A ceramic-based electrical interconnection feedthrough substrate and method of making the same

By setting an array of conductive micropillars and an array of through-holes in the insulating layer within a ceramic substrate, and combining this with MEMS fabrication technology, the problem of high-density, hermetic electrical interconnection feedthrough was solved, achieving efficient electrical interconnection feedthrough, reducing processing costs and complexity, and ensuring biocompatibility and long-term stability.

CN115910431BActive Publication Date: 2026-06-16SHANGHAI JIAOTONG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANGHAI JIAOTONG UNIV
Filing Date
2022-11-08
Publication Date
2026-06-16

AI Technical Summary

⚠Technical Problem

Existing technologies struggle to achieve high-density, airtight electrical interconnects, and traditional processing methods suffer from high internal stress and complex processes.

⚗Method used

The structure design employs a ceramic substrate with an array of conductive micropillars and an array of through-holes in the insulating layer. The electrically interconnected micropillar array is formed by mold sintering and filling with conductive materials, and pads are deposited on the insulating layer. Combined with MEMS processing technology, it achieves high controllability and mass production capability.

🎯Benefits of technology

It achieves high-density, airtight electrical interconnection, reduces processing costs and process complexity, and ensures biocompatibility and long-term stability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a ceramic-based electric interconnection feedthrough substrate and a preparation method thereof. The substrate comprises a ceramic substrate, an upper insulating layer, a lower insulating layer, an upper pad and a lower pad. The ceramic substrate is internally provided with an electric interconnection microcolumn array formed by electrically conductive microcolumns. The upper insulating layer is located above the ceramic substrate. The lower insulating layer is located below the ceramic substrate. The upper insulating layer and the lower insulating layer are internally provided with a via array formed by a plurality of insulating layer vias. The positions of the insulating layer vias correspond to the positions of the electrically conductive microcolumns. The diameter of the insulating layer vias is smaller than the diameter of the electrically conductive microcolumns. The upper pad is located above the upper insulating layer and fills the insulating layer vias on the upper insulating layer and the gap between the upper insulating layer and the electrically conductive microcolumns. The lower pad is located below the lower insulating layer and fills the insulating layer vias on the lower insulating layer and the gap between the lower insulating layer and the electrically conductive microcolumns. The application realizes a biocompatible air-tight electric interconnection feedthrough which can be integrated with a flexible implantable electrode.
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