Mcm package structure and method of manufacturing the same

CN115881712BActive Publication Date: 2026-08-28WUXI CHINA RESOURCE MICRO ASSEMBLY TECH
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Patent Information

Application Number
CN202111138572.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-09-27
Publication Date
2026-08-28
Estimated Expiration
2041-09-27

AI Technical Summary

Technical Problem

封装技术不但影响产品的性能，而且还制约产品的小型化

Benefits of technology

[0044]与现有技术相比，本发明的有益效果在于：利用第一导电柱、第二导电柱、第一金属片以及第二金属片，可将第一芯片与第二芯片堆叠封装起来，相对于第一芯片与第二芯片平摊于引线框架的封装方式，可实现封装结构的体积小、结构紧凑、集成度高的需求。

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Abstract

The application provides an MCM packaging structure and a manufacturing method thereof. The MCM packaging structure comprises a lead frame, a first chip, a first conductive column, a second conductive column, a first metal sheet, a second chip, a second metal sheet and a plastic sealing layer. The lead frame comprises at least a base island, a first pin, a second pin and a third pin. The first chip comprises a first gate, a first electrode and a second electrode, the first gate is connected to the first pin, and the first electrode is connected to the base island. The first end of the first conductive column is connected to the second pin. The third end of the second conductive column is connected to the third pin. The first metal sheet is connected to the second electrode and the first conductive column respectively. The second chip comprises a second gate, a third electrode and a fourth electrode, and the fourth electrode is connected to the first metal sheet. The second metal sheet is connected to the third electrode and the second conductive column respectively. The plastic sealing layer exposes the base island, the first pin, the second pin and the third pin. The packaging structure can meet the requirements of small size, compact structure and high integration.
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Citation Information

Patent Citations

  • Packaging-prior-to-etching chip-normally-bonded type three-dimensional system-level metal circuit board structure and process method thereof

    CN103400772A

  • Packaging-prior-to-etching passive device type three-dimensional system-level metal circuit board structure and process method thereof

    CN103400773A