the through-hole of the printed circuit board.

12. The camera module according to claim 1, wherein, The reinforcing member is formed of metal, glass epoxy resin, plastic or synthetic resin.

13. The camera module according to claim 1, wherein, The area of ​​the upper surface of the protrusion is equal to or greater than the area of ​​the lower surface of the image sensor.

14. The camera module according to claim 1, wherein, The reinforcing member includes a first region and a second region. The first region is the protrusion and the printed circuit board is coupled to the second region.

15. The camera module according to claim 14, wherein, The thickness of the first region of the reinforcing member is greater than the thickness of the second region of the reinforcing member.

16. The camera module according to claim 1, wherein, The side surface of the protrusion is spaced apart from the side surface of the through hole of the printed circuit board.

17. The camera module according to claim 2, wherein, The first adhesive component is epoxy resin, thermosetting adhesive or UV-curable adhesive.

18. A camera module, comprising: A reinforcing member, the reinforcing member including a protrusion extending from the upper surface of the reinforcing member and an uneven portion formed on the upper surface of the protrusion; A printed circuit board, the printed circuit board being disposed on the upper surface of the reinforcing member and including a through hole and a first terminal, the protrusion of the reinforcing member being disposed in the through hole; An image sensor is disposed on the upper surface of the protrusion of the reinforcing member and includes a second terminal; A first adhesive member is disposed between the uneven portion of the reinforcing member and the lower surface of the image sensor; Wiring, wherein the wiring connects the first terminal and the second terminal; as well as A lens barrel, which is positioned above the image sensor. Wherein, the upper surface of the protrusion is located below the upper surface of the printed circuit board, and The thickness of the image sensor is less than the thickness of the printed circuit board.

19. The camera module according to claim 18, wherein, The uneven portion includes convex and concave parts.

20. The camera module according to claim 19, wherein, A portion of the first adhesive member is disposed in the protrusion.

21. The camera module according to claim 18, wherein, The first adhesive component is epoxy resin, thermosetting adhesive or UV-curable adhesive.

22. The camera module according to claim 19, wherein, The protrusion has the shape of multiple lines, stripes, meshes, points, or islands.

23. The camera module according to claim 18, comprising: A second adhesive member is disposed between the reinforcing member and the printed circuit board.

24. The camera module according to claim 23, wherein, The first adhesive member is located at a higher position than the second adhesive member.

25. The camera module according to claim 18, wherein, The first terminal is disposed on the upper surface of the printed circuit board, and the second terminal is disposed on the upper surface of the image sensor.

26. The camera module according to claim 18, wherein, When viewed from above, the image sensor is disposed within the through-hole of the printed circuit board.

27. The camera module according to claim 18, wherein, The reinforcing member is formed of metal, glass epoxy resin, plastic or synthetic resin.

28. The camera module according to claim 18, wherein, The area of ​​the upper surface of the protrusion is equal to or greater than the area of ​​the lower surface of the image sensor.

29. The camera module according to claim 18, wherein, The reinforcing member includes a first region and a second region. The first region is the protrusion and the printed circuit board is coupled to the second region.

30. The camera module according to claim 29, wherein, The thickness of the first region of the reinforcing member is greater than the thickness of the second region of the reinforcing member.

31. The camera module according to claim 18, wherein, The side surface of the protrusion is spaced apart from the side surface of the through hole of the printed circuit board.

32. The camera module according to claim 18, wherein, The first adhesive component is epoxy resin, thermosetting adhesive or UV-curable adhesive.

33. A camera module, comprising: A reinforcing member, the reinforcing member comprising a first region and a second region, the first region protruding relative to the second region; A printed circuit board, the printed circuit board being disposed on the second region of the reinforcing member and including a through hole and a first terminal, the first region of the reinforcing member being disposed in the through hole, and the first terminal being disposed on the upper surface of the printed circuit board; An image sensor is disposed on the upper surface of the first region of the reinforcing member and includes a second terminal disposed on the upper surface of the image sensor. Wiring, wherein the wiring connects the first terminal and the second terminal; as well as A lens barrel, which is positioned above the image sensor. When viewed from above, the first region of the reinforcing member and the image sensor are disposed within the through-hole of the printed circuit board. Wherein, the thickness of the first region of the reinforcing member is greater than the thickness of the second region of the reinforcing member. Wherein, the upper surface of the first region is located at a position lower than the upper surface of the printed circuit board, and The thickness of the image sensor is less than the thickness of the printed circuit board.

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