Chip pasting film device

Abstract

A chip pasting device includes a film supplying device, a chip capturing device downstream of the film supplying device, and a capturer. The chip capturing device is used to capture and align a chip. The capturer is capable of sequentially moving through the film supplying device, a film aligning device, and the chip capturing device. The capturer is capable of capturing a film from the film supplying device, aligning the captured film through the film aligning device, and pasting the captured film with the chip captured by the chip capturing device, and delivering the pasted chip and film. Accordingly, the capturer is capable of simultaneously delivering the film and the pasted chip to quickly connect different devices (e.g., the film supplying device and the chip capturing device), thereby effectively improving the overall work efficiency.

Claims

1. A chip bonding device, characterized in that, The chip bonding equipment includes: One film supply device; A chip picking device is located downstream of the film supply device. The chip picking device is used to pick up a chip and align the picked chip. A chip verification device is located downstream of the chip acquisition device; and A circular workstation has multiple stations along a circular path. The circular workstation includes multiple pickers that move along the circular path, and any one of the pickers can pass through the multiple stations one by one along the circular path; wherein the multiple stations include: A film-taking station, located corresponding to the film-supplying device, is used to allow any of the film-taking devices that move to the film-taking station to take a film sheet from the film-supplying device. A bonding station, located corresponding to the chip acquisition device, for enabling any of the acquirers moved to the bonding station to bond its acquired film to the chip acquired by the chip acquisition device; and A chip verification station, located corresponding to the chip verification device; Wherein, after any of the capture devices passes through the bonding station, the capture device can transport the captured film and the chip to be bonded to the chip confirmation station, so as to perform a chip confirmation operation on the chip bonded by the film through the chip confirmation device.

2. The die taping apparatus of claim 1, wherein The chip bonding equipment includes an inspection device located downstream of the chip verification device, and the plurality of stations include an inspection station whose position corresponds to the inspection device; wherein, when any of the pickers passes through the chip verification station, the picker can transport the picked film and the chip to be bonded to the inspection station, so as to perform an inspection operation on the film and the chip to be bonded by the inspection device.

3. The chip bonding equipment according to claim 2, characterized in that, The chip bonding equipment includes a waste collection device located downstream of the inspection device, and the plurality of stations include a waste station located corresponding to the waste collection device; wherein, when the film picked up by any of the pickers and the chip bonded to it are determined to be unqualified in the chip confirmation operation or the inspection operation, the film and the chip can be transported to the waste station for collection by the waste collection device.

4. The chip bonding equipment according to claim 2, characterized in that, The chip bonding equipment includes a good product storage device located downstream of the inspection device, and the plurality of stations include a good product station whose location corresponds to the good product storage device; wherein, when the film picked up by any of the pickers and the chip bonded to it are determined to be qualified in the chip confirmation operation and the inspection operation, the film and the chip can be transported to the good product station for storage by the good product storage device.

5. The chip bonding equipment according to claim 4, characterized in that, The good product storage device includes: Multiple loading components can pass through the good product station one by one to receive the qualified membrane and the chip that are bonded to it; and A packaging module is provided corresponding to at least one of the loading elements, and the packaging module is capable of receiving the diaphragm and the chip attached thereto from one of the multiple loading elements in turn.

6. The chip bonding equipment according to claim 1, characterized in that, The film supply device includes: One machine body; A component module is detachably mounted on the machine body; wherein the component module includes a carrier plate and multiple films attached to the carrier plate; Multiple rollers are rotatably mounted on the machine body, and the multiple rollers together define a conveying path; wherein the carrier plate is movable on the conveying path; and A pre-peeling member is fixed to the machine body; wherein the pre-peeling member has a turning edge located on the conveying path; When the multiple rollers drive the carrier sheet to move along the conveying path, the two portions of the carrier sheet located on opposite sides of the turning edge form a turning angle of less than 180 degrees, so that the multiple films adjacent to the turning edge pass through the turning edge at different time points and separate from the carrier sheet one by one, so as to be picked up by any of the pickers moving to the film picking station.

7. The chip bonding equipment according to claim 6, characterized in that, The film supply device includes a tension adjustment mechanism positioned corresponding to the conveying path, and the tension adjustment mechanism is located downstream of the turning edge to keep the tension values ​​of the two portions of the carrier sheet the same.

8. The chip bonding equipment according to claim 6, characterized in that, The film supply device includes an image capture device installed on the machine body, and the position of the image capture device corresponds to the transport path and is located upstream of the turning edge, for capturing the position of the plurality of films before they move past the turning edge.

9. The chip bonding equipment according to claim 8, characterized in that, The film-taking position remains unchanged as any of the image capture devices moves to the film-taking station to capture the film. The machine body includes a traversing mechanism that can move the pre-peeling member and at least part of the material module. The multiple films that are separated from the carrier sheet one by one by passing the turning edge can be moved one by one to the film-taking position by the traversing mechanism according to the image capture device.

10. The chip bonding equipment according to claim 1, characterized in that, The multiple extractors can operate synchronously at the multiple sites respectively.

11. The chip bonding equipment according to claim 1, characterized in that, The chip bonding device includes a film alignment device located between the film supply device and the chip picking device. The plurality of stations include a film alignment station whose position corresponds to the film alignment device, so that any of the picking devices moved to the film alignment station can align the film picked up by the picking device through the film alignment device.

Images