Film supply device and film pre-stripping machine

Abstract

The application discloses a film supply device and a pre-stripping film machine. The pre-stripping film machine comprises a machine body, a plurality of rollers rotatably installed on the machine body, and a pre-stripping piece fixed on the machine body. The plurality of rollers jointly define a conveying path, and the pre-stripping piece has a turning edge located on the conveying path. Wherein, the plurality of rollers can be used to move a carrier sheet with a plurality of film pieces attached along the conveying path, and the turning edge can be used to make two parts of the carrier sheet located on opposite sides of the turning edge form a turning angle less than 180 degrees, so that the film pieces adjacent to the turning edge pass through the turning edge at different time points and are separated from the carrier sheet one by one. Accordingly, the pre-stripping film machine can facilitate the separation of the film pieces from the carrier sheet one by one by providing the pre-stripping piece with the turning edge, thereby effectively improving the operation efficiency.

Description

Technical Field

[0001] This invention relates to a film supply device, and more particularly to a film supply device and a pre-peeling machine capable of peeling and supplying films one by one. Background Technology

[0002] Existing membrane supply mechanisms involve placing multiple membrane sheets on a support plate, allowing a picker to directly remove the membrane sheets from the support plate. However, existing membrane supply mechanisms focus on improving the picker to facilitate easier removal of the membrane sheets from the support plate, but these improvements are gradually encountering bottlenecks.

[0003] Therefore, the inventor believed that the above-mentioned defects could be improved, and thus devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects. Summary of the Invention

[0004] The present invention provides a film supply device and a pre-peeling machine, which can effectively improve the defects that may occur in the existing film supply mechanism.

[0005] This invention discloses a film supply device, comprising: a machine body; a material module detachably mounted on the machine body; wherein the material module includes a carrier sheet and multiple films attached to the carrier sheet; multiple rollers rotatably mounted on the machine body, and the multiple rollers collectively defining a conveying path; wherein the carrier sheet is movable on the conveying path; and a pre-peeling member fixed to the machine body; wherein the pre-peeling member has a turning edge located on the conveying path; wherein when the multiple rollers drive the carrier sheet to move along the conveying path, two portions of the carrier sheet located on opposite sides of the turning edge form a turning angle of less than 180 degrees, so that the multiple films adjacent to the turning edge pass through the turning edge at different time points and separate from the carrier sheet one by one.

[0006] Preferably, multiple diaphragms are arranged in multiple columns along an arrangement direction that is not parallel to the transport path, and the turning edge forms an acute angle with the arrangement direction.

[0007] Preferably, the arrangement direction is perpendicular to the conveying path, and the acute angle is between 3 and 30 degrees.

[0008] Preferably, the arrangement direction is not perpendicular to the conveying path, and the acute angle is between 30 degrees and 45 degrees.

[0009] Preferably, the turning edge is not perpendicular to the conveying path, and the turning edge forms an angle between 45 degrees and 60 degrees with the conveying path.

[0010] Preferably, the film supply device includes an image capture device installed on the machine body, and the position of the image capture device corresponds to the transport path and is located upstream of the turning edge, so as to capture the position of multiple films before they move past the turning edge.

[0011] Preferably, the machine body includes a transverse mechanism capable of moving the pre-peeling component and at least part of the material module; wherein, multiple films that are separated from the carrier sheet one by one by passing through the turning edge can be moved one by one to the film taking position by the transverse mechanism according to the image capture device.

[0012] Preferably, the film supply device includes a tension adjustment mechanism installed on the machine body, and the tension adjustment mechanism is positioned corresponding to the conveying path and located downstream of the turning edge, so as to keep the tension values ​​of the two parts of the carrier sheet the same.

[0013] Preferably, the material module includes: a winding device mounted on the machine body and located at the beginning of the conveying path, wherein a carrier sheet and a plurality of films are wound on the winding device, and the winding device is used to transfer the carrier sheet and the plurality of films to the conveying path; and a winding device mounted on the machine body and located at the end of the conveying path, and the winding device is used to wind up the carrier sheet that has moved past the turning edge.

[0014] This invention also discloses a pre-peeling film machine, comprising: a machine body; a plurality of rollers rotatably mounted on the machine body and the plurality of rollers collectively defining a conveying path; and a pre-peeling member fixed to the machine body, the pre-peeling member having a turning edge located on the conveying path; wherein the plurality of rollers are used to allow a carrier sheet with a plurality of films attached to it to move along the conveying path, and the turning edge is used to allow two portions of the carrier sheet located on opposite sides to form a turning angle of less than 180 degrees, so that the plurality of films adjacent to the turning edge pass through the turning edge at different time points and separate from the carrier sheet one by one.

[0015] Preferably, the turning edge is not perpendicular to the conveying path, and the turning edge forms an angle between 45 degrees and 60 degrees with the conveying path.

[0016] In summary, the film supply device and pre-peeling machine disclosed in the embodiments of the present invention can effectively improve their operating efficiency by providing the turning edge on the pre-peeling member, thereby facilitating the separation of multiple films one by one from the carrier sheet.

[0017] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description

[0018] Figure 1This is a top view schematic diagram of the chip bonding device according to Embodiment 1 of the present invention.

[0019] Figure 2A for Figure 1 The diagram shows the subsequent actions.

[0020] Figure 2B This is a side view of the chip bonding device at the film alignment station.

[0021] Figure 3A for Figure 2A The diagram shows the subsequent actions.

[0022] Figure 3B A side view (a) of the chip bonding equipment at the bonding station.

[0023] Figure 3C This is a side view (II) of the chip bonding equipment at the bonding station.

[0024] Figure 3D A side view (III) of the chip bonding equipment at the bonding station.

[0025] Figure 4A for Figure 3A The diagram shows the subsequent actions.

[0026] Figure 4B This is a side view of the chip application device at the chip verification station.

[0027] Figure 5A for Figure 4A The diagram shows the subsequent actions.

[0028] Figure 5B A side view (a) of the chip application equipment at the inspection station.

[0029] Figure 5C A side view (II) of the chip application equipment at the inspection station.

[0030] Figure 5D A side view (III) of the chip application equipment at the inspection station.

[0031] Figure 6 for Figure 5A The diagram shows the subsequent actions.

[0032] Figure 7 for Figure 5A The diagram shows the subsequent actions.

[0033] Figure 8 This is a schematic diagram of the chip bonding device according to Embodiment 2 of the present invention corresponding to the film removal station.

[0034] Figure 9A for Figure 8 A partial top-view diagram.

[0035] Figure 9B for Figure 9A The diagram shows the subsequent actions.

[0036] Figure 9C for Figure 9B The diagram shows the subsequent actions.

[0037] Figure 10 for Figure 9A A schematic diagram of another state.

[0038] Figure 11 for Figure 9A Another schematic diagram of the same state. Detailed Implementation

[0039] The following specific embodiments illustrate the implementation of the "film supply device and pre-peeling machine" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0040] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0041] [Example 1]

[0042] Please see Figures 1 to 7 As shown, this is an embodiment of the present invention. Figure 1 As shown, this embodiment discloses a chip bonding device 1000, which includes a cyclic workstation S and a plurality of devices D located corresponding to the cyclic workstation S. The cyclic workstation S has a plurality of stations S' on a circular path, and the cyclic workstation S includes a plurality of pickers S1 that move along the circular path, each of the pickers S1 being able to pass through the plurality of stations S' one by one along the circular path.

[0043] In this embodiment, the ring path is circular, the number of multiple collectors S1 is not less than the number of multiple stations S', and the multiple collectors S1 can operate synchronously with the multiple stations S' respectively, thereby improving the overall operating efficiency of the chip film application device 1000, but the present invention is not limited thereto.

[0044] More specifically, each of the stations S' is, for example, a work area, and the multiple stations S' have different but related functions and distinct area sizes. In this embodiment, the multiple stations S' sequentially include a film-taking station S100, a film alignment station S200, a bonding station S300, a chip verification station S400, an inspection station S500, a waste station S600, and a good station S700 along the circular path, but the invention is not limited thereto. For example, in other embodiments not illustrated in this invention, the order of the multiple stations S' can be adjusted as needed (e.g., the waste station S600 and the good station S700 can be swapped).

[0045] Furthermore, in this embodiment, the plurality of devices D include a film supply device 100 located at the film taking station S100, a film alignment device 200 located at the film alignment station S200, a chip picking device 300 located at the bonding station S300, a chip confirmation device 400 located at the chip confirmation station S400, an inspection device 500 located at the inspection station S500, a waste collection device 600 located at the waste station S600, and a good product collection device 700 located at the good product station S700, but the present invention is not limited thereto.

[0046] For example, in other embodiments not illustrated in this invention, some of the plurality of stations S' (e.g., the membrane alignment station S200, the chip confirmation station S400, the inspection station S500, the waste station S600, and the good station S700) and their corresponding devices D (e.g., the membrane alignment device 200, the chip confirmation device 400, the inspection device 500, the waste collection device 600, and the good collection device 700) can be reduced according to design requirements; or, the chip film application equipment 1000 can also add new stations and their corresponding devices according to design requirements.

[0047] To facilitate understanding of the specific operation of the chip bonding device 1000 in this embodiment, the function and purpose of each device D and its corresponding station S' are described below. The operation flow of multiple collectors S1 is the same, so the diagrams in this embodiment only illustrate the operation of one collector S1, but the present invention is not limited thereto.

[0048] Among them, such as Figure 1 As shown, the film supply device 100 can continuously supply film sheets 21 for any of the extractors S1 to extract; that is, the film extraction station S100 corresponds to the film supply device 100 by its position, so that any of the extractors S1 that moves to the film extraction station S100 can extract a film sheet 21 from the film supply device 100.

[0049] Furthermore, such as Figure 2A and Figure 2B As shown, the membrane alignment device 200 is located downstream of the membrane supply device 100, and the membrane alignment station S200 corresponds to the membrane alignment device 200 by its position, so that any of the capture devices S1 moving to the membrane alignment station S200 can align the membrane sheet 21 it has captured through the membrane alignment device 200. More specifically, in this embodiment, the membrane alignment device 200 can be a camera to detect the relative position between the capture device S1 and the membrane sheet 21 it has captured, thereby facilitating subsequent chip bonding operations.

[0050] like Figures 3A to 3D As shown, the chip picking device 300 is located downstream of the film alignment device 200 (or the film supply device 100), and the chip picking device 300 is used to pick up a chip C and align the picked chip C. Furthermore, the bonding station S300 is positioned corresponding to the chip picking device 300 so that any picker S1 moving to the bonding station S300 can bond its picked film 21 to the chip C picked by the chip picking device 300.

[0051] More specifically, in this embodiment, the chip acquisition device 300 includes a chip carrier 301 loaded with a plurality of chips C, a bonding seat 302 positioned corresponding to the chip carrier 301, a transfer device 303 movably located between the chip carrier 301 and the bonding seat 302, and a top camera 304 positioned corresponding to the bonding seat 302. The transfer device 303 can transfer one chip C from the chip carrier 301 to the bonding seat 302, and the top camera 304 is used to detect the relative position between the bonding seat 302 and the chip C thereon. The bonding seat 302 can be used to move the chip C below the acquisition device S1 located in the bonding station S300.

[0052] In this embodiment, the bonding seat 302 includes two bonding portions 3021 whose positions respectively correspond to the transferor 303 and the picker S1, and the transferor 303 can place one chip C on one bonding portion 3021. When the bonding seat 302 rotates one bonding portion 3021 and the chip C it carries to a position below the picker S1, the other bonding portion 3021 is positioned to correspond to the transferor 303, allowing the transferor 303 to transfer another chip C onto it, thereby improving the overall working efficiency of the chip picking device 300.

[0053] Accordingly, the relative positions between the extractor S1 and the diaphragm 21, and between the bonding seat 302 and the chip C, have been accurately measured, so that the extractor S1 can accurately bond the diaphragm 21 it has extracted to the predetermined position of the chip C in the bonding station S300.

[0054] Furthermore, after any of the capture devices S1 passes through the bonding station S300, it can transport the captured film 21 and the bonded chip C to the next station S', thereby enabling the chip bonding device 1000 to quickly connect different stations S' (or different devices D) through the capture devices S1, thus effectively improving the overall working efficiency of the chip bonding device 1000.

[0055] In other words, the extractor S1 can sequentially move through the film supply device 100, the film alignment device 200, and the chip extraction device 300; wherein, the extractor S1 can extract a film 21 from the film supply device 100, align the extracted film 21 with the film alignment device 200, and bond the extracted film 21 with the chip C extracted by the chip extraction device 300, and deliver the bonded chip C and the film 21 (to the subsequent station S').

[0056] It should be further noted that the chip bonding device 1000 may be located downstream of the bonding station S300 or the chip picking device 300, depending on the function of the film 21 and the chip C bonded to it being transported by the picker S1 and the design requirements, and may selectively add corresponding stations or devices, which are not limited to those described in this embodiment.

[0057] like Figure 4A and Figure 4BAs shown, the chip verification device 400 is located downstream of the chip picking device 300 in this embodiment. After any of the picking devices S1 passes through the bonding station S300, it can transport the picked film 21 and the chip C to be bonded to the chip verification station S400, so as to perform a chip verification operation on the chip C bonded by the film 21 through the chip verification device 400.

[0058] More specifically, in this embodiment, the chip verification device 400 can be a bottom-side optical detector used to detect the position of the chip C attached to the bottom side of the diaphragm 21 or to confirm whether the diaphragm 21 is indeed attached to the chip C (i.e., the chip verification operation) through an automated optical inspection (AOI) process. However, the present invention is not limited to this. It should be noted that during the detection process performed by the chip verification device 400, the picker S1 maintains the picker of the diaphragm 21, and the diaphragm 21 remains attached to the chip C, thereby facilitating rapid entry into the next station S' (or the next device D).

[0059] like Figures 5A to 5D As shown, the inspection device 500 is located downstream of the chip verification device 400, and when any of the extractors S1 passes through the chip verification station S400, it can transport the extracted film 21 and the chip C that are attached to it to the inspection station S500, so as to perform an inspection operation on the film 21 and the chip C that are attached to it through the inspection device 500.

[0060] More specifically, in this embodiment, the inspection device 500 includes an inspection seat 501 and a top-side optical detector 502 positioned corresponding to the inspection seat 501. The inspection seat 501 is rotatably positioned to correspond to the top-side optical detector 502 and the imager S1 located at the inspection station S500, and the imager S1 can mount the imaged membrane 21 and the attached chip C onto the inspection seat 501.

[0061] When the inspection seat 501 rotates the chip C and the diaphragm 21 it carries to a position below the top-side optical detector 502, the top-side optical detector 502 can then perform an automated optical inspection (AOI) process to detect the relative position of the chip C and the diaphragm 21 from their top sides (i.e., the inspection operation). Furthermore, after the inspection operation, the inspection seat 501 can rotate the chip C and the diaphragm 21, which have passed the inspection operation, to a position below the collector S1, so that the collector S1 can pick up the diaphragm 21 and the attached chip C.

[0062] It should be noted that during the above-mentioned detection process performed by the inspection device 500, the diaphragm 21 and the chip C are placed in the inspection device 500 after leaving the collector S1, and after the detection is completed, they are transported by the collector S1 to the next station S' (or the next device D).

[0063] like Figure 6 and Figure 7 As shown, both the waste collection device 600 and the good product collection device 700 are located downstream of the inspection device 500. In this embodiment, the good product collection device 700 is located downstream of the waste collection device 600, but the invention is not limited thereto. Each of the collectors S1 selectively moves to either the waste collection device 600 or the good product collection device 700 based on the determination results of the chip confirmation operation and the inspection operation.

[0064] More specifically, such as Figure 6 As shown, when the membrane 21 captured by any of the capture devices S1 is determined to be unqualified in the chip confirmation or inspection process, it can be transported to the waste station S600 for collection by the waste collection device 600. Alternatively, as... Figure 7 As shown, when the membrane 21 captured by any of the capture devices S1 and the chip C attached thereto are determined to be qualified in the chip confirmation operation and the inspection operation, they can be transported to the good product station S700 (skipping the waste station S600) for storage by the good product storage device 700.

[0065] In this embodiment, as Figure 6As shown, the waste collection device 600 is, for example, a waste tray, on which any of the pickers S1 moving to the waste station S600 can place the picked-up membrane 21 and the attached chip C. The waste tray can be moved to maintain sufficient space in the portion below the picker S1 to accommodate the membrane 21 and the attached chip C.

[0066] Furthermore, such as Figure 7 As shown, the good product storage device 700 includes a plurality of loading elements 701 and a packaging module 702 corresponding to at least one of the loading elements. The plurality of loading elements 701 can pass through the good product station S700 one by one to receive (from the collector S1 located in the good product station S700) the qualified film 21 and the attached chip C; wherein, in this embodiment, the plurality of loading elements 701 may be disposed on a turntable, so that they pass through the good product station S700 one by one by the rotation of the turntable. Furthermore, the packaging module 702 can receive the film 21 and the attached chip C one by one from the plurality of loading elements 701.

[0067] [Example 2]

[0068] Please see Figures 8 to 11 As shown, this is Embodiment 2 of the present invention. Since this embodiment is similar to Embodiment 1 described above, the similarities between the two embodiments will not be repeated. The main difference between this embodiment and Embodiment 1 lies in the film supply device 100, and the structure of the film supply device 100 in this embodiment is roughly described as follows:

[0069] like Figure 8 and Figure 9A As shown, the film supply device 100 includes a machine body 1, a material module 2 detachably mounted on the machine body 1, a plurality of rollers 3 rotatably mounted on the machine body 1, and a pre-peeling component 4 fixed to the machine body 1. In this embodiment, the machine body 1, the plurality of rollers 3, and the pre-peeling component 4 are collectively referred to as a pre-peeling machine 10. Although the pre-peeling machine 10 is described in conjunction with the material module 2, the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the pre-peeling machine 10 can be used independently (e.g., for sale) or in conjunction with other components.

[0070] The plurality of rollers 3 collectively define a conveying path P. The material module 2 includes a carrier sheet 22 and a plurality of films 21 attached to the carrier sheet 22. The carrier sheet 22 is movable on the conveying path P (that is, the plurality of rollers 3 can be used to move the carrier sheet 22 along the conveying path P). The pre-peeling member 4 has a turning edge 41 located on the conveying path P.

[0071] Furthermore, when the multiple rollers 3 drive the carrier sheet 22 to move along the conveying path P, the two portions 221 of the carrier sheet 22 located on opposite sides of the turning edge 41 respectively form a turning angle α1 of less than 180 degrees (or, the turning edge 41 can be used to make the two portions 221 of the carrier sheet 22 form the turning angle α1), so that the multiple films 21 adjacent to the turning edge 41 pass through the turning edge 41 at different time points and separate from the carrier sheet 22 one by one.

[0072] In this embodiment, the turning angle α1 is described as less than 90 degrees (e.g., 70 to 85 degrees), but the present invention is not limited thereto. Furthermore, the film supply device 100, by providing the turning edge 41 on the pre-peeling member 4, facilitates the separation of the plurality of films 21 from the carrier sheet 22 one by one, thereby effectively improving its operating efficiency, and can further be used to provide any of the pickers S1 that move to the film picking station S100 for picking, thereby improving the overall operating efficiency.

[0073] More specifically, in this embodiment, the material module 2 includes a winding device 23 and a winding device 24 that cooperate with each other, and both the winding device 23 and the winding device 24 are mounted on the machine body 1. The winding device 23 is located at the starting point of the conveying path P, and the carrier sheet 22 and the plurality of membrane sheets 21 are wound around the winding device 23. The winding device 23 is used to transport the carrier sheet 22 and the plurality of membrane sheets 21 to the conveying path P. Furthermore, the winding device 24 is located at the ending point of the conveying path P, and the winding device 23 is used to wind up the carrier sheet 22 that has moved past the turning edge 41.

[0074] Furthermore, such as Figure 8 and Figure 9A As shown, in this embodiment, the film supply device 100 (or the pre-peeling machine 10) may further include an image capture device 5 installed on the machine body 1, and the position of the image capture device 5 corresponds to the transport path P and is located upstream of the turning edge 41, so as to capture the position of the plurality of films 21 before they move past the turning edge 41.

[0075] Furthermore, such as Figures 8 to 9C As shown, the film-grabbing position where any of the grabbers S1 moves to the film-grabbing station S100 to grab the film 21 can remain unchanged, and the machine body 1 includes a transverse mechanism 11 capable of moving the pre-peeling member 4 and at least a portion of the material module 2. For example, the transverse mechanism 11 may be composed of multiple linear guides (e.g., XY-axis slides) to allow the unwinder 23, the carrier sheet 22, the multiple films 21, and the pre-peeling member 4 to move in a plane.

[0076] In this embodiment, the multiple films 21 that separate from the carrier sheet 22 one by one after passing through the turning edge 41 can be moved one by one to the film-taking position by the lateral movement mechanism 11 according to the image capture device 5. Accordingly, the position information of the multiple films 21 obtained by the lateral movement mechanism 11 through the image capture device 5 can not only effectively eliminate the error caused by the multiple films 21 being arranged on the carrier sheet 22, but also help to keep the film-taking position of any one of the capture devices S1 unchanged, thereby significantly improving the efficiency and accuracy of each capture device S1 in capturing the film 21.

[0077] Furthermore, in other embodiments of the present invention not shown, the position at which the image capturer S1 captures the film 21 can be changed according to the image capturer 5, so that the image capturer S1 can be moved to directly above the film 21 that is separated from the carrier sheet 22 and is to be captured, thus eliminating the need for the transverse mechanism 11 in the film supply device 100.

[0078] It should be noted that, in order for the plurality of diaphragms 21 to be able to separate from the carrier sheet 22 one by one more smoothly at the turning edge 41, the corresponding relationship between the plurality of diaphragms 21, the transport path P, and the turning edge 41 is preferably to meet the following conditions, but the present invention is not limited thereto.

[0079] In this arrangement, multiple diaphragms 21 are arranged in multiple columns along an arrangement direction R that is not parallel to the transport path P, and the turning edge 41 forms an acute angle α2 with the arrangement direction R. Figure 9A As shown, the arrangement direction R is perpendicular to the conveying path P, and the acute angle α2 is between 3 and 30 degrees. Furthermore, the turning edge 41 is not perpendicular to the conveying path P, and the turning edge 41 and the conveying path P can form an angle α3 between 45 and 60 degrees.

[0080] It should be noted that, in this embodiment, the conditions for meeting both the acute angle α2 and the included angle α3 can occur simultaneously. Figure 9AIn this context (e.g., the acute angle α2 is 30 degrees, and the included angle α3 is 60 degrees), however, the conditions for the acute angle α2 and the included angle α3 can appear separately in different embodiments, and this invention does not impose any limitations on them. For example, such as... Figure 10 As shown, under the condition that the turning edge 41 is not perpendicular to the conveying path P and the included angle α3 is between 45 degrees and 60 degrees, the arrangement direction R can be not perpendicular to the conveying path P.

[0081] To go further, in Figure 9A and Figure 10 In the illustrated configuration, the turning edge 41 is not perpendicular to the conveying path P, but the invention is not limited thereto. For example, as... Figure 11 As shown, the arrangement direction R may not be perpendicular to the conveying path P, and the acute angle α2 is preferably between 30 degrees and 45 degrees; under the above conditions, the turning edge 41 may be perpendicular to the conveying path P.

[0082] Furthermore, the film supply device 100 (or the pre-peeling machine 10) may further include a tension adjustment mechanism 6 installed on the machine body 1, and the position of the tension adjustment mechanism 6 corresponds to the conveying path P and is located downstream of the turning edge 41, so as to keep the tension values ​​of the two portions 221 of the carrier sheet 22 the same.

[0083] [Technical Effects of the Embodiments of the Invention]

[0084] In summary, the chip bonding device disclosed in this embodiment of the invention, through the combination design of multiple devices and the picker, enables the picker to simultaneously deliver the film and the chip to be bonded, thereby quickly connecting different devices in series and effectively improving the overall work efficiency.

[0085] Furthermore, the relative positions between the capture device and the membrane, and between the bonding seat and the chip, have been accurately measured in the membrane alignment station and the bonding station, so that the capture device can accurately bond the captured membrane to the predetermined position of the chip in the bonding station.

[0086] Furthermore, the film supply device and pre-peeling machine disclosed in the embodiments of the present invention can effectively improve their operating efficiency by providing the turning edge on the pre-peeling member, thereby facilitating the separation of multiple films from the carrier sheet one by one, and can be further used to provide a picker for picking.

[0087] The above-disclosed content is only a preferred and feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included within the patent scope of the present invention.

Claims

1. A film supply device, characterized in that, The film supply device includes: One machine body; A component module is detachably mounted on the machine body; wherein the component module includes a carrier plate and multiple films attached to the carrier plate; Multiple rollers are rotatably mounted on the machine body, and the multiple rollers together define a conveying path; wherein the carrier sheet is movable on the conveying path, and the multiple films are arranged in multiple columns along an arrangement direction perpendicular to the conveying path; and A pre-peeling member is fixed to the machine body; wherein the pre-peeling member has a turning edge located on the conveying path, and the turning edge forms an acute angle with the arrangement direction; When the multiple rollers drive the carrier sheet to move along the conveying path, the two portions of the carrier sheet located on opposite sides of the turning edge form a turning angle of less than 180 degrees, so that the multiple films in any column adjacent to the turning edge pass through the turning edge at different time points and separate from the carrier sheet one by one.

2. The film supply device according to claim 1, characterized in that, The acute angle is between 3 degrees and 30 degrees.

3. The film supply device according to claim 1, characterized in that, The turning edge forms an angle between 45 degrees and 60 degrees with the conveying path.

4. The film supply device according to claim 1, characterized in that, The film supply device includes an image capture device installed on the machine body, and the position of the image capture device corresponds to the transport path and is located upstream of the turning edge, for capturing the position of the plurality of films before they move past the turning edge.

5. The film supply device according to claim 4, characterized in that, The machine body includes a transverse mechanism capable of moving the pre-peeling member and at least part of the material module; wherein, the plurality of films that are separated one by one from the carrier sheet by passing the turning edge can be moved one by one to the film taking position by the transverse mechanism according to the image capture device.

6. The film supply device according to claim 1, characterized in that, The film supply device includes a tension adjustment mechanism installed on the machine body, and the tension adjustment mechanism is positioned corresponding to the conveying path and downstream of the turning edge, so as to keep the tension values ​​of the two portions of the carrier sheet the same.

7. The film supply device according to claim 1, characterized in that, The material module includes: A winding device is installed on the machine body and located at the beginning of the conveying path. The carrier sheet and the plurality of the films are wound around the winding device, and the winding device is used to transfer the carrier sheet and the plurality of the films to the conveying path. and A take-up device is mounted on the machine body and located at the end of the conveying path, and the unwind device is used to take up the carrier piece that has moved past the turning edge.

8. A pre-peeling film machine, characterized in that, The pre-peeling machine includes: One machine body; Multiple rollers are rotatably mounted on the machine body, and the multiple rollers together define a conveying path; and A pre-peeling member is fixed to the machine body, and the pre-peeling member has a turning edge located on the conveying path; The rollers allow a carrier sheet with multiple films attached to it to move along the transport path, and the films are arranged in multiple columns along an arrangement direction perpendicular to the transport path. The turning edge forms an acute angle with the arrangement direction and is used to make two portions of the carrier sheet located on opposite sides of the turning edge form a turning angle of less than 180 degrees, so that the films in any column adjacent to the turning edge separate from the carrier sheet one by one at different times as they pass through the turning edge.

9. The pre-peeling machine according to claim 8, characterized in that, The turning edge is not perpendicular to the conveying path, and the turning edge forms an angle between 45 degrees and 60 degrees with the conveying path.

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