Electronic device and method of manufacturing an electronic device

Abstract

The present disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a first main pad; a second main pad; a first repair wire electrically connected to the first main pad; a second repair wire electrically connected to the second main pad, wherein the first repair wire and the second repair wire form a first solderable area; a first backup pad; a second backup pad; a connection wire electrically connecting the second repair wire, the first backup pad, and the second backup pad; and a first electronic unit disposed on the first main pad and the second main pad.

Description

Technical Field

[0001] This disclosure relates to an electronic device and a method for manufacturing the electronic device. Background Technology

[0002] Electronic devices, such as light-emitting devices, using electronic units (e.g., light-emitting diodes, LEDs) as light-emitting units, are applied in various fields, such as displays and lighting. Typically, electronic units are manufactured in chip / die form and bonded to bonding pads on the drive circuitry of the electronic device. If a bonded electronic unit fails or the bonding connection between the bonding pad and the electronic unit is defective, the manufacturer will need more time to repair the defect. Summary of the Invention

[0003] This disclosure relates to an electronic device having a repair structure for repairing defects.

[0004] This disclosure relates to a method for manufacturing an electronic device that can repair defects to achieve a desired yield.

[0005] According to some embodiments disclosed herein, the electronic device includes a first main pad; a second main pad; a first repair wire electrically connected to the first main pad; a second repair wire electrically connected to the second main pad, wherein the first repair wire and the second repair wire form a first solderable area; a first spare pad; a second spare pad; a connecting wire electrically connected to the second repair wire, the first spare pad, and the second spare pad; and a first electronic unit disposed on the first main pad and the second main pad.

[0006] According to some embodiments of this disclosure, a method of manufacturing an electronic device includes providing a substrate; forming a wiring structure on the substrate, the wiring structure including a first repair line, a second repair line, and a connecting line, wherein the first repair line and the second repair line constitute a first solderable area; forming a bonding layer on the wiring structure, the bonding layer including a first main pad, a second main pad, a first spare pad, and a second spare pad, wherein the first repair line is electrically connected to the first main pad, the second repair line is electrically connected to the second main pad, and the connecting line is electrically connected to the second repair line, the first spare pad, and the second spare pad; and placing a first electronic unit on the first main pad and the second main pad.

[0007] In summary, the electronic device of this disclosed embodiment is repairable and has a good yield rate.

[0008] To make the above-mentioned features and advantages disclosed herein more apparent and understandable, embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0009] The accompanying drawings are included to further illustrate the present disclosure, and are incorporated in and form a part of this specification. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the disclosure.

[0010] Figure 1 The illustration depicts a portion of an electronic device according to some embodiments of this disclosure;

[0011] Figure 2 The illustration depicts a portion of an electronic device according to some embodiments of this disclosure;

[0012] Figure 3 The figures illustrate cross-sectional views of electronic devices according to some embodiments of the present disclosure;

[0013] Figure 4 The figures illustrate solderable areas according to some embodiments of this disclosure;

[0014] Figure 5 The illustration shows a cross-sectional view of a weldable region according to some embodiments of this disclosure;

[0015] Figure 6 The figures illustrate cross-sectional views of weldable areas welded according to some embodiments of this disclosure;

[0016] Figure 7 The figures illustrate solderable areas according to some embodiments of this disclosure;

[0017] Figure 8 The illustration shows a cross-sectional view of a weldable region according to some embodiments of this disclosure;

[0018] Figure 9 The illustration depicts a portion of an electronic device according to some embodiments of this disclosure;

[0019] Figure 10 The illustration shows a portion of an electronic device according to some embodiments of this disclosure.

[0020] Explanation of reference numerals in the attached figures

[0021] 100, 100A, 100B, 200, 300: Electronic devices;

[0022] 102: Substrate;

[0023] 104: Wiring structure;

[0024] 106: Bonding layer;

[0025] 108A, 108B: Insulation layer;

[0026] 110: First main contact pad;

[0027] 120: Second main contact pad;

[0028] 130, 130': First repair line;

[0029] 132, 142: Terminal section;

[0030] 134, 144: Wiring section;

[0031] 140, 140': Second repair line;

[0032] 150: First spare contact pad;

[0033] 160: Second spare pad;

[0034] 170: Connecting cable;

[0035] 180: First electronic unit;

[0036] 180A: Backup electronic unit;

[0037] 190: First weldable zone;

[0038] 190', 190”: Weldable zone;

[0039] 192, 192A, 192B: Welded structures;

[0040] 194: Repair the joint pad;

[0041] 210: Third main contact pad;

[0042] 220: Fourth main contact pad;

[0043] 230: Third repair line;

[0044] 240: Fourth repair line;

[0045] 280: Second electronic unit;

[0046] 290: Second weldable zone;

[0047] 310, 320: Common contact pads;

[0048] D1, D2, D3, D4, D5, D6, D7, D8: Dimensions;

[0049] LR: Laser beam;

[0050] Iv: Drive current;

[0051] TL1: First transmission line;

[0052] TL2: Second transmission line;

[0053] TL3: Third transmission line;

[0054] TL4: Fourth transmission line;

[0055] PX, PXA: Light-emitting pixels;

[0056] V1, V2: Conductive holes;

[0057] X, Y: Direction;

[0058] II, II-II, III-III: Sectional lines. Detailed Implementation

[0059] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same component reference numerals may be used in the drawings and description to denote the same or similar parts.

[0060] Throughout this specification and the appended claims, certain terms are used to refer to specific components. Those skilled in the art will understand that display device manufacturers may use different names to refer to the same components. This document is not intended to distinguish between components that have the same function but different names. In the following specification and claims, words such as "containing" and "comprising" are open-ended terms and should therefore be interpreted as "containing but not limited to...".

[0061] The electrical connections described in this disclosure can refer to direct or indirect connections. In the case of a direct connection, the endpoints of two components in the circuit are directly connected or interconnected via wire segments. In the case of an indirect connection, a switch, diode, capacitor, inductor, resistor, or other suitable component, or a combination of the above components, is located between the endpoints of two components in the circuit. However, this disclosure is not limited thereto.

[0062] Although the terms first, second, third… can be used to describe multiple components, the components are not limited to these terms. These terms are used only to distinguish a single component from other components in the specification. The same terms may not be used in the claims, but rather replaced by first, second, third… in the order in which the components are declared in the claims. Therefore, in the following description, a first component may be a second component in the claims.

[0063] In this disclosure, adjacent circuit units may share the same portions or wires, or may contain specific portions thereof. Furthermore, any numerical values ​​disclosed herein may imply a range in the vicinity of those values. For example, if a first value is equal to a second value, it means that there may be an error of approximately ten percent between the first and second values.

[0064] It should be understood that the technical features of several different embodiments can be replaced, reorganized, or mixed to complete other embodiments without departing from the spirit of this disclosure.

[0065] In this disclosure, the electronic device may optionally include display functions, sensing functions, touch sensing functions, antenna functions, other suitable functions, or combinations thereof, but is not limited thereto. In some embodiments, the electronic device may include a splicing device, but is not limited thereto. The electronic device may include liquid crystal (LC) molecules, organic light-emitting diodes (OLEDs), inorganic light-emitting diodes (LEDs) such as mini LEDs, micro LEDs, quantum dots (QDs), quantum dot LEDs, fluorescent materials, phosphorescent materials, other suitable materials, or combinations thereof, but is not limited thereto. Furthermore, the electronic device may include a colored light-emitting device or a monochromatic light-emitting device, and the shape of the electronic device may be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes, but is not limited thereto. Hereinafter, for illustrative purposes, the electronic device is described as a light-emitting device having electronic units, but the electronic device is not limited thereto. In some embodiments, the electronic device may include a liquid crystal panel or other suitable electronic units. Electronic units may include passive and active components, such as capacitors, resistors, inductors, diodes, and transistors. A diode may include a light-emitting diode or a photodiode. A light-emitting diode may include, for example, an organic light-emitting diode (OLED), a mini light-emitting diode, a micro light-emitting diode, or a quantum dot light-emitting diode, but is not limited thereto.

[0066] Figure 1 The illustrations depict a portion of an electronic device according to some embodiments of this disclosure. Figure 1In this embodiment, electronic device 100 includes a first main pad 110, a second main pad 120, a first repair wire 130, a second repair wire 140, a first spare pad 150, a second spare pad 160, a connecting wire 170, and a first electronic unit 180. The first main pad 110 and the second main pad 120 are arranged side-by-side and separated from each other. The first repair wire 130 is electrically connected to the first main pad 110, and the second repair wire 140 is electrically connected to the second main pad 120. The first spare pad 150 and the second spare pad 160 are arranged side-by-side and separated from each other. The connecting wire 170 is electrically connected to the second repair wire 140, the first spare pad 150, and the second spare pad 160. The first electronic unit 180 is disposed on the first main pad 110 and the second main pad 120 and is electrically connected to the first main pad 110 and the second main pad 120.

[0067] Furthermore, the first repair line 130 and the second repair line 140 form a first solderable region 190. In some embodiments, the first repair line 130 and the second repair line 140 are physically and electrically disconnected from each other in an initial state, and can be electrically connected to each other in a repaired state via a welding process performed at the first solderable region 190. Specifically, the first solderable region 190 disclosed herein represents the area where a welding process can be performed to establish an electrical transmission path between the first repair line 130 and the second repair line 140.

[0068] The first electronic unit 180 can be an LED manufactured in chip / die form and bonded to the first main pad 110 and the second main pad 120. For example, the first electronic unit 180 can have two terminals, such as a cathode and an anode, and the two ends are respectively connected to the first main pad 110 and the second main pad 120. The first electronic unit 180 can be a flip-chip LED, a lateral LED, a vertical LED, etc., but is not limited thereto. The first electronic unit 180 can be bonded to the first main pad 110 and the second main pad 120 by flip-chip bonding, wire bonding, or other methods.

[0069] In some embodiments, the first main pad 110, the second main pad 120, the first repair line 130, the second repair line 140, the first spare pad 150, the second spare pad 160, the connecting line 170, and the first electronic unit 180 can be disposed in a single light-emitting pixel PX, and the electronic device 100 may include multiple light-emitting pixels PX according to various requirements. For example, multiple light-emitting pixels PX can be independently controlled to present different levels of brightness, and the electronic device 100 may be applied in the display field, but the present invention is not limited thereto. In addition, the electronic device 100 may also include a first transmission line TL1, a second transmission line TL2, and a third transmission line TL3 to establish the required electrical transmission path. The first transmission line TL1 electrically connects the light-emitting pixel PX to a first voltage source (not shown), and the second transmission line TL2 electrically connects the light-emitting pixel PX to a second voltage source (not shown). The third transmission line TL3 is electrically connected between the second main pad 120 and the first spare pad 150, and the second main pad 120, the first spare pad 150, and the second spare pad 160 may be connected in series. One of the first and second voltage sources can provide a voltage, such as a drive voltage (Vdd), while the other of the first and second voltage sources can apply another voltage, such as a common voltage (Vss) or a ground voltage. When the drive voltage and the common / ground voltage are provided, the drive current Iv can pass through the light-emitting pixel PX to drive the first electronic unit 180 and cause it to emit light.

[0070] Specifically, the first transmission line TL1 is connected to the first main pad 110, and the second transmission line TL2 is connected to the second spare pad 160 and the connecting line 170. Therefore, voltage on the first transmission line TL1 can be supplied to the first main pad 110, and voltage on the second transmission line TL2 can be supplied to the second main pad 120 via the connecting line 170. In the initial state, the first repair line 130 is electrically disconnected from the second repair line 140, and the first spare pad 150 is isolated from the second spare pad 160. Voltage on the first transmission line TL1 is not supplied to the second repair line 140, the first spare pad 150, the second spare pad 160, and the connecting line 170. Similarly, voltage on the second transmission line TL2 will not be supplied to the first repair line 130 or the first main pad 110.

[0071] When the first electronic unit 180 is a functional and acceptable component, an electrical transmission path for the drive current Iv is established from the first transmission line TL1 to the second transmission line TL2 via the first main pad 110, consisting of the first electronic unit 180, the second main pad 120, and the connecting line 170. Therefore, the drive current Iv can drive the first electronic unit 180 to emit light through the first electronic unit 180 located between the first main pad 110 and the second main pad 120. In this way, the light-emitting pixel PX can normally provide its light-emitting function. In this embodiment, the first spare pad 150 and the second spare pad 160 are dummy, and no electronic unit is disposed on the first spare pad 150 and the second spare pad 160. In this disclosure, the chain representing the drive current Iv is used to indicate the transmission path of the drive current Iv, but the transmission direction of the drive current Iv is not limited. In some embodiments, the transmission direction of the drive current Iv may be opposite to the arrow shown in the figure.

[0072] Figure 2 The illustration shows a portion of an electronic device according to some embodiments of this disclosure. Figure 2 Electronic device 100A and Figure 1 The electronic devices 100 are similar, and the same reference numerals in both embodiments represent the same elements. In other words, Figure 1 The description of the elements in the embodiments can be incorporated. Figure 2 In the example. Figure 1 and Figure 2 The difference is Figure 2 It also includes a spare electronic unit 180A. The first main contact pad 110, the second main contact pad 120, the first repair line 130, the second repair line 140, the first spare contact pad 150, the second spare contact pad 160, the connecting line 170, the first electronic unit 180, and the spare electronic unit 180A can be used as light-emitting pixels PXA. In the event of a defect in the first electronic unit 180, the light-emitting pixels PXA of the electronic device 100A can be obtained by repairing the light-emitting pixels PX.

[0073] For example, when an open-circuit defect is found in the first electronic unit 180 of electronic device 100, electronic device 100 can be repaired to obtain electronic device 100A. Specifically, electronic device 100A is manufactured by providing electronic device 100 and performing a repair process. The repair process may include placing a spare electronic unit 180A on a first spare pad 150 and a second spare pad 160, cutting the connecting wire 170, and soldering a first solderable area 190 defined between the first repair wire 130 and the second repair wire 140. The first solderable area 190 is soldered to form a solder structure 192 to electrically connect the first repair wire 130 and the second repair wire 140. By soldering the first solderable area 190 to form the solder structure 192 and cutting the connecting wire 170, an electrical transmission path between the first transmission line TL1 and the first spare pad 150 is established through the first repair wire 130, the solder structure 192, and the second repair wire 140, instead of through the connecting wire 170 to the second spare pad 160, because the connecting wire 170 is cut as an open circuit. Therefore, the driving current Iv can drive the standby electronic unit 180A to emit light through the standby electronic unit 180A.

[0074] In some alternative embodiments, the first electronic unit 180 in electronic device 100 has a short-circuit defect, and the first main pad 110 is directly electrically connected to the second main pad 120 via the first electronic unit 180. Electronic device 100 can be repaired to obtain electronic device 100A by placing a spare electronic unit 180A on the first spare pad 150 and the second spare pad 160 and cutting the connecting line 170. The first spare pad 150 is not directly electrically connected to the second spare pad 160, and the drive current Iv can pass through the spare electronic unit 180A to drive it to emit light. In the case of a short-circuit defect in the first electronic unit 180, a continuous electrical transmission path from the first transmission line TL1 to the first spare pad 150 can be established via the first main pad 110, the first electronic unit 180, the second main pad 120, and the third transmission line TL3. Soldering of the first solderable area 190 can optionally be omitted.

[0075] In short, the repair structure of the light-emitting pixel PXA may include the provision of a backup electronic unit 180A and the disconnection / cutting of the connecting line 170 when the first electronic unit 180 has a short-circuit defect, or the arrangement of the backup electronic unit 180A, the disconnection / cutting of the connecting line 170, and the electrical connection between the first repair line 130 and the second repair line 140 when the first electronic unit 180 has an open-circuit defect or a short-circuit defect. Therefore, various repair processes can be used to electrically connect the first backup pad 150 and the first transmission line TL1, and to make the first backup pad 150 and the second backup pad 160 electrically independent.

[0076] In electronic device 100, the driving current Iv is transmitted from the first transmission line TL1 to the second transmission line TL2, sequentially passing through the first main pad 110, the first electronic unit 180, the second main pad 120, and the connecting line 170, and the first electronic unit 180 emits light. In electronic device 100A with soldering structure 192, the driving current Iv is transmitted from the first transmission line TL1 to the second transmission line TL2, sequentially passing through the first repair line 130, the soldering structure 192, the second repair line 140, the first spare pad 150, the spare electronic unit 180A, and the second spare pad 160, and the spare electronic unit 180A emits light. In other words, both electronic device 100 and electronic device 100A achieve equivalent circuit functions.

[0077] Figure 3 The illustration shows a cross-sectional view of an electronic device according to some embodiments of the present disclosure. Figure 3 The cross-section shown corresponds to Figure 1 Section II in the middle. Figure 3 In the electronic device 100B, a substrate 102, a wiring structure 104, a bonding layer 106, and a first electronic unit 180 are included. The wiring structure 104 may include one or more conductive layers patterned to define a circuit arrangement. For example, the conductive layers constituting the wiring structure 104 may be patterned to at least define... Figure 1 The first repair line 130, the second repair line 140, the connecting line 170, the first transmission line TL1, the second transmission line TL2, and the third transmission line TL3 are included. The bonding layer 106 may be formed of another conductive layer, and the surface of the bonding layer 106 is at least partially exposed, allowing the first electronic unit 180 to be bonded to the bonding layer 106. The bonding layer 106 may be patterned to define a first primary pad 110, a second primary pad 120, a first spare pad 150, and a second spare pad 160. (As shown...) Figure 3 As shown, the first electronic unit 180 can be coupled to the first main pad 110 and the second main pad 120. Figure 2 The spare electronic unit 180A described herein can be coupled to the first spare pad 150 and the second spare pad 160.

[0078] In this embodiment, one or more insulating layers, such as insulating layers 108A and 108B, may be provided on the substrate 102 to separate different conductive layers to achieve the desired electrical transport path. The number of insulating layers 108A and 108B and the number of conductive layers can be determined according to various designs and are not limited to a specific number. The bonding layer 106 can be electrically connected to the corresponding component of the wiring structure 104 through its respective conductive via V1, and the conductive via V1 can pass through at least one insulating layer, such as insulating layer 108B, to be electrically connected to the conductive layer of the wiring structure 104.

[0079] The method of manufacturing electronic device 100B includes at least providing a substrate 102, forming a wiring structure 104 on the substrate 102, forming a bonding layer 106 on the wiring structure 104, and placing a first electronic unit 180 on a first main pad 110 and a second main pad 120 of the bonding layer 106. Similar to... Figure 1 In one embodiment, the first repair wire 130 is electrically connected to the first main pad 110, the second repair wire 140 is electrically connected to the second main pad 120, and the connecting wire 170 is electrically connected to the second repair wire 140, the first spare pad 150, and the second spare pad 160. Furthermore, although... Figure 3 Not shown Figure 1 The first weldable zone in the middle is 190, but Figure 1 The first repair line 130 and the second repair line 140 can form the first weldable area 190.

[0080] In some embodiments, the bonding layer 106 may be omitted. Furthermore, the first primary pad 110, the second primary pad 120, the first spare pad 150, and the second spare pad 160 may be formed by the conductive layer of the patterned wiring structure 104.

[0081] Figure 4 The illustrations depict solderable areas according to some embodiments of this disclosure. Figure 4 The solderable area 190' shown is formed by a first repair line 130' and a second repair line 140'. Specifically, the first repair line 130' includes a terminal portion 132 and a connector portion 134, which may be narrower than the terminal portion 132 when measured in the X direction. In other words, the width of the terminal portion 132 may be greater than the width of the connector portion 134, but the present invention is not limited thereto. The second repair line 140' includes a terminal portion 142 and a connector portion 144, which may be narrower than the terminal portion 142 when measured in the X direction. In other words, the width of the terminal portion 142 may be greater than the width of the connector portion 144, but the present invention is not limited thereto. The connector portion 134 and the connector portion 144 extend in the Y direction, but the present invention is not limited thereto. The terminal portion 132 is closer to the terminal portion 142 than the connector portion 134, and the terminal portion 142 is closer to the terminal portion 132 than the connector portion 144. Therefore, the first repair line 130' and the second repair line 140' are arranged with the terminal portion 132 facing the terminal portion 142. The structure of the solderable area 190' can be applied to Figure 1 The embodiment is used as an example of the first weldable area 190.

[0082] In this embodiment, a repair pad 194 is disposed in the solderable region 190'. The repair pad 194 may be formed of a conductive layer different from at least one of the first repair line 130' and the second repair line 140'. The repair pad 194 may overlap with both the first repair line 130' and the second repair line 140'. For example, in the initial state, the repair pad 194 may overlap the terminal portion 132 of the first repair line 130' and the terminal portion 142 of the second repair line 140'. In the absence of repair, the repair pad 194 is electrically disconnected from at least one of the first repair line 130' and the second repair line 140'.

[0083] In some embodiments, the dimension D1 of the terminal portion 132 measured in the X direction can be 10 micrometers (μm), the dimension D2 of the wiring portion 134 measured in the X direction can be 7 μm, and the dimension D3 of the terminal portion 132 measured in the Y direction can be 7 μm. In some embodiments, the dimension D4 of the terminal portion 142 measured in the X direction can be 10 μm, the dimension D5 of the wiring portion 144 measured in the X direction can be 7 μm, and the dimension D6 of the terminal portion 142 measured in the Y direction can be 7 μm. Furthermore, the dimension D7 of the repair pad 194 measured in the X direction can be 15 μm, and the dimension D8 of the repair pad 194 measured in the Y direction can be 20 μm. The above dimensions are merely illustrative of the dimensional relationships of the components, and the present invention is not limited to these quantities. Specifically, dimensions D1 to D8 can vary depending on different designs.

[0084] Figure 5 The illustration shows a cross-sectional view of a weldable region according to some embodiments of this disclosure, and Figure 5 The cross section corresponds to Figure 4 Section II-II in the middle. Figure 5 In this embodiment, a substrate 102 is provided, and a wiring structure 104 is disposed on the substrate 102. The substrate 102 and the wiring structure 104 can be coupled to... Figure 3 The substrate 102 and wiring structure 104, but not limited thereto. For example Figure 5 As shown, the wiring structure 104 disposed on the substrate 102 may include at least two conductive layers, which are separated by at least one insulating layer (e.g., insulating layer 108A). Specifically, the repair pad 194 may be defined by one conductive layer in the wiring structure 104, while the first repair line 130' and the second repair line 140' may be defined by another conductive layer in the wiring structure 104. The conductive layer of the repair pad 194 may be disposed between the substrate 102 and the conductive layers of the first repair line 130' and the second repair line 140', but the present invention is not limited thereto. In some embodiments, when the... Figure 5 The wiring structure 104 is combined with Figure 3 When repairing wiring structure 104, the conductive layer of repair pad 194 was not in place. Figure 3 As shown in the image.

[0085] Figure 6 The illustration shows a cross-sectional view of a weldable area welded according to some embodiments of this disclosure. Figure 6 The cross-section shows Figure 5 The structures are welded to the periphery of the terminal portion 132 of the first repair line 130' and the periphery of the terminal portion 142 of the second repair line 140'. In this embodiment, a high-power radiation beam (e.g., a laser beam) LR can irradiate the periphery of the terminal portion 132 of the first repair line 130' and the periphery of the terminal portion 142 of the second repair line 140' from the side of the repair pad 194 away from the substrate 102, and the materials of the terminal portions 132 and 142 can be melted to form welded structures 192A and 192B, which penetrate the insulating layer 108A below the terminal portions 132 and 142.

[0086] Welding structure 192A can electrically connect the first repair wire 130' to the repair pad 194, and welding structure 192B can electrically connect the second repair wire 140' to the repair pad 194. The first repair wire 130' can be electrically connected to the second repair wire 140' via the repair pad 194 through welding structures 192A and 192B. Figure 6 The welded structures 192A, 192B, and repair pad 194 shown can be used as Figure 2 An embodiment of the welded structure 192 in the first weldable zone 190.

[0087] In other embodiments not shown, the conductive layers of the first repair line 130' and the second repair line 140' may be disposed between the conductive layers of the substrate 102 and the repair pad 194, but the present invention is not limited thereto. In this embodiment, the laser beam LR may irradiate the periphery of the terminal portion 132 of the first repair line 130' and the periphery of the terminal portion 142 of the second repair line 140' from the side of the repair pad 194 adjacent to the substrate 102, but the present invention is not limited thereto.

[0088] Figure 7 The illustrations depict solderable areas according to some embodiments of this disclosure. Figure 7The solderable area 190” shown is formed by a first repair line 130” and a second repair line 140”. Specifically, the first repair line 130” includes a terminal portion 132 and a connecting portion 134. The connecting portion 134 may be narrower than the terminal portion 132 when measured in the X direction, and has approximately the same width as the second repair line 140” when measured in the X direction, but the invention is not limited thereto. The terminal portion 132 is closer to the second repair line 140” than the connecting portion 134. Therefore, the first repair line 130” and the second repair line 140” are arranged with the terminal portion 132 facing the second repair line 140”. Furthermore, in the initial case, the second repair line 140” can be electrically connected to the repair pad 194.

[0089] Figure 8 The illustration shows a cross-sectional view of a weldable region according to some embodiments of this disclosure. Figure 8 The cross section corresponds to Figure 7 Section III-III in the middle. Figure 7 In this embodiment, a substrate 102 is provided, and a wiring structure 104 is disposed on the substrate 102. The substrate 102 and the wiring structure 104 can be coupled to... Figure 3 The substrate 102 and wiring structure 104, but not limited thereto. For example Figure 8 As shown, the wiring structure 104 may include at least two conductive layers separated by at least one insulating layer, such as insulating layer 108A. Specifically, the conductive layer of the repair pad 194 may be disposed between the substrate 102 and the conductive layers of the first repair line 130' and the second repair line 140'", but the present invention is not limited thereto. In addition, the second repair line 140' is electrically connected to the repair pad 194 and passes through the insulating layer 108A between the second repair line 140' and the repair pad 194 via a conductive hole V2. In this embodiment, when a repair process is required, the laser beam LR may irradiate the periphery of the terminal portion 132 of the first repair line 130' from the side of the repair pad 194 away from the substrate 102, so as to electrically connect the first repair line 130' to the repair pad 194.

[0090] In other embodiments, the conductive layers of the first repair line 130' and the second repair line 140" can be disposed between the conductive layers of the substrate 102 and the repair pad 194. Furthermore, a conductive via V2 is formed between the second repair line 140" and the repair pad 194. Additionally, when a repair process is required, a laser beam LR can irradiate the terminal portion 132 of the first repair line 130" from the side of the repair pad 194 adjacent to the substrate 102 to form a weld structure 192A.

[0091] Figures 4 to 6 The weldable area 190' shown is Figures 7 to 8 The weldable area 190 shown is Figure 1 and Figure 2This is an exemplary example of the first solderable region 190, and can be applied to any embodiment disclosed herein. Specifically, Figure 6 The welding structure shown is suitable for electronic devices in a repair state, such as electronic device 100A, and Figure 5 and Figure 8 The structure shown is applicable to electronic devices in their initial state, such as electronic device 100.

[0092] Figure 9 The illustration shows a portion of an electronic device according to some embodiments of this disclosure. Figure 9 The electronic device 200 in the middle includes... Figure 1 The same components as those in the embodiments. Figure 9 and Figure 1 The difference is that, Figure 9 It also includes a third main pad 210, a fourth main pad 220, a third repair wire 230 electrically connected to the connecting wire 170, and a third main pad 210 and a fourth repair wire 240 electrically connected to the fourth main pad 220, and a second electronic unit 280 disposed on the third main pad 210 and the fourth main pad 220. In this embodiment, the third repair wire 230 and the fourth repair wire 240 form a second solderable area 290.

[0093] In this embodiment, the connection relationship between the first main pad 110 and the second main pad 120 and the first repair wire 130 and the second repair wire 140 can be referred to Figure 1 The description is applicable to the connection relationship between the third main pad 210 and the fourth main pad 220 and the third repair wire 230 and the fourth repair wire 240. Furthermore, the connecting wire 170 is electrically connected to the second repair wire 140, the second main pad 120, the first spare pad 150, the second spare pad 160, the third repair wire 230, and the third main pad 210.

[0094] Electrical transmission paths are established via a first transmission line TL1, a third transmission line TL3, a fourth transmission line TL4, and a second transmission line TL2, connecting wire 170, and a third main pad 210 and a fourth main pad 220. The first transmission line TL1 connects the first main pad 110 to a first voltage source (e.g., a power signal, not shown), the second transmission line TL2 connects the fourth main pad 220 to a second voltage source (e.g., ground voltage, not shown), the third transmission line TL3 connects the second main pad 120 and the first spare pad 150, and the fourth transmission line TL4 connects the second spare pad 160 and the third main pad 210. In an alternative embodiment, the third transmission line TL3, the second main pad 120, and the first spare pad 150 may be selectively integrated into a common pad. Similarly, the fourth transmission line TL4, the second spare pad 160, and the third main pad 210 may be selectively integrated into a common pad.

[0095] The pads are arranged such that the first main pad 110 faces the second main pad 120, the first spare pad 150 faces the second spare pad 160, and the third pad 210 faces the fourth pad 220. The corresponding electronic units can be coupled to the first main pad 110 and the second main pad 120 pair, the first spare pad 150 and the second spare pad 160 pair, or the third main pad 210 and the fourth main pad 220 pair.

[0096] In the initial state, the first main pad 110 and the second main pad 120 are electrically disconnected, the first spare pad 150 and the second spare pad 160 are electrically connected to each other, and the third main pad 210 and the fourth main pad 220 are electrically disconnected. The first electronic unit 180 may have two ends respectively connected to the first main pad 110 and the second main pad 120, and the second electronic unit 280 may have two ends respectively connected to the third main pad 210 and the fourth main pad 220. No electronic unit is connected to the first spare pad 150 or the second spare pad 160. Therefore, the first electronic unit 180 and the second electronic unit 280 are electrically connected in series.

[0097] In the electronic device 200, the driving current Iv is transmitted from the first transmission line TL1 to the second transmission line TL2 in sequence through the first main pad 110, the first electronic unit 180, the second main pad 120, the connecting line 170, the third main pad 210, the second electronic unit 280, and the fourth main pad 220, and both the first electronic unit 180 and the second electronic unit 280 emit light.

[0098] In electronic device 200, the first solderable area 190 and Figure 1Similar to the description in [the original text], the second solderable region 290 provides the same functionality as the first solderable region 190. Specifically, the first solderable region 190 and the second solderable region 290 can be [connected / switched] via [other means]. Figure 4 , Figure 5 , Figure 7 , Figure 8 This can be achieved using any of the structures or alternative structures shown. Therefore, when one or both of the first electronic unit 180 and the second electronic unit 280 are defective, the electronic device 200 is repairable and can maintain the desired function through a repair process.

[0099] In an alternative embodiment, the first electronic unit 180 has a short-circuit defect and the second electronic unit 280 has normal functionality, such as being able to emit light. The short-circuit defect of the first electronic unit 180 results in an electrical connection between the first main pad 110 and the second main pad 120, and the voltage on the first transmission line TL1 can be provided to the first spare pad 150 through the first main pad 110, the first electronic unit 180, the second main pad 120, and the third transmission line TL3. Furthermore, the first electronic unit 180 in the electronic device 200 cannot emit light. To repair the defect, a repair process is performed. The repair process may include placing a spare electronic unit (not shown) on the first spare pad 150 and the second spare pad 160, and cutting the connection line 170. In this embodiment, the connection line 170 is cut and the voltage on the transmission line TL1 is not directly provided to the second spare pad 160. Accordingly, the two ends of the spare electronic unit (not shown) are respectively coupled to the first spare pad 150 and the second spare pad 160 and can receive independent electrical signals to drive the spare electronic unit (not shown) to emit light.

[0100] In the repaired state, the drive current Iv can be transmitted from the first transmission line TL1 to the second transmission line TL2, sequentially passing through the first main pad 110, the first electronic unit 180, the second main pad 120, the third transmission line TL3, the first spare pad 150, the spare electronic unit (not shown), the second spare pad 160, the fourth transmission line TL4, the third main pad 210, the second electronic unit 280, and the fourth main pad 220. In this way, the spare electronic unit (not shown) and the second electronic unit 280 can still emit light under the drive current Iv, even though the first electronic unit 180 has a short-circuit defect and cannot emit light.

[0101] In an alternative embodiment, the first electronic unit 180 is found to have an open-circuit defect, while the second electronic unit 280 functions normally, for example, it can emit light. Due to the open-circuit defect in the first electronic unit 180, the first electronic unit 180 disconnects the electrical transmission path between the first main pad 110 and the second main pad 120, and the first repair line 130 and the second repair line 140 are electrically connected through the first solderable area 190. The repair process is performed by providing the electronic device 200, placing a spare electronic unit (not shown) on the first spare pad 150 and the second spare pad 160, cutting the connecting line 170, and soldering the first solderable area 190, and establishing an electrical transmission path from the first transmission line TL1 to the first spare pad 150 via the first repair line 130, the first solderable area 190, and the second repair line 140. When connection line 170 is cut, the first spare pad 150 and the second spare pad 160 are electrically disconnected. The spare electronic units (not shown) located on the first spare pad 150 and the second spare pad 160 emit light when they receive electrical signals from the first spare pad 150 and the second spare pad 160. Specifically, the drive current Iv can be transmitted from the first transmission line TL1 to the second transmission line TL2, sequentially passing through the first repair line 130, the first solderable line 190, the second repair line 140, the third transmission line TL3, the first spare pad 150, the spare electronic unit (not shown), the second spare pad 160, the fourth transmission line TL4, the third main pad 210, the second electronic unit 280, and the fourth main pad 220. The spare electronic unit (not shown) and the second electronic unit 280 can emit light under the drive current Iv, even though the first electronic unit 180 has an open-circuit defect and cannot emit light.

[0102] In an alternative embodiment, the second electronic unit 280 has a short-circuit defect and is susceptible to... Figure 9 The electronic device 200 shown undergoes a repair process. The repair process is similar to that for the short-circuit defect in electronic unit 180, and will not be repeated here.

[0103] In an alternative embodiment, the second electronic unit 280 has an open-circuit defect and is susceptible to... Figure 9 The electronic device 200 shown undergoes a repair process. The repair process is similar to the repair process for an open-circuit defect in electronic unit 180, and will not be repeated here.

[0104] In an alternative embodiment, both the first electronic unit 180 and the second electronic unit 280 have short-circuit defects, and the electronic device 200 is repaired by placing a spare electronic unit (not shown) on the first spare pad 150 and the second spare pad 160 and cutting the connecting line 170. In this way, a drive current Iv can be transmitted from the first transmission line TL1 to the second transmission line TL2, sequentially through the first main pad 110, the first electronic unit 180, the second main pad 120, the third transmission line TL3, the first spare pad 150, the spare electronic unit (not shown), the second spare pad 160, the fourth transmission line TL4, the third main pad 210, the second electronic unit 280, and the fourth main pad 220 to drive the spare electronic unit (not shown) to emit light. In other words, the electronic device 200 contains three electronic units, but only one electronic unit, the spare electronic unit (not shown), can emit light. In some embodiments, the value of the drive current Iv can be adjusted to achieve the desired light-emitting effect. For example, in order to achieve a similar or identical light-emitting effect to electronic device 200, since the number of acceptable electronic units in the initial electronic device 200 is twice that in the repaired electronic device, the modified driving current Iv generated in the repaired electronic device 200 can be twice that generated in the initial electronic device 200, but the present invention is not limited thereto.

[0105] In an alternative embodiment, the first electronic unit 180 has a short-circuit defect, the second electronic unit 280 has an open-circuit defect, and the electronic device 200 can be repaired by placing a spare electronic unit (not shown) on the first spare pad 150 and the second spare pad 160, cutting the connecting line 170, and soldering the second solderable area 290 to electrically connect the third repair line 230 and the fourth repair line 240. In this way, the drive current Iv can be transmitted from the first transmission line TL1 to the second transmission line TL2, sequentially through the first main pad 110, the first electronic unit 180, the second main pad 120, the third transmission line TL3, the first spare pad 150, the spare electronic unit (not shown), the second spare pad 160, the fourth transmission line TL4, the third repair line 230, the second solderable area 290, and the fourth repair line 240 to drive the spare electronic unit (not shown) to emit light. In other words, the repaired electronic device 200 includes three electronic units, but only one electronic unit, the spare electronic unit (not shown), can emit light. In some embodiments, the value of the drive current Iv in the repaired electronic device 200 can be adjusted to achieve the desired luminous effect.

[0106] In an alternative embodiment, the first electronic unit 180 has an open-circuit defect, the second electronic unit 280 has a short-circuit defect, and by providing Figure 9The electronic device 200 is repaired by placing a spare electronic unit (not shown) on the first spare pad 150 and the second spare pad 160, cutting the connecting wire 170, and soldering the first solderable area 190 to electrically connect the first repair wire 130 and the second repair wire 140. In the repaired state, a drive current Iv can be transmitted from the first transmission line TL1 to the second transmission line TL2, sequentially passing through the first repair wire 130, the first solderable area 190, the second repair wire 140, the first spare pad 150, the spare electronic unit (not shown), the second spare pad 160, the fourth transmission line TL4, the third main pad 210, the second electronic unit 280, and the fourth main pad 220 to drive the spare electronic unit (not shown) to emit light. In other words, the electronic device 200 contains three electronic units, but only one electronic unit, the spare electronic unit (not shown), can emit light. In some embodiments, the value of the drive current Iv can be adjusted to achieve the desired light emission effect.

[0107] In an alternative embodiment, both the first electronic unit 180 and the second electronic unit 280 have open-circuit defects, and by providing Figure 9 The electronic device 200 is repaired by placing a spare electronic unit (not shown) on the first spare pad 150 and the second spare pad 160, cutting the connecting wire 170, soldering the first solderable area 190 to electrically connect the first repair wire 130 and the second repair wire 140, and soldering the second solderable area 290 to electrically connect the third repair wire 230 and the fourth repair wire 240. In the repaired electronic device 200, the driving current Iv can be transmitted from the first transmission line TL1 to the second transmission line TL2, sequentially passing through the first repair wire 130, the first solderable area 190, the second repair wire 140, the first spare pad 150, the spare electronic unit (not shown), the second spare pad 160, the fourth transmission line TL4, the third repair wire 230, the second solderable area 290, and the fourth repair wire 240 to drive the spare electronic unit (not shown) to emit light. In other words, the electronic device 200 contains three electronic units, but only one electronic unit, namely the spare electronic unit (not shown), can emit light. In some embodiments, the value of the drive current Iv can be adjusted to achieve the desired light emission effect.

[0108] In the above embodiments, the welded structure formed in the first weldable region 190 or the second weldable region 290 can be... Figure 6 The structure shown or other alternative structures can be used to achieve this. Furthermore, the structure of the first main pad 110, the second main pad 120, the first spare pad 150, the second spare pad 160, the third main pad 210, and the fourth main pad 220 can be achieved through... Figure 3 The structure shown is used to achieve this.

[0109] Figure 10The illustrations depict a portion of an electronic device according to some embodiments of this disclosure. Figure 10 In this embodiment, electronic device 300 is similar to electronic device 200 and includes a first main pad 110; a second main pad 120; a first repair wire 130 electrically connected to the first main pad 110; a second repair wire 140 electrically connected to the second main pad 120; a first spare pad 150; a second spare pad 160; a connecting wire 170 electrically connected to the second repair wire 140; a first electronic unit 180 disposed on the first main pad 110 and the second main pad 120; a third main pad 210; a fourth main pad 220; a third repair wire 230 electrically connected to the connecting wire 170, the third main pad 210 and the second spare pad 160; a fourth repair wire 240 electrically connected to the fourth main pad 220; and a second electronic unit 280 disposed on the third main pad 210 and the fourth main pad 220. A first solderable area 190 is formed between the first repair line 130 and the second repair line 140, and a second solderable area 290 is formed between the third repair line 230 and the fourth repair line 240. Furthermore, unlike electronic device 200, in electronic device 300, the second main pad 120 and the first spare pad 150 are integrated in a common pad 310, and the third main pad 210 and the second spare pad 160 are integrated in a common pad 320. In other words, the second main pad 120 and the first spare main pad 150 are defined via portions of the common pad 310, and there is no physical boundary between them. Similarly, the third main pad 210 and the second spare pad 160 are defined via portions of the common pad 320, and there is no physical boundary between them.

[0110] In this embodiment, the areas of the common pad 310 and the common pad 320 are larger than those of the first main pad 110 and the fourth main pad 220. For example, as Figure 10 As shown, in the Y direction, the common pad 310 and / or the common pad 320 may have a size approximately similar to the first main pad 110 and / or the fourth main pad 220, but in the X direction, the common pad 310 and / or the common pad 320 have a larger size than the first main pad 110 and / or the fourth main pad 220. The second main pad 120 and the first spare pad 150 are arranged side by side in the X direction, and similarly, the third main pad 210 and the second spare pad 160 are arranged side by side in the X direction. In this embodiment, Figure 9 Transmission lines TL3 and TL4 shown may be omitted. In some other embodiments, common pad 310 and / or common pad 320 may have an elongated dimension in the Y direction, and the second primary pad 120 and the first spare pad 150 are arranged side by side in the Y direction, and similarly, the second spare pad 160 and the third primary pad 210 are arranged side by side in the Y direction.

[0111] In the event of defects in the first electronic unit 180 and / or the second electronic unit 280, a repair process can be performed. Specifically, details of the repair process and repair structure can be found in [reference needed]. Figures 2 to 9 The description of any one of them. Therefore, even if the first electronic unit 180 and / or the second electronic unit 280 are defective, the electronic device 300 can still function normally, thereby improving the yield.

[0112] In summary, the electronic device according to embodiments of the present invention includes at least one pair of main pads, one pair of spare pads, one pair of repair wires, and one connecting wire. The pair of main pads and the pair of repair wires are connected in such a manner that one main pad connects to one repair wire, and the pair of repair wires are arranged opposite each other to form a solderable area. Furthermore, the connecting wire connects one of the pair of spare pads and one of the pair of repair wires. In the event of a defective electronic unit disposed on a main pad, the connecting wire can be cut, a spare electronic unit can be disposed on a spare pad, and the solderable area can be selectively soldered to generate an electrical transmission path for the drive current to drive the spare electronic unit to maintain the required function. Therefore, a spare electronic unit disposed on a spare pad pair can replace an electronic unit disposed on a main pad pair to maintain the required function of the electronic device. In some embodiments, the electronic device may include multiple pairs of main pads, and multiple pairs of main pads may share at least one pair of spare pads. For example, two pairs of main pads may share a pair of spare pads, and the spare pad pair may be connected between two pairs of main pads. Alternatively, three or more pairs of main pads may share a pair of spare pads, and the spare pad pair may be connected between two of the three pairs of main pads. In some embodiments, the number of primary pad pairs may be the same as the number of spare pad pairs. Furthermore, the solderable area and repair line pairs may be designed to correspond to the number of primary pad pairs, such that each primary pad connects to a repair line and each primary pad pair is paired with a solderable area. Therefore, the electronic device according to the embodiments of this disclosure is repairable and has a desired yield.

[0113] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electronic device, characterized in that, include: First main contact pad; Second main contact pad; The first repair line is electrically connected to the first main contact pad; The second repair wire is electrically connected to the second main pad, wherein the first repair wire and the second repair wire form a first solderable area; First spare contact pad; Second spare pad; The connecting wire electrically connects the second repair wire, the first spare pad, and the second spare pad; as well as The first electronic unit is disposed on the first main pad and the second main pad.

2. The electronic device according to claim 1, characterized in that, The second primary pad and the first spare pad are integrated into a common pad.

3. The electronic device according to claim 2, characterized in that, The area of ​​the common pad is larger than that of the first main pad and larger than that of the second spare pad.

4. The electronic device according to claim 1, characterized in that, Also includes: A spare electronic unit is disposed on the first spare pad and the second spare pad, wherein the first electronic unit has an open circuit defect, the first solderable area is soldered to electrically connect the first repair wire to the second repair wire, and the connecting wire is cut off.

5. The electronic device according to claim 1, characterized in that, Also includes: Third main contact pad; Fourth main contact pad; The third repair line is electrically connected to the connecting line and the third main contact pad; The fourth repair wire is electrically connected to the fourth main pad, wherein the third repair wire and the fourth repair wire form a second solderable area; as well as The second electronic unit is disposed on the third main pad and the fourth main pad.

6. The electronic device according to claim 5, characterized in that, The second primary pad and the first spare pad are integrated in a common pad.

7. The electronic device according to claim 5, characterized in that, Also includes: A backup electronic unit is disposed on the first backup pad and the second backup pad, wherein the first electronic unit and the second electronic unit have a short circuit defect and the connecting line is cut off.

8. The electronic device according to claim 5, characterized in that, Also includes: A spare electronic unit is disposed on the first spare pad and the second spare pad, wherein the first electronic unit has an open circuit defect, the second electronic unit has a short circuit defect, the connecting line is cut, and the first solderable area is soldered.

9. The electronic device according to claim 5, characterized in that, Also includes: A backup electronic unit is disposed on the first backup pad and the second backup pad, wherein the first electronic unit has a short circuit defect, the second electronic unit has normal function, and the connecting line is cut off.

10. The electronic device according to claim 5, characterized in that, Also includes: A spare electronic unit is disposed on the first spare pad and the second spare pad, wherein the first electronic unit has an open circuit defect, the second electronic unit has normal function, the connecting line is cut and the first solderable area is soldered.

11. The electronic device according to claim 5, characterized in that, Also includes: A spare electronic unit is disposed on the first spare pad and the second spare pad, wherein the first electronic unit and the second electronic unit have open circuit defects, the connecting line is cut, the first solderable area is soldered, and the second solderable area is soldered.

12. A method for manufacturing an electronic device, characterized in that, include: Provide substrate; A wiring structure is formed on the substrate, the wiring structure including a first repair line, a second repair line and a connecting line, wherein the first repair line and the second repair line form a first solderable area; A bonding layer is formed on the wiring structure. The bonding layer includes a first main pad, a second main pad, a first spare pad, and a second spare pad. The first repair wire is electrically connected to the first main pad, the second repair wire is electrically connected to the second main pad, and the connecting wire is electrically connected to the second repair wire, the first spare pad, and the second spare pad. as well as The first electronic unit is placed on the first main pad and the second main pad.

13. The method for manufacturing an electronic device according to claim 12, characterized in that, Further, a spare electronic unit is placed on the first spare pad and the second spare pad, the first solderable area is soldered to electrically connect the first repair line to the second repair line and the connection line is cut off, wherein the first electronic unit has an open circuit defect.

14. The method for manufacturing an electronic device according to claim 12, characterized in that, Further place a spare electronic unit on the first spare pad and the second spare pad, and disconnect the connection line, wherein the first electronic unit has a short-circuit defect.

15. The method for manufacturing an electronic device according to claim 12, characterized in that, The wiring structure further includes a third repair line and a fourth repair line, the bonding layer further includes a third main pad and a fourth main pad, the third repair line is electrically connected to the connecting line and the third main pad, the fourth repair line is electrically connected to the fourth main pad, the third repair line and the fourth repair line form a second solderable area, and the method of manufacturing the electronic device further includes placing a second electronic unit on the third main pad and the fourth main pad.

16. The method for manufacturing an electronic device according to claim 15, characterized in that, Further place a spare electronic unit on the first spare pad and the second spare pad, and disconnect the connection line, wherein the first electronic unit and the second electronic unit have a short circuit defect.

17. The method for manufacturing an electronic device according to claim 15, characterized in that, Further place spare electronic units on the first spare pad and the second spare pad, cut the connecting wire and solder the first solderable area, wherein the first electronic unit has an open circuit defect and the second electronic unit has a short circuit defect.

18. The method for manufacturing an electronic device according to claim 15, characterized in that, Further place a spare electronic unit on the first spare pad and the second spare pad and disconnect the connection line, wherein the first electronic unit has a short circuit defect and the second electronic unit has normal function.

19. The method for manufacturing an electronic device according to claim 15, characterized in that, Further place spare electronic units on the first spare pad and the second spare pad, cut the connecting wire and solder the first solderable area, wherein the first electronic unit has an open circuit defect and the second electronic unit has normal function.

20. The method for manufacturing an electronic device according to claim 15, characterized in that, Further place spare electronic units on the first spare pad and the second spare pad, cut the connecting wire, and solder the first solderable area and the second solderable area, wherein the first electronic unit and the second electronic unit have open circuit defects.

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