Display module, manufacturing method of display module and display device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
- Filing Date
- 2021-09-27
- Publication Date
- 2026-06-26
Smart Images
Figure CN115881877B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of LED display technology, and in particular to a display module, a method for manufacturing the display module, and a display device. Background Technology
[0002] LED displays (Light Emitting Diodes) have become a popular display technology due to their energy-saving, environmentally friendly, and efficient advantages. However, as LED displays continue to develop, people are becoming increasingly demanding in terms of visual appeal, contrast, brightness, and lifespan. Consequently, the requirements for LED display manufacturing processes are also becoming more stringent. Currently, the complex structure and manufacturing process of LED displays hinder their development. Summary of the Invention
[0003] This invention provides a display module, a method for manufacturing the display module, and a display device to simplify the structure and manufacturing process of the display module.
[0004] In a first aspect, embodiments of the present invention provide a display module, comprising:
[0005] A transparent substrate has a first surface and a second surface disposed opposite to each other. At least one set of grooves is provided on the first surface of the transparent substrate. Each set of grooves includes a pad groove, a connection groove and a pin groove. The connection groove connects the pad groove and the pin groove.
[0006] A conductive layer, the conductive layer including at least one chip region, the chip region being provided with pads, connection structures and pins, the pads being connected to the pins through the connection structures;
[0007] The pads are correspondingly disposed in the pad slots, the connection structures are correspondingly disposed in the connection slots, and the pins are correspondingly disposed in the pin slots.
[0008] A connection terminal is provided on the side of the pin away from the transparent substrate, and the connection terminal is connected to the pin;
[0009] A light-emitting chip is disposed on the side of the pad away from the transparent substrate, and the electrodes of the light-emitting chip are connected to the pad;
[0010] An encapsulation layer that covers the conductive layer and the light-emitting chip, and exposes the connection terminals.
[0011] Optionally, each group of the grooves includes 2m pad grooves, m+1 connection grooves and m+1 pin grooves, and the 2m pad grooves form m pad groove groups, where m is a positive integer greater than or equal to 2;
[0012] Different groups of pad slots are arranged along the column direction. Each group of pad slots includes two pad slots arranged along the row direction. The two pads in a group of pad slots are connected to the two electrodes of a light-emitting chip.
[0013] One of the connection slots connects a row of the pad slots and a pin slot, and the connection structure disposed in one of the connection slots connects the pads disposed in a row of the pad slots and the pins disposed in a pin slot;
[0014] In the other column, each of the pad slots is connected to a pin slot via a connection slot, and the pads in each of the pad slots in the other column are connected to the pins in the pin slot via a connection structure in a connection slot.
[0015] Optionally, the second surface is the light-emitting surface of the display module.
[0016] Optionally, along the thickness direction of the transparent substrate, the distance from the surface of the connection structure away from the transparent substrate to the transparent substrate is less than the distance from the surface of the pad away from the transparent substrate to the transparent substrate.
[0017] Optionally, the ratio of the distance from the surface of the connection structure away from the transparent substrate to the transparent substrate to the distance from the surface of the pad away from the transparent substrate to the transparent substrate is in the range of 1 / 5 to 2 / 3.
[0018] Optionally, along the thickness direction of the transparent substrate, the difference between the distance from the surface of the connecting terminal away from the transparent substrate to the transparent substrate and the distance from the surface of the encapsulation layer away from the transparent substrate to the transparent substrate is in the range of 5 to 10 μm.
[0019] Optionally, the display module further includes a shielding layer disposed between the transparent substrate and the encapsulation layer, and exposing the pads and the pins.
[0020] Optionally, the display module further includes an adhesive layer disposed between the pads and the electrodes of the light-emitting chip, the adhesive layer being used to connect the pads and the electrodes of the light-emitting chip.
[0021] Secondly, embodiments of the present invention also provide a method for manufacturing a display module, comprising:
[0022] At least one set of grooves is formed on a transparent substrate, each set of grooves including a pad groove, a connection groove and a pin groove, wherein the connection groove connects the pad groove and the pin groove;
[0023] A conductive layer is formed in the groove. The conductive layer includes at least one chip area. The chip area is provided with pads, connection structures, and pins. The pads are connected to the pins through the connection structures. The pads are correspondingly disposed in the pad groove, the connection structures are correspondingly disposed in the connection groove, and the pins are correspondingly disposed in the pin groove.
[0024] A light-emitting chip is placed on the side of the pad away from the transparent substrate, and the electrodes of the light-emitting chip are connected to the pad.
[0025] A connection terminal is formed on the side of the pin away from the transparent substrate, so that the connection terminal is connected to the pin;
[0026] An encapsulation layer is formed, which covers the conductive layer and the light-emitting chip, and exposes the connection terminals.
[0027] Optionally, before placing the light-emitting chip on the side of the pads away from the transparent substrate, the method further includes:
[0028] A shielding layer is formed on the surface of the transparent substrate, the shielding layer exposing the pads and the pins.
[0029] Thirdly, embodiments of the present invention also provide a display device, which is formed by cutting the display module provided in the first aspect, wherein the cutting lines of the display module are disposed between adjacent chip areas.
[0030] The technical solution of this invention, because the conductive layer in the display module is disposed within the groove of the transparent substrate, allows the pads in the pad groove to be connected to the pins in the pin groove through the connection structure in the connection groove. In subsequent processes, the connection between the light-emitting chip and the connection terminal can be achieved, thereby connecting the light-emitting chip to the input terminal of the display module. Therefore, a single conductive layer disposed within the groove of the transparent substrate can form a wiring layer, simplifying the structure of the wiring layer in the display module in the prior art and reducing the manufacturing difficulty of the wiring layer. Then, by encapsulating the conductive layer and the light-emitting chip with an encapsulation layer and exposing the connection terminal, integrated packaging of the display module can be achieved. The display module can also be directly used to form a display screen, simplifying the process steps of forming a display screen from the display module and improving the efficiency of display screen manufacturing. Attached Figure Description
[0031] Figure 1 A cross-sectional structural diagram of an LED display module provided for the prior art;
[0032] Figure 2 This is a partial top view of a display module provided in an embodiment of the present invention;
[0033] Figure 3 This is a partial front view schematic diagram of a display module provided in an embodiment of the present invention;
[0034] Figure 4 This is a partial front view schematic diagram of another display module provided in an embodiment of the present invention;
[0035] Figure 5 This is a partial front view schematic diagram of another display module provided in an embodiment of the present invention;
[0036] Figure 6 A flowchart illustrating a method for manufacturing a display module according to an embodiment of the present invention;
[0037] Figure 7 This is a partial top view of a display module corresponding to step S610;
[0038] Figure 8 This is a partial front view structural diagram of a display module corresponding to step S610;
[0039] Figure 9 This is a partial top view of a display module corresponding to step S620;
[0040] Figure 10 This is a partial front view structural diagram of a display module corresponding to step S620;
[0041] Figure 11 This is a partial top view of a display module corresponding to step S630;
[0042] Figure 12 This is a partial front view structural diagram of a display module corresponding to step S630;
[0043] Figure 13 This is a partial top view of a display module corresponding to step S640;
[0044] Figure 14 This is a partial front view structural diagram of a display module corresponding to step S640;
[0045] Figure 15 This is a partial top view of a display module corresponding to step S650;
[0046] Figure 16 This is a partial front view structural diagram of a display module corresponding to step S650;
[0047] Figure 17 A top view schematic diagram of a display module corresponding to the formation of a shielding layer;
[0048] Figure 18 This is a partial front view schematic diagram of a display module corresponding to the formation of a shielding layer. Detailed Implementation
[0049] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.
[0050] Figure 1 This is a cross-sectional structural diagram of an LED display module provided by the prior art. (Example:) Figure 1 As shown, the LED display module includes pads 01, a wiring layer 02, pins 03, light-emitting chips 04, and an encapsulation layer 05. When the LED display module is used to manufacture an LED display screen, there can be multiple light-emitting chips 04, namely red, green, and blue light-emitting chips. The wiring layer 02 includes at least two layers for connecting the pins 03 and the pads 01. The pads 01 and pins 03 are respectively disposed on both sides of the wiring layer 02. The pads 01 are connected to the light-emitting chips 04, thereby connecting the light-emitting chips 04 to the wiring layer 02. At the same time, the wiring layer 02 is connected to the pins 03, thereby connecting the pins 03 to the light-emitting chips 04, so that the pins 03 can serve as connection terminals between the LED display module and an external driver circuit board 06. The encapsulation layer 05 is disposed on the side of the light-emitting chips 04 away from the pads 01, for encapsulating the light-emitting chips 04, thus forming the LED display module. In existing LED display modules, the wiring layer 02 typically requires 2-6 layers of wiring design to achieve the electrical connection between pads 01 and pins 03. This not only complicates the structure of the wiring layer 02 but also increases the complexity of its manufacturing process, thereby complicating the structure and manufacturing process of the LED display module. Using this LED display module to manufacture LED displays complicates the manufacturing process and reduces the efficiency of LED display production.
[0051] To address the aforementioned technical problems, embodiments of the present invention provide a display module. Figure 2 This is a partial top view of a display module provided in an embodiment of the present invention. Figure 3 This is a partial front view schematic diagram of a display module provided in an embodiment of the present invention. Figure 2 and Figure 3 As shown, the display module includes:
[0052] Transparent substrate 110 has a first surface 111 and a second surface 112 disposed opposite to each other. At least one set of grooves 10 are provided on the first surface 111 of the transparent substrate 110. Each set of grooves 10 includes a pad groove 101, a connection groove 102 and a pin groove 103. The connection groove 102 connects the pad groove 101 and the pin groove 103.
[0053] The conductive layer 120 includes at least one chip region 20. The chip region 20 is provided with pads 121, connection structures 122 and pins 123. The pads 121 are connected to the pins 123 through the connection structures 122.
[0054] The pad 121 is correspondingly disposed in the pad groove 101, the connection structure 122 is correspondingly disposed in the connection groove 102, and the pin 123 is correspondingly disposed in the pin groove 103.
[0055] A connection terminal 130 is provided on the side of pin 123 away from the transparent substrate 110, and the connection terminal 130 is connected to pin 123;
[0056] The light-emitting chip 140 is disposed on the side of the pad 121 away from the transparent substrate 110, and the electrodes of the light-emitting chip 140 are connected to the pad 121.
[0057] The encapsulation layer 150 covers the conductive layer 120 and the light-emitting chip 140, and exposes the connection terminals 130.
[0058] Specifically, the transparent substrate 110 has a relatively high light transmittance, and after forming the display module, it can serve as the light-emitting side of the display module. In addition, the transparent substrate 110 has high rigidity, which facilitates the creation of grooves 10 on the transparent substrate 110 while ensuring its function of supporting the display module. For example, the material of the transparent substrate 110 can be any one of glass, sapphire, quartz, and translucent acrylic glass. The grooves 10 on the transparent substrate 110 can be achieved by methods such as laser ablation or mechanical drilling. The depth of the grooves 10 is less than the thickness of the transparent substrate 110 to ensure that the transparent substrate 110 supports the light-emitting chip 140. During the fabrication of the display module, a large number of grooves 10 can be formed on the transparent substrate 110, and each groove 10 can subsequently form a single display device.
[0059] The conductive layer 120 can be a metal layer. By filling the groove 10 with the conductive layer 120, a circuit can be formed according to the shape of the groove 10 for subsequent connection of the light-emitting chip 140 to an external driving circuit board. For example, when the conductive layer 120 fills the groove 10, the conductive layer 120 filled in the pad groove 101 can form a pad 121, the conductive layer 120 filled in the connection groove 102 can form a connection structure 122, and the conductive layer 120 filled in the pin groove 103 can form a pin 123. Since the connection groove 102 connects the pad groove 101 and the pin groove 103, the pad 121 is connected to the pin 123 through the connection structure 122. Along the thickness direction X of the transparent substrate, the thickness of the pad 121 and the pin 123 is equal to the depth of the groove 10, so that the surface of the pad 121 and the pin 123 is flush with the surface of the transparent substrate 110. This not only facilitates the subsequent bonding of the light-emitting chip 140, but also protects the circuit formed by the conductive layer 120 through the groove 10. The conductive layer 120 can be formed by methods such as chemical vapor deposition, electroplating, bonding copper sheets, and coating.
[0060] A connection terminal 130 is located on the side of pin 123 away from the transparent substrate 110. The connection terminal 130 is connected to pin 123 and can serve as an input terminal for the display module. In subsequent processes, the connection terminal 130 can be connected to an external driver circuit board to provide drive signals to the display module. When forming the connection terminal 130, a flux-and-solder-ball bonding process or a solder paste-and-solder-ball bonding process can be used to ensure fast, efficient, and precise soldering between the connection terminal 130 and pin 123. The shape of the connection terminal 130 can be arbitrary. For example, refer to... Figure 2 and Figure 3 The connecting terminal 130 can be cylindrical.
[0061] The light-emitting chip 140 can be a miniature LED chip, and it can include P-type electrodes and N-type electrodes, serving as the positive and negative electrodes of the chip 140, respectively. By connecting the electrodes of the light-emitting chip 140 to the pads 121, an electrical connection between the chip 140 and the connection terminal 130 can be achieved. Each pad 121 within the chip area 20 can connect to multiple light-emitting chips 140, allowing them to output different colors of light, such as red, green, and blue, for full-color display in the display module. Furthermore, the light-emitting chip 140 can be a flip-chip directly mounted on the pads 121, enabling it to be used as a flip-chip. This increases the selectable types of light-emitting chips 140 and simplifies the connection process between the chip 140 and the pads 121. The light-emitting chip 140 can also be a flip-chip light-emitting chip. The electrodes of the light-emitting chip 140 are flip-chipped onto the pad 121 through a flip-chip process, thereby achieving electrical connection between the light-emitting chip 140 and the connection terminal 130.
[0062] The encapsulation layer 150 covers the conductive layer 120 and the light-emitting chip 140, serving to seal and protect the light-emitting chip 140. Simultaneously, the encapsulation layer 150 exposes connection terminals 130, which protrude relative to the encapsulation layer 150. This makes the connection terminals 130 equivalent to connection pins between the display module and an external driving circuit board, facilitating the connection between the display module and the external driving circuit board. Furthermore, the material of the encapsulation layer 150 can be epoxy resin doped with black filler, silicone doped with black filler, or silicone resin doped with black filler. The black filler can contain light-absorbing substances such as carbon black to reduce the light transmittance of the encapsulation layer 150, improve the contrast of the display module, and prevent crosstalk between adjacent chip areas 20. The encapsulation layer 150 can be formed using processes such as potting, underfilling, or injection molding.
[0063] It should be noted that when forming the conductive layer 120, uniform lines can be formed on the same plane according to the shape of the grooves 10 through methods such as chemical vapor deposition, electroplating, copper sheet bonding, and coating. When different grooves 10 are not connected, the light-emitting chips 140 corresponding to different grooves 10 are mutually insulated. When there are a large number of grooves 10 on the transparent substrate 110, the light-emitting chips 140 corresponding to the large number of grooves 10 can be directly connected to the driving circuit board to form a display screen. However, the electroplating method requires connecting the lines corresponding to all grooves 10 and forming the conductive layer 120 by increasing the external current. When there are a large number of grooves 10 on the transparent substrate 110, the light-emitting chips 140 corresponding to different grooves 10 are short-circuited to each other. The light-emitting chips 140 corresponding to the large number of grooves 10 need to be cut to form individual display devices, and then glued to form a display screen.
[0064] In this embodiment, the conductive layer 120 in the display module is disposed within the groove 10 of the transparent substrate 110. This allows the pads 121 in the pad groove 101 to connect to the pins 123 in the pin groove 103 via the connection structure 122 in the connection groove 102. In subsequent processes, the light-emitting chip 140 can be connected to the connection terminal 130, thereby connecting the light-emitting chip 140 to the input terminal of the display module. Therefore, a single conductive layer 120 disposed within the groove 10 of the transparent substrate 110 can form a wiring layer, simplifying the structure of the wiring layer in the display module in the prior art. This reduces the process difficulty of the wiring layer and consequently lowers the manufacturing difficulty of the display module. Then, the light-emitting chip 140 is encapsulated by the encapsulation layer 150, exposing the connection terminal 130. This achieves integrated packaging of the display module, allowing it to be used directly to form a display screen. This simplifies the process steps of forming a display screen from the display module and improves the efficiency of display screen manufacturing.
[0065] Continue to refer to Figure 2 and Figure 3 Each set of grooves 10 includes 2m pad grooves 101, m+1 connection grooves 102 and m+1 pin grooves 103. The 2m pad grooves 101 form m pad groove groups, where m is a positive integer greater than or equal to 2.
[0066] Different groups of pad slots are arranged along the column direction Y. Each group of pad slots includes two pad slots 101 arranged along the row direction Z. Two pads 121 in a group of pad slots are connected to the two electrodes of a light-emitting chip 140.
[0067] A connection slot 102 connects a row of pad slots 101 and a pin slot 103. A connection structure 122 disposed in a connection slot 102 connects the pads 121 disposed in a row of pad slots 101 and the pins 123 disposed in a pin slot 103.
[0068] In the other column, each pad slot 101 is connected to a pin slot 103 through a connecting slot 102. The pads 121 in each pad slot 101 in the other column are connected to the pins 123 in a pin slot 103 through a connecting structure 122 in a connecting slot 102.
[0069] Specifically, each chip region 20 may include at least two light-emitting chips 140. The light-emitting chips 140 may emit the same or different colors, thereby increasing the brightness of the chip region 20 or making the emitted color a mixed color. Each set of recesses 10 includes at least two sets of pad slots for correspondingly connecting different light-emitting chips 140. Two pads 121 disposed in a set of pad slots are correspondingly connected to the two electrodes of a light-emitting chip 140. When the two pad slots 101 in each set of pad slots are arranged along the row direction Z, the two electrodes of the light-emitting chip 140 are arranged along the row direction Z. Different sets of pad slots are arranged along the column direction Y, so that at least two light-emitting chips 140 are arranged along the column direction Y. When driving at least two light-emitting chips 140 to emit light, one electrode of each of the at least two light-emitting chips 140 can be connected together. That is, a row of pad slots 101 is connected to a pin slot 103 through a connecting slot 102, and a row of pads 121 is connected to a pin 123 through a connecting structure 122, thereby realizing the common cathode or common anode of at least two light-emitting chips 140. Then, each pad slot 101 in another row is connected to a pin slot 103 through a connecting slot 102, and each pad 121 in the other row is connected to a pin 123 through a connecting structure 122. This allows the other electrode of each of the at least two light-emitting chips 140 to be connected to different pins 123, thereby enabling the other electrode of each of the at least two light-emitting chips 140 to receive signals provided by an external driving circuit board through different connecting terminals 130. This allows for individual control of each light-emitting chip 140, which is beneficial for adjusting the light emission of the display module.
[0070] For example, when the display module is used for full-color display, each set of grooves 10 includes three sets of pad groove groups consisting of six pad grooves 101, four connection grooves 102 and four pin grooves 103. The different sets of pad groove groups are arranged along the column direction Y. Each set of pad groove groups includes two pad grooves 101 arranged along the row direction Z. Two pads 121 in a set of pad groove groups are connected to two electrodes of a light-emitting chip 140. A connection groove 102 connects a column of pad grooves 101 and a pin groove 103. A connection structure 122 in a connection groove 102 connects the pads 121 in a column of pad grooves 101 and the pins 123 in a pin groove 103. In another column, each pad groove 101 is connected to a pin groove 103 through a connection groove 102. In another column, each pad 121 in each pad groove 101 is connected to a pin 123 in a pin groove 103 through a connection structure 122 in a connection groove 102. For example, each chip area 20 of the display module can be equipped with three light-emitting chips 140, namely a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip. Each light-emitting chip 140 includes two electrodes, and the two electrodes of each light-emitting chip 140 can correspond to a set of pad slots 101. The two pad slots 101 of each set of pad slots 101 are arranged along the row direction Z, such that the pads 121 corresponding to the two pad slots 101 are arranged along the row direction Z. Thus, the two electrodes of the light-emitting chip 140 are arranged along the row direction Z and connected to the two pads 121 corresponding to the set of pad slots 101. Since the pad slots 101 of different sets are arranged along the column direction Y, the three light-emitting chips 140 can be arranged along the column direction Y. When driving the three light-emitting chips 140 to emit light, one electrode of the three light-emitting chips 140 can be connected together and input the same signal to realize the common cathode or common anode of the light-emitting chips 140. At this time, a row of pad slots 101 can be connected through a connecting slot 102, and simultaneously connected to a pin slot 103, so that the pads 121 corresponding to the row of pad slots 101 are connected together, and simultaneously connected to the pins 123 corresponding to the pin slot 103, realizing the connection of one electrode of the three light-emitting chips 140, and inputting signals provided by the external driver circuit board through a connecting terminal 130. In addition, the three pad slots 101 corresponding to the other electrode of the three light-emitting chips 140 are respectively connected to a pin slot 103 through a connecting slot 102, so that after the other electrode of the light-emitting chip 140 is connected to the pad 121 in a pad slot 101, it is then connected to the pin 123 in a pin slot 103 through the connecting structure 122 in a connecting slot 102, so that the other electrode of the three light-emitting chips 140 can be respectively used as an input terminal by a connecting terminal 130 to input signals provided by the external driver circuit board.Since the other electrode of the chip with different light emission colors in the display module provides driving signals through different connection terminals 130, it is possible to control each light emission chip 140 individually, which is beneficial for adjusting the light emission of the display module.
[0071] Based on the above technical solutions, the second surface 112 is the light-emitting surface of the display module.
[0072] Specifically, since the conductive layer 120, connection terminal 130, light-emitting chip 140, and encapsulation layer 150 in the display module are all disposed on the same side of the transparent substrate 110, and the connection terminal 130 is used to connect to an external driving circuit board to provide driving signals to the display module, the light from the display module is emitted from the second surface 112 of the transparent substrate 110, that is, the second surface 112 of the transparent substrate 110 is the light-emitting surface of the display module. Because the transparent substrate 110 has excellent light transmittance, directly using the transparent substrate 110 as the light-emitting surface of the display module can reduce light loss in the display module, thereby ensuring the brightness and contrast of the displayed module.
[0073] Continue to refer to Figure 2 and Figure 3 Along the thickness direction X of the transparent substrate, the distance from the surface of the connection structure 122 away from the transparent substrate 110 to the transparent substrate 110 is less than the distance from the surface of the pad 121 away from the transparent substrate 110 to the transparent substrate 110.
[0074] Specifically, by setting the distance from the surface of the connection structure 122 away from the transparent substrate 110 to the transparent substrate 110 to be less than the distance from the surface of the pad 121 away from the transparent substrate 110 to the transparent substrate 110, the connection between the light-emitting chip 140 and the pad 121 can be facilitated. Simultaneously, the bonding force between the encapsulation layer 150 and the conductive layer 120 can be increased, improving the hermeticity of the display module. For example, when the light-emitting chip 140 is connected to the pad 121 via a die-bonding process, if the height of the connection structure 122 is too high, the stencil used for applying solder paste to the pad 121 will contact the connection structure 122 first, making it difficult to apply the solder paste to the pad 121. Furthermore, during die bonding, the excessive height of the connection structure 122 can cause the light-emitting chip 140 to bounce off the connection structure 122, resulting in the light-emitting chip 140 shifting.
[0075] Based on the above technical solutions, the ratio of the distance from the surface of the connection structure 122 away from the transparent substrate 110 to the distance from the surface of the pad 121 away from the transparent substrate 110 to the transparent substrate 110 is in the range of 1 / 5 to 2 / 3, thereby minimizing the impact of the connection structure 122 on the connection between the light-emitting chip 140 and the pad 121. Simultaneously, it also ensures the reliability of the connection structure 122 in connecting the pad 121 and the pin 123.
[0076] Based on the above technical solutions, along the thickness direction X of the transparent substrate, the difference between the distance from the surface of the connecting terminal 130 away from the transparent substrate 110 to the transparent substrate 110 and the distance from the surface of the encapsulation layer 150 away from the transparent substrate 110 to the transparent substrate 110 is in the range of 5 to 10 μm.
[0077] Specifically, the connection terminal 130 has a protrusion relative to the encapsulation layer 150, which facilitates connection of the connection terminal 130 to an external driving circuit board, thereby simplifying the use of the display module. By setting the difference between the distance from the surface of the connection terminal 130 away from the transparent substrate 110 and the distance from the surface of the encapsulation layer 150 away from the transparent substrate 110 to the transparent substrate 110 is greater than or equal to 5μm, that is, the protrusion height of the connection terminal 130 relative to the encapsulation layer 150 is greater than or equal to 5μm, the convenience of connecting the connection terminal 130 to the external driving circuit board can be ensured. At the same time, setting the difference between the distance from the surface of the connection terminal 130 away from the transparent substrate 110 and the distance from the surface of the encapsulation layer 150 away from the transparent substrate 110 to the transparent substrate 110 is less than or equal to 10μm, that is, the protrusion height of the connection terminal 130 relative to the encapsulation layer 150 is less than or equal to 10μm, it is beneficial to reduce the thickness of the display device formed by the display module and the driving circuit board, thereby achieving a thinner and lighter display device.
[0078] Figure 4 This is a partial front view schematic diagram of another display module provided in an embodiment of the present invention. (See attached diagram.) Figure 4 As shown, the display module also includes a shielding layer 160, which is disposed between the transparent substrate 110 and the encapsulation layer 150 and exposes the pads 121 and pins 123.
[0079] Specifically, after forming the conductive layer 120 within the groove 10, a shielding layer 160 can be formed on the surface of the transparent substrate 110. The shielding layer 160 can be made of epoxy resin doped with black filler, silicone doped with black filler, or silicone resin doped with black filler, wherein the black filler can contain light-absorbing substances such as carbon black. The shielding layer 160 can be formed through processes such as coating, vapor deposition, mounting, and exposure and development. When the shielding layer 160 is disposed between the transparent substrate 110 and the encapsulation layer 150, and exposes the pads 121 and pins 123, the shielding layer 160 covers the connection structure 122. At this time, when the light-emitting chip 140 is placed on the pads 121, the shielding layer prevents the adhesive material between the light-emitting chip 140 and the pads 121 from spreading and climbing along the connection structure 102, effectively preventing the light-emitting chip 140 from shifting or making poor contact. Simultaneously, it increases the bonding force between the encapsulation layer 150 and the conductive layer 120, improving the hermeticity of the display module. For example, when the light-emitting chip 140 is connected to the pad 121 using a die-bonding process, an adhesive material such as solder paste is also provided between the pad 121 and the light-emitting chip 140. When the shielding layer 160 covers the connection structure 122, it can prevent the solder paste from spreading and climbing along the connection structure 122 during the die-bonding process, thereby effectively preventing the light-emitting chip 140 from shifting or making poor contact during die bonding. In addition, the color of the shielding layer 160 can be set to be lighter than the color of the encapsulation layer 150, thereby improving the contrast and light-emitting effect of the display module. For example, when both the encapsulation layer 150 and the shielding layer 160 are black, the black of the encapsulation layer 150 is darker than the black of the shielding layer 160.
[0080] It should be noted that the shielding layer 160 can also be formed when the encapsulation layer 150 is formed. In this case, the shielding layer 160 can cover the light-emitting chip 140 and be reused as the encapsulation layer 150, which can prevent light leakage between the light-emitting chips 140 and seal and protect the light-emitting chips 140.
[0081] Figure 5 This is a partial front view schematic diagram of another display module provided in an embodiment of the present invention. (See attached diagram.) Figure 5 As shown, the display module also includes an adhesive layer 170, which is disposed between the pad 121 and the electrode of the light-emitting chip 140. The adhesive layer 170 is used to connect the pad 121 and the electrode of the light-emitting chip 140.
[0082] Specifically, the adhesive layer 170 can be formed by stencil printing, and the material of the adhesive layer 170 can be solder paste, silver paste, etc. By forming the adhesive layer 170 between the electrodes of the light-emitting chip 140 and the pads 121, the pads 121, the adhesive layer 170 and the electrodes of the light-emitting chip 140 are correspondingly arranged, and then the connection between the electrodes of the light-emitting chip 140, the adhesive layer 170 and the pads 121 is achieved by the die bonding process.
[0083] This invention also provides a method for manufacturing a display module. Figure 6 This is a flowchart illustrating a method for manufacturing a display module according to an embodiment of the present invention. Figure 6 As shown, the method includes:
[0084] S610. At least one set of grooves is formed on a transparent substrate, each set of grooves including a pad groove, a connection groove and a pin groove, the connection groove connecting the pad groove and the pin groove.
[0085] Specifically, Figure 7 This is a partial top view of a display module corresponding to step S610. Figure 8 This is a partial front view structural diagram of a display module corresponding to step S610. For example... Figure 7 and Figure 8 As shown, six sets of grooves 10 are exemplary disposed on the transparent substrate 110. Each set of grooves 10 includes a pad groove 101, a connection groove 102, and a pin groove 103. The connection groove 102 connects the pad groove 101 and the pin groove 103. Exemplarily, each set of grooves 10 includes three sets of pad groove groups consisting of six pad grooves 101, four connection grooves 102, and four pin grooves 103. Different sets of pad groove groups are arranged along the column direction. Each set of pad groove groups includes two pad grooves 101 arranged along the row direction. One connection groove 102 connects one column of pad grooves 101 and one pin groove 103. In another column, each pad groove 101 is connected to another three pin grooves 103 through the other three connection grooves 102.
[0086] S620. A conductive layer is formed in the groove. The conductive layer includes at least one chip area. The chip area is provided with pads, connection structures and pins. The pads are connected to the pins through the connection structures. The pads are correspondingly disposed in the pad groove, the connection structures are correspondingly disposed in the connection groove, and the pins are correspondingly disposed in the pin groove.
[0087] Specifically, Figure 9 This is a partial top view of a display module corresponding to step S620. Figure 10 This is a partial front view structural diagram of a display module corresponding to step S620. For example... Figure 9 and Figure 10As shown, when the conductive layer 120 fills the groove 10, the conductive layer 120 filled in the pad groove 101 can form a pad 121, the conductive layer 120 filled in the connection groove 102 can form a connection structure 122, and the conductive layer 120 filled in the pin groove 103 can form a pin 123. For example, when each group of grooves 10 includes three groups of pad grooves consisting of six pad grooves 101, four connection grooves 102 and four pin grooves 103, then each chip area 20 includes three groups of pads consisting of six pads 121, four connection structures 122 and four pins 123. The pad groups of different groups are arranged along the column direction. Each group of pads includes two pads 121 arranged along the row direction. One connection structure 122 connects one column of pads 121 and one pin 123. In another column, each pad 121 is connected to another three pins 123 through another three connection structures 122.
[0088] S630. Place the light-emitting chip on the side of the pad away from the transparent substrate, so that the electrodes of the light-emitting chip are connected to the pad.
[0089] Specifically, Figure 11 This is a partial top view of a display module corresponding to step S630. Figure 12 This is a partial front view structural diagram of a display module corresponding to step S630. For example... Figure 11 and Figure 12 As shown, the electrodes of the light-emitting chip 140 are connected to the pads 121, which enables the fixing and connection of the light-emitting chip 140. For example, each chip area 20 is provided with three light-emitting chips 140, corresponding to a red, green, and blue light-emitting chip respectively. Two electrodes of each light-emitting chip 140 are connected to two pads 121. The three pads 121 of the same polarity connecting the three light-emitting chips 140 are connected to a pin 123 through a connection structure 122, achieving a common cathode or common anode connection for the three light-emitting chips. The other pad 121 of the same polarity among the three light-emitting chips 140 is connected to a pin 123 through a connection structure 122, enabling individual control of the three light-emitting chips. In addition, before placing the light-emitting chip 140 on the side of the conductive layer 120 away from the transparent substrate 110 and connecting the electrodes of the light-emitting chip 140 to the pad 121, an adhesive layer can be first provided on the side of the pad 121 away from the transparent substrate 110; then, the light-emitting chip 140 is placed on the side of the adhesive layer away from the conductive layer 120, so that the electrodes of the light-emitting chip 140 are positioned opposite to the adhesive layer; finally, the die bonding process is used to connect the electrodes of the chip 140 and the pad 121 through the adhesive layer.
[0090] S640: A connection terminal is formed on the side of the pin away from the transparent substrate, so that the connection terminal is connected to the pin;
[0091] Specifically, Figure 13 This is a partial top view of a display module corresponding to step S640. Figure 14 This is a partial front view structural diagram of a display module corresponding to step S640. For example... Figure 13 and Figure 14 As shown, a connection terminal 130 is formed on pin 123. The connection terminal 130 can be used as the input terminal of the display module to connect with an external driving circuit board and provide a driving signal to the display module.
[0092] It should be noted that the order of steps S630 and S640 is not limited. In other embodiments, a connection terminal 130 may be formed first on the side of pin 123 away from the transparent substrate 110, so that the connection terminal 130 is connected to pin 123, and then a light-emitting chip 140 is placed on the side of pad 121 away from the transparent substrate 110, so that the electrode of the light-emitting chip 140 is connected to pad 121. This is not limited here.
[0093] S650: Form an encapsulation layer that covers the conductive layer and the light-emitting chip, and exposes the connection terminals.
[0094] Specifically, Figure 15 This is a partial top view of a display module corresponding to step S650. Figure 16 This is a partial front view structural diagram of a display module corresponding to step S650. For example... Figure 15 and Figure 16 As shown, an encapsulation layer 150 is formed on the side of the light-emitting chip 140 away from the transparent substrate 110. The encapsulation layer 150 covers the conductive layer 120 and the light-emitting chip 140, and is used to seal the light-emitting chip 140, thereby protecting the light-emitting chip 140. At the same time, the encapsulation layer 150 exposes the connection terminal 130, so that the connection terminal 130 serves as the input terminal of the display module and is connected to an external driving circuit board.
[0095] In this embodiment, the conductive layer 120 in the display module is disposed within the groove 10 of the transparent substrate 110. This allows the pads 121 in the pad groove 101 to connect to the pins 123 in the pin groove 103 via the connection structure 122 in the connection groove 102. In subsequent processes, the light-emitting chip 140 can be connected to the connection terminal 130, thereby connecting the light-emitting chip 140 to the input terminal of the display module. Therefore, a single conductive layer 120 disposed within the groove 10 of the transparent substrate 110 can form a wiring layer, simplifying the structure of the wiring layer in the display module in the prior art. This reduces the process difficulty of the wiring layer and consequently lowers the manufacturing difficulty of the display module. Then, the light-emitting chip 140 is encapsulated by the encapsulation layer 150, exposing the connection terminal 130. This achieves integrated packaging of the display module, allowing it to be used directly to form a display screen. This simplifies the process steps of forming a display screen from the display module and improves the efficiency of display screen manufacturing.
[0096] Based on the above technical solution, before placing the light-emitting chip on the side of the pad away from the transparent substrate, the method further includes:
[0097] A shielding layer is formed on the surface of a transparent substrate, exposing the pads and pins.
[0098] Specifically, Figure 17 This is a partial top view of a display module that forms a shielding layer. Figure 18 This is a partial front view diagram of a display module corresponding to the formation of a shielding layer. (Example) Figure 17 and Figure 18 As shown, the shielding layer 160 can be formed after the conductive layer 120 is formed. The shielding layer 160 can cover the connection structure 122 and expose the pads 121 and pins 123. At this time, when the light-emitting chip 140 is placed on the pads 121, it can prevent the adhesive material between the light-emitting chip 140 and the pads 121 from spreading and climbing along the connection structure, thereby effectively avoiding the offset or poor contact of the light-emitting chip 140 when it is placed. At the same time, it can increase the bonding force between the encapsulation layer 150 and the conductive layer 120, and improve the hermeticity of the display module.
[0099] It should be noted that the shielding layer 160 can also be formed after step S640. In this case, the shielding layer 160 can be directly set to cover the light-emitting chip 140, so that the shielding layer 160 can be reused as the encapsulation layer 150, which can prevent light from crossing between light-emitting chips and seal and protect the chip.
[0100] This invention also provides a display device. The display device is formed by cutting a display module provided in any embodiment of this invention, with the cutting lines of the display module disposed between adjacent chip areas.
[0101] Specifically, when the conductive layer of a display module comprises multiple chip areas, after forming the encapsulation layer, slicing can be performed between adjacent chip areas to form multiple individual display devices. When using these display devices to form a display screen, a pick-and-place machine can be used to mount the individual display devices to form the display screen.
[0102] In other embodiments, when the conductive layer of the display module includes multiple chip regions, and the conductive layer in each chip region of the display module exists independently, the display devices formed by each chip region can be insulated from each other. After the connection terminal is used as the input terminal of the display device, the connection terminal can be directly connected to the external driving circuit board, so that the external driving circuit board can directly provide driving signals to different display devices in the display module independently. This allows the display module to directly form a display screen, simplifies the process steps of forming a display screen from the display module, and improves the efficiency of manufacturing the display screen.
[0103] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.
Claims
1. A display module, characterized in that, include: A transparent substrate has a first surface and a second surface disposed opposite to each other. At least one set of grooves is provided on the first surface of the transparent substrate. Each set of grooves includes a pad groove, a connection groove and a pin groove. The connection groove connects the pad groove and the pin groove. A conductive layer, the conductive layer including at least one chip region, the chip region being provided with pads, connection structures and pins, the pads being connected to the pins through the connection structures; The pads are correspondingly disposed in the pad slots, the connection structures are correspondingly disposed in the connection slots, and the pins are correspondingly disposed in the pin slots. A connection terminal is provided on the side of the pin away from the transparent substrate, and the connection terminal is connected to the pin; A light-emitting chip is disposed on the side of the pad away from the transparent substrate, and the electrodes of the light-emitting chip are connected to the pad; An encapsulation layer that covers the conductive layer and the light-emitting chip, and exposes the connection terminals.
2. The display module according to claim 1, characterized in that, Each group of grooves includes 2m pad grooves, m+1 connection grooves and m+1 pin grooves. The 2m pad grooves form m pad groove groups, where m is a positive integer greater than or equal to 2. Different groups of pad slots are arranged along the column direction. Each group of pad slots includes two pad slots arranged along the row direction. The two pads in a group of pad slots are connected to the two electrodes of a light-emitting chip. One of the connection slots connects a row of the pad slots and a pin slot, and the connection structure disposed in one of the connection slots connects the pads disposed in a row of the pad slots and the pins disposed in a pin slot; In the other column, each of the pad slots is connected to a pin slot via a connection slot, and the pads in each of the pad slots in the other column are connected to the pins in the pin slot via a connection structure in a connection slot.
3. The display module according to claim 1, characterized in that, The second surface is the light-emitting surface of the display module.
4. The display module according to claim 1, characterized in that, Along the thickness direction of the transparent substrate, the distance from the surface of the connection structure away from the transparent substrate to the transparent substrate is less than the distance from the surface of the pad away from the transparent substrate to the transparent substrate.
5. The display module according to claim 4, characterized in that, The ratio of the distance from the surface of the connection structure away from the transparent substrate to the transparent substrate to the distance from the surface of the pad away from the transparent substrate to the transparent substrate is in the range of 1 / 5 to 2 / 3.
6. The display module according to claim 1, characterized in that, Along the thickness direction of the transparent substrate, the difference between the distance from the surface of the connecting terminal away from the transparent substrate to the transparent substrate and the distance from the surface of the encapsulation layer away from the transparent substrate to the transparent substrate ranges from 5 to 10 μm.
7. The display module according to claim 1, characterized in that, The display module further includes a shielding layer disposed between the transparent substrate and the encapsulation layer, and exposing the pads and the pins.
8. The display module according to claim 1, characterized in that, The display module further includes an adhesive layer disposed between the pads and the electrodes of the light-emitting chip, the adhesive layer being used to connect the pads and the electrodes of the light-emitting chip.
9. A method for manufacturing a display module, characterized in that, include: At least one set of grooves is formed on a transparent substrate, each set of grooves including a pad groove, a connection groove and a pin groove, wherein the connection groove connects the pad groove and the pin groove; A conductive layer is formed in the groove. The conductive layer includes at least one chip area. The chip area is provided with pads, connection structures, and pins. The pads are connected to the pins through the connection structures. The pads are correspondingly disposed in the pad groove, the connection structures are correspondingly disposed in the connection groove, and the pins are correspondingly disposed in the pin groove. A light-emitting chip is placed on the side of the pad away from the transparent substrate, and the electrodes of the light-emitting chip are connected to the pad. A connection terminal is formed on the side of the pin away from the transparent substrate, so that the connection terminal is connected to the pin; An encapsulation layer is formed, which covers the conductive layer and the light-emitting chip, and exposes the connection terminals.
10. The method for manufacturing a display module according to claim 9, characterized in that, Before placing the light-emitting chip on the side of the pad away from the transparent substrate, the method further includes: A shielding layer is formed on the surface of the transparent substrate, the shielding layer exposing the pads and the pins.
11. A display device, characterized in that, The display module is formed by cutting according to any one of claims 1-8, wherein the cutting lines of the display module are disposed between adjacent chip areas.