Substrate support assembly for substrate processing device

Abstract

This invention relates to a substrate support assembly for a substrate support device. The invention is characterized by comprising: a chuck base supporting the substrate to be processed, having a housing portion formed along the circumferential direction near its outer peripheral surface, and an upwardly opening receiving groove formed in the inner portion surrounded by the housing portion, capable of rotation about a rotation axis; a chuck pin disposed on the upper part of the housing portion of the chuck base, movable in directions away from and towards the substrate; a device portion disposed within the housing portion and connected to the chuck pin for moving the chuck pin; a drive portion for transmitting power to the device portion; and an ultrasonic cleaning unit housed in the receiving groove. The device portion is centrally disposed within the housing portion formed along the circumferential direction near the outer peripheral surface of the chuck base, and the ultrasonic cleaning unit is housed in the central receiving groove. Therefore, it can have the functional effect of cleaning the back side of the substrate using an ultrasonic generating unit.

Description

Technical Field

[0001] The present invention relates to a substrate support assembly for a substrate processing apparatus, and more specifically, to a substrate support assembly that is rotated while supporting a substrate for semiconductor processes such as cleaning or drying. Background Technology

[0002] Semiconductor devices are typically manufactured by depositing various materials in thin film form on a substrate and then carbonizing them. This process involves several steps, including deposition, photolithography, etching, cleaning, and drying.

[0003] The cleaning and drying processes are processes that remove foreign objects or particles present on the substrate and then dry it. This is carried out by rotating the substrate at high speed while supporting it on a rotating head (clamp base) and supplying a processing liquid to the surface or back of the substrate.

[0004] Typically, when the rotating head rotates, multiple chuck pins are provided around the rotating head to prevent the substrate from detaching from the side of the rotating head. The substrate support device consists of the chuck pins, the rotating head, the device part (mechanism), and a drive part for driving the device part.

[0005] The aforementioned multiple chuck pins have the following structure: they reciprocate between a holding position where the substrate is held on the rotating head and a release position where it is separated from the substrate.

[0006] However, in the existing substrate support device, a cover is formed on the upper surface of the rotating head facing the back of the substrate, and cleaning is performed by spraying cleaning liquid or gas or other substances through a baffle provided on the cover.

[0007] Therefore, according to the existing technology of this structure, there is a disadvantage that it is difficult to clean the back side of the substrate using devices with other cleaning principles, such as ultrasonic generating units.

[0008] Existing technical documents

[0009] Patent documents

[0010] Patent Document 1: Korean Patent Publication No. 10-1145775 (May 7, 2012) Summary of the Invention

[0011] The present invention is proposed to solve the problems of the prior art described above. The object of the present invention is to provide a substrate support assembly for a substrate processing apparatus, that is, the back side of the substrate can be cleaned by a medium such as an ultrasonic generating unit.

[0012] To achieve the above objectives, the substrate support assembly for the substrate processing apparatus of the present invention is characterized by comprising: a chuck base for supporting the substrate to be processed, having a housing portion formed along the circumferential direction near its outer peripheral surface, and an upwardly opening receiving groove formed in the inner portion surrounded by the housing portion, which is rotatable about a rotation axis; a chuck pin disposed on the upper part of the housing portion of the chuck base, which is movable in directions away from and towards the substrate; a device part disposed within the housing portion and connected to the chuck pin for moving the chuck pin; a drive part for transmitting power to the device part; and an ultrasonic cleaning unit housed in the receiving groove.

[0013] The present invention is characterized in that a drainage hole is formed through the bottom of the receiving groove of the chuck base or the side wall of the chuck base.

[0014] The present invention is characterized in that the drainage hole formed at the bottom of the receiving groove of the chuck base is adjacent to the inner edge of the receiving part.

[0015] The present invention is characterized in that an insertion groove for inserting the lower protrusion of the ultrasonic cleaning unit is formed at the center of the bottom of the receiving groove, and adjacent to the insertion groove, a partition wall surrounding the outer peripheral surface of the lower protrusion of the ultrasonic cleaning unit is formed at the bottom of the receiving groove, protruding upward.

[0016] The present invention is characterized in that the ultrasonic cleaning unit is capable of moving up and down in a manner that brings it closer to or further away from the substrate.

[0017] The present invention is characterized in that, when viewed from a top view, the ultrasonic cleaning unit extends radially around a rotation axis, and its width gradually increases from the rotation axis toward the front end and remains constant from a predetermined position.

[0018] The present invention is characterized in that an internal cleaning flow path for receiving cleaning liquid and spraying it toward the substrate is formed inside the ultrasonic cleaning unit, and one or more external cleaning liquid supply nozzles are provided on the outside.

[0019] The present invention is characterized in that, when viewed from a top view, the aforementioned internal cleaning flow path is located near the center of the chuck base, and is positioned at the center of the ultrasonic cleaning unit in the width direction.

[0020] The present invention is characterized in that the exterior of the ultrasonic cleaning unit is connected to the internal cleaning fluid supply nozzle, the internal cleaning fluid supply nozzle is connected to the inlet of the internal cleaning flow path, and when viewed from a top view, the supply portion of the internal cleaning fluid supply nozzle extends toward the center of the outlet of the internal cleaning flow path.

[0021] The present invention is characterized in that the outlet of the internal cleaning flow path is formed on the upper surface of the ultrasonic cleaning unit, the internal cleaning flow path is inclined toward the substrate, and when viewed from a top view, at least one of the two ends of the internal cleaning flow path exposed on the upper part of the ultrasonic cleaning unit in the radial direction is located on opposite sides of the radial direction with the rotation axis as the center.

[0022] The invention is characterized in that, when viewed from a top view, the external nozzle for supplying the cleaning fluid is arranged at an angle relative to a radial direction with the rotation axis as the center, having a rotational direction component of the chuck base and a component facing the edge of the substrate, spraying the cleaning fluid at a position ranging from 1 / 5 to 4 / 5 of the length of the ultrasonic cleaning unit in the direction from the center of the substrate toward the edge.

[0023] The present invention is characterized in that a first through-beam sensor for detecting the substrate is provided in a lower fixing frame spaced apart below the chuck base, a light-transmitting hole for transmitting light from the first through-beam sensor is formed at the bottom of the receiving groove of the chuck base, and a second through-beam sensor for detecting light from the first through-beam sensor is provided in an upper fixing frame spaced apart above the substrate.

[0024] The present invention is characterized in that a sealing window is provided at the bottom of the receiving groove of the clamp base, which is sealed by covering the light-transmitting hole and allows light to pass through, and the sealing window is disposed in one or more positions.

[0025] According to the substrate support assembly for the substrate processing apparatus of the present invention having the structure described above, the present invention can have the following effect: the tool part can be centrally arranged in the storage part formed along the circumferential direction near the outer peripheral surface of the chuck base, and the ultrasonic cleaning unit can be stored in the central receiving groove, thereby cleaning the back side of the substrate by the ultrasonic generating unit.

[0026] Furthermore, according to the present invention, the present invention has the following effect: by adjusting the position of the support pins, etc., so that the inner peripheral surface of the above-mentioned housing portion is close to the outer peripheral surface of the substrate, if the ultrasonic generating unit is accurately installed in the above-mentioned housing groove, the entire substrate can be cleaned uniformly and effectively with ultrasonic waves.

[0027] Furthermore, according to the present invention, the present invention has the following effect: a drainage hole is formed through the bottom of the above-mentioned receiving tank or the side wall of the chuck base, thereby preventing the cleaning liquid or drying liquid and other liquids supplied from the substrate and flowing into the receiving tank from being easily discharged from the receiving tank and accumulated.

[0028] Furthermore, according to the present invention, the present invention has the following effects: the drainage hole allows the liquid medicine flowing into the receiving tank to be discharged quickly; at the same time, when the chuck base rotates, the liquid medicine can be easily moved to the drainage hole at the bottom of the receiving tank and discharged through centrifugal force.

[0029] Furthermore, according to the present invention, the present invention has the following effect: when an insertion groove for inserting the lower protrusion of the ultrasonic cleaning unit is formed at the center of the bottom of the above-mentioned receiving groove, and when a partition wall surrounding the outer peripheral surface of the lower protrusion of the ultrasonic cleaning unit is formed at the bottom of the receiving groove adjacent to the insertion groove, the liquid medicine flowing into the receiving groove through the partition wall can be prevented from flowing into the motor or the like through the central insertion groove.

[0030] Furthermore, according to the present invention, the present invention has the following effect: the ultrasonic cleaning unit can be raised and lowered in a manner that is close to or far from the substrate to adjust the ultrasonic intensity, thereby allowing the cleaning effect on the substrate to be appropriately adjusted according to the type of substrate.

[0031] Furthermore, according to the present invention, the present invention has the following effect: the ultrasonic cleaning unit has a shape that can extend radially about the rotation axis, and its width gradually increases from the rotation axis toward the front end and remains constant from a predetermined position, that is, the outer walls are formed side by side, so that the area occupied by the ultrasonic cleaning unit at the bottom of the above-mentioned receiving tank can be minimized.

[0032] Furthermore, according to the present invention, the present invention has the following effect: an internal cleaning flow path for receiving cleaning liquid and spraying it toward the substrate can be formed inside the ultrasonic cleaning unit, and one or more external cleaning liquid supply nozzles are provided on the outside. The cleaning liquid is sprayed through the internal cleaning flow path to a region near the center of the substrate, and through the external cleaning liquid supply nozzles to a region near the edge of the substrate, thereby uniformly spraying the substrate.

[0033] Furthermore, according to the present invention, the present invention has the following effect: the exterior of the ultrasonic cleaning unit is connected to the internal cleaning fluid supply nozzle, the internal cleaning fluid supply nozzle is connected to the inlet of the internal cleaning flow path, and when viewed from a top view, the supply portion of the internal cleaning fluid supply nozzle extends toward the window of the internal cleaning flow path. When the cleaning fluid is sprayed, there will be no collision with the wall of the flow path, thereby preventing the cleaning fluid from scattering.

[0034] Furthermore, according to the present invention, the present invention has the following effect: the outlet of the internal cleaning flow path is formed on the upper surface of the ultrasonic cleaning unit, and the internal cleaning flow path is inclined toward the substrate. When viewed from a top view, if at least one of the two ends of the internal cleaning flow path exposed on the upper part of the ultrasonic cleaning unit is located on opposite sides of the radial direction with respect to the rotation axis, the internal cleaning flow path inside the ultrasonic cleaning unit is located on the rear side of the center of the substrate (or the center of the rotation axis) with respect to the spray direction, so that the cleaning liquid is sprayed to the rear part of the center of the ultrasonic cleaning unit, thereby achieving complete cleaning of the ultrasonic cleaning unit.

[0035] Furthermore, according to the present invention, the present invention has the following effect: a first through-beam sensor for detecting a substrate is provided in the lower fixing frame arranged below the chuck base; a light-transmitting hole for transmitting light from the first through-beam sensor is formed at the bottom of the receiving groove of the chuck base; and a second through-beam sensor for detecting light from the first through-beam sensor is provided in the upper fixing frame arranged above the substrate. Therefore, if the substrate blocks the optical axis in the light-transmitting hole, it is determined that a substrate is placed. If the substrate is rotating while being placed on the chuck pin, but the second through-beam sensor detects light for more than a predetermined time, it can be automatically determined that no substrate is placed or the substrate is damaged.

[0036] Furthermore, according to the present invention, the present invention has the following effect: a sealing window is provided at the bottom of the receiving groove of the chuck base, which seals the light-transmitting hole and allows light to pass through. When the sealing window is configured in more than one position, it is possible to check whether the substrate is installed in multiple positions. Attached Figure Description

[0037] Figure 1 A side cross-sectional view of the substrate processing apparatus of the present invention is shown for brevity.

[0038] Figure 2 A side cross-sectional view illustrating the principle of the substrate support assembly for the substrate processing apparatus of the present invention.

[0039] Figure 3 This is a perspective view of the substrate support assembly for the substrate processing apparatus of the present invention and a partial longitudinal sectional view viewed from the length direction of the ultrasonic cleaning unit.

[0040] Figure 4 This is a bottom perspective view of the substrate support assembly for the substrate processing apparatus of the present invention.

[0041] Figure 5 To show the target in Figure 4 A schematic diagram showing the nozzle placement and spray direction of the ultrasonic cleaning unit.

[0042] Figure 6 This is a planar perspective view showing the structure of the fixture part of the substrate support assembly for the substrate processing apparatus of the present invention.

[0043] Figure 7 This is a bottom perspective view showing the structure of the fixture part of the substrate support assembly for the substrate processing apparatus of the present invention.

[0044] Figure 8 This is a top view illustrating the working principle of the second working piece in the instrument section of the substrate support assembly for the substrate processing apparatus of the present invention.

[0045] Figure 9 This is a partial bottom perspective view of the substrate support assembly for the substrate processing apparatus of the present invention.

[0046] Figure 10 This is a partial longitudinal sectional view of the substrate support assembly for the substrate processing apparatus of the present invention. Detailed Implementation

[0047] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0048] like Figure 1 As shown, the substrate processing apparatus 1000 of the present invention includes a fluid supply unit 10, a bowl assembly 20, a lifting unit 30, and a substrate support device S.

[0049] The fluid supply unit 10 supplies the substrate W with a processing liquid or processing gas for processing the substrate.

[0050] Furthermore, during the process, the substrate support device S rotates the substrate W while supporting it.

[0051] The aforementioned bowl assembly 20 contains structural elements that prevent the liquid medicine used in the process and the fumes generated during the process from splashing or flowing out to the outside. Preferably, it is constructed in a stacked manner, allowing different liquid medicines and fumes to flow in differently according to their relative height to the substrate.

[0052] The aforementioned lifting unit 30 causes the substrate support device S or the bowl assembly 20 to move up and down, changing the relative height between the bowl assembly 20 and the substrate support device S within the bowl assembly 20.

[0053] like Figure 2As shown, the substrate support device S includes: a chuck base 100 that supports the substrate W to be processed, a receiving portion 110 formed near the outer peripheral surface along the circumferential direction, and an upwardly opening receiving groove 120 formed in the inner portion surrounded by the receiving portion 110, which can rotate about a rotation axis A; a chuck pin 200 disposed on the upper part of the receiving portion 110 of the chuck base 100, which can move in directions away from and towards the substrate W; a device part 300 disposed in the receiving portion 110 and connected to the chuck pin 200 for moving the chuck pin 200; a drive part 400 for transmitting power to the device part 300; and an ultrasonic cleaning unit 900 housed in the receiving groove 120.

[0054] A support pin 800 for supporting the substrate W can be additionally provided on the aforementioned chuck base 100.

[0055] As described above, the appliance part 300 is centrally arranged in the storage part 110 formed along the circumferential direction near the lower part of the outer peripheral surface of the clamp base 100, and the ultrasonic cleaning unit 900 is stored in the central receiving groove 120. Therefore, it can have the function of cleaning the back of the back panel by means of ultrasonic waves generated by the ultrasonic wave generating unit 900.

[0056] In particular, by adjusting the position of the support pin 800, etc., so that the inner peripheral surface of the above-mentioned housing part 110 is close to the outer peripheral surface of the substrate W, if the ultrasonic generating unit 900 is accurately placed in the above-mentioned housing groove, the entire substrate W can be cleaned uniformly and effectively with ultrasonic waves.

[0057] Considering the relative positions of the aforementioned device part 300 and the chuck pin 200, the aforementioned chuck pin 200 can be bent toward the aforementioned substrate W.

[0058] Cleaning liquid or drying liquid supplied from above or below the substrate W can flow into the receiving tank 120.

[0059] Preferably, in order to prevent the accumulation of the liquid medicine flowing into the aforementioned receiving tank 120 and to discharge or circulate it to the outside, a bottom 122 of the aforementioned receiving tank 120 (refer to...) Figure 2 ) or the side wall of the chuck base 100 (refer to Figure 3 Drainage holes 123 are formed through the passage.

[0060] Furthermore, such as Figure 2As shown, preferably, when the drain hole 123 is formed at the bottom of the receiving groove 120 of the chuck base 100, the drain hole 123 is adjacent to the inner edge of the receiving part 110, thereby quickly draining the liquid medicine flowing into the receiving groove 120. At the same time, when the chuck base 100 rotates, the liquid medicine is easily moved to the drain hole 123 at the bottom 122 of the receiving groove and discharged by centrifugal force.

[0061] Furthermore, an insertion groove 125 for inserting the lower protrusion 910 of the ultrasonic cleaning unit 900 can be formed at the bottom center of the aforementioned receiving groove 120. Adjacent to the insertion groove 125, a partition wall 126 surrounding the outer peripheral surface of the lower protrusion 910 of the ultrasonic cleaning unit 900 can be formed at the bottom of the receiving groove 120, protruding upward.

[0062] This prevents the liquid medicine flowing into the receiving tank 120 through the partition wall 126 from flowing into the motor 500 through the central insertion slot 125 (see reference). Figure 1 )wait.

[0063] Furthermore, the ultrasonic cleaning unit 900 is fixed in the rotation direction of the chuck base 100 and can be raised or lowered in a manner that approaches or moves away from the substrate W to adjust the ultrasonic intensity, thereby adjusting the cleaning effect on the substrate W.

[0064] On the other hand, such as Figure 3 and Figure 4 As shown, when viewed from a top view, the ultrasonic cleaning unit 900 described above may have a rotation axis A (refer to...) Figure 1 A shape that extends radially from a center, such as... Figure 5 As shown, its width gradually increases from the center of the rotation axis A toward the front end and remains constant from a specified position, that is, the outer walls can be formed side by side.

[0065] This minimizes the area occupied by the ultrasonic cleaning unit 900 at the bottom of the aforementioned receiving tank 120.

[0066] Preferably, an internal cleaning flow path 920 for receiving cleaning liquid and spraying it toward the substrate is formed inside the ultrasonic cleaning unit 900, and one or more external cleaning liquid supply nozzles 930 are provided on the outside, so that the cleaning liquid can be sprayed evenly onto the substrate W.

[0067] In this case, such as Figure 3 As shown, when viewed from the side view, the direction in which the internal cleaning flow path 920 faces relative to the direction of the rotation axis A can be in the range of greater than 0 degrees and less than 90 degrees, more preferably in the range of 10 degrees to 80 degrees.

[0068] That is, preferably, the center of the substrate W is sprayed through the internal cleaning flow path 920, that is, the area near the rotation axis A, and the area near the edge of the substrate W is sprayed through the external cleaning fluid supply nozzle 930.

[0069] When the internal cleaning flow path 920 and the external cleaning fluid supply nozzle 930 spray simultaneously, there may be overlapping areas. Moreover, even if there are overlapping areas, the cleaning effect will not decrease.

[0070] When viewed from a top view, the aforementioned internal cleaning flow path 920 can be configured at the center of the chuck base 100, that is, near the center of the rotation axis A, and can be configured at the center of the ultrasonic cleaning unit 900 in the width direction.

[0071] Furthermore, preferably, the exterior of the ultrasonic cleaning unit 900 is connected to the internal cleaning fluid supply nozzle 940, which is connected to the inlet of the internal cleaning flow path 920. When viewed from a top view, the supply portion 941 of the internal cleaning fluid supply nozzle 940 extends toward the center of the outlet 921 of the internal cleaning flow path 920, so that when the cleaning fluid is sprayed, there is no collision with the wall of the flow path, thus preventing the cleaning fluid from scattering.

[0072] And, as Figure 5 As shown, the outlet 921 of the internal cleaning flow path 920 is formed on the upper surface of the ultrasonic cleaning unit 900. The internal cleaning flow path 920 is formed at an angle toward the substrate W. When viewed from a top view, if at least one of the two ends of the internal cleaning flow path 920 exposed on the upper part of the ultrasonic cleaning unit 900 in the radial direction is located on the opposite side of the radial direction with respect to the rotation axis A, then the starting point of the internal cleaning flow path 920 inside the ultrasonic cleaning unit 900 is located behind the center of the rotation axis A or the center of the substrate W with respect to the spray direction. Therefore, the cleaning liquid is applied to the rear part of the center of the ultrasonic cleaning unit 900, thus achieving complete cleaning of the ultrasonic cleaning unit 900.

[0073] like Figure 5 As shown, preferably, when viewed from a top view, the external cleaning flow path of the external cleaning fluid supply nozzle 930 is inclined relative to the radial direction centered on the rotation axis A, so that it has the rotation direction component of the chuck base 100 and also has a component toward the edge of the substrate W, and sprays cleaning fluid in the direction toward the edge of the substrate W, within a range of 1 / 5 to 4 / 5 of the length of the ultrasonic cleaning unit 900.

[0074] Therefore, the cleaning liquid can be sprayed towards the radial direction of the substrate W through the internal supply nozzle 920, and simultaneously sprayed towards the radial direction and the rotation direction through the external supply nozzle 930. Thus, the entire area of ​​the substrate W can be sprayed more evenly and effectively.

[0075] On the other hand, such as Figure 4 As shown, a first through-beam sensor S1 for detecting the substrate W is provided in a lower fixing frame 181 arranged below the clamp base 100. A light-transmitting hole 111 for transmitting light from the first through-beam sensor S1 is formed at the bottom of the receiving groove 120 of the clamp base 100. A second through-beam sensor S2 for detecting the light from the first through-beam sensor S1 is provided in an upper fixing frame 191 arranged above the substrate W.

[0076] Therefore, if the substrate W blocks the optical axis inside the light-transmitting hole 111, it is determined that the substrate W is placed. If the substrate W is rotating while being placed on the chuck pin 200, but the second through-beam sensor S2 detects light for more than a specified time, it can be automatically determined that the substrate W is not set or the substrate W is damaged.

[0077] In this case, preferably, a sealing window 112 is provided at the bottom of the receiving groove 120 of the chuck base 100, which seals the light-transmitting hole 111 and allows light to pass through. The light-transmitting hole 111 and the sealing window 112 can be configured in more than one position, so that inspection can be carried out in multiple positions.

[0078] On the other hand, such as Figures 6 to 10 As shown, the aforementioned appliance part 300 may include: a first working piece 310, which can be moved in a recoverable manner along the rotation axis A via the aforementioned drive part 400; and a second working piece 320, which, along its length, contacts the first working piece 310 on one side and has the aforementioned chuck pin 200 on the other side, and can be moved in a recoverable manner between the one side and the other side, with the hinge axis 330 provided on the chuck base 100 as the center.

[0079] The first working piece 310 can move up and down along two guide rods 318 that are vertically arranged within the storage section 110.

[0080] The hinge shaft 330 can be disposed on the second working piece 320 and rotatably coupled to the chuck base 100, which is equivalent to the technology of ordinary skill in the art to which this invention pertains.

[0081] According to this structure, if the drive unit 400 operates to move the first working piece 310, the second working piece 320 that is in contact with the first working piece 310 will move, thereby allowing the chuck pin 200 connected to the second working piece 320 to move away from the substrate and be in a waiting position, or to move closer to the substrate and be in a holding position.

[0082] That is, through a simple structure, the aforementioned chuck pin 200 can move to the waiting position and the holding position, thereby minimizing the lateral cross-sectional area (volume) of the aforementioned storage section 110.

[0083] The storage portion 110 of the aforementioned chuck base 100 forms a guide hole 190 for moving the chuck pin 200 between the waiting position and the gripping position (see reference). Figure 8 ).

[0084] Furthermore, an inclined surface 322 is formed on the lower end of one side of the second working piece 320 that contacts the first working piece 310. As the first working piece 310 rises along the rotation axis A, the upper end of the first working piece 310 pushes the inclined surface 322 of the second working piece 320, causing the second working piece 320 to move hingedly around the hinge axis 330.

[0085] Furthermore, the first working plate 310 and the second working plate 320 can be moved back to their original positions, so that when the drive unit 400 is not working, the chuck pin 200 is always in the holding position.

[0086] Specifically, between the first working piece 310 and the chuck base 100, a first spring 311 or a first magnet (not shown) that applies a restoring force in a direction that is far apart from each other in the direction of the rotation axis A can be provided. A second spring 321 or a second magnet (not shown) that applies a force can be provided between the second working piece 320 and the chuck base 100 in such a way that the chuck pin 200 is oriented toward the holding position.

[0087] The figure shows that the first spring 311 is a compression spring arranged in the vertical direction, and the second spring 321 is a compression spring arranged in the horizontal direction. Those skilled in the art can appropriately change and modify the arrangement direction of the springs.

[0088] Furthermore, in the second working piece 320, with the hinge shaft 330 as the center, the portion 326 facing the chuck pin 200 can be positioned above the portion 327 facing the first working piece 310. The portion 326 facing the chuck pin 200 can be separated from the portion 327 facing the first working piece 310 in the vertical direction by the separation wall 130 and sealed.

[0089] With this structure, if the upper cover of the storage section 110 is opened, the second working piece 320 is exposed, and the first working piece 310 is sealed below by the separation wall 130. Therefore, it is possible to achieve the advantages of making maintenance such as replacing the chuck pin 200 very simple and the first working piece 310 is not affected by the external environment.

[0090] like Figure 8 As shown, preferably, when viewed from a top view, the second working piece 320 extends in an arc-shaped manner along the periphery of the chuck base 100, so as to minimize interference with the chuck base 100 when the hinge is moved.

[0091] like Figure 6 and Figure 9 As shown, preferably, an inspection hole 140 is formed on the outer peripheral surface of the chuck base 100, so that the portion 326 facing the chuck pin 200 is exposed, thereby making it easy to confirm the connection status of the chuck pin 200 from the outside.

[0092] The present invention shows that the fastening groove 324 exposed through the above-mentioned inspection hole 140 allows the collet pin 200 to be easily separated from the second working piece 320 using a wrench or other appropriate tools.

[0093] And, as Figure 8 As shown, preferably, the weight of the portion 327 facing the first working piece 310 is greater than the weight of the portion 326 facing the chuck pin 200.

[0094] According to this structure, when the chuck base 100 rotates, the torque of the portion 327 of the hinge shaft 330 toward the first working piece 310 is greater than the torque of the portion 326 toward the chuck pin 200 due to its centrifugal force. Through the centrifugal force, the chuck pin 200 presses the side of the substrate W. Therefore, when the chuck base 100 rotates, the substrate W can be held more firmly.

[0095] On the other hand, such as Figure 9 As shown, the drive unit 400 may include: a push rod 410 that contacts the first working piece 310 of the device unit 300; and a drive unit 420 that is connected to the push rod 410.

[0096] Driven by the aforementioned drive unit 420, the push rod 410 rises, which in turn causes the first working plate 310 to move upwards.

[0097] In this case, a connecting groove 312 can be formed at the lower end of the first working piece 310, and a working protrusion 412 can be formed at the upper end of the push rod 410 so as to complementarily engage with the connecting groove 312 of the first working piece 310.

[0098] As described above, the connecting groove 312 and the working protrusion 412 are complementaryly combined, so that even if the central axis of the connecting groove 312 and the working protrusion 412 are not aligned, they can be easily combined during sliding.

[0099] In the first working piece 310, a first part 313 that contacts the push rod 410 and a second part 314 that contacts the inclined surface 322 of the second working piece 320 can be formed separately.

[0100] like Figure 6 and Figure 7 As shown, a first part 313 and a second part 314 can be formed at both ends of the plate 315 that is bent in a "┓" shape in the first working piece 310. A connecting groove 312 is formed in the first part 313, and the second part 314 contacts the inclined surface 322 of the second working piece 320.

[0101] Furthermore, a protrusion 328 extending in the vertical direction can be formed at a position along the length of the second working piece 320, and a second spring 321 is formed between the inner side of the protrusion 328 and the inner surface of the receiving part 110, thereby applying an elastic restoring force.

[0102] And, as Figure 9 As shown, preferably, the drive unit 420 includes: a support frame 423 with a plurality of push rods 410 arranged along the circumferential direction; a pressure rod 421 connected to the support frame 423 and spaced inward relative to the push rods 410; and a drive source 422 spaced inward relative to the push rods 410 and connected to the pressure rod 421, forming a curtain wall 160 between the push rods 410 and the pressure rod 421.

[0103] This structure avoids the adverse effects caused by the spray of liquid medicine or other substances flowing into the drive source 422 or the pressure rod 421 when the rotating head rotates.

[0104] Furthermore, the present invention may also include an outer cover 170 that seals around the drive source 422. The drive source 422 is connected to the pressure rod 421 through the upper end of the outer cover 170, thereby preventing the drive source 422 from being damaged by external influences such as spray.

[0105] On the other hand, such as Figure 2 As shown, preferably, the chuck pin 200, the second working piece 320, the conductive medium 180 constituting the chuck base 100 and the motor 500 for driving the rotation of the chuck base 100 are electrically connected and grounded, thereby preventing quality deterioration due to static electricity on the substrate W.

[0106] The aforementioned second working piece 320 and conductive medium 180 can be made of conductive materials such as conductive metals or carbon-containing conductive materials.

[0107] Figure 2 In the diagram, structural element B is a screw used to fasten the motor 500.

[0108] Furthermore, if the assembly of the aforementioned chuck pin 200, the appliance part 300, and the drive part 400 can be arranged in two or more sets at equal intervals along the circumferential direction with the rotation axis A as the center, the aforementioned substrate W can be supported evenly.

[0109] The embodiments of the present invention are merely illustrative examples. Anyone skilled in the art to which this invention pertains can make various modifications and other equivalent embodiments within the scope of the claims.

Claims

1. A substrate support assembly for a substrate processing apparatus, characterized in that, include: The chuck base supports the substrate to be processed. Near the outer peripheral surface, a storage part is formed along the circumferential direction. An upward-opening receiving groove is formed on the upper surface of the inner part surrounded by the storage part, which can rotate about the rotation axis. The chuck pin is disposed on the upper part of the chuck base and can move in directions away from and towards the substrate. The tool section is disposed in the above-mentioned storage section and is connected to the above-mentioned chuck pin for moving the chuck pin; A drive unit for transmitting power to the aforementioned appliance unit; and An ultrasonic cleaning unit is housed in the aforementioned receiving groove. When viewed from above, the ultrasonic cleaning unit has a shape that extends radially about a rotation axis, with one end of the extended shape facing the inner circumference of the receiving groove.

2. The substrate support assembly for a substrate processing apparatus according to claim 1, characterized in that, A drainage hole is formed at the bottom of the receiving groove of the aforementioned chuck base or through the side wall of the chuck base.

3. The substrate support assembly for the substrate processing apparatus according to claim 2, characterized in that, The drainage hole formed at the bottom of the receiving groove of the aforementioned clamp base is adjacent to the inner edge of the aforementioned storage section.

4. The substrate support assembly for a substrate processing apparatus according to claim 1, characterized in that, An insertion groove for inserting the lower protrusion of the ultrasonic cleaning unit is formed at the bottom center of the aforementioned receiving groove. Adjacent to the insertion groove, a partition wall surrounding the outer peripheral surface of the lower protrusion of the ultrasonic cleaning unit is formed at the bottom of the aforementioned receiving groove, protruding upward.

5. The substrate support assembly for a substrate processing apparatus according to claim 1, characterized in that, The ultrasonic cleaning unit described above can be raised or lowered to move closer to or further away from the substrate.

6. The substrate support assembly for a substrate processing apparatus according to claim 1, characterized in that, When viewed from above, the width of the ultrasonic cleaning unit gradually increases from the axis of rotation toward the radial direction and remains constant from a predetermined position.

7. The substrate support assembly for a substrate processing apparatus according to claim 1, characterized in that, An internal cleaning flow path for receiving cleaning fluid and spraying it toward the substrate is formed inside the ultrasonic cleaning unit, and one or more external cleaning fluid supply nozzles are provided on the outside.

8. The substrate support assembly for a substrate processing apparatus according to claim 7, characterized in that, When viewed from above, the aforementioned internal cleaning flow path is located near the center of the chuck base, positioned at the center of the width direction of the aforementioned ultrasonic cleaning unit.

9. The substrate support assembly for a substrate processing apparatus according to claim 8, characterized in that, The exterior of the ultrasonic cleaning unit is connected to the internal cleaning fluid supply nozzle, which is connected to the inlet of the internal cleaning flow path. When viewed from above, the supply portion of the internal cleaning fluid supply nozzle extends toward the center of the outlet of the internal cleaning flow path.

10. The substrate support assembly for a substrate processing apparatus according to claim 7, characterized in that, The outlet of the aforementioned internal cleaning flow path is formed on the upper surface of the aforementioned ultrasonic cleaning unit. The aforementioned internal cleaning flow path is inclined toward the aforementioned substrate. When viewed from above, at least one of the two ends of the aforementioned internal cleaning flow path exposed on the upper part of the aforementioned ultrasonic cleaning unit in the radial direction is located on the opposite side in the radial direction with the aforementioned rotation axis as the center.

11. The substrate support assembly for a substrate processing apparatus according to claim 10, characterized in that, When viewed from the side, the direction in which the aforementioned internal cleaning flow path faces is within the range of 10 to 80 degrees relative to the direction of the rotation axis.

12. The substrate support assembly for a substrate processing apparatus according to claim 7, characterized in that, When viewed from above, the external nozzle for supplying the cleaning fluid is inclined relative to the radial direction centered on the rotation axis, so that it has the rotational direction component of the chuck base and the component facing the edge of the substrate, spraying the cleaning fluid at a position ranging from 1 / 5 to 4 / 5 of the length of the ultrasonic cleaning unit in the direction from the center of the substrate toward the edge.

13. The substrate support assembly for a substrate processing apparatus according to claim 1, characterized in that, A first through-beam sensor for detecting the substrate is provided in a lower fixing frame spaced apart below the aforementioned chuck base. A light-transmitting hole for transmitting light from the first through-beam sensor is formed at the bottom of the receiving groove of the aforementioned chuck base. A second through-beam sensor for detecting the light from the first through-beam sensor is provided in an upper fixing frame spaced apart above the substrate.

14. The substrate support assembly for a substrate processing apparatus according to claim 13, characterized in that, A sealing window is provided at the bottom of the receiving groove of the aforementioned clamp base, which is sealed by covering the aforementioned light-transmitting hole and allows light to pass through. The aforementioned sealing window is provided in one or more positions.

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