Multilayer circuit board manufacturing apparatus and multilayer circuit board manufacturing method

Abstract

Disclosed is a multilayer circuit board manufacturing apparatus and a multilayer circuit board manufacturing method. The disclosure includes a plurality of uncoilers configured to supply a plurality of different members, and a compression machine configured to join the members supplied from the respective uncoilers to each other. The compression machine includes a belt that rotates in contact with one surface of one of the plurality of members, and a pressing device that is located inside the belt and spaced apart from the belt, and presses the belt toward the member in a non-contact manner.

Description

[0001] [Cross-reference to related applications]

[0002] This application is based on and claims priority to Korean Patent Application No. 10-2021-0130305, filed on September 30, 2021, with the Korean Intellectual Property Office, the full disclosure of which is incorporated herein by reference. Technical Field

[0003] One or more embodiments relate to an apparatus and a method, and more specifically to a multilayer circuit board manufacturing apparatus and a multilayer circuit board manufacturing method. Background Technology

[0004] With the development of electronic or communication technologies, electronic / communication devices (such as mobile phones) are becoming smaller and more powerful. Therefore, circuit boards embedded in these devices are manufactured as multi-layered circuit boards to perform numerous functions.

[0005] Multilayer circuit boards can be manufactured using a roll-press method. For example, multilayer circuit boards can be manufactured using a roll-to-roll stacking method that uses multiple rollers.

[0006] This multilayer circuit board has a structure in which composite materials are stacked. When manufactured using a roll-to-roll method, the composite materials can be transferred and compressed while tension is applied. Here, in order to bond the composite materials together, it is necessary to apply pressure while applying heat. In this case, multilayer circuit boards manufactured by providing uniform pressure and temperature to the composite materials will not cause product quality defects (such as poor appearance). Summary of the Invention

[0007] One or more embodiments include multilayer circuit board manufacturing equipment and multilayer circuit board manufacturing method, which can manufacture high-quality multilayer circuit boards by roll-to-roll method.

[0008] Additional aspects will be set forth in part in the description which follows, and will become apparent in part from the description, or may be learned by practicing the embodiments presented in this disclosure.

[0009] According to one or more embodiments, a multilayer circuit board manufacturing apparatus includes: a plurality of uncoilers configured to supply a plurality of different components; and a compressor configured to engage components supplied from a respective uncoiler among the plurality of uncoilers, wherein the compressor includes: a belt that rotates in contact with a surface of one of the plurality of components; and a pressing device located inside and spaced apart from the belt and pressing the belt toward the component in a non-contact manner.

[0010] In one embodiment, the compressor may further include a belt roller located inside the belt and causing the belt to rotate.

[0011] In one embodiment, the pressing device may include: a fluid pressing unit configured to supply fluid toward the belt; and a fluid outlet located adjacent to the fluid pressing unit and collecting the fluid.

[0012] In one embodiment, the pressing device may include a fluid inlet connected to the fluid pressing unit and directing the fluid to the fluid pressing unit.

[0013] In one embodiment, multiple fluid inlets may be provided, and the multiple fluid inlets may be connected to the fluid pressing unit and spaced apart from each other by a certain distance.

[0014] In an embodiment, the multilayer circuit board manufacturing equipment may further include a recoiler configured to wind the multilayer circuit board, wherein the plurality of components passing through the compressor are laminated in the multilayer circuit board.

[0015] In one embodiment, the multilayer circuit board manufacturing apparatus may further include a curing device configured to cure the multilayer circuit board wound around the winding machine.

[0016] In one embodiment, the curing apparatus may include: an oven in which the multilayer circuit board wound around the winding machine is located; a support member located in the oven and supporting the multilayer circuit board; and a heating section located in the oven and providing heat to the multilayer circuit board.

[0017] In an embodiment, the curing apparatus may include: an unwinding roller on which the multilayer circuit board wound around the winding machine is disposed and unwound from the unwinding roller; a heating unit configured to heat the multilayer circuit board unwound from the unwinding roller; and a winding roller configured to wind the multilayer circuit board that has passed through the heating unit.

[0018] In one embodiment, the heating unit may include: a heating chamber configured to provide space for the multilayer circuit board to move therein; and a heating portion located within the heating chamber and heating the multilayer circuit board.

[0019] According to one or more embodiments, a method for manufacturing a multilayer circuit board includes: unwinding each of a plurality of components; laminating the plurality of components in a compressor; and applying heat to the laminated plurality of components in a curing apparatus to fix the plurality of components.

[0020] In one embodiment, the compressor may include: a belt that rotates in contact with a surface of one of the plurality of components; and a pressing device located inside and spaced apart from the belt, and pressing the belt toward the component in a non-contact manner.

[0021] In one embodiment, the pressing device may include: a fluid pressing unit configured to supply fluid toward the belt; and a fluid outlet located adjacent to the fluid pressing unit and collecting the fluid.

[0022] In an embodiment, the multilayer circuit board manufacturing method may further include winding the laminated plurality of components.

[0023] In one embodiment, the curing apparatus may include: an oven in which a multilayer circuit board wound around a winding machine is located; a support member located within the oven and supporting the multilayer circuit board; and a heating section located within the oven and providing heat to the multilayer circuit board.

[0024] In an embodiment, the curing apparatus may include: an unwinding roller on which a multilayer circuit board wound around a winding machine is disposed and unwound; a heating unit configured to heat the multilayer circuit board unwound from the unwinding roller; and a winding roller configured to wind the multilayer circuit board that has passed through the heating unit. Attached Figure Description

[0025] The above and other aspects, features, and advantages of certain embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0026] Figure 1 This is a front view showing a portion of a multilayer circuit board manufacturing apparatus according to an embodiment of the present disclosure.

[0027] Figure 2 It is shown Figure 1 The front view of the pressing unit shown.

[0028] Figure 3 This is a front view showing another part of a multilayer circuit board manufacturing apparatus according to an embodiment of the present disclosure.

[0029] Figure 4 This is a cross-sectional view showing a multilayer circuit board according to an embodiment of the present disclosure.

[0030] Figure 5 This is a front view showing a portion of a multilayer circuit board manufacturing apparatus according to another embodiment of the present disclosure.

[0031] Figure 6This is a front view showing another part of a multilayer circuit board manufacturing apparatus according to another embodiment of the present disclosure.

[0032] Figure 7 This is a cross-sectional view showing a multilayer circuit board according to another embodiment of the present disclosure.

[0033] [Explanation of Symbols]

[0034] 1: Multilayer circuit board;

[0035] 10: Core materials;

[0036] 11: Core layer;

[0037] 11S1: First surface;

[0038] 11S2: Second surface;

[0039] 12: Metallic pattern;

[0040] 13: Metal layer;

[0041] 14: First metal pattern;

[0042] 16: Second metal pattern;

[0043] 21: First material;

[0044] 22: Second material;

[0045] 31: Third material;

[0046] 32: The fifth material;

[0047] 41: Fourth material;

[0048] 42: The sixth material;

[0049] 100: Uncoiler;

[0050] 110: Central uncoiler;

[0051] 120: The third uncoiler;

[0052] 130: Fourth uncoiler;

[0053] 140: First uncoiler;

[0054] 150: Second uncoiler;

[0055] 160: Fifth uncoiler;

[0056] 170: The sixth uncoiler;

[0057] 200: Compressing machine;

[0058] 210: First belt device;

[0059] 211: First belt roller;

[0060] 212: Second belt roller;

[0061] 213: First zone;

[0062] 220: Second belt device;

[0063] 221: Third belt roller;

[0064] 222: Fourth belt roller;

[0065] 223: Second band;

[0066] 230: First pressing device;

[0067] 231: First fluid inlet;

[0068] 233: First fluid pressing unit;

[0069] 235: First fluid outlet;

[0070] 240: Second pressing device;

[0071] 241: Second fluid inlet;

[0072] 243: Second fluid pressing unit;

[0073] 245: Second fluid outlet;

[0074] 251: First fluid;

[0075] 253: Second fluid;

[0076] 300: Winding machine;

[0077] 400-1, 400-2: Curing devices;

[0078] 410-1: Drying oven;

[0079] 410-2: Unwinding roller;

[0080] 420-1: Support component;

[0081] 420-2: Winding roller;

[0082] 430-1: Heating section;

[0083] 430-2: Heating unit;

[0084] 431-2: Heating chamber;

[0085] 432-2: Heating section;

[0086] 1000: Multilayer circuit board manufacturing equipment;

[0087] SLA1: First slip zone;

[0088] SLA2: Second slip zone. Detailed Implementation

[0089] The embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings, wherein the same reference numerals refer to the same elements throughout. In this regard, embodiments of the invention may have different forms and should not be considered as limited to the description herein. Therefore, the embodiments described below with reference to the figures are merely for the purpose of illustrating various aspects of this description. The term "and / or" as used herein includes any and all combinations of one or more of the related listed items. When an expression such as "at least one of..." follows a series of elements, the expression modifies the entire series of elements rather than individual elements within the series.

[0090] This disclosure will be illustrated by the following embodiments, which are set forth in detail with reference to the accompanying drawings. However, this disclosure may be implemented in various forms and should not be construed as limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of this disclosure to those skilled in the art. Furthermore, this disclosure is defined only by the scope of the claims. Meanwhile, the terminology used in this specification is for explaining the embodiments only and not for limiting the disclosure. In this specification, the singular form includes the plural form unless clearly indicated otherwise by the context. The meaning of “comprising” and / or “including” as used in the specification does not exclude the presence or addition of one or more components, steps, operations, and / or elements other than those mentioned. It should be understood that although terms such as “first” and “second” are used herein to describe various elements, these elements should not be limited by these terms. The terms are used only to distinguish one component from other components.

[0091] Figure 1 This is a front view showing a portion of a multilayer circuit board manufacturing apparatus according to an embodiment of the present disclosure. Figure 2 It is shown Figure 1 The front view of the pressing unit shown. Figure 3 This is a front view showing another part of a multilayer circuit board manufacturing apparatus according to an embodiment of the present disclosure.

[0092] Reference Figures 1 to 3 Multilayer circuit board manufacturing equipment 1000 can manufacture multilayer circuit boards 1. Multilayer circuit board manufacturing equipment 1000 may include an uncoiler 100, a compressor 200 and a coiler 300.

[0093] Uncoiler 100 may include a center uncoiler 110, a first uncoiler 140, a second uncoiler 150, a third uncoiler 120, and a fourth uncoiler 130. Here, although not shown in the figure, uncoiler 100 can bend at least one material at least twice.

[0094] The center uncoiler 110 can continuously supply center material 10. The first uncoiler 140 can supply first material 21. The second uncoiler 150 can supply second material 22. The third uncoiler 120 can supply third material 31. The fourth uncoiler 130 can supply fourth material 41. The uncoiler 100 can be an uncoiler that supplies materials and can adjust the tension of each of the materials.

[0095] The compressor 200 can compress the central material 10 and various other materials. In one embodiment, the compressor 200 can compress the second material 22, the central material 10, and the first material 21 arranged in the order of second material 22, central material 10, and first material 21. In another embodiment, the compressor 200 can compress the second material 22, the central material 10, the third material 31, the fourth material 41, and the first material 21 arranged in the order of second material 22, central material 10, third material 31, fourth material 41, and first material 21. The compressor 200 may include a first belt device 210, a second belt device 220, a first pressing device 230, and a second pressing device 240.

[0096] The first belt device 210 and the second belt device 220 can be arranged facing each other such that the multilayer circuit board 1 is located between the first belt device 210 and the second belt device 220. The first belt device 210 and the second belt device 220 allow the multilayer circuit board 1 to pass between the first belt device 210 and the second belt device 220. The first belt device 210 may include a first belt roller 211, a second belt roller 212, and a first belt 213. The second belt device 220 may include a third belt roller 221, a fourth belt roller 222, and a second belt 223. The first belt 213 and the second belt 223 are rotatable and can move the multilayer circuit board 1 in one direction. Here, the first belt 213 and the second belt 223 can be arranged in a form similar to a caterpillar track and can be configured to enclose the inner space from the outside. The first belt 213 and the second belt 223 may contain steel. For example, the first belt 213 and the second belt 223 may contain stainless steel, nickel alloy, or nickel-chromium alloy.

[0097] The first belt roller 211 and the second belt roller 212 are spaced apart from each other and allow the first belt 213 to rotate. Each of the first belt roller 211 and the second belt roller 212 can be connected to a drive unit (e.g., a motor) and can be controlled and rotated by the drive unit.

[0098] The third and fourth belt rollers 221 and 222 are spaced apart from each other and allow the second belt 223 to rotate. Each of the third and fourth belt rollers 221 and 222 can be connected to a drive unit (e.g., a motor) and can be controlled and rotated by the drive unit. In an embodiment, the first and third belt rollers 211 and 221 can face each other with a multilayer circuit board 1 located between the first and third belt rollers 211 and 221, and the second and fourth belt rollers 222 can face each other with a multilayer circuit board 1 located between the second and fourth belt rollers 212 and 222.

[0099] The first pressing device 230 and the second pressing device 240 can press the multilayer circuit board 1. The first pressing device 230 can be located between the first belt roller 211 and the second belt roller 212. The first pressing device 230 can press the first belt 213. The first pressing device 230 may include a first fluid inlet 231, a first fluid pressing unit 233, and a first fluid outlet 235. The first fluid inlet 231 can be connected to a first fluid supply unit (not shown). In an embodiment, the first fluid inlet 231 may be a first pipe. The first fluid supply unit can store a first fluid 251 with high temperature and high pressure. In an embodiment, the first fluid 251 may be high temperature and high pressure oil. The first fluid 251 can move to the first fluid pressing unit 233 via the first fluid inlet 231. The first fluid 251 can press the first belt 213 in the first fluid pressing unit 233. In addition, the first fluid 251 can transfer heat to the multilayer circuit board 1 in the first fluid pressing unit 233. The first fluid pressing unit 233 may be a space capable of accommodating the first fluid 251. The first fluid outlet 235 can discharge the first fluid 251 from the first pressing device 230. In an embodiment, the first fluid outlet 235 can be connected to a fluid receiving unit (not shown) under vacuum. A first slip zone SLA1 can be formed between the first fluid pressing unit 233 and the first fluid outlet 235. The first slip zone SLA1 can be a region where slippage occurs between the first belt 213 and the first fluid pressing unit 233 due to the first fluid 251. Therefore, the first belt 213 can slide and rotate over the first pressing device 230.

[0100] The second pressing device 240 may be located between the third belt roller 221 and the fourth belt roller 222. The second pressing device 240 can press the second belt 223. The second pressing device 240 may include a second fluid inlet 241, a second fluid pressing unit 243, and a second fluid outlet 245. The second fluid inlet 241 may be connected to a second fluid supply unit (not shown). In an embodiment, the second fluid inlet 241 may be a second pipe. The second fluid supply unit may store a high-temperature and high-pressure second fluid 253. In an embodiment, the second fluid 253 may be high-temperature and high-pressure oil. The second fluid 253 may move to the second fluid pressing unit 243 via the second fluid inlet 241. The second fluid 253 can press the second belt 223 in the second fluid pressing unit 243. In addition, the second fluid 253 can transfer heat to the multilayer circuit board 1 in the second fluid pressing unit 243. The second fluid pressing unit 243 may be a space capable of accommodating the second fluid 253. The second fluid outlet 245 can discharge the second fluid 253 from the second pressing device 240. In one embodiment, the second fluid outlet 245 can be connected to a fluid receiving unit (not shown) under vacuum. A second slip zone SLA2 can be formed between the second fluid pressing unit 243 and the second fluid outlet 245. The second slip zone SLA2 can be a zone where slippage occurs between the second belt 223 and the second fluid pressing unit 243 due to the second fluid 253. Therefore, the second belt 223 can slide and rotate over the second pressing device 240.

[0101] The winding machine 300 can wind the multilayer circuit board 1 that has passed through the first pressing device 230 and the second pressing device 240. In this case, at least one winding machine 300 can be provided. Furthermore, when multiple winding machines 300 are provided, the multiple winding machines 300 can sequentially wind the multilayer circuit board 1.

[0102] The winding machine 300 described above is equipped with a separate drive unit (e.g., a motor) and is capable of rotation, not only winding the multilayer circuit board 1 but also moving the multilayer circuit board 1.

[0103] The multilayer circuit board manufacturing equipment 1000 may further include a curing device 400-1. Here, the curing device 400-1 may be separately configured from the uncoiler 100, the compressor 200, and the winding machine 300. In this case, the curing device 400-1 may include: an oven 410-1 into which the multilayer circuit board 1 wound around the winding machine 300 is inserted; a support member 420-1 located within the oven 410-1 and supporting the multilayer circuit board 1; and a heating section 430-1 located within the oven 410-1 and providing heat. In this case, the support member 420-1 is connected to the rotation axis of the winding machine 300 and thus supports the multilayer circuit board 1 without contacting it. In another embodiment, the multilayer circuit board 1 may be supported by being located on the support member 420-1. The heating section 430-1 may apply heat to the multilayer circuit board 1 in various ways. For example, heating section 430-1 can heat the multilayer circuit board 1 by emitting light onto it. In another embodiment, heating section 430-1 may include a heater. In another embodiment, heating section 430-1 can heat the multilayer circuit board 1 by providing hot air to it. The method of manufacturing the multilayer circuit board 1 using the multilayer circuit board manufacturing equipment 1000 described above will be described in detail.

[0104] Uncoiler 100 can continuously supply material. Center uncoiler 110 can continuously supply center material 10 and change the movement path of the continuously supplied center material 10 at least twice. In an embodiment, center material 10 may include a core layer, a metal pattern, and a metal layer. The core layer may include a first surface and a second surface opposite to each other. The metal pattern may be disposed on at least one of the first surface and the second surface. For example, the metal pattern may be disposed on the first surface, and the metal layer may be disposed on the second surface.

[0105] The first uncoiler 140 can continuously supply the first material 21. The second uncoiler 150 can continuously supply the second material 22. In an embodiment, the first material 21 and the second material 22 may have the same substance.

[0106] The third uncoiler 120 can continuously supply a third material 31. In an embodiment, the third material 31 may comprise prepreg. The fourth uncoiler 130 can continuously supply a fourth material 41. The fourth material 41 may comprise copper foil.

[0107] Subsequently, each type of material can be fed into the compressor 200 at a preset angle.

[0108] Next, the compressor 200 can compress the various materials fed into it. The various materials can pass between the first belt assembly 210 and the second belt assembly 220. The first belt 213 and the second belt 223 can rotate, and the various materials can move in one direction.

[0109] The first pressing device 230 and the second pressing device 240 can compress the various materials fed into the compressor 200. In an embodiment, the first fluid 251 supplied to the first pressing device 230 can be in a high-temperature and high-pressure state, and the second fluid 253 supplied to the second pressing device 240 can be in a high-temperature and high-pressure state. Therefore, the various materials fed into the compressor 200 can be compressed by the first fluid 251 and the second fluid 253. In an embodiment, the compressor 200 can compress the second material 22, the center material 10, and the first material 21 arranged in the order of second material 22, center material 10, and first material 21. In an embodiment, the compressor 200 can compress the second material 22, the center material 10, the third material 31, the fourth material 41, and the first material 21 arranged in the order of second material 22, center material 10, third material 31, fourth material 41, and first material 21. That is, the first fluid 251 and the second fluid 253 can heat the first strip 213 and the second strip 223 while pressing the first strip 213 and the second strip 223 toward the second material 22 and the first material 21, respectively. In this case, the first fluid 251 and the second fluid 253 can press the respective areas of the inner surface of the first strip 213 and the second strip 223 with uniform pressure. In addition, the first strip 213 and the second strip 223 can be subjected to pressure without being affected by the surface shape of at least one of the second material 22, the center material 10, the third material 31, the fourth material 41, and the first material 21. Therefore, in the above case, when the first strip 213 and the second strip 223 press the second material 22 and the first material 21, defects caused by uneven pressure on the pressing surfaces of each of the first strip 213 and the second strip 223 during the process of joining the second material 22, the center material 10, the third material 31, the fourth material 41, and the first material 21 can be minimized. Furthermore, not only can uniform pressure be applied to the second material 22, the central material 10, the third material 31, the fourth material 41, and the first material 21, but the pressure applied to a particular part will not be excessively greater than the pressure applied to another part. Therefore, damage to each material that may occur during the manufacturing of the multilayer circuit board 1 can be prevented.

[0110] Subsequently, the manufactured multilayer circuit board 1 can pass through the compressor 200. Therefore, according to this embodiment, a multilayer circuit board 1 with reduced appearance defects and improved product quality can be manufactured.

[0111] When the above process is completed, the winding machine 300 can be inserted into the curing device 400-1. Here, the winding machine 300 may have a shape that can be separated from the separately provided drive unit.

[0112] The curing device 400-1 can enhance the coupling between the second material 22, the central material 10, the third material 31, the fourth material 41, and the first material 21 by supplying heat to the winding machine 300.

[0113] Therefore, the multilayer circuit board manufacturing equipment 1000 and the multilayer circuit board manufacturing method can manufacture multilayer circuit boards 1 with uniform quality. Furthermore, the multilayer circuit board manufacturing equipment 1000 and the multilayer circuit board manufacturing method can minimize defects that may occur during the manufacturing of the multilayer circuit board 1.

[0114] Figure 4 This is a cross-sectional view showing a multilayer circuit board according to an embodiment of the present disclosure.

[0115] Reference Figure 4 The multilayer circuit board 1 may include a central material 10 and multiple materials. In an embodiment, the multiple materials may include the central material 10, a first material 21, a second material 22, a third material 31, and a fourth material 41.

[0116] The second material 22, the central material 10, the third material 31, and the first material 21 may be arranged in the multilayer circuit board 1 in the following order: second material 22, central material 10, third material 31, and first material 21. The multilayer circuit board 1 may be a circuit board manufactured for signal connections between electronic components in an electronic device.

[0117] The core material 10 may include a core layer 11, a metal pattern 12, and a metal layer 13. The core layer 11 may be formed by impregnating a base material (e.g., glass cloth or glass nonwoven fabric) with a thermosetting resin and then curing the impregnated base material. The core layer 11 may include a first surface 11S1 and a second surface 11S2. The second surface 11S2 may be a surface on the opposite side of the first surface 11S1. The metal pattern 12 may be disposed on at least one of the first surface 11S1 and the second surface 11S2. For example, the metal pattern 12 may be disposed on the first surface 11S1, and the metal layer 13 may be disposed on the second surface 11S2. In another example, the metal pattern 12 may be disposed on the second surface 11S2, and the metal layer 13 may be disposed on the first surface 11S1. The metal pattern 12 may be a patterned metal sheet with high conductivity, such as copper (Cu) foil. The metal layer 13 may be a non-patterned metal sheet with high conductivity, such as copper foil. In some embodiments, the metal pattern 12 may be omitted, and the metal layer 13 may be disposed on each of the first surface 11S1 and the second surface 11S2.

[0118] The third material 31 may cover the metal pattern 12. The third material 31 may be disposed on the first surface 11S1 of the core layer 11 and the metal pattern 12. The third material 31 may be a prepreg. For example, the third material 31 may be formed by impregnating glass cloth or glass nonwoven fabric with a thermosetting resin and then semi-curing the impregnated material. In some embodiments, the third material 31 may be omitted when the metal pattern 12 is omitted.

[0119] A fourth material 41 may be disposed on the third material 31. In one embodiment, the fourth material 41 may be disposed on the first surface 11S1 side of the core layer 11. In some embodiments, the fourth material 41 may be a non-patterned metal sheet with high conductivity, such as copper foil. In some embodiments, the fourth material 41 may be omitted.

[0120] The first material 21 may be disposed on the fourth material 41. The first material 21 may be a cover foil. In one embodiment, the first material 21 may be a carrier made of copper foil. The first material 21 may be disposed below the central material 10. In some embodiments, the central material 10 may be disposed between the first material 21 and the second material 22. In one embodiment, the second material 22 may be a carrier made of copper foil. The first material 21 and the second material 22 may have the same material.

[0121] The multilayer circuit board 1 described above may have a structure in which composite materials are stacked. The first material 21 and the second material 22 may have the same material and be arranged symmetrically.

[0122] Figure 5 This is a front view showing a portion of a multilayer circuit board manufacturing apparatus according to another embodiment of the present disclosure. Figure 6 This is a front view showing another part of a multilayer circuit board manufacturing apparatus according to another embodiment of the present disclosure.

[0123] Reference Figure 5 and Figure 6 Multilayer circuit board manufacturing equipment 1000 can manufacture multilayer circuit boards 1. Multilayer circuit board manufacturing equipment 1000 may include an uncoiler 100, a compressor 200, and a coiler 300. Uncoiler 100 may include a center uncoiler 110, a first uncoiler 140, a second uncoiler 150, a third uncoiler 120, a fourth uncoiler 130, a fifth uncoiler 160, and a sixth uncoiler 170.

[0124] The fifth uncoiler 160 can supply the fifth material 32. The sixth uncoiler 170 can supply the sixth material 42.

[0125] The compressor 200 can compress the central material 10 and various other materials. Here, the compressor 200 can be used in conjunction with... Figure 1 and Figure 2 The compressor 200 shown is the same as or similar to the compressor 200. In an embodiment, the compressor 200 can compress the second material 22, the sixth material 42, the fifth material 32, the center material 10, the third material 31, the fourth material 41 and the first material 21 arranged in the order of second material 22, sixth material 42, fifth material 32, center material 10, third material 31, fourth material 41 and first material 21.

[0126] The winding machine 300 can wind the multi-layer circuit board 1 that has already passed through the compressor 200. Here, the winding machine 300 can be used with... Figure 1 and Figure 2 The winding machines shown are the same or similar, and therefore detailed descriptions of them will be omitted.

[0127] The multilayer circuit board manufacturing equipment 1000 may include a curing device 400-2. Here, the curing device 400-2 may include an unwinding roller 410-2, a heating unit 430-2, and a winding roller 420-2. The unwinding roller 410-2 may have a multilayer circuit board 1 wound around a winding machine 300 and supply the multilayer circuit board 1 to the heating unit 430-2. Here, the unwinding roller 410-2 may have a structure in which the winding machine 300 itself is disposed. The heating unit 430-2 may apply heat to the multilayer circuit board 1 supplied from the unwinding roller 410-2. Here, the heating unit 430-2 may include a heating chamber 431-2 and a heating section 432-2 arranged on the movement path of the moving multilayer circuit board 1. In this case, the heating section 432-2 may include a heater, a lamp supplying infrared light, a nozzle supplying hot air, or similar components. The winding roller 420-2 may wind the multilayer circuit board 1 that has passed through the heating unit 430-2. Here, the winding roller 420-2 can be connected to a separate drive unit (e.g., a motor) and can carry multiple layers of circuit boards 1.

[0128] The method of manufacturing multilayer circuit board 1 using the multilayer circuit board manufacturing equipment 1000 described above will be explained in detail.

[0129] Uncoiler 100 can continuously supply material. Center uncoiler 110 can continuously supply center material 10. In an embodiment, center material 10 may include a core layer and a metal pattern. The core layer may include a first surface and a second surface opposite to each other. The metal pattern may include a first metal pattern disposed on the first surface and a second metal pattern disposed on the second surface.

[0130] The first uncoiler 140 can continuously supply the first material 21. The second uncoiler 150 can continuously supply the second material 22. In an embodiment, the first material 21 and the second material 22 may have the same substance.

[0131] The third uncoiler 120 can continuously supply the third material 31, and the fifth uncoiler 160 can continuously supply the fifth material 32. In an embodiment, the third material 31 and the fifth material 32 may have the same substance. The third material 31 and the fifth material 32 may include prepreg.

[0132] The fourth uncoiler 130 can continuously supply the fourth material 41, and the sixth uncoiler 170 can continuously supply the sixth material 42. In this embodiment, the fourth material 41 and the sixth material 42 may have the same substance. The fourth material 41 and the sixth material 42 may have copper foil.

[0133] Next, the compressor 200 can compress the various materials fed into it. Subsequently, the manufactured multilayer circuit board 1 can pass through the compressor 200. Therefore, according to this embodiment, a multilayer circuit board 1 with reduced appearance defects and improved product quality can be manufactured.

[0134] Next, the multilayer circuit board 1, which is mounted on the winding machine 300, can be mounted on the unwinding roller 410-2. Furthermore, the multilayer circuit board 1 can be connected to the winding roller 420-2. When the drive unit of the winding roller 420-2 operates, the multilayer circuit board 1 can move while passing through the heating unit 430-2. The heating unit 430-2 can provide heat to the multilayer circuit board 1, thereby enhancing the coupling between the materials of the multilayer circuit board 1. Specifically, the heating unit 430-2 can heat at least a portion of the third material 31 and at least a portion of the fifth material 32.

[0135] The multilayer circuit board 1, which has already passed through the heating unit 430-2, can be wound around the winding roller 420-2. Subsequently, the winding roller 420-2 is moved to another device or similar device, and various processes can be performed on the multilayer circuit board 1.

[0136] Figure 7 This is a cross-sectional view showing a multilayer circuit board according to another embodiment of the present disclosure.

[0137] Reference Figure 7 The multilayer circuit board 1 may include a central material 10 and multiple materials. In an embodiment, the multiple materials may include the central material 10, a first material 21, a second material 22, a third material 31, a fourth material 41, a fifth material 32, and a sixth material 42.

[0138] The second material 22, the sixth material 42, the fifth material 32, the center material 10, the third material 31, the fourth material 41, and the first material 21 may be arranged in the multilayer circuit board 1 in the following order: second material 22, sixth material 42, fifth material 32, center material 10, third material 31, fourth material 41, and first material 21. The multilayer circuit board 1 may be a circuit board manufactured for signal connections between electronic components in an electronic device.

[0139] The core material 10 may include a core layer 11 and a metal pattern 12. The core layer 11 may include a first surface 11S1 and a second surface 11S2. The second surface 11S2 may be a surface on the opposite side to the first surface 11S1. The metal pattern 12 may be disposed on at least one of the first surface 11S1 and the second surface 11S2. In an embodiment, the metal pattern 12 may include a first metal pattern 14 and a second metal pattern 16. The first metal pattern 14 may be disposed on the first surface 11S1. The second metal pattern 16 may be disposed on the second surface 11S2.

[0140] The third material 31 may cover the first metal pattern 14. The third material 31 may be disposed on the first surface 11S1 of the core layer 11 and the first metal pattern 14. The third material 31 may be a prepreg. For example, the third material 31 may be formed by impregnating glass cloth or glass nonwoven fabric with a thermosetting resin and then semi-curing the impregnated material.

[0141] The fifth material 32 may cover the second metal pattern 16. The fifth material 32 may be disposed on the second surface 11S2 of the core layer 11 and the second metal pattern 16. The center material 10 may be disposed between the third material 31 and the fifth material 32. The third material 31 and the fifth material 32 may include the same substance. The fifth material 32 may be a prepreg. For example, the fifth material 32 may be formed by impregnating glass cloth or glass nonwoven fabric with a thermosetting resin and then semi-curing the impregnated material.

[0142] A fourth material 41 may be disposed on the third material 31. In one embodiment, the fourth material 41 may be disposed on the first surface 11S1 side of the core layer 11. In one embodiment, the fourth material 41 may be a non-patterned metal sheet with high conductivity, such as copper foil.

[0143] A sixth material 42 may be disposed on the fifth material 32. In one embodiment, the sixth material 42 may be disposed on the second surface 11S2 side of the core layer 11. The center material 10, the third material 31, and the fifth material 32 may be disposed between the fourth material 41 and the sixth material 42. The sixth material 42 and the fourth material 41 may have the same material. In some embodiments, the sixth material 42 may be a non-patterned metal sheet with high conductivity, such as copper foil.

[0144] The first material 21 may be disposed on the fourth material 41. The first material 21 may be a cover foil. In one embodiment, the first material 21 may be a carrier made of copper foil. The second material 22 may be disposed on the sixth material 42. In one embodiment, the center material 10, the third material 31, the fourth material 41, the fifth material 32, and the sixth material 42 may be disposed between the first material 21 and the second material 22. In one embodiment, the second material 22 may be a carrier made of copper foil. The first material 21 and the second material 22 may have the same material.

[0145] The multilayer circuit board 1 described above may have a structure in which composite materials are stacked. The first material 21 and the second material 22 may have the same material and be arranged symmetrically. The third material 31 and the fifth material 32 may have the same material and be arranged symmetrically. The fourth material 41 and the sixth material 42 may have the same material and be arranged symmetrically.

[0146] The multilayer circuit board manufacturing apparatus and method according to embodiments of the present disclosure enable the continuous manufacturing of multilayer circuit boards. Furthermore, when manufacturing multilayer circuit boards, the multilayer circuit board manufacturing apparatus and method according to embodiments of the present disclosure can provide constant pressure and uniform temperature to the entire surface of the multilayer circuit board.

[0147] Although this disclosure has been described with reference to the above embodiments, various modifications or variations may be made without departing from the subject matter and scope of this disclosure. Therefore, the appended claims may include such modifications or variations, provided that such modifications or variations fall within the subject matter of this disclosure.

[0148] It should be understood that the embodiments described herein are to be considered illustrative only and not for limiting purposes. The description of features or aspects in each embodiment should generally be considered as applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various changes in form and detail may be made herein without departing from the spirit and scope of this disclosure as defined by the foregoing claims.

Claims

1. A multilayer circuit board manufacturing equipment, comprising: Multiple uncoilers are configured to supply multiple different components; as well as The compressor is configured to engage the components supplied from a respective uncoiler among the plurality of uncoilers. The compressor included in the above includes: The belt rotates in contact with a surface of one of the plurality of different components; and The pressing device is located inside the belt and spaced apart from the belt, and presses the belt toward the member in a non-contact manner. The pressing device includes: A fluid pressing unit is configured to supply fluid toward the belt; and A fluid outlet is located adjacent to the fluid pressing unit and collects the fluid.

2. The multilayer circuit board manufacturing equipment according to claim 1, wherein the compressor further includes a belt roller located inside the belt and causing the belt to rotate.

3. The multilayer circuit board manufacturing equipment according to claim 1, wherein the pressing device includes a fluid inlet connected to the fluid pressing unit and guiding the fluid to the fluid pressing unit.

4. The multilayer circuit board manufacturing equipment according to claim 3, wherein the fluid inlet is provided in multiple locations, and Multiple fluid inlets are connected to the fluid pressing unit and are spaced apart from each other by a certain distance.

5. The multilayer circuit board manufacturing equipment according to claim 1 further includes a winding machine configured to wind the multilayer circuit board, wherein the plurality of components passing through the compressor are laminated in the multilayer circuit board.

6. The multilayer circuit board manufacturing apparatus of claim 5 further includes a curing device configured to cure the multilayer circuit board wound around the winding machine.

7. The multilayer circuit board manufacturing equipment according to claim 6, wherein the curing device comprises: An oven is located in which the multilayer circuit board wound around the winding machine is situated; A support member is located inside the oven and supports the multilayer circuit board; as well as The heating section is located in the oven and provides heat to the multilayer circuit board.

8. The multilayer circuit board manufacturing equipment according to claim 6, wherein the curing device comprises: An unwinding roller, on which the multilayer circuit board wound around the winding machine is disposed and unwound from the unwinding roller; A heating unit is configured to heat the multilayer circuit board unwound from the unwinding roller; as well as A winding roller is configured to wind the multilayer circuit board that has passed through the heating unit.

9. The multilayer circuit board manufacturing equipment according to claim 8, wherein the heating unit comprises: The heating chamber is configured to provide space for the multilayer circuit board to move within it; as well as The heating section is located within the heating chamber and heats the multilayer circuit board.

10. A method for manufacturing a multilayer circuit board, comprising: Unwind each of the multiple components; The plurality of components are laminated in a compressor machine; as well as Heat is applied to the laminated components in a curing apparatus to fix the components in place. The compressor included in the above includes: The belt rotates upon contact with a surface of one of the plurality of components; and The pressing device is located inside the belt and spaced apart from the belt, and presses the belt toward the member in a non-contact manner. The pressing device includes: A fluid pressing unit is configured to supply fluid toward the belt; and A fluid outlet is located adjacent to the fluid pressing unit and collects the fluid.

11. The method for manufacturing a multilayer circuit board according to claim 10, further comprising winding the laminated plurality of components.

12. The method for manufacturing a multilayer circuit board according to claim 10, wherein the curing apparatus comprises: An oven is located in which a multi-layer circuit board wound around a winding machine is situated; A support member is located inside the oven and supports the multilayer circuit board; as well as The heating section is located in the oven and provides heat to the multilayer circuit board.

13. The method for manufacturing a multilayer circuit board according to claim 10, wherein the curing apparatus comprises: A dewinding roller on which a multi-layer circuit board wound around a winding machine is disposed and unwound from the dewinding roller; A heating unit is configured to heat the multilayer circuit board unwound from the unwinding roller; as well as A winding roller is configured to wind the multilayer circuit board that has passed through the heating unit.

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