Sample testing device and reagent bottle refrigeration device thereof

Abstract

The application discloses a sample detection device and a reagent bottle refrigerating device thereof. The reagent bottle refrigerating device comprises a refrigeration bin, a refrigeration assembly and a sealing assembly. The refrigeration bin comprises a bin body and a refrigeration seat, the refrigeration seat is arranged in the bin body, and the refrigeration seat is formed with a refrigeration chamber. The refrigeration assembly comprises a refrigeration block and a refrigeration sheet, the refrigeration block is arranged in the bin body and is in contact with the refrigeration seat, the refrigeration sheet is arranged on the side of the refrigeration block away from the refrigeration seat, and the cold end of the refrigeration sheet is in contact with the refrigeration block. The heat dissipation assembly is in contact with the hot end of the refrigeration sheet. The sealing assembly is arranged between the refrigeration seat and the heat dissipation assembly, and forms a sealing space surrounding the refrigeration sheet. In the above manner, the reagent bottle refrigerating device can isolate the refrigeration sheet from the outside, thereby significantly reducing the risk of moisture absorption of the refrigeration sheet.

Description

Technical Field

[0001] This application relates to the field of medical device technology, and in particular to a sample testing device and a reagent bottle refrigeration device thereof. Background Technology

[0002] Sample analyzers often require the refrigeration of reagents to prevent them from losing their effectiveness; therefore, sample analyzers are usually equipped with refrigeration devices for refrigerating reagents.

[0003] Current refrigeration equipment generates a lot of condensation during use, which can easily cause the cooling coils to become moldy and damaged, reducing refrigeration efficiency and shortening their lifespan. Summary of the Invention

[0004] This application mainly provides a sample testing device and a reagent bottle refrigeration device to solve the problem that the cooling element in the refrigeration device is prone to mold and damage.

[0005] To solve the above-mentioned technical problems, this application adopts the following technical solution: providing a reagent bottle refrigeration device. The reagent bottle refrigeration device includes: a refrigeration chamber, comprising a chamber body and a cold-conducting seat, the cold-conducting seat being disposed within the chamber body and forming a refrigeration compartment; a refrigeration component, comprising a cold-conducting block and a refrigeration plate, the cold-conducting block passing through the chamber body and contacting the cold-conducting seat, the refrigeration plate being disposed on the side of the cold-conducting block opposite to the cold-conducting seat, and the cold end of the refrigeration plate contacting the cold-conducting block; a heat dissipation component contacting the hot end of the refrigeration plate; and a sealing component disposed between the cold-conducting seat and the heat dissipation component, forming a sealed space at least surrounding the refrigeration plate.

[0006] In some embodiments, a portion of the sealing assembly is disposed between the heat dissipation assembly and the housing, and another portion of the sealing assembly is disposed between the cooling base and the housing, or between the housing and the cooling block.

[0007] In some embodiments, the sealing assembly includes a first seal and a second seal. The first seal is disposed around the cooling chip and between the heat dissipation assembly and the housing. The second seal is disposed around the cooling block and between the cooling base and the housing, or between the housing and the cooling block.

[0008] In some embodiments, the sealing assembly is disposed around the cooling chip and between the heat dissipation assembly and the cooling block.

[0009] In some embodiments, the sealing assembly includes a support frame and two sealing rings. The support frame is disposed around the cooling chip and between the heat dissipation assembly and the cooling block. One of the sealing rings is disposed between the support frame and the cooling block, and the other sealing ring is disposed between the support frame and the heat dissipation assembly.

[0010] In some embodiments, the cooling block includes a positioning part and a support part of an integral structure. The positioning part is located on the side of the support part away from the cooling base and is used to be inserted into the support frame and to contact the cold end of the cooling chip. The sealing ring is provided between the side of the support part away from the cooling base and the support frame.

[0011] In some embodiments, the chamber body is provided with stepped holes, and the cooling block has a stepped structure that is fitted with the stepped holes.

[0012] In some embodiments, the reagent bottle refrigeration device further includes three flexible thermally conductive layers, which are respectively disposed between the cold-conducting base and the cold-conducting block, between the cold-conducting block and the cooling chip, and between the cooling chip and the heat dissipation assembly.

[0013] In some embodiments, the flexible thermally conductive layer is a thermally conductive silicone sheet or thermally conductive grease.

[0014] To solve the above-mentioned technical problems, another technical solution adopted in this application is to provide a sample testing device, which includes the reagent bottle refrigeration device as described above.

[0015] The beneficial effects of this application are as follows: Unlike the prior art, this application discloses a sample testing device and its reagent bottle refrigeration device. By setting a sealing component between the cooling base and the heat dissipation component to form a sealed space at least around the cooling chip, the cooling chip is isolated from the outside air, preventing moisture from the air from condensing on the cooling chip and causing damage. Therefore, the reagent bottle refrigeration device provided by this application can significantly reduce the risk of moisture absorption of the cooling chip. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0017] Figure 1 This is a schematic diagram of an embodiment of the reagent bottle refrigeration device provided in this application;

[0018] Figure 2 yes Figure 1 A magnified structural diagram of region A in the reagent bottle refrigeration device shown;

[0019] Figure 3 yes Figure 1 A schematic diagram of the exploded structure of the reagent bottle refrigeration device shown.

[0020] Figure 4 yes Figure 1 A schematic diagram of another possible combination of the refrigeration and heat dissipation components in the reagent bottle refrigeration device shown.

[0021] Figure 5 yes Figure 1 The diagram shows the structure of the anti-pressure component in the reagent bottle refrigeration device. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0023] The terms "first," "second," and "third" used in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0024] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0025] In sample analysis devices, the reagents stored inside often need to be kept in a low-temperature environment to avoid destroying their effectiveness. Therefore, refrigeration devices are often required to refrigerate unused reagents.

[0026] Based on this, this application provides a reagent bottle refrigeration device 100, see reference. Figures 1 to 3 , Figure 1 This is a schematic diagram of an embodiment of the reagent bottle refrigeration device provided in this application. Figure 2 yes Figure 1 The diagram shows an enlarged view of region A in the reagent bottle refrigeration device. Figure 3 yes Figure 1 The diagram shows the exploded structure of the reagent bottle refrigeration device.

[0027] The reagent bottle refrigeration device 100 includes a refrigeration chamber 10, a refrigeration component 20, a heat dissipation component 30, and a sealing component 40. The refrigeration component 20 provides cooling to the refrigeration chamber 10 and transfers the heat exchanged within the refrigeration chamber 10 to the heat dissipation component 30, which in turn dissipates heat from the refrigeration component 20. The sealing component 40 prevents the refrigeration component 20 from being damaged by moisture.

[0028] Specifically, the refrigeration chamber 10 includes a chamber body 12 and a cooling seat 14. The cooling seat 14 is disposed inside the chamber body 12 and forms a cold storage chamber 140. The cooling seat 14 is made of a metal material with good heat transfer performance. The chamber body 12 has heat insulation properties and is provided with a receiving cavity. The cooling seat 14 is disposed inside the receiving cavity.

[0029] The cooling base 14 is made of materials with excellent thermal conductivity, such as copper, aluminum and their alloys. It includes a supporting base plate, multiple upright side plates located on the side of the supporting base plate, and a top plate located on the upright side plates. Either the supporting base plate or the upright side plates can contact the refrigeration component 20 to receive the cooling supply from the refrigeration component 20. The top plate has an opening for the reagent needle to draw reagents located in the cold storage compartment 140, or for the conduit to guide the reagents in the cold storage compartment 140 to the outside.

[0030] The cooling base 14 is a sheet metal part, which can achieve a small volume with a large area. It can dissipate cold energy to the maximum extent with almost no increase in cooling power, so as to create a uniform cooling temperature in the refrigerator compartment 140, effectively improve the utilization rate of cooling power and enhance the cooling effect.

[0031] The compartment 12 includes a shell 120, a heat insulation layer 122 and a heat preservation layer 124 disposed within the shell 120, and a compartment door (not shown). The compartment door is used to close the cold storage compartment 140. The heat insulation layer 122 and the heat preservation layer 124 are made of heat insulation material or material with low thermal conductivity. The cold conduction seat 14 is disposed within the heat preservation layer 124 to reduce the evaporation of cold energy. The heat insulation layer 122 is disposed between the shell 120 and the heat preservation layer 124 to reduce the impact of external temperature on the cold storage compartment 140.

[0032] The refrigeration assembly 20 includes a cooling block 22 and a cooling plate 24. The cooling block 22 passes through the chamber 12 and contacts the cooling base 14. The cooling plate 24 is disposed on the side of the cooling block 22 away from the cooling base 14, and the cold end of the cooling plate 24 contacts the cooling block 22 to provide cooling to the cooling base 14 through the cooling block 22. The hot end of the cooling plate 24 contacts the heat dissipation assembly 30 to improve the heat dissipation efficiency through the heat dissipation assembly 30, thereby further improving the refrigeration efficiency.

[0033] The heat dissipation assembly 30 includes a heat-conducting element 31, a heat-conducting pipe 32, a heat dissipation fin assembly 33, and a fan 34. The heat-conducting element 31 is in contact with the hot end of the cooling chip 24. One end of the heat-conducting pipe 32 is disposed in the heat-conducting element 31, and the other end of the heat-conducting pipe 32 is disposed in the heat dissipation fin assembly 33. The fan 34 is disposed on one side of the heat dissipation fin assembly 33 to enhance the air flow rate through the heat dissipation fin assembly 33, thereby accelerating heat dissipation and improving heat dissipation performance.

[0034] Among them, the heat-conducting component 31, the heat-conducting pipe 32 and the heat dissipation fins 33 are all made of materials with good thermal conductivity, such as copper, aluminum and their alloys.

[0035] like Figure 2 As shown, in this embodiment, the cooling block 22 is in contact with the supporting base plate of the cooling seat 14, meaning that both the cooling component 20 and the heat dissipation component 30 are located below the cooling seat 14. The chamber 12 has a stepped hole 121, and the cooling block 22 has a stepped structure that mates with the stepped hole 121 for limiting assembly. The mate between the stepped hole 121 and the stepped structure of the cooling block 22 limits the length of the cooling block 22 extending into the accommodating cavity of the chamber 12, ensuring good contact between the cooling block 22 and the cooling seat 14 and preventing damage to the cooling seat 14.

[0036] The sealing component 40 is disposed between the cooling base 14 and the heat dissipation component 30, and forms a sealed space at least around the cooling chip 24 to isolate the cooling chip 24 and prevent moisture from the air from condensing on the cooling chip 24, which would damage the cooling chip 24.

[0037] When the cooling element 24 is in operation, the temperature is low, and water droplets are easily condensed when it comes into contact with the air. Water droplets or ice can cause great damage to the performance and service life of the cooling element 24. By setting the sealing component 40 between the cooling seat 14 and the heat dissipation component 30, a sealed space is formed at least around the cooling element 24, thereby isolating the cooling element 24 from the outside air and preventing water vapor from the air from condensing on the cooling element 24 and causing damage to the cooling element 24.

[0038] The sealed space is set at least around the cooling chip 24. In other words, the sealed space formed by the sealing component 40, the cooling chamber 10, and the heat dissipation component 30 can seal the cooling chip 24, or seal the cooling chip 24 and the heat conduction seat 14, or seal the cooling chip 24 and part of the heat conduction seat 14.

[0039] In one embodiment, in conjunction with reference to Figures 1 to 3 A portion of the sealing assembly 40 is disposed between the heat dissipation assembly 30 and the chamber 12, and another portion of the sealing assembly 40 is disposed between the cooling seat 14 and the chamber 12, or between the chamber 12 and the cooling block 22.

[0040] Optionally, the sealing assembly 40 may include multiple independent components, which are respectively disposed between the heat dissipation assembly 30 and the housing 12, and between the coolant base 14 and the housing 12, or between the housing 12 and the coolant block 22; the sealing assembly 40 may also be an independent component that can be disposed simultaneously between the heat dissipation assembly 30 and the housing 12, between the coolant base 14 and the housing 12, and / or between the housing 12 and the coolant block 22.

[0041] In this embodiment, the sealing assembly 40 includes two independent components. The sealing assembly 40 may also include three, four, or five components, and this application does not specifically limit this number.

[0042] Specifically, the sealing assembly 40 includes a first sealing element 41 and a second sealing element 42. The first sealing element 41 is disposed around the cooling chip 24 and between the heat dissipation assembly 30 and the housing 12. That is, the first sealing element 41 is annular and is disposed around the cooling chip 24. The first sealing element 41 is disposed between the heat dissipation assembly 30 and the housing 12 to prevent air from outside the cooling housing 10 from contacting the cooling chip 24. The second sealing element 42 is disposed around the cooling block 22 and is disposed between the cooling seat 14 and the housing 12, or between the housing 12 and the cooling block 22, to prevent air or liquid from the cooling housing 10 from contacting the cooling chip 24, and to form a sealed space around the cooling chip 24 to isolate the air and liquid from the outside atmosphere and the cooling housing 10, creating a working environment for the cooling chip 24 that is not prone to condensation or contact with liquid.

[0043] The first seal 41 and the second seal 42 may be made of an elastic material; or the first seal 41 and the second seal 42 may include a rigid support frame and a sealing ring disposed on the support frame, with the sealing ring providing the sealing effect.

[0044] In this embodiment, both the first sealing element 41 and the second sealing element 42 are sealing cotton. The first sealing element 41 is frame-shaped and surrounds the cooling chip 24, and is located between the heat dissipation assembly 30 and the chamber 12. The second sealing element 42 is also frame-shaped and surrounds the cooling block 22, and is located between the supporting base plate of the cooling seat 14 and the chamber 12. The resulting sealed space seals and isolates both the cooling block 22 and the cooling chip 24.

[0045] In other embodiments, the second seal 42 may also be disposed between the inner wall of the stepped hole 121 and the cooling block 22, or may cooperate with the first seal 41 to form a sealed space surrounding the cooling chip 24.

[0046] See Figure 4 , Figure 4 yes Figure 1 A schematic diagram of another possible combination of the refrigeration and heat dissipation components in the reagent bottle refrigeration device shown.

[0047] In another embodiment, such as Figure 4 As shown, the sealing component 40 is arranged around the cooling chip 24 and between the heat dissipation component 30 and the cooling block 22, so that the sealing component 40, the heat dissipation component 30 and the cooling block 22 together form a sealed space, which isolates the cooling chip 24 from air and liquid.

[0048] The sealing assembly 40 may be the first seal 41 as described above.

[0049] In this embodiment, the sealing assembly 40 includes a support frame 43 and two sealing rings 45. The support frame 43 is arranged around the cooling chip 24 and between the heat dissipation assembly 30 and the cooling block 22. One sealing ring 45 is arranged between the support frame 43 and the cooling block 22, and the other sealing ring 45 is arranged between the support frame 43 and the heat dissipation assembly 30.

[0050] The support frame 43 is a square frame similar in shape to the cooling plate 24. The support frame 43 is made of rigid material. The cooling plate 24 has a certain thickness. By setting the support frame 43, the stability of the sealing assembly 40 is increased and the use of elastic sealing material is reduced, thereby improving the sealing effect.

[0051] Optionally, the support frame 43 has sealing grooves on both sides, and two sealing rings 45 are respectively disposed in the sealing grooves and sealed with the corresponding cooling block 22 and heat dissipation assembly 30; or, the support frame 43 has a sealing groove on one side surface, and the cooling block 22 or heat dissipation assembly 30 on the other side of the support frame 43 has another sealing groove, and two sealing rings 45 are respectively disposed in the two sealing rings; or, the cooling block 22 and heat dissipation assembly 30 have sealing grooves, and two sealing rings 45 are respectively disposed in the two sealing rings, and are sealed by the abutment support of the support frame 43.

[0052] In this embodiment, the cooling block 22 includes a positioning part 221 and a support part 223 with an integral structure. The positioning part 221 is located on the side of the support part 223 away from the cooling base and is used to be inserted into the support frame 43 and to contact the cold end of the cooling chip 24. The support part 223 stops on the side of the support frame 43 facing the cooling block 22. A sealing ring 45 is provided between the side of the support part 223 away from the cooling block 22 and the support frame 43.

[0053] The positioning part 221 is disposed on one side of the support part 223. It protrudes relative to the support part 223 and cooperates with the support part 223 to form a step. The step structure is assembled with the support frame 43 so that the positioning part 221 is disposed inside the support frame 43, and the positioning part 221 and the support frame 43 can limit each other to further increase stability.

[0054] Furthermore, such as Figures 1 to 3 As shown, the reagent bottle refrigeration device 100 also includes a flexible heat-conducting layer 52, which is disposed between the cooling chip 24 and the cooling block 22 and / or between the hot end of the cooling chip 24 and the heat dissipation assembly 30.

[0055] Optionally, a flexible heat-conducting layer 52 is disposed between the cooling chip 24 and the cooling block 22. The cooling chip 24 transfers cooling energy to the cooling block 22 through the flexible heat-conducting layer 52. The flexible heat-conducting layer 52 can have more sufficient contact with the cooling chip 24 and the cooling block 22, which can eliminate the contact gap between the cooling chip 24 and the cooling block 22 and improve the efficiency of cooling energy transfer.

[0056] Optionally, a flexible thermally conductive layer 52 is disposed between the hot end of the cooling chip 24 and the heat dissipation assembly 30. The cooling chip 24 dissipates heat to the heat dissipation assembly 30 through the flexible thermally conductive layer 52. The flexible thermally conductive layer 52 can have more sufficient contact with the cooling chip 24 and the heat dissipation assembly 30, which can eliminate the contact gap between the cooling chip 24 and the heat dissipation assembly 30 and improve the heat transfer efficiency. Optionally, the flexible thermally conductive layer 52 is a thermally conductive silicone sheet or thermally conductive grease.

[0057] like Figures 1 to 3As shown, the reagent bottle refrigeration device 100 also includes an anti-pressure component 54, which is disposed between the cooling block 22 and the heat dissipation assembly 30. The height of the anti-pressure component 54 along the stacking direction of the cooling chip 24 and the cooling block 22 is greater than the height of the cooling chip 24, so that the anti-pressure component 54 can mainly bear the pressure transmitted by the cooling block 22, reduce the pressure on the cooling chip 24, and thus avoid the cooling block 22 from excessively squeezing the cooling chip 24, causing damage to the cooling chip 24.

[0058] By setting a flexible heat-conducting layer 52 between the cooling chip 24 and the cooling block 22 and / or between the hot end of the cooling chip 24 and the heat dissipation assembly 30, the unevenness of the cooling chip 24 can be improved. This avoids hard contact or insufficient contact with the cooling block 22, or unbalanced force caused by the insufficient flatness of the cooling chip 24. Furthermore, an anti-pressure component 54 is set to withstand the extrusion force transmitted by the cooling block 22 and correct the unbalanced force on the cooling chip 24. This allows the cooling chip 24 to be protected and to transfer energy more efficiently through the flexible heat-conducting layer 52.

[0059] In this embodiment, the reagent bottle refrigeration device 100 includes three flexible heat-conducting layers 52. The three flexible heat-conducting layers 52 are respectively disposed between the heat-conducting seat 14 and the heat-conducting block 22, between the heat-conducting block 22 and the cooling chip 24, and between the cooling chip 24 and the heat dissipation component 30, so as to improve the contact conditions between them and improve the efficiency of heat and cold transfer.

[0060] The anti-pressure component 54 can be disposed within the sealed space formed by the sealing assembly 40 or outside the sealed space.

[0061] In this embodiment, the anti-pressure component 54 is disposed within the sealed space and is also supported between the chamber body 12 and the heat dissipation component 30, which can also reduce the compressive force of the heat dissipation component 30 on the cooling block 22 and the cooling seat 14.

[0062] There are two anti-pressure components 54, which are respectively set on both sides of the cooling plate 24 to distribute the extrusion pressure of the cooling block 22 from the left and right sides of the cooling plate 24, and to make the force transmission between the cooling block 22 and the cooling plate 24 uniform, thereby having better heat transfer efficiency.

[0063] See Figure 5 , Figure 5 yes Figure 1 The diagram shows the structure of the anti-pressure component in the reagent bottle refrigeration device. In this embodiment, the anti-pressure component 54 includes a first anti-pressure part 540 and a second anti-pressure part 542. The first anti-pressure part 540 and the second anti-pressure part 542 are stepped. The first anti-pressure part 540 covers the second anti-pressure part 542 along the stacking direction. The first anti-pressure part 540 is supported by the cooling block 22, and the second anti-pressure part 542 is supported by the heat dissipation assembly 30.

[0064] Wherein, the first anti-pressure part 540 does not cover the step of the second anti-pressure part 542, a connecting structure 543 is provided. The connecting structure 543 can be a connecting hole or a connecting post, etc. For example, the connecting structure 543 is a connecting hole, and fasteners can be used to fix the anti-pressure part 54 to the chamber body 12 through the connecting hole, which can limit the position of the cooling block 22 and prevent the anti-pressure part 54 from moving at will.

[0065] Optionally, the number of anti-pressure components 54 can also be one, which is frame-shaped and arranged around the cooling chip 24, and may also be provided with a connecting structure 543.

[0066] Optionally, the number of anti-pressure components 54 can be three or four, and they can be respectively set in different positions of the cooling plate 24.

[0067] This application also provides a sample testing device (not shown), which includes a reagent bottle refrigeration device 100 as described above. The sample testing device is used to test samples such as blood or urine. The reagent bottle refrigeration device 100 is used to refrigerate and store reagent bottles or kits containing reagents. The reagent solution is extracted, added to the sample solution, mixed, and heated to induce a reaction with the sample solution.

[0068] Unlike existing technologies, this application discloses a sample testing device and its reagent bottle refrigeration device. By setting a sealing component between the cooling base and the heat dissipation component to form a sealed space at least around the cooling element, the cooling element is isolated from the outside air, preventing moisture from the air from condensing on the cooling element and causing damage. Therefore, the reagent bottle refrigeration device provided by this application can significantly reduce the risk of moisture absorption of the cooling element.

[0069] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A reagent bottle refrigeration device, characterized in that, The reagent bottle refrigeration device includes: A refrigeration compartment includes a compartment body and a cooling guide seat, wherein the cooling guide seat is disposed in the compartment body and forms a refrigeration chamber; A refrigeration assembly includes a cooling block and a refrigeration plate. The cooling block passes through the chamber and contacts the cooling base. The refrigeration plate is disposed on the side of the cooling block away from the cooling base, and the cold end of the refrigeration plate contacts the cooling block. The heat dissipation component is in contact with the hot end of the cooling chip; A sealing assembly is disposed between the cooling base and the heat dissipation assembly, and forms a sealed space at least around the cooling chip; An anti-pressure component is disposed between the cooling block and the heat dissipation assembly, and the height of the anti-pressure component along the stacking direction of the cooling chip and the cooling block is greater than the height of the cooling chip; The sealing assembly includes a first sealing element and a second sealing element. The first sealing element is disposed around the cooling chip and between the heat dissipation assembly and the housing. The second sealing element is disposed around the cooling block and between the cooling base and the housing, or between the housing and the cooling block. The reagent bottle refrigeration device also includes three flexible heat-conducting layers, which are respectively disposed between the heat-conducting base and the heat-conducting block, between the heat-conducting block and the cooling chip, and between the cooling chip and the heat dissipation component; The pressure-resistant component includes a first pressure-resistant part and a second pressure-resistant part, the first pressure-resistant part and the second pressure-resistant part are arranged in a stepped manner, the first pressure-resistant part covers the second pressure-resistant part along the stacking direction, the first pressure-resistant part is supported by the cooling block, and the second pressure-resistant part is supported by the heat dissipation assembly.

2. The reagent bottle refrigeration device according to claim 1, characterized in that, The chamber body is provided with stepped holes, and the cooling block has a stepped structure that is fitted with the stepped holes.

3. The reagent bottle refrigeration device according to claim 1, characterized in that, The flexible thermally conductive layer is a thermally conductive silicone sheet or thermally conductive silicone grease.

4. A sample detection device, characterized in that, The sample testing device includes the reagent bottle refrigeration device as described in any one of claims 1 to 3.

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