Lighting device and method of manufacturing a lighting device

Abstract

A lighting device and a method of manufacturing a lighting device are described. The lighting device includes a heat sink having a mounting area. A main board is mounted to the mounting area of the heat sink, the main board including a recess. A light emitting diode (LED) assembly is mounted to the mounting area within the recess of the main board. The LED assembly includes at least one emitter. A circuit is disposed on a top surface of the main board configured to control the at least one emitter of the LED assembly. An electrical connection is provided between the LED assembly and the circuit.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefits of U.S. Provisional Application Serial No. 63 / 026455, filed May 18, 2020, and European Application Serial No. EP 20187328.8, filed July 23, 2020, the contents of which are incorporated herein by reference. Background Technology

[0003] Due to their inherent advantages (such as long lifespan, energy efficiency, and small size), LED light sources are increasingly used in lighting applications. LED light sources typically include integrated components such as electrical connectors, seals, heat sinks, and optical elements. Because these LED light sources are widely used, for example in vehicle lighting, there is high market demand, and a large number of standardized and non-standardized LED light sources are used. Summary of the Invention

[0004] A lighting device and a method of manufacturing the lighting device are described. The lighting device includes a heat sink having a mounting area. A motherboard can be mounted to the mounting area of ​​the heat sink, and the motherboard includes a recess. A light-emitting diode (LED) assembly can be mounted to the mounting area within the recess of the motherboard. The LED assembly may include at least one emitter. Circuitry can be disposed on the top surface of the motherboard and can be configured to control the at least one emitter of the LED assembly. An electrical connection can be provided between the LED assembly and the circuitry. Attached Figure Description

[0005] A more detailed understanding can be obtained by referring to the following description, which is given by way of example in conjunction with the accompanying drawings, wherein:

[0006] Figure 1 This is a perspective view of a first embodiment of the lighting device;

[0007] Figure 2 This is another perspective view of the first embodiment of the lighting device;

[0008] Figure 3 yes Figure 1 A side view of the lighting equipment;

[0009] Figure 4 yes Figure 1 A cross-sectional view of the lighting equipment;

[0010] Figure 5 yes Figure 1-4 Exploded perspective view of the lighting equipment;

[0011] Figure 6 yes Figure 1 A top view of the lighting equipment;

[0012] Figure 7yes Figure 1 A cross-sectional side view of the panel of the lighting equipment;

[0013] Figure 8 This is a perspective view of an alternative embodiment of a board with circuitry;

[0014] Figure 9 yes Figure 8 Bottom perspective view of an alternative embodiment of a board with circuitry;

[0015] Figure 10 This is a top view of a board having circuitry according to another alternative embodiment;

[0016] Figure 11 This is a perspective view of a second embodiment of the lighting device;

[0017] Figure 12 yes Figure 11 A side view of the lighting device of the second embodiment;

[0018] Figure 13 yes Figure 11 , 12 An exploded perspective view of the lighting device of the second embodiment;

[0019] Figure 14 This is an exploded perspective view of the lighting device according to the third embodiment; and

[0020] Figure 15 This is a flowchart illustrating the steps involved in manufacturing a lighting device. Detailed Implementation

[0021] Examples of different lighting devices and methods of manufacturing lighting devices will be described more fully below with reference to the accompanying drawings. These examples are not mutually exclusive, and features found in one example may be combined with features found in one or more other examples to achieve additional embodiments. Therefore, it will be understood that the examples shown in the drawings are provided for illustrative purposes only and are not intended to limit this disclosure in any way. Similar reference numerals always refer to similar elements.

[0022] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms may be used to distinguish one element from another. For example, without departing from the scope of the invention, a first element may be referred to as a second element, and a second element may be referred to as a first element. As used herein, the term “and / or” may include any and all combinations of one or more of the associated listed items.

[0023] It will be understood that when an element, such as a layer, region, or substrate, is referred to as "on another element" or "extending to another element," it can be directly on or directly extended to another element, or intermediate elements may be present. Conversely, when an element is referred to as "directly on another element" or "directly extending to another element," intermediate elements may not be present. It will also be understood that when an element is referred to as "connected" or "coupled" to another element, it can be directly connected or coupled to another element and / or connected or coupled to another element via one or more intermediate elements. Conversely, when an element is referred to as "directly connected" or "directly coupled" to another element, there are no intermediate elements between that element and the other element. It will be understood that these terms are intended to cover different orientations of elements other than those depicted in the accompanying drawings.

[0024] Relative terms such as “below,” “above,” “over,” “under,” “horizontal,” or “vertical” may be used herein to describe the relationship of one element, layer, or region to another element, layer, or region illustrated in the accompanying drawings. It will be understood that these terms are intended to cover different orientations of the device other than those depicted in the accompanying drawings.

[0025] The embodiments described herein depict a lighting device and a method of manufacturing the lighting device. The lighting device may include a heat sink having a mounting area. A motherboard may be mounted to the mounting area and may include a recess. A light-emitting diode (LED) assembly may also be mounted to the mounting area within the recess. The LED assembly may include at least one emitter. Circuitry may be disposed on the top surface of the motherboard and may be configured to control the at least one emitter of the LED assembly. An electrical connection may be provided between the LED assembly and the circuitry.

[0026] The lighting devices and methods of manufacturing them described herein offer flexibility, as they allow for the combination of suitable motherboards with appropriate LED components. The motherboard and LED components can be manufactured separately and mounted on the heat sink later in the manufacturing process. In the event of defects, only the defective component can be replaced, such as replacing only the motherboard or only the LED component. Furthermore, recesses (if included) allow two separately manufactured components (i.e., the motherboard and LED components) to contact the heat sink, rather than, for example, mounting the LED components onto the motherboard. Therefore, the LED components and motherboard can directly contact the heat sink, which optimizes thermal coupling and heat dissipation.

[0027] Now for reference Figure 1 , 2 Figures 1 and 3 illustrate a first embodiment of the lighting device 10. The lighting device 10 may include a cylindrical housing component 12 having a top opening 13.

[0028] Within the top hole 13, a circuit 19 including an LED unit 33 (with a light-emitting surface 38) can be arranged, and light can be emitted from the light-emitting surface 38 along the optical axis X in the forward direction.

[0029] On the opposite side, the cylindrical housing component 12 may include a rear aperture 15. Circularly arranged heat fins 26 of the heat sink 22 may extend from the rear aperture 15. The rear portion of the heat sink 22 may be covered by a rear housing component 14, which may include a plug housing 46 located at the center of the heat fins 26.

[0030] The cylindrical housing component 12 may include alignment protrusions 42 arranged around the circumference to position and align the lighting device 10 within the bracket, such as a vehicle signal light.

[0031] like Figure 4 , 5 As shown, the heat sink 22 may include a disk portion 24 from which heat dissipation fins 26 extend. The disk portion 24 may be arranged perpendicular to the optical axis X. The heat dissipation fins 26 may project from the disk portion 24 in a rearward direction parallel to the optical axis X. The heat dissipation fins 26 may be spaced apart from each other, and free space may be provided between every two heat dissipation fins 26. The disk portion 24 and the heat dissipation fins 26 of the heat sink 22 may be integrally formed from bent copper or aluminum sheet material.

[0032] The plate portion 24 of the heat sink 22 can be positioned on top of the mounting area 23 of the circuit 19.

[0033] Figure 7 Circuit 19 is shown in more detail below. Circuit 19 may include a rectangular LED assembly 16 and a main board, which may be a driver board 18.

[0034] LED assembly 16 may include LED board 35, with LED units 33 mounted on top. LED unit 33 may include a plurality of LED elements 34, which may be surrounded by dam 36 and covered by phosphor coating 37, which provides a light-emitting surface 38. Dam 36 may also be adjacent to phosphor coating 37.

[0035] The driver board 18 may include electronic components for driving the LED unit 33, such as power supplies and safety components. (Refer to...) Figure 5The driver board 18 may include a cutout 39, also referred to herein as a recess. An LED assembly 16 may be disposed within the cutout 39. Since the cutout 39 can provide free space for the LED assembly 16, its shape can be rectangular, similar to the shape of the LED assembly 16, such that the edges of the cutout 39 can be slightly longer than the edges of the LED assembly 16, allowing a gap 32 to exist between the driver board 18 and the LED assembly 16. Figure 6 As shown, within the cutout 39, the LED assembly 16 can be surrounded by the driver plate 18 from all directions and can be located at its center.

[0036] Refer again Figure 7 Individual driver boards 18 and LED assemblies 16 can be electrically coupled via strip connectors 58 bridging gaps 32. Therefore, as... Figure 6 As shown, the strip connector 58 can be used to couple the electronic components of the driver board 18 and the LED assembly 16. The driver board 18 and the LED assembly 16 can be together to form a circuit 19, while the electronic components can be mounted on two separately manufactured boards coupled by the strip connector 58.

[0037] like Figure 4 As shown, the driver board 18 and the LED assembly 16 can be mounted on the mounting area 23 of the heat sink 22. The driver board 18 can be circular and can have the same diameter as the disk portion 24. The cutout 39 in the driver board 18 allows both the driver board 18 and the LED assembly 16 to be directly mounted to the heat sink 22 for excellent thermal coupling. Furthermore, the cutout 39 allows the LED assembly 16 to be located at the center of the heat sink disk portion 24 and the center of the optical axis X to achieve a symmetrical and central beam.

[0038] like Figure 5 As shown, the rear housing component 14 may include a gripper arm 48, which is arranged around the circumference of the housing disc portion 52 on the top of the plug housing 46.

[0039] After assembly, the cylindrical housing component 12 and the rear housing component 14 can be fixed together, covering the disk portion 24 and the circuitry 19. The cylindrical housing component 12 and the rear housing component 14 can be coupled by clamping arms 48, which engage with holes 44 within the double-walled structure 43 of the cylindrical housing component 12. Thus, each clamping arm 48 can traverse the heat sink 22 by extending through the free space between the two heat dissipation fins 26.

[0040] To operate the lighting device 10, a plug connector can be inserted into the plug housing 46. An internal electrical connection (not shown) can be provided to electrically couple the plug connector within the plug housing 46 to a driver board 18, which can be configured to drive the LED elements 34 within the LED unit 33. A phosphor coating 37 can be exposed to the radiation from the LED elements 34 and can emit light uniformly from the luminous surface 38 and the top aperture 13. The lighting device 10 can be mounted in a bracket, such as when installed as a signal light inside a vehicle.

[0041] The lighting device 10 can be manufactured by providing and assembling a heat sink 22, an LED assembly 16, a driver board 18, and two housing components 12 and 14. The heat sink 22 can be manufactured integrally using a stamping process. The LED assembly 16 and the driver board 18 can be manufactured separately. When manufacturing the LED assembly 16, LED elements 34 and dams 36 can be disposed on the LED board 35, and phosphor material can be filled into the cavity surrounded by the dams 36, covering the LED elements 34 and forming a phosphor coating 37. In the event of a defect in the LED assembly 16 or the driver board 18, replacing only the defective components 16 and 18 may be sufficient. By providing the LED assembly 16 and the driver board 18 independently, the circuitry 19 can be mounted on the heat sink 22 using hot glue. Metal pins (not shown) mounted on the heat sink 22 can be coupled to the driver board 18 and can pass through the heat sink 22 to its bottom side. The driver board 18 and the LED assembly 16 can be electrically coupled into a single functional unit via a strip connector 58. The cylindrical housing component 12 and the rear housing component 14 can each be integrally molded. The plug housing 46 can be integrally formed with the rear housing component 14, which may also include a hole (not shown) leading to the plug housing 46. The cylindrical housing component 12 and the rear housing component 14 can be arranged in opposite directions and coupled via a snap-fit ​​connection (formed by the clamping arm 48 and the hole 44). Metal leads (not shown) can extend through the hole into the plug housing 46 to provide an internal electrical connection that the plug can couple to.

[0042] Figure 8 and Figure 9 A circuit 19 according to an alternative embodiment is shown, which corresponds to the circuit 19 according to the first embodiment, and may differ only in the rectangular shape of the driver board 18.

[0043] Figure 10A circuit 19 according to another alternative embodiment is shown. The driver board 18 according to this alternative embodiment may include two driver board portions 62a, 62b, both also L-shaped. A gap 54 may exist between the two driver board portions 62a, 62b, and a rectangular cut 39 may be formed in the middle, through which LED components 16 can be arranged. Although the driver board portions 62a, 62b may have the same shape, different electronic components may be mounted on them. Similarly, the two driver board portions 62a, 62b may be manufactured separately and mounted on a heat sink 22, and then electrically coupled via a strip connector, allowing them to function as a single circuit.

[0044] Figure 11-13 A second embodiment of the lighting device 20 is shown in perspective. It corresponds to the lighting device 10 of the first embodiment in all its components and their arrangement, and the same reference numerals are used to refer to the same components. The second embodiment may differ only in the shape of the heat sink 28 of the lighting device 20.

[0045] Radiator 28 Figure 13 As shown in the diagram, the heat sink 28 may include first and second heat sink portions 72, 74. The first heat sink portion 72 may include first heat sink fins 26 and a heat sink plate 24, on which the circuitry 19 may be mounted. The second heat sink portion 74 may include a planar ring 76 and second heat sink fins 78, the second heat sink fins 78 protruding from the planar ring 76 in a rearward direction parallel to the optical axis X. The heat sink fins 78 may be separable from each other. The planar ring 76 may be used to space the first heat sink fins 26 and the second heat sink fins 78 apart. The entire heat sink 28 may be integrally manufactured from bent copper or aluminum sheet material.

[0046] Figure 14 A third embodiment of the lighting device 300 is shown in an exploded perspective view. Several components and their arrangement in the third embodiment correspond to the lighting device 10 of the first embodiment. The lighting device 300 may include a circular washer 304 having a central hole 308, which may also be circular or any other suitable shape. The circuit 319 includes an LED unit 333 and electronic components 320 for driving the LED unit 333. The LED unit 333 is provided with a light-emitting surface 338 from which light can be emitted in a forward direction parallel to the optical axis X.

[0047] LED unit 333 may include a plurality of LED elements (not shown), which may be surrounded by a dam (not shown) and covered by a phosphor coating (not shown) that provides a light-emitting surface 338. The dam may also be adjacent to the phosphor coating.

[0048] The lighting device 300 may include a housing portion 312. The housing portion 312 may include a circular opening through which a heat sink 322 may extend. Circularly arranged heat sink fins 326 may extend from the heat sink 322 and may extend in a direction parallel to the optical axis X and away from the circuit 319. The heat sink 322 may include a disk portion 324 from which the heat sink fins 326 extend. The disk portion 324 may be arranged perpendicular to the optical axis X. The heat sink fins 326 may be spaced apart from each other, and free space may be provided between every two heat sink fins 326. The disk portion 324 and the heat sink fins 326 may be integrally formed from a bent copper or aluminum sheet material. The disk portion 324 may include a mounting area 323 on its top for mounting the circuit 319.

[0049] Electronic components 320 (such as power supplies and safety components) can be mounted to the motherboard 318 to drive the LED unit 333. Similarly, the LED unit 333 can be arranged for mounting on the motherboard 318. The motherboard 318 can be a printed circuit board. The LED unit 333 and the electronic components 320 together form circuit 319. Therefore, in this third embodiment, the LED unit 333 and the electronic components 320 are mounted on the same motherboard 318.

[0050] Typically, LED units 333 are manufactured using several small chips (such as lateral dies, CSP dies, or TF dies). These chips are attached to a substrate and covered with phosphors and / or silicone lenses. The placement of phosphors on the chips is often affected by significant process variations, high failure rates, calibration requirements, and other variables. If LED units 333 are rejected during the manufacturing of the lighting device 300, it is less costly to discard rejected LED units 333 mounted to the motherboard 318 before final assembly, rather than discarding LED units 333 mounted to the heat sink 322 after final assembly. Therefore, in some cases, cost savings can be achieved by mounting LED units to the motherboard 318 instead of directly mounting them to the heat sink 322.

[0051] The motherboard 318 can be formed to pass through the central hole 308 of the circular washer 304 for fitting into the circular opening of the housing portion 312 and can be mounted on the mounting area 323 of the heatsink 322. For example, the motherboard 318 can be mounted on the mounting area 323 using hot glue. The motherboard 318 can generally be square or rectangular and may include cut-offs 321 at its corners. Alternatively, the motherboard 318 can generally be circular or any other suitable geometry. The motherboard 318 can have the same dimensions as the tray portion 324. The heatsink 322 can be manufactured integrally using a stamping process.

[0052] Figure 15This is a flowchart illustrating the steps for manufacturing a lighting device. These manufacturing steps are shown in steps 1510, 1520, 1530, 1540, 1550, 1560, 1570, and 1580. In the first manufacturing step 1510, an LED assembly can be provided. In step 1520, a motherboard can be provided. In step 1530, circuitry for controlling the LED assembly can be mounted onto the motherboard. In step 1540, a recess can be formed in the motherboard. In step 1550, a heat sink with a mounting area can be provided. In step 1560, the motherboard can be arranged on the mounting area of ​​the heat sink. In step 1570, the LED assembly can be arranged on the mounting area of ​​the heat sink within the recess of the motherboard. In step 1580, the circuitry mounted on the motherboard can be connected to the LED assembly.

[0053] An LED assembly may include at least one LED element. The term LED element may be used herein to refer to any type of single solid-state lighting element or group of solid-state lighting elements, such as light-emitting diodes, laser diodes, organic light-emitting diodes (OLEDs), etc. The term LED assembly may be used herein to refer to an assembly that includes one or more other elements besides one or more LED elements for, for example, thermal, mechanical, optical, and / or electrical functions. This may include, for example, electrical connection devices (such as connection pads) to electrically contact the LED assembly with, for example, an external power source. These other elements may also include a base on which the LED element can be mounted. Furthermore, an LED assembly may include a cover over the LED element, such as an optical element, which may be transparent or may be used to modify the light emitted from the LED element.

[0054] Heat sinks can be made of or contain any rigid thermally conductive material, such as metals (e.g., aluminum or copper), to dissipate heat from electrical components (e.g., LED assemblies). LED elements within LED assemblies may be particularly sensitive to elevated temperatures, thus efficient heat dissipation is preferred.

[0055] Besides heat dissipation, heat sinks can be used for mechanical purposes. For example, a heat sink can serve as a carrier for LED components. The mounting area can be any part of the heat sink, suitable for mounting LED components on or on top of the heat sink. For example, the mounting area can provide a surface on which electrical components (such as LED components) can be easily and reliably attached.

[0056] The lighting device may also include a motherboard having circuitry (configured to control LED components) and electrical connections (configured between the LED components and the circuitry).

[0057] The motherboard can serve as a carrier for circuitry that can be mounted on the carrier. The motherboard can be made of a solid material and can be, for example, a planar board. The motherboard can be, for example, a board for SMD components. Perhaps particularly preferred is that the shape of the motherboard can resemble the shape of the mounting area, for example, a circle if the mounting area is circular, or a rectangle if the mounting area is rectangular. The dimensions of the motherboard can be, for example, adapted to fit the mounting area but not extend beyond it.

[0058] The circuit can be electrically coupled to the LED assembly. For example, the circuit can supply operating power to the LED assembly. For instance, the circuit can include a driver circuit that acts as a power source for the LED assembly. Furthermore, the circuit can include electronic components for current regulation and safety. For example, electrical components can be arranged to protect the circuit from voltage spikes.

[0059] The electrical connection provided between the LED component and the circuitry can include any type of electrical conductor. For example, connection pads and / or connection pins can be provided on the LED component and / or the motherboard, allowing for wire connections to couple the LED component to the circuitry on the motherboard.

[0060] According to the described embodiment, a recess can be provided within the motherboard, and an LED assembly can be positioned within the recess. The motherboard can therefore provide free space in which the LED assembly can be at least partially accommodated. The recess can have different shapes, such as circular, rectangular, or any shape that can be a hole or cutout within the motherboard. Preferably, the recess is a cutout within the motherboard. The recess can be completely surrounded by the motherboard. For example, the recess can be positioned within the central portion of the motherboard. Alternatively, the recess can be only partially surrounded by the motherboard (e.g., at its outer edge). For example, the recess can surround the LED assembly. Furthermore, the recess can be larger than the LED assembly, or the recess can be shaped to conform to the shape of the LED assembly.

[0061] Therefore, according to the described embodiment, both the motherboard and the LED assembly can be positioned on the mounting area, and the LED assembly can be arranged within a recess. This allows both the motherboard and the LED assembly to be in direct contact with the mounting area of ​​the heatsink to provide excellent thermal coupling. The recess within the motherboard can leave free space in the mounting area in which the LED assembly can be positioned. For example, a gap can be provided between the LED assembly and the motherboard. The motherboard and the LED assembly can be thermally coupled to the heatsink, for example, via hot glue or a thermal pad.

[0062] Therefore, the lighting device according to the embodiments described herein offers the flexibility to combine a suitable motherboard with appropriate LED components. The motherboard and LED components can advantageously be manufactured separately from each other and, when mounted on a heat sink, can be coupled late in the manufacturing process. In the event of a defect, only the defective component needs to be replaced, e.g., only the motherboard or only the LED component. Furthermore, the recessed design provides the benefit that both separately manufactured components can contact the heat sink, rather than, for example, mounting the LED component on the motherboard. Thus, the LED component and motherboard can directly contact the heat sink, which optimizes heat dissipation.

[0063] In some embodiments, an LED assembly may include an LED unit comprising one or more LED elements. The term LED unit may be used herein to refer to a device mounted on a substrate (such as, for example, a circuit board) that may include one or more LED elements and may be configured to emit light from a light-emitting surface. Furthermore, an LED unit may include additional elements, such as a cover above the LED elements. In the operation of the LED elements(s), light may be emitted from the light-emitting surface of the LED unit, which may be, for example, planar and may be of any suitable shape, such as, for example, rectangular or circular. Light from the LED elements may be emitted directly from the light-emitting surface or may be modified by optical elements, such as those modifying direction, intensity distribution, color, or other properties.

[0064] For example, an LED unit may include a dam surrounding an LED element and a phosphor coating arranged to cover the LED element. The dam may partially or, for example, completely surround the LED element. It may be preferred that the dam is higher than the LED element, such that the dam extends beyond the LED element in a direction perpendicular to the LED panel.

[0065] The phosphor coating can be arranged within a cavity created by a dam, allowing the dam to act as a barrier and a mold for the phosphor coating. The dam can adjoin the phosphor coating and define its dimensions, which can be advantageous during the manufacturing process. The phosphor coating can be, for example, yellow, green, or red.

[0066] In some embodiments, an LED assembly may include an LED board and LED units including light-emitting surfaces. The LED board may be planar. It may provide a planar lower surface (configured to contact a heat sink) and a planar upper surface (on which LED units can be mounted). The board may be, for example, rectangular or circular. When manufacturing multiple LED boards, a rectangular shape may be preferred to reduce material waste. The LED assembly may include an LED board, and the LED units may be implemented as, for example, top-contact lateral chips, bottom-contact chip-scale packages, or vertical dies directly deposited on the board.

[0067] While the dimensions of the LED board and LED units, as well as their luminescent surfaces, are generally freely chosen, in some embodiments, a fairly small LED board may be used, which may be sufficient to accommodate the LED units, but not significantly larger. Thus, for example, the size of the LED board may be less than three times the size of the luminescent surface. For instance, the LED board may be 2.5 times the size of the luminescent surface of the LED unit or less. The dimensions of both the LED board and the luminescent surface can be measured as the maximum extension parallel to the luminescent surface, such as diameter or diagonal.

[0068] According to another embodiment, the motherboard can be arranged to surround the LED assembly from at least two opposing directions. For example, it can be arranged as a semicircle surrounding the LED assembly, or it can be angled. In some embodiments, the motherboard can surround the LED assembly from all sides. Surrounding the LED assembly from two opposing sides allows the light-emitting area to be arranged at the center of the mounting area, which can provide optical advantages.

[0069] The motherboard can be configured as a single unit. In embodiments, the motherboard may include or may consist of a first motherboard portion and a second motherboard portion. The first and second motherboard portions may be arranged to surround the LED assembly. For example, the first motherboard portion may be arranged on one side of the LED assembly, and the second motherboard portion may be arranged on the opposite side of the LED assembly. The composition of at least two motherboards allows for easy fabrication of recesses. For example, the recess may be formed, for instance, by assembling the first and second motherboard portions including the first and second recess portions. Furthermore, it allows for easy fabrication of the motherboard itself, such as by equivalently forming the first and second motherboard portions so that they can be manufactured in a single manufacturing step. In the event of a defective component within the motherboard, replacing only the first or second motherboard portion may be sufficient.

[0070] In an embodiment, the first and second motherboard portions may be L-shaped. The L-shape is characterized by two pins that can be arranged at an angle (e.g., right angle). The two pins of each motherboard portion may have different lengths, or, for example, the same length. It may be further preferred that the two motherboard portions have the same shape. The first and second motherboard portions may be positioned on a mounting area such that a first pin of the first motherboard portion can be arranged adjacent to a pin of the second motherboard portion, and a second pin of the first motherboard portion can be arranged adjacent to another pin of the second motherboard portion. The first and second motherboard portions may be arranged to contact each other or have a small gap, such as less than 5 mm. By positioning the motherboard portions in this way, they can enclose a rectangular recess. Therefore, the recess can be formed by arranging the L-shaped motherboard portions in a suitable manner, rather than cutting material from the motherboard.

[0071] L-shaped motherboard sections are easy to manufacture during the manufacturing process due to their rectangular shape. Furthermore, if they have identical L-shapes, they can be cut in a single manufacturing step. Additionally, recesses can be easily provided by positioning two motherboard sections adjacent to each other. Moreover, rectangular recesses allow for the manufacture of compatible rectangular LED assemblies, which are easy to manufacture and minimize material waste.

[0072] The LED assembly can be arranged within a recess, allowing it to either make direct mechanical contact with the motherboard or be positioned at a distance from it. According to one embodiment, the motherboard and LED assembly can be arranged to form a gap of 10-500 μm, 20-200 μm, and / or 30-100 μm. This gap can, for example, be formed along one, several, or all edges of the LED assembly. Small gaps allow for a compact design of the motherboard and LED assembly. Furthermore, small gaps can be advantageous for electrical connections between the motherboard and LED assembly by providing short connection paths. Longer connection paths may increase the likelihood of failures such as cable breaks.

[0073] In some embodiments, the mounting area may be a planar portion, and the heat sink may include heat dissipation fins extending from and angled to the mounting area. The planar portion may be, for example, a disc made of a suitable heat-dissipating material, such as a metal sheet.

[0074] Heat sink fins can be provided to offer increased heat dissipation surface. The heat sink fins can be directly coupled to the mounting area, for example, integrally formed therewith. The heat sink fins can extend in a rearward direction, for example, opposite to the forward direction defined by the central light emission direction, and can be perpendicular to the mounting area. The heat sink fins can be arranged at least substantially perpendicular to the mounting area, for example. The mounting area and the heat sink fins can be made of curved sheet metal material.

[0075] According to another embodiment, the planar portion of the heat sink may be a first planar portion, and the heat sink may further include a second planar portion arranged parallel to the first planar portion. The heat dissipation fins may be first heat dissipation fins, and the heat sink may further include second heat dissipation fins projecting from and forming an angle with the second planar portion. The second planar portion may be a planar region, such as an annular or polygonal shape. The second planar portion may, for example, extend beyond the first planar portion in a direction parallel to the planar portion. For example, the outer diameter of the second planar portion may be larger than the outer diameter of the first planar portion to increase the size of the heat sink and thus provide better heat dissipation. Particularly preferred is that the first heat dissipation fins may also be attached to the second planar portion, such that the first heat dissipation fins can be arranged to couple the first and second planar portions. For example, the heat sink including the first and second planar portions and the first and second heat dissipation fins may be integrally formed from, for example, a curved sheet of metal material.

[0076] In another embodiment, the housing may be arranged to at least partially cover the heat sink, the motherboard, and the LED assembly. The housing may include first and second housing components. At least a portion of the heat sink may be disposed between the first and second housing components. The housing may be composed of any solid material, such as an electrically insulating material (e.g., a plastic material). It may be advantageous for the housing to cover at least a portion of the motherboard without covering the light-emitting surface, thereby protecting the circuitry from environmental influences such as humidity or contamination. It may be particularly preferred that the housing provide features (e.g., annular surfaces) for supporting seals (such as O-rings).

[0077] Dividing the housing into two parts facilitates its arrangement, eliminating the need for, for example, overmolding of these parts. The first part of the housing can be arranged from one side of the heat sink, and the second part from, for example, the opposite side, allowing the heat sink to be positioned between them. Manufacturing and arranging the housing in two separate steps is particularly advantageous in avoiding the effects of high-temperature processes on electronic components.

[0078] According to some embodiments, a first housing component may include a first locking feature, and a second housing component may include a second locking feature. The first and second locking features may be secured together. The first locking feature may be disposed in a free area between two heat sink fins. The first and second locking features may be secured together such that the attachment may be detachable or permanent. For example, the locking features may form a snap-fit ​​connection, or the first locking feature may be clamped to the second locking feature, such as between two clamping members, or the first locking feature may be a hole and the second locking feature may be a lug that can be fitted into the hole. Alternatively, the first and second locking features may be secured together by an adhesive medium or screws.

[0079] The first locking feature may include, for example, an elongated portion to allow for the formation of pins. The pins may be provided in an advantageous shape for arrangement between two heat sink fins. In some embodiments, the first and / or second housing component may include multiple locking features; for example, the first housing component may include multiple individual pins.

[0080] The heat sink fins can be spaced apart to provide multiple free regions, and multiple first locking features can extend through these free regions. For example, the distance between any two adjacent heat sink fins can be the same. For example, pins of the first locking features can be arranged between any two heat sink fins.

[0081] According to one embodiment, the housing may provide an electrical plug housing. The plug housing may be adapted to accommodate an electrical connector for coupling to an external power source. It may be advantageous that the plug housing be made of an insulating material, such as a plastic material. The plug housing may include cavities within the housing. For example, the housing and plug housing may be integrally manufactured. The plug housing may be arranged perpendicular to the mounting area such that the connection pins of the plug connector can point to the mounting area. The plug housing may be configured to accommodate internal electrical connections. For example, one or more electrical conductors (such as pins or lead frames) may extend from the plug housing to the mounting area for electrical coupling to a circuit. It may be particularly preferred that the plug housing include a locking mechanism so that the electrical connector can be reliably retained.

[0082] The housing can provide alignment features for arrangement relative to the bracket. For example, alignment features can be provided to ensure defined alignment of the lighting fixture with respect to the bracket. Alignment features may include alignment surfaces, alignment protrusions, and / or alignment recesses, which are configured to engage with corresponding alignment surfaces, alignment protrusions, and / or recesses of the bracket. It may be particularly preferred that the housing and the alignment protrusions and / or recesses be integrally manufactured to ensure precise positioning.

[0083] The circuitry can be configured, for example, to contact an external power source via an internal electrical connection, such as through or around a heatsink to reach the connector housing. The internal electrical connection may include metal pins that can couple to a motherboard located on the mounting area, and these pins may, for example, pass through the heatsink to reach the bottom side of the heatsink. The internal electrical connection, or the heatsink, may be electrically isolated, for example, by anodizing the heatsink. To provide a housing, the heatsink and circuitry can be overmolded, and in this manufacturing step, the connector housing can be formed on the bottom side of the heatsink such that the metal pins extend into the connector housing, serving as electrical connection means for an electrical connector.

[0084] As an alternative to overmolding the heat sink and circuitry, the housing may, for example, consist of two or more housing components arranged to cover the heat sink so that they can form a housing when fixed together. In some embodiments, one of the housing components may include a plug housing and a hole through which metal pins can pass, terminating within the plug housing.

[0085] For example, electrical connections (provided between the circuitry and the LED assembly) can be established later in the manufacturing process. Therefore, electrical connections can be achieved through wire bonding or strip bonding. Strip connectors provided to couple the LED assembly to the circuitry on the motherboard can be made of, for example, gold or aluminum. They can contact pads or pins.

[0086] It should be noted that the above embodiments are illustrative and not limiting of the invention, and those skilled in the art will be able to devise many alternative embodiments without departing from the scope of the appended claims. For example, in addition to the circuit 19 mounted on the top surface 23 of the disk portion 24, a second circuit may be mounted on its bottom surface.

[0087] It will be understood that the above embodiments are merely exemplary and not restrictive.

[0088] Other features will become apparent from this detailed description taken in conjunction with the accompanying drawings. However, it will be understood that the drawings are for illustrative purposes only and are not restrictive. It should also be understood that the drawings are not drawn to scale and are intended only to conceptually illustrate the structures and processes described herein.

[0089] The embodiments have been described in detail, and those skilled in the art will understand that, given this specification, modifications can be made to the embodiments described herein without departing from the spirit of the inventive concept. Therefore, the scope of the invention is not intended to be limited to the specific embodiments illustrated and described.

Claims

1. A lighting device, comprising: Radiator, including the mounting area; The motherboard is mounted to the mounting area of ​​the heatsink and includes a top surface and a recess. A light-emitting diode (LED) assembly is mounted in a mounting area within a recess of the motherboard, the LED assembly being fully exposed on the top surface of the motherboard, the LED assembly including at least one emitter and spaced 10-500 µm from the inner surface of the motherboard within the recess; A circuit, on the top surface of the motherboard, is configured to control at least one emitter of the LED assembly; as well as An electrical connection is made between the LED assembly and the circuit. The groove is a cut configured to provide a free area for the LED assembly.

2. The lighting device according to claim 1, wherein the shape of the groove is similar to the shape of the LED component.

3. The lighting device according to claim 1, wherein the groove is rectangular in shape and the LED assembly is rectangular in shape.

4. The lighting device of claim 1, wherein the LED assembly is surrounded by the motherboard from at least two directions.

5. The lighting device of claim 1, wherein the electrical connection between the LED assembly and the circuit comprises a strip connector.

6. The lighting device of claim 5, wherein the strip connector bridges the gap between the motherboard and the LED assembly.

7. The lighting device of claim 1, wherein the LED assembly comprises an LED unit, the LED unit comprising one or more LED elements, the LED assembly further comprising a dam surrounding the LED elements, and wherein a phosphor coating is arranged to cover the LED elements.

8. The lighting device according to claim 1, wherein the main board comprises a first main board portion and a second main board portion.

9. The lighting device according to claim 8, wherein the first main board portion and the second main board portion each have an L-shape.

10. The lighting device of claim 9, wherein there is a rectangular cutout between the first main board portion and the second main board portion, the rectangular cutout being arranged to accommodate the LED assembly.

11. The lighting device of claim 1, wherein the mounting area is a planar portion, and wherein the heat sink includes heat dissipation fins extending from the mounting area and forming an angle with the mounting area.

12. The lighting device of claim 11, wherein the planar portion is a first planar portion, and the heat sink further comprises a second planar portion arranged parallel to the first planar portion, wherein the heat dissipation fins are first heat dissipation fins, and the heat sink further comprises a second heat dissipation fin extending from the second planar portion and forming an angle with the second planar portion.

13. The lighting device of claim 1, further comprising a housing arranged to at least partially cover the heat sink, the motherboard and the LED assembly, wherein the housing includes a first housing component and a second housing component, and wherein at least a portion of the heat sink is disposed between the first housing component and the second housing component.

14. The lighting device of claim 13, wherein the first housing component includes a first locking feature, and the second housing component includes a second locking feature, wherein the first locking feature and the second locking feature are fixed together.

15. The lighting device of claim 13, wherein the housing provides an electrical plug housing.

16. The lighting device of claim 13, wherein the housing provides alignment features for arrangement relative to the bracket.

17. A method for manufacturing a lighting device, comprising the following steps: Provide LED components; A motherboard is provided, which includes circuitry for controlling the LED assembly and includes recesses; Provide radiators with installation areas; The LED assembly and the motherboard are arranged in the mounting area, wherein the LED assembly is disposed within the recess and spaced 10-500 µm from the inner surface of the motherboard within the recess, and wherein the LED assembly is fully exposed on the top surface of the motherboard; and, The LED assembly is electrically connected to the circuit. The groove is a cut configured to provide a free area for the LED assembly.

18. A vehicle lighting system, comprising: Lighting equipment, the lighting equipment comprising: Radiator, including the mounting area; The motherboard is mounted to the mounting area of ​​the heatsink and includes a top surface and a recess. A light-emitting diode (LED) assembly is mounted in a mounting area within a recess of the motherboard, the LED assembly being fully exposed on the top surface of the motherboard, the LED assembly including at least one emitter and spaced 10-500 µm from the inner surface of the motherboard within the recess; A circuit, on the top surface of the motherboard, is configured to control at least one emitter of the LED assembly. Electrical connection, between the LED assembly and the circuit, and A rear housing component includes an electrical connector housing electrically coupled to the motherboard and exposed on the bottom surface of the rear housing component; and The plug connector is electrically coupled to the plug housing. The groove is a cut configured to provide a free area for the LED assembly.

19. The system according to claim 18, wherein: The radiator includes multiple fins that are spaced apart to form spaces and are bent toward a direction away from the mounting area of ​​the radiator. The rear housing component includes multiple clamping arms spaced apart from each other, and The clamping arm of the plug connector extends through the space between the fins and engages with an opening in another housing component.

20. The system of claim 19, wherein the heat sink is a single metal component comprising a mounting area and fins.

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