Reinforcement patch machine control method and device, electronic equipment and storage medium

Abstract

The application discloses a reinforcing patch machine control method and device, electronic equipment and a storage medium, which are applied to a reinforcing patch machine. The reinforcing patch machine is provided with a camera device used for acquiring a circuit board image. The reinforcing patch machine control method comprises the following steps: acquiring first image data of a circuit board surface to be attached, wherein the first image data comprises circuit board model information; determining reinforcing patch model information corresponding to the circuit board model information from a preset model mapping relationship; performing image recognition processing on the first image data to determine reinforcing patch shape information; and performing adjustment processing on a target reinforcing patch according to the reinforcing patch shape information, so that the target reinforcing patch meets a preset attachment condition. The target reinforcing patch represents a reinforcing patch corresponding to the reinforcing patch model information. Through the reinforcing patch machine control method, the attachment efficiency for different circuit boards can be effectively improved.

Description

Technical Field

[0001] This application relates to, but is not limited to, the field of reinforcing patch technology, and particularly to a reinforcing patch machine control method, apparatus, electronic device, and storage medium. Background Technology

[0002] With the trend towards thinner and lighter flexible printed circuit boards (FPCBs), the inherent strength of FPCBs is decreasing. To meet the strength requirements of FPCBs, reinforcing sheets need to be attached to improve their strength. Currently, standardized reinforcing sheets are mainly used for attachment. When the model or specifications of the FPCB are changed, the specifications of the reinforcing sheets need to be manually adjusted, which is cumbersome and reduces production efficiency. Therefore, improving the bonding efficiency for different FPCBs has become an urgent problem to be solved. Summary of the Invention

[0003] This application provides a reinforcement chip mounter control method, apparatus, electronic device, and storage medium, which can effectively improve the bonding efficiency of different circuit boards.

[0004] In a first aspect, embodiments of this application provide a reinforcing pick-and-place machine control method, applied to a reinforcing pick-and-place machine, comprising:

[0005] Acquire first image data of the surface of the circuit board to be bonded, the first image data including circuit board model information;

[0006] From the preset model mapping relationship, determine the reinforcement piece model information corresponding to the circuit board model information;

[0007] The first image data is processed by image recognition to determine the shape information of the reinforcement patch;

[0008] Based on the shape information of the reinforcing sheet, the target reinforcing sheet is adjusted to meet the preset bonding conditions; the target reinforcing sheet is characterized as the reinforcing sheet corresponding to the reinforcing sheet model information.

[0009] The reinforcement patch machine control method provided in this application has at least the following beneficial effects: First image data of the surface of the circuit board to be patched is acquired to obtain the model information of the circuit board. Based on the model information of the circuit board, the model information of the reinforcement piece is determined from a preset model mapping relationship. Image recognition processing is performed on the first image data to determine the shape information of the reinforcement piece to be patched. Then, the target reinforcement piece corresponding to the model information of the reinforcement piece is adjusted according to the shape information of the reinforcement piece so that the target reinforcement piece meets the preset patching conditions. Therefore, by recognizing the first image data of the circuit board to be patched, the reinforcement piece matching the circuit board to be patched can be determined, effectively avoiding the need for manual adjustment of the reinforcement piece when the model or specifications of the circuit board to be patched change, thus improving production efficiency.

[0010] According to some embodiments of the first aspect of this application, adjusting the target reinforcing sheet based on the shape information of the reinforcing sheet to make the target reinforcing sheet meet preset bonding conditions includes:

[0011] Obtain the second image data of the circuit board to be bonded in the vertical direction;

[0012] The thickness of the circuit board to be bonded is determined using the second image data;

[0013] The area of ​​the circuit board to be bonded is determined using the first image data;

[0014] The thickness information of the reinforcing sheet is determined based on the area of ​​the circuit board to be bonded, the shape information of the reinforcing sheet, and the thickness of the circuit board to be bonded.

[0015] Based on the shape information and thickness information of the reinforcing sheet, the target reinforcing sheet is adjusted to meet the preset bonding conditions.

[0016] According to some embodiments of the first aspect of this application, determining the thickness information of the reinforcing sheet based on the area of ​​the circuit board to be bonded, the shape information of the reinforcing sheet, and the thickness of the circuit board to be bonded includes...

[0017] The scaling factor is determined based on the area of ​​the circuit board to be bonded and the area of ​​the reinforcing sheet;

[0018] The thickness of the circuit board to be bonded is calculated using the scaling factor to determine the thickness information of the reinforcing sheet.

[0019] According to some embodiments of the first aspect of this application, the step of performing image recognition processing on the first image data to determine the shape information of the reinforcing patch includes:

[0020] By processing the pixels of the first image data, the bonding area on the surface of the circuit board to be bonded is obtained;

[0021] The shape information of the reinforcing sheet is determined based on the shape of the area to be bonded;

[0022] According to some embodiments of the first aspect of this application, it also includes:

[0023] A bonding region coordinate system is constructed for the region to be bonded, and the coordinates of the center point of the region are determined using the edge coordinate points of the region to be bonded.

[0024] A coordinate system for the target reinforcement piece is constructed, and the coordinates of the center point of the reinforcement piece are determined using the edge coordinate points of the target reinforcement piece.

[0025] The suction head is controlled to attach the target reinforcement piece to the circuit board to be bonded, so that the coordinates of the center point of the region coincide with the coordinates of the center point of the reinforcement piece.

[0026] According to some embodiments of the first aspect of this application, after controlling the adhesive head to adhere the target reinforcing sheet to the circuit board to be adhered, such that the coordinates of the center point of the region coincide with the coordinates of the center point of the reinforcing sheet, the following steps are included:

[0027] Obtain a third image of the surface of the laminated circuit board;

[0028] The preset template image is compared with the third image. If there is a difference between the third image and the preset template image, the third image is marked.

[0029] According to some embodiments of the first aspect of this application, it also includes:

[0030] When the model information of the reinforcing piece corresponding to the model information of the circuit board cannot be determined from the preset model mapping relationship, a warning message is issued.

[0031] Secondly, embodiments of this application provide a reinforcing patch device, applied to a reinforcing patch machine, comprising:

[0032] A camera device is used to acquire first image data of the surface of a circuit board, the first image data including circuit board model information;

[0033] A control device, connected to the camera device, is used to determine the reinforcing sheet model information corresponding to the circuit board model information from a preset model mapping relationship; perform image recognition processing on the first image data to determine the reinforcing sheet shape information; and adjust the target reinforcing sheet according to the reinforcing sheet shape information so that the target reinforcing sheet meets preset bonding conditions; the target reinforcing sheet is characterized as the reinforcing sheet corresponding to the reinforcing sheet model information.

[0034] Thirdly, embodiments of this application provide an electronic device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the reinforcement placement machine control method as described in the first aspect.

[0035] Fourthly, embodiments of this application provide a computer-readable storage medium storing computer-executable instructions for causing a computer to perform the reinforcement placement machine control method as described in the first aspect. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the structure of a reinforcing patch device provided in one embodiment of this application;

[0037] Figure 2 This is a flowchart of the reinforcement placement machine control method provided in the embodiments of this application;

[0038] Figure 3 yes Figure 2 Detailed flowchart of step S400;

[0039] Figure 4 yes Figure 3 Detailed flowchart of step S430;

[0040] Figure 5 yes Figure 2 Detailed flowchart of step S300;

[0041] Figure 6 This is a flowchart of a reinforcement patch machine control method provided in another embodiment of this application;

[0042] Figure 7 yes Figure 6 The detailed flowchart following step S700;

[0043] Figure 8 This is a flowchart of a reinforcement patch machine control method provided in another embodiment of this application;

[0044] Figure 9 This is a schematic diagram of the hardware structure of an electronic device provided in another embodiment of this application.

[0045] The accompanying drawings are used to provide a further understanding of the technical solutions of this application and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions of this application. Detailed Implementation

[0046] This section will describe in detail the specific embodiments of this application. Preferred embodiments of this application are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of this application, but they should not be construed as limiting the scope of protection of this application.

[0047] It should be understood that in the description of the embodiments of this application, the use of terms such as "first" and "second" is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features indicated, or implicitly indicating the order of the technical features indicated. "At least one" means one or more, and "more than one" means two or more. "At least one of the following" and similar expressions refer to any combination of these items, including any combination of single or multiple items.

[0048] Furthermore, unless otherwise explicitly specified and limited, the term "connection / linkage" should be interpreted broadly, for example, it can be a fixed connection or a movable connection, a detachable connection or a non-detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection or a connection that can communicate with each other; it can be a direct connection or an indirect connection through an intermediate medium.

[0049] In the description of the embodiments in this application, the terms "one embodiment / implementation," "another embodiment / implementation," or "some embodiments / implementations," "in the above embodiments / implementations," etc., refer to specific features, structures, materials, or characteristics described in conjunction with embodiments or examples that are included in at least two embodiments or implementations of this disclosure. In this disclosure, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or implementation. It should be noted that although a logical order is shown in the flowcharts, in some cases, the steps shown or described may be performed in a different order than that shown in the flowcharts.

[0050] It should be noted that the technical features involved in the various embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0051] This application provides a control method, apparatus, device, and storage medium for a reinforcing patch machine. The machine acquires first image data of the surface of a circuit board to be patched using a camera device. This first image data includes circuit board model information. A control module determines the reinforcing piece model information corresponding to the circuit board model information from a preset model mapping relationship. Image recognition processing is performed on the first image data to determine the shape information of the reinforcing piece. Based on the shape information, the target reinforcing piece is adjusted to meet preset patching conditions. Therefore, by recognizing the first image data of the circuit board to be patched, a reinforcing piece matching the circuit board can be determined, effectively avoiding the need for manual adjustment of the reinforcing piece when the circuit board model or specifications change, thus improving production efficiency.

[0052] The embodiments of this application will be further described below with reference to the accompanying drawings.

[0053] refer to Figure 1 A schematic diagram of the structure of a reinforcing patch device provided in one embodiment of this application.

[0054] exist Figure 1 In the example, the reinforcing patch device of this application embodiment includes a controller, a camera, a suction head, and an adjustment device for adjusting the reinforcing patch. The controller is connected to the camera, the adjustment device, and the suction head. The camera is used to acquire first image data of the surface of the circuit board to be bonded. The controller determines the reinforcing patch model information corresponding to the circuit board model information from a preset model mapping relationship, performs image recognition processing on the first image data to determine the shape information of the reinforcing patch, and adjusts the target reinforcing patch according to the shape information of the reinforcing patch so that the target reinforcing patch meets the preset bonding conditions.

[0055] The reinforcing patch device described in this application is for the purpose of more clearly illustrating the technical solutions of this application, and does not constitute a limitation on the technical solutions provided in this application. Those skilled in the art will know that with the evolution of reinforcing patch devices and the emergence of new application scenarios, the technical solutions provided in this application are also applicable to similar technical problems.

[0056] It will be understood by those skilled in the art that Figure 1 The structure of the reinforcing patch device shown in the figure does not constitute a limitation on the embodiments of this application. It may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0057] refer to Figure 2 , Figure 2 This is a flowchart of a reinforcement pick-and-place machine control method provided in an embodiment of this application. This flowchart of the reinforcement pick-and-place machine control method can be applied to, for example... Figure 1The reinforcing patch device shown includes, but is not limited to, the following steps in its control method:

[0058] Step S100: Obtain first image data of the surface of the circuit board to be bonded, the first image data including circuit board model information;

[0059] Step S200: Determine the reinforcement chip model information corresponding to the circuit board model information from the preset model mapping relationship;

[0060] Step S300: Perform image recognition processing on the first image data to determine the shape information of the reinforcing sheet;

[0061] Step S400: Adjust the target reinforcing sheet according to the shape information of the reinforcing sheet so that the target reinforcing sheet meets the preset bonding conditions.

[0062] Understandably, the first image data of the circuit board surface to be bonded is acquired using a camera. The circuit board surface is marked with its model information. By acquiring the first image data, the circuit board model information marked on the surface can be obtained. After obtaining the circuit board model information, the model information of the reinforcing sheet corresponding to the circuit board model is determined according to a preset model mapping relationship. Because different circuit board models have different thicknesses and rigidities, the reinforcing sheet needs to be adjusted according to the different circuit board models. Image recognition processing is performed on the first image data to determine the shape information of the reinforcing sheet. The shape information of the reinforcing sheet corresponds to the shape of the reinforcing sheet on the circuit board to be bonded. Based on the shape information of the reinforcing sheet, the adjustment device adjusts the target reinforcing sheet. The target reinforcing sheet is characterized by the reinforcing sheet model information, so that the target reinforcing sheet meets the preset bonding conditions. The preset bonding conditions include adjusting the shape of the reinforcing sheet according to the shape information of the reinforcing sheet so that the shape of the reinforcing sheet conforms to the bonding shape. Because for irregular circuit boards, the shapes of the circuit boards are not consistent, and the shapes of the positions where the reinforcing sheets need to be bonded are also different, it is necessary to adjust the reinforcing sheet according to the position on the circuit board to meet the bonding requirements.

[0063] It is understandable that meeting the preset bonding conditions involves adjusting the shape of the target reinforcement piece by adjusting the module so that the shape of the target reinforcement piece matches the shape of the bonding area on the circuit board to be bonded.

[0064] Understandably, the preset model mapping relationship can be adjusted according to actual production needs.

[0065] refer to Figure 3 , Figure 3 yes Figure 2 The detailed flowchart of step S400 is in Figure 3In the example, step S400 also includes, but is not limited to, the following steps:

[0066] Step S410: Obtain the second image data of the circuit board to be bonded in the vertical direction;

[0067] Step S420: Determine the thickness of the circuit board to be bonded using the second image data;

[0068] Step S430: Determine the area of ​​the circuit board to be bonded using the first image data;

[0069] Step S440: Determine the thickness information of the reinforcing sheet based on the area of ​​the circuit board to be bonded, the shape information of the reinforcing sheet, and the thickness of the circuit board to be bonded.

[0070] Step 450: Adjust the target reinforcement sheet according to the reinforcement sheet shape information and reinforcement sheet thickness information so that the target reinforcement sheet meets the preset bonding conditions.

[0071] Understandably, the process involves acquiring second image data of the circuit board to be bonded in the vertical direction. This second image data includes multiple pixels. The thickness of the circuit board to be bonded is calculated using these pixels. The thickness of the reinforcing sheet is determined by the shape information of the reinforcing sheet, the area of ​​the circuit board to be bonded, and the thickness of the circuit board. This ensures that the thickness of the reinforcing sheet meets the requirements of the current circuit board, preventing damage to the circuit board during subsequent processing due to an excessively thick reinforcing sheet, or insufficient reinforcement due to an excessively thin reinforcing sheet. Based on the shape and thickness information of the reinforcing sheet, the adjustment device is controlled to adjust the target reinforcing sheet to meet the preset bonding conditions. The target reinforcing sheet is characterized as a reinforcing sheet corresponding to the reinforcing sheet model information.

[0072] It is understandable that satisfying the preset bonding conditions means adjusting the thickness of the reinforcing sheet to the thickness determined based on the area of ​​the circuit board to be bonded, the shape information of the reinforcing sheet, and the thickness of the circuit board to be bonded, and adjusting the shape of the reinforcing sheet to be the same as the shape of the area to be bonded.

[0073] It is understandable that the shape information of the reinforcing sheet includes its area. The overall area of ​​the circuit board to be bonded is calculated from multiple pixels in the first image information. The shape of the reinforcing sheet is the same as the shape to be bonded on the circuit board. Therefore, it can be assumed that the area of ​​the reinforcing sheet is the same as the area of ​​the region to be bonded on the circuit board. The shape and thickness of the target reinforcing sheet are related to the shape and thickness of the circuit board to be bonded, respectively. Therefore, the thickness of the reinforcing sheet can be determined by formula (1). Formula (1) is as follows:

[0074]

[0075] Where H1 is the thickness of the circuit board to be bonded, S1 is the area of ​​the circuit board to be bonded, S2 is the area of ​​the reinforcing sheet, and H2 is the thickness of the reinforcing sheet.

[0076] refer to Figure 4 , Figure 4 yes Figure 3 The detailed flowchart of step S430 is in Figure 4 In the example, step S430 also includes, but is not limited to, the following steps:

[0077] Step S431: Determine the scaling factor based on the area of ​​the circuit board to be bonded and the area of ​​the reinforcing sheet;

[0078] Step S432: Calculate the thickness of the circuit board to be bonded using a scaling factor to determine the thickness information of the reinforcing sheet.

[0079] Understandably, the shape information of the reinforcing sheet includes its area. A scaling factor is determined by the area of ​​the circuit board to be bonded and the area of ​​the reinforcing sheet. The thickness of the reinforcing sheet is then determined by multiplying the scaling factor by the thickness of the circuit board to be bonded. The area of ​​the circuit board to be bonded is calculated from the first image data. The thickness of the reinforcing sheet is confirmed by using the scaling factor and the thickness of the circuit board to be bonded, ensuring that the thickness of the reinforcing sheet meets the requirements and avoiding the impact on the actual use effect due to the reinforcing sheet being too thick or too thin.

[0080] It is understandable that the scaling factor is derived from formula (2):

[0081]

[0082] Where θ is the area of ​​the reinforcing sheet, μ is the area of ​​the circuit board to be bonded, and η is the scaling factor.

[0083] refer to Figure 5 , Figure 5 yes Figure 2 The detailed flowchart of step S300 is in Figure 5 In the example, step S300 also includes, but is not limited to, the following steps:

[0084] Step S301: By processing the pixels of the first image data, the bonding area on the surface of the circuit board to be bonded is obtained;

[0085] Step S302: Determine the shape information of the reinforcing sheet according to the shape of the area to be bonded;

[0086] Understandably, the first image data also includes multiple pixels. By calculating the multiple pixels, the area and shape of the bonding area on the surface of the circuit board to be bonded are determined. Based on the shape of the bonding area, the shape information of the reinforcing sheet is determined.

[0087] Understandably, the reinforcing sheet is shaped to match the area to be bonded, so that the reinforcing sheet can be fully bonded to the area.

[0088] refer to Figure 6 , Figure 6 This is a flowchart of a reinforcement pick-and-place machine control method according to another embodiment of this application. The reinforcement pick-and-place machine control method further includes, but is not limited to, the following steps:

[0089] Step S500: Construct a coordinate system for the area to be bonded, and determine the coordinates of the center point of the area using the edge coordinates of the area to be bonded.

[0090] Step S600: Construct a coordinate system for the target reinforcement piece and determine the coordinates of the center point of the reinforcement piece using the edge coordinates of the target reinforcement piece;

[0091] Step S700: Control the suction head to attach the target reinforcement sheet to the circuit board to be bonded, so that the coordinates of the center point of the area coincide with the coordinates of the center point of the reinforcement sheet.

[0092] Understandably, a coordinate system is constructed for the bonding area, and the coordinates of the center point of the area are determined using the edge coordinates of the area to be bonded. Then, a coordinate system is constructed for the target reinforcement piece, and the coordinates of the center point of the reinforcement piece are determined using the edge coordinates of the target reinforcement piece. Based on the coordinates of the center point of the area and the center point of the reinforcement piece, the suction head is controlled to bond the target reinforcement piece to the bonding circuit board, so that the coordinates of the center point of the area and the center point of the reinforcement piece coincide. By determining the center point of the area and the center point of the reinforcement piece, the bonding accuracy is improved, and the phenomenon of offset during the bonding process of the reinforcement piece is avoided, which would lead to bonding failure and affect the subsequent processing of the product.

[0093] refer to Figure 7 , Figure 7 yes Figure 6 The detailed flowchart following step S700 is in Figure 7 In the example, after step S700, there are, but are not limited to, the following steps:

[0094] Step S800: Obtain a third image of the surface of the bonded circuit board;

[0095] Step S900: Compare the preset template image with the third image. If there is a difference between the third image and the preset template image, mark the third image.

[0096] Understandably, a third image of the surface of the bonded circuit board is obtained and compared with a preset template image. If there is a difference between the third image and the preset template image, the third image is marked. The preset template image is the image after the circuit board and the reinforcing sheet are properly bonded, which helps users understand which circuit board has a bonding problem. Then, the circuit board corresponding to the marked third image is removed to prevent defective products from entering subsequent processes and improve the product yield.

[0097] It is understandable that the difference between the third image and the preset template image can be attributed to misalignment of the circuit board and the reinforcing sheet or failure of the circuit board to be bonded to the reinforcing sheet.

[0098] Reference Figure 8 , Figure 8 This is a flowchart of a reinforcement pick-and-place machine control method according to another embodiment of this application. The reinforcement pick-and-place machine control method further includes, but is not limited to, the following steps:

[0099] In step S1000, when the reinforcement chip information corresponding to the circuit board model information cannot be determined from the preset model mapping relationship, a warning message is issued.

[0100] Understandably, when the control device cannot determine the reinforcement chip information corresponding to the circuit board model information from the preset model mapping relationship, it will issue a warning message on the display or through a buzzer or other device to remind the user to deal with the problem in a timely manner to ensure production efficiency.

[0101] It is understandable that the inability to determine the reinforcement information corresponding to the circuit board model information from the preset model mapping relationship includes cases where the circuit board model does not exist in the preset model mapping relationship, or where the reinforcement information corresponding to the model does not exist.

[0102] A second aspect of this application provides a reinforcing patch device applied to a reinforcing patch machine, comprising a camera device and a control device. The camera device is connected to the control device. The camera device is used to acquire first image data of the surface of a circuit board, the first image data including circuit board model information. The control device is used to determine the reinforcing patch model information corresponding to the circuit board model information from a preset model mapping relationship; to perform image recognition processing on the first image data to determine the reinforcing patch shape information; and to adjust the target reinforcing patch according to the reinforcing patch shape information so that the target reinforcing patch meets preset bonding conditions. The target reinforcing patch is characterized as the reinforcing patch corresponding to the reinforcing patch model information.

[0103] refer to Figure 9 , Figure 9The present invention provides a schematic diagram of the structure of an electronic device 900 according to a third aspect embodiment of the present application. The operation control device 900 includes a memory 910, a processor 920, and a computer program stored in the memory 910 and executable on the processor 920. When the processor 920 executes the computer program, it implements the reinforcement placement machine control method as described in the above embodiment.

[0104] The memory 910, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs, such as the reinforcement placement machine control method in the above embodiments of this application. The processor 920 implements the reinforcement placement machine control method in the above embodiments of this application by running the non-transitory software program and instructions stored in the memory 910.

[0105] The memory 910 may include a program storage area and a data storage area. The program storage area may store the operating system and application programs required for at least one function; the data storage area may store data required for executing the reinforcement placement machine control method described in the above embodiments. Furthermore, the memory 910 may include a high-speed random access memory 910, and may also include non-transitory memory 910, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. It should be noted that the memory 910 may optionally include memory 910 remotely located relative to the processor 920, and these remote memories 910 can be connected to the terminal via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0106] The non-transient software program and instructions required to implement the reinforcement placement machine control method in the above embodiments are stored in memory. When executed by one or more processors, the reinforcement placement machine control method in the above embodiments is executed, for example, the method described above is executed. Figure 2 Method steps S100 to S400 Figure 3 Method steps S410 to S450 Figure 4 Method steps S431 to S432, Figure 5 Method steps S301 to S302, Figure 6 Method steps S500 to S700 Figure 7 Method steps S800 and S900, Figure 8 Method step S1000.

[0107] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0108] Furthermore, one embodiment of this application also provides a computer-readable storage medium storing computer-executable instructions that are executed by a processor 920 or a controller, for example, by a processor 920 in the above-described electronic device 900 embodiment, causing the processor 920 to execute the reinforcement placement machine control method in the above-described embodiment, for example, to perform the above-described... Figure 2 Method steps S100 to S400 Figure 3 Method steps S410 to S450 Figure 4 Method steps S431 to S432, Figure 5 Method steps S301 to S302, Figure 6 Method steps S500 to S700, Figure 7 Method steps S800 and S900, Figure 8 Method step S1000. Those skilled in the art will understand that all or some of the steps and systems disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all physical components can be implemented as software executed by a processor 920, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0109] The above is a detailed description of the preferred embodiments of this application. However, this application is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this application. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A method for controlling a reinforcing chip mounter, characterized in that, This method is applied to a reinforcing pick-and-place machine, which is equipped with a camera device for acquiring images of circuit boards. The control method for the reinforcing pick-and-place machine includes: Acquire first image data of the surface of the circuit board to be bonded, the first image data including circuit board model information; From the preset model mapping relationship, determine the reinforcement piece model information corresponding to the circuit board model information; The first image data is processed by image recognition to determine the shape information of the reinforcement patch; Based on the shape information of the reinforcing sheet, the target reinforcing sheet is adjusted to meet the preset bonding conditions; the target reinforcing sheet is characterized as the reinforcing sheet corresponding to the reinforcing sheet model information. The step of adjusting the target reinforcing sheet according to the shape information of the reinforcing sheet to make the target reinforcing sheet meet the preset bonding conditions includes: Obtain the second image data of the circuit board to be bonded in the vertical direction; The thickness of the circuit board to be bonded is determined using the second image data; The area of ​​the circuit board to be bonded is determined using the first image data; The thickness information of the reinforcing sheet is determined based on the area of ​​the circuit board to be bonded, the shape information of the reinforcing sheet, and the thickness of the circuit board to be bonded. Based on the shape information and thickness information of the reinforcing sheet, the target reinforcing sheet is adjusted to meet the preset bonding conditions.

2. The reinforcement patch panel control method according to claim 1, characterized in that, The reinforcing sheet shape information includes the reinforcing sheet area. The step of determining the reinforcing sheet thickness information based on the area of ​​the circuit board to be bonded, the reinforcing sheet shape information, and the thickness of the circuit board to be bonded includes: The scaling factor is determined based on the area of ​​the circuit board to be bonded and the area of ​​the reinforcing sheet; The thickness of the circuit board to be bonded is calculated using the scaling factor to determine the thickness information of the reinforcing sheet.

3. The reinforcement placement machine control method according to claim 1, characterized in that, The step of performing image recognition processing on the first image data to determine the shape information of the reinforcement patch includes: By processing the pixels of the first image data, the bonding area on the surface of the circuit board to be bonded is obtained; The shape information of the reinforcing sheet is determined based on the shape of the area to be bonded.

4. The reinforcement patch machine control method according to claim 3, characterized in that, The reinforcing pick-and-place machine further includes a suction head for bonding the reinforcing sheet to the circuit board, and the reinforcing pick-and-place machine control method further includes: A bonding region coordinate system is constructed for the region to be bonded, and the coordinates of the center point of the region are determined using the edge coordinate points of the region to be bonded. A coordinate system for the target reinforcement piece is constructed, and the coordinates of the center point of the reinforcement piece are determined using the edge coordinate points of the target reinforcement piece. The suction head is controlled to attach the target reinforcement piece to the circuit board to be bonded, so that the coordinates of the center point of the region coincide with the coordinates of the center point of the reinforcement piece.

5. The reinforcement patch machine control method according to claim 4, characterized in that, The step of controlling the suction head to attach the target reinforcement piece to the circuit board to be bonded, so that the coordinates of the center point of the region coincide with the coordinates of the center point of the reinforcement piece, includes: Obtain a third image of the surface of the laminated circuit board; The preset template image is compared with the third image. If there is a difference between the third image and the preset template image, the third image is marked.

6. The reinforcement patch panel control method according to claim 1, characterized in that, The reinforcement patch machine control method further includes: When the model information of the reinforcing piece corresponding to the model information of the circuit board cannot be determined from the preset model mapping relationship, a warning message is issued.

7. A reinforcing patch device, applied to a reinforcing patch machine, characterized in that, The reinforcing patch device includes: A camera device is used to acquire first image data of the surface of a circuit board, the first image data including circuit board model information; A control device, connected to the camera device, is used to determine the reinforcing sheet model information corresponding to the circuit board model information from a preset model mapping relationship; determine the reinforcing sheet shape information through the color information of the first image data or by performing image recognition processing on the first image data; and adjust the target reinforcing sheet according to the reinforcing sheet shape information so that the target reinforcing sheet meets preset bonding conditions; the target reinforcing sheet is characterized as the reinforcing sheet corresponding to the reinforcing sheet model information.

8. An electronic device, comprising: A memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that the processor, when executing the computer program, implements the reinforcement placement machine control method as described in any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions for causing a computer to perform the reinforcement placement machine control method as described in any one of claims 1 to 6.

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