A method and system for detecting wafer edge topography
By using robotic arms and beam illumination to automatically calibrate and inspect equipment, the complexity and error problems of wafer edge morphology inspection have been solved, achieving automated and accurate wafer edge morphology inspection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XIAN ESWIN MATERIAL TECHNOLOGY CO LTD
- Filing Date
- 2022-12-12
- Publication Date
- 2026-06-16
AI Technical Summary
Existing technologies for wafer edge morphology inspection are complex, requiring manual machine adjustment and calibration, which introduces errors and wastes manpower. Furthermore, there are risks associated with robotic arms handling wafers.
A robotic arm is used to transport standard wafers to the testing equipment. Images are acquired by illuminating the wafers with a light beam, and multiple points to be verified are checked. The position and intensity of the light source are adjusted to calibrate the testing equipment. Once the verification is passed, the wafer edge morphology is inspected.
It enables automatic calibration of the testing equipment, avoiding errors and contamination caused by manual calibration, and automatically detects the edge morphology of wafers, reducing the risks of robotic arms and the waste of manpower.
Smart Images
Figure CN115881570B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of wafer inspection technology, and in particular to a method and system for detecting the edge morphology of a wafer. Background Technology
[0002] As the carrier of semiconductor circuit manufacturing processes, the quality of wafers has a decisive impact on the formation of integrated circuits. Currently, the main processes in the initial wafer forming process include dicing, grinding, etching, polishing, and cleaning. Wafer grinding typically includes double-sided grinding and edge grinding. Edge grinding is a crucial process, as its effect directly affects the accuracy of the final product positioning, performance, efficiency, and stability of photovoltaic cells and integrated circuits. Understandably, wafers are cut from silicon ingots, resulting in high edge roughness, irregular edge morphology, and defects such as scratches, chipping, and bright spots. These defects significantly impact subsequent processes, leading to fragmentation and breakage, and in severe cases, equipment damage. Wafer edge grinding not only removes burrs, scratches, and chipping from the wafer edges, but also significantly affects the edge morphology. Currently, there are many methods for inspecting wafer edge morphology, but they are all complex, requiring machine adjustment, calibration, and testing. Furthermore, there are risks associated with robotic arms handling wafers, and regular calibration is complex, requiring manufacturer support, resulting in long processing times and significant manpower waste. Summary of the Invention
[0003] In view of this, the present invention aims to provide a method and system for detecting the edge morphology of a wafer; capable of automatically detecting the edge morphology of a wafer and avoiding errors caused by manual detection.
[0004] The technical solution of this invention is implemented as follows:
[0005] In a first aspect, embodiments of the present invention provide a method for detecting the edge morphology of a wafer, the method comprising:
[0006] A robotic arm is used to transport a standard wafer to a designated testing position within the testing equipment, and the standard wafer is then irradiated with a light beam.
[0007] The image of the standard wafer is acquired, and multiple verification points on the image are obtained for detecting edge morphology.
[0008] The inherent light source position and light intensity in the testing equipment are verified using the multiple verification points. If the verification fails, the inherent light source position and / or light intensity are adjusted to make the verification pass. When the verification passes, it indicates that the calibration of the inherent light source position and light intensity in the testing equipment is complete.
[0009] Once the verification is passed, the standard wafer is removed and the wafer to be tested is placed at the designated detection position within the testing equipment for edge morphology detection.
[0010] Secondly, embodiments of the present invention provide a system for detecting the edge morphology of a wafer, the system comprising: a robotic arm, a light source illumination device, an image acquisition and processing device, and a verification data processing device; wherein;
[0011] The robotic arm is used to transfer a standard wafer to a designated testing position within the testing equipment; and after the testing equipment has completed calibration, to remove the standard wafer and place the wafer to be tested at the designated testing position within the testing equipment.
[0012] The light source irradiation device is used to irradiate the standard wafer and the wafer under test with a light beam.
[0013] The image acquisition and processing device is used to acquire images of the standard wafer and the wafer under test to obtain multiple verification points for detecting edge morphology;
[0014] The verification data processing device is configured to verify the position and intensity of the inherent light source in the detection equipment using the multiple points to be verified.
[0015] This invention provides a method and system for detecting the edge morphology of a wafer. The method acquires an image of a standard wafer and verifies multiple points on the image to be verified. When multiple points fail verification, the position and beam information of the inherent light source in the detection equipment are adjusted to ensure the multiple points pass verification, thus calibrating the detection equipment. After multiple points pass verification, the standard wafer is removed, and the wafer to be tested is placed at the designated detection position within the detection equipment for edge morphology detection. This method can automatically calibrate the detection equipment using a standard wafer, avoiding inaccurate calibration data caused by standard wafer contamination due to manual calibration. Simultaneously, it can automatically detect the edge morphology of the wafer, avoiding errors caused by manual detection. Attached Figure Description
[0016] Figure 1 This is a schematic flowchart of a method for detecting the edge morphology of a wafer provided in an embodiment of the present invention;
[0017] Figure 2 This is a schematic diagram of wafer edge morphology detection provided in an embodiment of the present invention;
[0018] Figure 3 This is a schematic diagram of V-shaped notch edge morphology detection provided in an embodiment of the present invention;
[0019] Figure 4This is a schematic diagram of V-shaped notch edge morphology detection provided in another embodiment of the present invention;
[0020] Figure 5 A schematic diagram of the movement trajectory calibration of the robotic arm provided in an embodiment of the present invention;
[0021] Figure 6 This is a schematic diagram of a system for detecting the edge morphology of a wafer, provided as an embodiment of the present invention. Detailed Implementation
[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
[0023] See Figure 1 This illustrates a method for detecting wafer edge morphology according to an embodiment of the present invention, the method comprising:
[0024] S101. A robotic arm is used to transfer a standard wafer to a designated detection position within the testing equipment, and the standard wafer is then irradiated with a light beam.
[0025] S102. Acquire an image of the standard wafer and obtain multiple verification points on the image for detecting edge morphology;
[0026] S103. The inherent light source position and light intensity in the detection equipment are verified using the multiple verification points. If the verification fails, the inherent light source position and / or light intensity are adjusted to make the verification pass. Wherein, when the verification passes, it indicates that the inherent light source position and light intensity calibration in the detection equipment is completed.
[0027] S104. After the verification is passed, the standard wafer is removed and the wafer to be tested is placed at the set detection position in the detection equipment to detect the edge morphology.
[0028] It should be noted that, in the embodiments of the present invention, the edge morphology of the wafer includes the edge morphology without the V-shaped notch portion (hereinafter referred to as "edge morphology") and the edge morphology with the V-shaped notch.
[0029] Understandably, for Figure 1 The technical solution shown in the figure involves steps S101, S102 and S103, which use a standard wafer to calibrate the position and intensity of the light source inherent in the detection equipment. Once the detection equipment is calibrated, step S104 can be executed to detect the edge morphology of the wafer to be tested.
[0030] In addition, it should be noted that multiple light source illumination devices and projection sensing devices are arranged around the wafer inside the inspection equipment. When the multiple light source illumination devices illuminate the wafer, the projection sensing device can convert the optical signal into an image signal to obtain the outline of the wafer. Through the image acquisition and processing device set in the inspection equipment, multiple verification points for detecting the edge morphology of the wafer can be obtained.
[0031] for Figure 1 In some possible implementations of the technical solution shown, the step of acquiring an image of the standard wafer and obtaining multiple verification points on the image for detecting the edge morphology of the standard wafer includes:
[0032] An edge image of the standard wafer is acquired to obtain seven verification points on the edge image for detecting the edge morphology of the standard wafer; wherein the seven verification points are: arc upper sloping point, arc upper tangent point, end face point, arc lower tangent point, arc lower sloping point, front thickness measurement point, and back thickness measurement point.
[0033] like Figure 2 As shown, it specifically illustrates the seven points to be verified on the edge image of a standard wafer: arc sloping point A, arc tangent point B, end face point C, arc tangent point D, arc sloping point E, front thickness measurement point F, and back thickness measurement point G.
[0034] It should be noted that end face point C is the point of tangency between the edge of the standard wafer and end face s, specifically as follows: Figure 2 As shown.
[0035] for Figure 1 In some possible implementations of the technical solution shown, the step of verifying the inherent light source position and light intensity in the detection device using the multiple verification points, and adjusting the inherent light source position and / or light intensity to make the verification pass when the verification fails, includes:
[0036] Based on the edge image of the standard wafer, the pixel thickness, the first pixel width of the upper slope, the second pixel width of the lower slope, the third pixel width of the upper end face, the fourth pixel width of the lower end face, and the first pixel radius of the tip arc of the standard wafer are measured respectively. When any of the pixel thickness h, the first pixel width of the upper slope, the second pixel width of the lower slope, the third pixel width of the upper end face, the fourth pixel width of the lower end face, and the first pixel radius of the tip arc of the standard wafer do not meet the set standard value, it indicates that the 7 points to be verified have failed.
[0037] Wherein, the pixel thickness of the standard wafer is the distance between the front thickness measurement point and the back thickness measurement point; the first pixel width is the perpendicular distance from the upper sloping point of the standard wafer edge to the end face where the end face point is located; the second pixel width is the perpendicular distance from the lower sloping point of the standard wafer edge to the end face where the end face point is located; the third pixel width is the distance between the upper sloping point of the standard wafer edge and the end face point in the Z-axis direction; the fourth pixel width is the distance between the lower sloping point of the standard wafer edge and the end face point in the Z-axis direction; and the first pixel radius is the radius of the circle containing the upper tangent point of the arc, the end face point, and the lower tangent point of the arc.
[0038] When the verification of the seven points to be verified fails, the positions of the seven points to be verified on the edge image are corrected by repeatedly adjusting the inherent light source position and / or correcting the light intensity. The pixel thickness, the first pixel width of the upper slope, the second pixel width of the lower slope, the third pixel width of the upper end face, the fourth pixel width of the lower end face, and the first pixel radius of the tip arc of the standard wafer are remeasured. When the pixel thickness, the first pixel width of the upper slope, the second pixel width of the lower slope, the third pixel width of the upper end face, the fourth pixel width of the lower end face, and the first pixel radius of the tip arc of the standard wafer all meet the set standard values, it indicates that the verification of the seven points to be verified has passed.
[0039] It should be noted that in the embodiments of the present invention, the centroid of the standard wafer is taken as the origin O of the Cartesian coordinate system, two mutually perpendicular radial directions are taken as the X-axis and Y-axis of the Cartesian coordinate system, and the thickness direction of the standard wafer is taken as the Z-axis of the Cartesian coordinate system.
[0040] Understandably, after obtaining the edge image of the standard wafer and the 7 verification points on the edge image, the arc 1 can be obtained by fitting the positions of the verification points B, C, and D. Therefore, in the specific implementation process, by determining whether the pixel thickness h, the first pixel width l1 of the upper slope, the second pixel width l2 of the lower slope, the third pixel width l3 of the upper end face, the fourth pixel width l4 of the lower end face, and the first pixel radius r1 of the tip arc 1 are consistent with the set standard values, it can be determined that the position and intensity of the light source used to illuminate the edge of the wafer in the detection equipment have been calibrated using the standard wafer.
[0041] Furthermore, when calibrating the testing equipment, since the pixel change ratio on the same acquired image is fixed, when the pixel thickness h of the standard wafer, the first pixel width l1 of the upper slope, the second pixel width l2 of the lower slope, the third pixel width l3 of the upper end face, the fourth pixel width l4 of the lower end face, and the first pixel radius r1 of the tip arc 1 respectively meet the set standard values, it means that the actual thickness of the standard wafer, the actual width of the upper slope, the actual width of the lower slope, the actual width of the upper end face, the actual width of the lower end face, and the actual radius of the tip arc 1 meet the set standard values.
[0042] On the other hand, in this embodiment of the invention, the aforementioned seven verification points are used to detect the edge morphology of the wafer, by... Figure 2 It can be seen that when the edge morphology of the wafer meets the specifications, in addition to the pixel thickness h and the pixel radius r of the tip arc meeting the set standard values, the first pixel width l1 of the upper slope is equal to the second pixel width l2 of the lower slope, and the third pixel width l3 of the upper end face is equal to the fourth pixel width l4 of the lower end face.
[0043] for Figure 1 The method shown, in some possible implementations, involves acquiring an image of the standard wafer and obtaining multiple verification points on the image, including:
[0044] A surface image of the standard wafer is acquired to obtain five verification points on the surface image for detecting the V-shaped notch morphology of the standard wafer. The five verification points are: the tangent point of the left inner circle edge, the tangent point of the left arc, the tangent point of the right arc, the tangent point of the right inner circle edge, and the end point of the bottom of the V-groove.
[0045] like Figure 3 As shown, it specifically illustrates the five points to be verified on the standard wafer surface image: the left inscribed circle edge tangent point H, the left arc tangent point I, the right arc tangent point J, the right inscribed circle edge tangent point K, and the bottom end point L of the V-groove.
[0046] for Figure 1 In some possible implementations of the method shown, the step of verifying the inherent light source position and light intensity in the detection device using the plurality of verification points, and adjusting the inherent light source position and / or light intensity to make the verification pass when the verification fails, includes:
[0047] Based on the surface image of the standard wafer, the second pixel radius of the left inscribed circle, the third pixel radius of the right inscribed circle, and the fourth pixel radius of the notch measuring circle where the bottom end of the V-groove, the left arc tangent point, and the right arc tangent point are located are obtained. When any of the second pixel radius, the third pixel radius of the right inscribed circle, and the fourth pixel radius do not meet the set standard value, it indicates that the five points to be verified have failed.
[0048] When the verification of the five points to be verified fails, the positions of the five points to be verified are corrected by adjusting the inherent light source position and / or correcting the light intensity multiple times. The second pixel radius, the third pixel radius of the right inscribed circle, and the fourth pixel radius are remeasured. When the second pixel radius, the third pixel radius of the right inscribed circle, and the fourth pixel radius all meet the set standard values, it indicates that the five points to be verified have passed.
[0049] It should be noted that once the surface image of the wafer under test is output and obtained, the five verification points on the edge of the V-notch can be determined, as follows: Figure 3 As shown, in order to verify the morphology of the V-shaped notch using the above five verification points, based on the acquired surface image, the left inscribed circle 2 is obtained from verification points H and I, the right inscribed circle 3 is obtained from verification points J and K, and the notch measurement circle 4 is obtained from verification points I, L, and J. From this, the second pixel radius r2 of the left inscribed circle 2, the third pixel radius r3 of the right inscribed circle 3, and the fourth pixel radius r4 of the notch measurement circle 4 can be determined. It should be noted that in this embodiment of the invention, the edge morphology of the standard wafer W and the edge morphology of the V-shaped notch have set standard values. Therefore, by comparing the obtained pixel radii with the set standard values, it can be determined whether the above five verification points have passed verification.
[0050] like Figure 4 As shown, when the position of the light source in the detection equipment does not meet the requirements, the obtained notch measurement circle 4 may actually be elliptical. However, when the position of the light source is adjusted, its shape can be adjusted to... Figure 3 The circle in the test equipment is calibrated when the second pixel radius r2 of the left inscribed circle 2, the third pixel radius r3 of the right inscribed circle 3, and the fourth pixel radius r4 of the notch measurement circle 4 meet the set standard values.
[0051] Understandably, once the seven verification points for detecting edge morphology and the five verification points for detecting V-notch morphology have passed verification, the testing equipment is calibrated and can then be used to detect the edge morphology and V-notch morphology of the wafer under test.
[0052] for Figure 1 In some possible implementations of the technical solution shown, the step of removing the standard wafer and placing the wafer to be tested at the designated detection position within the testing equipment after the verification is passed includes:
[0053] Once the verification is passed, the standard wafer is removed and the wafer to be tested is placed at the designated testing position within the testing equipment;
[0054] Edge and surface images of the wafer under test are acquired respectively. Seven verification points for edge morphology detection are obtained on the edge image of the wafer under test. These seven verification points are: upper sloping point of the arc, upper tangent point of the arc, end face point, lower tangent point of the arc, lower sloping point of the arc, front thickness measurement point, and back thickness measurement point. Five verification points for V-notch morphology detection are obtained on the surface image of the wafer under test. These five verification points are: left inscribed circle edge tangent point, left arc tangent point, right arc tangent point, right inscribed circle edge tangent point, and bottom end of the V-groove.
[0055] When the seven verification points used to detect the edge morphology and the five verification points used to detect the V-notch morphology on the edge image and surface image of the wafer under test pass the verification, it is determined that the edge morphology of the wafer under test meets the specification requirements.
[0056] Understandably, in the process of detecting the edge morphology and V-notch morphology of the wafer under test, the verification method for the seven verification points used to detect the edge morphology is to determine, based on the acquired edge image of the wafer under test, whether the corresponding pixel thickness, the fifth pixel width of the upper slope, the fifth pixel width of the lower slope, the fifth pixel width of the upper end face, the fifth pixel width of the lower end face, and the fifth pixel radius of the tip arc of the wafer under test meet the set standard values respectively; the verification for the five verification points used to detect the V-notch morphology is to determine, based on the acquired surface image of the wafer under test, whether the sixth pixel radius of the left inscribed circle, the seventh pixel radius of the right inscribed circle, and the eighth pixel radius of the notch measurement circle corresponding to the V-notch in the wafer under test meet the set standard values respectively.
[0057] for Figure 1 The method shown, in some possible implementations, such as Figure 5 As shown, before transferring the standard wafer into the testing equipment, the method further includes:
[0058] This causes the robotic arm 51, which holds the calibration component 52, to extend into the detection device and make the calibration component 52 contact multiple parts of the detection device, forming multiple contact points;
[0059] When the calibration component 52 contacts each of the said locations, the robotic arm 51 stops moving;
[0060] The positions of multiple parts in the detection device are obtained based on the orientation of the robotic arm 51 when it stops moving and the position of the calibration component 52 and the contact point.
[0061] The orientation and contour of the inside of the detection device are obtained by fitting the positions of multiple said parts;
[0062] Based on the orientation and contour of the inside of the detection equipment, the movement trajectory of the robotic arm 51 is determined to transport the standard wafer to the set detection position.
[0063] Understandably, the aforementioned calibration component 52 can be a standard wafer W. Once the orientation and contour of the internal inspection area are determined, the robot arm 51 can determine the movement trajectory so that the standard wafer and the wafer to be tested are transported into the inspection equipment, thereby initiating the calibration inside the inspection equipment or the inspection of the edge morphology of the wafer to be tested.
[0064] The method described in this invention involves acquiring an image of a standard wafer and verifying multiple points on the image. If multiple points fail verification, the position of the light source and the beam information are adjusted to ensure successful verification, thus calibrating the testing equipment. Once multiple points pass verification, the standard wafer is removed, and the wafer to be tested is placed at the designated detection position within the testing equipment for edge morphology detection. This method automatically detects the edge morphology of the wafer through automatic calibration of the testing equipment, avoiding errors caused by manual inspection and inaccurate calibration data due to contamination of the standard wafer during manual calibration. It also avoids contamination caused by manual inspection of the standard wafer, preventing abnormal detection data. Furthermore, this method can calibrate the movement trajectory of the robotic arm, ensuring not only accurate positioning but also the safety of the robotic arm, reducing the risk of wafer scratches and robotic arm breakage.
[0065] See Figure 6 This invention also provides a system 100 for detecting the edge morphology of a wafer. The system 100 includes: a robotic arm 51, a light source illumination device 101, an image acquisition and processing device 102, and a verification data processing device 103; wherein...
[0066] The robotic arm 51 is used to transfer the standard wafer W to a set detection position within the testing equipment; and after the testing equipment has completed calibration, to remove the standard wafer W and place the wafer to be tested at the set detection position within the testing equipment.
[0067] The light source irradiation device 101 is used to irradiate the standard wafer W and the wafer under test with a light beam.
[0068] The image acquisition and processing device 102 is used to acquire images of the standard wafer W and the wafer under test to obtain multiple verification points for detecting edge morphology;
[0069] The verification data processing device 103 is configured to verify the position and intensity of the inherent light source in the detection equipment using the multiple verification points.
[0070] In some examples, the verification data processing device 103 is configured as follows:
[0071] Based on the edge image of the standard wafer, the pixel thickness, the first pixel width of the upper slope, the second pixel width of the lower slope, the third pixel width of the upper end face, the fourth pixel width of the lower end face, and the first pixel radius of the tip arc of the standard wafer are measured respectively. When any of the pixel thickness h, the first pixel width of the upper slope, the second pixel width of the lower slope, the third pixel width of the upper end face, the fourth pixel width of the lower end face, and the first pixel radius of the tip arc of the standard wafer does not meet the set standard value, it indicates that the 7 points to be verified fail.
[0072] Wherein, the pixel thickness of the standard wafer is the distance between the front thickness measurement point and the back thickness measurement point; the first pixel width is the perpendicular distance from the upper sloping point of the standard wafer edge to the end face where the end face point is located; the second pixel width is the perpendicular distance from the lower sloping point of the standard wafer edge to the end face where the end face point is located; the third pixel width is the distance between the upper sloping point of the standard wafer edge and the end face point in the Z-axis direction; the fourth pixel width is the distance between the lower sloping point of the standard wafer edge and the end face point in the Z-axis direction; and the first pixel radius is the radius of the circle containing the upper tangent point of the arc, the end face point, and the lower tangent point of the arc.
[0073] When the verification of the seven points to be verified fails, the positions of the seven points to be verified on the edge image are corrected by repeatedly adjusting the inherent light source position and / or correcting the light intensity. The pixel thickness, the first pixel width of the upper slope, the second pixel width of the lower slope, the third pixel width of the upper end face, the fourth pixel width of the lower end face, and the first pixel radius of the tip arc of the standard wafer are remeasured. When the pixel thickness, the first pixel width of the upper slope, the second pixel width of the lower slope, the third pixel width of the upper end face, the fourth pixel width of the lower end face, and the first pixel radius of the tip arc of the standard wafer all meet the set standard values, it indicates that the verification of the seven points to be verified has passed.
[0074] In some examples, the verification data processing device 103 is further configured to:
[0075] Based on the surface image of the standard wafer, the second pixel radius of the left inscribed circle, the third pixel radius of the right inscribed circle, and the fourth pixel radius of the notch measuring circle where the bottom end of the V-groove, the tangent point of the left arc and the tangent point of the right arc are located are obtained. When any of the second pixel radius, the third pixel radius of the right inscribed circle and the fourth pixel radius do not meet the set standard value, it indicates that the 5 points to be verified have failed.
[0076] When the verification of the five points to be verified fails, the positions of the five points to be verified are corrected by adjusting the inherent light source position and / or correcting the light intensity multiple times. The second pixel radius, the third pixel radius of the right inscribed circle, and the fourth pixel radius are remeasured. When the second pixel radius, the third pixel radius of the right inscribed circle, and the fourth pixel radius all meet the set standard values, it indicates that the five points to be verified have passed.
[0077] It should be noted that the technical solutions described in the embodiments of the present invention can be combined arbitrarily without conflict.
[0078] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.
Claims
1. A method for detecting the edge morphology of a wafer, characterized in that, The method includes: A robotic arm is used to transport a standard wafer to a designated testing position within the testing equipment, and the standard wafer is then irradiated with a light beam. The image of the standard wafer is acquired, and multiple verification points on the image are obtained for detecting edge morphology. The position and intensity of the light source in the testing equipment are verified using the multiple verification points. If the verification fails, the position and / or intensity of the light source are adjusted to make the verification pass. When the verification passes, it indicates that the calibration of the position and intensity of the light source in the testing equipment is complete. Once the verification is passed, the standard wafer is removed and the wafer to be tested is placed at the designated detection position within the testing equipment for edge morphology detection. The process of acquiring an image of the standard wafer and obtaining multiple verification points on the image for detecting the edge morphology of the standard wafer includes: The edge image of the standard wafer is acquired to obtain seven verification points on the edge image for detecting the edge morphology of the standard wafer; wherein, the seven verification points are: arc upper sloping point, arc upper tangent point, end face point, arc lower tangent point, arc lower sloping point, front thickness measurement point, and back thickness measurement point; The process of verifying the position and intensity of the light source in the testing equipment using the multiple verification points, and adjusting the position and / or intensity of the light source to pass the verification when the verification fails, includes: Based on the edge image of the standard wafer, the pixel thickness, the first pixel width of the upper slope, the second pixel width of the lower slope, the third pixel width of the upper end face, the fourth pixel width of the lower end face, and the first pixel radius of the tip arc of the standard wafer are measured respectively. When the pixel thickness of the standard wafer... h If any of the following values—the first pixel width of the upper slope, the second pixel width of the lower slope, the third pixel width of the upper end face, the fourth pixel width of the lower end face, and the first pixel radius of the tip arc—does not meet the set standard value, it indicates that the seven points to be verified have failed. Wherein, the pixel thickness of the standard wafer is the distance between the front thickness measurement point and the back thickness measurement point; the first pixel width is the perpendicular distance from the upper sloping point of the standard wafer edge to the end face where the end face point is located; the second pixel width is the perpendicular distance from the lower sloping point of the standard wafer edge to the end face where the end face point is located; the third pixel width is the distance between the upper sloping point of the standard wafer edge and the end face point in the Z-axis direction; the fourth pixel width is the distance between the lower sloping point of the standard wafer edge and the end face point in the Z-axis direction; and the first pixel radius is the radius of the circle containing the upper tangent point of the arc, the end face point, and the lower tangent point of the arc. When the verification of the seven points to be verified fails, the positions of the seven points to be verified on the edge image are corrected by adjusting the position of the light source and / or correcting the light intensity multiple times. The pixel thickness, the first pixel width of the upper slope, the second pixel width of the lower slope, the third pixel width of the upper end face, the fourth pixel width of the lower end face, and the first pixel radius of the tip arc of the standard wafer are remeasured. When the pixel thickness, the first pixel width of the upper slope, the second pixel width of the lower slope, the third pixel width of the upper end face, the fourth pixel width of the lower end face, and the first pixel radius of the tip arc of the standard wafer all meet the set standard values, it indicates that the verification of the seven points to be verified has passed.
2. The method according to claim 1, characterized in that, The process of acquiring an image of the standard wafer and obtaining multiple verification points on the image includes: A surface image of the standard wafer is acquired to obtain five verification points on the surface image for detecting the V-shaped notch morphology of the standard wafer. The five verification points are: the tangent point of the left inner circle edge, the tangent point of the left arc, the tangent point of the right arc, the tangent point of the right inner circle edge, and the end point of the bottom of the V-groove.
3. The method according to claim 2, characterized in that, The process of verifying the position and intensity of the light source in the testing equipment using the multiple verification points, and adjusting the position and / or intensity of the light source to pass the verification when the verification fails, includes: Based on the surface image of the standard wafer, the second pixel radius of the left inscribed circle, the third pixel radius of the right inscribed circle, and the fourth pixel radius of the notch measuring circle where the bottom end of the V-groove, the left arc tangent point, and the right arc tangent point are located are obtained. When any of the second pixel radius, the third pixel radius of the right inscribed circle, and the fourth pixel radius do not meet the set standard value, it indicates that the five points to be verified have failed. When the verification of the five points to be verified fails, the positions of the five points to be verified are corrected by adjusting the position of the light source and / or correcting the light intensity multiple times. The second pixel radius, the third pixel radius of the right inscribed circle and the fourth pixel radius are remeasured. When the second pixel radius, the third pixel radius of the right inscribed circle and the fourth pixel radius all meet the set standard values, it indicates that the five points to be verified have passed.
4. The method according to claim 1, characterized in that, After the verification is passed, the standard wafer is removed and the wafer to be tested is placed at the designated detection position within the testing equipment for edge morphology detection, including: Once the verification is passed, the standard wafer is removed and the wafer to be tested is placed at the designated testing position within the testing equipment; The edge image and surface image of the wafer under test are acquired respectively, and 7 verification points are obtained on the edge image of the wafer under test for detecting the edge morphology, and 5 verification points are obtained on the surface image of the wafer under test for detecting the V-shaped notch morphology. When the seven verification points used to detect the edge morphology and the five verification points used to detect the V-notch morphology on the edge image and surface image of the wafer under test pass the verification, it is determined that the edge morphology of the wafer under test meets the specification requirements.
5. The method according to claim 1, characterized in that, Before transferring the standard wafer into the testing equipment, the method further includes: This allows the robotic arm holding the calibration component to extend into the testing equipment and make the calibration component contact multiple parts of the testing equipment, forming multiple contact points; The robotic arm stops moving when the calibration component contacts each of the stated locations; The positions of multiple parts in the detection device are obtained based on the orientation of the robotic arm at each stop of movement and the position of the calibration component and the contact point. The orientation and contour of the inside of the detection device are obtained by fitting the positions of multiple said parts; Based on the orientation and contour of the inside of the testing equipment, the movement trajectory of the robotic arm is determined to transport the standard wafer to the set testing position.
6. A system for detecting the edge morphology of a wafer, characterized in that, The system includes: a robotic arm, a light source illumination device, an image acquisition and processing device, and a verification data processing device; wherein... The robotic arm is used to transfer a standard wafer to a designated testing position within the testing equipment; and after the testing equipment has completed calibration, to remove the standard wafer and place the wafer to be tested at the designated testing position within the testing equipment. The light source irradiation device is used to irradiate the standard wafer and the wafer under test with a light beam. The image acquisition and processing device is used to acquire images of the standard wafer and the wafer under test to obtain multiple verification points for detecting edge morphology; The verification data processing device is configured to verify the position and intensity of the light source in the detection device using the multiple points to be verified. The image acquisition and processing device is used to acquire the edge image of the standard wafer and obtain 7 verification points on the edge image for detecting the edge morphology of the standard wafer; wherein, the 7 verification points are: arc upper sloping point, arc upper tangent point, end face point, arc lower tangent point, arc lower sloping point, front thickness measurement point and back thickness measurement point. The verification data processing device is configured as follows: Based on the edge image of the standard wafer, the pixel thickness, the first pixel width of the upper slope, the second pixel width of the lower slope, the third pixel width of the upper end face, the fourth pixel width of the lower end face, and the first pixel radius of the tip arc of the standard wafer are measured respectively. When the pixel thickness of the standard wafer... h If any of the following values—the first pixel width of the upper slope, the second pixel width of the lower slope, the third pixel width of the upper end face, the fourth pixel width of the lower end face, and the first pixel radius of the tip arc—does not meet the set standard value, it indicates that the seven points to be verified have failed. The seven points to be verified are: the upper sloping point of the arc, the upper tangent point of the arc, the end face point, the lower tangent point of the arc, the lower sloping point of the arc, the front thickness measurement point, and the back thickness measurement point; the pixel thickness of the standard wafer is the distance between the front thickness measurement point and the back thickness measurement point; the first pixel width is the perpendicular distance from the upper sloping point of the standard wafer edge to the end face where the end face point is located; the second pixel width is the perpendicular distance from the lower sloping point of the standard wafer edge to the end face where the end face point is located; the third pixel width is the distance between the upper sloping point of the standard wafer edge and the end face point in the Z-axis direction; the fourth pixel width is the distance between the lower sloping point of the standard wafer edge and the end face point in the Z-axis direction; and the first pixel radius is the radius of the circle containing the upper tangent point of the arc, the end face point, and the lower tangent point of the arc. When the verification of the seven points to be verified fails, the positions of the seven points to be verified on the edge image are corrected by adjusting the position of the light source and / or correcting the light intensity multiple times. The pixel thickness, the first pixel width of the upper slope, the second pixel width of the lower slope, the third pixel width of the upper end face, the fourth pixel width of the lower end face, and the first pixel radius of the tip arc of the standard wafer are remeasured. When the pixel thickness, the first pixel width of the upper slope, the second pixel width of the lower slope, the third pixel width of the upper end face, the fourth pixel width of the lower end face, and the first pixel radius of the tip arc of the standard wafer all meet the set standard values, it indicates that the verification of the seven points to be verified has passed.
7. The system according to claim 6, characterized in that, The image acquisition and processing device is used to acquire the surface image of the standard wafer and obtain five verification points on the surface image for detecting the V-shaped notch morphology of the standard wafer; wherein, the five verification points are: the tangent point of the left inner circle edge, the tangent point of the left arc, the tangent point of the right arc, the tangent point of the right inner circle edge, and the end point of the bottom of the V-groove; The verification data processing device is further configured as follows: Based on the surface image of the standard wafer, the second pixel radius of the left inscribed circle, the third pixel radius of the right inscribed circle, and the fourth pixel radius of the notch measuring circle where the bottom end of the V-groove, the left arc tangent point, and the right arc tangent point are located are obtained. When any of the second pixel radius, the third pixel radius of the right inscribed circle, and the fourth pixel radius do not meet the set standard value, it indicates that the five points to be verified have failed. When the verification of the five points to be verified fails, the positions of the five points to be verified are corrected by adjusting the position of the light source and / or correcting the light intensity multiple times. The second pixel radius, the third pixel radius of the right inscribed circle and the fourth pixel radius are remeasured. When the second pixel radius, the third pixel radius of the right inscribed circle and the fourth pixel radius all meet the set standard values, it indicates that the five points to be verified have passed.