Apparatus and method for processing a substrate

Abstract

The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a processing tank having a receiving space for containing a processing liquid; a support member configured to support at least one substrate in a vertical position at the receiving space; and a posture-changing robot configured to change the posture of a substrate immersed in the processing liquid from the vertical position to a horizontal position, wherein the posture-changing robot includes: a body configured to hold the substrate thereon; and a liquid supply member configured to supply a wetting liquid to the substrate placed on the body.

Description

Technical Field

[0001] The embodiments of the inventive concept described herein relate to substrate processing equipment. Background Technology

[0002] To manufacture semiconductor devices, desired patterns are formed on a substrate, such as a wafer, through various processes such as photolithography, etching, ashing, ion implantation, and thin film deposition. Various processing liquids and gases are used in each process, and particles and process byproducts are generated during the process. To remove the thin films, particles, and process byproducts from the substrate, a liquid treatment process is performed on the substrate before and after each process. In a typical liquid treatment process, the substrate is treated with chemicals and rinsing solutions and then dried. During the liquid treatment process, SiN on the substrate can be stripped.

[0003] In addition, substrate processing methods using processing solutions such as chemicals and / or rinsing solutions can be divided into batch processing methods that process multiple substrates in batches and single processing methods that process substrates one by one.

[0004] In batch processing methods for processing multiple substrates together, substrate processing is performed by immersing multiple substrates in a processing tank containing chemicals or rinsing solution in a vertical orientation. Therefore, the substrate processing exhibits excellent mass production capabilities, and the processing quality is uniform across each substrate. However, in batch processing methods, multiple substrates with patterns formed on their top surfaces are immersed in a vertical orientation. Therefore, if the patterns formed on the substrates have a high aspect ratio, pattern tilting may occur at the points where the patterns are formed on the substrates during processes such as lifting the substrates. Furthermore, if a rapid drying process is not performed within a short time while the multiple substrates are exposed to air, watermarks may form on some of the substrates exposed to air.

[0005] On the other hand, in a single-processing method that processes substrates one by one, substrate processing is performed to supply chemicals or rinsing solutions to individual substrates rotating in a horizontal orientation. Furthermore, in a single-processing method, since the transported substrates maintain a horizontal orientation, the risk of pattern tilting is reduced, and by processing substrates one by one and immediately drying or liquid treating the processed substrates, the risk of watermarks is reduced. However, in the case of a single-processing method, the mass production capability of substrate processing is poor, and compared to batch processing methods, the processing quality between each substrate is relatively uneven.

[0006] In addition, when the substrate is dried by rotation, if the pattern formed on the substrate has a high aspect ratio, there is a concern that the pattern formed on the substrate may collapse or tilt. Summary of the Invention

[0007] Embodiments of the present invention provide a substrate processing apparatus and method for efficiently processing substrates.

[0008] Embodiments of the present invention provide a substrate processing apparatus and method for improving the mass production capability of substrate processing.

[0009] Embodiments of the present invention provide a substrate processing apparatus and method for improving the uniformity of processing quality between each substrate.

[0010] Embodiments of the present invention provide a substrate processing apparatus and method for minimizing the risk of generating watermarks on a substrate.

[0011] Embodiments of the present invention provide a substrate processing apparatus and method for minimizing tilting of patterns formed on a substrate.

[0012] Embodiments of the present invention provide a substrate processing apparatus and method for efficiently processing substrates having patterns with a high aspect ratio.

[0013] The technical objectives of this invention are not limited to those described above, and other unmentioned technical objectives will become apparent to those skilled in the art from the following description.

[0014] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a processing tank having a receiving space for containing a processing liquid; a support member configured to support at least one substrate in a vertical orientation at the receiving space; and a posture-changing robot configured to change the orientation of a substrate immersed in the processing liquid from a vertical orientation to a horizontal orientation, wherein the posture-changing robot includes: a body configured to hold the substrate thereon; and a liquid supply member configured to supply a wetting liquid to the substrate placed on the body.

[0015] In one embodiment, the liquid supply component includes: at least one first nozzle, each first nozzle supplying wetting liquid to a first region of a substrate placed on a body; and at least one second nozzle, each second nozzle supplying wetting liquid to a second region of the substrate placed on the body, the second region being a region different from the first region.

[0016] In one embodiment, the spray distance of the wetting fluid supplied from the first nozzle is different from the spray distance of the wetting fluid supplied from the second nozzle.

[0017] In one embodiment, the distance between the first region and the first nozzle is shorter than the distance between the second region and the second nozzle, the first region and the second region are edge regions of the substrate, and the spray distance of the wetting liquid supplied from the first nozzle is shorter than the spray distance of the wetting liquid supplied from the second nozzle.

[0018] In one embodiment, the diameter of the nozzle orifice of the first nozzle is larger than the diameter of the nozzle orifice of the second nozzle.

[0019] In one embodiment, the supply flow rate of wetting fluid delivered to the first nozzle per unit time is the same as the supply flow rate of wetting fluid delivered to the second nozzle per unit time.

[0020] In one embodiment, the body includes: a support body on which a substrate is placed; and a clamping body configured to clamp the substrate placed on the support body.

[0021] In one embodiment, the liquid supply component is mounted on the support body.

[0022] In one embodiment, the posture-changing robot includes: a joint portion; and a hand, the hand being coupled to the joint portion and including a support body and a gripping body, wherein the hand also includes a fastening body configured to couple the gripping body and the support body to the joint portion.

[0023] In one embodiment, the liquid supply component is mounted on the fastening body.

[0024] In one embodiment, the liquid supply component is a supply conduit having a first nozzle and a second nozzle.

[0025] In one embodiment, the liquid supply member is fastened to the joint portion and configured to supply wetting fluid to the central region of a substrate placed on a support body.

[0026] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a first process unit configured to process substrates in a batch manner; and a second process unit configured to process the substrates in a single manner, wherein the first process unit includes: a posture-changing processing tank configured to have a receiving space for containing liquid; a support member configured to support at least one substrate in a vertical posture at the receiving space; and a posture-changing robot configured to change the posture of a substrate immersed in liquid from a vertical posture to a horizontal posture, the posture-changing robot having a body for holding the substrate, an arm for changing the position of the body, and a liquid supply member for supplying wetting liquid to the substrate placed on the body.

[0027] In one embodiment, the liquid supply component includes: at least one first nozzle for supplying wetting liquid to a first region of a substrate placed on a body; and at least one second nozzle for supplying wetting liquid to a second region of a substrate placed on a support body, the second region being a region different from the first region.

[0028] In one embodiment, the spray distance of the wetting fluid supplied from the first nozzle is different from the spray distance of the wetting fluid supplied from the second nozzle.

[0029] In one embodiment, the distance between the first region and the first nozzle is shorter than the distance between the second region and the second nozzle, and the first region and the second region are edge regions of the substrate, and the spray distance of the wetting liquid supplied from the first nozzle is shorter than the spray distance of the wetting liquid supplied from the second nozzle.

[0030] In one embodiment, the diameter of the nozzle orifice of the first nozzle is smaller than the diameter of the nozzle orifice of the second nozzle.

[0031] In one embodiment, the supply flow rate of wetting fluid delivered to the first nozzle per unit time is the same as the supply flow rate of wetting fluid delivered to the second nozzle per unit time.

[0032] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a first process unit configured to process substrates in a batch manner; a second process unit configured to process the substrates in a single manner; and a controller, wherein the first process unit includes: a batch processing tank configured to process the substrates in a vertical orientation; an orientation changing processing tank configured to change the orientation of the substrates from a vertical orientation to a horizontal orientation, the orientation changing processing tank having a receiving space for containing liquid and a support member for supporting the substrates in a vertical orientation at the receiving space; and an orientation changing robot configured to immerse the substrates in liquid... The substrate's orientation is changed from vertical to horizontal. The orientation-changing robot has a body for holding the substrate, an arm for changing the position of the body, and a liquid supply member for supplying wetting fluid to the substrate placed on the body. The second process unit includes: a single-process chamber configured to process the substrate in a horizontal orientation; a buffer unit configured to provide space for temporarily storing the substrate; and a transfer robot configured to transfer the substrate between the buffer unit and the single-process chamber. A controller controls the orientation-changing robot to perform the orientation change of the substrate and transfer the orientation-changed substrate to the buffer unit.

[0033] In one embodiment, the controller controls the posture-changing robot to perform a posture change on the substrate; the substrate is moved so that it deviates from the liquid stored in the posture-changing processing tank, and if the substrate deviates from the liquid, a wetting liquid is supplied to the substrate by a liquid supply member.

[0034] According to embodiments of the present invention, substrates can be processed efficiently.

[0035] According to embodiments of the present invention, the mass production capability of substrate processing can be improved.

[0036] According to embodiments of the present invention, the uniformity of processing quality between each substrate can be improved.

[0037] According to embodiments conceived in this invention, the risk of generating watermarks on a substrate can be minimized.

[0038] According to embodiments of the present invention, the tilting phenomenon of patterns formed on a substrate can be minimized.

[0039] According to embodiments of the present invention, substrates with patterns having a high aspect ratio can be processed efficiently.

[0040] The effects of this invention are not limited to those described above, and other effects not mentioned will become apparent to those skilled in the art from the following description. Attached Figure Description

[0041] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein, unless otherwise stated, the same reference numerals in the various drawings refer to the same parts, and wherein:

[0042] Figure 1 This is a schematic top view of a substrate processing apparatus according to an embodiment of the present invention.

[0043] Figure 2 Show Figure 1 Any one of the batch processing tanks.

[0044] Figure 3 Show Figure 1 The posture changes the state of the processing tank.

[0045] Figure 4 schematically shown Figure 1 The robot's posture changes.

[0046] Figure 5 Show Figure 4 The hands.

[0047] Figure 6 Show Figure 1 The first buffer unit.

[0048] Figure 7 Showing settings Figure 1 A substrate processing device in a single liquid processing chamber.

[0049] Figure 8 Showing settings Figure 1 A substrate processing device in a single drying chamber.

[0050] Figure 9 This is a flowchart illustrating a substrate processing method according to an embodiment of the present invention.

[0051] Figure 10 and Figure 11 Showing the posture change robot in Figure 9 In the second posture change step, the posture of the substrate is changed to a horizontal posture.

[0052] Figure 12 Show execution Figure 9 The robot's posture changes during the wetting process.

[0053] Figure 13 This shows the liquid supply component in Figure 9A top view of the state of the wetting solution supplied during the wetting step.

[0054] Figure 14 This shows the liquid supply component in Figure 9 A side view of the state of the wetting fluid supplied at the wetting step.

[0055] Figure 15 A hand is shown according to another embodiment of the concept of the present invention.

[0056] Figure 16 It is shown Figure 15 A top view of the state in which the liquid supply component supplies wetting fluid to the substrate.

[0057] Figure 17 This illustrates another embodiment of a posture-changing robot based on the concept of the present invention.

[0058] Figure 18 This is a top view of a hand according to another embodiment of the concept of the present invention.

[0059] Figure 19 yes Figure 18 Side view of the hand. Detailed Implementation

[0060] The inventive concept can be modified and taken in various forms, and specific embodiments of the inventive concept will be shown and described in detail in the accompanying drawings. However, the embodiments of the inventive concept are not intended to limit the specific forms disclosed, and it should be understood that the inventive concept includes all variations, equivalents, and substitutions included within the spirit and scope of the inventive concept. In the description of the inventive concept, detailed descriptions of relevant prior art may be omitted where it may obscure the essence of the inventive concept.

[0061] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the inventive concept. As used herein, the singular forms “a,” “an,” and “described” are also intended to include the plural forms unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes,” and / or “including” as used in this specification specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Furthermore, the term “example” is intended to refer to an example or illustration.

[0062] It should be understood that although the terms "first," "second," "third," etc., may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or section from another region, layer, or section. Therefore, without departing from the teachings of the inventive concept, the first element, first component, first region, first layer, or first section discussed below may be referred to as a second element, second component, second region, second layer, or second section.

[0063] It should be understood that when an element or layer is referred to as "on another element or layer," "connected to," "attached to," or "covering" another element or layer, it may be directly on, connected to, attached to, or cover the other element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as "directly on another element or layer," "directly connected to," or "directly attached to" another element or layer, there are no intermediate elements or layers. Other terms such as "between," "adjacent," or "nearby" should be interpreted in the same manner.

[0064] Unless otherwise defined, all terms used herein (including technical or scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the inventive concept pertains. Terms such as those defined in common dictionaries should be interpreted in accordance with the context of the relevant art and should not be interpreted as ideal or overly formal, unless clearly defined in this application.

[0065] Additionally, the components of the transfer substrate W described below (e.g., the transfer unit or transfer robot described below) may be referred to as transfer modules.

[0066] In the following text, reference will be made to Figures 1 to 19 An embodiment of the present invention is described.

[0067] Figure 1 This is a schematic top view of a substrate processing apparatus according to an embodiment of the present invention.

[0068] refer to Figure 1 According to an embodiment of the present invention, the substrate processing apparatus 10 may include a first process processing unit 100, a second process processing unit 200, and a controller 600. When viewed from above, the first process processing unit 100 and the second process processing unit 200 may be arranged along a first direction X. Hereinafter, when viewed from above, the direction perpendicular to the first direction X is referred to as the second direction Y, and the direction perpendicular to both the first direction X and the second direction Y is referred to as the third direction Z.

[0069] The first process processing unit 100 can perform liquid processing on multiple substrates W in batches. For example, the first process processing unit 100 can clean multiple substrates W in batches. In the first process processing unit 100, multiple substrates W in a vertical position (the top or bottom surface of the substrate W is parallel to the direction perpendicular to the ground) can be processed simultaneously.

[0070] The first process processing unit 100 may include a first loading port unit 110, a transposition chamber 120, a transmission unit 130, a batch processing unit 140, and a posture changing unit 150.

[0071] The first loading port unit 110 may include at least one loading port. A transfer container F storing at least one substrate W may be placed on the loading port of the first loading port unit 110. Multiple substrates W may be stored at the transfer container F. For example, 25 substrates may be stored at the transfer container F. The transfer container F may be referred to as a filling box, pod, FOUP, etc. The transfer container F may be loaded onto the first loading port unit 110 by a container transfer device. The substrate W stored at the transfer container F placed in the first loading port unit 110 may be an unprocessed substrate W. An unprocessed substrate W may be, for example, a substrate W that has not yet been processed, or a substrate W that has been processed but still requires liquid treatment.

[0072] Furthermore, the first loading port unit 110 may contain only the container F storing the unprocessed substrate W. In other words, the first loading port unit 110 may only perform the function of loading the substrate W that needs to be processed.

[0073] The first loading port unit 110 can be connected to the transposition chamber 120. The transposition chamber 120 and the first loading port unit 110 can be arranged along a second direction Y. The first transposition chamber 120 may include a transposition robot 122 and a posture changing unit 124. The transposition robot 122 can remove unprocessed substrates W or substrates requiring processing from a container F mounted on the first loading port unit 110. The first transfer robot 122 can remove substrates W from the container F and transport substrates W to a storage container C disposed in the first transposition chamber 120. The first transfer robot 122 may have a batching hand capable of simultaneously holding and transferring multiple substrates W (e.g., 25 sheets).

[0074] The storage container C may have a substantially cylindrical shape. The storage container C may have storage space therein. Multiple substrates W may be stored in the storage space of the storage container C. For example, 50 substrates W may be stored in the storage space of the storage container C. The storage container C may have a cylindrical shape, wherein at least two or more surfaces of the storage container C are open. Support members for supporting / holding the substrates W may be provided in the storage space of the storage container C.

[0075] If the substrate W taken from the transfer container F is completely brought into the storage container C, the storage container C can be returned to the posture changing unit 124 provided in the transposition chamber 120 via a transfer device (not shown). The posture changing unit 124 can rotate the storage container C. For example, the posture changing unit 124 can rotate the storage container C so that the opening of the storage container C faces upward. If the opening of the storage container C is rotated to face upward, the posture of the substrate W stored in the storage container C can be changed from a horizontal posture (the top and bottom surfaces of the substrate W are horizontal with respect to the ground) to a vertical posture. A horizontal posture can mean that the top surface of the substrate W (e.g., a surface on which a pattern is formed) is parallel to the XY plane (i.e., the ground), and a vertical posture can mean that the top surface of the substrate W is parallel to the XZ plane or the YZ plane (i.e., a surface perpendicular to the ground).

[0076] The transfer unit 130 may include a first transfer unit 132 and a second transfer unit 134. The first transfer unit is used to transfer the substrate W between the transposition chamber 120 and the batch processing unit 140, and the second transfer unit is used to transfer the substrate W between the batch processing unit 140 and the posture changing unit 150, which will be described later.

[0077] The first transfer unit 132 may include a track extending along a first direction X and a hand configured to transfer multiple substrates W at a time. The first transfer unit 132 may hold substrates W whose orientation has changed at the posture changing unit 124 and return the held substrates W to the batch processing unit 140. For example, the first transfer unit 132 may transfer substrates W whose orientation has changed at the posture changing unit 124 to any selected processing tank among the batch processing tanks 141-B1 to 143-B2 included in the batch processing unit 140. For example, the first transfer unit 132 may transfer substrates W whose orientation has changed at the posture changing unit 124 to batch processing tank 141-B1.

[0078] The second transfer unit 134 may include a track extending along a first direction X and a hand configured to transfer multiple substrates W at a time. The second transfer unit 134 may be configured to transfer substrates W between the first batch processing unit 141, the second batch processing unit 142, and the third batch processing unit 143 included in the batch processing unit 140. Additionally, the second transfer unit 134 may be configured to transfer substrates W between the batch processing unit 141 and the posture changing unit 150.

[0079] Furthermore, when viewed from above, its posture is changed by the posture changing unit 124, and the substrate stored in the storage container C and the substrate W stored in the batch processing tank of the batch processing unit 140 can be arranged parallel to each other in the first direction X.

[0080] Furthermore, when viewed from above, the substrates W stored in the batch processing tanks 141-B1 to 143-B2 of the batch processing unit 140 and the substrate W stored in the posture changing processing tank 151 of the posture changing unit 150 can be arranged parallel to each other in the first direction X. In other words, when viewed from above, the support members 141-B1-6 of each of the batch processing tanks 141-B1 to 143-B2 and the support member 153 of the posture changing processing tank 151 can be arranged parallel to each other in the first direction X.

[0081] The batch processing unit 140 can perform liquid processing on multiple substrates W at a time. The batch processing unit 140 can clean multiple substrates W at once using a processing solution. The processing solution used in the batch processing unit 140 can be a chemical and / or a rinsing solution. For example, the chemical can be a chemical with strong acid or strong base properties. Furthermore, the rinsing solution can be pure water. For example, the chemical can be suitably selected from ammonia-hydrogen peroxide mixtures (APM), hydrochloric acid-hydrogen peroxide mixtures (HPM), hydrofluoric acid-hydrogen peroxide mixtures (FPM), dilute hydrofluoric acid (DHF), dilute sulfuric acid peroxide (DSP), chemicals for removing SiN, chemicals including phosphoric acid, and chemicals including sulfuric acid, etc. The rinsing solution can be a liquid containing water. For example, the rinsing solution can be suitably selected from pure water or ozone water.

[0082] The batch processing unit 140 may include a first batch processing unit 141, a second batch processing unit 142, and a third batch processing unit 143.

[0083] The first batch processing unit 141 may include a batch processing slot 141-B1 (1-1), a batch processing slot 141-B2 (1-2), and a first batch transfer unit 141-TR.

[0084] In the 1-1 batch processing tank 141-B1, multiple substrates W can be simultaneously treated with a chemical such as DSP. In the 1-2 batch processing tank 141-B2, multiple substrates W can be simultaneously treated with a chemical such as DHF. However, the inventive concept is not limited thereto, and the processing liquid used in the 1-1 batch processing tank 141-B1 and the 1-2 batch processing tank 141-B2 can be modified to use processing liquids selected from the above-described processing liquids.

[0085] The first batch transfer unit 141-TR can be configured to transfer substrate W between batch processing slot 1-1 141-B1 and batch processing slot 1-2 141-B2.

[0086] The second batch processing unit 142 may include a 2-1 batch processing slot 1442-B1, a 2-2 batch processing slot 1442-B2, and a second batch transfer unit 142-TR.

[0087] In batch processing tank 144-B1 (2-1), multiple substrates W can be simultaneously treated with a chemical containing phosphoric acid. In batch processing tank 142-B2 (2-2), multiple substrates W can be simultaneously treated with a rinsing solution. However, the inventive concept is not limited thereto, and the processing solutions used in batch processing tanks 142-B1 (2-1) and 142-B2 (2-2) can be modified to be selected from the above-described processing solutions.

[0088] The second batch transfer unit 142-TR can be configured to transfer substrate W between batch processing tank 141-B1 (2-1) and batch processing tank 1442-B2 (2-2).

[0089] The third batch processing unit 143 may include a 3-1 batch processing slot 142-B1, a 3-2 batch processing slot 143-B2, and a third batch transfer unit 143-TR.

[0090] In batch processing tank 143-B1 (3-1), multiple substrates W can be simultaneously treated with a chemical containing phosphoric acid. In batch processing tank 143-B2 (3-2), multiple substrates W can be simultaneously treated with a rinsing solution. However, the inventive concept is not limited thereto, and the processing solutions used in batch processing tanks 143-B1 (3-1) and 143-B2 (3-2) can be modified to use processing solutions selected from the above-described processing solutions.

[0091] The third batch transfer unit 143-TR can be configured to transfer substrate W between batch processing slot 143-B1 (3-1) and batch processing slot 143-B2 (3-2).

[0092] Since batch treatment tanks 141-B1 to 143-B2 have the same or similar structure except for the type of treatment fluid L used, batch treatment tank 141-B1 will be described below, and repeated descriptions of the remaining batch treatment tanks 141-B2 to 143-B2 will be omitted.

[0093] Figure 2 Show Figure 1 Any one of the batch processing tanks. For example, Figure 2 Batch processing tank 141-B1 is shown among batch processing tanks 141-B1 to 143-B2.

[0094] refer to Figure 2 The batch processing tank 141-B1 may include a processing tank 141-B1-1, a heating component 141-B1-3, a supply line 141-B1-4, a recollection line 141-B1-5, and a support component 141-B1-6.

[0095] The processing tank 141-B1-1 may have a receiving space 1441-B1-2. The processing tank 141-B1-1 may have a cylindrical shape with an open top. The processing liquid L may be stored in the receiving space 1441-B1-2 of the processing tank 141-B1-1. In order to adjust the temperature of the processing liquid L stored in the receiving space 141-B1-2, a heating member 141-B1-3 may be installed at the processing tank 141-B1-1. The heating member 141-B1-3 can heat the temperature of the processing liquid L stored in the receiving space 1441-B1-2 of the processing tank 141-B1-1 to a set temperature based on the temperature of the processing liquid L sensed by a temperature sensor (not shown).

[0096] Supply line 141-B1-4 supplies the processing fluid L to the containment space 1441-B1-2. Recollection line 141-B1-5 drains the processing fluid L from the containment space 1441-B1-2. A valve is installed at each of the supply line 144-B1-4 and the recollection line 141-B1-5, and can adjust the level of the processing fluid L supplied to the containment space 141-B1-2 (the amount of processing fluid L stored in the containment space 144-B1-2) to a set level based on the level of the processing fluid L sensed by a level sensor (not shown).

[0097] Support member 141-B1-6 can be disposed in receiving space 141-B1-2 to support substrate W. Support member 141-B1-6 can be configured to support multiple substrates W. For example, support member 141-B1-6 can be configured to support 50 substrates W. Support member 141-B1-6 can be configured such that pairs of rod-shaped bodies are arranged facing each other, and a support groove (not shown) is formed in each body through which it supports substrate W.

[0098] Return to reference Figure 1 The posture changing unit 150 can change the posture of the substrate W. The posture changing unit 150 can change the posture of the substrate W from a vertical posture to a horizontal posture. The posture changing unit 150 can change the posture of the substrate W processed in the batch processing unit 140, so that the substrate W processed in a vertical posture can be post-processed in single-processing chambers 230 and 240, wherein the post-processing is performed on a single substrate W in a horizontal posture. The posture changing unit 150 can be disposed between the batch processing unit 140 and the second process processing unit 200.

[0099] The pose change unit 150 may include a pose change processing slot 151 and a pose change robot 156. When viewed from above, the pose change processing slot 151 may have a wider width than the batch processing slots 141-B1 to 143-B2. For example, when viewed from above, the pose change processing slot 151 may have a wider width in a second direction (Y, one direction) than the batch processing slots 141-B1 to 143-B2. Furthermore, when viewed from above, the pose change processing slot 151 may have the same width in a first direction (X, another direction) as the batch processing slots 141-B1 to 143-B2.

[0100] Figure 3 Show Figure 1 The posture change processing slot.

[0101] refer to Figure 3 The posture change processing tank 151 may include a processing tank 152, a support member 153, a supply line 154, and a recollection line 155.

[0102] The processing tank 152 may have a cylindrical shape with an open top. Alternatively, the processing tank 152 may have a rectangular cylindrical shape with an open top. The processing tank 152 may have receiving spaces A and B in which the processing liquid L can be stored. The processing liquid L stored in the processing tank 152 may be a liquid containing water. The type of processing liquid L stored in the processing tank 152 may be the same type of liquid as the wetting liquid sprayed from the first buffer unit 210, which will be described later. For example, both the processing liquid L stored in the processing tank 152 and the wetting liquid sprayed from the first buffer unit 210 may be liquids containing water.

[0103] Support members 153 can be disposed in receiving spaces A and B to support substrate W. Support members A and B can be configured to support multiple substrates W. For example, support member 153 can be configured to support 50 substrates W. Rod-shaped bodies are arranged facing each other, and a support groove (not shown) can be formed in each body to support substrate W.

[0104] Supply line 154 supplies the treatment fluid L to containment spaces A and B. Recollection line 155 drains the treatment fluid L from containment spaces A and B. A valve is installed in each of the supply line 154 and the recollection line 155, and based on the level of the treatment fluid L sensed by a level sensor, the level of the treatment fluid L supplied to containment spaces A and B (the amount of treatment fluid L stored in containment spaces A and B) can be adjusted to a set level.

[0105] Additionally, the accommodating spaces A and B may include a support region A and a posture-changing region B. Support region A may be the region in which support member 153 supports substrate W. Posture-changing region B may be the region in which the posture of substrate W is changed by posture-changing robot 156, described later.

[0106] Return to reference Figure 1 The posture-changing robot 156 can be disposed on one side of the posture-changing processing slot 151. The posture-changing robot 156 can be disposed between the posture-changing processing slot 151 and the first buffer unit 210, described later. The posture-changing robot 156 may include a hand 156-H and a joint portion 156-R. The hand 156-H can be coupled to the joint portion 156-R. The joint portion 156-R can change the position of the hand 156-H.

[0107] Figure 4 schematically shown Figure 1 The robot's posture was changed. (Reference) Figure 4According to an embodiment of the present invention, the posture-changing robot 156 can change the posture of the substrate W from a vertical posture to a horizontal posture in the posture-changing processing tank 151, and then transfer the substrate in the horizontal posture to the first buffer unit 210 of the second process processing unit 200. Furthermore, the posture-changing robot 156 can be a multi-joint robot. Specifically, the posture-changing robot 156 can be a six-axis multi-joint robot.

[0108] The joint portion 156-R can be a multi-joint arm consisting of at least two axes. For example, the joint portion 156-R can be a six-axis multi-joint arm. The joint portion 156-R can change the position of the hand 156-H by moving the hand 156-H in at least one of the first direction X, the second direction Y, and the third direction Z. In addition, the joint portion 156-R can rotate the hand 156-H about one of the axes of the first direction X, the second direction Y, and the third direction Z.

[0109] The posture-changing robot 156 may include a base 171, a rotating body 172, a first arm 173, a second arm 174, a third arm 175, and a fourth arm 176.

[0110] A base 171 can be connected to a rotating body 172. The rotating body 172 can rotate based on the base 171. The rotating body 172 can rotate about a direction perpendicular to the ground as its axis of rotation. A first arm 173 can be connected to the rotating body 172. The first arm 173 can rotate relative to the rotating body about a horizontal axis of rotation. A second arm 174 can be connected to the first arm 173. The second arm 174 can rotate relative to the first arm 173 about a horizontal axis of rotation. A third arm 175 can be connected to the second arm 174. The third arm 175 can rotate along the length of the second arm 174 (or the length of the third arm 175). A fourth arm 176 can rotate about a direction perpendicular to the length of the third arm 175 as its axis of rotation. Furthermore, the fourth arm 176 can rotate the hand 156-H. For example, the fourth arm 176 can have a rotation axis (not shown) capable of rotating the hand 156-H. The hand 156-H can rotate about a direction perpendicular to the axis of rotation of the fourth arm 176 as its axis of rotation.

[0111] Figure 5 Show Figure 4 Hands. (Reference) Figure 5 The hand 156-H of the posture-changing robot 156 may include a support body 161, a first guide portion 162, a second guide portion 163, a drive component 164, a gripping body 165, a fastening body 166, a vision component 167, and a liquid supply component 168.

[0112] The support body 161 can support the bottom surface of the substrate W. The support body 161 can support the bottom surface of the substrate W, which is either the top surface on which the pattern of the substrate W is formed or the bottom surface on which no pattern is formed. That is, the substrate W can be placed on the support body 161.

[0113] The first guide portion 162 and the second guide portion 163 can be disposed on the support body 161. The first guide portion 162 can be a support pad close to the fastening body 166 described later. The second guide portion 163 can be a support pad away from the fastening body 166 described later. Each of the first guide portion 162 and the second guide portion 163 can be disposed in pairs. The first guide portion 162 and the second guide portion 163 can support the bottom surface and / or side surface of the substrate W. The first guide portion 162 and the second guide portion 163 can have a stepped top surface. For example, the height of the inner region of the top surface of the first guide portion 162 supporting the bottom surface of the substrate W can be lower than the height of the outer region of the bottom surface of the substrate W not supporting it. Similarly, the height of the inner region of the top surface of the second guide portion 163 supporting the bottom surface of the substrate W can be lower than the height of the outer region of the bottom surface of the substrate W not supporting it. That is, the substrate W can be placed on the support body 161 via the first guide portion 162 and the second guide portion 163 mounted on the support body 161. The substrate W placed on the support body 161 should be interpreted as including not only the case where the support body 161 and the substrate W are in direct contact with each other, but also the case where the substrate W is placed on the first guide portion 162 and the second guide portion 163 mounted on the support body 161.

[0114] The drive member 164 can be fastened to the clamping body 166. The drive member 164 can be a driver capable of moving the clamping body 165 in the lateral direction. The drive members 164 can be arranged in pairs. For example, the drive members 164 can be configured to correspond to each of the paired clamping bodies 165. The pair of drive members 164 can move the pair of clamping bodies 165 in the lateral direction. The clamping bodies 165 can move in a direction close to the substrate W and in a direction away from that side of the substrate W. Therefore, the clamping bodies 165 can clamp the substrate W placed on the support body 161. In other words, the support body 161 and the clamping bodies 165 can be bodies that hold the substrate W.

[0115] The fastening body 166 may be a body that connects the clamping body 165 and the support body 161 to the joint portion 156-R. The fastening body 166 may also be a body that connects the clamping body 165 and the support body 161 to the fourth arm 176 of the joint portion 156-R. The fastening body 166 may be fastened to the rotation axis of the fourth arm 176 of the joint portion 156-R.

[0116] Each of the support bodies 161 may be provided with a first guide portion 162 and a second guide portion 163. The first guide portion 162 may be a protrusion close to the rotating member 166, which will be described later. The second guide portion 163 may be a protrusion relatively far from the rotating member 166, which will be described later. The second guide portion 163 may be positioned further from the rotating member 166 than the first guide portion 162. The first guide portion 162 and the second guide portion 163 may support a side portion of the substrate W. The first guide portion 162 and the second guide portion 163 support a side portion of the substrate W, and the distance between them may be slightly smaller than the diameter of the substrate W.

[0117] The vision component 167 can acquire images by imaging the substrate W and / or the support body 161. The acquired images can be transmitted to the controller 600, which will be described later. The controller 600 can generate control signals for driving the posture-changing robot 156 based on the images acquired by the vision component 167.

[0118] The liquid supply member 168 can supply a wetting liquid WL to the substrate W placed on the support body 161. The wetting liquid WL may include water. The wetting liquid WL supplied by the liquid supply member 168 may be a liquid of the same type as the processing liquid L stored in the receiving spaces A and B. Alternatively, the wetting liquid WL supplied by the liquid supply member 168 may be a liquid of the same type as the wetting liquid WL supplied by the first buffer unit 210, which will be described later.

[0119] The liquid supply component 168 may include a first nozzle 166a and a second nozzle 166b. At least one of the first nozzles 166a and at least one of the second nozzles 166b may be provided. Multiple first nozzles 168a and second nozzles 166b may be provided respectively. The first nozzle 166a supplies wetting liquid WL to a first region of the substrate W placed on the support body 161. The second nozzle 166b supplies wetting liquid WL to a second region of the substrate W placed on the support body 161. The first region and the second region may be different regions. As described below, the first region and the second region may be edge regions of the substrate W. The first region may be adjacent to the first nozzle 166a, and the second region may be adjacent to the second nozzle 166b.

[0120] The distance between the first region and the first nozzle 166a can be shorter than the distance between the second region and the second nozzle 166b. That is, the spray distance of the wetting fluid WL supplied from the first nozzle 166a can differ from the spray distance of the wetting fluid WL supplied from the second nozzle 168b. For example, the spray distance of the wetting fluid WL supplied from the first nozzle 168a can be shorter than the spray distance of the wetting fluid WL supplied from the second nozzle 168b.

[0121] Furthermore, when viewed from above, the first nozzle 168a can be positioned between the second nozzles 168b. The second nozzles 168b can be positioned relatively close to the clamping body 165 (i.e., on the outside). The first nozzle 166a can be positioned relatively far from the clamping body 165 (i.e., on the inside).

[0122] The wetting liquid WL sprayed from the first nozzle 168a and the second nozzle 168b can be in different directions. For example, when viewed from above, the first nozzle 166a can supply the wetting liquid WL in a direction parallel to the reference line, while the second nozzle 168b can supply the wetting liquid WL in a direction inclined to the reference line, which is an imaginary reference line passing through the center of the substrate W and the center of the visual member 167.

[0123] The diameters of the injection orifices of the first nozzle 168a and the second nozzle 168b can be different from each other. For example, the diameter of the injection orifice of the first nozzle 166a can be larger than the diameter of the injection orifice of the second nozzle 166a. For example, the supply flow rate of the wetting liquid WL delivered to the first nozzle 168a and the second nozzle 168b per unit time can be the same. Therefore, the injection distance of the wetting liquid WL injected from the first nozzle 166a can be shorter than the injection distance of the wetting liquid WL injected from the second nozzle 168b.

[0124] In addition, the first nozzle 166a and the second body 166b can be mounted on the support body 161.

[0125] Return to reference Figure 1 The second processing unit 200 can process the substrate W processed by the first processing unit 100. The second processing unit 200 can process the substrate W processed by the first processing unit 100, and can perform liquid treatment or drying on the substrate W in a single manner.

[0126] The second process unit 200 may include a first buffer unit 210, a first transfer chamber 220, a single-phase liquid processing chamber 230, a drying chamber 240, a second buffer unit 250, a second transfer chamber 260, and a second loading port unit 270. Both the single-phase liquid processing chamber 230 and the drying chamber 240 may be referred to as single-phase processing chambers.

[0127] The first buffer unit 210 provides storage space for temporarily storing the substrate W. Viewed from above, the first buffer unit 210 is open to the posture changing unit 150. Viewed from above, the first buffer unit 210 is also open to the first transfer chamber 220. Therefore, the posture changing robot 156 can change the posture of the substrate W in the posture changing processing tank 151 and return the substrate W with the changed posture to the first buffer unit 210. Additionally, the substrate W transferred to the first buffer unit 210 can be removed by the first transfer robot 222 in the first transfer chamber 220. The removed substrate can be transferred to either the single-phase liquid processing chamber 230 or the single-phase drying chamber 240.

[0128] Furthermore, the first buffer unit 210 can be positioned at a relatively higher height than the posture change processing tank 151 described above. For example, if the posture change processing tank 151 is positioned on the first layer, the first buffer unit 210 can be positioned at a height of approximately two layers or approximately 1.5 layers.

[0129] If necessary, the first buffer unit 210 can be stacked with at least a portion of the single-phase processing chamber. For example, the drying chamber 240 or the single-phase liquid processing chamber 230, described later, can be disposed below the first buffer unit 210. For example, the single-phase liquid processing chamber 230, described later, can be disposed below the first buffer unit 210. One or more single-phase liquid processing chambers 230 are disposed below the first buffer unit 210. That is, the first buffer unit 210 is configured to be stacked with the single-phase processing chamber to directly store the substrate W conveyed by the second transfer unit 152, and can be disposed above the single-phase processing chamber.

[0130] A first transfer chamber 220 may be disposed between the first buffer unit 210 and the single-processing chamber. The first transfer chamber 220 may have a first transfer robot 222. The first transfer robot 222 may remove the substrate W from the first buffer unit 210 and return the substrate W to the single-processing chamber. The first transfer robot 222 may have a single-transfer hand for transporting the substrate W one by one.

[0131] A single-processing chamber may be located on one side of the first transfer chamber 220. The single-processing chamber may include a single-liquid processing chamber 230 and a single-drying chamber 240.

[0132] Multiple single-unit processing chambers 230 can be provided. These single-unit processing chambers 230 can be arranged and stacked in an up / down direction. A single-unit liquid processing chamber 230 can rotate the substrate W in a horizontal orientation, but it can also process the substrate W by supplying processing liquid to the rotating substrate W. The single-unit liquid processing chamber 230 can process the substrate W one by one. The processing liquid supplied from the single-unit liquid processing chamber 230 can be an organic solvent. For example, the processing liquid supplied from the single-unit liquid processing chamber 230 can be isopropanol (IPA). In the single-unit liquid processing chamber 230, an organic solvent can be supplied to the rotating substrate W, and the substrate W can be dried by rotating it. In contrast, in a single-unit liquid processing chamber 9230, an organic solvent is supplied to the rotating substrate W, and the substrate W is conveyed to a drying chamber 240, described later, in a state of being wetted with the organic solvent, so that the substrate W can be dried in the drying chamber 240. A detailed description of the single-unit liquid processing chamber 230 will be described later.

[0133] Multiple single-unit drying chambers 240 can be provided. These single-unit drying chambers 240 can be arranged and stacked in an up / down direction. A single-unit drying chamber 240 can use supercritical fluid to process a substrate W. A single-unit drying chamber 240 can be a supercritical chamber in which a single substrate W is dried in a single manner. A single-unit drying chamber 240 can be a supercritical chamber in which a supercritical fluid is used to dry the substrate W. A detailed description of the single-unit drying chamber 240 will be described later.

[0134] The substrate W processed in the single-processing chamber can be transferred to the second buffer unit 250 by the first transfer robot 222. The second buffer unit 250 can be disposed between the first transfer chamber 220 and the second transfer chamber 260. The second buffer unit 250 can also be disposed between the single-processing chamber and the second loading port unit 270.

[0135] Similar to the first buffer unit 210, the second buffer unit 250 can provide space for temporary storage or storage of the substrate W. For example, the second buffer unit 250 can temporarily store the substrate W processed in a single liquid processing chamber 230 and / or a single drying chamber 240, which are single processing chambers.

[0136] The second transfer chamber 260 can be disposed between the second buffer unit 250 and the second loading port unit 270. The second transfer robot 262 can be disposed in the second transfer chamber 260. The second transfer robot 262 can transfer the substrate W stored in the second buffer unit 250 after processing to the transfer container F.

[0137] The hand of the second transfer robot 262 can be a single hand that transfers each substrate W individually. The transfer hand of the second transfer robot 262 can be configured to move along a first direction X, a second direction Y, and a third direction Z. In addition, the transfer hand of the second transfer robot 262 can be rotatably configured with the third direction Z as the axis of rotation.

[0138] The second loading port unit 270 may include at least one loading port. A transfer container F capable of storing multiple substrates W may be placed on the loading port included in the second loading port unit 270. For example, the transfer container F placed on the second loading port unit 270 may store substrates W that have been processed at the first process processing unit 100 and the second process processing unit 200. Only substrates W that have been processed at the first process processing unit 100 and the second process processing unit 200 can be stored in the transfer container F placed on the second loading port unit 270. That is, the second loading port unit 270 may perform the function of unloading processed substrates W from the substrate processing equipment.

[0139] The second transfer robot 262 described above can bring the processed substrate W into the container F placed on the loading port of the second loading port unit 270. The container F can be transferred to the outside of the substrate processing device 10 via the aforementioned article transfer device (e.g., OHT).

[0140] The controller 600 can control the substrate processing apparatus 10. For example, the controller 600 can control the components of the substrate processing apparatus 10. For example, the controller 600 can control the substrate processing apparatus 10 so that the substrate processing apparatus 10 can perform the process of processing the substrate W.

[0141] The controller may include a process controller comprising a microprocessor (computer) that controls the substrate processing equipment, a user interface (such as a keyboard) through which an operator inputs commands to manage the substrate processing equipment, a display showing the operating status of the substrate processing equipment, and a memory unit that stores processing schemes (i.e., control programs that execute the processing procedures of the substrate processing equipment by controlling the process controller, or programs that execute components of the substrate processing equipment based on data and processing conditions). Additionally, the user interface and the memory unit may be connected to the process controller. The processing schemes may be stored in a storage medium in the memory unit, and the storage medium may be a hard disk, a portable disk (such as a CD-ROM or DVD), or a semiconductor memory (such as flash memory).

[0142] Figure 6 Show Figure 1 The first buffer unit.

[0143] refer to Figure 6The first buffer unit 210 may have a structure that supplies wetting liquid to the storage space to prevent the substrate W brought into the storage space from drying out (in order to maintain the wettability of the substrate W). In addition, the substrate W stored in the first buffer unit 210 may be stored in a corresponding storage space divided in the first buffer unit 210.

[0144] The first buffer unit 210 may include a support frame 212, a discharge baffle 214, a wetting nozzle 216 (exemplary second wetting nozzle) and a discharge line 218.

[0145] Multiple support frames 212, discharge baffles 214, and wetting nozzles 216 can be provided to correspond to each substrate W brought into the first buffer unit 210. The support frames 212 can support the substrate W within the space provided by the first buffer unit 210. Additionally, a weight sensor 212a can be mounted on the support frame 212. The weight sensor senses the weight of the substrate W supported on the support frame 212 to confirm the amount of wetting liquid WL supplied to the substrate W.

[0146] The controller 600 can adjust the amount of wetting liquid WL sprayed from the wetting nozzle 216 per unit time based on the weight of the substrate W supported by the support frame 212. The support frame 212 can be configured to support the bottom surfaces of one side and the other side of the substrate W.

[0147] The wetting nozzle 216 can be configured to spray wetting liquid in a stream or spray manner. Multiple wetting nozzles 216 can be provided. A pair of wetting nozzles 216 can spray wetting liquid onto each substrate W. The wetting nozzle 216 can include a chemical capable of maintaining the wettability of the substrate W conveyed to the storage space of the first buffer unit 210, or a nozzle for supplying mist. The chemical or mist can be a wetting liquid selected from isopropanol (IPA), the aforementioned chemicals, and the aforementioned rinsing liquid.

[0148] A discharge baffle 214 can be disposed below the support frame 212. The discharge baffle 214 can be disposed below each substrate W supported on the support frame 212. The discharge baffle 214 serves as a liquid receiver for receiving the wetting liquid ejected by the wetting nozzle 216 and can divide a space in which each substrate W is disposed. The discharge baffle 214 has a rectangular column shape with an open top to provide a liquid receiving space, and the liquid receiving space of the discharge baffle wall 214 can be connected to a discharge line 218. Therefore, the wetting liquid ejected by the wetting nozzle 216 can be discharged to the outside.

[0149] Figure 7 Showing settings Figure 1 The status of the substrate processing equipment in the single liquid processing chamber.

[0150] refer to Figure 7The substrate processing apparatus 400 provided to the single liquid processing chamber 230 may include a housing 410, a processing container 420, a support unit 440, a lifting / lowering unit 460, and a liquid supply unit 480.

[0151] The housing 410 has a processing space 412. The housing 410 may have a cylindrical shape with a space therein. The internal space 412 of the housing 410 may house a processing container 420, a support unit 440, a lifting / lowering unit 460, and a liquid supply unit 480. When viewed from the front surface, the housing 410 may have a rectangular shape. However, the inventive concept is not limited thereto, and the housing 410 may be modified into various shapes that can have the processing space 412.

[0152] The processing container 420 has a cylindrical shape with an open top. The processing container 420 has an internal recollection container 422 and an external recollection container 426. Each of the recollection containers 422 and 426 recollects different processing liquids from the processing liquid used in the process. The internal recollection container 422 is arranged in an annular shape around the substrate unit 440, and the external recollection container 426 is arranged in an annular shape around the internal recollection container 426. The internal space 422a of the internal recollection container 422 and the internal recollection container 422 itself function as a first inlet 422a through which the processing liquid flows into the internal recollection container 422. The space 426a between the internal recollection container 422 and the external recollection container 426 functions as a second inlet 426a through which the processing liquid flows into the external recollection container 426. According to one embodiment, each inlet 422a and 426a may be located at a different height. Recollection lines 422b and 426b are connected below the bottom surface of each of the recollection containers 422 and 426. The treatment fluid brought into each of the recollection containers 422 and 426 can be reused and supplied to an external treatment fluid regeneration system (not shown) via recollection lines 422b and 426b.

[0153] Support unit 440 supports substrate W in processing space 412. Support unit 440 supports and rotates substrate W during the process. Support unit 440 includes support plate 442, support pin 444, chuck pin 446, and rotation drive members 448 and 449.

[0154] The support plate 442 is configured as a substantially circular plate and has a top surface and a bottom surface. The diameter of the bottom surface is smaller than the diameter of the top surface. That is, the support plate 442 can have a top-wide, bottom-narrow structure. The top and bottom surfaces are positioned such that their central axes coincide with each other. Additionally, a heating device (not shown) can be provided at the support plate 442. The heating device provided to the support plate 442 can heat the substrate W placed on the support plate 442. The heating device can generate heat. The heat generated by the heating device can be hot or cold. The heat generated by the heating device can be transferred to the substrate W placed on the support plate 442. Furthermore, the heat transferred to the substrate W can heat the processing liquid supplied to the substrate W. The heating device can be a heater and / or a cooling coil. However, the inventive concept is not limited thereto, and the heating device can be modified in various ways using known devices.

[0155] A plurality of support pins 444 are provided. The support pins 444 are configured to be spaced apart by a predetermined space at the edge portion of the top surface of the support plate 442 and to protrude upward from the support plate 442. The support pins 444 are arranged in an annular shape by combining with each other. The support pins 444 support the edge region of the bottom surface of the substrate W such that the substrate W is spaced apart from the top surface of the support plate 442 by a predetermined distance.

[0156] Multiple chuck pins 446 are provided. The chuck pins 446 are positioned further away from the center of the support plate 442 than the support pins 444. The chuck pins 446 are configured to project upwards from the top surface of the support plate 442. The chuck pins 446 support the side portions of the substrate W such that the substrate W does not separate from its correct position in the lateral direction when the support plate 442 is rotated. The chuck pins 446 are configured to move linearly between an outer position and an inner position along the radial direction of the support plate 442. The outer position is the position further away from the center of the support plate 442 compared to the inner position. The chuck pins 446 are positioned in the outer position when the substrate W is loaded or unloaded from the support plate 442, and in the inner position when a process is performed on the substrate W. The inner position is the position where the chuck pins 446 and the side portions of the substrate W contact each other, and the outer position is the position where the chuck pins 446 and the substrate W are spaced apart from each other.

[0157] Rotational drive members 448 and 449 rotate the support plate 442. The support plate 442 can rotate about its central axis via the rotational drive members 448 and 449. The rotational drive members 448 and 449 include a support shaft 448 and a drive unit 449. The support shaft 448 has a cylindrical shape facing a fourth direction 16. The top end of the support shaft 448 is fixedly coupled to the bottom surface of the support plate 442. According to one embodiment, the support shaft 448 can be fixedly coupled to the center of the bottom surface of the support plate 442. The drive unit 449 provides a driving force to rotate the rotational shaft 448. The support shaft 448 can be rotated by the drive unit 449, and the support plate 442 can rotate together with the support shaft 448.

[0158] The lifting / lowering unit 460 linearly moves the processing container 420 in the up / down direction. As the processing container 420 moves up and down, its relative height to the support plate 442 changes. If the substrate W is loaded or unloaded from the support plate 442, the processing container 420 is lowered, causing the support plate 442 to protrude above the processing container 420. Furthermore, during operation, the height of the processing container 420 is adjusted so that the processing liquid flows into predetermined collection containers 422 and 426 depending on the type of processing liquid supplied to the substrate W. The lifting / lowering unit 460 has a bracket 462, a moving shaft 464, and a driver 466. The bracket 462 is fixedly mounted on the outer wall of the processing container 420 and is fixedly connected to the bracket 462 via the moving shaft 464, which moves in the up / down direction via the driver 466. Optionally, the lifting / lowering unit 460 can move the support plate 442 in the up / down direction.

[0159] The liquid supply unit 480 can supply processing liquid to the substrate W. The processing liquid can be the aforementioned organic solvent, chemical, or rinsing liquid. The organic solvent can be isopropanol (IPA) solution.

[0160] The liquid supply unit 480 may include a moving member 481 and a nozzle 489. The moving member 481 moves the nozzle 489 to a process position and a standby position. The process position is the position where the nozzle 489 faces the substrate W supported by the support unit 440. According to one embodiment, the process position is the position where the processing liquid is discharged onto the top surface of the substrate W. The process position also includes a first supply position and a second supply position. The first supply position may be a position closer to the center of the substrate W than the second supply position, and the second supply position may be a position including an end of the substrate. Alternatively, the second supply position may be a region adjacent to an end of the substrate. The standby position is defined as a position where the nozzle 489 deviates from the process position. According to one embodiment, the standby position may be a position where the nozzle 489 is ready before or after the substrate W has completed the process processing.

[0161] The moving member 481 includes an arm 482, a support shaft 483, and a driver 484. The support shaft 483 is located on one side of the processing container 420. The support shaft 483 is rod-shaped, with its length direction being a fourth direction. The support shaft 483 can be configured to be rotatable by the driver 484. The support shaft 483 is configured to be able to move up and down. The arm 482 is coupled to the top end of the support shaft 483. The arm 482 extends vertically from the support shaft 484. A nozzle 489 is coupled to the end of the arm 482. When the support shaft 483 rotates, the nozzle 489 can swing together with the arm 482. The nozzle 489 can move to a process position and a standby position during the swing. Optionally, the arm 482 can be configured to be able to move forward and backward in its length direction. When viewed from above, the path traversed by the movement of the nozzle 489 can coincide with the central axis of the substrate W at the process position.

[0162] Figure 8 Showing settings Figure 1 A substrate processing device in a single drying chamber.

[0163] refer to Figure 8 The substrate processing apparatus 500 provided in the single-stage drying chamber 240 can remove residual processing liquid on the substrate W by using a drying fluid G in a supercritical state. The drying chamber 500 can be a supercritical chamber, which uses a supercritical fluid to remove residual processing liquid (e.g., rinsing liquid or organic solvent) on the substrate W. For example, the substrate processing apparatus 500 provided in the single-stage drying chamber 240 can use supercritical carbon dioxide (CO2) to perform the drying process to remove residual organic solvent on the substrate W.

[0164] The substrate processing apparatus 500, disposed in a single drying chamber 240, may include a main body 510, a heating member 520, a fluid supply unit 530, a fluid discharge unit 550, and a lifting / lowering member 560. The main body 510 may have an internal space 518 in which the substrate W is processed. The main body 510 may provide an internal space 518 in which the substrate W is dried by a drying fluid G in a supercritical state.

[0165] The main body 510 may include a top body 512 and a bottom body 514. The top body 512 and the bottom body 514 may be combined with each other to form an internal space 518. A substrate W may be supported in the internal space 518. For example, the substrate W may be supported by a support member (not shown) in the internal space 518. The support member may be configured to support the bottom surface of an edge region of the substrate W. Either the top body 512 or the bottom body 514 may be coupled to a lifting / lowering member 560 for vertical movement. For example, the bottom body 514 may be coupled to the lifting / lowering member 560 and may be moved vertically via the lifting / lowering member 560. Thus, the internal space 518 of the main body 510 may be selectively sealed. Although the above example has been described as an example of the bottom body 514 being coupled to the lifting / lowering member 560 and moving vertically, the inventive concept is not limited thereto. For example, the top body 512 may be coupled to the lifting / lowering member 560 for vertical movement.

[0166] The heating element 520 can heat the dry fluid G supplied to the internal space 518. The heating element 520 can increase the temperature of the internal space 518 of the main body 510 to induce a phase change of the dry fluid G supplied to the internal space 518 to a supercritical state. In addition, the heating element 520 can increase the temperature of the internal space 518 of the main body 510, so that the dry fluid G supplied to the internal space 518, which is in a supercritical state, remains in a supercritical state.

[0167] Additionally, the heating element 520 may be embedded in the main body 510. For example, the heating element 520 may be embedded in either the top main body 512 or the bottom main body 514. For example, the heating element 520 may be disposed in the bottom main body 514. However, the inventive concept is not limited thereto, and the heating element 520 may be disposed at various locations capable of increasing the temperature of the interior space 518. Furthermore, the heating element 520 may be a heater. However, the inventive concept is not limited thereto, and the heating element 520 may be modified from various known devices capable of increasing the temperature of the interior space 518.

[0168] The fluid supply unit 530 can supply dry fluid G to the internal space 518 of the main body 510. The dry fluid G supplied by the fluid supply unit 530 may include carbon dioxide (CO2). The fluid supply unit 530 may include a fluid supply source 531, a first supply line 533, a first supply valve 535, a second supply line 537, and a second supply valve 539.

[0169] Fluid supply source 531 can store and / or supply dried fluid G to the internal space 518 of body 510. Fluid supply source 531 can supply dried fluid G to first supply line 533 and / or second supply line 537. For example, first supply valve 535 can be installed on first supply line 533. Additionally, second supply valve 539 can be installed on second supply line 537. First supply valve 535 and second supply valve 539 can be on / off valves. Depending on whether the first supply valve 535 and second supply valve 539 are open or closed, dried fluid G can selectively flow through first supply line 533 or second supply line 537.

[0170] In the example above, the first supply line 533 and the second supply line 537 are connected to a fluid supply source 531, but are not limited thereto. For example, multiple fluid supply sources 531 may be provided, the first supply line 533 may be connected to one of the multiple fluid supply sources 531, and the second supply line 537 may be connected to another of the fluid supply sources 531.

[0171] Furthermore, the first supply line 533 can be a top supply line that supplies dry gas from above the interior space 518 of the main body 510. For example, the first supply line 533 can supply dry gas to the interior space 518 of the main body 510 in a top-to-bottom direction. For example, the first supply line 533 can be connected to the top body 512. Furthermore, the second supply line 537 can be a bottom supply line that supplies dry gas from below the interior space 518 of the main body 510. For example, the second supply line 537 can supply dry gas to the interior space 518 of the main body 510 in a bottom-to-top direction. For example, the second supply line 537 can be connected to the bottom body 514.

[0172] The fluid discharge unit 550 can discharge dry fluid G from the internal space 518 of the main body 510.

[0173] Figure 9 This is a flowchart illustrating a substrate processing method according to an embodiment of the present invention.

[0174] refer to Figure 9 The substrate processing method according to an embodiment of the present invention may include a substrate loading step S10, a first posture changing step S20, a batch processing step S30, a second posture changing step S50, a single processing step S60, and a substrate unloading step S70.

[0175] In substrate loading step S10, the so-called unprocessed substrate W to be processed can be loaded onto the substrate processing device 10. In substrate loading step S10, the transfer container F can be placed in the first loading port unit 110.

[0176] The substrate W stored in the transfer container F can be taken out by the transfer robot 122 and transferred to the storage container C.

[0177] In the first posture change step S20, the posture of the substrate W can be changed from a horizontal posture to a vertical posture. In the first posture change step S20, the posture of the substrate W can be changed by rotating the storage container C in the first direction X using the posture change unit 124. The posture change unit 124 may have a rotation axis capable of rotating the storage container C in the first direction X, which serves as an axis.

[0178] The substrate W, which has been changed to a vertical orientation, can be transferred to the first batch processing unit 141 via the first transfer unit 132.

[0179] In the batch processing step S30, liquid processing can be performed on the substrate W. In the batch processing step S30, the substrate W can be returned to at least one batch processing tank 1441-B1 to 143-B2 for further liquid processing. The batch processing step S30 can be performed by performing preprocessing at the first batch processing unit 141 and postprocessing at the second batch processing unit 142 or the third batch processing unit.

[0180] For example, the substrate W transferred to the first batch processing unit 141 can undergo liquid processing in batch processing tank 1-1 141-B1 and / or batch processing tank 141-B2. The substrate W undergoing liquid processing in batch processing tank 1-1 141-B1 and / or batch processing tank 141-B2 can be transferred to either the second batch processing unit 142 or the third batch processing unit 143 for further processing.

[0181] For example, when the substrate W is transferred to the second batch processing unit 142, the substrate W can first be treated with a chemical containing phosphoric acid in the 2-1 batch processing tank 142-B1, and then rinsed with a rinsing solution containing water in the 2-2 batch processing tank 142-B2.

[0182] The rinsed substrate W can be transferred to the posture change processing tank 151 via the second transfer unit 134.

[0183] The second posture change step S40 can be performed at the posture change unit 150. The second posture change step S40 may include a holding step of holding the substrate W and a rotation step of changing the posture of the substrate W.

[0184] For example, such as Figure 10As shown, in the holding step of the second posture change step S40, the hand 156-H can approach any substrate W supported in a vertical posture by the support member 153. The hand 156-H can move such that the substrate W can be positioned between the first guide portion 162 and the second guide portion 163. If the substrate W is positioned between the first guide portion 162 and the second guide portion 163, the clamping body 165 can move to the clamping position to hold the substrate W.

[0185] If the hand 156-H holds the substrate W, the substrate W can move upward so that the substrate W can detach from the support groove formed in the support member 153.

[0186] After that, as Figure 11 As shown, in the rotation step of the second posture change step S40, the substrate W can be linearly moved along the direction that changes the position of the substrate W while rotating the substrate W based on the axis of the rotation member 166. That is, in the rotation step, the substrate W can rotate and move linearly simultaneously. In this case, the position of the end of the substrate W can be changed when drawing a virtual curve (e.g., a parabola). That is, when drawing a parabola, the posture of the substrate W can be changed from a vertical posture to a horizontal posture while immersed in the processing liquid L. In addition, the difference between the time when the rotation of the substrate W ends and the time when the linear movement of the substrate W ends can be less than or equal to a set time. For example, these two time points can be the same time point. That is, at the time point when the linear movement of the substrate W ends, the rotation of the substrate W by the rotation member 166 can be terminated simultaneously.

[0187] Furthermore, when the substrate W is held and rotated, the vision component 167 can be kept out of the processing liquid L. In other words, the vision component 167 can be mounted in a position where it is not immersed in the processing liquid L stored in the posture change processing tank 151. Therefore, the problem of damage to the vision component 167 from the processing liquid L can be minimized.

[0188] If the orientation of substrate W is changed to a state where substrate W is immersed in processing liquid L, substrate W may be damaged due to the resistance of processing liquid L. However, as conceived in this invention, if the orientation is changed by plotting a curve while substrate W is immersed in processing liquid L, the resistance caused by processing liquid L can be suppressed and transmitted to substrate W as much as possible. Furthermore, if substrate W is moved away from processing liquid L (i.e., exposed to air) and its orientation is changed, the wettability of substrate W may not be maintained and watermarks may form on substrate W; this problem can be minimized by changing the orientation of substrate W while it is immersed in processing liquid L.

[0189] After performing the second posture change step S40, the wetting step S50 can be performed. The wetting step S50 can be performed between the second posture change step S40 and the single-processing step S60.

[0190] The wetting step S50 can be performed by the posture-changing robot 156 and / or the first buffer unit 210. In the wetting step S50, the substrate W exposed to the outside by spraying a wetting liquid can prevent the substrate W from drying out naturally. The wetting liquid can be a liquid of the same type as the processing liquid L stored in the posture-changing processing tank 151. Conversely, the wetting liquid can be a liquid of a different type than the processing liquid L.

[0191] For example, such as Figure 12 As shown, the posture change of the substrate W is completed, and the posture change robot 156 can move the substrate W upwards to deviate from the processing liquid L stored in the posture change processing tank 152. If the substrate W deviates from the processing liquid L, the liquid supply member 168 can supply wetting liquid WL. In this case, as... Figure 13 and Figure 14 As shown, a wetting liquid WL can be supplied to a first region and a second region, which are the edge regions of a substrate W. The wetting liquid WL supplied to the edge regions of the substrate W can flow along the top surface of the substrate W to form a liquid film on the top surface of the substrate W. If the wetting liquid WL flows along the edge regions of the substrate W to form a liquid film, the splashing of the wetting liquid WL is suppressed to the greatest extent, thereby allowing the substrate W to be processed more effectively.

[0192] Furthermore, the wetting step S50 can be performed at the first buffer unit 210 as described above. The substrate W to which the second posture change step S40 is performed can be transferred to the first buffer unit 210 by the posture change robot 156. In the wetting step S30, if the substrate W is brought into the first buffer unit 210, the wetting nozzle 216 of the first buffer unit 210 can spray wetting liquid onto the substrate W.

[0193] Because the wetting step S30 is performed, the natural drying of the substrate W can be minimized before it is brought into the single-process chamber.

[0194] The single processing step S60 may include a liquid processing step S61 and a drying step S62.

[0195] In the liquid processing step S61, the substrate W can be liquid processed in a single manner. If the substrate W, which is temporarily stored in the first buffer unit 210, is transferred to the single liquid processing chamber 230, the liquid processing step S61 can be performed in the single liquid processing chamber 230. In the liquid processing step S40, an organic solvent such as IPA can be supplied to the substrate W.

[0196] In drying step S62, substrate W can be dried in a single manner. If substrate W, which has been liquid-treated in liquid treatment step S61, is transferred to drying chamber 240, drying step S62 can be performed in drying chamber 240. In drying step S50, a supercritical processing liquid (e.g., supercritical carbon dioxide) can be supplied to substrate W to remove residual organic solvents, wetting liquid, or processing liquid L from the substrate.

[0197] In some cases, the drying step S50 may not be performed in the drying chamber 240, but can be dried by rotating the substrate W at high speed in the single liquid treatment chamber 230 (so-called rotary drying).

[0198] The substrate W, which has undergone a single processing step S60, can be transferred to the second buffer unit 250 and then transferred by the second transfer robot 262 of the second transfer chamber 260 to the transfer container F placed in the second loading port unit 270.

[0199] As described above, the substrate processing apparatus 10 according to an embodiment of the present invention may include both a batch processing unit 140 and a single liquid processing chamber 230. Therefore, it can have all the advantages of both batch liquid processing methods and single liquid processing methods.

[0200] For example, since the batch processing unit 140 can process multiple substrates W at once, the mass production capability of substrate W processing is excellent, and the processing uniformity between substrates W is very high. Furthermore, if the pattern formed on the substrate W has a high aspect ratio, the batch processing unit 140 can replenish unprocessed portions (e.g., unetched portions) by supplying chemicals, rinsing fluid, etc., from the single-liquid processing chamber 230. Additionally, substrates W (e.g., wafers) wetted with organic solvent supplied from the single-liquid processing chamber 230 or the first buffer unit 210 can be transferred to the drying chamber 240 to dry the substrate W by supplying supercritical fluid. Supercritical fluid has high penetrating power into the spaces between patterns formed on the substrate W and can dry the substrate W without rotating it, thereby minimizing the aforementioned pattern tilting phenomenon. Furthermore, the substrate processing apparatus 10 of the present invention can perform all of the single-liquid processing method, the batch liquid processing method, and the method of drying substrate W using supercritical fluid, thereby improving defects caused by particles, droplets, and flowability. Furthermore, since the number of substrates W that can be processed at the batch processing unit 140 is relatively large, a large number of liquid processing chambers are not required, and thus the footprint of the substrate processing equipment 10 can be reduced. Additionally, as described above, by further including a single liquid processing chamber 230, the problem of abnormal SiO2 growth on the patterns on the substrate W that may occur when only the batch processing unit 140 is used to process the substrate W can be solved.

[0201] Furthermore, similar to the substrate processing apparatus 10 according to an embodiment of the present invention, if both the batch processing unit 140 and the single liquid processing chamber 230 are provided, it is necessary to change the orientation of the substrate W from a vertical to a horizontal orientation. Therefore, the substrate processing apparatus 10 according to an embodiment of the present invention includes an orientation-changing robot 156 to change the orientation of the substrate W from a vertical to a horizontal orientation. In this case, the orientation change of the substrate W is performed while the substrate W is immersed in the processing liquid L in order to maintain the wettability of the substrate W as much as possible (otherwise, the substrate W may dry out and form watermarks).

[0202] In the above example, it has been described that the liquid supply component 168 is mounted on the support body 161, but the inventive concept is not limited thereto. For example, as Figure 15As shown, the liquid supply component 169 can be mounted on the fastening body 166. The liquid supply component 169 can be a supply conduit on which a first nozzle 169a, a second nozzle 168b, and a third nozzle 166c are formed. The first nozzle 169a, the second nozzle 168b, and the third nozzle 166c can spray wetting liquid WL toward the substrate W in a downwardly inclined direction. At least one of the first nozzle 169a, the second nozzle 168b, and the third nozzle 166c can be formed. For example, a plurality of first nozzles 169a, a plurality of second nozzles 168b, and a plurality of third nozzles 166c can be formed. The first nozzles 169a can be disposed between the second nozzles 169b, and the second nozzles 169b can be disposed between the third nozzles 169c. The first nozzles 169a can be disposed relatively on the inner side, and the third nozzles 169c can be disposed relatively on the outer side. Furthermore, as Figure 16 As shown, the diameters of the nozzles 169a, 168b, and 168c can be different from each other. The diameter of the nozzle 169a can be larger than that of the second nozzle 168b, and the diameter of the nozzle 169b can be larger than that of the third nozzle 166c. Furthermore, the supply flow rate of the wetting liquid WL delivered to the first nozzle 169a, second nozzle 168b, and third nozzle 168c per unit time can be the same. Therefore, regarding the spray distance of the wetting liquid WL supplied from the first nozzle 169a, second nozzle 168b, and third nozzle 166c, the first nozzle 169a can have the shortest distance, while the third nozzle 169c can have the longest. Additionally, the first nozzle 169a, second nozzle 168b, and third nozzle 168c can supply the wetting liquid WL to the edge region of the substrate W.

[0203] In the above example, the posture-changing robot 156 has been described supplying wetting fluid WL to the edge region of the substrate W; however, the inventive concept is not limited thereto. For example, as... Figure 17 As shown, the liquid supply member 177 can be fastened to the third arm 175. In addition, the liquid supply member 177 can be configured to rotate with a rotation axis parallel to the rotation axis of the fourth arm 176, and can be configured to supply wetting liquid WL to the central region of the substrate W placed on the hand 156-H.

[0204] Figure 18 This is a top view of a hand according to another embodiment of the concept of the present invention, and Figure 19 yes Figure 18 Side view of the hand.

[0205] refer to Figure 18 and Figure 19The posture-changing robot 156 may have a hand 156-H1 according to another embodiment, which may include a support body 181, a guide portion 182, a gripping body 183, a drive member 184, a rotating member 185, a rotary motor 186, a connecting body 187, and a vision member 188.

[0206] The support body 181 may have a finger shape. A guide portion 182 may be disposed at the distal end of the support body 181. The guide portion 182 may support the side portion of the substrate W, and the support body 181 may support the bottom surface of the substrate W.

[0207] The clamping body 183 can move in a certain direction via the drive member 184. The clamping body 183 can move between a clamping position for clamping the substrate W and a standby position for not clamping the substrate W via the drive member 184. The rotating member 185 can rotate the support body 181 and the substrate W about an axis, and the rotary motor 186 can transmit a driving force for rotating the rotating member 185. The connecting body 187 can be connected to the joint portion 156-R of the posture-changing robot 156. The vision member 188 can perform the same or similar functions as the vision member 167 described above. Furthermore, when the posture of the substrate W changes, similar to the vision member 167, the vision member 188 can be mounted in a position not immersed in the processing liquid L stored in the posture-changing processing tank 151.

[0208] In the above example, the substrate processing apparatus 10 according to an embodiment of the present invention includes both a single liquid processing chamber 230 and a drying chamber 240, but is not limited thereto. For example, the substrate processing apparatus 10 may include only one of the single liquid processing chamber 230 and the drying chamber 240.

[0209] In the example above, the substrate W taken from the batch processing unit 140 is transferred to the single-phase liquid processing chamber 230, and after the substrate W is processed in the single-phase liquid processing chamber 230, the substrate W is transferred to the drying chamber 240. For example, if the particle level is good, the substrate W can be transferred directly from the batch processing chamber 140 to the drying chamber 240.

[0210] The effects of this invention are not limited to those described above, and those skilled in the art to which this invention pertains can clearly understand any effects not mentioned from the specification and drawings.

[0211] Although preferred embodiments of the inventive concept have been shown and described up to now, the inventive concept is not limited to the specific embodiments described above, and it should be noted that those skilled in the art to which the inventive concept relates can perform the inventive concept differently without departing from the essence of the inventive concept as claimed in the claims, and should not be interpreted or modified in a way that is separate from the technical spirit or prospect of the inventive concept.

Claims

1. A substrate processing apparatus, comprising: A treatment tank having a receiving space for containing a treatment liquid; A support member configured to support at least one substrate in a vertical position at the receiving space; as well as A posture-changing robot is configured to change the posture of any one of the substrates immersed in the processing liquid from a vertical posture to a horizontal posture, wherein the posture change of the substrate is performed while the substrate is immersed in the processing liquid. The posture-changing robot mentioned above includes: Joints; A hand, connected to the joint portion and including a support body and a clamping body, wherein a base plate is placed on the support body, wherein the clamping body is configured to clamp the base plate placed on the support body, and wherein the hand further includes a fastening body configured to connect the clamping body and the support body to the joint portion; and A liquid supply component configured to supply wetting fluid to the substrate placed on the support body.

2. The substrate processing apparatus according to claim 1, wherein the liquid supply component comprises: At least one first nozzle, each first nozzle supplying the wetting liquid to a first region of the substrate placed on the support body; as well as At least one second nozzle, each second nozzle supplying the wetting liquid to a second region of the substrate placed on the support body, the second region being a region different from the first region.

3. The substrate processing apparatus according to claim 2, wherein the spray distance of the wetting liquid supplied from the first nozzle is different from the spray distance of the wetting liquid supplied from the second nozzle.

4. The substrate processing apparatus according to claim 3, wherein the distance between the first region and the first nozzle is shorter than the distance between the second region and the second nozzle. The first region and the second region are edge regions of the substrate, and The spray distance of the wetting fluid supplied from the first nozzle is shorter than the spray distance of the wetting fluid supplied from the second nozzle.

5. The substrate processing apparatus according to claim 4, wherein the diameter of the nozzle orifice of the first nozzle is larger than the diameter of the nozzle orifice of the second nozzle.

6. The substrate processing apparatus according to claim 5, wherein the supply flow rate of the wetting liquid delivered to the first nozzle per unit time is the same as the supply flow rate of the wetting liquid delivered to the second nozzle per unit time.

7. The substrate processing apparatus according to claim 1, wherein the liquid supply component is mounted on the support body.

8. The substrate processing apparatus according to claim 2, wherein the liquid supply component is mounted on the fastening body.

9. The substrate processing apparatus according to claim 8, wherein the liquid supply component is a supply conduit having the first nozzle and the second nozzle.

10. The substrate processing apparatus of claim 1, wherein the liquid supply member is fastened to the joint portion and configured to supply the wetting liquid to the central region of the substrate placed on the support body.

11. A substrate processing apparatus, comprising: A first process processing unit is configured to process a substrate in a batch manner. as well as A second process processing unit is configured to process the substrate in a single manner, and The first process processing unit includes: An attitude change processing tank, the attitude change processing tank being configured to have a receiving space for containing liquid; A support member, configured to support at least one substrate in a vertical position within the receiving space; and A posture-changing robot is configured to change the posture of any one of the substrates immersed in the liquid from a vertical posture to a horizontal posture, wherein the posture change of the substrate is performed while the substrate is immersed in the liquid. The posture-changing robot mentioned above includes: The joint portion is a multi-joint arm consisting of at least two axes; A hand, connected to the joint portion and including a support body and a clamping body, wherein a base plate is placed on the support body, wherein the clamping body is configured to clamp the base plate placed on the support body, and wherein the hand further includes a fastening body configured to connect the clamping body and the support body to the joint portion to change the position of the clamping body and the support body via the joint portion; and A liquid supply component configured to supply wetting fluid to the substrate placed on the support body.

12. The substrate processing apparatus of claim 11, wherein the liquid supply component comprises: At least one first nozzle supplies the wetting liquid to a first region of the substrate placed on the support body; as well as At least one second nozzle for supplying the wetting liquid to a second region of the substrate placed on the support body, the second region being a region different from the first region.

13. The substrate processing apparatus of claim 12, wherein the spray distance of the wetting liquid supplied from the first nozzle is different from the spray distance of the wetting liquid supplied from the second nozzle.

14. The substrate processing apparatus of claim 13, wherein the distance between the first region and the first nozzle is shorter than the distance between the second region and the second nozzle, and The first region and the second region are edge regions of the substrate, and The spray distance of the wetting fluid supplied from the first nozzle is shorter than the spray distance of the wetting fluid supplied from the second nozzle.

15. The substrate processing apparatus according to claim 14, wherein the diameter of the nozzle orifice of the first nozzle is smaller than the diameter of the nozzle orifice of the second nozzle.

16. The substrate processing apparatus of claim 15, wherein the supply flow rate of the wetting liquid delivered to the first nozzle per unit time is the same as the supply flow rate of the wetting liquid delivered to the second nozzle per unit time.

17. A substrate processing apparatus, comprising: A first process processing unit is configured to process at least one substrate in a batch manner. A second process processing unit is configured to process the substrate in a single manner; as well as Controller The first process processing unit includes: Batch processing tank, the batch processing tank being configured to process the substrate in a vertical orientation; An orientation change processing tank, configured to change the orientation of any one of the substrates from a vertical orientation to a horizontal orientation, the orientation change processing tank having a receiving space for containing liquid and a support member for supporting the substrate in the vertical orientation at the receiving space; and A posture-changing robot is configured to change the posture of a substrate immersed in a liquid from a vertical posture to a horizontal posture, wherein the posture change of the substrate is performed while the substrate is immersed in the liquid. The posture-changing robot mentioned above includes: The joint portion is a multi-joint arm consisting of at least two axes; A hand, connected to the joint portion and including a support body and a clamping body, wherein a base plate is placed on the support body, wherein the clamping body is configured to clamp the base plate placed on the support body, and wherein the hand further includes a fastening body configured to connect the clamping body and the support body to the joint portion to change the position of the clamping body and the support body via the joint portion; and A liquid supply component configured to supply wetting fluid to the substrate placed on the support body, and The second process processing unit includes: A single processing chamber configured to process the substrate in the horizontal orientation; A buffer unit, configured to provide space for temporarily storing the substrate; and A transfer robot, configured to transfer the substrate between the buffer unit and the single-unit processing chamber, and The controller controls the posture-changing robot, enabling the robot to change the posture of the substrate and transfer the changed posture substrate to the buffer unit.

18. The substrate processing apparatus of claim 17, wherein the controller controls the posture-changing robot to perform the posture change of the substrate; moves the substrate such that the substrate deviates from the liquid stored in the posture-changing processing tank; and if the substrate deviates from the liquid, the wetting liquid is supplied to the substrate by the liquid supply member.

Images