Evaporator and loop heat pipe

Abstract

The embodiment of the present application provides an evaporator and loop heat pipe, which comprises a shell, a partition and a heat conduction structure; the shell is internally formed with a cavity; the partition is used for separating the cavity into an evaporation cavity and a compensation cavity, the compensation cavity is used for filling working medium; a first capillary structure is formed on a first heat absorbing wall of the evaporation cavity in contact with a heat source, a second capillary structure is formed on a second heat absorbing wall of the evaporation cavity opposite to the first heat absorbing wall, the first capillary structure and the second capillary structure can draw working medium from the compensation cavity, and evaporate the working medium into the evaporation cavity under the heating of the heat source; the heat conduction structure is vertically arranged in the evaporation cavity, one end of the heat conduction structure is connected with the first heat absorbing wall, the other end of the heat conduction structure is connected with the second heat absorbing wall, and the heat conduction structure is used for conducting heat generated by the heat source from the first heat absorbing wall to the second capillary structure. The evaporator and loop heat pipe can reduce the starting temperature of the evaporator and improve the heat dissipation efficiency.

Description

Technical Field

[0001] This invention relates to the field of loop heat pipe technology, and more particularly to an evaporator and a loop heat pipe. Background Technology

[0002] A loop heat pipe is a device that uses the phase change of the working fluid for heat transfer and is now widely used in the heat dissipation of various high heat flux density heating elements. A loop heat pipe generally consists of an evaporator, gas lines and liquid lines connected to the evaporator, and a condenser located at the junction of the gas lines and liquid lines.

[0003] An evaporator includes a compensation chamber and an evaporation chamber. The compensation chamber is filled with a liquid working fluid. A capillary structure is attached to the inner surface of the evaporator's heat-absorbing wall. The capillary structure draws the working fluid from the compensation chamber, and the heat conducted from the heat-absorbing wall heats the working fluid within the capillary structure, causing it to evaporate into a gaseous state and enter the evaporation chamber. The vapor in the evaporation chamber flows along the gas pipeline under its own pressure, reaches the condenser, dissipates heat, condenses, and returns to the liquid state. It then flows back to the compensation chamber via the liquid pipeline, thus forming a heat dissipation cycle. In the process of developing this application, the inventors discovered that the prior art has at least the following problems: In the prior art, the evaporator mainly utilizes a single heat-absorbing wall in contact with the heat source. Therefore, only the capillary structure located on the inner surface of the heat-absorbing wall can generate steam, resulting in low evaporation efficiency and low vapor pressure, leading to slow circulation and low heat dissipation efficiency. Summary of the Invention

[0004] This invention provides an evaporator and a loop heat pipe to improve the problem that the evaporator of the loop heat pipe in the prior art uses a single heat-absorbing wall for heat absorption and evaporation, resulting in low evaporation efficiency and thus low heat dissipation efficiency.

[0005] In an embodiment of the present invention, the evaporator includes:

[0006] An outer casing, wherein a cavity is formed inside the outer casing;

[0007] An isolator is disposed in the cavity to divide the cavity into an evaporation cavity and a compensation cavity, the compensation cavity being filled with a working fluid; a first capillary structure is formed on the first heat-absorbing wall of the evaporation cavity that is in contact with the heat source, and a second capillary structure is formed on the second heat-absorbing wall of the evaporation cavity that is opposite to the first heat-absorbing wall; the first capillary structure and the second capillary structure can draw the working fluid from the compensation cavity and evaporate the working fluid into the evaporation cavity under the heating of the heat source;

[0008] A heat-conducting structure is erected in the evaporation chamber. One end of the heat-conducting structure is connected to the first heat-absorbing wall, and the other end is connected to the second heat-absorbing wall. It is used to conduct the heat generated by the heat source from the first heat-absorbing wall to the second capillary structure.

[0009] As a further alternative to the evaporator, a vacuum chamber is formed within the heat-conducting structure, the vacuum chamber is filled with a working fluid, and a third capillary structure is formed on the surrounding wall of the vacuum chamber.

[0010] As a further optional embodiment of the evaporator, the outer casing is connected to a first degassing pipe and a second degassing pipe. The first degassing pipe is connected to the vacuum chamber and serves as a channel for removing air from the vacuum chamber and injecting working fluid. The second degassing pipe is connected to the compensation chamber and serves as a channel for removing air from the compensation chamber and injecting working fluid.

[0011] As a further alternative to the evaporator, the heat-conducting structure includes sidewalls and two endwalls, the sidewalls surrounding and connecting the outer peripheries of the two endwalls and located between the two endwalls, such that the heat-conducting structure forms a completely closed structure; or

[0012] The heat-conducting structure includes a sidewall and an endwall. The sidewall surrounds the outer periphery of the endwall, forming an open-end structure. The opening of the heat-conducting structure is sealed to the first heat-absorbing wall, and the third capillary structure is connected to the first capillary structure; or the opening of the heat-conducting structure is sealed to the second heat-absorbing wall, and the third capillary structure is connected to the second capillary structure; or...

[0013] The heat-conducting structure includes only sidewalls, forming a structure with openings at both ends. One opening of the heat-conducting structure is sealed to the first heat-absorbing wall, and the other opening of the heat-conducting structure is sealed to the second heat-absorbing wall. The third capillary structure is connected to both the first capillary structure and the second capillary structure.

[0014] As a further alternative to the evaporator, a fourth capillary structure is formed on the outer surface of the sidewall, the fourth capillary structure being connected to the first capillary structure and the second capillary structure respectively.

[0015] As a further alternative to the evaporator, the capillary force of the fourth capillary structure is greater than that of the first capillary structure and the second capillary structure, respectively, to form a gradient capillary structure.

[0016] As a further alternative to the evaporator, the sidewall, together with the fourth capillary structure, protrudes outward from the heat-conducting structure to form a plurality of protrusions.

[0017] As a further alternative to the evaporator, at least one of the protrusions extends from the evaporation chamber through the separator and into the compensation chamber.

[0018] As a further alternative to the evaporator, the isolation member is coaxially arranged with the outer casing, such that the evaporation chamber is formed in the middle of the cavity, and the compensation chamber surrounds the outer side of the evaporation chamber.

[0019] In an embodiment of the invention, the loop heat pipe includes a liquid pipeline, a gas pipeline, a heat exchange assembly, and an evaporator as described in any of the preceding embodiments; one end of the liquid pipeline is connected to the compensation cavity, and the other end is connected to the heat exchange assembly; one end of the gas pipeline is connected to the evaporation cavity, and the other end is connected to the heat exchange assembly, wherein the heat exchange assembly is used to convert the gaseous working fluid in the gas pipeline into a liquid state so that it flows into the liquid pipeline.

[0020] Implementing the embodiments of the present invention will have at least the following beneficial effects:

[0021] According to the evaporator of the above embodiment, by setting a heat-conducting structure in the evaporation chamber, the heat generated by the heat source is conducted from the first heat-absorbing wall to the second heat-absorbing wall, which expands the heat flow input area of ​​the heat source, accelerates the evaporation rate, increases the vapor pressure, and thus improves the heat dissipation effect.

[0022] According to the above embodiment, the loop heat pipe expands the heat flow input area of ​​the heat source, that is, it expands the evaporation area, thereby accelerating the evaporation rate, improving the efficiency of the working fluid circulation, and enhancing the overall heat dissipation effect. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] in:

[0025] Figure 1 This is a schematic diagram of the overall structure of the loop heat pipe in one embodiment of the present invention;

[0026] Figure 2 This is a schematic diagram of the internal structure of an evaporator in one embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram of the internal structure of the evaporator in another embodiment of the present invention;

[0028] Figure 4 This is a schematic diagram of the internal structure of the evaporator in another embodiment of the present invention;

[0029] Explanation of key component symbols:

[0030] 10-Evaporator, 11-Outer shell, 111-First heat-absorbing wall, 1111-First capillary structure, 112-Second heat-absorbing wall, 1121-Second capillary structure, 113-Evaporation chamber, 114-Compensation chamber, 115-First degassing pipe, 116-Second degassing pipe, 12-Isolation element, 13-Heat-conducting structure, 131-Vacuum chamber, 132-Third capillary structure, 133-Side wall, 1331-Protrusion, 134-End wall, 135-Fourth capillary structure;

[0031] 20 - Liquid pipeline;

[0032] 30 - Gas pipeline;

[0033] 40 - Heat exchanger assembly. Detailed Implementation

[0034] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many other different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0035] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0037] This invention provides an evaporator and a loop heat pipe to solve the problem that the evaporator of the loop heat pipe in the prior art uses a single heat-absorbing wall for heat absorption and evaporation, resulting in low evaporation efficiency and thus low heat dissipation efficiency.

[0038] In the embodiments of the present invention, please refer to Figure 1 The loop heat pipe includes an evaporator 10, a liquid line 20, a gas line 30, and a heat exchange assembly 40.

[0039] For evaporator 10, please refer to Figure 2The evaporator 10 includes a shell 11, an isolation element 12, and a heat-conducting structure 13. Specifically, a cavity is formed inside the outer shell 11; an isolator 12 is disposed in the cavity of the outer shell 11 to divide the cavity into an evaporation cavity 113 and a compensation cavity 114, the compensation cavity 114 being filled with a working fluid; a first capillary structure 1111 is formed on the first heat-absorbing wall 111 of the evaporation cavity 113 that is in contact with the heat source, and a second capillary structure 1121 is formed on the second heat-absorbing wall 112 inside the evaporation cavity 113 that is opposite to the first heat-absorbing wall 111; the first capillary structure 1111 and the second capillary structure 1121 can draw working fluid from the compensation cavity 114 and evaporate the working fluid into the evaporation cavity 113 under the heating of the heat source; a heat-conducting structure 13 is disposed in the evaporation cavity 113, one end of the heat-conducting structure 13 being connected to the first heat-absorbing wall 111 and the other end being connected to the second heat-absorbing wall 112, for conducting the heat generated by the heat source from the first heat-absorbing wall 111 to the second capillary structure 1121.

[0040] The aforementioned statement that "one end of the heat-conducting structure 13 is connected to the first heat-absorbing wall 111, and the other end is connected to the second heat-absorbing wall 112" specifically includes two scenarios: one where the end of the heat-conducting structure 13 is connected to the capillary structure on the heat-absorbing wall, and the other where the end of the heat-conducting structure 13 is connected to the wall of the heat-absorbing wall used for attaching the capillary structure. In this case, the capillary structure contacts the side of the heat-conducting structure 13 to conduct heat. In both scenarios, the heat-conducting structure 13 effectively conducts heat from the first heat-absorbing wall 111 to the second capillary structure 1121. Since the wall of the first heat-absorbing wall 111, where the first capillary structure 1111 is attached, is in direct contact with the heat source, in order to enable the heat-conducting structure 13 to absorb more heat, the end of the heat-conducting structure 13 that is connected to the first heat-absorbing wall 111 is preferably connected to the wall of the first heat-absorbing wall 111. Furthermore, to increase the heat absorption efficiency of the second capillary structure 1121, the end of the heat-conducting structure 13 that is connected to the second heat-absorbing wall 1121 is preferably connected to the second capillary structure 1121. This preferred solution... Figure 2 As shown in the image.

[0041] The capillary structures mentioned in the embodiments of the present invention can all adopt a relatively common design, specifically including two parts: a composite capillary structure and a channel capillary structure. The composite capillary structure is used to absorb liquid working fluid from the compensation cavity 114. After being heated by a heat source, the liquid working fluid forms a gaseous state and evaporates from the channel capillary structure into the evaporation cavity 113.

[0042] The method by which the first capillary structure 1111 and the second capillary structure 1121 draw working fluid from the compensation cavity includes two cases. In one case, no capillary structures are formed on the heat-conducting structure 13 to connect with the first capillary structure 1111 and the second capillary structure 1121 respectively. In this case, both the first capillary structure 1111 and the second capillary structure 1121 are disposed within the evaporation cavity 113 and extend through the separator 12 into the compensation cavity 114, thereby enabling them to draw working fluid. In the other case, capillary structures (i.e., the third capillary structure 132 and the fourth capillary structure 135 involved in subsequent embodiments) are formed on the heat-conducting structure 13 to connect with the first capillary structure 1111 and the second capillary structure 1121 respectively. In this case, the first capillary structure 1111 and the second capillary structure 1121... The fine structure 1121 can be configured such that only one of them extends through the separator 12 into the compensation cavity 114 to draw in the working fluid, while the other is formed only in the evaporation cavity 113. In this case, the working fluid is transferred through the capillary structure on the heat-conducting structure 13 to the capillary structure formed only in the evaporation cavity 113. Since in the actual use of the evaporator 10, the insufficient wettability of the capillary structure should be avoided as much as possible to prevent dry burning, in this case, the scheme in which both the first capillary structure 1111 and the second capillary structure 1121 are set in the evaporation cavity 113 and extend through the separator 12 into the compensation cavity 114 is still the preferred scheme.

[0043] For the loop heat pipe, one end of the liquid line 20 is connected to the compensation chamber 114, and the other end is connected to the heat exchange assembly 40; one end of the gas line 30 is connected to the evaporation chamber 113, and the other end is connected to the heat exchange assembly 40. The heat exchange assembly 40 is used to convert the gaseous working fluid in the gas line 30 into a liquid state so that it flows into the liquid line 20. The arrangement of the liquid line 20, gas line 30, and heat exchange assembly 40 can all be designed using existing technologies, and will not be elaborated here.

[0044] The working process of this loop heat pipe is as follows: the first heat-absorbing wall 111 of the evaporator 10 is brought into contact with a heat source (usually an electronic device or a heating element in an electronic device). The heat absorbed by the first heat-absorbing wall 111 is conducted to the second capillary structure 1121 on the second heat-absorbing wall 112 through the heat-conducting structure 13. The liquid working fluid absorbed by the first capillary structure 1111 and the second capillary structure 1121 from the compensation chamber 114 is converted into a gaseous state under the heating of the heat emitted by the heat source. The gaseous working fluid evaporates through the first capillary structure 1111 and the second capillary structure 1121. Most of the gaseous working fluid evaporates into the evaporation chamber 113, and a small part enters the compensation chamber 114. Due to the heat-conducting structure in the evaporation chamber, the evaporation area is increased. As a result, the vapor pressure formed in the evaporation chamber 113 is greater than the vapor pressure in the compensation chamber 114 (this is the starting condition of the evaporator 10). Under a certain starting pressure, when the evaporation area increases, the heating power required for starting decreases, which means the starting temperature is reduced. The vapor in the evaporation chamber 113 moves to the heat exchange assembly 40 through the gas pipeline 30 and undergoes a large amount of heat exchange at the heat exchange assembly 40, thereby turning back into a liquid state. It then flows back to the compensation chamber 114 through the liquid pipeline 20, thus forming a circulation of the working fluid.

[0045] For the evaporator 10, by setting the heat-conducting structure 13 in the evaporation chamber 113, the heat generated by the heat source is rapidly conducted from the first heat-absorbing wall 111 to the second heat-absorbing wall 112, thereby reducing the temperature of the wall of the first heat-absorbing wall 111 located in the evaporation chamber 113. Therefore, the temperature of the wall of the first heat-absorbing wall 111 located in the evaporation chamber 113 is lower than the temperature of the wall of the first heat-absorbing wall 111 located in the compensation chamber 114. More heat will be conducted to the wall of the first heat-absorbing wall 111 located in the evaporation chamber 113. In other words, the heat conducted to the portion of the first capillary structure 1111 and the second capillary structure 1121 located in the evaporation chamber 113 will increase, and the heat received by the portion located in the compensation chamber 114 will decrease. The vapor pressure difference between the evaporation chamber 113 and the compensation chamber 114 is more easily formed, thus reducing the start-up temperature of the evaporator 10. This means that compared with the prior art, the evaporator 10 can produce better heat dissipation when the heat source temperature is low. For loop heat pipes, the heat input area of ​​the heat source is expanded, which means the evaporation area is increased, thereby accelerating the evaporation rate, improving the efficiency of the working fluid circulation, and enhancing the overall heat dissipation effect.

[0046] For the implementation of the heat-conducting structure 13, the simplest way to set it up is to select a material with high thermal conductivity, such as gold, silver, or copper, and connect it between the first heat-absorbing wall 111 and the second heat-absorbing wall 112. However, the temperature uniformity and heat transfer efficiency of this solution are still difficult to achieve a satisfactory level.

[0047] In one embodiment, a vacuum cavity 131 is formed within the heat-conducting structure 13, the vacuum cavity 131 is filled with a working fluid, and a third capillary structure 132 is formed on the surrounding wall of the vacuum cavity 131.

[0048] In this embodiment, one end of the heat-conducting structure 13 is the evaporation end and the other end is the condensation end. When the evaporation end of the heat-conducting structure 13 is heated, the liquid in the third capillary structure 132 rapidly vaporizes. The vapor flows to the condensation end under the power of thermal diffusion and releases heat and condenses at the condensation end. The liquid then flows back to the evaporation end along the third capillary structure 132 by capillary action. This cycle continues until the temperatures at both ends of the heat-conducting structure 13 are equal.

[0049] In this embodiment, the heat-conducting structure 13 is equivalent to a "heat pipe" in the prior art, and the heat pipe has a thermal conductivity exceeding that of any known metal, thereby enabling the rapid transfer of heat from the first heat-absorbing wall 111 to the second heat-absorbing wall 112 in a short time. The heat pipe is preferably cylindrical or prismatic in shape.

[0050] In one specific embodiment, the heat-conducting structure 13 includes a sidewall 133 and two endwalls 134. The sidewall 133 surrounds and connects to the outer periphery of the two endwalls 134 and is located between the two endwalls 134, so that the heat-conducting structure 13 forms a completely closed structure.

[0051] In another specific embodiment, the heat-conducting structure 13 includes a sidewall 133 and an endwall 134. The sidewall 133 is connected around the outer periphery of the endwall 134, so that the heat-conducting structure 13 forms a structure with one end open. The surrounding wall of the opening of the heat-conducting structure 13 is sealed to the first heat-absorbing wall 111 and the third capillary structure 132 is connected to the first capillary structure 1111. Alternatively, the opening of the heat-conducting structure 13 is sealed to the second heat-absorbing wall 112 and the third capillary structure 132 is connected to the second capillary structure 1121.

[0052] In another specific embodiment, please refer to Figure 3 The heat-conducting structure 13 includes only the sidewall 133, which makes the heat-conducting structure 13 form a structure with open ends. The opening at one end of the heat-conducting structure 13 is sealed to the first heat-absorbing wall 111, and the opening at the other end is sealed to the second heat-absorbing wall 112. The third capillary structure 132 is connected to the first capillary structure 1111 and the second capillary structure 1121 respectively.

[0053] For the three specific embodiments described above, when the heat-conducting structure 13 only includes the sidewall 133, the sidewall 133 and the capillary structure thereon undertake the main heat-conducting function; when the heat-conducting structure 13 also includes an endwall 134 that contacts the second capillary structure 1121, the sidewall 133, the endwall 134 and the capillary structures attached to both undertake the main heat-conducting function.

[0054] It should be noted that the connection between two different capillary structures mentioned in this invention specification refers to the connection of different capillary structures to form a functionally unified whole, so that the different capillary structures can work together to transport and evaporate the working fluid.

[0055] In a more specific embodiment, a fourth capillary structure 135 is formed on the outer surface of the sidewall 133, and the fourth capillary structure 135 is connected to the first capillary structure 1111 and the second capillary structure 1121 respectively. In this case, the fourth capillary structure 135, together with the first capillary structure 1111 and the second capillary structure 1121, participates in the transport and evaporation of the working fluid.

[0056] The advantage of this embodiment is that the fourth capillary structure 135 on the outer surface of the heat-conducting structure 13 participates in the transport and evaporation of the working fluid, expands the heat exchange area, reduces the impact of evaporation and boiling limitation caused by concentrated heat density, and enhances the heat transfer performance. At the same time, the fourth capillary structure 135 connects the first capillary structure 1111 and the second capillary structure 1121, so that the three form a functionally unified whole, and the working fluid can be transported among the three, improving the operating performance of the evaporator 10 and making the evaporator 10 have better anti-gravity performance in anti-gravity application scenarios (heat source above, evaporator 10 below).

[0057] In a more specific embodiment, the capillary force of the fourth capillary structure 135 is greater than that of the first capillary structure 1111 and the second capillary structure 1121, respectively, to form a gradient capillary structure.

[0058] The purpose of setting up a gradient capillary structure is to enable the fourth capillary structure 135 to better absorb the working fluid from the first capillary structure 1111 and the second capillary structure 1121, thereby improving the evaporation efficiency.

[0059] In one embodiment, please refer to Figure 4 With the fourth capillary structure 135 formed on the outer surface of the sidewall 133 of the heat-conducting structure 13, the sidewall 133 together with the fourth capillary structure 135 protrudes to the outer side of the heat-conducting structure 13 to form a number of protrusions 1331.

[0060] The purpose of setting the protrusion 1331 is to further expand the heat exchange area and enhance the heat transfer performance.

[0061] It is conceivable that, in order to improve heat dissipation, the protrusions 1331 can be set in multiples and arranged at even intervals.

[0062] In one specific embodiment, a cavity is formed inside the protrusion 1331, which is connected to the vacuum cavity 131 of the heat-conducting structure 13, so that heat can be conducted to the fourth capillary structure 135 on the protrusion 1331 more quickly.

[0063] In one specific embodiment, at least one of the protrusions 1331 extends from the evaporation chamber 113 through the separator 12 and into the compensation chamber 114.

[0064] The advantage of this implementation scheme is that after the protrusion 1331 reaches the compensation cavity 114, the fourth capillary structure 135 of the protrusion 1331 can directly absorb the liquid working fluid, reducing the distance for the liquid working fluid to reach the heat conduction structure 13, improving the operating performance of the evaporator 10, and at the same time, under the application of anti-gravity, the evaporator 10 has better anti-gravity properties.

[0065] To facilitate the extraction of gas from the evaporator 10 and the injection of working fluid, in one embodiment, a first degassing pipe 115 and a second degassing pipe 116 are connected to the outer casing 11. The first degassing pipe 115 is connected to the vacuum chamber 131 of the heat-conducting structure 13 and serves as a channel for extracting air from the vacuum chamber 131 and injecting working fluid. The second degassing pipe 116 is connected to the compensation chamber 114 and serves as a channel for extracting air from the compensation chamber 114 and injecting working fluid.

[0066] In one embodiment, the isolator 12 is coaxially arranged with the housing 11, such that the evaporation chamber 113 is formed in the middle of the cavity of the housing 11, and the compensation chamber 114 surrounds the outside of the evaporation chamber 113. In this case, the gas line 30 can be connected to the evaporation chamber 113 via the compensation chamber 114 and the isolator 12, for example, by entering the evaporation chamber 113 from one side of the housing 11; the gas line 30 can also be directly connected to the evaporation chamber 113, for example, by entering the evaporation chamber 113 from the upper or lower end of the housing 11.

[0067] In some embodiments, the insulating element 12 is made of a material with low thermal conductivity, including but not limited to stainless steel and ceramic. The capillary structure may be sintered from copper powder, aluminum powder, nickel powder, copper braided mesh, stainless steel mesh, nickel mesh, nickel foam, etc. The liquid line 20 and the gas line 30 may be made of metals such as copper, aluminum, and stainless steel. The working fluid may include, but is not limited to, pure water, acetone, and methanol.

[0068] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0069] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. An evaporator, characterized in that, include: An outer casing, wherein a cavity is formed inside the outer casing; An isolator is disposed in the cavity to divide the cavity into an evaporation cavity and a compensation cavity, wherein the compensation cavity is used to fill the working fluid; A first capillary structure is formed on the first heat-absorbing wall in the evaporation chamber that is in contact with the heat source, and a second capillary structure is formed on the second heat-absorbing wall in the evaporation chamber that is opposite to the first heat-absorbing wall. The first capillary structure and the second capillary structure can draw working fluid from the compensation chamber and evaporate the working fluid into the evaporation chamber under the heating of the heat source. A heat-conducting structure is disposed in the evaporation chamber. One end of the heat-conducting structure is connected to the first heat-absorbing wall, and the other end is connected to the second heat-absorbing wall. It is used to conduct the heat generated by the heat source from the first heat-absorbing wall to the second capillary structure. A vacuum cavity is formed within the heat-conducting structure, the vacuum cavity is filled with a working fluid, and a third capillary structure is formed on the surrounding wall of the vacuum cavity.

2. The evaporator according to claim 1, characterized in that, The outer casing is connected to a first degassing pipe and a second degassing pipe. The first degassing pipe is connected to the vacuum chamber and serves as a channel for evacuating air from the vacuum chamber and injecting working fluid. The second degassing pipe is connected to the compensation chamber and serves as a channel for evacuating air from the compensation chamber and injecting working fluid.

3. The evaporator according to claim 1 or 2, characterized in that, The heat-conducting structure includes a sidewall and two endwalls. The sidewalls are connected around the outer periphery of the two endwalls and are located between the two endwalls, so that the heat-conducting structure forms a completely closed structure. or The heat-conducting structure includes a sidewall and an endwall. The sidewall is connected to the outer periphery of the endwall, so that the heat-conducting structure forms a structure with one end open. The opening of the heat-conducting structure is sealed to the first heat-absorbing wall and the third capillary structure is connected to the first capillary structure, or the opening of the heat-conducting structure is sealed to the second heat-absorbing wall and the third capillary structure is connected to the second capillary structure. Or The heat-conducting structure includes only sidewalls, forming a structure with openings at both ends. One opening of the heat-conducting structure is sealed to the first heat-absorbing wall, and the other opening of the heat-conducting structure is sealed to the second heat-absorbing wall. The third capillary structure is connected to both the first capillary structure and the second capillary structure.

4. The evaporator according to claim 3, characterized in that, A fourth capillary structure is formed on the outer surface of the sidewall, and the fourth capillary structure is connected to the first capillary structure and the second capillary structure respectively.

5. The evaporator according to claim 4, characterized in that, The capillary force of the fourth capillary structure is greater than that of the first capillary structure and the second capillary structure, respectively, so as to form a gradient capillary structure.

6. The evaporator according to claim 4 or 5, characterized in that, The sidewall, together with the fourth capillary structure, protrudes outward from the heat-conducting structure to form several protrusions. The interior of each protrusion has a cavity, which is connected to the vacuum cavity of the heat-conducting structure, so that heat can be conducted to the fourth capillary structure more quickly.

7. The evaporator according to claim 6, characterized in that, At least one of the protrusions extends from the evaporation chamber through the insulating member and into the compensation chamber.

8. The evaporator according to claim 1, characterized in that, The isolator is coaxially arranged with the outer shell, such that the evaporation chamber is formed in the middle of the cavity, and the compensation chamber surrounds the outer side of the evaporation chamber.

9. A loop heat pipe, characterized in that, It includes a liquid pipeline, a gas pipeline, a heat exchange assembly, and an evaporator as described in any one of claims 1-8; one end of the liquid pipeline is connected to the compensation chamber, and the other end is connected to the heat exchange assembly; one end of the gas pipeline is connected to the evaporation chamber, and the other end is connected to the heat exchange assembly, wherein the heat exchange assembly is used to convert the gaseous working fluid in the gas pipeline into a liquid state so that it flows into the liquid pipeline.

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