Sample printed wiring board gold finger beveling method based on a drill tip apparatus

Abstract

The application provides a sample printed circuit board gold finger bevel processing method based on a drill bit device. The sample printed circuit board gold finger bevel processing method based on the drill bit device comprises the following steps: placing a sample printed circuit board to be processed after molding on a workbench of the drill bit device; polishing a drill bit of the drill bit device; aligning a cutting edge of the drill bit with a gold finger of the sample printed circuit board; rotating the workbench, and obtaining a position parameter of the sample printed circuit board when the sample printed circuit board is set to be inclined; measuring an actual angle of the sample printed circuit board when the sample printed circuit board is set to be inclined; adjusting an angle of chamfering of the drill bit according to the actual angle and a compensation angle of the drill bit device; and controlling the drill bit of the drill bit device to drill the gold finger of the sample printed circuit board. The sample printed circuit board gold finger bevel processing method based on the drill bit device has good energy saving and good processing convenience.

Description

Technical Field

[0001] This invention relates to the technical field of printed circuit boards, and in particular to a method for processing the beveled edges of gold fingers on sample printed circuit boards based on a drilling device. Background Technology

[0002] A printed circuit board (PCB) is a support structure for electronic components and a carrier for their electrical connections. PCBs are equipped with gold fingers, which are gold-plated narrow connectors used to mate with corresponding slots to connect multiple PCBs. The beveled edge treatment of the gold fingers refers to chamfering the edges of the gold fingers at a specific angle to facilitate insertion into the corresponding slots.

[0003] In existing technology, operators use an automatic beveling machine to bevel the gold fingers on printed circuit boards (PCBs). The automatic beveling machine is a conveyor-line type of operating device. Multiple PCBs are stacked and fixed on the conveyor belt of the automatic beveling machine, and the cutters of the machine beveling the gold fingers of the stacked PCBs one by one in sequence. However, before mass-producing PCBs, operators often need to create a sample PCB for testing to determine its effectiveness. If an automatic beveling machine is used to bevele the gold fingers of a sample PCB, the machine's operating time is short, resulting in high power consumption from the frequent on / off cycles. This leads to poor energy efficiency when using an automatic beveling machine for beveling the gold fingers of sample PCBs. Meanwhile, the cutter of the automatic beveling machine needs to be constantly adjusted when beveling the gold fingers of the sample printed circuit board. For this type of transmission line operating equipment, the adjustment operation is very cumbersome for the operator, making it difficult for the operator to adjust the cutter of the automatic beveling machine, thus making the beveling of the gold fingers of the sample printed circuit board less convenient. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method for processing the beveled edge of the gold fingers of a sample printed circuit board based on a drill bit device, which has better energy efficiency and ease of processing.

[0005] The objective of this invention is achieved through the following technical solution:

[0006] A method for processing the beveled edges of gold fingers on a sample printed circuit board based on a drilling device includes:

[0007] The shaped printed circuit board sample to be processed is placed on the worktable of the drilling equipment.

[0008] The printed circuit board sample to be processed is positioned and fixed on the worktable;

[0009] The drill bit of the aforementioned drilling equipment is ground to form a chamfer;

[0010] The drill bit, after being polished, is installed on the drill bit device;

[0011] Align the cutting edge of the drill bit with the gold fingers of the sample printed circuit board so that the drill bit contacts the sample printed circuit board;

[0012] The worktable is rotated to tilt the sample printed circuit board, and the position parameters of the sample printed circuit board are obtained when the sample printed circuit board is tilted.

[0013] Measure the actual angle formed by the sample printed circuit board when the sample printed circuit board is tilted.

[0014] The chamfering angle of the drill bit is adjusted based on the actual angle and the compensation angle of the drill bit equipment.

[0015] The drill bit of the drilling device is controlled to drill and remove the gold fingers of the sample printed circuit board, so as to form a chamfer on the gold fingers of the sample printed circuit board.

[0016] The drilling device is controlled to drive the drill bit to work in order to complete the bevel processing of the gold fingers of the sample printed circuit board;

[0017] The sample printed circuit board is inspected to determine whether the bevel treatment of the gold fingers on the sample printed circuit board meets the standards.

[0018] If the beveled edge treatment of the gold fingers on the sample printed circuit board meets the standard, then the sample printed circuit board is cleaned.

[0019] The thickness of the printed circuit board in the sample is greater than 3mm.

[0020] In one embodiment, the step of grinding the drill bit of the drill bit device includes:

[0021] The drill bit is selected and placed on the operating platform of the grinding machine;

[0022] The drill bit is fixed to the operating platform;

[0023] The grinding machine is angled according to the required angle of the bevel.

[0024] The grinding machine is controlled to grind the drill bit so that the drill bit forms a chamfer with a preset angle.

[0025] In one embodiment, the step of aligning the cutting edge of the drill bit with the gold fingers of the sample printed circuit board to bring the drill bit into contact with the sample printed circuit board includes:

[0026] Align the cutting edge of the drill bit with the gold fingers of the sample printed circuit board;

[0027] The drill bit is controlled to move toward the gold fingers of the sample printed circuit board, and the pressure exerted by the drill bit on the sample printed circuit board when the drill bit contacts the sample printed circuit board is measured to obtain the actual holding pressure of the drill bit.

[0028] Determine whether the actual holding pressure of the drill bit is equal to the preset holding pressure;

[0029] If so, control the drill bit to stop moving, so that the drill bit comes into contact with the sample printed circuit board.

[0030] In one embodiment, the step of measuring the pressure exerted by the drill bit on the sample printed circuit board when the drill bit contacts the sample printed circuit board, and obtaining the actual holding pressure of the drill bit, specifically involves:

[0031] The actual holding pressure of the drill bit is obtained by measuring the pressure exerted by the drill bit on the sample printed circuit board when the drill bit comes into contact with the sample printed circuit board using a pressure sensor.

[0032] In one embodiment, the step of obtaining the position parameters of the sample printed circuit board when the sample printed circuit board is tilted specifically involves:

[0033] The positional parameters of the printed circuit board of the sample were obtained when the sample was tilted, using a 3D cube annotation method.

[0034] In one embodiment, the step of measuring the actual angle formed by the sample printed circuit board when the sample printed circuit board is tilted includes:

[0035] Fix the vernier universal angle gauge to the worktable;

[0036] Adjust the vernier universal angle gauge so that the measuring surface of the vernier universal angle gauge is in close contact with the measured surface when the sample printed circuit board is tilted, so as to obtain the actual angle formed by the sample printed circuit board.

[0037] Determine whether the actual angle formed by the sample printed circuit board is equal to the preset angle;

[0038] If not equal, the worktable continues to rotate to adjust the tilt position of the sample printed circuit board until the actual angle formed by the sample printed circuit board is equal to the preset angle, at which point the worktable stops rotating.

[0039] Remove the vernier universal angle gauge.

[0040] In one embodiment, the cutting speed F controlling the drill bit device to drive the drill bit is 2 m / min.

[0041] In one embodiment, the step of inspecting the sample printed circuit board to determine whether the bevel treatment of the gold fingers on the sample printed circuit board meets the standard includes:

[0042] The dimensions of the sample printed circuit board were inspected.

[0043] The printed circuit board of the sample was subjected to visual inspection;

[0044] The solderability, solder resistance, and peel strength of the sample printed circuit board were tested.

[0045] The printed circuit board of the sample was subjected to a separation test.

[0046] In one embodiment, the sample printed circuit board has multiple positioning holes, and the worktable is provided with multiple positioning posts. Each positioning post passes through the positioning hole and is connected to the sample printed circuit board. The specific steps for positioning and fixing the sample printed circuit board to be processed to the worktable are as follows:

[0047] The sample printed circuit board to be processed is positioned and fixed on the worktable through multiple positioning holes.

[0048] In one embodiment, if the bevel treatment of the gold fingers on the sample printed circuit board meets the standard, the specific step of cleaning the sample printed circuit board is as follows:

[0049] The sample printed circuit board was cleaned using a water-based cleaning process.

[0050] Compared with the prior art, the present invention has at least the following advantages:

[0051] 1. Because the drilling equipment is a small device suitable for standalone operation, specifically for beveling sample printed circuit boards (PCBs), when operators use it to bevele the gold fingers of PCBs, the drilling equipment operates for a longer time compared to an automatic beveling machine. This avoids the problem of high power consumption from repeatedly turning the drilling equipment on and off in a short period. The longer processing time for a single PCB sample results in lower power consumption during this continuous operation, making the drilling equipment more energy-efficient for beveling the gold fingers of PCBs.

[0052] 2. Because the drilling equipment can adjust the chamfering angle of the drill bit according to the actual angle and the compensation angle of the drilling equipment, the actual angle is adjusted by rotating the worktable, and the compensation angle of the drilling equipment is controlled and adjusted by the drilling equipment itself. After the above two angles are adjusted, the chamfering angle of the drill bit is fixed. That is, the chamfering angle of the drill bit can be adjusted by adjusting the rotation of the worktable and the compensation angle of the drilling equipment. Compared with the automatic beveling machine, the tool adjustment is simpler, which makes it more convenient for operators to perform adjustment operations. This makes the adjustment of the drill bit of the drilling equipment less difficult for operators, thus making the processing of the beveling of the gold fingers of the sample printed circuit board more convenient. Attached Figure Description

[0053] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0054] Figure 1 A flowchart illustrating a method for processing the beveled edges of gold fingers on a sample printed circuit board based on a drill bit device, according to one embodiment.

[0055] Figure 2 The sample printed circuit board of one embodiment has a thickness of 5mm and a bevel treatment angle of 50°, and the bevel depth analysis table is provided.

[0056] Figure 3 The sample printed circuit board of one embodiment has a thickness of 5mm and a bevel treatment angle of 50°, and the bevel depth analysis diagram is shown.

[0057] Figure 4 This is a schematic diagram of the structure of the drill bit equipment and the sample printed circuit board, which is an embodiment of a method for processing the beveled edge of the gold fingers of a sample printed circuit board based on a drill bit equipment.

[0058] Figure 5for Figure 4 Enlarged schematic diagram of point A of the drill bit equipment shown.

[0059] Figure 6 for Figure 4 The diagram shows the structure of the drill bit device with its worktable rotated to a preset angle. Detailed Implementation

[0060] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0061] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0062] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0063] This invention provides a method for processing the beveled edges of gold fingers on a sample printed circuit board (PCB) using a drilling equipment, comprising: placing the formed sample PCB to be processed on the worktable of the drilling equipment; positioning and fixing the sample PCB to be processed on the worktable; grinding the drill bit of the drilling equipment to form a chamfer; installing the ground drill bit onto the drilling equipment; aligning the cutting edge of the drill bit with the gold fingers of the sample PCB to make the drill bit contact the sample PCB; rotating the worktable to tilt the sample PCB, and simultaneously acquiring the position parameters of the sample PCB when it is tilted; measuring the beveled edges of the gold fingers on the sample PCB. The actual angle formed by the sample printed circuit board when the circuit board is tilted; the chamfering angle of the drill bit is adjusted according to the actual angle and the compensation angle of the drill bit device; the drill bit of the drill bit device is controlled to drill and remove the gold fingers of the sample printed circuit board to form a chamfer on the gold fingers of the sample printed circuit board; the drill bit of the drill bit device is controlled to work to complete the bevel treatment of the gold fingers of the sample printed circuit board; the sample printed circuit board is inspected to determine whether the bevel treatment of the gold fingers of the sample printed circuit board meets the standard; if the bevel treatment of the gold fingers of the sample printed circuit board meets the standard, the sample printed circuit board is cleaned; wherein, the thickness of the sample printed circuit board is greater than 3mm.

[0064] The aforementioned method for beveling the gold fingers of sample printed circuit boards based on a drilling device is suitable for standalone operation, as the drilling device is a small piece of equipment. Specifically, it is suitable for beveling the gold fingers of sample printed circuit boards. When an operator uses the drilling device to bevele the gold fingers of a sample printed circuit board, the drilling device operates for a longer time compared to an automatic beveling machine. This avoids the problem of high power consumption caused by repeatedly turning the drilling device on and off in a short period. Consequently, the processing time for processing a single sample printed circuit board is longer, resulting in lower power consumption during continuous operation. Therefore, the drilling device exhibits good energy efficiency in beveling the gold fingers of sample printed circuit boards. Because the drilling equipment can adjust the chamfering angle of the drill bit based on the actual angle and the compensation angle of the drilling equipment, the actual angle is adjusted by rotating the worktable, and the compensation angle of the drilling equipment is controlled and adjusted by the drilling equipment itself. After the above two angles are adjusted, the chamfering angle of the drill bit is fixed. That is, the chamfering angle of the drill bit can be adjusted by adjusting the rotation of the worktable and the compensation angle of the drilling equipment. Compared with the automatic beveling machine, the tool adjustment is simpler, making it more convenient for operators to perform adjustment operations. This reduces the difficulty for operators to adjust the drill bit of the drilling equipment, thus making the beveling of the gold fingers of the sample printed circuit board more convenient.

[0065] To better understand the technical solution and beneficial effects of the present invention, the present invention will be further described in detail below with reference to specific embodiments:

[0066] like Figures 1 to 6 As shown, an embodiment of the bevel processing method for the gold fingers 201 of a sample printed circuit board 20 based on a drill bit device 10 is used for bevel processing of the gold fingers 201 of the sample printed circuit board 20. Further, the bevel processing method for the gold fingers 201 of the sample printed circuit board 20 based on the drill bit device 10 includes some or all of the following steps:

[0067] S101, the molded sample printed circuit board 20 to be processed is placed on the worktable 100 of the drill bit equipment 10.

[0068] In this embodiment, before the bevel treatment, the gold fingers 201 of the sample printed circuit board 20 are inspected to avoid the sample printed circuit board 20 from malfunctioning when plugged in after the bevel treatment due to missing or damaged gold fingers 201, thereby reducing the failure rate of the sample printed circuit board 20.

[0069] S103, the printed circuit board 20 of the sample to be processed is positioned and fixed on the worktable 100.

[0070] In this embodiment, the sample printed circuit board 20 to be processed is positioned and fixed on the worktable 100 so that the position of the sample printed circuit board 20 is fixed by the worktable 100, so that the position stability of the sample printed circuit board 20 is better when the bevel is processed, and the shaking of the sample printed circuit board 20 is reduced when the bevel is processed.

[0071] S105, the drill bit 200 of the drill bit device 10 is ground to form a chamfer 210.

[0072] In this embodiment, the drill bit 200 is placed on the operating platform of the grinding machine, and the grinding wheel of the grinding machine is aligned with the end of the drill bit 200 to grind it so that the end of the drill bit 200 forms a chamfer 210.

[0073] S107, the drill bit 200, after being polished, is installed on the drill bit device 10.

[0074] In this embodiment, the drill bit device 10 is provided with a connection hole 300, and the drill bit 200 passes through the connection hole 300 and is detachably connected to the drill bit device 10, so that the installation between the drill bit 200 and the drill bit device 10 is more convenient.

[0075] S109, Align the cutting edge of the drill bit 200 with the gold finger 201 of the sample printed circuit board 20 so that the drill bit 200 contacts the sample printed circuit board 20.

[0076] In this embodiment, the cutting edge of the drill bit 200 is the chamfered part 210 after grinding. Before the drill bit 200 starts working, according to the manufacturing process operation specifications, it needs to be "set up" so that the drill bit 200 contacts the sample printed circuit board 20, thereby ensuring that the cutting edge of the drill bit 200 is aligned with the area of ​​the gold finger 201 that needs to be beveled.

[0077] S111, the worktable 100 is rotated so that the sample printed circuit board 20 is tilted, and the position parameters of the sample printed circuit board are obtained when the sample printed circuit board is tilted.

[0078] In this embodiment, the drill bit 200 is kept vertical, so that an angle is formed between the drill bit 200 and the sample printed circuit board 20. This makes it easier for the drill bit 200 to chamfer the gold fingers 201 during beveling, thus improving the working efficiency of the drilling equipment 10. Furthermore, during the fabrication of the sample printed circuit board 20, continuous adjustments are needed to correct errors and obtain the position parameters of the sample printed circuit board 20. This facilitates the positioning of the sample printed circuit board 20 in the next iteration, thereby improving the fabrication efficiency of the sample printed circuit board 20.

[0079] S113, Measure the actual angle formed by the sample printed circuit board 20 when the sample printed circuit board 20 is tilted.

[0080] In this embodiment, the actual angle is the angle formed between the sample printed circuit board 20 and the ground. The sample printed circuit board 20 is parallel to the placement surface 110 of the workbench 100. That is, the actual angle is also the angle formed between the workbench 100 and the ground.

[0081] S115, the chamfering angle of the drill bit 200 is adjusted according to the actual angle and the compensation angle of the drill bit device 10.

[0082] In this embodiment, the compensation angle of the drill bit device 10 is compensated based on the measured pressure so that the deformation of the sample printed circuit board 20 has a smaller impact on the chamfering angle of the drill bit 200, thereby improving the accuracy of the bevel processing of the gold finger 201.

[0083] S117, control the drill bit 200 of the drilling device 10 to drill and remove the gold fingers 201 of the sample printed circuit board 20, so as to process and shape the chamfer on the gold fingers 201 of the sample printed circuit board 20.

[0084] In this embodiment, the drill bit 200 drills away the gold fingers 201 of the sample printed circuit board 20. During the drilling process, debris is generated at the gold fingers 201 of the sample printed circuit board 20. If the debris is not cleaned properly, it will adhere to the gold fingers 201, resulting in poor contact performance at the gold fingers 201 of the sample printed circuit board 20. Conversely, if the debris is cleaned properly, it will be difficult for the debris to adhere to the gold fingers 201, resulting in better contact performance at the gold fingers 201 of the sample printed circuit board 20.

[0085] S119, control the drilling device 10 to drive the drill bit 200 to work, so as to complete the bevel processing of the gold finger 201 of the sample printed circuit board 20.

[0086] In this embodiment, the control drill bit device 10 drives the drill bit 200 to work, so that the drill bit 200 cuts the gold fingers 201 of the sample printed circuit board 20, and completes the bevel treatment of the gold fingers 201 of the sample printed circuit board 20.

[0087] S121, the sample printed circuit board 20 is inspected to determine whether the bevel treatment of the gold fingers 201 of the sample printed circuit board 20 meets the standard.

[0088] In this embodiment, the sample printed circuit board 20 is inspected to determine whether the bevel treatment of the gold fingers 201 of the sample printed circuit board 20 meets the standard, thereby improving the pass rate of the sample printed circuit board 20; if the bevel treatment of the gold fingers 201 of the sample printed circuit board 20 does not meet the standard, the sample printed circuit board 20 is further processed.

[0089] S123, if the bevel treatment of the gold fingers 201 of the sample printed circuit board 20 meets the standard, then the sample printed circuit board 20 is cleaned.

[0090] In this embodiment, the sample printed circuit board 20 is cleaned to remove debris from the gold fingers 201 of the sample printed circuit board 20, so that the sample printed circuit board 20 can be used quickly, thereby improving the ease of use of the sample printed circuit board 20.

[0091] Furthermore, the thickness of the sample printed circuit board 20 is greater than 3 mm.

[0092] In one embodiment, Figure 2 A table analyzing the bevel depth of a sample printed circuit board with a thickness of 5mm and a bevel angle of 50°. Figure 3 The image shows the bevel depth of a 5mm thick printed circuit board sample with a 50° bevel angle. Blue marks represent standard values, and red marks represent measured values.

[0093] The above-described method for beveling the gold fingers 201 of a sample printed circuit board 20 based on the drill bit device 10 is suitable for standalone operation, as the drill bit device 10 is a small device. Specifically, the drill bit device 10 is suitable for beveling the gold fingers 201 of the sample printed circuit board 20. When the operator uses the drill bit device 10 to bevele the gold fingers 201 of the sample printed circuit board 20, the drill bit device 10 has a longer operating time compared to an automatic beveling machine. This avoids the problem of high power consumption caused by repeatedly turning the drill bit device 10 on and off in a short period. This results in a longer processing time for each sample printed circuit board, leading to lower power consumption during continuous operation. Consequently, the drill bit device 10 exhibits good energy efficiency in beveling the gold fingers 201 of the sample printed circuit board 20. Since the drilling equipment 10 can adjust the chamfering angle 210 of the drill bit 200 according to the actual angle and the compensation angle of the drilling equipment 10, the actual angle is adjusted by the rotation of the worktable 100, and the compensation angle of the drilling equipment 10 is controlled and adjusted by the drilling equipment 10 itself. After the above two angles are adjusted, the chamfering angle 210 of the drill bit 200 is fixed. That is, the chamfering angle 210 of the drill bit 200 can be adjusted by adjusting the rotation of the worktable 100 and the compensation angle of the drilling equipment 10. Compared with the automatic beveling machine, the tool adjustment is simpler, which makes it more convenient for the operator to perform the adjustment operation. This makes the adjustment of the drill bit 200 of the drilling equipment 10 less difficult for the operator, thus making the beveling of the gold fingers 201 of the sample printed circuit board 20 easier.

[0094] like Figures 4 to 6 As shown, in one embodiment, the step of grinding the drill bit 200 of the drill bit device 10 includes: selecting the drill bit 200 and placing it on the operating platform of the grinding machine; fixing the drill bit 200 on the operating platform; adjusting the angle of the grinding machine according to the required angle of the bevel; controlling the grinding machine to grind the drill bit 200 so that the drill bit 200 forms a chamfer 210 with a preset angle, so that the ground drill bit 200 becomes a tool specifically for processing the bevel of the gold finger 201, thereby enabling the ground drill bit 200 to be used repeatedly, improving the reusability of the ground drill bit 200, and thus making the drill bit device 10 more applicable.

[0095] In one embodiment, the step of aligning the cutting edge of the drill bit with the gold fingers of the sample printed circuit board (PCB) to bring the drill bit into contact with the PCB includes: aligning the cutting edge of the drill bit with the gold fingers of the PCB; controlling the drill bit to move towards the gold fingers of the PCB, while simultaneously measuring the pressure exerted by the drill bit on the PCB when it contacts the PCB to obtain the actual holding pressure of the drill bit; determining whether the actual holding pressure of the drill bit is equal to a preset holding pressure; if so, controlling the drill bit to stop moving, bringing the drill bit into contact with the PCB. In this embodiment, if the actual holding pressure of the drill bit 200 is too high when it contacts the PCB 20, it will damage the PCB 20, rendering it unusable and increasing the manufacturing cost of the PCB 20. To prevent damage to the sample printed circuit board 20, a preset holding pressure is set, which is a range value, denoted as X. Based on the properties of the sample printed circuit board 20, the maximum stress that the sample printed circuit board 20 can withstand is set to N. Therefore, the range of the preset holding pressure is 0 > X and less than or equal to N / 2. When X is greater than 0, it indicates that the drill bit 200 is in contact with the sample printed circuit board 20. Since the actual maximum holding pressure is N / 2, that is, half of the maximum stress that the sample printed circuit board 20 can withstand, the actual holding pressure of the drill bit 200 when processing the sample printed circuit board 20 is relatively small, avoiding damage to the sample printed circuit board 20 and thus reducing the manufacturing cost of the sample printed circuit board 20.

[0096] In one embodiment, the step of measuring the pressure exerted by the drill bit 200 on the sample printed circuit board 20 when the drill bit 200 contacts the sample printed circuit board 20, and obtaining the actual holding pressure of the drill bit 200, specifically involves: measuring the pressure exerted by the drill bit 200 on the sample printed circuit board 20 when the drill bit 200 contacts the sample printed circuit board 20 using a pressure sensor (not shown), and obtaining the actual holding pressure of the drill bit 200. In this embodiment, the drill bit 200 is equipped with a pressure sensor, which is electrically connected to a computer. When the drill bit 200 abuts against the sample printed circuit board 20, the pressure sensor transmits information to the computer so that the computer can obtain the actual holding pressure of the drill bit 200. The pressure sensor is a real-time feedback instrument, allowing the operator to obtain the real-time actual holding pressure of the drill bit 200 through the computer, thereby improving the operator's ease of adjustment of the drill bit 200 and thus improving the ease of handling of the drill bit device 10.

[0097] In one embodiment, the step of obtaining the position parameters of the sample printed circuit board when it is tilted specifically involves: using a 3D cube annotation method to obtain the position parameters of the sample printed circuit board when it is tilted. In this embodiment, the 3D cube annotation method is a method of obtaining a spatial visual model from a 2D image or video to measure the relative distance between objects. This allows the operator to obtain a spatial visual model of the sample printed circuit board 20. Compared to a planar model, the spatial visual model has higher dimensional accuracy, thereby resulting in higher coordinate accuracy of the position parameters of the sample printed circuit board 20.

[0098] In one embodiment, the step of measuring the actual angle formed by the sample printed circuit board when it is tilted includes: fixing a vernier universal protractor to the worktable; adjusting the vernier universal protractor so that its measuring surface is in close contact with the measured surface of the sample printed circuit board when it is tilted, thereby obtaining the actual angle formed by the sample printed circuit board; determining whether the actual angle formed by the sample printed circuit board is equal to a preset angle; if not, controlling the worktable to continue rotating to adjust the tilt position of the sample printed circuit board until the actual angle formed by the sample printed circuit board is equal to the preset angle, at which point the worktable stops rotating; and removing the vernier universal protractor. In this embodiment, the vernier universal protractor is an angle measuring tool that uses the vernier reading principle to directly measure the angle of a workpiece or to scribing lines. The vernier universal protractor is suitable for measuring internal and external angles in machining, making it more flexible in measuring the actual angle formed by the sample printed circuit board 20, thereby improving the efficiency of processing the beveled edge of the gold fingers 201 of the sample printed circuit board 20.

[0099] In one embodiment, the cutting speed F of the drill bit 200 driven by the control drill bit device 10 is 2m / min, which makes the cutting speed of the drill bit 200 slower during the bevel treatment of the gold finger 201. This results in a better treatment effect of the drill bit 200 on the bevel treatment of the gold finger 201, while avoiding the problem of damage to the drill bit 200 caused by a large amount of heat generated by rapid cutting, thereby improving the service life of the drill bit 200.

[0100] In one embodiment, the step of inspecting the sample printed circuit board to determine whether the beveled edge treatment of the gold fingers of the sample printed circuit board meets the standards includes: inspecting the dimensions of the sample printed circuit board; inspecting the appearance of the sample printed circuit board; inspecting the solderability, solder resist, and peel strength of the sample printed circuit board; and inspecting the separability of the sample printed circuit board. In this embodiment, the sample printed circuit board 20 is considered a qualified product only after passing the dimensions inspection, appearance inspection, solderability, solder resist, and peel strength inspection, and separability inspection in sequence, thus ensuring a high product quality.

[0101] like Figures 4 to 6 As shown, in one embodiment, the sample printed circuit board 20 has multiple positioning holes 202, and the worktable 100 is provided with multiple positioning posts 120. Each positioning post 120 passes through the positioning hole 202 and is connected to the sample printed circuit board 20. The specific step of positioning and fixing the sample printed circuit board 20 to be processed to the worktable 100 is as follows: the sample printed circuit board 20 to be processed is positioned and fixed to the worktable 100 through the multiple positioning holes 202. In this embodiment, each positioning post 120 passes through the positioning hole 202 and is connected to the sample printed circuit board 20, so that the positional stability of the sample printed circuit board 20 is better under the fixation of the multiple positioning posts 120, reducing the shaking of the sample printed circuit board 20 during the bevel processing of the gold finger 201, and making the processing accuracy of the drilling device 10 better.

[0102] Furthermore, the worktable 100 includes a fixed base 130 and a placement base 140. The fixed base 130 and the placement base 140 are rotatably connected so that the placement base 140 rotates around the fixed base 130. The fixed base 130 is movably connected to the drill bit device 10. Multiple positioning posts 120 are disposed on the placement base 140. A placement surface 110 is formed on the placement base 140. The sample printed circuit board 20 is formed with multiple positioning holes 202 so that the sample printed circuit board 20 is fixed to the placement base 140 and rotates with the placement base 140 so that the sample printed circuit board 20 is tilted.

[0103] In one embodiment, if the bevel treatment of the gold fingers on the sample printed circuit board meets the standard, the specific step of cleaning the sample printed circuit board is as follows: cleaning the sample printed circuit board using a water-based cleaning process. In this embodiment, the water-based cleaning process uses water as the cleaning medium. To improve the cleaning effect, a small amount of surfactants, detergents, corrosion inhibitors, and other chemical substances (generally at a content of 2%-10%) can be added to the water. The surfactant is glyceryl stearate monoester, the detergent is monoethanolamine, and the corrosion inhibitor is the copper corrosion inhibitor methylbenzotriazole. The water-based cleaning process has a better cleaning effect, separating debris from the beveled surface of the gold fingers 201, thereby resulting in a better bevel treatment quality at the gold fingers 201 of the sample printed circuit board 20.

[0104] Furthermore, to enhance the effectiveness of water-based cleaning processes, additives can be added to the water to broaden the application range of the process and improve its ability to dissolve water-soluble dirt, thereby further enhancing the cleaning effect.

[0105] Furthermore, to enhance the effectiveness of water-based cleaning processes, physical methods can be employed as supplementary cleaning techniques. These physical methods include heating, brushing, spraying, and ultrasonic cleaning.

[0106] Furthermore, the water-based cleaning process for cleaning the qualified sample printed circuit board 20 after testing includes: First, placing the qualified sample printed circuit board 20 in an immersion tank for solvent heating and immersion cleaning, while simultaneously oscillating the immersion tank to ensure that the immersion liquid can fully and quickly penetrate the area where debris meets the chamfered surface, allowing for better separation of debris from the chamfered surface of the gold fingers 201; Second, performing a cold rinsing operation on the sample printed circuit board 20 after heating and immersion. Based on the principle of thermal expansion and contraction, the cold rinsing operation after heating and immersion will further clean the chamfered area. The debris underwent thermal expansion and contraction, causing it to separate from the chamfered surface. Next, the sample printed circuit board 20, after cold rinsing, was subjected to a spray cleaning operation. The impact of the sprayed liquid on the chamfered surface allowed for rapid separation of the chamfered surface from the debris, while also preventing the debris from being missed in the confined space of the chamfer. Finally, the sample printed circuit board 20, after spray cleaning, underwent a vapor-phase rinsing and drying operation. The gas was used to dry the chamfered area of ​​the gold fingers 201, resulting in better drying of the chamfered surface and preventing moisture residue at the chamfered area of ​​the gold fingers 201 on the sample printed circuit board 20.

[0107] Furthermore, the specific steps for performing a spray cleaning operation on the sample printed circuit board 20 after the cold rinsing operation are as follows: The sample printed circuit board 20 after the cold rinsing operation is sprayed at a preset spray angle. The preset spray angle changes periodically with the spraying time.

[0108] Furthermore, the preset spray angle changes periodically with the spray time, specifically: the preset spray angle is 12° in the first spray time period, 30° in the second spray time period, and 50° in the third spray time period. This avoids the problem of sporadic debris remaining on the chamfered surface, ensuring that the sample printed circuit board 20 has a better spray cleaning effect after the cold rinsing operation. In this embodiment, the first time period is 10s, the second time period is 15s, and the third time period is 5s.

[0109] It is understandable that the cutting edge of the drill bit 200 and the gold fingers 201 of the sample printed circuit board 20 can be tangent in two ways: one is internal tangent, and the other is external tangent. The deformation of the sample printed circuit board 20 caused by internal tangent and external tangent are different.

[0110] When the cutting edge of the drill bit 200 is internally cut to the gold finger 201 of the sample printed circuit board 20, the angle at which the drill bit 200 performs chamfering 210 is equal to the actual angle plus the compensation angle of the drill bit device 10.

[0111] When the cutting edge of the drill bit 200 is externally cut to the gold fingers 201 of the sample printed circuit board 20, the chamfering angle of the drill bit 200 is equal to the actual angle minus the compensation angle of the drill bit device 10. In summary, the compensation angle of the drill bit device 10 is used to compensate for the angle change caused by the deformation of the sample printed circuit board 20. It is adjusted by measuring the pressure so that the deformation effect of the sample printed circuit board 20 can be offset by adjusting the compensation angle of the drill bit device 10, making the processing of the drill bit device 10 more convenient.

[0112] Furthermore, the measured pressure can be fed back to the operator in real time. Based on the tangency of the cutting edge of the drill bit 200 with the gold fingers 201 of the sample printed circuit board 20, the operator can easily calculate the chamfering angle of the drill bit 200, which makes the data feedback of the drill bit device 10 more reliable in real time, thereby enabling the operator to operate the drill bit device 10 better.

[0113] Furthermore, when the measured pressure value is "0", it can be determined that the cutting edge of the drill bit 200 is separated from the gold finger 201 of the sample printed circuit board 20. At this time, the compensation angle of the drill bit device 10 is "0". Therefore, the angle at which the drill bit 200 performs chamfering 210 is equal to the actual angle, which makes the processing of the beveled edge of the gold finger 201 of the sample printed circuit board 20 more convenient.

[0114] In one embodiment, the edges of the sample printed circuit board 20 need to be polished to remove burrs and barbs, so that the edges of the sample printed circuit board 20 are smoother and will not scratch operators during use, thereby improving the safety of the sample printed circuit board 20.

[0115] Furthermore, the corners of the sample printed circuit board 20 need to be chamfered. While grinding the edges of the sample printed circuit board 20, the drill bit 200 also needs to chamfer the corners. After completing the chamfering operation, the drill bit 200 returns in the opposite direction to grind the edges again, thus completing the secondary grinding of the edges of the sample printed circuit board 20, which makes the grinding accuracy of the edges of the sample printed circuit board 20 better.

[0116] Furthermore, when the drill bit 200 performs two grinding processes on the edge of the sample printed circuit board 20, the first grinding process chamfers the corner at the end point, and the second grinding process chamfers the corner at the starting point, so that the edge of one side and two corners of the sample printed circuit board 20 are all ground, resulting in a better finish for the sample printed circuit board 20. The tool path direction for the first grinding process is opposite to that for the second grinding process.

[0117] In one embodiment, positioning holes 202 on the sample printed circuit board 20 are arranged around the edge of the printed circuit board. The arrangement of the positioning holes 202 gradually decreases from the edge to the center. Since the deformation of the sample printed circuit board 20 is mainly concentrated at the four corners far from the center, the deformation of the area closer to the center of the printed circuit board is smaller. Therefore, there are fewer positioning holes 202 closer to the center, which makes the arrangement of positioning holes 202 on the sample printed circuit board 20 more reasonable.

[0118] Furthermore, the number of positioning holes 202 is proportional to the edge length of the sample printed circuit board 20. That is, the longer the edge length of the sample printed circuit board 20, the more positioning holes 202 are distributed on the edge of the sample printed circuit board 20, so as to reduce the deformation of the sample printed circuit board 20 and strengthen the structural strength of the sample printed circuit board 20.

[0119] Compared with the prior art, the present invention has at least the following advantages:

[0120] 1. Since the drill bit device 10 is a small device suitable for standalone operation, that is, the drill bit device 10 is suitable for beveling the sample printed circuit board 20. When the operator uses the drill bit device 10 to bevele the gold fingers 201 of the sample printed circuit board 20, the drill bit device 10 has a longer running time compared to an automatic beveling machine. This avoids the problem of the drill bit device 10 consuming a lot of electricity when it is turned on and off in a short period of time. This makes the processing time of the drill bit device 10 when processing a sample printed circuit board longer, and thus the power consumption of the drill bit device during the continuous operation of processing a sample printed circuit board is smaller. As a result, the drill bit device 10 has better energy efficiency when beveling the gold fingers 201 of the sample printed circuit board 20.

[0121] 2. Since the drilling equipment 10 can adjust the chamfering angle 210 of the drill bit 200 according to the actual angle and the compensation angle of the drilling equipment 10, the actual angle is adjusted by the rotation of the worktable 100, and the compensation angle of the drilling equipment 10 is controlled and adjusted by the drilling equipment 10 itself. After the above two angles are adjusted, the chamfering angle 210 of the drill bit 200 is fixed. That is, the chamfering angle 210 of the drill bit 200 can be adjusted by adjusting the rotation of the worktable 100 and the compensation angle of the drilling equipment 10. Compared with the automatic beveling machine, the tool adjustment is simpler, which makes it more convenient for the operator to perform the adjustment operation. This makes the adjustment of the drill bit 200 of the drilling equipment 10 less difficult for the operator, thus making the beveling of the gold fingers 201 of the sample printed circuit board 20 easier.

[0122] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for processing a sample printed wiring board gold finger bevel based on a drill tip apparatus, the method comprising: include: ​ The shaped printed circuit board sample to be processed is placed on the worktable of the drilling equipment. The printed circuit board sample to be processed is positioned and fixed on the worktable; The drill bit of the aforementioned drilling equipment is ground to form a chamfer; The drill bit, after being polished, is installed on the drill bit device; Align the cutting edge of the drill bit with the gold fingers of the sample printed circuit board so that the drill bit contacts the sample printed circuit board; The worktable is rotated to tilt the sample printed circuit board, and the position parameters of the sample printed circuit board are obtained when the sample printed circuit board is tilted. Measure the actual angle formed by the sample printed circuit board when the sample printed circuit board is tilted. The chamfering angle of the drill bit is adjusted based on the actual angle and the compensation angle of the drill bit equipment. The drill bit of the drilling device is controlled to drill and remove the gold fingers of the sample printed circuit board, so as to form a chamfer on the gold fingers of the sample printed circuit board. The drilling device is controlled to drive the drill bit to work in order to complete the bevel processing of the gold fingers of the sample printed circuit board; The sample printed circuit board is inspected to determine whether the bevel treatment of the gold fingers on the sample printed circuit board meets the standards. If the beveled edge treatment of the gold fingers on the sample printed circuit board meets the standard, then the sample printed circuit board is cleaned. The thickness of the printed circuit board in the sample is greater than 3mm.

2. The method of beveling a gold finger of a sample printed wiring board based on a bit tip apparatus according to claim 1, wherein The steps for grinding the drill bit of the aforementioned drilling equipment include: The drill bit is selected and placed on the operating platform of the grinding machine; The drill bit is fixed to the operating platform; The grinding machine is angled according to the required angle of the bevel. The grinding machine is controlled to grind the drill bit so that the drill bit forms a chamfer with a preset angle.

3. The method of beveling a gold finger of a sample printed wiring board based on a bit tip apparatus as recited in claim 1, wherein, The step of aligning the cutting edge of the drill bit with the gold fingers of the sample printed circuit board to make the drill bit contact the sample printed circuit board includes: Align the cutting edge of the drill bit with the gold fingers of the sample printed circuit board; The drill bit is controlled to move toward the gold fingers of the sample printed circuit board, and the pressure exerted by the drill bit on the sample printed circuit board when the drill bit contacts the sample printed circuit board is measured to obtain the actual holding pressure of the drill bit. Determine whether the actual holding pressure of the drill bit is equal to the preset holding pressure; If so, control the drill bit to stop moving, so that the drill bit comes into contact with the sample printed circuit board.

4. The method of claim 3, wherein the method further comprises: The specific steps for measuring the pressure exerted by the drill bit on the sample printed circuit board when the drill bit contacts the sample printed circuit board, and obtaining the actual bearing pressure of the drill bit, are as follows: The actual holding pressure of the drill bit is obtained by measuring the pressure exerted by the drill bit on the sample printed circuit board when the drill bit comes into contact with the sample printed circuit board using a pressure sensor.

5. The method of beveling a gold finger of a sample printed wiring board based on a bit tip apparatus as recited in claim 1, wherein, The specific steps for obtaining the position parameters of the sample printed circuit board when it is tilted are as follows: The positional parameters of the printed circuit board of the sample were obtained when the sample was tilted, using a 3D cube annotation method.

6. The method of beveling a gold finger of a sample printed wiring board based on a bit tip apparatus as recited in claim 1, wherein, The steps for measuring the actual angle formed by the sample printed circuit board when the sample printed circuit board is tilted include: Fix the vernier universal angle gauge to the worktable; Adjust the vernier universal angle gauge so that the measuring surface of the vernier universal angle gauge is in close contact with the measured surface when the sample printed circuit board is tilted, so as to obtain the actual angle formed by the sample printed circuit board. Determine whether the actual angle formed by the sample printed circuit board is equal to the preset angle; If not equal, the worktable continues to rotate to adjust the tilt position of the sample printed circuit board until the actual angle formed by the sample printed circuit board is equal to the preset angle, at which point the worktable stops rotating. Remove the vernier universal angle gauge.

7. The method of beveling a gold finger of a sample printed wiring board based on a bit tip apparatus as recited in claim 1, wherein, The cutting speed F controlling the drill bit device to drive the drill bit is 2m / min.

8. The method of beveling a gold finger of a sample printed wiring board based on a bit tip apparatus as recited in claim 1, wherein, The steps for inspecting the sample printed circuit board to determine whether the bevel treatment of the gold fingers on the sample printed circuit board meets the standards include: The dimensions of the sample printed circuit board were inspected. The printed circuit board of the sample was subjected to visual inspection; The solderability, solder resistance, and peel strength of the sample printed circuit board were tested. The printed circuit board of the sample was subjected to a separation test.

9. The method of beveling a gold finger of a sample printed wiring board based on a bit tip apparatus as recited in claim 1, wherein, The sample printed circuit board has multiple positioning holes, and the worktable is provided with multiple positioning posts. Each positioning post passes through the positioning hole and is connected to the sample printed circuit board. The specific steps for positioning and fixing the sample printed circuit board to be processed onto the worktable are as follows: The sample printed circuit board to be processed is positioned and fixed on the worktable through multiple positioning holes.

10. The method of beveling a gold finger of a sample printed wiring board based on a bit tip apparatus as recited in claim 1, wherein, If the bevel treatment of the gold fingers on the sample printed circuit board meets the standard, the specific steps for cleaning the sample printed circuit board are as follows: The sample printed circuit board was cleaned using a water-based cleaning process.

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