A thermal insulation structure and wafer heating device

Abstract

The present invention discloses a thermal insulation structure and a wafer heating device, which belong to the field of semiconductor technology. The thermal insulation structure includes a grid structure and a thermal insulation layer arranged inside the grid structure. The top surface of the grid structure can be used to place objects. The projections of the grid structure along the heat source conduction direction are all located within the range covered by the thermal insulation layer. The grid structure and the thermal insulation layer are integrally formed by 3D printing. The wafer heating device includes the thermal insulation structure as described above. The grid structure is in direct contact with the object and can reduce heat conduction. The thermal insulation layer can block heat transfer caused by air convection and thermal radiation, thereby improving the thermal insulation effect. The grid structure can reduce the weight of the thermal insulation structure, and the thermal insulation layer plays a role in increasing strength. The grid structure cooperates with the thermal insulation layer to reduce deformation and extend service life.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a heat insulation structure and a wafer heating device. Background Art

[0002] In semiconductor applications like laser annealing and wafer bonding, wafer heating is often required. This is typically done using a heating plate made of high-temperature alloy or ceramic. The wafer is placed on the plate and heated. Depending on the application, the heating temperature can reach hundreds of degrees Celsius. The plate typically requires some type of thermal insulation structure to provide uniform and rigid support, while also preventing the high temperature from being transferred to other environments.

[0003] In existing technologies, using traditional polymer insulation materials often shortens the lifespan of the insulation structure due to high temperatures, thus affecting the reliability of the device. Using foamed metals is prone to contamination, lacks strength, and has limited insulation effectiveness. Using fins or other structures can easily scratch the surface of the heating plate. Using composite materials increases manufacturing complexity. Summary of the Invention

[0004] The purpose of the present invention is to provide a thermal insulation structure and a wafer heating device to solve the technical problems existing in the prior art of short service life of the thermal insulation structure, poor thermal insulation effect and great manufacturing difficulty.

[0005] As conceived above, the technical solution adopted by the present invention is:

[0006] A thermal insulation structure includes a grid structure and a thermal insulation layer arranged inside the grid structure. The top surface of the grid structure can be used to place objects. The projections of the grid structure along the direction of heat source conduction are all located within the range covered by the thermal insulation layer. The grid structure and the thermal insulation layer are integrally formed by 3D printing.

[0007] Wherein, the thickness of the thermal insulation layer is 0.15mm to 3mm.

[0008] Wherein, the thermal insulation layer is a continuous planar structure.

[0009] The grid structure has a grid surface, and the heat insulation layer coincides with the grid surface.

[0010] Wherein, the heat insulation layer is a continuous curved surface structure.

[0011] The thermal insulation layer is a discontinuous curved surface structure, and the thermal insulation layer includes a plurality of thermal insulation sub-layers. The projections of the junctions of adjacent thermal insulation sub-layers in the heat source conduction direction have an overlapping area.

[0012] The top surface of the grid structure is a grid surface, or the top surface of the grid structure is a lattice layer.

[0013] Wherein, the thermal insulation structure is made of metal or ceramic.

[0014] The filling density of the grid structure gradually decreases from the position of the thermal insulation layer to both sides.

[0015] A wafer heating device comprises the above-mentioned thermal insulation structure.

[0016] Beneficial effects of the present invention:

[0017] The insulation structure proposed in this invention features a grid structure that directly contacts the object, reducing heat conduction. The insulation layer blocks heat transfer due to air convection and thermal radiation, thereby enhancing insulation effectiveness. The grid structure reduces the weight of the insulation structure, while the insulation layer increases its strength. The grid structure and insulation layer work together to minimize deformation and extend service life. The grid structure and insulation layer are integrally formed via 3D printing, simplifying manufacturing and facilitating processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of a heat insulation structure provided in Example 1 of the present invention;

[0019] Figure 2 is a schematic diagram of a heat insulation structure provided by a second embodiment of the present invention;

[0020] Figure 3 This is a partial structural diagram of the heat insulation structure provided by the second embodiment of the present invention;

[0021] Figure 4 yes Figure 3 Schematic diagram of part of the structure;

[0022] Figure 5 is a schematic diagram of a heat insulation structure provided by a third embodiment of the present invention;

[0023] Figure 6 is a schematic diagram of a heat insulation structure provided by a fourth embodiment of the present invention;

[0024] Figure 7 is a schematic diagram of a heat insulation structure provided by a fifth embodiment of the present invention;

[0025] Figure 8 This is a schematic diagram of the heat insulation structure provided in Example 6 of the present invention.

[0026] In the picture:

[0027] 10. Grid structure; 101. Top surface; 102. Bottom surface;

[0028] 20. Thermal insulation layer. DETAILED DESCRIPTION

[0029] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, but are not to be construed as limiting the present invention.

[0030] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0031] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0032] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0033] Example 1

[0034] See also Figure 1 An embodiment of the present invention provides a thermal insulation structure that is integrally formed through 3D printing, reducing manufacturing complexity and facilitating processing and production. The thermal insulation structure is made of metal or ceramic. The metal can be stainless steel, titanium alloy, aluminum alloy, or other metals suitable for 3D printing. During use, the thermal insulation structure can withstand a pressure of 3 tons.

[0035] The thermal insulation structure includes a grid structure 10 and a thermal insulation layer 20 arranged inside the grid structure 10. The grid structure 10 can reduce the weight of the thermal insulation structure, and the thermal insulation layer 20 plays a role in increasing the strength. The grid structure 10 and the thermal insulation layer 20 cooperate to reduce deformation and extend service life.

[0036] The top surface 101 of the grid structure 10 can be used to place items. During use, the upward-facing side of the grid structure 10 is the top surface 101, and the downward-facing side of the grid structure 10 is the bottom surface 102. In essence, items can be placed regardless of whether the top surface 101 or the bottom surface 102 faces upward. Because the items are in direct contact with the grid structure 10, heat conduction can be reduced.

[0037] The projections of the grid structure 10 along the heat source conduction direction are all located within the range covered by the heat insulation layer 20. The heat insulation layer 20 can block the heat transfer caused by air convection and heat radiation, thereby improving the heat insulation effect.

[0038] In this embodiment, the thermal insulation layer 20 is disposed in the middle of the grid structure 10 , and the grid structure 10 is symmetrically disposed relative to the thermal insulation layer 20 , so that the thermal insulation structure has high symmetry and uniform stress.

[0039] The thickness of the heat insulation layer 20 is 0.15 mm to 3 mm, thereby reducing the weight of the structure while ensuring the strength of the structure.

[0040] The grid structure 10 includes a plurality of substructures, each of which is a polyhedron structure, a multi-sided pyramid structure, or a multi-sided prism structure. When modeling, a Tet, Quad, Hex, or Wedge structure filling may be considered.

[0041] In this embodiment, the substructure is a tetrahedral structure.

[0042] The packing density of the grid structure 10 gradually decreases from the position of the thermal insulation layer 20 to both sides. In other words, the closer to the thermal insulation layer 20, the greater the density of the grid structure 10. The thermal insulation layer 20 serves to increase the strength.

[0043] Specifically, between the thermal insulation layer 20 and the top surface 101 of the grid structure 10, the multiple substructures of the grid structure 10 are divided into several layers. The innermost layer is connected to the thermal insulation layer 20, and the density of the substructure in the innermost layer is the highest. The top surface 101 of the grid structure 10 is the outermost layer, and the density of the substructure in the outermost layer is the lowest.

[0044] In this embodiment, the unit size of the innermost substructure connected to the insulation layer 20 is between 0.1 mm and 8 mm, and the unit size of the outermost layer located at the top surface 101 of the grid structure 10 is between 6 mm and 30 mm. The filling density of the grid structure 10 gradually decreases from the insulation layer 20 to the top surface 101 of the grid structure 10.

[0045] Correspondingly, between the thermal insulation layer 20 and the bottom surface 102 of the grid structure 10, the multiple substructures of the grid structure 10 are divided into several layers. The innermost layer is connected to the thermal insulation layer 20, and the density of the substructure in the innermost layer is the highest. The bottom surface 102 of the grid structure 10 is the outermost layer, and the density of the substructure in the outermost layer is the lowest.

[0046] In this embodiment, the unit size of the innermost substructure connected to the insulation layer 20 is between 0.1 mm and 8 mm, and the unit size of the outermost layer located at the bottom surface 102 of the grid structure 10 is between 6 mm and 30 mm. The filling density of the grid structure 10 gradually decreases from the insulation layer 20 to the bottom surface 102 of the grid structure 10.

[0047] In this embodiment, the heat insulating layer 20 is a continuous planar structure, which is firmly combined with the grid structure 10 and has good strength.

[0048] The grid structure 10 has a grid surface, that is, among the multiple substructures, each substructure has a surface that is coplanar with a surface of an adjacent substructure, and then the multiple surfaces are spliced ​​into a grid surface.

[0049] In this embodiment, the top surface 101 and the bottom surface 102 of the grid structure 10 are both grid surfaces. The middle position of the grid structure 10 forms a grid surface, and the thermal insulation layer 20 overlaps with the grid surface, so that the grid structure 10 and the thermal insulation layer 20 have a larger contact area.

[0050] The shape of the heat-insulating structure is set according to the shape of the article to be insulated. In this embodiment, the heat-insulating structure is disc-shaped. In other cases, the heat-insulating structure can be set into a desired shape.

[0051] Example 2

[0052] Figures 2 to 4 A second embodiment is shown, wherein components identical or corresponding to those in the first embodiment are designated with corresponding reference numerals. For simplicity, only the differences between the second embodiment and the first embodiment are described. The differences are that the top surface 101 of the grid structure 10 is a lattice layer, while the bottom surface 102 of the grid structure 10 is a grid surface. The provision of the lattice layer reduces the contact area between the object and the grid structure 10, thereby reducing heat conduction and improving the thermal insulation effect.

[0053] In this embodiment, the thermal insulation layer 20 is a continuous curved surface structure. Specifically, the thermal insulation layer 20 is a continuous wavy surface structure to increase the contact area with the grid structure 10. During 3D printing, the thermal insulation layer 20 is less deformed and the processing technology is simple.

[0054] Example 3

[0055] Figure 5 A third embodiment is shown, wherein components identical or corresponding to those in the first embodiment are numbered accordingly. For simplicity, only the differences between the third embodiment and the first embodiment are described. The difference lies in that the central portion of the grid structure 10 forms a grid surface, and the thermal insulation layer 20 is spaced apart from the grid surface to enhance structural strength.

[0056] The top surface 101 of the grid structure 10 is a lattice layer, and the bottom surface 102 of the grid structure 10 is a grid surface. The arrangement of the lattice layer can reduce the contact area between the object and the grid structure 10, thereby reducing heat conduction and improving the heat insulation effect.

[0057] Example 4

[0058] Figure 6 A fourth embodiment is shown, wherein components identical or corresponding to those in the first embodiment are denoted by the corresponding reference numerals. For simplicity, only the differences between the fourth embodiment and the first embodiment are described. The difference lies in the fact that the thermal insulation layer 20 has a discontinuous curved surface structure. Specifically, the thermal insulation layer 20 comprises multiple thermal insulation sub-layers, with the projections of adjacent thermal insulation sub-layers in the direction of heat conduction having overlapping areas, resulting in the entire thermal insulation layer 20 being a complete, solid surface.

[0059] In this embodiment, the top surface 101 and the bottom surface 102 of the grid structure 10 are both lattice layers. No matter which side faces upward, the contact area between the grid structure 10 and the object can be reduced, thereby reducing heat conduction and improving the thermal insulation effect.

[0060] Example 5

[0061] Figure 7 A fifth embodiment is shown, wherein components identical or corresponding to those in the first embodiment are denoted by corresponding reference numerals. For simplicity, only the differences between the fifth embodiment and the first embodiment are described. The difference lies in the provision of multiple thermal insulation layers 20, which are spaced apart along the direction of heat conduction to enhance radiation protection.

[0062] The heat insulation layer 20 may be a continuous plane or a discontinuous plane.

[0063] In this embodiment, two thermal insulation layers 20 are provided, one thermal insulation layer 20 is a continuous plane, and the other thermal insulation layer 20 is a discontinuous plane. The discontinuous plane is divided into two discontinuous sub-layers, one sub-layer is located above the continuous plane, and the other sub-layer is located below the continuous plane.

[0064] Example 6

[0065] Figure 8 A sixth embodiment is shown, wherein components identical or corresponding to those in the first embodiment are denoted by reference numerals corresponding to those in the first embodiment. For simplicity, only the differences between the sixth embodiment and the first embodiment are described. The difference is that the grid structure 10 includes a plurality of substructures, each of which is an octahedral structure.

[0066] An embodiment of the present invention also provides a wafer heating device, including the above-mentioned thermal insulation structure. When in use, the wafer is located on the heating plate, and the heating plate is placed on the grid structure 10 of the thermal insulation structure. The grid structure 10 is in direct contact with the object, which can reduce heat conduction, and the thermal insulation layer 20 can block heat transfer caused by air convection and thermal radiation, thereby improving the thermal insulation effect. The grid structure 10 can reduce the weight of the thermal insulation structure, and the thermal insulation layer 20 plays a role in increasing the strength. The grid structure 10 cooperates with the thermal insulation layer 20 to reduce deformation and extend service life. The grid structure 10 and the thermal insulation layer 20 are integrally formed by 3D printing, which reduces the manufacturing difficulty and facilitates processing and production.

[0067] The above embodiments merely illustrate the basic principles and features of the present invention. The present invention is not limited to the above embodiments. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer heating device, characterized in that: The invention comprises a heat insulation structure, wherein the heat insulation structure comprises a grid structure (10) and a heat insulation layer (20) arranged inside the grid structure (10); the top surface (101) of the grid structure (10) is used for placing objects; the projections of the grid structure (10) along the heat source conduction direction are all located within the range covered by the heat insulation layer (20); and the grid structure (10) and the heat insulation layer (20) are integrally formed by 3D printing.

2. The wafer heating device according to claim 1, wherein: The thickness of the heat insulation layer (20) is 0.15 mm to 3 mm.

3. The wafer heating device according to claim 1, wherein: The heat insulation layer (20) is a continuous planar structure.

4. The wafer heating device according to claim 3, wherein: The grid structure (10) has a grid surface, and the heat insulation layer (20) coincides with the grid surface.

5. The wafer heating device according to claim 1, wherein: The heat insulation layer (20) is a continuous curved surface structure.

6. The wafer heating device according to claim 1, wherein: The heat insulation layer (20) is a discontinuous curved surface structure, and the heat insulation layer (20) comprises a plurality of heat insulation sub-layers, and projections of the junctions of adjacent heat insulation sub-layers in the heat source conduction direction have overlapping areas.

7. The wafer heating device according to claim 1, wherein: The top surface (101) of the grid structure (10) is a grid surface, or the top surface (101) of the grid structure (10) is a lattice layer.

8. The wafer heating device according to claim 1, wherein: The heat insulation structure is made of metal or ceramic.

9. The wafer heating device according to any one of claims 1 to 8, characterized in that: The filling density of the grid structure (10) gradually decreases from the position of the thermal insulation layer (20) toward both sides.

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