A fine-tuning pin device

Abstract

This invention relates to the field of wafer fabrication equipment, specifically a fine-tuning lift pin device. This device is primarily used for fine-tuning the height and verticality of lift pins in confined spaces within a process cavity, particularly in situations where the bottom space is limited within a vacuum process cavity. The structure includes a lift pin support ring 1 and a lift pin support ring 2, an adjusting block, and a spring. The lift pin support ring 1 is equipped with horizontal adjusting screws and height & vertical adjusting screws. The lift pin support ring 2 is located below the lift pin support ring 1 and is connected to it. The lift pin support ring 2 has a spring limiting post, and the spring is sleeved on the spring limiting post. The adjusting block is sleeved on the spring limiting post and contacts the spring. The lower end of the adjusting screw contacts the upper surface of the adjusting block. The lower end of the lift pin is fixed to a lift pin base. The lift pin base passes through the lift pin through-hole and contacts the upper surface of the adjusting block.

Description

Technical Field

[0001] This invention relates to the field of chip wafer equipment, specifically a wafer fine-tuning pin device. Background Technology

[0002] In semiconductor manufacturing equipment, most processes are performed in a vacuum environment or a sealed lower space. The process cavity requires lift pins as a transfer medium for wafer transfer with robotic arms. Lift pins typically employ a three- or four-pin mechanism. For example, with the lift pin at the bottom, the robotic arm transfers the wafer to the process cavity; the lift pin lifts to separate the wafer from the robotic arm, the robotic arm exits the process cavity, and the lift pin descends to place the wafer onto the stage; the reverse process transfers the wafer out of the process cavity. To prevent wafer misalignment when landing on the stage, the wafer's level on the lift pin must be consistent with the stage. This requires height adjustment of the lift pin to ensure consistent height difference between the three or four pins, and verticality must also be met simultaneously. If a hard-connection method is used, this requires absolute precision in processing, which is difficult to achieve in practice and results in a high scrap rate. Summary of the Invention

[0003] This invention, by improving the support ring structure and adding a finely adjustable structure for the lift pin height and verticality, can avoid issues such as high scrap rates and wafer misalignment on the stage. The technical solution is as follows:

[0004] A fine-tuning ejector pin device includes an ejector pin support ring 1 and an ejector pin support ring 2, an adjusting block, and a spring, wherein...

[0005] The ejector pin support ring 1 is provided with a horizontal adjustment screw, a height and verticality adjustment screw, and an ejector pin through hole;

[0006] The ejector pin support ring 2 is located below the ejector pin through hole, and the ejector pin support ring 2 is provided with a spring limiting post;

[0007] The spring is sleeved on the spring limiting post;

[0008] The upper surface of the adjustment block is smooth, and the lower surface has an annular protrusion, which can be sleeved on the spring limiting post and contact the spring.

[0009] The lower end of the height & verticality adjusting set screw contacts the surface of the adjusting block.

[0010] The lower end of the ejector pin is fixed on the ejector pin base; the ejector pin base passes through the ejector pin through hole and contacts the upper surface of the adjustment block.

[0011] Furthermore, the ejector pin support ring 2 is provided with a screw through hole, which is connected to the ejector pin support ring 1 by screws.

[0012] Furthermore, the ejector pin support ring 2 is provided with a spring limiting groove and a fixing screw through hole.

[0013] Furthermore, the ejector pin support ring 1 is provided with a rectangular ejector pin through hole, and the ejector pin base is rectangular with a threaded hole, and the bottom of the ejector pin can be screwed into the threaded hole for fixation.

[0014] Furthermore, the adjustment block is circular with a smooth upper surface and an annular protrusion on the lower surface.

[0015] Furthermore, three set screw threaded holes are evenly distributed around the set pin through hole, and the set screw for adjusting the height and verticality contacts the surface of the adjustment block through the set screw threaded holes.

[0016] Furthermore, the ejector pin support ring 1 is connected to a cylinder or a motor.

[0017] Beneficial effects

[0018] This patent adds a fine-tuning structure, allowing adjustment via work on the upper part of the support ring, and the Lift Pin can be fine-tuned as follows:

[0019] (1) Fine-tune the left and right positions of the thimble;

[0020] (2) Fine adjustment of the height of the ejector pin;

[0021] (3) Fine-tune the verticality of the pin; Attached Figure Description

[0022] Figure 1 1. Existing organizational structure diagram;

[0023] Among them, 1. wafer, 2. lift pin, 3. stage, 4. process cavity, 5. lift pin support ring, 6. cylinder, 7. lift pin limiting post, 8. wafer transfer port;

[0024] Figure 2 A schematic diagram of a lift pin support ring in the prior art;

[0025] Figure 3 A schematic diagram of the device structure of the present invention;

[0026] Figure 4 A schematic diagram of the Lift Pin support ring 1 in this invention;

[0027] Figure 51. Schematic diagram of the Lift Pin support ring 2 structure in this invention;

[0028] Figure 6 A top view of the structure of the lift pin support ring 2 in this invention;

[0029] Figure 7 A schematic diagram of the structure of the ejector pin height and verticality adjustment block in this invention;

[0030] Figure 8 A schematic diagram of the top view of the pin height and verticality adjustment block in this invention; wherein,

[0031] 9. Lift Pin fixing threaded hole; 10. Support ring and cylinder fixing screw; 11. Support ring horizontal adjustment screw.

[0032] 12. Spring; 13. Lift Pin support ring 2; 14. Fixing screw; 15. Ejector screw; 16. Lift Pin base; 17. Ejector pin height & verticality adjustment block.

[0033] 18. Set screw mounting threaded hole; 19. Lift pin through hole; 20. Spring limit post; 21. Screw through hole; 22. Spring limit groove; 51. Lift pin support ring 1. Detailed Implementation

[0034] like Figure 1 Currently, most semiconductor manufacturing equipment operates in a vacuum environment or a sealed lower space. The process cavity requires lift pins (ejector pins, wafer ejector pins) as a transfer medium to interact with the robotic arm for wafer transfer. Lift pins typically employ a three-pin or four-pin mechanism. For example, with the lift pin in the lower position, the robotic arm transfers the wafer to the process cavity. The lift pin lifts up to separate the wafer from the robotic arm, the robotic arm exits the process cavity, and the lift pin descends to place the wafer onto the stage. The reverse process transfers the wafer out of the process cavity.

[0035] To prevent the wafer from shifting when landing on the stage, the wafer's level on the lift pin must be consistent with the stage. This requires adjusting the height of the lift pin to ensure that the height difference between the three or four pins is consistent, and the verticality must also be met simultaneously. If a hard connection method is used, the consistent height difference between the three or four pins can only be guaranteed under conditions of zero machining accuracy, which is difficult to meet in practice and results in a high scrap rate.

[0036] like Figure 1 , Figure 2The current Lift Pin support ring 5 has the following structural problems:

[0037] (1) It is difficult to guarantee the verticality of the Lift Pin. The verticality of the Lift Pin is related to the verticality of the threaded hole of the Lift Pin support ring and the thread tapping. If the verticality is poor, the Lift Pin and the Lift Pin limiting post may rub against each other or even get stuck.

[0038] (2) It is difficult to ensure that the Lift Pin support ring is completely horizontal, resulting in inconsistent height differences between the three or four Lift Pins and making them impossible to adjust.

[0039] To address the aforementioned issues, this invention improves the support ring structure and adds a lift pin height and verticality fine-tuning structure, which can reduce the scrap rate of processed parts and prevent the wafer from shifting when falling onto the stage.

[0040] Because the space below the support ring is limited, and adjustments cannot be made within this space, the lift pin can be finely adjusted within the working space above the support ring by adding the fine-tuning structure described in this patent.

[0041] 1. Fine-tune the left and right positions of the Lift Pin;

[0042] 2. Fine-tune the height of the Lift Pin;

[0043] 3. Fine-tune the verticality of the Lift Pin;

[0044] Specifically, such as Figure 3 The device in this invention mainly changes the support ring structure, transforming the original one-piece support ring assembly into two modules:

[0045] Lift Pin support ring 1 and its mating components; Lift Pin support ring 2 and its mating components, wherein Lift Pin support ring 1 and Lift Pin support ring 2 are connected by fixing screw 14.

[0046] Furthermore, the specific structure is as follows: Figure 3 , Figure 4 , Figure 5 The lift pin support ring assembly 1 is used to connect with the cylinder. An adjusting screw is provided at the connection between the support ring and the cylinder. The horizontal adjustment of the lift pin is made by adjusting the adjusting screw at the connection between the cylinder and the support ring.

[0047] The Lift Pin support ring 2 is used to fix the ejector pin. Simultaneously, the height and verticality are adjusted via the Lift Pin height and verticality adjustment block, spring, and ejector screw. The bottom end of the Lift Pin is threaded, and the corresponding base also has a threaded hole, allowing the Lift Pin to be screwed into the base for fixation. The base is a rectangular part, and correspondingly, the support ring 1 has a rectangular through hole. When the base passes through the through hole and is rotated 90 degrees, the rectangular outline of the base can no longer pass through the rectangular through hole on the support ring.

[0048] Figure 4 The diagram shows a top view of the support ring 1. The ring surface of the support ring 1 has four rectangular lift pin holes, and each lift pin hole has three threaded holes 18 around its perimeter. The connection end between the support ring 1 and the cylinder has a support ring and cylinder fixing screw 10 and a support ring horizontal adjustment screw 11. Alternatively, it can be configured with three lift pin holes.

[0049] Figure 5 This is a schematic diagram of the structure of supporting ring 2 from a top view angle. Figure 6 This is a frontal view of the support ring 2. The support ring 2 is a circular part with a central groove and a spring limiting post 20, located below the Lift Pin through hole of the support ring 1. The support ring 2 has a threaded through hole 21 for fixed connection with the support ring 1.

[0050] Spring 12 is fitted onto spring limit post 20; adjustment block 17 is placed on spring 12;

[0051] The base of the lift pin is set on the surface of the adjustment block.

[0052] like Figure 7 , Figure 8 As shown, the adjusting block 17 is a component mounted on a spring. Applying pressure to its surface can adjust its height or tilt. The base of the ejector pin is placed on the surface of the adjusting block, so changes in the height or tilt of the adjusting block surface will cause fine adjustments to the ejector pin.

[0053] Furthermore, the adjusting block is a circular part with a smooth upper surface and an annular protrusion on the lower surface, which is fitted onto the limiting post 20; at this time, the spring 12 is below the adjusting block.

[0054] The set screw, with a structure similar to a screw, serves a positioning function. The set screw 15 contacts the surface of the adjusting block 17 through the threaded hole 18 and presses down; at this time, the surface of the adjusting block is pressed upwards by a spring from below, while the three set screws on the upper surface of the adjusting block apply downward pressure. By rotating the set screw 15, it moves downwards or upwards, thus fine-tuning the height and level of the plane of the adjusting block 17. This allows adjustment of the height and verticality of the Lift Pin base, and consequently, the height and verticality of the Lift Pin.

[0055] Specific adjustment: The lower end of the set screw 15 contacts the upper surface of the adjusting block. By rotating the set screw 15, the surface of the adjusting block can be adjusted to change its height or level.

[0056] Furthermore, under normal circumstances, the process of using this device to perform the robotic arm's film loading and unloading actions is as follows:

[0057] (1) The robotic arm carries the wafer into the process chamber through the wafer transfer port;

[0058] (2) The cylinder rises, which drives the support ring 1 and its components to rise. The support ring drives the Lift Pin to rise. The height of the Lift Pin is higher than the surface of the robot arm. The Lift Pin lifts the wafer and detaches the wafer from the robot arm.

[0059] (3) The robotic arm exits the process chamber;

[0060] (4) The Lift Pin descends via the cylinder and support ring, causing the wafer to fall onto the Stage; at this time, the height of the Lift Pin is lower than the surface of the Stage.

[0061] (5) Processing begins in the process chamber;

[0062] (6) The process in the process chamber is completed;

[0063] (7) The Lift Pin lifts the wafer via a cylinder and a support ring;

[0064] (8) The robotic arm enters the process chamber through the transfer port;

[0065] (9) The Lift Pin descends, meaning the wafer falls onto the robotic arm and the Lift Pin detaches from the wafer;

[0066] (10) The robotic arm carries the wafer out of the process chamber; the wafer handling process is complete.

[0067] If you need to adjust the lift pin:

[0068] like Figure 3 The installation and adjustment methods are as follows:

[0069] (1) Insert the spring into the limiting post of the Lift Pin support ring 2; as follows Figure 5 , Figure 6 As shown, the support ring 2 has a spring-loaded limiting post 20.

[0070] (2) Fit the limiting post of the Lift Pin support ring 2. Figure 7 The Lift Pin height & verticality adjustment block shown;

[0071] (3) Connect the Lift Pin support ring 2 with Figure 4 (4) Fix the Lift Pin support ring 1 with a combination of fixing screws; (5) Install the Lift Pin support ring 1 onto the cylinder and adjust the level by using the set screw;

[0072] (5) Install the set screw in the set screw threaded hole for installing the Lift Pin support ring 1, so that the set screw contacts Figure 7 The Lift Pin height & verticality adjustment block shown;

[0073] (6) Figure 5 Middle Lift Pin base along Figure 4 Insert the Lift Pin support ring 1 into the opening direction, press down to compress the spring, rotate the Lift Pin base 90 degrees, and confirm that the Lift Pin base is stuck and will not pop out.

[0074] (7) Adjust the top of the Lift Pin base by adjusting the set screw. Figure 4 The height difference and verticality of the Lift Pin support ring assembly 1 are such that the four target pins are at the same height and perpendicular to the surface of the support ring assembly 1;

[0075] (8) Install Stage;

[0076] (9) Screw in the Lift Pin;

[0077] (10) Confirm that the height difference between the four Lift Pins and the Stage surface is consistent. If there is a difference, fine adjustment is required. Record the amount of Lift Pin adjustment required. Remove the Stage and adjust the base height and verticality of the corresponding Lift Pin using the set screw.

[0078] (11) Install Stage and repeatedly check the height difference of the four Lift Pins until the required range of the four-pin height difference is met.

[0079] Because the Lift Pin base has a clearance fit within the hole, it can move within a limited space, allowing movement during the up-and-down motion of the Lift Pin. Figure 1 The middle lift pin can automatically adjust for centering.

[0080] The scope of protection of this patent is not limited to the use of cylinders or motors to drive the up and down movement, or the use of Lift Pin material; this invention is mainly designed for spaces with limited space at the bottom, but it is not limited to this, and it is also applicable to large spaces or open spaces at the bottom; the height difference adjustment range of three or four pins is determined by the component size, and in semiconductor equipment, the adjustment range is generally required to be within 0 to 3 mm; in the structure of this patent, the ejector pin is fixed on the base, and the base can be finely adjusted left and right in the gap.

[0081] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several improvements and additions without departing from the method of the present invention, and these improvements and additions should also be considered within the scope of protection of the present invention.

Claims

1. A fine-tuning ejector pin device, characterized in that, Includes ejector pin support ring 1 and ejector pin support ring 2, adjusting block, and spring, wherein, The ejector pin support ring 1 is provided with ejector pin through holes, horizontal adjustment screws, and height and verticality adjustment screws; The ejector pin support ring 2 is located below the ejector pin through hole, and the ejector pin support ring 2 is provided with a spring limiting post; The spring is sleeved on the spring limiting post; the upper surface of the adjusting block is smooth and the lower surface has an annular protrusion, and it is sleeved on the spring limiting post; the annular protrusion contacts the spring; the lower end of the height and verticality adjusting screw contacts the upper surface of the adjusting block; the lower end of the ejector pin is fixed on the ejector pin base; The ejector pin base contacts the upper surface of the adjusting block through the ejector pin through hole; The ejector pin support ring 2 is provided with a screw through hole and is fixedly connected to the ejector pin support ring 1 by screws; the ejector pin support ring 2 is provided with a spring limiting groove and a fixing screw through hole. The ejector pin support ring 1 is provided with a rectangular ejector pin through hole, and the ejector pin base is rectangular and provided with a threaded hole, and the bottom end of the ejector pin can be screwed into the threaded hole for fixation; The adjustment block is circular; Three set screw threaded holes are evenly distributed around the pin through hole. The height and verticality adjusting set screws contact the surface of the adjusting block through the set screw threaded holes. The pin support ring 1 is connected to a cylinder or motor.

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