一种埋无源器件封装基板及其制作方法
By using 3D printing to create passive device layers and combining them with mature processes, the problems of complex, high-cost, and polluting packaging substrate preparation have been solved, enabling efficient and environmentally friendly packaging substrate production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI MEADVILLE SCI & TECH
- Filing Date
- 2022-11-30
- Publication Date
- 2026-07-17
AI Technical Summary
The existing packaging substrate manufacturing process is complex, costly, and polluting. Traditional methods of embedding passive devices are difficult to process and the reliability of passive devices is poor.
The passive component layer is fabricated using 3D printing and combined with mature substrate fabrication technology to simplify the process. The electrical performance parameters of the passive component layer can be controlled by 3D printing, eliminating the need for drilling and external soldering. The packaging substrate is fabricated using an additive method to achieve more precise circuitry.
It simplifies the production process, reduces costs, improves production efficiency and the reliability of passive components, reduces environmental pollution, and enables more precise circuit fabrication.
Smart Images
Figure CN115910989B_ABST